JP2004039873A - Apparatus and method for manufacturing printed circuit board - Google Patents

Abstract

A manufacturing apparatus and a manufacturing method for manufacturing a high-quality printed circuit board by mounting circuit components on a wiring board with required accuracy.
The dimensions of a wiring board are measured (SP1), the operation of printing solder on the wiring board is corrected according to the dimensions, and the solder is printed at an appropriate position according to the dimensions of the wiring board (SP6). The dimensions of the print mask are measured (SP4), the operation of printing the solder on the wiring board is corrected according to the dimensions, and the solder is printed at an appropriate position according to the dimensions of the print mask (SP6). The dimensions of the components are measured (SP7), and the operation of mounting the circuit components on the wiring board is corrected according to the dimensions, and the circuit components are mounted at appropriate positions according to the dimensions of the circuit components (SP9).
[Selection] Figure 2

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an apparatus and a method for manufacturing a printed circuit board.
[0002]
[Prior art]
Conventionally, when a connection material is printed on a wiring board (printed wiring board) using a print mask, and then the circuit components are mounted on the wiring board via the printed connection material to manufacture a printed circuit board, The print mask used to print the wiring board design values, circuit component design values, and connection material, based on the positions at which the circuit components are mounted on the board and the positions at which the connection material such as solder is printed on the electrodes formed on the wiring board. The circuit component is mounted on the wiring board through the operation of printing the connection material on the wiring board and the printed connection material via the connection material.
[0003]
[Problems to be solved by the invention]
However, the method described below for manufacturing a printed circuit board by mounting circuit components on a wiring board has the following problems. That is, the wiring board, the circuit component, and the print mask actually used for mounting have manufacturing tolerances (processing tolerances), respectively, and in reality, they are not actually manufactured (processed) as designed.
[0004]
For this reason, when connecting materials are printed on a wiring board that is not manufactured as designed using a printing mask that is not manufactured as designed, and circuit components that are not manufactured as designed are mounted on the wiring board. In addition, there is a case where the operation of each operation is performed on the assumption that all members are manufactured as designed.
[0005]
In this case, the circuit components cannot be mounted on the wiring board with the required accuracy, and the quality of the printed circuit board deteriorates, resulting in many defective products. As a countermeasure, it takes a lot of time and cost to respond to repeated trial production.
[0006]
In particular, recently, high density is required for mounting circuit components, and it is expected that the occurrence of this problem will increase.
[0007]
An object of the present invention is to provide a manufacturing apparatus and a manufacturing method for manufacturing a high quality printed circuit board by mounting circuit components on a wiring board with required accuracy.
[0008]
[Means for Solving the Problems]
The printed circuit board manufacturing apparatus of the present invention prints a connection material on a wiring board using a print mask, and then mounts circuit components on the wiring board via the printed connection material to form a printed circuit board. In a manufacturing apparatus, a measuring means for measuring dimensions of members required for manufacturing the printed circuit board, and an operation for manufacturing the printed circuit board based on a difference between a measured value measured by the measuring means and a reference value. Processing means for correcting the operation.
[0009]
According to the configuration of the present invention, when manufacturing a printed circuit board, an operation in a manufacturing operation is performed in accordance with dimensions of members (part or all of a wiring board, circuit components, and a print mask) required for manufacturing the printed circuit board. After the correction, the circuit component can be finally mounted at an appropriate position.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing a configuration of a process for manufacturing a printed circuit board according to this embodiment. The manufacturing apparatus and the manufacturing method include, on a line, a first step 11 including a substrate supply device 1, a second step 12 including a substrate measuring device 2, and a third step 13 including a solder printing device 3. And a fourth step 14 including the component mounting apparatus 4, a fifth step 15 including the solder curing furnace 5, and a sixth step 16 including the substrate storage device 6. Further, the manufacturing apparatus and the manufacturing method include a seventh step 17 provided with the mask measuring device 7 and an eighth step 18 provided with the component measuring device 8.
[0011]
The second step 12 including the measuring device 2 includes a processing device (PC) 21. The seventh step 17 including the mask measuring device 7 includes a processing device (PC) 22. The eighth step 18 including the component measuring device 8 includes a processing device (PC) 23. Further, a processing device (PC) 24 is provided by connecting the processing devices (PC) 21, 22, and 23.
[0012]
Further, the manufacturing apparatus and the manufacturing method include a measurement value storage server 25 connected to each of the processing apparatuses (PCs) 21, 22, and 23 via a bus 26.
[0013]
In this embodiment, a processing device (PC) is independently provided for each of the processes 11, 12, 17, and 18. However, the processing of each processing device (PC) is performed on the line by each processing device (PC). ) May be provided by a single processing device (PC).
[0014]
The board supply device 1 provided in the first step 11 carries out an operation of loading a wiring board as an entrance of a production line of a printed circuit board, and for example, a bar code indicating the type is described on the wiring board. In some cases, a function for reading this bar code is also provided.
[0015]
The board measuring device 2 provided in the second step 12 is provided in a stage preceding the solder printing device 3 and has the shape and external dimensions of the wiring board supplied by the board supply device 1, the shape of each connection electrode on the wiring board, and the like. It measures dimensions, position coordinates, angles, and the like. If necessary, the amount of warpage or undulation of the wiring board may be measured. For this measurement, an optical length measurement method, an image length measurement method, a laser length measurement method, or the like is employed, and the length measurement resolution is about 0.1 μm to 1 μm. The number of connection electrodes on the wiring board varies depending on the type of product, but is generally about several hundreds to several thousands. In some cases, the total number may be measured as needed, and only in the required places.
[0016]
FIG. 4 is a diagram schematically showing an example of a wiring board handled in a manufacturing process of a printed circuit board according to this embodiment. The wiring board used in this embodiment is formed by printing a connection electrode for connecting circuit components and a conductive line connecting the connection electrode on a surface of an insulating substrate with a conductive material, and further leaving the connection electrode ( It is intended for a printed wiring board in which the surface of an insulating substrate is exposed (exposed) with an insulating material.
[0017]
In FIG. 4, reference numeral 101 denotes a rectangular wiring board, on the surface of which a connection electrode to be connected to a connection pin and a connection pin included in the circuit component is exposed at a position where the circuit component is mounted. I have. For example, at the position where the chip resistor is mounted, two connection electrodes 102 for connecting the two connection electrodes included in the chip resistor are formed to be inclined with respect to the edge of the wiring board 101. At the mounting position, a number of connection electrodes 103 connected to a number of connection pins of the QFP occupy one corner of the substrate. Further, at a position where the BGA is mounted, a large number of circular connection electrodes 104 connected to a large number of connection electrodes included in the BGA are formed occupying one corner of the substrate.
[0018]
The board measuring device 2 measures the length L and the width W of the wiring board 101, and measures the coordinate position of the connection electrode 102 with reference to the absolute coordinates set on the wiring board 101. Measure the dimensions and height as needed. The dimensions of the other connection electrodes 103 and 104 are measured similarly. Since the connection electrode 104 is circular, the diameter Z is measured. The measured information is binarized, for example.
[0019]
The solder printing device 3 provided in the third step 13 is provided at the subsequent stage of the substrate measuring device 2 and prints solder as an example of a connection material on each connection electrode of the wiring board by a printing method using a print mask. This is to perform the application operation. The print mask has an opening facing the connection electrode of the wiring board, and the solder paste is printed on the connection electrode through the opening. The connection material is not limited to solder, and other connection materials can be used.
[0020]
The component mounting device 4 provided in the fourth step 14 is provided at the subsequent stage of the solder printing device 3 and arranges circuit components to be mounted on the wiring board at mounting positions on the surface of the wiring board, and the connection provided by the circuit components An electrode or pin is fixed to the connection electrode of the wiring board, and the connection electrode or pin is placed on the solder applied on the connection electrode and the circuit component is mounted on the wiring board. is there.
[0021]
The solder hardening furnace 5 provided in the fifth step 15 is provided at the subsequent stage of the component mounting device 4 and hardens the solder while the circuit component is mounted on the wiring board, and connects the connection electrodes or pins of the circuit component by the solder. The operation of attaching the circuit component to the wiring board by fixing to the connection electrode is performed.
[0022]
The substrate storage device 6 provided in the sixth step 16 is provided at the subsequent stage of the solder curing furnace 5 and carries out an operation of carrying out and storing a wiring substrate on which circuit components are mounted from a production line.
[0023]
The mask measuring device 7 provided in the seventh step 17 includes the shape and external dimensions of the print mask, the shape and dimensions of each solder printing opening formed facing each connection electrode of the wiring board, position coordinates and angles, and the like. Are respectively measured. If necessary, the amount of warpage or undulation of the wiring board may be measured. For this measurement, an optical length measurement method, an image length measurement method, a laser length measurement method, or the like is employed, and the length measurement resolution is about 0.1 μm to 1 μm. The number of openings in the print mask corresponds to the number of connection electrodes on the wiring board, and varies depending on the type of product, but is generally in the range of several hundred to several thousand. There are cases.
[0024]
FIG. 5 is a diagram schematically illustrating an example of a print mask handled in the manufacturing process of the printed circuit board according to this embodiment. In FIG. 5, reference numeral 111 denotes a rectangular print mask, and an opening having the same size as the electrode is formed at the position of the connection electrode on the wiring board. For example, two openings 112 facing two connection electrodes 102 for chip resistance corresponding to the wiring substrate shown in FIG. 4 and many openings 113 facing many connection electrodes 103 for QFP are provided. , A large number of circular openings 114 facing the large number of connection electrodes 104 for BGA.
[0025]
The mask measuring device 7 measures the length L and the width W of the print mask 111, measures the coordinate position of the opening 112 based on the absolute coordinates set on the print mask 111, and measures the X and Y dimensions, Measure the height as needed. The dimensions of the other openings 113 and 114 are measured similarly. Since the opening 114 is circular, the diameter dimension Z is measured. The measured information is binarized, for example.
[0026]
The component measuring device 8 provided in the eighth step 18 is provided independently of the component mounting device 4 or incorporated in the component mounting device 4. For this measurement, an optical length measurement method, an image length measurement method, a laser length measurement method, or the like is employed, and the length measurement resolution is about 0.1 μm to 1 μm. Examples of the circuit component mounted on the wiring board include a chip component, a QFP, and a BGA.
[0027]
If the measurement point of the circuit component is a cubic or rectangular parallelepiped circuit component (chip component), the vertical, horizontal, and height dimensions are measured. In the case of a circuit component (QFP) in which connection pins are formed, the length of the pins, the parallelism between the pins, and the vertical, horizontal, and height dimensions of portions other than the pins are measured. In the case of a circuit component (BGA) provided with a connection ball electrode, the height of the ball electrode, the parallelism between the balls, and the vertical, horizontal, and height dimensions of a portion other than the ball are measured. In the case of other circuit components, external dimensions of the circuit components, dimensions of connection electrodes, and the like are arbitrarily measured.
[0028]
6A and 6B are diagrams schematically illustrating an example of circuit components handled in a manufacturing process of a printed circuit board according to the present embodiment, wherein FIG. 6A is a front view and FIG. 6B is a side view.
[0029]
is there. In the figure, reference numeral 121 denotes a chip resistor which is an example of a chip component. The component measuring device 8 measures the length L (Y), width W (X) and height H of the chip resistor. The measured information is binarized, for example.
[0030]
Further, the processing device (PC) 21 provided in the second step 12 including the substrate measuring device 2 receives various measured values such as dimensions of each connection electrode on the wiring board measured by the substrate measuring device 2, and receives the measured values. The design value (reference value) of the wiring board is compared with the measured value, a correction value is calculated based on the difference, and the correction information is output to the solder printing apparatus 3. The processing device (PC) 21 outputs the correction value information to the solder printing device 3 in order to correct the operation of the solder printing device 3 for printing the solder on the connection electrodes of the wiring board. The correction value is for printing solder on the connection electrode at a position and size suitable for the measurement values of various dimensions such as the dimensions of each connection electrode on the wiring board measured by the board measuring device 2.
[0031]
Here, the processing device (PC) 21 outputs the correction value information to the solder printing device 3 when the difference between the measured value and the design value (reference value) is within a preset threshold range. is there. If the difference between the measured value and the design value (reference value) exceeds a preset threshold range, the wiring board is excluded from the manufacturing line and is not targeted.
[0032]
The processing device (PC) 22 provided in the seventh step 17 including the mask measuring device 7 receives various measured values such as the size of each opening in the print mask measured by the mask measuring device 7 and designs the print mask. The value (reference value) is compared with the measured value, a correction value is calculated based on the difference, and the correction value information is output to the solder printing apparatus 3.
[0033]
The processing device (PC) 22 outputs the correction value information to the solder printing device 3 in order to correct the operation of the solder printing device 3 for printing the solder on the connection electrodes of the wiring board. The correction value is for printing the solder on the connection electrode at a position and size suitable for the measurement values of various dimensions on the print mask measured by the mask measuring device 7.
[0034]
Here, the processing device (PC) 22 outputs the correction value information to the solder printing device 3 when the difference between the measured value and the design value (reference value) is within a preset threshold range. is there. If the difference between the measured value and the design value (reference value) exceeds a preset threshold range, the wiring board is excluded from the manufacturing line and is not targeted.
[0035]
The processing device (PC) 23 provided in the eighth step 18 including the component measuring device 8 receives various measured values of the circuit component measured by the component measuring device 8 and receives the design value (reference value) of the circuit component and the measured value. The measured values are compared with each other, a correction value is calculated based on the difference, and the correction information is output to the component mounting apparatus 4. The processing device (PC) 23 outputs the correction value information to the component mounting device 4 because the component mounting device 4 arranges the circuit component on the wiring board (the connection electrode and the pin for connecting the circuit component are connected to the wiring substrate). The correction value is provided at a position suitable for the measured value of the dimension and shape of the circuit component measured by the component measuring device 8.
[0036]
Here, the processing device (PC) 23 outputs the correction value information to the component mounting device 4 when the difference between the measured value and the design value (reference value) is within a preset threshold value range. is there. If the difference between the measured value and the design value (reference value) exceeds a predetermined threshold range, the wiring board is excluded from the manufacturing line and is not used as a target.
[0037]
The processing device (PC) 24 receives the design value information of the wiring board for the processing device (PC) 21, the design value information of the print mask for the processing device (PC) 22, and the processing device (PC) 23. , The design value information of the circuit components is input in advance. Further, the processing device (PC) 24 receives information indicating the type of the wiring board supplied by the device from the substrate supply device 1 and provides the information to each of the processing devices (PC) 21, 22, and 23.
[0038]
The measurement value storage server 25 interconnected to each of the processing devices (PCs) 21, 22, and 23 stores the measurement values of the wiring board, the print mask, and the circuit component measured by each of the processing devices (PCs) 21, 22, and 23, respectively. Information is stored, and access control of data writing and data reading is performed by each of the processing devices (PCs) 21, 22, and 23.
[0039]
Next, a case where a printed circuit board is manufactured by such a manufacturing apparatus and a manufacturing method will be described with reference to FIG. FIG. 2 is a diagram showing the sequence of steps for manufacturing a printed circuit board in this embodiment.
[0040]
First, in the first step 11, the wiring substrate is carried into the manufacturing line by the substrate supply device 1 (SP1). The processing device (PC) 24 inputs the design values of the wiring board, print mask, and circuit components to be manufactured to the processing devices (PC) 21, 22, and 23 in advance.
[0041]
Next, in the second step 12, the board measuring device 2 measures the outer dimensions of the wiring board, the dimensions of each connection electrode, and the like. The measurement value information measured by the substrate measurement device 2 is sent to the processing device (PC) 21 (SP2 = measurement step).
[0042]
The processing device (PC) 21 compares the measured value of the wiring board measured by the board measuring device 2 with a design value (reference value), and when the difference is within a threshold range, the difference is determined. , And outputs the correction value information to the solder printing apparatus 3. The correction value is a value for printing solder on the connection electrode at a position and size suitable for various measurement values such as the size of each connection electrode on the wiring board. For example, when a plurality of connection electrodes for QFP are shifted as a group by a certain distance from a design value in a certain direction, the printing position of the solder is changed in the direction (or a certain distance in the opposite direction) according to the shift. (SP3 = processing step), ie, accepts various dimensions such as the dimensions of each connection electrode on the wiring board, and adjusts the dimensions. Correct so that the solder is printed at the appropriate position.
[0043]
If the difference between the measured value and the design value (reference value) is out of the range of the preset threshold value, the circuit board is excluded from the production line (SP3 = processing step).
[0044]
Next, in a seventh step 17, the external dimensions and the opening dimensions of the print mask are measured by the mask measuring device 7. The measurement value information measured by the mask measurement device 7 is sent to the processing device (PC) 22 (SP4 = measurement step).
[0045]
The processing device (PC) 22 compares the measured value of the print mask measured by the mask measuring device 7 with the design value (reference value), and when the difference is within the range of the threshold value, the difference is determined. , And outputs the correction value information to the solder printing apparatus 3. The correction value is a value for printing the solder on the connection electrode at a position and size suitable for various measurement values such as the size of each opening in the print mask. For example, when a plurality of openings forming a plurality of connection electrodes for QFP are shifted as a group by a certain distance from a design value in a certain direction, the printing position of the solder is changed in the direction according to the shift. A correction value is output so as to correct (move) a certain distance (or in the opposite direction) and print the solder (SP5 = processing step). That is, various dimensions such as the dimensions of each opening in the measured print mask are received, and correction is performed so that solder is printed at an appropriate position according to the dimensions.
[0046]
If the difference between the measured value and the design value (reference value) is out of the range of the preset threshold value, the print mask is excluded from the production line (SP5 = processing step).
[0047]
Next, in a third step 13, solder is printed on each connection electrode on the wiring board by using a print mask by the solder printing apparatus 3. Here, the solder printing apparatus 3 applies a connection value of the wiring board to the connection electrode of the wiring board based on the correction value corresponding to the measurement value of the wiring board from the processing apparatuses (PCs) 21 and 22 and the correction value corresponding to the measurement value of the print mask. The operation of printing the solder is performed (SP6).
[0048]
That is, the operation of the solder printing apparatus 3 for printing the solder on the connection electrodes of the wiring board is set based on the design value of the wiring board and the design value of the print mask. However, if the dimensions of the wiring board and the dimensions of the print mask are deviated from the design values, the solder is printed on the connection electrodes of the wiring board based on the design values. It is printed out of position.
[0049]
Therefore, based on the correction value information from the processing devices (PCs) 21 and 22, various actual dimensions of the printed circuit board are accepted, and various actual dimensions of the print mask are accepted. Correct so that the solder is printed at the appropriate position. In other words, even when various dimensions of the wiring board and various dimensions of the print mask have deviations from the design values, the solder is printed at a position where the deviations are absorbed. Therefore, the solder can be printed on the wiring board with the required accuracy.
[0050]
Also, by measuring the three-dimensional dimensions of the connection electrodes of the wiring board, the amount of solder to be printed and applied on the connection electrodes can be determined.
[0051]
Next, in an eighth step 18, various dimensions of the circuit component mounted on the wiring board are measured by the component measuring device 8. The measurement value information measured by the component measuring device 8 is sent to the processing device (PC) 23 (SP7 = measuring step).
[0052]
The processing device (PC) 23 compares the measured value of the circuit component measured by the component measuring device 8 with a design value (reference value), and when the difference is within a threshold range, the difference is determined. , And outputs the correction value information to the component mounting apparatus 3 (SP8 = processing step). The correction value is a value at which the circuit component can be mounted on the wiring board at a position and size suitable for various measured values of the circuit component. That is, various dimensions of the measured circuit component are accepted, and correction is made so that the circuit component can be arranged at an appropriate position according to the dimension.
[0053]
If the difference between the measured value and the design value (reference value) is out of the range of the preset threshold value, the circuit component is excluded from the production line (SP8 = processing step).
[0054]
FIG. 3 is a diagram showing a data table for measuring and correcting dimensions of circuit components in a process of manufacturing a printed circuit board according to this embodiment. Here, QFP and chip components are taken as circuit components. Since the QFP has a large number of connection pins, the dimensions in the X and Y directions are measured for each pin, the reference value is measured, the difference is compared with the reference value, the difference is determined, and a correction value is set.
[0055]
In the QFP of FIG. 3, the reference values in the X and Y directions are a ₁ , b ₂ , the measured values in the X and Y directions are c ₁ , d ₁ , and the difference between the X and Y directions is (a ₁ −c ₁ ), (b ₂ −d ₂ ), threshold values e ₁ , f _{1 in} the X and Y directions, and correction values g ₁ , h ₁ , in the X and Y directions.
[0056]
Next, in the fourth step 14, the circuit component is placed at the mounting position on the surface of the wiring board by the component mounting apparatus 4, and the electrodes or pins of the circuit component are fixed to face the connection electrodes of the wiring board. The operation of mounting the circuit component on the wiring board by placing the electrode or the pin on the solder applied on the connection electrode is performed. Here, the component mounting device 4 performs an operation of mounting the circuit component on the wiring board based on the correction value according to the measurement of the circuit component from the processing device (PC) 23 (SP9).
[0057]
That is, the operation of the component mounting device 4 for mounting the circuit component on the wiring board is set based on the design value of the circuit component. However, when the dimensions of the circuit component deviate from the design values, when the operation of mounting the circuit component on the wiring board based on the design value is performed, the circuit component solder is mounted at a position deviating from the design value.
[0058]
Therefore, based on the correction value from the processing device (PC) 23, the actual size of the circuit component is received, and the correction is performed so that the circuit component is arranged at an appropriate position corresponding to the size. In other words, even when various dimensions of the circuit component are deviated from the design values, the circuit component is mounted at a position where the deviation is absorbed. Therefore, the circuit component wiring can be mounted on the wiring board with required accuracy.
[0059]
Next, in a fifth step 15, the solder is cured while the circuit component is mounted on the wiring board by the solder curing furnace 5, and the electrodes or pins of the circuit component are fixed to the connection electrodes by soldering, and the circuit component is mounted on the wiring board. The work of mounting is performed (SP10).
[0060]
Next, in the sixth step 16, a work is carried out in which the wiring board on which the circuit components are mounted is carried out of the manufacturing line and stored by the board storage device 6 (SP11).
[0061]
In this way, the connection material is printed on the wiring board using a printing mask, and then the circuit components are mounted on the wiring board with the required precision through the printed connection material, thereby producing a high-quality printed circuit board. can do.
[0062]
In manufacturing the printed circuit board, not only the measurement result of the wiring board, the measurement result of the print mask, and the measurement result of the marine component are used independently to obtain a correction value, but also these measurement results are used in two or three. The correction values can be obtained in combination, and in this case, the correction can be performed more widely and with higher accuracy.
[0063]
In this case, each of the processing devices (PCs) 21, 22, and 23 writes data of the measured values of the wiring board, the print mask, and the circuit component measured to the measured value accumulation server 25, respectively. ) 21, 22, and 23 read the data of the measurement values stored in the measurement value storage server 25.
[0064]
The present invention is not limited to the above-described embodiment, but can be implemented with various modifications.
[0065]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the manufacturing apparatus and manufacturing method of a printed circuit board which manufactures a high quality printed circuit board by mounting a circuit component on a wiring board with required precision can be obtained.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a configuration of a manufacturing process of a printed circuit board according to an embodiment of the present invention.
FIG. 2 is a view showing the order of steps of manufacturing a printed circuit board in the embodiment.
FIG. 3 is an exemplary view showing a data table in a step of manufacturing the printed circuit board according to the embodiment;
FIG. 4 is a diagram schematically showing an example of a wiring board handled in a manufacturing step of the printed circuit board according to the embodiment.
FIG. 5 is a view schematically showing an example of a print mask handled in the manufacturing process of the printed circuit board according to the embodiment.
FIG. 6 is a diagram schematically showing an example of circuit components handled in a printed circuit board manufacturing process according to the embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Substrate supply apparatus 2 ... Substrate measuring apparatus 3 ... Solder printing apparatus 4 ... Component mounting apparatus 5 ... Solder curing furnace 6 ... Substrate storage apparatus 7 ... Mask measuring apparatus 8 ... Part measuring apparatus 11 ... First step 12 ... Second step 13 third step 14 fourth step 15 fifth step 16 sixth step 17 seventh step 18 eighth step 21 processing apparatus 22 processing apparatus 23 processing apparatus 24 processing apparatus 25 measurement values Storage server 101: Wiring board 111: Printing mask 121: Chip resistance

Claims (8)

In a device for printing a connection material using a print mask on a wiring board, and then mounting a circuit component on the wiring board via the printed connection material to manufacture a printed circuit board,
Measuring means for measuring the dimensions of the members required to manufacture the printed circuit board,
Processing means for correcting the operation of the operation of manufacturing the printed circuit board according to the measurement value measured by the measuring means. The measuring means is for measuring a dimension related to the wiring board, and the processing means is an operation of printing the connection material on the wiring board based on a difference between a measured value measured by the measuring means and a reference value. The apparatus for manufacturing a printed circuit board according to claim 1, wherein the operation is corrected. The measuring unit is for measuring a dimension related to the circuit component, and the processing unit is configured to connect the circuit component to the wiring via the connection material based on a difference between a measured value measured by the measuring unit and a reference value. 2. The apparatus for manufacturing a printed circuit board according to claim 1, wherein the apparatus corrects an operation of a work to be mounted on a substrate. The measuring unit is for measuring a dimension related to the print mask, and the processing unit is an operation for printing the connection material on the wiring board based on a difference between a measured value measured by the measuring unit and a reference value. The apparatus for manufacturing a printed circuit board according to claim 1, wherein the operation is corrected. A method for manufacturing a printed circuit board by printing a connection material using a print mask on a wiring board, and then mounting circuit components on the wiring board via the printed connection material,
A measuring step of measuring the dimensions of the members required to manufacture the printed circuit board,
A process of correcting the operation of the operation of manufacturing the printed circuit board according to the measured value measured in the measuring step. The measuring step is for measuring a dimension related to the wiring board, and the processing step is an operation of printing the connection material on the wiring board based on a difference between a measured value measured in the measuring step and a reference value. The method for manufacturing a printed circuit board according to claim 5, wherein the operation is corrected. The measuring step is for measuring a dimension related to the circuit component, and the processing step is to connect the circuit component to the wiring via the connection material based on a difference between a measured value measured in the measuring step and a reference value. The method for manufacturing a printed circuit board according to claim 5, wherein the operation of mounting on the board is corrected. The measuring step is for measuring a dimension related to the print mask, and the processing step is an operation of printing the connection material on the wiring board based on a difference between a measured value measured in the measuring step and a reference value. The method for manufacturing a printed circuit board according to claim 5, wherein the operation is corrected.

Images