JP2004026070A - Method of adhering and sealing hem portion of vehicle body - Google Patents
Method of adhering and sealing hem portion of vehicle body Download PDFInfo
- Publication number
- JP2004026070A JP2004026070A JP2002187537A JP2002187537A JP2004026070A JP 2004026070 A JP2004026070 A JP 2004026070A JP 2002187537 A JP2002187537 A JP 2002187537A JP 2002187537 A JP2002187537 A JP 2002187537A JP 2004026070 A JP2004026070 A JP 2004026070A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- hemming
- hem
- sealer
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000007789 sealing Methods 0.000 title claims abstract description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- 230000001070 adhesive effect Effects 0.000 claims abstract description 39
- 238000009957 hemming Methods 0.000 claims abstract description 30
- 229920001944 Plastisol Polymers 0.000 claims abstract description 14
- 239000004999 plastisol Substances 0.000 claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 12
- 239000011324 bead Substances 0.000 claims abstract description 10
- 239000002245 particle Substances 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 8
- 229920000178 Acrylic resin Polymers 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000004014 plasticizer Substances 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 2
- 150000003278 haem Chemical class 0.000 claims 1
- 238000009825 accumulation Methods 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract description 2
- -1 2-ethylhexyl Chemical group 0.000 description 17
- 238000000576 coating method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 10
- 229920000768 polyamine Polymers 0.000 description 10
- 229910000831 Steel Inorganic materials 0.000 description 9
- 229920005862 polyol Polymers 0.000 description 9
- 150000003077 polyols Chemical class 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 6
- 238000005336 cracking Methods 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920000570 polyether Polymers 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 239000011164 primary particle Substances 0.000 description 4
- 239000003981 vehicle Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 229920005906 polyester polyol Polymers 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000011163 secondary particle Substances 0.000 description 3
- 239000012798 spherical particle Substances 0.000 description 3
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- XFDQLDNQZFOAFK-UHFFFAOYSA-N 2-benzoyloxyethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOC(=O)C1=CC=CC=C1 XFDQLDNQZFOAFK-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 241000272194 Ciconiiformes Species 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 241000178435 Eliokarmos dubius Species 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- FZERHIULMFGESH-UHFFFAOYSA-N N-phenylacetamide Chemical compound CC(=O)NC1=CC=CC=C1 FZERHIULMFGESH-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- VEZUQRBDRNJBJY-UHFFFAOYSA-N cyclohexanone oxime Chemical compound ON=C1CCCCC1 VEZUQRBDRNJBJY-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 2
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- CBFCDTFDPHXCNY-UHFFFAOYSA-N icosane Chemical compound CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- GFNDFCFPJQPVQL-UHFFFAOYSA-N 1,12-diisocyanatododecane Chemical compound O=C=NCCCCCCCCCCCCN=C=O GFNDFCFPJQPVQL-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical class C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- ROHUXHMNZLHBSF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCC(CN=C=O)CC1 ROHUXHMNZLHBSF-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- DFPJRUKWEPYFJT-UHFFFAOYSA-N 1,5-diisocyanatopentane Chemical compound O=C=NCCCCCN=C=O DFPJRUKWEPYFJT-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- QARDZRSRMBMAFJ-UHFFFAOYSA-N 1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)-1-[oxiran-2-yl-(oxiran-2-ylmethylamino)methoxy]methanamine Chemical compound C1OC1CNC(C1OC1)OC(C1OC1)NCC1CO1 QARDZRSRMBMAFJ-UHFFFAOYSA-N 0.000 description 1
- DNBONBIDYRIIIH-UHFFFAOYSA-N 1-(oxiran-2-ylmethoxy)hexane-1,1-diol Chemical compound CCCCCC(O)(O)OCC1CO1 DNBONBIDYRIIIH-UHFFFAOYSA-N 0.000 description 1
- RJXOUJMYPFAIBK-UHFFFAOYSA-N 1-(oxiran-2-ylmethyl)imidazolidine-2,4-dione Chemical compound O=C1NC(=O)CN1CC1OC1 RJXOUJMYPFAIBK-UHFFFAOYSA-N 0.000 description 1
- ZZFUVPDOJGQTKI-UHFFFAOYSA-N 1-methyl-2-[(2-methylphenyl)methyl]benzene Chemical compound CC1=CC=CC=C1CC1=CC=CC=C1C ZZFUVPDOJGQTKI-UHFFFAOYSA-N 0.000 description 1
- LTJKEWJBNJGKCM-UHFFFAOYSA-N 1-propan-2-ylimidazolidine-2,4-dione Chemical compound CC(C)N1CC(=O)NC1=O LTJKEWJBNJGKCM-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- LTMRRSWNXVJMBA-UHFFFAOYSA-L 2,2-diethylpropanedioate Chemical compound CCC(CC)(C([O-])=O)C([O-])=O LTMRRSWNXVJMBA-UHFFFAOYSA-L 0.000 description 1
- HGUFODBRKLSHSI-UHFFFAOYSA-N 2,3,7,8-tetrachloro-dibenzo-p-dioxin Chemical compound O1C2=CC(Cl)=C(Cl)C=C2OC2=C1C=C(Cl)C(Cl)=C2 HGUFODBRKLSHSI-UHFFFAOYSA-N 0.000 description 1
- GVPODVKBTHCGFU-UHFFFAOYSA-N 2,4,6-tribromoaniline Chemical compound NC1=C(Br)C=C(Br)C=C1Br GVPODVKBTHCGFU-UHFFFAOYSA-N 0.000 description 1
- BLPURQSRCDKZNX-UHFFFAOYSA-N 2,4,6-tris(oxiran-2-ylmethoxy)-1,3,5-triazine Chemical compound C1OC1COC(N=C(OCC1OC1)N=1)=NC=1OCC1CO1 BLPURQSRCDKZNX-UHFFFAOYSA-N 0.000 description 1
- UYINXWLEUKYMEC-UHFFFAOYSA-N 2-(2-hydrazinyl-2-oxoethoxy)acetohydrazide;4-[1-(4-hydroxyphenyl)ethyl]phenol Chemical compound NNC(=O)COCC(=O)NN.C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 UYINXWLEUKYMEC-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- KOGSPLLRMRSADR-UHFFFAOYSA-N 4-(2-aminopropan-2-yl)-1-methylcyclohexan-1-amine Chemical compound CC(C)(N)C1CCC(C)(N)CC1 KOGSPLLRMRSADR-UHFFFAOYSA-N 0.000 description 1
- VESRBMGDECAMNH-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]-2,3,5,6-tetramethylphenol Chemical compound CC1=C(C(=C(C(=C1O)C)C)C(C)(C)C1=CC=C(C=C1)O)C VESRBMGDECAMNH-UHFFFAOYSA-N 0.000 description 1
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 1
- BTJIUGUIPKRLHP-UHFFFAOYSA-N 4-nitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1 BTJIUGUIPKRLHP-UHFFFAOYSA-N 0.000 description 1
- XRBNDLYHPCVYGC-UHFFFAOYSA-N 4-phenylbenzene-1,2,3-triol Chemical group OC1=C(O)C(O)=CC=C1C1=CC=CC=C1 XRBNDLYHPCVYGC-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- JPKVIAIUBLGJQH-UHFFFAOYSA-N 6-methylidenecyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1C=CCC(=C)C1C(O)=O JPKVIAIUBLGJQH-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- GOJCZVPJCKEBQV-UHFFFAOYSA-N Butyl phthalyl butylglycolate Chemical compound CCCCOC(=O)COC(=O)C1=CC=CC=C1C(=O)OCCCC GOJCZVPJCKEBQV-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- QSBINWBNXWAVAK-PSXMRANNSA-N PE-NMe(16:0/16:0) Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP(O)(=O)OCCNC)OC(=O)CCCCCCCCCCCCCCC QSBINWBNXWAVAK-PSXMRANNSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical class OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical class CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- FZENGILVLUJGJX-UHFFFAOYSA-N acetaldehyde oxime Chemical compound CC=NO FZENGILVLUJGJX-UHFFFAOYSA-N 0.000 description 1
- 229960001413 acetanilide Drugs 0.000 description 1
- PXAJQJMDEXJWFB-UHFFFAOYSA-N acetone oxime Chemical compound CC(C)=NO PXAJQJMDEXJWFB-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229960004050 aminobenzoic acid Drugs 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 229940045713 antineoplastic alkylating drug ethylene imines Drugs 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- GXGMLHLXTNVBOQ-UHFFFAOYSA-N benzene-1,3-diol;2-(2-hydrazinyl-2-oxoethoxy)acetohydrazide Chemical compound OC1=CC=CC(O)=C1.NNC(=O)COCC(=O)NN GXGMLHLXTNVBOQ-UHFFFAOYSA-N 0.000 description 1
- VQXDIDTUGQJUFE-UHFFFAOYSA-N benzene-1,4-diol;2-(2-hydrazinyl-2-oxoethoxy)acetohydrazide Chemical compound OC1=CC=C(O)C=C1.NNC(=O)COCC(=O)NN VQXDIDTUGQJUFE-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000006267 biphenyl group Chemical class 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- HCQHIEGYGGJLJU-UHFFFAOYSA-N didecyl hexanedioate Chemical compound CCCCCCCCCCOC(=O)CCCCC(=O)OCCCCCCCCCC HCQHIEGYGGJLJU-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 1
- BEPAFCGSDWSTEL-UHFFFAOYSA-N dimethyl malonate Chemical compound COC(=O)CC(=O)OC BEPAFCGSDWSTEL-UHFFFAOYSA-N 0.000 description 1
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 1
- DROMNWUQASBTFM-UHFFFAOYSA-N dinonyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCC DROMNWUQASBTFM-UHFFFAOYSA-N 0.000 description 1
- MIMDHDXOBDPUQW-UHFFFAOYSA-N dioctyl decanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC MIMDHDXOBDPUQW-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- QQVHEQUEHCEAKS-UHFFFAOYSA-N diundecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCC QQVHEQUEHCEAKS-UHFFFAOYSA-N 0.000 description 1
- JMLPVHXESHXUSV-UHFFFAOYSA-N dodecane-1,1-diamine Chemical compound CCCCCCCCCCCC(N)N JMLPVHXESHXUSV-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- FKIRSCKRJJUCNI-UHFFFAOYSA-N ethyl 7-bromo-1h-indole-2-carboxylate Chemical compound C1=CC(Br)=C2NC(C(=O)OCC)=CC2=C1 FKIRSCKRJJUCNI-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FBQUUIXMSDZPEB-UHFFFAOYSA-N hexadecane-1,1-diamine Chemical compound CCCCCCCCCCCCCCCC(N)N FBQUUIXMSDZPEB-UHFFFAOYSA-N 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- NWHXWGJXXSTRKT-UHFFFAOYSA-N hydroxy carbonochloridate Chemical compound OOC(Cl)=O NWHXWGJXXSTRKT-UHFFFAOYSA-N 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- ZIYVHBGGAOATLY-UHFFFAOYSA-L methylmalonate(2-) Chemical compound [O-]C(=O)C(C)C([O-])=O ZIYVHBGGAOATLY-UHFFFAOYSA-L 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- PWNDYKKNXVKQJO-UHFFFAOYSA-N n',n'-dibutylethane-1,2-diamine Chemical compound CCCCN(CCN)CCCC PWNDYKKNXVKQJO-UHFFFAOYSA-N 0.000 description 1
- KYCGURZGBKFEQB-UHFFFAOYSA-N n',n'-dibutylpropane-1,3-diamine Chemical compound CCCCN(CCCC)CCCN KYCGURZGBKFEQB-UHFFFAOYSA-N 0.000 description 1
- UDGSVBYJWHOHNN-UHFFFAOYSA-N n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCN UDGSVBYJWHOHNN-UHFFFAOYSA-N 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- DILRJUIACXKSQE-UHFFFAOYSA-N n',n'-dimethylethane-1,2-diamine Chemical compound CN(C)CCN DILRJUIACXKSQE-UHFFFAOYSA-N 0.000 description 1
- DMDXQHYISPCTGF-UHFFFAOYSA-N n',n'-dipropylethane-1,2-diamine Chemical compound CCCN(CCC)CCN DMDXQHYISPCTGF-UHFFFAOYSA-N 0.000 description 1
- GZUCMODGDIGMBI-UHFFFAOYSA-N n',n'-dipropylpropane-1,3-diamine Chemical compound CCCN(CCC)CCCN GZUCMODGDIGMBI-UHFFFAOYSA-N 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- KCAMXZBMXVIIQN-UHFFFAOYSA-N octan-3-yl 2-methylprop-2-enoate Chemical compound CCCCCC(CC)OC(=O)C(C)=C KCAMXZBMXVIIQN-UHFFFAOYSA-N 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- XRQKARZTFMEBBY-UHFFFAOYSA-N oxiran-2-ylmethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC1CO1 XRQKARZTFMEBBY-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000010665 pine oil Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229940088417 precipitated calcium carbonate Drugs 0.000 description 1
- 239000010734 process oil Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- ZNZJJSYHZBXQSM-UHFFFAOYSA-N propane-2,2-diamine Chemical compound CC(C)(N)N ZNZJJSYHZBXQSM-UHFFFAOYSA-N 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- XGSHEASGZHYHBU-UHFFFAOYSA-N tetradecane-1,1-diamine Chemical compound CCCCCCCCCCCCCC(N)N XGSHEASGZHYHBU-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical group CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- BOXSVZNGTQTENJ-UHFFFAOYSA-L zinc dibutyldithiocarbamate Chemical compound [Zn+2].CCCCN(C([S-])=S)CCCC.CCCCN(C([S-])=S)CCCC BOXSVZNGTQTENJ-UHFFFAOYSA-L 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
Images
Landscapes
- Body Structure For Vehicles (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【0001】
【発明の属する技術分野】
本発明は車体パネルのヘム部接着シール工法、更に詳しくは、特に自動車の車体組立ラインでのヘミング工程に関し、車体パネル(インナーパネルとアウターパネル)の周縁ヘム部を接着(ヘミング接着剤を使用)し、かつ両パネルのヘム重ね合せ部の段差をシール(ボデーシーラーを使用)するに際し、上記ヘミング接着剤のエアー溜りの影響による、ボデーシーラーの焼付硬化時のフクレ発生の防止もしくは軽減を目的とした工法に関する。
【0002】
【従来の技術と発明が解決しようとする課題】
自動車の車体組立ラインにおいて、たとえばドア、トランク、フード、サンルーフカバーなどの車体部分(いわゆる、蓋もの部分)にあって一般に、その車体パネル(インナーパネルとアウターパネル)をヘミング工程に付す。具体的には、
i)アウターパネルの周縁ヘム部にヘミング接着剤を塗布し、
ii)これにインナーパネルを重ね合せ、アウターパネルの折返し部をクリンチして、ヘミング部を加圧(プレス)し、
iii)次いで、電着塗装工程を経て、両パネルのヘム重ね合せ部にボデーシーラーを塗布し、焼付硬化を行って両パネルの段差をシールする。
その後、後工程として中塗塗料の焼付硬化、および上塗塗料の焼付硬化を行なって作業を終了する。
【0003】
ところで従来より、上記ヘミング接着剤の中に、その層厚みを一定に維持するためのスペーサーとして、ガラスビーズ、セラミックスや硬質合金(ステンレス鋼、チタン)などの球状粒子が配合され、かかる粒子はプレス段階でパネル面に食込み、仮止め効果に寄与する(特表平8−510698号公報参照)。
【0004】
一方、ボデーシーラーとして、たとえばポリ塩化ビニル(PVC)やアクリル樹脂粒子を可塑剤に分散してなるプラスチゾルシーラーが用いられている。
しかして、ヘミング接着剤は通常、上記電着塗装工程中の焼付硬化で同時に硬化するが、上記球状粒子が配合されていることによって、ヘム重ね合せ部の接着クリアランス(間隙)が広くなり、接着剤の充填部位にエアー溜りを発生させる傾向が強くなる(勿論、最大限十分なヘミング部の加圧(プレス)をかければ、接着クリアランスを縮小することはできるが、工程上限界がある)。
このエアー溜りは、ボデーシーラーの焼付硬化時に膨張して該シーラーのフクレを起生せしめ、ひいては、中塗りおよび/または上塗りの塗膜割れ現象に至らしめることは少なくない。
【0005】
【課題を解決するための手段】
そこで本発明者らは、上記接着クリアランスをより狭くしてエアー溜りの可能性をできるだけ抑えかつ適度の仮止め効果を維持せしめ、そして、ある程度のエアーが残留しても、ボデーシーラーのフクレ発生を防止もしくは軽減できる技法に関して鋭意研究を進めたところ、ヘミング接着剤に配合する球形粒子として、特定平均粒径および量のガラスビーズを用い、かつ従来よりも低圧締条件下でプレス(加圧)しても、適度の接着クリアランスおよび仮止め効果が得られること;並びにボデーシーラーに熱硬化性材料を配合することにより、熱時強度を付与すればフクレ発生を有効に防止もしくは軽減しうることを見出し、本発明を完成させるに至った。
【0006】
すなわち、本発明は、車体パネル(インナーパネルとアウターパネル)に対しヘミング工程により、周縁ヘム部を接着し、かつ両パネルのヘム重ね合せ部の段差をシールする工法において、
上記周縁ヘム部の接着に、平均粒径100〜300μmのガラスビーズ0.3〜2重量%を含有するヘミング接着剤を用い、プレスによりヘミング部を加圧し、次いで上記段差のシールに、プラスチゾルシーラーを用いることを特徴とする車体パネルのヘム部接着シール工法を提供するものである。
【0007】
本発明で用いるヘミング接着剤は、平均粒径100〜300μm、好ましくは140〜250μmのガラスビーズ0.3〜2%(重量%、以下同様)、好ましくは0.5〜1.5%を含有する、たとえばエポキシ樹脂(ビスフェノール型エポキシ樹脂、ウレタン変性エポキシ樹脂、アクリルゴム変性エポキシ樹脂、ポリアルキレンエーテル変性エポキシ樹脂など)および潜在性硬化剤から成る一液型エポキシ系接着剤が代表的に示されるが、これ以外にも、同上のガラスビーズを含有するポリウレタン系あるいはアクリル系の接着剤を使用しうる。
【0008】
ガラスビーズの平均粒径が、100μm未満だと、充分なかしめ強度が発現せず、また300μmを越えると、パネル表面に凸凹が生ずることになる。
またガラスビーズの含有量が、0.3%未満では、かしめ強度が発現せず、また2%を越えると、加圧力の低い部分で充分に接着クリアランスを詰めることができないため、シーラーのフクレを誘発することになる。
【0009】
本発明で用いるボデーシーラーとしては、通常のプラスチゾルシーラーや、好ましくはこれを熱硬化性とし熱時強度を付与したものが使用できるが、焼却時にダイオキシンの発生が懸念されるPVCを用いない、いわゆるPVCフリーの、アクリル樹脂粒子と充填剤を可塑剤に分散してなるアクリルゾルに、熱硬化性材料を配合し、150℃熱時の破断強度が50kPa以上のものが好適である(この場合、シーラー中の熱硬化性材料の量は3%以上が適当である)。
【0010】
上記アクリル樹脂粒子としては、たとえばアクリル酸アルキルエステル(アルキルとしてメチル、エチル、ブチル、2−エチルヘキシルなど)もしくはメタクリル酸アルキルエステル(アルキルとしてメチル、エチル、ブチル、ラウリル、ステアリルなど)の単独重合体もしくは共重合体または他のアクリル系モノマー(メタクリル酸、アクリル酸、イタコン酸など)との共重合体であって、通常、一次粒子のおよび/または一次粒子が凝集した二次粒子の粒径が0.1〜100μmのものが好ましい。
なお、アクリル樹脂粒子として、構成モノマーの比率がコア部からシェル部にかけて多段階乃至連続的に変化したグラジェント型構造を有するアクリル樹脂粒子を使用してもよい。かかるグラジェント型アクリル樹脂粒子は、その構成モノマーとして、たとえばエチルメタクリレート、n−ブチルメタクリレート、i−ブチルメタクリレート、sec−ブチルメタクリレート、t−ブチルメタクリレート、エチルヘキシルメタクリレート、エチルアクリレート、n−ブチルアクリレート、sec−ブチルアクリレート、t−ブチルアクリレートの少なくとも1種[Aモノマーと称す]と、メチルメタクリレート、ベンジルメタクリレートの少なくとも1種およびメタクリル酸、アクリル酸、イタコン酸、クロトン酸の少なくとも1種の混合物[混合Bモノマーと称す]を使用するもので、重合に際して、上記Aモノマーと混合Bモノマーとを、その配合割合(比率)を多段階乃至連続的に変化させながら重合を行うことによって製造することができる(この場合、Aモノマーの構成比率がコア部からシェル部にかけて徐々に減少し、混合Bモノマーの構成比率がコア部からシェル部にかけて徐々に増加する)。通常、平均分子量1000〜2000000、一次粒子のおよび/または一次粒子が凝集した二次粒子の粒径0.1〜100μmのものが使用されてよく、市販品として、三菱レイヨン(株)製の「ダイヤナール」が知られている。
【0011】
上記充填剤としては、たとえばクレー、炭酸カルシウム(重質炭酸カルシウム、沈降性炭酸カルシウム、表面処理炭酸カルシウム等)、炭酸マグネシウム、酸化チタン、焼石コウ、硫酸バリウム、亜鉛華、ケイ酸、マイカ粉、アスベスト、タルク、ベントナイト、シリカ、ガラス粉、ベンガラ、カーボンブラック、グラファイト粉、アルミナ、シラスバルーン、セラミックバルーン、ガラスバルーン、プラスチックバルーン、金属粉などが挙げられる。
上記可塑剤としては、たとえばジ(2−エチルヘキシル)フタレート、ブチルベンジルフタレート、ジノニルフタレート、ジイソノニルフタレート、ジイソデシルフタレート、ジウンデシルフタレート、ジヘプチルフタレート、ブチルフタリルブチルグリコレートなどのフタル酸エステル;ジオクチルアジペート、ジデシルアジペート、ジオクチルセバケートなどの脂肪族二塩基酸エステル;ポリオキシエチレングリコールジベンゾエート、ポリオキシプロピレングリコールジベンゾエートなどのポリグリコール安息香酸エステル;トリブチルホスフェート、トリクレジルホスフェートなどのリン酸エステル;アルキル置換ジフェニル、アルキル置換ターフェニル、部分水添アルキルターフェニル、芳香族系プロセスオイル、パインオイルなどの炭化水素類が挙げられる。
【0012】
上記熱硬化性材料としては、たとえば下記の群(i)〜(iv)から選ばれてよい。
(i)ポリオール[たとえばポリオキシアルキレンポリオール(PPG)、ポリエーテルポリオール変性体、ポリテトラメチレンエーテルグリコールを含むポリエーテルポリオール;縮合系ポリエステルポリオール、ラクトン系ポリエステルポリオール、ポリカーボネートジオールを含むポリエステルポリオール;その他ポリブタジエン系ポリオール、ポリオレフィン系ポリオール等]と過剰のポリイソシアネート化合物[たとえばトリメチレンジイソシアネート、テトラメチレンジイソシアネート、ヘキサメチレンジイソシアネート、ペンタメチレンジイソシアネート、2,4,4−または2,2,4−トリメチルヘキサメチレンジイソシアネート、ドデカメチレンジイソシアネート、1,3−シクロペンタンジイソシアネート、1,6−ヘキサンジイソシアネート(HDI)、1,4−シクロヘキサンジイソシアネート、1,3−シクロヘキサンジイソシアネート、4,4’−メチレンビス(シクロヘキシルイソシアネート)、4,4’−メチレンビス(シクロヘキシルイソシアネート)、メチル2,4−シクロヘキサンジイソシアネート、メチル2,6−シクロヘキサンジイソシアネート、1,4−ビス(イソシアネートメチル)シクロヘキサン、1,3−ビス(イソシアネートメチル)シクロヘキサン、m−フェニレンジイソシアネート、p−フェニレンジイソシアネート、4,4’−ジフェニルジイソシアネート、1,5−ナフタレンジイソシアネート、4,4’−ジフェニルメタンジイソシアネート(MDI)、クルードMDI、2,4−または2,6−トリレンジイソシアネート、4,4’−トルイジンジイソシアネート、ジアニジンジイソシアネート、4,4’−ジフェニルエーテルジイソシアネート、1,3−または1,4−キシリレンジイソシアネート、ω,ω’−ジイソシアネート−1,4−ジエチルベンゼン等]を反応させて、末端NCO基含有ウレタンプレポリマーを得、これに適当なブロック剤(たとえばメタノール、エタノール、プロパノール、ブタノール、イソブタノールなどのアルコール;フェノール、クレゾール、キシレノール、p−ニトロフェノール、アルキルフェノールなどのフェノール類;マロン酸メチル、マロン酸ジメチル、マロン酸ジエチル、アセト酢酸エチル、アセト酢酸メチル、アセチルアセトンなどの活性メチレン化合物;アセトアミド、アクリルアミド、アセトアニリドなどの酸アミド類;コハク酸イミド、マレイン酸イミドなどの酸イミド;2−エチルイミダゾール、2−エチル−4−メチルイミダゾールなどのイミダゾール類;2−ピロリドン、ε−カプロラクタムなどのラクタム類;アセトキシム、メチルエチルケトキシム、シクロヘキサノンオキシム、アセトアルドキシムなどのケトンまたはアルデヒドのオキシム類;その他エチレンイミン、重亜硫酸塩等)を反応させて遊離NCOをブロック化して得られるブロック化ウレタンプレポリマー;
【0013】
(ii)上記ポリイソシアネート化合物のNCO基を上記ブロック剤でブロック化して得られるブロック化ポリイソシアネート化合物;
【0014】
(iii)ポリヒドロキシ化合物[たとえばポリアルキレングリコール(ポリエチレングリコール、ポリプロピレングリコール、ポリエチレンプロピレングリコールなど);ヘキシレングリコール、ブチレングリコール、プロピレングリコール、エチレングリコール、ネオペンチルグリコール、トリエチレングリコール、ペンタンジオール、ヘキサントリオール、グリセロールなどの脂肪族多価ヒドロキシ化合物]とエピハロヒドリンを反応させて得られるアルキレンオキシド変性グリシジルエーテル型エポキシ樹脂;および/または
【0015】
(iv)ポリエーテルポリオール(たとえばポリオキシアルキレンポリオール、ポリエーテルポリオール変性体、ポリテトラメチレンエーテルグリコール)と過剰のポリイソシアネート化合物を反応させて末端NCO基含有ウレタンプレポリマーを得、これに1分子中に少なくとも1個の水酸基を有するエポキシ樹脂(たとえばビスフェノールAのジグリシジルエーテル、脂肪族多価アルコールのジグリシジルエーテル)を反応させることにより得られるポリエーテルウレタン変成エポキシ樹脂。
【0016】
上記熱硬化性材料の潜在性硬化剤としては、熱硬化性材料の種類に応じて適宜公知のものが使用されてよく、たとえば下記群(A)〜(C)から選択される。
(A)60℃以上の温度で活性化してNCO基またはエポキシ基と反応しうるもの、たとえばアジピン酸ジヒドラジド、セバチン酸ジヒドラジド、イソフタル酸ジヒドラジド、1,3−ビス(ヒドラジノカルボエチル)−5−イソプロピルヒダントイン、エイコサン二酸ジヒドラジド、ハイドロキノンジグリコール酸ジヒドラジド、レゾルシノールジグリコール酸ジヒドラジド、4,4’−エチリデンビスフェノールジグリコール酸ジヒドラジドなどのジヒドラジド化合物;ジシアンジアミド;4,4’−ジアミノジフェニルスルホン;イミダゾール、2−n−ヘプタンデシルイミダゾールなどのイミダゾール化合物;メラミン;ベンゾグアナミン;N,N’−ジアルキル尿素化合物、;N,N’−ジアルキルチオ尿素化合物;ジアミノジフェニルメタン、ジアミノビフェニル、ジアミノフェニール、フェニレンジアミン、トリレンジアミン、ドデカンジアミン、デカンジアミン、オクタンジアミン、テトラデカンジアミン、ヘキサデカンジアミン、ヒドラジド系ポリアミンなどの融点60℃以上の常温固形のポリアミン;
【0017】
(B)ポリアミン系変性化合物として、脂肪族ポリアミン(a)(たとえばジメチルアミノプロピルアミン、ジエチルアミノプロピルアミン、ジプロピルアミノプロピルアミン、ジブチルアミノプロピルアミン、ジメチルアミノエチルアミン、ジエチルアミノエチルアミン、ジプロピルアミノエチルアミン、ジブチルアミノエチルアミン、トリメチルヘキサメチレンジアミン、ジアミノプロパンなど)とNH2もしくはNH基を少なくとも1個有する環状構造のアミンもしくは芳香族ポリアミン(b)(たとえばメタキシリレンジアミン、1,3−ビス(アミノメチル)シクロヘキサン、イソホロンジアミン、メンタンジアミン、ジアミノシクロヘキサン、フェニレンジアミン、トルイレンジアミン、キシリレンジアミン、ジアミノジフェニルメタン、ジアミノジフェニルスルホン、ピペラジン、N−アミノエチルピペラジン、ベンジルアミン、シクロヘキシルアミンなどのポリアミンおよびモノアミン類)とジイソシアネート化合物(c)(たとえばイソホロンジイソシアネート、メタキシリレンジイソシアネート、1,3−ビス(イソシアネートメチル)シクロヘキサン、2,4−トルイレンジイソシアネート、2,6−トルイレンジイソシアネート、1,5−ナフチレンジイソシアネート、1,4−フェニレンジイソシアネート、ジフェニルメタン−4,4’−ジイソシアネート、2,2’−ジメチルジフェニルメタン−4,4’−ジイソシアネート、ヘキサメチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネートなど)の反応生成物や、上述の脂肪族ポリアミン(a)とアミン(b)とエポキシド化合物(d)(ビスフェノールA、ビスフェノールF、ビスフェノールS、ヘキサヒドロビスフェノールA、カテコール、レゾルシン、トリヒドロキシビフェニル、ベンゾフェノン、ハイドロキノン、テトラメチルビスフェノールAなどの多価フェノールとエピクロルヒドリンを反応して得られるグリシジルエーテル;グリセリン、ネオペンチルグリコール、エチレングリコール、ポリエチレングリコールなどの脂肪族多価アルコールとエピクロルヒドリンを反応して得られるポリグリシジルエーテル;p−オキシ安息香酸、オキシナフトエ酸などのヒドロキシカルボン酸とエピクロルヒドリンを反応して得られるグリシジルエーテルエステル;フタル酸、イソフタル酸、テトラハイドロフタル酸、エンドメチレンテトラヒドロフタル酸、トリメリット酸、重合脂肪酸などのポリカルボン酸から誘導されるポリグリシジルエステル;アミノフェノール、アミノアルキルフェノールから誘導されるグリシジルアミノグリシジルエーテル;アミノ安息香酸から誘導されるグリシジルアミノグリシジルエステル;アニリン、トルイジン、トリブロムアニリン、キシリレンジアミン、4,4’−ジアミノジフェニルメタンから誘導されるグリシジルアミン;エポキシ化ポリオレフィン、グリシジルヒダントイン、グリシジルアルキルヒダントイン、トリグリシジルシアヌレート、ブチルグリシジルエーテル、フェニルグリシジルエーテル、アルキルフェニルグリシジルエーテル、安息香酸グリシジルエステル、スチレンオキサイドなどのモノエポキシド等)の反応生成物;
【0018】
(C)その他のポリアミン系変性化合物として、上述の脂肪族ポリアミン、環状構造のポリアミンもしくは芳香族ポリアミンの群から選ばれる1種または2種以上とエポキシ化合物(たとえば、エポキシ基を分子中に1個乃至2個以上有する、ビスフェノール型エポキシ樹脂、ノボラック型エポキシ樹脂、ポリエステル型エポキシ樹脂、ポリエーテル型エポキシ樹脂など)の付加反応物に、フェノール化合物(たとえばフェノール樹脂、レゾールノボラック樹脂など)および/またはポリカルボン酸化合物(たとえばアジピン酸、セバチン酸、ドデカン酸、アゼライン酸など)を反応させて、アミノ基をマスクして不活性化したもの。
【0019】
上記本発明ではプラスチゾルに熱硬化性材料を配合する具体例について説明したが、本発明に用いるプラスチゾルシーラーとして、架橋性官能基を有するプラスチゾル成分(ポリ塩化ビニル、アクリル樹脂等)を用いて、熱時破断強度を向上させることもできる。
【0020】
なお、かかるプラスチゾルシーラーにあって、必要に応じて吸湿剤(酸化カルシウム、モレキュラーシーブスなど)、揺変性賦与剤(有機ベントナイト、フュームドシリカ、ステアリン酸アルミニウム、金属石けん類、ヒマシ油誘導体など)、安定剤[2,6−ジ−t−ブチル−4−メチルフェノール、2,2−メチレン−ビス(4−メチル−6−t−ブチルフェノール)、ジブチルジチオカルバミン酸ニッケルなど]、硬化促進剤(ジブチル錫ジラウレート、オクチル酸鉛、オクチル酸ビスナスなど)、溶剤(ナフサ、パラフィンなどの高沸点炭化水素系溶剤)等を適宜選択して添加してもよい。
【0021】
【発明の実施の形態】
本発明に係る車体パネルのヘム部接着シール工法は、上述のヘミング接着剤とプラスチゾルシーラーを用い、かつ上述の低圧締条件で加圧することを特徴とする以外は、通常の方法により以下の手順で実施することができる。
i)アウターパネルの周縁ヘム部にヘミング接着剤を、1〜2mmφのひも状に塗布する。
【0022】
ii)これにインナーパネルを重ね合せ、アウターパネルの折返し部をクリンチして、加圧(プレス)する。ここで、後記実施例で示す条件下で測定した接着クリアランスは0.1mm以下、好ましくは0.01〜0.08mmに設定され、また仮止め効果に関して測定したかしめ強度(引き抜き強度)も0.8MPa以上が認められる。
【0023】
iii)次に通常の電着塗装工程(脱脂→化成処理→電着塗装→水洗→焼付硬化)を行ってから、両パネルのヘム重ね合せ部にプラスチゾルシーラーを約1mm厚の量で塗布し、約120℃×15分の条件で焼付硬化を行なって、両パネルの段差をシールする。ここで、シーラーのフクレや発泡等の異常は認められない。
その後、後工程の中塗塗料の焼付硬化および上塗塗料の焼付硬化に付す。
【0024】
【実施例】
次に実施例および比較例を挙げて、本発明をより具体的に説明する。
実施例1〜3および比較例1〜3
(1)ヘミング接着剤(No.1〜3)
下記表1にNo.1と2の組成(重量部)を示す。
No.3は、平均粒径250μmのガラスビーズ5%を含有する市販接着剤:サンスター技研(株)製の「ペンギンセメント#1063G」を使用。
【0025】
【表1】
表1中
注1)油化シエルエポキシ(株)製「エピコート828」
注2)ポッターズバロティーニ(株)製「M−7」(平均粒径250μm)
注3)同(株)製「M−13」(平均粒径50μm)
【0026】
(2)プラスチゾルシーラー(No.A〜C)
下記表2にNo.AとBの組成(重量部)および150℃熱時の破断強度(kPa)(ダンベル物性)を示す。
No.Cは、150℃熱時の破断強度が40kPaである市販PVCゾルシーラー:サンスター技研(株)製の「ペンギンシール#1571」を使用。
【0027】
【表2】
表2中、
注4)三菱レイヨン(株)製「ダイヤナールLP3106」
注5)グリセリンベーストリオール/TDIのオキシムブロック体(分子量5
000)
注6)富士化成(株)製「フジキュアFXE−1030」
【0028】
(3)試験測定
I)上記(1)のヘミング接着剤(No.1〜3)を用いて下記の要領で接着クリアランスとかしめ強度を測定し、結果を下記表3に示す。
接着クリアランス
被着体:SPCC−SD鋼板(25×100×0.8mm)
ラップ代:10mm
加圧時の厚み(鋼板+接着剤+鋼板)
剪断試験のテストピースを用い、加圧力(30MPa)と加圧時の隙間を接着剤無しと接着剤有りにて測定し、その差を接着クリアランス(mm)とした。なお、許容基準値を0.08mm以下とする。
接着クリアランス(mm)=(接着剤有りの厚み)−(接着剤無しの厚み)
【0029】
かしめ強度
アウターパネル:25×70×0.8mm(折返し部7mm)
インナーパネル:25×100×0.8mm
ラップ代:6mm
幅25mmのヘム形状試験片を用い、一定の加圧力(30MPa)を加えた後、引張試験を行いかしめ強度(引き抜き強度)(MPa)とした。なお、許容基準値を0.8MPa以上とする。
【0030】
II)フクレ挙動と塗膜割れの評価(下記結果を表3に示す)
図1に示すように100×300mmの鋼板1に、ヘミング接着剤(No.1〜3)2を塗布し、その上に2枚の15×220mmの鋼板3a,3bを載せて加圧力30MPaにてプレスする(この場合、エアー想定部面積を30×7.5mmに設定)。加熱硬化は170℃×20分間で行なう。
【0031】
次に鋼板1と鋼板3a,3bの合せ部(段差)に上記(2)のシーラー(No.A〜C)を1mm厚で塗布し、110℃×10分(昇温時間25分)、次いで140℃×20分で焼付硬化する。焼付硬化後のシーラーのフクレ挙動(フクレ直径)を測定する(なお、許容基準値を4mm以下とし、○:合格、×:不合格)。
【0032】
さらに、シーラー塗布したテストピースに、自動車用中塗塗料を15〜20μm厚にて塗装し、140℃×20分間で焼付硬化を行ない、塗膜割れの有無を調べる(○は割れ無し、×は割れ有り)。
【0033】
【表3】
【0034】
【発明の効果】
表3の結果より、本発明(実施例1〜3)によれば、低加圧力(30MPa)でプレスした場合にも、接着クリアランスを適度に小さくし、よって、許容範囲のかしめ強度(仮止め効果)を得ることができ、しかも従来の、シーラーのフクレ発生や塗膜割れの問題点も一挙に解決しうることが認められる。
【図面の簡単な説明】
【図1】実施例のフクレ挙動と塗膜割れの評価試験において、鋼板に対しヘミング接着剤の塗布箇所を示す簡略図である。
【符号の説明】
1,3a,3b:鋼板
2:ヘミング接着剤[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for bonding and sealing a hem portion of a body panel, and more particularly, to a hemming process in an automobile body assembly line, in which a peripheral hem portion of a body panel (an inner panel and an outer panel) is bonded (using a hemming adhesive). In order to prevent or reduce the occurrence of blisters during baking hardening of the body sealer due to the effect of the air accumulation of the above-mentioned hemming adhesive when sealing the step of the hem overlapping portion of both panels (using a body sealer). Related to the construction method.
[0002]
[Prior Art and Problems to be Solved by the Invention]
2. Description of the Related Art In a vehicle body assembly line of an automobile, a body panel (an inner panel and an outer panel) of a body part (a so-called lid part) such as a door, a trunk, a hood, and a sunroof cover is generally subjected to a hemming process. In particular,
i) apply a hemming adhesive to a peripheral hem portion of the outer panel,
ii) The inner panel is overlaid on this, the folded portion of the outer panel is clinched, and the hemming portion is pressed (pressed).
iii) Next, through an electrodeposition coating process, a body sealer is applied to the hem overlapping portion of both panels, and baking and curing are performed to seal the steps of both panels.
Thereafter, the baking and curing of the intermediate coating and the baking and curing of the top coating are performed as a post-process, and the operation is completed.
[0003]
By the way, conventionally, spherical particles such as glass beads, ceramics and hard alloys (stainless steel, titanium) are blended into the above-mentioned hemming adhesive as spacers for keeping the layer thickness constant. It penetrates into the panel surface at a stage and contributes to the temporary fixing effect (see Japanese Patent Application Laid-Open No. Hei 8-510698).
[0004]
On the other hand, as a body sealer, for example, a plastisol sealer obtained by dispersing polyvinyl chloride (PVC) or acrylic resin particles in a plasticizer is used.
However, the hemming adhesive is usually cured simultaneously by baking during the electrodeposition coating process, but due to the inclusion of the spherical particles, the adhesive clearance (gap) of the hem overlapping portion is increased, and the There is a strong tendency to generate air pockets at the filling site of the agent (of course, if the pressing of the hemming portion is performed as much as possible, the adhesive clearance can be reduced, but there is a limit in the process).
This air pocket expands during baking and hardening of the body sealer, causing blisters of the sealer, which often leads to a cracking phenomenon of a middle coat and / or a top coat.
[0005]
[Means for Solving the Problems]
Therefore, the present inventors made the above-mentioned adhesive clearance narrower, minimized the possibility of air accumulation and maintained an appropriate temporary fixing effect, and even if a certain amount of air remained, blistering of the body sealer did not occur. After intensive research on techniques that can prevent or reduce this, glass beads with a specific average particle size and amount are used as spherical particles to be mixed with the hemming adhesive, and pressed under a lower pressure condition than before. However, it has been found that a suitable adhesive clearance and a temporary fixing effect can be obtained, and that the addition of a thermosetting material to the body sealer can effectively prevent or reduce the occurrence of blisters if the hot strength is imparted. Thus, the present invention has been completed.
[0006]
That is, the present invention provides a method of bonding a peripheral hem portion to a vehicle body panel (an inner panel and an outer panel) by a hemming process and sealing a step of a hem overlapping portion of both panels.
A hemming adhesive containing 0.3 to 2% by weight of glass beads having an average particle diameter of 100 to 300 μm is used for bonding the peripheral hem portion, and the hemming portion is pressed by a press. Then, a plastisol sealer is applied to the step seal. The present invention provides a method for bonding and sealing a hem portion of a vehicle body panel, characterized by using:
[0007]
The hemming adhesive used in the present invention contains glass beads having an average particle diameter of 100 to 300 μm, preferably 140 to 250 μm, 0.3 to 2% (% by weight, the same applies hereinafter), preferably 0.5 to 1.5%. For example, a one-pack type epoxy adhesive composed of an epoxy resin (bisphenol-type epoxy resin, urethane-modified epoxy resin, acrylic rubber-modified epoxy resin, polyalkylene ether-modified epoxy resin, etc.) and a latent curing agent is typically shown. However, besides this, a polyurethane-based or acrylic-based adhesive containing glass beads as described above may be used.
[0008]
If the average particle size of the glass beads is less than 100 μm, sufficient crimping strength will not be exhibited, and if it exceeds 300 μm, the surface of the panel will be uneven.
If the content of the glass beads is less than 0.3%, the caulking strength is not exhibited, and if it exceeds 2%, the adhesive clearance cannot be sufficiently filled in the portion where the pressing force is low. Will trigger.
[0009]
As the body sealer used in the present invention, an ordinary plastisol sealer or, preferably, a thermosetting and heat-hardened one can be used, but a so-called PVC that does not generate dioxin during incineration is used. It is preferable that a thermosetting material is blended with an acrylic sol obtained by dispersing acrylic resin particles and a filler in a plasticizer, which is PVC-free, and has a breaking strength of 50 kPa or more when heated at 150 ° C. 3% or more is appropriate for the amount of the thermosetting material in the sealer).
[0010]
Examples of the acrylic resin particles include homopolymers of alkyl acrylate (eg, methyl, ethyl, butyl, 2-ethylhexyl as alkyl) or alkyl methacrylate (methyl, ethyl, butyl, lauryl, stearyl, etc. as alkyl) or It is a copolymer or a copolymer with other acrylic monomers (such as methacrylic acid, acrylic acid, and itaconic acid). Usually, the primary particles and / or the secondary particles in which the primary particles are aggregated have a particle size of 0. .1 to 100 μm are preferred.
Note that, as the acrylic resin particles, acrylic resin particles having a gradient structure in which the ratio of the constituent monomers changes continuously or in multiple stages from the core portion to the shell portion may be used. Such gradient type acrylic resin particles include, for example, ethyl methacrylate, n-butyl methacrylate, i-butyl methacrylate, sec-butyl methacrylate, t-butyl methacrylate, ethylhexyl methacrylate, ethyl acrylate, n-butyl acrylate, sec. A mixture of at least one of -butyl acrylate and t-butyl acrylate [referred to as A monomer], at least one of methyl methacrylate and benzyl methacrylate and at least one of methacrylic acid, acrylic acid, itaconic acid and crotonic acid [mixture B In the polymerization, the above-mentioned monomer A and mixed B monomer are polymerized while changing the mixing ratio (ratio) in multiple stages or continuously. Can be prepared I (in this case, the component ratio of A monomer gradually decreases toward the shell portion from the core unit, the component ratio of the mixture B monomer is gradually increased toward the shell portion from the core part). In general, secondary particles having an average molecular weight of 1,000 to 2,000,000 and primary particles and / or secondary particles in which the primary particles are aggregated having a particle size of 0.1 to 100 μm may be used. As a commercial product, “Mitsubishi Rayon Co., Ltd.” "Dianal" is known.
[0011]
Examples of the filler include clay, calcium carbonate (heavy calcium carbonate, precipitated calcium carbonate, surface-treated calcium carbonate, etc.), magnesium carbonate, titanium oxide, calcined stone, barium sulfate, zinc white, silicic acid, mica powder, Examples include asbestos, talc, bentonite, silica, glass powder, red iron oxide, carbon black, graphite powder, alumina, shirasu balloon, ceramic balloon, glass balloon, plastic balloon, and metal powder.
Examples of the plasticizer include phthalic acid esters such as di (2-ethylhexyl) phthalate, butylbenzyl phthalate, dinonyl phthalate, diisononyl phthalate, diisodecyl phthalate, diundecyl phthalate, diheptyl phthalate and butyl phthalyl butyl glycolate; dioctyl; Aliphatic dibasic acid esters such as adipate, didecyl adipate and dioctyl sebacate; polyglycol benzoic acid esters such as polyoxyethylene glycol dibenzoate and polyoxypropylene glycol dibenzoate; phosphoric acid such as tributyl phosphate and tricresyl phosphate Esters: alkyl-substituted diphenyl, alkyl-substituted terphenyl, partially hydrogenated alkyl terphenyl, aromatic process oil, pine oil It includes the hydrocarbons.
[0012]
The thermosetting material may be selected from, for example, the following groups (i) to (iv).
(I) Polyol [for example, polyoxyalkylene polyol (PPG), modified polyether polyol, polyether polyol containing polytetramethylene ether glycol; condensed polyester polyol, lactone polyester polyol, polyester polyol containing polycarbonate diol; other polybutadiene Based polyols, polyolefin based polyols and the like] and excess polyisocyanate compounds [for example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 2,4,4- or 2,2,4-trimethylhexamethylene diisocyanate, Dodecamethylene diisocyanate, 1,3-cyclopentane diisocyanate, 1,6- Xanthic diisocyanate (HDI), 1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate, 4,4′-methylenebis (cyclohexyl isocyanate), 4,4′-methylenebis (cyclohexyl isocyanate),
[0013]
(Ii) a blocked polyisocyanate compound obtained by blocking the NCO group of the polyisocyanate compound with the blocking agent;
[0014]
(Iii) polyhydroxy compounds [for example, polyalkylene glycol (polyethylene glycol, polypropylene glycol, polyethylene propylene glycol, etc.); hexylene glycol, butylene glycol, propylene glycol, ethylene glycol, neopentyl glycol, triethylene glycol, pentanediol, hexanetriol Glycidyl ether type epoxy resin obtained by reacting an aliphatic polyhydric hydroxy compound such as glycerol] with epihalohydrin; and / or
(Iv) reacting a polyether polyol (for example, polyoxyalkylene polyol, modified polyether polyol, polytetramethylene ether glycol) with an excess of a polyisocyanate compound to obtain a urethane prepolymer having a terminal NCO group; A polyether urethane modified epoxy resin obtained by reacting an epoxy resin having at least one hydroxyl group (for example, diglycidyl ether of bisphenol A and diglycidyl ether of an aliphatic polyhydric alcohol).
[0016]
As the latent curing agent for the thermosetting material, a known curing agent may be appropriately used depending on the type of the thermosetting material, and is selected from, for example, the following groups (A) to (C).
(A) Those which can be activated at a temperature of 60 ° C. or higher to react with an NCO group or an epoxy group, for example, adipic dihydrazide, sebacic dihydrazide, isophthalic dihydrazide, 1,3-bis (hydrazinocarboethyl) -5 Dihydrazide compounds such as isopropylhydantoin, eicosane diacid dihydrazide, hydroquinone diglycolic acid dihydrazide, resorcinol diglycolic acid dihydrazide, 4,4'-ethylidenebisphenol diglycolic acid dihydrazide; dicyandiamide; 4,4'-diaminodiphenyl sulfone; imidazole, 2 Imidazole compounds such as -n-heptanedecyl imidazole; melamine; benzoguanamine; N, N'-dialkyl urea compounds; N, N'-dialkyl thiourea compounds; diaminodiphenyl Room temperature solid polyamine having a melting point of 60 ° C. or higher, such as methane, diaminobiphenyl, diaminophenyl, phenylenediamine, tolylenediamine, dodecanediamine, decanediamine, octanediamine, tetradecanediamine, hexadecanediamine, and hydrazide-based polyamine;
[0017]
(B) As the polyamine-based modifying compound, aliphatic polyamine (a) (for example, dimethylaminopropylamine, diethylaminopropylamine, dipropylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, diethylaminoethylamine, dipropylaminoethylamine, dibutyl Aminoethylamine, trimethylhexamethylenediamine, diaminopropane, etc.) and a cyclic structure amine or aromatic polyamine (b) having at least one NH 2 or NH group (for example, meta-xylylenediamine, 1,3-bis (aminomethyl) Cyclohexane, isophoronediamine, menthanediamine, diaminocyclohexane, phenylenediamine, toluylenediamine, xylylenediamine, diaminodiphenyl Methane, diaminodiphenylsulfone, piperazine, polyamines and monoamines such as N-aminoethylpiperazine, benzylamine and cyclohexylamine) and diisocyanate compound (c) (for example, isophorone diisocyanate, meta-xylylene diisocyanate, 1,3-bis (isocyanatomethyl) ) Cyclohexane, 2,4-toluylene diisocyanate, 2,6-toluylene diisocyanate, 1,5-naphthylene diisocyanate, 1,4-phenylene diisocyanate, diphenylmethane-4,4′-diisocyanate, 2,2′-dimethyldiphenylmethane -4,4'-diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, etc.) (A) and amine (b) and epoxide compound (d) (polyphenols such as bisphenol A, bisphenol F, bisphenol S, hexahydrobisphenol A, catechol, resorcin, trihydroxybiphenyl, benzophenone, hydroquinone, and tetramethylbisphenol A) Glycidyl ether obtained by reacting epichlorohydrin with glyceryl ether; polyglycidyl ether obtained by reacting aliphatic polyhydric alcohols such as glycerin, neopentyl glycol, ethylene glycol, and polyethylene glycol with epichlorohydrin; p-oxybenzoic acid, oxynaphthoic acid Glycidyl ether esters obtained by reacting hydroxychlorocarboxylic acid with hydroxycarboxylic acid such as phthalic acid, isophthalic acid, tetrahydrophthalic acid, ene Polyglycidyl esters derived from polycarboxylic acids such as methylenetetrahydrophthalic acid, trimellitic acid, and polymerized fatty acids; glycidylaminoglycidyl ether derived from aminophenol and aminoalkylphenol; glycidylaminoglycidyl ester derived from aminobenzoic acid; Aniline, toluidine, tribromoaniline, xylylenediamine, glycidylamine derived from 4,4′-diaminodiphenylmethane; epoxidized polyolefin, glycidylhydantoin, glycidylalkylhydantoin, triglycidyl cyanurate, butyl glycidyl ether, phenylglycidyl ether, Monoepoxides such as alkylphenyl glycidyl ether, glycidyl benzoate and styrene oxide Reaction products;
[0018]
(C) As another polyamine-based modifying compound, one or more selected from the above-mentioned aliphatic polyamines, cyclic structure polyamines and aromatic polyamines and an epoxy compound (for example, one epoxy group per molecule) A phenol compound (for example, a phenol resin, a resol novolak resin, etc.) and / or a polyphenol compound (e.g., a phenol resin, a resole novolak resin, etc.) having at least two or more bisphenol-type epoxy resins, novolak-type epoxy resins, polyester-type epoxy resins, and polyether-type epoxy resins. Compounds in which a carboxylic acid compound (for example, adipic acid, sebacic acid, dodecanoic acid, azelaic acid, etc.) is reacted and the amino group is masked to be inactivated.
[0019]
In the present invention, a specific example in which a thermosetting material is added to the plastisol has been described. However, as the plastisol sealer used in the present invention, a plastisol component having a crosslinkable functional group (polyvinyl chloride, acrylic resin, or the like) is used. The breaking strength at break can also be improved.
[0020]
In such a plastisol sealer, if necessary, a moisture absorbent (calcium oxide, molecular sieves, etc.), a thixotropic additive (organic bentonite, fumed silica, aluminum stearate, metal soaps, castor oil derivatives, etc.), Stabilizer [2,6-di-t-butyl-4-methylphenol, 2,2-methylene-bis (4-methyl-6-t-butylphenol), nickel dibutyldithiocarbamate, etc.], curing accelerator (dibutyltin) Dilaurate, lead octylate, bisnas octylate and the like), solvents (high-boiling hydrocarbon solvents such as naphtha and paraffin) and the like may be appropriately selected and added.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
The hem portion adhesive seal method of the vehicle body panel according to the present invention uses the above-mentioned hemming adhesive and plastisol sealer, and is characterized in that it is pressurized under the above-mentioned low pressure tightening conditions, and is performed in the following procedure by a usual method. Can be implemented.
i) A hemming adhesive is applied to the outer hem portion of the outer panel in a string shape of 1 to 2 mmφ.
[0022]
ii) The inner panel is superimposed on this, and the folded portion of the outer panel is clinched and pressed (pressed). Here, the adhesive clearance measured under the conditions shown in Examples described later is set to 0.1 mm or less, preferably 0.01 to 0.08 mm, and the caulking strength (pulling strength) measured for the temporary fixing effect is also 0.1 mm. 8 MPa or more is observed.
[0023]
iii) Next, after performing a normal electrodeposition coating process (degreasing → chemical conversion treatment → electrodeposition coating → washing with water → baking hardening), a plastisol sealer is applied in an amount of about 1 mm to the hem overlapping portion of both panels, Baking and hardening are performed at about 120 ° C. for 15 minutes to seal the step between both panels. Here, no abnormality such as blistering or foaming of the sealer is observed.
Thereafter, baking of the intermediate coating and baking of the top coating are performed in the post-process.
[0024]
【Example】
Next, the present invention will be described more specifically with reference to examples and comparative examples.
Examples 1-3 and Comparative Examples 1-3
(1) Hemming adhesive (No. 1-3)
In Table 1 below, No. The compositions (parts by weight) of 1 and 2 are shown.
No. 3 is a commercially available adhesive containing 5% of glass beads having an average particle size of 250 μm: “Penguin Cement # 1063G” manufactured by Sunstar Giken Co., Ltd.
[0025]
[Table 1]
Note 1 in Table 1) "Epicoat 828" manufactured by Yuka Ciel Epoxy Co., Ltd.
Note 2) "M-7" manufactured by Potters Barotini Co., Ltd. (average particle size 250 μm)
Note 3) “M-13” (average particle size 50 μm) manufactured by the same company
[0026]
(2) Plastisol sealer (No. AC)
In Table 2 below, No. The compositions (parts by weight) of A and B and the breaking strength (kPa) at 150 ° C. heat (dumbbell physical properties) are shown.
No. C is a commercially available PVC sol sealer having a breaking strength of 40 kPa at 150 ° C. heat: “Penguin Seal # 1571” manufactured by Sunstar Giken Co., Ltd.
[0027]
[Table 2]
In Table 2,
Note 4) "Dianal LP3106" manufactured by Mitsubishi Rayon Co., Ltd.
Note 5) Oxime block of glycerin-based triol / TDI (molecular weight 5
000)
Note 6) "Fujicure FXE-1030" manufactured by Fuji Kasei Co., Ltd.
[0028]
(3) Test measurement I) Using the hemming adhesive (Nos. 1 to 3) of the above (1), adhesive clearance and swaging strength were measured in the following manner, and the results are shown in Table 3 below.
Adhesion clearance Substrate: SPCC-SD steel plate (25 x 100 x 0.8 mm)
Wrap fee: 10mm
Thickness when pressurized (steel plate + adhesive + steel plate)
Using a test piece for a shear test, the gap between the pressing force (30 MPa) and the pressure was measured with and without the adhesive, and the difference was defined as the adhesion clearance (mm). The allowable reference value is 0.08 mm or less.
Adhesion clearance (mm) = (thickness with adhesive)-(thickness without adhesive)
[0029]
Caulking strength Outer panel: 25 x 70 x 0.8 mm (turned part 7 mm)
Inner panel: 25 × 100 × 0.8mm
Wrap fee: 6mm
After applying a constant pressing force (30 MPa) using a hem-shaped test piece having a width of 25 mm, a tensile test was performed to obtain a crimping strength (pulling strength) (MPa). The allowable reference value is set to 0.8 MPa or more.
[0030]
II) Evaluation of blistering behavior and coating film cracking (the following results are shown in Table 3)
As shown in FIG. 1, a hemming adhesive (No. 1 to 3) 2 is applied to a 100 × 300 mm steel plate 1, and two 15 × 220
[0031]
Next, the sealer (No. A to C) of the above (2) is applied with a thickness of 1 mm to the joint (step) of the steel sheet 1 and the
[0032]
Further, a test piece coated with a sealer is coated with an intermediate coating for automobiles at a thickness of 15 to 20 μm, and is baked and cured at 140 ° C. for 20 minutes to check for cracks in the coating film (○: no cracking, x: cracking) Yes).
[0033]
[Table 3]
[0034]
【The invention's effect】
According to the results of Table 3, according to the present invention (Examples 1 to 3), even when pressed at a low pressing force (30 MPa), the adhesive clearance was appropriately reduced, and therefore, the allowable caulking strength (temporary fixing) was obtained. Effect) can be obtained, and the conventional problems of blistering of the sealer and cracking of the coating film can be solved at once.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a simplified diagram showing a location where a hemming adhesive is applied to a steel sheet in an evaluation test of blistering behavior and coating film cracking of an example.
[Explanation of symbols]
1, 3a, 3b: steel plate 2: hemming adhesive
Claims (5)
上記周縁ヘム部の接着に、平均粒径100〜300μmのガラスビーズ0.3〜2重量%を含有するヘミング接着剤を用い、ヘミング部を加圧し、次いで上記段差のシールに、プラスチゾルシーラーを用いることを特徴とする車体パネルのヘム部接着シール工法。In the method of bonding the peripheral hem portion to the body panel (inner panel and outer panel) by the hemming process, and sealing the step at the hem overlapping portion of both panels,
A hemming adhesive containing 0.3 to 2% by weight of glass beads having an average particle diameter of 100 to 300 μm is used to bond the peripheral hem portion, and the hemming portion is pressed. Then, a plastisol sealer is used to seal the step. A method of bonding and sealing a hem portion of a vehicle body panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002187537A JP2004026070A (en) | 2002-06-27 | 2002-06-27 | Method of adhering and sealing hem portion of vehicle body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002187537A JP2004026070A (en) | 2002-06-27 | 2002-06-27 | Method of adhering and sealing hem portion of vehicle body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2004026070A true JP2004026070A (en) | 2004-01-29 |
Family
ID=31182547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002187537A Pending JP2004026070A (en) | 2002-06-27 | 2002-06-27 | Method of adhering and sealing hem portion of vehicle body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004026070A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005325347A (en) * | 2004-04-15 | 2005-11-24 | L & L Products Inc | Activatable material and method for forming and using activatable material |
| US7530624B2 (en) | 2006-06-09 | 2009-05-12 | Toyota Jidosha Kabushiki Kaisha | Vehicle door structure |
| JP2010059355A (en) * | 2008-09-05 | 2010-03-18 | Aisin Chem Co Ltd | Ultraviolet ray precuring sealant |
| JP2011508792A (en) * | 2006-12-21 | 2011-03-17 | シーカ・テクノロジー・アーゲー | Hem flange adhesive bond |
| JP2013017940A (en) * | 2011-07-09 | 2013-01-31 | Kansai Paint Co Ltd | Method of forming multi-layer coating film |
| JP2017537180A (en) * | 2014-11-11 | 2017-12-14 | ダウ グローバル テクノロジーズ エルエルシー | Adhesive composition having glass spheres |
-
2002
- 2002-06-27 JP JP2002187537A patent/JP2004026070A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005325347A (en) * | 2004-04-15 | 2005-11-24 | L & L Products Inc | Activatable material and method for forming and using activatable material |
| US7530624B2 (en) | 2006-06-09 | 2009-05-12 | Toyota Jidosha Kabushiki Kaisha | Vehicle door structure |
| DE102007026523B4 (en) * | 2006-06-09 | 2016-03-03 | Toyota Jidosha Kabushiki Kaisha | Motor vehicle door assembly |
| JP2011508792A (en) * | 2006-12-21 | 2011-03-17 | シーカ・テクノロジー・アーゲー | Hem flange adhesive bond |
| US9034135B2 (en) | 2006-12-21 | 2015-05-19 | Sika Technology Ag | Hem flange joint |
| JP2010059355A (en) * | 2008-09-05 | 2010-03-18 | Aisin Chem Co Ltd | Ultraviolet ray precuring sealant |
| JP2013017940A (en) * | 2011-07-09 | 2013-01-31 | Kansai Paint Co Ltd | Method of forming multi-layer coating film |
| JP2017537180A (en) * | 2014-11-11 | 2017-12-14 | ダウ グローバル テクノロジーズ エルエルシー | Adhesive composition having glass spheres |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101467602B1 (en) | Heat Resistant Epoxy Resin | |
| KR102626998B1 (en) | High modulus, toughened, one-component epoxy structural adhesive with high aspect ratio fillers. | |
| JP6632401B2 (en) | Structural adhesive composition | |
| JPWO2001088009A1 (en) | thermosetting composition | |
| EP1283228B1 (en) | Thermosetting composition | |
| ZA200104980B (en) | Shock-risistant epoxide resin compositions. | |
| EP3737725B1 (en) | Epoxy resin adhesive compositions | |
| CN101772532A (en) | Toughened adhesive material | |
| EP1283229B1 (en) | Plastisol composition | |
| US10815405B2 (en) | One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same | |
| WO2015160468A1 (en) | Epoxy resin compositions for pre-gel ovens | |
| JPWO2001088011A1 (en) | Plastisol composition | |
| JP2004026070A (en) | Method of adhering and sealing hem portion of vehicle body | |
| JPWO2001088034A1 (en) | thermosetting composition | |
| JP3727591B2 (en) | Thermosetting composition | |
| JP5042155B2 (en) | Two-component curable composition for automobile body sealer | |
| JP4203053B2 (en) | Thermosetting composition | |
| JP5705071B2 (en) | Hemming sealant composition | |
| WO2001088008A1 (en) | Thermosetting composition | |
| JP3776353B2 (en) | Hybrid thermosetting material composition | |
| JP2009161711A (en) | Plastisol composition for sealing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Effective date: 20050520 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20050706 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20050824 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20050824 |
|
| A977 | Report on retrieval |
Effective date: 20080104 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20080108 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080304 |
|
| A02 | Decision of refusal |
Effective date: 20080715 Free format text: JAPANESE INTERMEDIATE CODE: A02 |