JP2004038573A - Noncontact id card and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the reduction in yield of product in a noncontact ID card by satisfactorily connecting the antenna electrode of an antenna circuit board to the extended electrode of an interposer board without using a conductive film while providing practical electric characteristics of a fixed quality, and preventing a positional slippage when fixing both the boards. <P>SOLUTION: The antenna circuit board 2 and the interposer board 7 are laminated so that the antenna electrodes 3a and 3b of the board 2 are closely fitted to the extended electrodes 11a and 11b of the board 7, and both the substrates are mutually fixed after pressing local portions of one-side electrodes into the other electrodes. The one-side electrodes may be the antenna electrodes 3a and 3b or the extended electrodes 11a and 11b, and the number of local portions may be one or two or more. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to non-contact ID (identification information) cards and a method for manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, various types of so-called non-contact ID cards, non-contact tags, etc. (hereinafter, collectively referred to as non-contact ID cards) in which an IC chip is mounted on an antenna circuit board are known. is there.
[0003]
A typical example thereof is a non-contact ID card disclosed in International Publication No. WO01 / 62517. This known non-contact ID card is an antenna circuit board having an antenna formed on a base material. And an interposer substrate in which an enlarged electrode connected to the electrode of the IC chip is formed on a base material on which the IC chip is mounted, and the antenna electrode and the enlarged electrode are joined together by a conductive film. It is a stack of substrates.
[0004]
However, in the non-contact ID cards described above, since the antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board are joined by a conductive film, both electrodes are joined by heat sealing as described later. In this case, the displacement of the joining position between the two electrodes is easy to occur, and the joining is susceptible to environmental changes such as temperature and humidity, which is a good joining state of the two electrodes. The electric resistance value is low and constant. It has a drawback that it is difficult to maintain the conduction state for a long period of time.
[0005]
Then, in the prior application (Japanese Patent Application No. 2002-075112), the antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board are joined with a conductive film, and the base material of the antenna circuit board and the base material of the interposer board are joined together. It has been proposed that the fixation can alleviate the influence of environmental changes (changes in temperature, humidity, etc.) on the joining of the two electrodes and maintain a good joining state over a long period of time. The elimination of the shift has not been resolved.
[0006]
In general, the two electrodes are joined by attaching a conductive adhesive film as a conductive film on the electrode of the interposer substrate, and then laminating it on the antenna circuit board, followed by heat sealing, that is, expansion with the antenna electrode. The conductive particles contained in the conductive adhesive film are applied to both electrodes with strong force by heating while pressing with a heat tool the part to be joined with the conductive adhesive film arranged between the electrodes. They are brought into contact and joined in a conductive state.
[0007]
However, immediately after the start of the heat sealing (the initial stage of the heat sealing), the two electrodes are merely in a bonded state by the conductive adhesive film that is adhered to them, and are in an unstable temporary bonded state. ing.
[0008]
Therefore, immediately after the start of the heat sealing, the displacement of the joining position between the two electrodes is likely to occur due to the elasticity of the conductive adhesive film containing the conductive particles in the adhesive resin, and the heat sealing temperature (for example, 100 ° C.) The conductive adhesive film softens in the middle of the temperature rise (intermediate temperature) until the temperature reaches, so that if the flatness of the bonding portion is not precisely maintained, the bonding position is likely to be similarly shifted, and the above-described bonding position shift is caused. If the heat sealing is performed while the displacement of the bonding position is disregarded, the electrical resistance value of the bonding changes and the product becomes defective, resulting in a reduction in product yield. As described above, all of the conventional non-contact ID cards have a problem that is difficult to solve such that a bonding position shift occurs due to the use of the conductive film.
[0009]
[Problems to be solved by the invention]
The present invention has been made in view of the above-mentioned drawbacks, and the object is to improve the antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board even if the conductive film is not used. To achieve a certain level of practical electrical characteristics and to secure (especially fusion) the substrates of both substrates without causing displacement. In order to prevent a decrease in product yield.
[0010]
[Means for solving the problem]
In order to solve the above problems, in the method for manufacturing non-contact ID cards according to the present invention, the two electrodes are laminated so that the antenna electrode of the antenna circuit substrate and the enlarged electrode of the interposer substrate are in close contact with each other, After press-fitting the local portion of the one electrode into the other electrode, the base materials of both substrates are fixed to each other.
[0011]
As described above, while fixing the base materials of both substrates laminated so that the electrodes are in close contact with each other, prior to that, a portion of one electrode is pressed into the other electrode, so that the conductive film , The two electrodes can be satisfactorily connected to each other, thereby preventing a decrease in product yield.
[0012]
The above-mentioned one electrode may be either the antenna electrode of the antenna circuit board or the enlarged electrode of the interposer board, and the local portion thereof may be singular or plural. In general, the latter (plural) is preferable in order to more effectively prevent the occurrence of displacement.
[0013]
In addition, the non-contact ID cards according to the present invention manufactured by such a method directly connect the antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board without interposing a conductive film. Nevertheless, it can have a certain quality of practical electrical properties.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Non-contact ID cards according to the present invention have an antenna circuit board and an interposer board laminated on each other. FIG. 1 is a plan view of one embodiment, and FIG. 1 is a cross-sectional view taken along line XX of FIG. 2 is shown.
[0015]
In both figures, the lower antenna circuit board 2 and the upper interposer board 7 are laminated so that the antenna electrodes 3a and 3b of the antenna circuit board 2 and the enlarged electrodes 11a and 11b of the interposer board 7 are in close contact with each other. At the same time, the base material 9 of the antenna circuit board 2 and the base material 10 of the interposer board 7 are fused (see FIG. 5).
[0016]
In the above-described antenna circuit board 2, an antenna 6 and a pair of antenna electrodes 3a and 3b connected thereto are formed on a resin film constituting a base material 9. On the other hand, the interposer substrate 7 embeds the IC chip 4 in a thermoplastic resin film constituting the base material 10 and forms enlarged electrodes 11a and 11b connected to a pair of electrodes of the IC chip 4. .
[0017]
3 and 4 show an enlarged view of the interposer substrate 7, the pair of electrodes 12a and 12b of the IC chip 4 are, for example, aluminum electrodes, which are thin leads of the expanded electrodes 11a and 11b. The sections 11a ₁ and 11b ₁ are connected.
[0018]
Further, in FIG. 5, the close contact portion between the enlarged electrode 11a of the interposer substrate 7 and the antenna electrode 3a of the antenna circuit substrate 2 is shown in an enlarged manner. Is pressed into the antenna electrode 3a.
[0019]
The other electrode 11b and the electrode 3b (not shown) are also in close contact with each other in the same form, and the local portion 15 of the enlarged electrode 11a is located at the center of the antenna electrode 3a in plan view (see FIG. 6).
[0020]
The above-described press-fitting is performed in a state where both substrates 2 and 7 are stacked. This is performed before the base material 10 of the interposer substrate 7 and the base material 9 of the antenna circuit board 2 are fused. For example, a local tool 15 such as a punch is pressed into the substrate 10 of the interposer substrate 7 to a predetermined depth in a direction indicated by an arrow (downward) in the drawing to press the local portion 15 of the enlarged electrode 11a into the antenna electrode 3a.
[0021]
After that, the base material 10 of the interposer substrate 7 and the base material 9 of the antenna circuit board 2 are fused by appropriate means. For example, the base material 10 and the base material 9 are fused by heating while pressing with a heat tool. Such a fused portion is preferably a peripheral portion of a contact portion between the enlarged electrodes 11a and 11b and the antenna electrodes 3a and 3b. The fused portion is fused in a continuous shape so as to surround the contact portion, or is an intermittent shape. It can be appropriately fused to a predetermined form, for example, by fusion.
[0022]
As described above, prior to fusion between the base material 10 of the interposer substrate 7 and the base material 9 of the antenna circuit board 2, the local portions 15 of the enlarged electrodes 11a and 11b are press-fitted into the antenna electrodes 3a and 3b. Therefore, even if a conductive film is not used, both electrodes can be satisfactorily connected and practical electrical characteristics of a certain quality can be obtained, and at the time of welding the base materials in a later step, It is possible to perform the fusion without causing the displacement, and it is possible to prevent the yield of products from lowering.
[0023]
As described above, one embodiment of the non-contact ID cards according to the present invention has been described. However, in the present invention, the base material 9 of the antenna circuit board 2 may be a resin film, paper, nonwoven fabric, or the like as a single material. Good. The base material 10 of the interposer substrate 7 may be a resin film as a single material or a laminated material having a resin film (for example, a laminated material of a resin film and paper). It is preferable to select a thermoplastic resin film.
[0024]
The mounting of the IC chip 4 on the base material 10 of the interposer substrate 7 is not limited to the embedding, and may be performed in a general form that is not embedded, but the base material 10 may be a resin film or a thermoplastic resin film. And embedding the IC chip 4 in them is preferable from the viewpoint of thinning.
[0025]
Further, the fixation of the base material 9 of the antenna circuit board 2 and the base material 10 of the interposer board 7 is not limited to the above-mentioned fusion, and may be fixed using an appropriate adhesive. That is, when both the substrates 9 and 10 are made of a material that cannot be fused (a material other than the thermoplastic resin film), they are fixed using an appropriate adhesive.
[0026]
On the other hand, when one (preferably the latter) or both of the base material 9 of the antenna circuit board 2 and the base material 10 of the interposer board 7 are made of a thermoplastic resin film, they are fused. Since the application of the adhesive is troublesome, fusion is preferable to using the adhesive.
[0027]
The above-mentioned fusion site can be selected at a predetermined location as needed, and may be either a point-like fusion or a predetermined length fusion. As the heat tool as the fusing means, a predetermined tool such as an ultrasonic type or a ceramic type can be selected as necessary.
[0028]
Also, when the base material 9 of the antenna circuit board 2 and the base material 10 of the interposer substrate 7 are fixed with an adhesive, a predetermined portion can be appropriately selected as a bonding portion, if necessary. They may be adhered in a dotted manner or adhered to a predetermined length.
[0029]
The above-described enlarged electrodes 11a and 11b and the antenna 6 are preferably made of a conductive resin, and are preferably formed by a printing method, for example, a screen printing method from the viewpoint of cost reduction. However, if necessary, it may be formed by another printing method, for example, offset printing or the like, and furthermore, aluminum or the like may be deposited by a method other than the printing method, for example, a sputtering method.
[0030]
It is preferable that both the antenna electrodes 3a and 3b and the enlarged electrodes 11a and 11b are constituted by silver paste printed electrodes, or one is constituted by a silver paste printed electrode and the other is constituted by an aluminum electrode.
[0031]
As a condition for press-fitting both electrodes, 10 g to ²⁰ kg, preferably 50 g to 5 kg per 2.5 mm ² is appropriate. A predetermined temperature can be selected as the fusion temperature between the base materials 9 and 10 according to the melting temperature of the resin.
[0032]
The electrodes 12a and 12b of the IC chip 4 are preferably formed with an under barrier metal layer (UBM layer) in order to secure the connection with the enlarged electrodes 11a and 11b.
[0033]
Further, instead of forming the base material 10 of the interposer substrate 7 with a thermoplastic resin film, the base material 9 of the antenna circuit substrate 2 may be formed with a thermoplastic resin film. One or both base materials of the interposer substrate 7 may be constituted by a thermoplastic resin film.
[0034]
As for the above-mentioned thermoplastic resin film, other than the copolymerized polyethylene terephthalate (PET-G), for example, polyethylene terephthalate (PET), polysulfone (PSF), polyether sulfone (PES), liquid crystal polymer (LCP), polyether ethyl ketone (PEEK) or the like.
[0035]
Further, the antenna 6 of the antenna circuit board 2 may be of any type, such as a spiral type or a comb type (see FIG. 7), and the space between the substrate mounting portions may be filled with the insulating material 14.
[0036]
Further, instead of press-fitting the local portions 15 of the enlarged electrodes 11a and 11b into the antenna electrodes 3a and 3b, as shown in FIG. 8, the local portions 15 of the antenna electrodes 3a and 3b may be press-fitted into the enlarged electrodes 11a and 11b. In short, in short, in the present invention, a portion of one electrode is press-fitted into the other electrode before the substrates are fixed to each other.
[0037]
Further, the means for press-fitting is not limited to the above-described molding tool such as a punch, and may be another means, and the press-fitting position is also the center of the antenna electrodes 3a, 3b or the enlarged electrodes 11a, 11b. It is not limited to the part, and may be set at a position other than the center part, and the press fit shape is not limited to the V-shaped or inverted V-shaped press-fit shape as shown in FIGS. For example, it may be curved (see FIG. 10).
[0038]
Note that a plurality of portions of one electrode may be press-fitted into the other electrode. Such a configuration is shown in FIG. Further, the press-fitting may be performed by pressing the electrode into a non-penetrating state or by pressing the electrode into a penetrating state as shown in FIG.
[0039]
【The invention's effect】
As described above, the present invention includes an antenna circuit board having an antenna formed on a base material, and an interposer board having an enlarged electrode connected to an electrode of the IC chip formed on a base material having an IC chip mounted thereon. In the case of manufacturing a non-contact ID card or the like in which the bases of both substrates stacked so that the electrode of the antenna and the enlarged electrode are brought into close contact with each other, the base of the interposer substrate and the antenna circuit Prior to the fixation of the substrate to the substrate, the local portion of one electrode is pressed into the other. Therefore, even if a conductive film is not used, both electrodes can be connected well, and practical electrical characteristics of a certain quality can be obtained. At the time of (especially fusion), fixation (or fusion) can be performed without causing displacement, and a decrease in product yield can be prevented.
[Brief description of the drawings]
FIG. 1 is a plan view of non-contact ID cards.
FIG. 2 is a sectional view taken along line XX of FIG.
FIG. 3 is a front view of an interposer substrate.
FIG. 4 is a plan view of FIG. 3;
FIG. 5 is a front view showing an adhesion state of electrodes.
FIG. 6 is a plan view of FIG. 5;
FIG. 7 is a plan view showing a comb-shaped antenna.
FIG. 8 is a front view showing another contact state of the electrode.
FIG. 9 is a front view showing another contact state of the electrode.
FIG. 10 is a front view showing another contact state of the electrode.
FIG. 11 is a front view showing another contact state of the electrode.
[Explanation of symbols]
2: antenna circuit boards 3a, 3b: antenna electrode 4: IC chip 6: antenna 7: interposer board 9: base material of antenna circuit board 10: base materials 11a, 11b of interposer board: enlarged electrode 15: local

Claims (20)

An antenna circuit substrate having an antenna formed on a base material, and an interposer substrate having an expanded electrode connected to an electrode of the IC chip formed on a base material having an IC chip mounted thereon, wherein the electrode of the antenna and the expanded electrode are provided. In a method for manufacturing a non-contact ID card and the like in which the base materials of both substrates stacked so as to be in close contact with each other are fixed, localization of the one electrode is performed prior to fixing of the base materials to each other. A non-contact ID card, etc. The method for manufacturing non-contact ID cards according to claim 1, wherein a plurality of localities of the one electrode are press-fitted into the other electrode. 3. The method according to claim 1, wherein the one electrode is the enlarged electrode. The method according to claim 1 or 2, wherein the one electrode is an electrode of the antenna. The non-contact ID card according to any one of claims 1 to 4, wherein the base material of the interposer substrate is formed of a resin film or a laminate having a resin film as a single material. Production method. The method for manufacturing non-contact ID cards according to claim 5, wherein the resin film is formed of a thermoplastic resin film. The method for manufacturing non-contact ID cards according to claim 6, wherein the IC chip is embedded in the thermoplastic resin film. The non-contact ID card according to any one of claims 1 to 4, wherein the base material of the antenna circuit board is formed of any one of a resin film, paper, and nonwoven fabric as a single material. Manufacturing methods. 9. The method according to claim 8, wherein the resin film is made of a thermoplastic resin film. The method for manufacturing non-contact ID cards according to any one of claims 1 to 9, wherein the enlarged electrode is made of a conductive resin. An antenna circuit substrate having an antenna formed on a base material, and an interposer substrate having an expanded electrode connected to an electrode of the IC chip formed on a base material having an IC chip mounted thereon, wherein the electrode of the antenna and the expanded electrode are provided. In a non-contact ID card or the like in which the base materials of both substrates stacked so as to adhere to each other are fixed, the electrode of the antenna and the enlarging electrode are configured such that a local portion of the one electrode is connected to the other electrode. Non-contact ID cards that are closely attached to a press-fitted figure. The non-contact ID cards according to claim 11, wherein the one electrode has a plurality of local portions. The non-contact ID cards according to claim 11, wherein the one electrode is the enlarged electrode. The non-contact ID cards according to claim 11, wherein the one electrode is the antenna electrode. The non-contact ID cards according to any one of claims 11 to 14, wherein the base material of the interposer substrate is formed of a resin film or a laminate having a resin film as a single material. The non-contact ID cards according to claim 15, wherein the resin film is formed of a thermoplastic resin film. The non-contact ID cards according to claim 16, wherein the IC chip is embedded in the thermoplastic resin film. The non-contact ID card according to any one of claims 11 to 14, wherein the base material of the antenna circuit board is formed of any one of a resin film, paper, and a nonwoven fabric as a single material. Kind. The non-contact ID cards according to claim 18, wherein the resin film is formed of a thermoplastic resin film. The non-contact ID cards according to any one of claims 11 to 19, wherein the enlarged electrode is made of a conductive resin.

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