JP2004032144A - transceiver - Google Patents

Abstract

An object of the present invention is to reduce the cost of a wireless device and ensure antenna performance.
A circuit component is mounted on one side or both sides of a multilayer substrate, a single-sided substrate is placed on the multilayer substrate, and a ground pattern of the multilayer substrate is connected to a ground pattern of the single-sided substrate. Configure.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a wireless device such as a cordless remote controller, a transceiver, and a cordless telephone, and more particularly to a circuit board structure of the wireless device.
[0002]
[Prior art]
A conventional wireless device will be described with reference to the drawings. FIG. 4 is a configuration diagram of a conventional wireless device.
[0003]
In FIG. 4, 1 is a multilayer substrate, 2 is a circuit component, 4 is a ground pattern of the multilayer substrate, and 7 is an antenna.
[0004]
The circuit component 2 is mounted on the surface of the multilayer board 1. Here, the circuit component 2 is a chip LCR component, a transistor, a filter, or the like. A wireless circuit is constituted by the circuit components 2 and the wiring patterns formed on the multilayer substrate 1. The antenna 7 is connected to an antenna terminal on the multilayer substrate 1. On the multilayer substrate 1, a ground pattern 4 of the multilayer substrate is formed. The ground pattern 4 of the multilayer substrate has a role as a ground for the antenna 7 in addition to a role as the ground wiring of the wireless circuit 2.
[0005]
The multi-layer substrate 1 is housed in a resin case or the like to complete a wireless device.
[0006]
[Problems to be solved by the invention]
However, the conventional wireless device has a problem that the size of the multilayer board cannot be reduced to a certain size or less. That is, the length or size of the antenna is determined by the frequency used. For example, in a 400 MHz band で は λ antenna, the length is about 17 cm. Here, it is necessary that the size of the ground pattern 4 of the multilayer substrate serving as a housing is also about 17 cm or more. When the multilayer substrate ground pattern 4 is small, the performance of the antenna is reduced. For example, there are adverse effects such as a decrease in gain and an unstable characteristic in which the directivity tends to change depending on the surrounding environment.
[0007]
When the circuit component 2 is reduced in size, the occupied area of the entire wireless circuit can be reduced. However, in order to secure the characteristics of the antenna as described above, the size of the multilayer substrate 1 needs to be more than a certain size. In general, a multilayer substrate is more expensive than a single-sided substrate, which has been a limiting factor in reducing the cost of a wireless device.
[0008]
[Means for Solving the Problems]
In order to solve the conventional problem, a wireless device of the present invention includes a circuit board mounted on one or both sides of a multilayer board, a single-sided board placed on the multilayer board, and a ground pattern of the multilayer board. It is configured by connecting a ground pattern of a single-sided board.
[0009]
The multilayer board can be made as small as the area occupied by the wireless circuit, and the size of the ground pattern for the antenna can be secured with an inexpensive single-sided board, thus reducing the cost of the wireless device and securing the antenna performance. Can be compatible.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
According to the first aspect of the present invention, a circuit component is mounted on one or both sides of a multilayer board, a single-sided board is placed on the multilayer board, and a ground pattern of the multilayer board is connected to a ground pattern of the single-sided board. Make up. And since the multilayer board can be made as small as the area occupied by the wireless circuit, and the ground of the antenna can be secured with an inexpensive single-sided board, it is possible to reduce the cost of the wireless device and secure the antenna performance. it can.
[0011]
According to a second aspect of the present invention, an antenna component is mounted or an antenna pattern is formed on a single-sided substrate, and an antenna terminal of a multilayer substrate is connected to the antenna component or the antenna pattern of the single-sided substrate. In the configuration in which the antenna pattern is formed on the substrate, the size of the multilayer substrate can be minimized, and the area required for the antenna can be sufficiently secured by the inexpensive single-sided substrate, thereby realizing a low cost. it can.
[0012]
According to a third aspect of the present invention, the connection between the ground pattern of the multi-layer substrate and the single-sided substrate uses rivets. Since the rivet is inexpensive and the work process can be simplified, the cost can be reduced.
[0013]
【Example】
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0014]
(Example 1)
FIG. 1 is a configuration diagram of a wireless device according to a first embodiment of the present invention. The wireless device of this embodiment will be described with reference to FIG.
[0015]
In FIG. 1, 1 is a multilayer board, 2 is a circuit component, 3 is a single-sided board, 4 is a ground pattern of a multilayer board, 5 is a ground pattern of a single-sided board, 6 is a connection structure, and 7 is an antenna.
[0016]
The circuit component 2 is mounted on the surface of the multilayer board 1. Here, the multilayer substrate 1 is a double-sided substrate in which copper foil patterns are formed on both sides of the substrate, but a four-layer substrate or a multilayer having more layers can be used. Here, the term “multilayer” refers to a multilayer having a plurality of copper foil layers. Therefore, although the dielectric layer is a single layer in the double-sided substrate, this is also classified as a multilayer substrate.
[0017]
The circuit component 2 uses a chip LCR component, a transistor, a filter, and the like. A wireless circuit is formed by these circuit components 2 and the wiring pattern formed on the multilayer substrate 1. In addition, a ground pattern 4 of the multilayer substrate is formed on the multilayer substrate 1 as a ground of the wireless circuit.
[0018]
In addition, a single-sided board ground pattern 5 is formed by the copper foil on the single-sided board 3 surface. Further, the multilayer substrate 1 and the single-sided substrate 3 are arranged so as to overlap with each other. Here, the single-sided substrate 3 is arranged such that the surface of the single-sided substrate 3 without the copper foil comes to the multilayer substrate 1 side. With such an arrangement, there is an advantage that unnecessary conduction can be prevented from occurring due to contact between the copper foil of the multilayer substrate 1 and the copper foil of the single-sided substrate 3. However, the surface of the single-sided substrate 3 with the copper foil may be arranged facing the multilayer substrate 1 side. In this case, since the copper foil pattern of the single-sided board 3 and the copper foil pattern of the multilayer board 1 overlap, there is an advantage that the mutual connection is easy.
[0019]
Next, the ground pattern 4 of the multilayer substrate and the ground pattern 5 of the single-sided substrate are electrically connected. The connection structure 6 is used for the connection. In the connection structure 6, metal pins are inserted into holes formed in the multilayer substrate 1 and the single-sided substrate 3 and soldered to the ground pattern 4 of the multilayer substrate and the ground pattern 5 of the single-sided substrate. Although only one connection structure 6 is shown in FIG. 1, a configuration in which connections are made at a plurality of locations may be employed.
[0020]
The antenna 7 is connected to an antenna terminal provided on the multilayer substrate 1.
[0021]
With the above-described configuration, the size of the multilayer substrate 1 can be reduced to the minimum size necessary for configuring a wireless circuit. The ground pattern required for the antenna 7 is constituted by the ground pattern 5 on a single-sided board.
[0022]
In this embodiment, the multilayer board 1 uses a glass epoxy board. In general, glass epoxy substrates are widely used in high-frequency circuits such as wireless devices because they have relatively small dielectric loss and can form patterns with high accuracy. The single-sided substrate 3 uses a paper phenol substrate. Generally, a paper phenol substrate is characterized by being very inexpensive and easy to process. The total cost is about 1/7 of the glass epoxy substrate.
[0023]
Since a portion requiring a large area as the ground of the antenna 7 is formed on an inexpensive paper phenol single-sided substrate, product cost can be reduced. Since the wireless circuit is formed on the multilayer substrate 1 made of glass epoxy, the performance as a wireless device is ensured. That is, it is possible to achieve both reduction in the cost of the wireless device and securing of antenna performance.
[0024]
In this embodiment, the antenna 7 is directly connected to the antenna terminal of the multilayer substrate 1 and the antenna is also directly mounted on the multilayer substrate. However, the antenna 7 can be mounted on the single-sided substrate 3. In this case, a structure similar to the connection structure 6 is used to connect the antenna terminal of the multilayer substrate 1 to the antenna 7 mounted on the single-sided substrate 3.
[0025]
The multi-layer substrate 1 is housed in a resin case or the like to complete a wireless device.
[0026]
Although the circuit components may be mounted on only one side of the multilayer substrate, the circuit components can be mounted on both sides. However, in this case, it hits when it is overlaid on the single-sided substrate. In order to avoid this, the portions corresponding to the mounting positions of the circuit components of the single-sided multilayer board can be deleted or cut out in advance so that they can be overlapped.
[0027]
(Example 2)
FIG. 2 is a configuration diagram of a wireless device according to a second embodiment of the present invention. In FIG. 2, reference numeral 8 denotes a pattern antenna. The same components as those in FIG. 1 are denoted by the same reference numerals.
[0028]
A feature of the present invention is that a pattern antenna 8 formed of a copper foil of the single-sided substrate 3 is used as an antenna.
[0029]
The antenna terminal of the multilayer board 1 is connected to the pattern antenna 8 of the single-sided board 3 through the connection structure 6. The antenna terminal is for inputting and outputting a wireless signal of a wireless circuit formed on the multilayer substrate 1, and is provided for connection with an antenna.
[0030]
Generally, when a pattern antenna is formed on a substrate, it often occupies a larger area than the area occupied by a wireless circuit. In this configuration, an inexpensive paper phenol substrate is used as the single-sided substrate 3, so that cost increase can be suppressed even in a large area.
[0031]
Since the pattern antenna can be configured as an antenna built in the storage case of the wireless device, the pattern antenna can have a shape without protrusions.
[0032]
In this embodiment, the pattern antenna formed on the single-sided substrate 3 is used. However, an antenna function such as a chip antenna or a sheet metal antenna can be mounted on the single-sided substrate 3 to configure the function of the antenna.
[0033]
(Example 3)
FIG. 3 is a configuration diagram of a wireless device according to a third embodiment of the present invention. In FIG. 3, reference numeral 9 denotes a rivet. The same components as those in FIGS. 1 and 2 are denoted by the same reference numerals.
[0034]
A feature of the present invention is that a rivet is used as the connection structure. That is, the rivets 9 are used to connect the ground pattern 4 of the multilayer substrate and the ground pattern 5 of the single-sided substrate. Also, rivets 9 are used to connect the antenna terminals of the multilayer substrate 1 and the pattern antenna 8 of the single-sided substrate 3.
[0035]
Rivets are relatively inexpensive and thus have a cost advantage, but they also have the advantage of further reducing assembly costs. That is, the mounting of the circuit components on the multilayer substrate 1 is performed by a reflow process or a flow process. On the other hand, since there is no component to be mounted on the single-sided board, the above steps are unnecessary. Therefore, it is not necessary to form a resist or the like on the copper foil surface of the single-sided substrate. Next, the ground pattern 4 of the multilayer board and the ground pattern 5 of the single-sided board are connected. However, if a step of soldering metal pins is adopted, it is necessary to solder manually by a robot or the like, which results in cost reduction. Disadvantageous. It is also possible to select a step of soldering metal pins in the flow step, but in this case, it is necessary to apply a resist process to prevent solder from adhering to unnecessary parts on the copper foil surface of the single-sided board, It is disadvantageous in terms of cost.
[0036]
In this embodiment, the connection is completed by inserting rivets into holes formed in the multilayer substrate 1 and the single-sided substrate 3 and performing rivet caulking. Electrical and mechanical connections can be made easily. By eliminating the need for soldering equipment and completing it in a short time, assembly costs can be greatly reduced.
[0037]
Note that it is necessary to arrange the surface of the single-sided substrate 3 without the copper foil on the multilayer substrate 1 side.
[0038]
After the rivet caulking step, soldering may be performed on the substrate pattern and the rivet.
[0039]
【The invention's effect】
As is clear from the above description, according to the wireless device of the present invention, the area of the relatively expensive multilayer board is minimized, and the ground area required for the antenna is formed by an inexpensive single-sided board. Therefore, there is an effect that both cost reduction and antenna performance can be ensured.
[Brief description of the drawings]
1 is a configuration diagram of a wireless device according to a first embodiment of the present invention; FIG. 2 is a configuration diagram of a wireless device according to a second embodiment of the present invention; FIG. 3 is a configuration diagram of a wireless device according to a third embodiment of the present invention; 4: Configuration diagram of conventional radio device [Explanation of reference numerals]
REFERENCE SIGNS LIST 1 multilayer board 2 circuit component 3 single-sided board 4 ground pattern of multilayer board 5 ground pattern of single-sided board 6 connection structure 7 antenna 8 pattern antenna 9 rivet

Claims (3)

A wireless device comprising a circuit component mounted on one or both surfaces of a multilayer substrate, a single-sided substrate placed on the multilayer substrate, and a ground pattern of the multilayer substrate connected to a ground pattern of the single-sided substrate. 2. The wireless device according to claim 1, wherein an antenna component is mounted or an antenna pattern is formed on a single-sided substrate, and the antenna terminal of the multilayer substrate is connected to the antenna component or the antenna pattern on the single-sided substrate. 3. The wireless device according to claim 1, wherein the connection of the ground pattern between the multilayer substrate and the single-sided substrate uses a rivet.

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