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JP2004151968A - Contactless data receiver - Google Patents

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Publication number
JP2004151968A
JP2004151968A JP2002315943A JP2002315943A JP2004151968A JP 2004151968 A JP2004151968 A JP 2004151968A JP 2002315943 A JP2002315943 A JP 2002315943A JP 2002315943 A JP2002315943 A JP 2002315943A JP 2004151968 A JP2004151968 A JP 2004151968A
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Prior art keywords
chip
transmitter
data
antenna body
receiver
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Pending
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JP2002315943A
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Japanese (ja)
Inventor
Mitsugi Saito
貢 斎藤
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Toppan Edge Inc
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Toppan Forms Co Ltd
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Application filed by Toppan Forms Co Ltd filed Critical Toppan Forms Co Ltd
Priority to JP2002315943A priority Critical patent/JP2004151968A/en
Publication of JP2004151968A publication Critical patent/JP2004151968A/en
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

【課題】メモリ容量の大きい、小型化の可能な、通信距離範囲の広い、多機能化の可能な非接触型データ受送信体を提供する。
【解決手段】絶縁部材からなる基板2と、基板2の一方の面上に配置され、データの記憶、処理および通信の制御を行う第1のICチップ3および第2のICチップ4と、第1のICチップ3および第2のICチップ4に接続され、導電部材からなるアンテナ体5とを備え、このアンテナ体5は、複数の周回部6と周回部6の両端部から延びる接続部7を有し、アンテナ体5を構成する周回部6の一端は、周回部6の上方に設けた第2の絶縁部材8の上を通して第1のICチップ3、第2のICチップ4に接続され、他端は直接第1のICチップ3、第2のICチップ4に接続されており、第1のICチップ3、第2のICチップ4は、アンテナ体5に並列に接続されている非接触型データ受送信体1。
【選択図】 図1
A non-contact data transmitter / receiver having a large memory capacity, a small size, a wide communication distance range, and a multi-functionality is provided.
A substrate (2) made of an insulating member, a first IC chip (3) and a second IC chip (4) arranged on one surface of the substrate (2) for controlling storage, processing and communication of data; An antenna body 5 connected to the first IC chip 3 and the second IC chip 4 and made of a conductive member; the antenna body 5 includes a plurality of circling portions 6 and connection portions 7 extending from both ends of the circulating portion 6; And one end of the circling portion 6 constituting the antenna body 5 is connected to the first IC chip 3 and the second IC chip 4 through a second insulating member 8 provided above the circulating portion 6. The other end is directly connected to the first IC chip 3 and the second IC chip 4, and the first IC chip 3 and the second IC chip 4 are connected in parallel to the antenna body 5. Contact type data receiver / transmitter 1.
[Selection diagram] Fig. 1

Description

【0001】
【発明の属する技術分野】
本発明は、外部からのデータの読み書きや電力の供給を電磁波などによって非接触で行う非接触型データ受送信体に関する。
本発明に係る非接触型データ受送信体は、ICを搭載したカードやタグなどに好適に用いられる。
【0002】
【従来の技術】
近年、非接触ICタグやRF−ID(Radio Frequency Identification)用途の情報記録メディアのように、電磁波を媒体として外部から情報を受信し、また外部に情報を送信できるようにした非接触型データ受送信体が提案されている。
【0003】
従来、このような非接触型データ受送信体は、絶縁部材からなる基板上に、データの記憶、処理および通信制御を行う各種電子部品を搭載したICチップ1個と、電磁波を送受信するコイル状としたアンテナ体を実装した構造を備えている(例えば、特許文献1参照)。
【0004】
【特許文献1】
特開平10−334203号公報
【0005】
【発明が解決しようとする課題】
しかしながら、従来の非接触型データ受送信体は、ICチップを1個のみ備えたものであるから、メモリ容量が小さいため、データの記憶容量も小さく、大量のデータを同時に処理したり、メモリに記憶させたデータのバックアップをすることが難しかった。
また、従来の非接触型データ受送信体はメモリ容量が少ないため、電磁波によるデータ通信を行うために必要な共振周波数を確保するために、アンテナ体を小型化することができなかった。このようなことから、非接触型データ受送信体ではアンテナ体の占める面積が大きいため、非接触型データ受送信体をより小型化することが難しかった。
【0006】
さらに、従来の非接触型データ受送信体はICチップを1個のみ備えたものであるから、所定の通信距離においてのみ使用可能であり、この所定の通信距離を外れると使用できなかった。また、従来の非接触型データ受送信体はICチップを1個のみ備え、このICチップのメモリ容量は少ないことから、多機能化することが難しかった。
【0007】
本発明は、前記事情に鑑みてなされたもので、メモリ容量の大きい、小型化の可能な、通信距離範囲の広い、多機能化の可能な非接触型データ受送信体を提供することを課題とする。
【0008】
【課題を解決するための手段】
前記課題は、絶縁部材からなる基板と、該基板上に配置され、データの記憶、処理および通信の制御を行う複数のICチップと、該複数のICチップに接続され、導電部材からなるアンテナ体とを備えた非接触型データ受送信体であって、前記複数のICチップは、前記アンテナ体に設けた複数の端子を介して並列接続されたことを特徴とする非接触型データ受送信体によって解決できる。
【0009】
【発明の実施の形態】
以下では、本発明に係る非接触型データ受送信体について図面に基づき詳細に説明する。
図1は、本発明に係る非接触型データ受送信体の第1の実施形態を示す模式的な平面図である。
図1の非接触型データ受送信体1は、第1の絶縁部材からなる基板2と、基板2の一方の面上に配置され、データの記憶、処理および通信の制御を行う2つのICチップ(ここでは第1のICチップ3、第2のICチップ4)と、第1のICチップ3、第2のICチップ4に両端部が接続され、導電部材からなるアンテナ体5とを備えている。このアンテナ体5は、複数の周回部6と周回部6の両端部から延びて第1のICチップ3、第2のICチップ4と接続される接続部7を有している。なお、アンテナ体5を構成する周回部6の一端は、周回部6の上方に設けた第2の絶縁部材8の上を通して第1のICチップ3、第2のICチップ4に接続され、他端は直接第1のICチップ3、第2のICチップ4に接続されており、第1のICチップ3、第2のICチップ4は、アンテナ体5に並列に接続されている。
【0010】
基板2としては、例えば、ガラス繊維などの無機繊維またはアルミナ繊維、ポリエステル繊維、ポリアミド繊維などの有機繊維からなる織布、不織布、マット、紙あるいはこれらを組み合わせたもの、あるいはこれらに樹脂ワニスを含浸させて成形した複合基材、ポリアミド系樹脂基材、ポリエステル系樹脂基材、ポリオレフィン系樹脂基材、ポリイミド系樹脂基材、エチレン・ビニルアルコール共重合体系樹脂基材、ポリビニルアルコール系樹脂基材、ポリ塩化ビニル系樹脂基材、ポリ塩化ビニリデン系樹脂基材、ポリスチレン系樹脂基材、ポリカーボネート系樹脂基材、アクリロニトリルブタジエンスチレン共重合体系樹脂基材、ポリエーテルスルホン系樹脂基材などのプラスチック基材、あるいはこれらにマット処理、コロナ放電処理、プラズマ処理、紫外線照射処理、電子線照射処理、フレームプラズマ処理およびオゾン処理、あるいは各種易接着処理などの表面処理を施したもの、など公知のものから選択して用いることができる。
【0011】
非接触型データ受送信体1を構成するアンテナ体5は、複数の周回部6の他に、周回部6の両端部から延びる第1のICチップ3、第2のICチップ4と接続される接続部7を備えている。接続部7の先端は、2つに分岐して第1のICチップ3、第2のICチップ4と接続される接続端子をなしている。
【0012】
導電部材からなるアンテナ体5(周回部6と接続部7)を形成する方法としては、公知の製造法を用いることができる。例えば、溶剤揮発型、熱硬化型、あるいは光硬化型の導電ペーストをスクリーン印刷して乾燥固定化する方法、被覆あるいは非被覆金属線を貼り付ける方法、エッチング法、金属箔を貼り付ける方法、金属を直接蒸着する方法、金属蒸着膜を転写する方法、導電性高分子膜を形成する方法などが挙げられる。
これらの中でも、導電ペーストをスクリーン印刷して乾燥固定化する方法は、減圧雰囲気を必要とせず、通常の大気中において、任意の線幅からなるアンテナ体5を基板2における所望の位置に容易に形成できるので好ましい。
また、図1では、接続部7は周回部6の外側に配置されているが、もちろん内側に配置されていてもよい。接続部7を周回部6の内側に配置し、この接続部7の端部に第1のICチップ3、第2のICチップ4を接続するように、周回部6の内側に第1のICチップ3、第2のICチップ4を配置すれば、基板2上においてスペースの有効利用を図ることができる。加えて、基板2上において周回部6の外側に、第1のICチップ3、第2のICチップ4を配置するためのスペースを設ける必要がないから、非接触型データ受送信体1をより小型化することができる。
【0013】
第2の絶縁部材8の形成は、絶縁性ペーストの印刷、絶縁性フィルムの接着剤を介した貼り付け、絶縁性テープの貼り付けなどの公知の方法で行うことができるが、絶縁性ペーストを用いたスクリーン印刷が最も好ましい。スクリーン印刷による第2の絶縁部材8の形成では、塗布剤として絶縁性粒子とバインダーからなる組成物を用いるが、絶縁性粒子としてはシリカ、アルミナ、タルクなどが挙げられる。この絶縁性粒子の材質やその混在比率などを適宜選択することにより、第2の絶縁部材8は、その誘電率を微調整することが可能である。ただし、絶縁性粒子が無くても絶縁性が確保される場合は、バインダーのみからなる組成物を用い、第2の絶縁部材8を形成しても構わない。
【0014】
また、第2の絶縁部材8の形成には、上記組成物の代わりに絶縁インキを用いてもよい。この絶縁インキとしては、浸透乾燥型、溶剤揮発型、熱硬化型、光硬化型など公知の何れの材料も使用できる。さらに、この絶縁インキを構成するバインダーに光硬化性樹脂を含ませれば、硬化時間を短縮して作業効率を向上できるのでより好ましい。無溶剤(溶剤を含まない)の絶縁インキは、溶剤が揮発する際に生じるマイクロクラックの発生を防げるので好ましい。
【0015】
非接触型データ受送信体1では、第1のICチップ3と第2のICチップ4としては、電磁波を媒体として外部から情報を受送信可能な非接触型データ受送信体に用いられるものは全て使用可能である。また、第1のICチップ3と第2のICチップ4とは、その機能およびメモリ容量が同じであっても、異なっていてもよい。
【0016】
このように、非接触型データ受送信体1では、2つのICチップ(第1のICチップ3、第2のICチップ4)を設けることにより、従来の非接触型データ受送信体よりも見かけ上メモリ容量を2倍以上にすることができる。これにより、大量のデータを同時に処理することが可能となる。また、一方のICチップ(例えば第1のICチップ3)に記憶させたデータを、他方のICチップ(例えば第2のICチップ4)でバックアップすることが可能となり、一方のICチップが破損、あるいは故障しても、データを損失することがない。
【0017】
さらに、第1のICチップ3、第2のICチップ4として異なる機能を有するものを用いれば、2つ以上の異なるデータを同時に処理することが可能となるため、非接触型データ受送信体1を多機能化することができる。
多機能化の具体的な例としては、例えば、第1のICチップ3、第2のICチップ4として、通信距離の異なるものを用いれば、近傍、近接型を兼用することができ、通信距離範囲の広い非接触型データ受送信体1とすることができる。また、第1のICチップ3、第2のICチップ4のそれぞれに、異なるデータ呼び出し保護手段を設けることにより、他者によるデータの偽造や呼び出しを困難なものとし、データをより厳密に保護することができる。これにより、2以上の異なる通信相手に対して、他者のデータに影響を及ぼすことなく、それぞれ独立にデータの受送信が可能となる。すなわち、第1のICチップ3によって通信相手Aとデータの受送信を行い、第2のICチップ4によって通信相手Bとデータの受送信を行うように、非接触型データ受送信体1内に、異なる通信相手との通信手段として、第1のICチップ3と第2のICチップ4を併存させることができる。よって、2以上の異なる通信相手と非接触によるデータ受送信を行うために、それぞれの相手に応じた非接触型データ受送信体をそれぞれ所有することなく、1つの非接触型データ受送信体を共用することも可能となる。
【0018】
図2は、図1に示した非接触型データ受送信体1における共振回路の等価回路を示す回路図である。
図2において、符号11はアンテナ体5の等価回路、12は第1のICチップ3の回路部分、13は第2のICチップ4の回路部分に相当する。また、アンテナ体5の等価回路11において、符号14はアンテナ体5の等価容量C、15は等価抵抗R、16は等価インダクタンスLである。さらに、符号17は第1のICチップ3の等価容量C、18は第2のICチップ4の等価容量Cである。
非接触型データ受送信体1のデータの受送信を、電磁波を用いて行う場合、非接触型データ受送信体1内に電磁波の周波数に合わせた共振回路が必要となる。非接触型データ受送信体1では、この共振回路は、インダクタンス素子としてのアンテナ体5と、静電容量素子として第1のICチップ3、第2のICチップ4とから構成さている。この共振回路の共振周波数fは、一般に下記式(1)で表される。
f=1/{2π[L(C+C+C)]1/2} (1)
【0019】
上記式(1)から、非接触型データ受送信体1の共振周波数fは、アンテナ体5の等価インダクタンスLと、アンテナ体5の等価容量Cと第1のICチップ3の等価容量Cと第2のICチップ4の等価容量Cとの積により決定される。よって、非接触型データ受送信体1に第1のICチップ3と第2のICチップ4を設けることにより、非接触型データ受送信体1における共振回路の等価回路上の等価容量が増大し、非接触型データ受送信体1を共振周波数の共振点に合わせるために必要とされる、アンテナ体5の等価インダクタンスLの値を小さくすることができる。その結果として、アンテナ体5の大きさを小さくすることができるから、非接触型データ受送信体1をより小型化することができる。
【0020】
なお、この実施形態では、基板2の一方の面上に第1のICチップ3、第2のICチップ4およびアンテナ体5が配置されたものを示したが、本発明の非接触型データ受送信体はこれに限定されず、第1のICチップ3、第2のICチップ4、アンテナ体5のうちいずれか1つまたは2つが基板2の他方の面上に配置されていてもよい。
また、この実施形態では、2個のICチップ(第1のICチップ3、第2のICチップ4)が、アンテナ体5に並列接続された非接触型データ受送信体1を示したが、本発明の非接触型データ受送信体はこれに限定されるものではなく、アンテナ体にICチップが3個以上並列接続されていてもよい。
【0021】
【発明の効果】
以上説明したように、本発明の非接触型データ受送信体は、絶縁部材からなる基板と、該基板上に配置され、データの記憶、処理および通信の制御を行う複数のICチップと、該複数のICチップに接続され、導電部材からなるアンテナ体とを備えた非接触型データ受送信体であって、前記複数のICチップは、前記アンテナ体に設けた複数の端子を介して並列接続されたものであるから、従来の非接触型データ受送信体よりもメモリ容量を大きくすることができる。これにより、大量のデータを同時に処理することが可能となる上に、一のICチップに記憶させたデータを、他のICチップでバックアップすることが可能となり、一のICチップが破損、あるいは故障しても、データを損失することがない。また、複数のICチップとして、異なる機能を有するものを用いれば、複数の異なるデータを同時に処理することが可能となるため、非接触型データ受送信体を多機能化することができる。具体的には、複数のICチップとして通信距離の異なるものを用いれば、通信距離範囲の広い非接触型データ受送信体とすることができる。さらに、アンテナ体の等価インダクタンスの値を小さくすることができるから、アンテナ体の大きさを小さくすることができ、非接触型データ受送信体をより小型化することができる。
【図面の簡単な説明】
【図1】本発明に係る非接触型データ受送信体の一例を示す模式的な平面図である。
【図2】図1に示した非接触型データ受送信体1における共振回路の等価回路を示す回路図である。
【符号の説明】
1・・・非接触型データ受送信体、2・・・基板、3・・・第1のICチップ、4・・・第2のICチップ、5・・・アンテナ体、6・・・周回部、7・・・接続部、8・・・第2の絶縁部材
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a non-contact type data transmitter / receiver that externally reads / writes data and supplies power by electromagnetic waves or the like.
INDUSTRIAL APPLICABILITY The non-contact data receiver / transmitter according to the present invention is suitably used for a card, a tag, and the like on which an IC is mounted.
[0002]
[Prior art]
In recent years, such as non-contact IC tags and information recording media for use in RF-ID (Radio Frequency Identification), non-contact data reception has been made to receive information from outside using electromagnetic waves as a medium and to transmit information to the outside. A sender has been proposed.
[0003]
Conventionally, such a non-contact type data transmitter / receiver is composed of an IC chip mounted with various electronic components for storing, processing, and controlling data on a substrate made of an insulating member, and a coil-shaped device for transmitting and receiving electromagnetic waves. (For example, see Patent Document 1).
[0004]
[Patent Document 1]
JP-A-10-334203
[Problems to be solved by the invention]
However, since the conventional non-contact type data receiver / transmitter has only one IC chip, the memory capacity is small, so the data storage capacity is also small, and a large amount of data can be processed at the same time. It was difficult to backup the stored data.
Further, since the conventional non-contact data receiver / transmitter has a small memory capacity, the antenna cannot be miniaturized in order to secure a resonance frequency necessary for performing data communication using electromagnetic waves. Because of this, the area occupied by the antenna in the non-contact data receiver / transmitter is large, and it has been difficult to further reduce the size of the non-contact data receiver / transmitter.
[0006]
Further, since the conventional non-contact type data receiving / transmitting device has only one IC chip, it can be used only at a predetermined communication distance, and cannot be used outside of the predetermined communication distance. Further, the conventional non-contact type data receiver / transmitter has only one IC chip, and since the memory capacity of the IC chip is small, it has been difficult to achieve multi-functionality.
[0007]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a non-contact data receiver / transmitter having a large memory capacity, a small size, a wide communication distance range, and a multifunctional function. And
[0008]
[Means for Solving the Problems]
The object is to provide a substrate made of an insulating member, a plurality of IC chips arranged on the substrate to control data storage, processing and communication, and an antenna body connected to the plurality of IC chips and made of a conductive member Wherein the plurality of IC chips are connected in parallel via a plurality of terminals provided on the antenna body. Can be solved.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a non-contact type data transmitter / receiver according to the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic plan view showing a first embodiment of a contactless data receiver / transmitter according to the present invention.
1 includes a substrate 2 made of a first insulating member and two IC chips arranged on one surface of the substrate 2 for controlling data storage, processing, and communication. (Here, the first IC chip 3 and the second IC chip 4) and an antenna body 5 having both ends connected to the first IC chip 3 and the second IC chip 4 and made of a conductive member. I have. The antenna body 5 has a plurality of orbiting portions 6 and connecting portions 7 extending from both ends of the orbiting portion 6 and connected to the first IC chip 3 and the second IC chip 4. In addition, one end of the circling portion 6 constituting the antenna body 5 is connected to the first IC chip 3 and the second IC chip 4 through a second insulating member 8 provided above the circulating portion 6 and other components. The end is directly connected to the first IC chip 3 and the second IC chip 4, and the first IC chip 3 and the second IC chip 4 are connected in parallel to the antenna body 5.
[0010]
As the substrate 2, for example, a woven fabric, a nonwoven fabric, a mat, a paper made of an inorganic fiber such as a glass fiber or an organic fiber such as an alumina fiber, a polyester fiber, or a polyamide fiber, or a combination thereof, or a resin varnish impregnated therein Composite base, polyamide-based resin base, polyester-based resin base, polyolefin-based resin base, polyimide-based resin base, ethylene-vinyl alcohol copolymer-based resin base, polyvinyl alcohol-based resin base, Plastic substrates such as polyvinyl chloride-based resin substrates, polyvinylidene chloride-based resin substrates, polystyrene-based resin substrates, polycarbonate-based resin substrates, acrylonitrile-butadiene-styrene copolymer-based resin substrates, and polyethersulfone-based resin substrates Or matte treatment, corona discharge treatment Plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment, or subjected to surface treatment of various adhesion-facilitating treatment, may be selected from known ones such as.
[0011]
The antenna body 5 constituting the non-contact type data receiving / transmitting body 1 is connected to the first IC chip 3 and the second IC chip 4 extending from both ends of the circling section 6 in addition to the plurality of circulating sections 6. A connection section 7 is provided. The distal end of the connection part 7 forms a connection terminal that branches into two and is connected to the first IC chip 3 and the second IC chip 4.
[0012]
As a method of forming the antenna body 5 (circular portion 6 and connection portion 7) made of a conductive member, a known manufacturing method can be used. For example, a method of screen-printing and fixing a solvent-evaporating, thermosetting, or light-curing conductive paste by drying and fixing, a method of attaching a coated or uncoated metal wire, an etching method, a method of attaching a metal foil, metal , A method of transferring a metal deposition film, a method of forming a conductive polymer film, and the like.
Among them, the method of screen-printing and fixing the conductive paste by drying does not require a reduced-pressure atmosphere, and easily places the antenna body 5 having an arbitrary line width at a desired position on the substrate 2 in a normal atmosphere. It is preferable because it can be formed.
Further, in FIG. 1, the connecting portion 7 is arranged outside the orbital portion 6, but may be arranged inside as a matter of course. The connecting portion 7 is arranged inside the circling portion 6, and the first IC chip 3 and the second IC chip 4 are connected to the inside of the circling portion 6 such that the first IC chip 3 and the second IC chip 4 are connected to the ends of the connecting portion 7. If the chip 3 and the second IC chip 4 are arranged, the space on the substrate 2 can be effectively used. In addition, since it is not necessary to provide a space for disposing the first IC chip 3 and the second IC chip 4 on the substrate 2 outside the circling portion 6, the non-contact type data receiver / transmitter 1 is more easily provided. The size can be reduced.
[0013]
The formation of the second insulating member 8 can be performed by a known method such as printing of an insulating paste, pasting of an insulating film through an adhesive, and pasting of an insulating tape. The screen printing used is most preferred. In the formation of the second insulating member 8 by screen printing, a composition comprising insulating particles and a binder is used as a coating agent, and examples of the insulating particles include silica, alumina, and talc. The dielectric constant of the second insulating member 8 can be finely adjusted by appropriately selecting the material of the insulating particles and the mixing ratio thereof. However, in the case where the insulating property is ensured even without the insulating particles, the second insulating member 8 may be formed by using a composition consisting only of the binder.
[0014]
Further, in forming the second insulating member 8, an insulating ink may be used instead of the composition. As the insulating ink, any known material such as a penetration drying type, a solvent evaporation type, a thermosetting type, and a photo-setting type can be used. Further, it is more preferable to include a photocurable resin in the binder constituting the insulating ink because the curing time can be shortened and the working efficiency can be improved. Solvent-free (excluding solvent) insulating ink is preferable because it can prevent the occurrence of microcracks that occur when the solvent evaporates.
[0015]
In the non-contact type data receiver / transmitter 1, the first IC chip 3 and the second IC chip 4 used for the non-contact type data receiver / transmitter capable of receiving and transmitting information from the outside using an electromagnetic wave as a medium are as follows. All can be used. The first IC chip 3 and the second IC chip 4 may have the same function and the same memory capacity or may have different functions.
[0016]
As described above, in the non-contact type data receiver / transmitter 1, by providing two IC chips (the first IC chip 3 and the second IC chip 4), the apparent value is larger than that of the conventional non-contact type data receiver / transmitter. The upper memory capacity can be doubled or more. As a result, a large amount of data can be processed simultaneously. In addition, data stored in one IC chip (for example, the first IC chip 3) can be backed up by the other IC chip (for example, the second IC chip 4), so that one of the IC chips is damaged, Or, even if a failure occurs, no data is lost.
[0017]
Furthermore, if the first IC chip 3 and the second IC chip 4 having different functions are used, two or more different data can be processed at the same time. Can be multifunctional.
As a specific example of multi-functionalization, for example, if the first IC chip 3 and the second IC chip 4 having different communication distances are used, both the proximity and proximity types can be used. The contactless data receiver / transmitter 1 having a wide range can be obtained. Further, by providing different data call protection means in each of the first IC chip 3 and the second IC chip 4, it is difficult to forge or call data by another person, and the data is more strictly protected. be able to. As a result, data can be transmitted and received independently to two or more different communication partners without affecting other party's data. That is, the first IC chip 3 transmits and receives data to and from the communication partner A, and the second IC chip 4 transmits and receives data to and from the communication partner B. In addition, the first IC chip 3 and the second IC chip 4 can coexist as communication means with different communication partners. Therefore, in order to perform data transmission / reception without contact with two or more different communication partners, one non-contact data receiver / transmitter does not have a contactless data receiver / transmitter corresponding to each partner. It can also be shared.
[0018]
FIG. 2 is a circuit diagram showing an equivalent circuit of a resonance circuit in the non-contact type data receiver / transmitter 1 shown in FIG.
In FIG. 2, reference numeral 11 denotes an equivalent circuit of the antenna body 5, 12 denotes a circuit portion of the first IC chip 3, and 13 denotes a circuit portion of the second IC chip 4. Further, in the equivalent circuit 11 of the antenna 5, reference numeral 14 is an equivalent capacitance C A, 15 of the antenna 5 is equivalent resistance R A, 16 is an equivalent inductance L A. Further, reference numeral 17 denotes an equivalent capacitance C 1 of the first IC chip 3, and reference numeral 18 denotes an equivalent capacitance C 2 of the second IC chip 4.
When data is transmitted and received by the non-contact data receiver / transmitter 1 using an electromagnetic wave, a resonance circuit that matches the frequency of the electromagnetic wave is required in the non-contact data receiver / transmitter 1. In the non-contact type data transmitter / receiver 1, the resonance circuit includes the antenna 5 as an inductance element, and the first IC chip 3 and the second IC chip 4 as capacitance elements. The resonance frequency f of this resonance circuit is generally represented by the following equation (1).
f = 1 / {2π [L A (C A + C 1 + C 2)] 1/2} (1)
[0019]
From the equation (1), the resonance frequency f of the non-contact type data reception and transmission body 1, the equivalent inductance L A of the antenna 5, the equivalent capacitance of the equivalent capacitor C A and the first IC chip 3 of the antenna 5 C 1 and the product of the equivalent capacitance C2 of the second IC chip 4. Therefore, by providing the first IC chip 3 and the second IC chip 4 in the non-contact data receiver / transmitter 1, the equivalent capacitance on the equivalent circuit of the resonance circuit in the non-contact data receiver / transmitter 1 increases. the contactless data reception and transmission body 1 is required to match the resonance point of the resonance frequency, it is possible to reduce the value of the equivalent inductance L a of the antenna 5. As a result, the size of the antenna body 5 can be reduced, so that the size of the non-contact data transmitter / receiver 1 can be further reduced.
[0020]
In this embodiment, the first IC chip 3, the second IC chip 4, and the antenna 5 are arranged on one surface of the substrate 2. The transmitting body is not limited to this, and one or two of the first IC chip 3, the second IC chip 4, and the antenna body 5 may be arranged on the other surface of the substrate 2.
Further, in this embodiment, the non-contact type data receiver / transmitter 1 in which the two IC chips (the first IC chip 3 and the second IC chip 4) are connected in parallel to the antenna body 5 is shown. The contactless data receiver / transmitter of the present invention is not limited to this, and three or more IC chips may be connected in parallel to the antenna.
[0021]
【The invention's effect】
As described above, the non-contact type data transmitter / receiver of the present invention includes a substrate formed of an insulating member, a plurality of IC chips disposed on the substrate, for controlling data storage, processing, and communication. A non-contact data receiver / transmitter, comprising: an antenna body made of a conductive member connected to a plurality of IC chips, wherein the plurality of IC chips are connected in parallel via a plurality of terminals provided on the antenna body Therefore, the memory capacity can be made larger than that of the conventional non-contact data transmitter / receiver. As a result, a large amount of data can be processed at the same time, and the data stored in one IC chip can be backed up by another IC chip. No data loss. In addition, when a plurality of IC chips having different functions are used, a plurality of different data can be processed at the same time, so that the contactless data receiver / transmitter can have multiple functions. Specifically, if a plurality of IC chips having different communication distances are used, a non-contact data receiver / transmitter having a wide communication distance range can be obtained. Furthermore, since the value of the equivalent inductance of the antenna can be reduced, the size of the antenna can be reduced, and the size of the non-contact data transmitter / receiver can be further reduced.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing an example of a non-contact data transmitter / receiver according to the present invention.
FIG. 2 is a circuit diagram showing an equivalent circuit of a resonance circuit in the non-contact type data receiver / transmitter 1 shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Non-contact type data transmission / reception body, 2 ... Substrate, 3 ... 1st IC chip, 4 ... 2nd IC chip, 5 ... Antenna body, 6 ... Circuit Part, 7 connection part, 8 second insulation member

Claims (1)

絶縁部材からなる基板と、該基板上に配置され、データの記憶、処理および通信の制御を行う複数のICチップと、該複数のICチップに接続され、導電部材からなるアンテナ体とを備えた非接触型データ受送信体であって、
前記複数のICチップは、前記アンテナ体に設けた複数の端子を介して並列接続されたことを特徴とする非接触型データ受送信体。
A substrate formed of an insulating member, a plurality of IC chips disposed on the substrate to control data storage, processing, and communication; and an antenna body connected to the plurality of IC chips and formed of a conductive member. A contactless data receiver and transmitter,
A non-contact type data receiving / transmitting body, wherein the plurality of IC chips are connected in parallel via a plurality of terminals provided on the antenna body.
JP2002315943A 2002-10-30 2002-10-30 Contactless data receiver Pending JP2004151968A (en)

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JP2006344043A (en) * 2005-06-09 2006-12-21 Ntt Docomo Inc Non-contact IC device and control method
KR100834845B1 (en) 2007-04-13 2008-06-03 주식회사 하렉스인포텍 Contactless card
JP2010067128A (en) * 2008-09-12 2010-03-25 Nittoku Eng Co Ltd Noncontact information processing medium
EP2182473A1 (en) * 2008-11-03 2010-05-05 Oberthur Technologies Electronic device authorising contactless near-field communications
JP2011070321A (en) * 2009-09-24 2011-04-07 Maxell Seiki Kk Multi-application ic card, and ic card
JP2012512451A (en) * 2008-12-15 2012-05-31 カードラボ エーピーエス RFID tag
JP2012230682A (en) * 2005-12-09 2012-11-22 Tego Inc Multiple radio frequency network node rfid tag
CN103208024A (en) * 2013-03-27 2013-07-17 上海东方磁卡工程有限公司 Smart card
US8941470B2 (en) 2005-12-09 2015-01-27 Tego Inc. Methods and systems of a radio frequency network node RFID tag with hardened memory system
US8988223B2 (en) 2005-12-09 2015-03-24 Tego Inc. RFID drive management facility
US9117128B2 (en) 2005-12-09 2015-08-25 Tego, Inc. External access to memory on an RFID tag
US9361568B2 (en) 2005-12-09 2016-06-07 Tego, Inc. Radio frequency identification tag with hardened memory system
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US9418263B2 (en) 2005-12-09 2016-08-16 Tego, Inc. Operating systems for an RFID tag
US9430732B2 (en) 2014-05-08 2016-08-30 Tego, Inc. Three-dimension RFID tag with opening through structure
US9542577B2 (en) 2005-12-09 2017-01-10 Tego, Inc. Information RFID tagging facilities
US9953193B2 (en) 2014-09-30 2018-04-24 Tego, Inc. Operating systems for an RFID tag
US10095968B2 (en) 2014-12-19 2018-10-09 Cardlabs Aps Method and an assembly for generating a magnetic field and a method of manufacturing an assembly
US10558901B2 (en) 2015-04-17 2020-02-11 Cardlab Aps Device for outputting a magnetic field and a method of outputting a magnetic field
US10784983B2 (en) 2016-12-30 2020-09-22 Cardlab Aps Assembly comprising a noise emitting element

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JP2006344043A (en) * 2005-06-09 2006-12-21 Ntt Docomo Inc Non-contact IC device and control method
US8941470B2 (en) 2005-12-09 2015-01-27 Tego Inc. Methods and systems of a radio frequency network node RFID tag with hardened memory system
JP2012230682A (en) * 2005-12-09 2012-11-22 Tego Inc Multiple radio frequency network node rfid tag
US9471821B2 (en) 2005-12-09 2016-10-18 Tego, Inc. External access to memory on an RFID tag
US9465559B2 (en) 2005-12-09 2016-10-11 Tego, Inc. System and method for emulating many time programmable memory
US10691992B2 (en) 2005-12-09 2020-06-23 Tego, Inc. RF tag with memory management
US10430702B2 (en) 2005-12-09 2019-10-01 Tego, Inc. RF tag network connectivity through gateway facility
US9542577B2 (en) 2005-12-09 2017-01-10 Tego, Inc. Information RFID tagging facilities
US9858452B2 (en) 2005-12-09 2018-01-02 Tego, Inc. Information RFID tagging facilities
US8558699B2 (en) 2005-12-09 2013-10-15 Tego Inc. Multiple radio frequency network node RFID tag
US9594998B2 (en) 2005-12-09 2017-03-14 Tego, Inc. Radio frequency identification tag with hardened memory system
US9424447B2 (en) 2005-12-09 2016-08-23 Tego, Inc. RFID tag facility with access to a sensor
US9842290B2 (en) 2005-12-09 2017-12-12 Tego, Inc. Flight-cycle sensor monitoring of aviation component
US9710682B2 (en) 2005-12-09 2017-07-18 Tego, Inc. Operating systems for an RFID tag
US8988223B2 (en) 2005-12-09 2015-03-24 Tego Inc. RFID drive management facility
US9117128B2 (en) 2005-12-09 2015-08-25 Tego, Inc. External access to memory on an RFID tag
US9361568B2 (en) 2005-12-09 2016-06-07 Tego, Inc. Radio frequency identification tag with hardened memory system
US8947233B2 (en) 2005-12-09 2015-02-03 Tego Inc. Methods and systems of a multiple radio frequency network node RFID tag
US9390362B2 (en) 2005-12-09 2016-07-12 Tego, Inc. Radio frequency identification tag with emulated multiple-time programmable memory
US9405950B2 (en) 2005-12-09 2016-08-02 Tego, Inc. External access to memory on an RFID tag
US9418263B2 (en) 2005-12-09 2016-08-16 Tego, Inc. Operating systems for an RFID tag
WO2008127044A1 (en) * 2007-04-13 2008-10-23 Harex Infotech Inc. Contactless card
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JP2010067128A (en) * 2008-09-12 2010-03-25 Nittoku Eng Co Ltd Noncontact information processing medium
EP2182473A1 (en) * 2008-11-03 2010-05-05 Oberthur Technologies Electronic device authorising contactless near-field communications
EP2377078B1 (en) * 2008-12-15 2014-03-05 Cardlab ApS An rfid tag
US8912887B2 (en) 2008-12-15 2014-12-16 Cardlab Aps RFID tag
JP2012512451A (en) * 2008-12-15 2012-05-31 カードラボ エーピーエス RFID tag
JP2011070321A (en) * 2009-09-24 2011-04-07 Maxell Seiki Kk Multi-application ic card, and ic card
CN103208024A (en) * 2013-03-27 2013-07-17 上海东方磁卡工程有限公司 Smart card
US9430732B2 (en) 2014-05-08 2016-08-30 Tego, Inc. Three-dimension RFID tag with opening through structure
US10204244B2 (en) 2014-09-30 2019-02-12 Tego, Inc. Data aggregating radio frequency tag
US9953193B2 (en) 2014-09-30 2018-04-24 Tego, Inc. Operating systems for an RFID tag
US10445536B2 (en) 2014-09-30 2019-10-15 Tego, Inc. Operating system for an RF tag
US10891449B2 (en) 2014-09-30 2021-01-12 Tego, Inc. Self-monitoring wireless computing device
US10095968B2 (en) 2014-12-19 2018-10-09 Cardlabs Aps Method and an assembly for generating a magnetic field and a method of manufacturing an assembly
US10614351B2 (en) 2014-12-19 2020-04-07 Cardlab Aps Method and an assembly for generating a magnetic field and a method of manufacturing an assembly
EP3035230A1 (en) 2014-12-19 2016-06-22 Cardlab ApS A method and an assembly for generating a magnetic field
US10558901B2 (en) 2015-04-17 2020-02-11 Cardlab Aps Device for outputting a magnetic field and a method of outputting a magnetic field
US10784983B2 (en) 2016-12-30 2020-09-22 Cardlab Aps Assembly comprising a noise emitting element

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