JP2004018711A - Method for adjusting pot life of epoxy resin composition - Google Patents
Method for adjusting pot life of epoxy resin composition Download PDFInfo
- Publication number
- JP2004018711A JP2004018711A JP2002176979A JP2002176979A JP2004018711A JP 2004018711 A JP2004018711 A JP 2004018711A JP 2002176979 A JP2002176979 A JP 2002176979A JP 2002176979 A JP2002176979 A JP 2002176979A JP 2004018711 A JP2004018711 A JP 2004018711A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- compound
- polyamino
- polyamino compound
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
【課題】エポキシ樹脂組成物の常温硬化におけるポットライフの調節方法を提供する。
【解決手段】安全衛生上優位であり、保存安定性が良好である特定構造のポリアミノ化合物とスチレンとの付加反応により得られる特定構造のポリアミノ化合物を含むポリアミノ組成物を必須成分とするエポキシ樹脂硬化剤を用いる
【選択図】 無An object of the present invention is to provide a method for adjusting a pot life in room temperature curing of an epoxy resin composition.
An epoxy resin cured with a polyamino composition containing a polyamino compound having a specific structure obtained by an addition reaction of a polyamino compound having a specific structure and styrene, which is superior in safety and health and has good storage stability, as an essential component [Selection diagram]
Description
【0001】
【発明の属する技術分野】
本発明は特定のポリアミノ組成物をエポキシ樹脂硬化剤の必須成分として、他の成分と混合して用いることを特徴とするエポキシ樹脂組成物のポットライフ調節方法に関する。
【0002】
【従来の技術】
各種ポリアミノ化合物がエポキシ樹脂硬化剤およびその原料として用いられていることは広く知られている。これらのエポキシ樹脂硬化剤を利用した常温硬化用エポキシ樹脂組成物は、特に船舶・橋梁・陸海上鉄構築物用防食塗料などの塗料分野、コンクリート構造物のライニング・補強・補修、建築物の床材、上下水道設備のライニング、舗装材、接着材などの土木・建築分野に広く利用されている。中でも後述する(1)式で示されるポリアミノ化合物およびこれを原料とするエポキシ樹脂硬化剤は他のポリアミノ化合物およびこれを原料とするエポキシ樹脂硬化剤と比較して、エポキシ樹脂組成物に良好な硬化性を与える、光沢、平滑性に優れたエポキシ樹脂硬化塗膜を与える、耐水性、耐薬品性に優れたエポキシ樹脂硬化物を与える等の特長を有している。
【0003】
しかし、その反面(1)式で示されるポリアミノ化合物およびこれらを原料とするエポキシ樹脂硬化剤はエポキシ樹脂との反応性が高いために、そのエポキシ樹脂組成物は常温硬化ではポットライフが短く、作業性が悪いという欠点を有している。
【0004】
従来からポリアミノ化合物とアクリロニトリルとのマイケル付加反応により得られるシノエチル化ポリアミノ化合物をエポキシ樹脂硬化剤として使用した場合にエポキシ樹脂組成物に長いポットライフを与えることが知られており(例えば、垣内弘編著、新エポキシ樹脂、186頁、昭晃堂、(1985))、(1)式で示されるポリアミノ化合物およびこれらを原料とするエポキシ樹脂硬化剤に混合し、ポットライフを調節することできる。しかし、アクリロニトリルは特定化学物質および劇物に指定されているため、近年では安全衛生上から該ポリアミノ化合物をエポキシ樹脂硬化剤に混合して使用することは少なくなってきている。
【0005】
また、特開平11−80322号はポリアミノ化合物と不飽和カルボン酸エステル化合物とのマイケル付加反応による得られる、低粘度で、有害性が低い化合物に関するものであり、該化合物をエポキシ樹脂硬化剤として使用したエポキシ樹脂組成物の常温硬化におけるポットライフ延長方法が開示されているが、該化合物中にアミノ基とエステル基が存在するために、保存中にエステルアミド交換反応が進行し、アミドの生成により粘度上昇が生じ保存安定性が悪く、また、エステル基が減少するためにエポキシ樹脂硬化剤として使用した場合にエポキシ樹脂組成物のポットライフ調節効果は小さくなる。
【0006】
【発明が解決しようとする課題】
本発明の目的は、エポキシ樹脂硬化剤の必須成分として、安全衛生上優位であり、保存安定性が良好である特定構造のポリアミノ化合物を含むポリアミノ組成物を他のポリアミノ化合物成分と混合して使用し、エポキシ樹脂組成物の常温硬化におけるポットライフの調節方法を提供することにある。
【0007】
【発明が解決するための手段】
本発明者らは、鋭意検討した結果、安全衛生上優位であり、保存安定性が良好である(1)式で示されるポリアミノ化合物とスチレンとの付加反応により得られ、(2)式で示される互いに側鎖基の構成が異なる各付加物からなるポリアミノ化合物を必須成分とするポリアミノ組成物を他のポリアミノ化合物成分と混合して使用することでエポキシ樹脂組成物常温硬化におけるポットライフを調節できることを見出し、本発明に至った。
【0008】
即ち本発明は、(1)式で示されるポリアミノ化合物Aとスチレンとの付加反応により得られ、(2)式で示される互いに側鎖基の構成が異なる各付加物から選ばれる少なくとも1つであるポリアミノ化合物Bを必須成分とするポリアミノ組成物を含むエポキシ樹脂硬化剤を用いることを特徴とするエポキシ樹脂組成物のポットライフ調節方法を提供する。
【化3】
【化4】
【0009】
【発明の実施の形態】
本発明で使用される(1)式で示されるポリアミノ化合物Aとしては、オルソキシレンジアミン、メタキシリレンジアミン、パラキシリレンジアミン、1,2−ビス(アミノメチル)シクロヘキサン、1,3−ビス(アミノメチル)シクロヘキサン、1,4−ビス(アミノメチル)シクロヘキサンなどがあげられる。この中で特に好ましいのは、メタキシリレンジアミン、1,3−ビス(アミノメチル)シクロヘキサンである。
【0010】
本発明で使用されるアミノ化合物Bとは、前記アミノ化合物Aとスチレンとの付加反応により得られ、(2)式で示される互いに側鎖基の構成が異なる各付加物から選ばれる少なくとも1つの化合物からなる。ここで、互いに側鎖基の構成が異なる各付加物とは、(2)式において、R1、R2およびR3のいずれもが水素である付加物、いずれか2つが水素であり、残り1つがフェネチル基である付加物、いずれか2つがフェネチル基であり、残り1つが水素である付加物、およびいずれもがフェネチル基である付加物である。本発明では、これらの付加物は単独あるいは混合物として用いられる。
【0011】
本発明において、アミノ化合物Bを製造する際には、強塩基性を呈する触媒を使用することが好ましい。例えば、アルカリ金属、アルカリ金属アミド、アルキル化アルカリ金属などがあるが、好ましくはアルカリ金属アミド(一般式MNRR’:Mはアルカリ金属、Nは窒素、RおよびR’は各々独立して水素またはアルキル基である)であり、特にリチウムアミド(LiNH2)が好ましい。
【0012】
本発明において、ポリアミノ組成物とは、前記ポリアミド化合物Bを必須成分として含むものであり、ポリアミド化合物B以外のポリアミノ化合物成分は、脂肪族ポリアミノ化合物、脂環族ポリアミノ化合物、芳香族ポリアミノ化合物、およびこれらを原料とする変性ポリアミノ化合物から選ばれる。これらのポリアミノ化合物の中で(1)式で示されるポリアミノ化合物のAがフェニレン基である脂肪族ポリアミノ化合物の変性ポリアミノ化合物、あるいは(1)式で示されるポリアミノ化合物のAがシクロヘキシレン基である脂環族ポリアミノ化合物の変性ポリアミノ化合物が好ましい。
【0013】
前記変性ポリアミノ化合物は、原料であるポリアミノ化合物を、フェノール系化合物とアルデヒド化合物とのマンニッヒ反応による変性、エポキシ化合物との反応による変性、カルボキシル基を有する化合物との反応による変性、およびアクリル系化合物とのマイケル反応による変性から選ばれる少なくとも1つの方法で変性して得られる。
【0014】
前記ポリアミノ化合物Bと他のポリアミノ化合物成分との混合割合は任意に選ばれ、特に限定されるものではないが、ポリアミノ化合物Bの混合割合が多いほどエポキシ樹脂組成物のポットライフは長くなる。従って、この混合割合を適切に選定することにより、目的に適したポットライフを有するエポキシ樹脂組成物が得られる。
【0015】
【実施例】
以下に、本発明を実施例により具体的に説明するが、本発明はこれらの実施例により限定されるものではない。
【0016】
合成例1
撹拌装置、温度計、窒素導入管、滴下漏斗、冷却管を備えた2リットルフラスコに、メタキシリレンジアミン(三菱ガス化学(株)製、以下MXDAと記す)817.2g(6.0モル)とリチウムアミド(Merk社製試薬)2.9g(0.13モル)を仕込み、窒素気流下、撹拌しながら80℃に昇温した。80℃に保ちながら、スチレン(和光純薬(株)製、試薬特級)625.2g(6.0モル)を2時間かけて滴下した。滴下終了後、80℃で1時間保った。
その後室温に冷却し、仕込んだリチウムアミドの10倍モル量の水23.4g(1.3モル)を加え撹拌した。フラスコ内液中の沈殿物をろ過で分離後、減圧蒸留で水を留去し、ポリアミノ組成物A1380.7gを得た。
【0017】
合成例2
実施例1と同様のフラスコにMXDA681.0g(5.0モル)とリチウムアミド3.7g(0.16モル)を仕込み、窒素気流下、撹拌しながら80℃に昇温した。80℃に保ちながらスチレン781.5g(7.5モル)を2.5時間かけて滴下した。滴下終了後、80℃で1時間保った。その後室温に冷却し、仕込んだリチウムアミドの10倍モル量の水28.8g(1.6モル)を加え、合成例1と同様の操作を行い、ポリアミノ組成物B1395.6gを得た。
【0018】
合成例3
合成例1と同様のフラスコに、1,3−ビス(アミノメチル)シクロヘキサン(三菱ガス化学(株)製、以下1,3−BACと記す)853.2g(6.0モル)とリチウムアミド3.0g(0.13モル)を仕込み、窒素気流下、撹拌しながら80℃に昇温した。80℃に保ちながら、スチレン625.2g(6.0モル)を2時間かけて滴下した。滴下終了後、80℃で1時間保った。その後室温に冷却し、仕込んだリチウムアミドの10倍モル量の水23.4g(1.3モル)を加え、合成例1と同様の操作を行い、ポリアミノ組成物C1409.3gを得た。
【0019】
合成例4
合成例1と同様のフラスコに1,3−BAC711.0g(5.0モル)とリチウムアミド3.7g(0.16モル)を仕込み、窒素気流下、撹拌しながら80℃に昇温した。80℃に保ちながらスチレン781.5g(7.5モル)を2.5時間かけて滴下した。滴下終了後、80℃で1時間保った。その後室温に冷却し、仕込んだリチウムアミドの10倍モル量の水28.8g(1.6モル)を加え、合成例1と同様の操作を行い、ポリアミノ組成物D1424.4gを得た。
【0020】
合成例5
実施例1と同様のフラスコに、MXDA612.9g(4.5モル)とフェノール423.45g(4.5モル)を仕込み、窒素気流下、撹拌しながら80℃に昇温した。80℃でホルマリン(8%メタノール含有37%水溶液)243.3g(3.0モル)を1.5時間かけて滴下した。滴下終了後、100℃に昇温し1.5時間反応を行った。その後水を留去しながら2時間かけて150℃まで昇温し、同温度で1時間反応を行い、マンニッヒ反応による変性ポリアミノ化合物E1072.0gを得た。
【0021】
合成例6
合成例5のMXDAを1,3−BAC639.9g(4.5モル)に変え、同様の方法で合成を行い、変性ポリアミノ化合物F1095.6gを得た。
【0022】
合成例7〜9
合成例1で示したポリアミノ組成物Aと合成例5で示した変性ポリアミノ化合物Eを表1に示す割合で混合し、エポキシ樹脂硬化剤G〜Iを得た。
【0023】
合成例10〜12
合成例2で示したポリアミノ組成物Bと合成例5で示した変性ポリアミノ化合物Eを表1に示す割合で混合し、エポキシ樹脂硬化剤J〜Lを得た。
【0024】
合成例13〜15
合成例3で示したポリアミノ組成物Cと合成例6で示した変性ポリアミノ化合物Fを表2に示す割合で混合し、エポキシ樹脂硬化剤M〜Oを得た。
【0025】
合成例16〜18
合成例4で示したポリアミノ組成物Dと合成例6で示した変性ポリアミノ化合物Eを表2に示す割合で混合し、エポキシ樹脂硬化剤P〜Rを得た。
【0026】
実施例1〜4
合成例1〜4で得られたポリアミノ組成物A〜Dの保存安定性を評価した。評価結果を表3に示した。
【0027】
実施例5〜10
合成例7〜9で示したエポキシ樹脂硬化剤G〜Iおよび合成例10〜12で示したエポキシ樹脂硬化剤J〜LをビスフェノールA型液状エポキシ樹脂(商品名:エピコート828、ジャパンエポキシレジン(株)製)と表2に示す割合で配合しエポキシ樹脂組成物を調製した。得られたエポキシ樹脂組成物のポットライフを測定した。測定結果を表4に示した。
【0028】
実施例11〜16
合成例13〜15で示したエポキシ樹脂硬化剤M〜Oおよび合成例16〜18で示したエポキシ樹脂硬化剤P〜RをビスフェノールA型液状エポキシ樹脂(商品名:エピコート828、ジャパンエポキシレジン(株)製)と表2に示す割合で配合しエポキシ樹脂組成物を調製した。得られたエポキシ樹脂組成物のポットライフを測定した。測定結果を表5に示した。
【0029】
【表1】
【0030】
【表2】
【0031】
【表3】
【0032】
【表4】
【0033】
【表5】
【0034】
ポリアミノ組成物およびエポキシ樹脂組成物の評価は以下の方法で行った。
〈保存安定性〉
ポリアミノ組成物200gを225mlのガラス瓶に入れて密封し、23℃、50%RHの条件下に1ヶ月間保存後、外観変化および粘度変化を観察した。
〈ポットライフ〉
エポキシ樹脂組成物100gを300mlのポリプロピレン製カップに入れ、23℃、50%RHの条件下に放置し、最高発熱温度への到達時間を測定した。
【0035】
【発明の効果】
以上の実施例から明らかなように、安全衛生上優位であり、保存安定性が良好である(1)式で示されるポリアミノ化合物とスチレンとの付加反応により得られ、(2)式で示される互いに側鎖基の異なる各付加物から構成されるポリアミノ化合物を必須成分として、他のポリアミノ化合物成分と混合して使用することでエポキシ樹脂組成物のポットライフを調節することができる。これにより、目的に応じて適切なポットライフを有するエポキシ樹脂組成物を得ることができる。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for adjusting the pot life of an epoxy resin composition, wherein a specific polyamino composition is used as an essential component of an epoxy resin curing agent and mixed with other components.
[0002]
[Prior art]
It is widely known that various polyamino compounds are used as epoxy resin curing agents and their raw materials. Room temperature curing epoxy resin compositions using these epoxy resin curing agents are particularly useful in the field of paints such as anticorrosive paints for ships, bridges, and onshore and shore iron structures, lining, reinforcing and repairing concrete structures, and flooring materials for buildings. It is widely used in civil engineering and construction fields such as lining of water and sewage equipment, paving materials, and adhesives. Above all, the polyamino compound represented by the formula (1) described below and the epoxy resin curing agent using the same as a raw material are better cured for the epoxy resin composition than other polyamino compounds and the epoxy resin curing agent using the same as the raw material. It has features such as giving an epoxy resin cured coating film having excellent gloss and smoothness, and giving a cured epoxy resin material having excellent water resistance and chemical resistance.
[0003]
However, on the other hand, the polyamino compound represented by the formula (1) and the epoxy resin curing agent using these as a raw material have high reactivity with the epoxy resin. It has the drawback of poor properties.
[0004]
It has been known that when a sinoethylated polyamino compound obtained by a Michael addition reaction between a polyamino compound and acrylonitrile is used as an epoxy resin curing agent, an epoxy resin composition has a long pot life (for example, edited by Hiroshi Kakiuchi) New epoxy resin, page 186, Shokodo, (1985)), a polyamino compound represented by the formula (1) and an epoxy resin curing agent using these as a raw material to control the pot life. However, since acrylonitrile is specified as a specific chemical substance and a deleterious substance, the use of the polyamino compound mixed with an epoxy resin curing agent has been reduced in recent years from the viewpoint of safety and health.
[0005]
JP-A-11-80322 relates to a low-viscosity, low-harmful compound obtained by the Michael addition reaction of a polyamino compound and an unsaturated carboxylic acid ester compound, and the compound is used as an epoxy resin curing agent. A method for extending the pot life in the room temperature curing of the epoxy resin composition has been disclosed.However, due to the presence of an amino group and an ester group in the compound, an ester amide exchange reaction proceeds during storage, and amide formation is caused. When the epoxy resin composition is used as a curing agent for an epoxy resin, the effect of adjusting the pot life of the epoxy resin composition is reduced when the viscosity is increased and the storage stability is poor.
[0006]
[Problems to be solved by the invention]
An object of the present invention is to use a polyamino composition containing a polyamino compound having a specific structure which is superior in safety and hygiene and has good storage stability as an essential component of an epoxy resin curing agent by mixing with another polyamino compound component. It is another object of the present invention to provide a method for adjusting a pot life in curing an epoxy resin composition at room temperature.
[0007]
Means for Solving the Invention
The present inventors have conducted intensive studies and as a result, obtained by the addition reaction of a polyamino compound represented by formula (1) with styrene, which is superior in safety and health and has good storage stability, and which is represented by formula (2) The pot life in the room temperature curing of the epoxy resin composition can be adjusted by using a polyamino compound containing a polyamino compound composed of each adduct having a different side chain group as an essential component in combination with other polyamino compound components. And found the present invention.
[0008]
That is, the present invention provides at least one selected from the adducts obtained by the addition reaction of the polyamino compound A represented by the formula (1) with styrene and having different side chain groups represented by the formula (2). Provided is a method for adjusting the pot life of an epoxy resin composition, characterized by using an epoxy resin curing agent containing a polyamino composition containing a certain polyamino compound B as an essential component.
Embedded image
Embedded image
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Examples of the polyamino compound A represented by the formula (1) used in the present invention include orthoxylylenediamine, metaxylylenediamine, paraxylylenediamine, 1,2-bis (aminomethyl) cyclohexane, and 1,3-bis ( Aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane and the like. Of these, meta-xylylenediamine and 1,3-bis (aminomethyl) cyclohexane are particularly preferred.
[0010]
The amino compound B used in the present invention is obtained by an addition reaction between the amino compound A and styrene, and is at least one selected from adducts having different side chain groups represented by the formula (2). Consists of a compound. Here, each of the adducts having a different side chain group structure is an adduct in which all of R1, R2 and R3 are hydrogen in formula (2), any two of which are hydrogen, and the other one is phenethyl Adducts which are groups, any two of which are phenethyl groups, and the other one is hydrogen, and all of which are phenethyl groups. In the present invention, these adducts are used alone or as a mixture.
[0011]
In the present invention, when producing the amino compound B, it is preferable to use a catalyst exhibiting strong basicity. For example, there are alkali metals, alkali metal amides, alkylated alkali metals, etc., and preferably alkali metal amides (general formula NMRR ′: M is an alkali metal, N is nitrogen, R and R ′ are each independently hydrogen or alkyl) And lithium amide (LiNH 2 ) is particularly preferred.
[0012]
In the present invention, the polyamino composition includes the polyamide compound B as an essential component, and the polyamino compound component other than the polyamide compound B includes an aliphatic polyamino compound, an alicyclic polyamino compound, an aromatic polyamino compound, and These are selected from modified polyamino compounds using these as raw materials. Among these polyamino compounds, a modified polyamino compound of an aliphatic polyamino compound in which A of the polyamino compound represented by the formula (1) is a phenylene group, or A of a polyamino compound represented by the formula (1) is a cyclohexylene group Modified polyamino compounds of alicyclic polyamino compounds are preferred.
[0013]
The modified polyamino compound is a raw material polyamino compound, modified by a Mannich reaction between a phenolic compound and an aldehyde compound, modified by a reaction with an epoxy compound, modified by a reaction with a compound having a carboxyl group, and an acrylic compound. And denatured by at least one method selected from the Michael reaction.
[0014]
The mixing ratio between the polyamino compound B and the other polyamino compound components is arbitrarily selected and is not particularly limited. However, the pot life of the epoxy resin composition becomes longer as the mixing ratio of the polyamino compound B increases. Therefore, by properly selecting the mixing ratio, an epoxy resin composition having a pot life suitable for the purpose can be obtained.
[0015]
【Example】
Hereinafter, the present invention will be described specifically with reference to Examples, but the present invention is not limited to these Examples.
[0016]
Synthesis Example 1
817.2 g (6.0 mol) of meta-xylylenediamine (manufactured by Mitsubishi Gas Chemical Co., Ltd .; hereinafter, referred to as MXDA) in a 2 liter flask equipped with a stirrer, thermometer, nitrogen inlet tube, dropping funnel, and cooling tube. And 2.9 g (0.13 mol) of lithium amide (a reagent manufactured by Merk) were charged, and the temperature was raised to 80 ° C. while stirring under a nitrogen stream. While maintaining the temperature at 80 ° C., 625.2 g (6.0 mol) of styrene (special grade reagent, manufactured by Wako Pure Chemical Industries, Ltd.) was added dropwise over 2 hours. After completion of the dropwise addition, the temperature was maintained at 80 ° C. for 1 hour.
Thereafter, the mixture was cooled to room temperature, 23.4 g (1.3 mol) of water having a molar amount 10 times that of the charged lithium amide was added, and the mixture was stirred. After the precipitate in the flask was separated by filtration, water was distilled off under reduced pressure to obtain 1380.7 g of a polyamino composition A.
[0017]
Synthesis Example 2
The same flask as in Example 1 was charged with 681.0 g (5.0 mol) of MXDA and 3.7 g (0.16 mol) of lithium amide, and heated to 80 ° C. while stirring under a nitrogen stream. While maintaining the temperature at 80 ° C., 781.5 g (7.5 mol) of styrene was added dropwise over 2.5 hours. After completion of the dropwise addition, the temperature was maintained at 80 ° C. for 1 hour. Thereafter, the mixture was cooled to room temperature, and 28.8 g (1.6 mol) of 10 times the molar amount of the charged lithium amide was added, and the same operation as in Synthesis Example 1 was performed to obtain 1395.6 g of a polyamino composition B.
[0018]
Synthesis Example 3
In a flask similar to Synthesis Example 1, 853.2 g (6.0 mol) of 1,3-bis (aminomethyl) cyclohexane (manufactured by Mitsubishi Gas Chemical Company, Ltd .; hereinafter, referred to as 1,3-BAC) and lithium amide 3 0.0 g (0.13 mol) was charged, and the temperature was raised to 80 ° C. while stirring under a nitrogen stream. While maintaining the temperature at 80 ° C., 625.2 g (6.0 mol) of styrene was added dropwise over 2 hours. After completion of the dropwise addition, the temperature was maintained at 80 ° C. for 1 hour. Thereafter, the mixture was cooled to room temperature, and 23.4 g (1.3 mol) of a 10-fold molar amount of the charged lithium amide was added, and the same operation as in Synthesis Example 1 was performed to obtain 1409.3 g of a polyamino composition C.
[0019]
Synthesis Example 4
The same flask as in Synthesis Example 1 was charged with 711.0 g (5.0 mol) of 1,3-BAC and 3.7 g (0.16 mol) of lithium amide, and heated to 80 ° C. while stirring under a nitrogen stream. While maintaining the temperature at 80 ° C., 781.5 g (7.5 mol) of styrene was added dropwise over 2.5 hours. After completion of the dropwise addition, the temperature was maintained at 80 ° C. for 1 hour. Thereafter, the mixture was cooled to room temperature, and 28.8 g (1.6 mol) of 10 times the molar amount of the charged lithium amide was added, and the same operation as in Synthesis Example 1 was performed to obtain 1424.4 g of a polyamino composition D.
[0020]
Synthesis Example 5
612.9 g (4.5 mol) of MXDA and 423.45 g (4.5 mol) of phenol were charged into the same flask as in Example 1, and the temperature was raised to 80 ° C. while stirring under a nitrogen stream. At 80 ° C., 243.3 g (3.0 mol) of formalin (37% aqueous solution containing 8% methanol) was added dropwise over 1.5 hours. After the completion of the dropwise addition, the temperature was raised to 100 ° C., and the reaction was performed for 1.5 hours. Thereafter, the temperature was raised to 150 ° C. over 2 hours while distilling off water, and the reaction was carried out at the same temperature for 1 hour to obtain 1072.0 g of a modified polyamino compound E by Mannich reaction.
[0021]
Synthesis Example 6
The synthesis was performed in the same manner as in Synthesis Example 5 except that MXDA was changed to 639.9 g (4.5 mol) of 1,3-BAC to obtain 1095.6 g of a modified polyamino compound F.
[0022]
Synthesis Examples 7 to 9
The polyamino composition A shown in Synthesis Example 1 and the modified polyamino compound E shown in Synthesis Example 5 were mixed at the ratio shown in Table 1 to obtain epoxy resin curing agents GI.
[0023]
Synthesis Examples 10 to 12
The polyamino composition B shown in Synthesis Example 2 and the modified polyamino compound E shown in Synthesis Example 5 were mixed at the ratio shown in Table 1 to obtain epoxy resin curing agents J to L.
[0024]
Synthesis Examples 13 to 15
The polyamino composition C shown in Synthesis Example 3 and the modified polyamino compound F shown in Synthesis Example 6 were mixed at the ratio shown in Table 2 to obtain epoxy resin curing agents M to O.
[0025]
Synthesis Examples 16 to 18
The polyamino composition D shown in Synthesis Example 4 and the modified polyamino compound E shown in Synthesis Example 6 were mixed at the ratio shown in Table 2 to obtain epoxy resin curing agents P to R.
[0026]
Examples 1-4
The storage stability of the polyamino compositions A to D obtained in Synthesis Examples 1 to 4 was evaluated. Table 3 shows the evaluation results.
[0027]
Examples 5 to 10
The epoxy resin curing agents G to I shown in Synthesis Examples 7 to 9 and the epoxy resin curing agents J to L shown in Synthesis Examples 10 to 12 were mixed with a bisphenol A liquid epoxy resin (trade name: Epicoat 828, Japan Epoxy Resin Co., Ltd.). )) And the proportions shown in Table 2 to prepare an epoxy resin composition. The pot life of the obtained epoxy resin composition was measured. Table 4 shows the measurement results.
[0028]
Examples 11 to 16
The epoxy resin curing agents M to O shown in Synthesis Examples 13 to 15 and the epoxy resin curing agents P to R shown in Synthesis Examples 16 to 18 were combined with a bisphenol A type liquid epoxy resin (trade name: Epicoat 828, Japan Epoxy Resin Co., Ltd.). )) And the proportions shown in Table 2 to prepare an epoxy resin composition. The pot life of the obtained epoxy resin composition was measured. Table 5 shows the measurement results.
[0029]
[Table 1]
[0030]
[Table 2]
[0031]
[Table 3]
[0032]
[Table 4]
[0033]
[Table 5]
[0034]
The evaluation of the polyamino composition and the epoxy resin composition was performed by the following method.
<Storage stability>
200 g of the polyamino composition was put in a 225 ml glass bottle, sealed, stored for one month under the conditions of 23 ° C. and 50% RH, and then observed for change in appearance and change in viscosity.
<Pot life>
100 g of the epoxy resin composition was placed in a 300 ml polypropylene cup, allowed to stand at 23 ° C. and 50% RH, and the time required to reach the maximum exothermic temperature was measured.
[0035]
【The invention's effect】
As is evident from the above examples, it is obtained by the addition reaction of the polyamino compound represented by the formula (1) with styrene, which is superior in safety and health and has good storage stability, and is represented by the formula (2) The pot life of the epoxy resin composition can be adjusted by using, as an essential component, a polyamino compound composed of adducts having mutually different side chain groups and mixing with another polyamino compound component. Thereby, an epoxy resin composition having an appropriate pot life according to the purpose can be obtained.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002176979A JP2004018711A (en) | 2002-06-18 | 2002-06-18 | Method for adjusting pot life of epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002176979A JP2004018711A (en) | 2002-06-18 | 2002-06-18 | Method for adjusting pot life of epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2004018711A true JP2004018711A (en) | 2004-01-22 |
Family
ID=31175134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002176979A Pending JP2004018711A (en) | 2002-06-18 | 2002-06-18 | Method for adjusting pot life of epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004018711A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004263177A (en) * | 2003-02-13 | 2004-09-24 | Mitsubishi Gas Chem Co Inc | Low temperature curing type epoxy resin curing agent and epoxy resin composition |
| WO2005123800A1 (en) * | 2004-06-21 | 2005-12-29 | Huntsman Advanced Materials (Switzerland) Gmbh | Curing agents for epoxy resins |
| US7396902B2 (en) * | 2003-02-13 | 2008-07-08 | Mitsubishi Gas Chemical Company, Inc. | Epoxy resin curing agent of aliphatic diamine/styrene addition product |
| JP2011006499A (en) * | 2009-06-23 | 2011-01-13 | Mitsubishi Gas Chemical Co Inc | Epoxy resin curing agent and epoxy resin composition |
| JP2011057743A (en) * | 2009-09-07 | 2011-03-24 | Mitsubishi Gas Chemical Co Inc | Heat-curable epoxy resin composition |
| JP2015511983A (en) * | 2012-03-09 | 2015-04-23 | コンストラクション リサーチ アンド テクノロジー ゲーエムベーハーConstruction Research & Technology GmbH | Amine curable epoxy resin composition |
| CN104974333A (en) * | 2008-08-25 | 2015-10-14 | 气体产品与化学公司 | Curing Agent For Low Temperature Cure Applications |
| WO2017179358A1 (en) * | 2016-04-12 | 2017-10-19 | 三菱瓦斯化学株式会社 | Epoxy resin curing agent, epoxy resin composition, and carbon fiber-reinforced composite material |
| JP2018083905A (en) * | 2016-11-24 | 2018-05-31 | 三菱瓦斯化学株式会社 | Epoxy resin curing agent, epoxy resin composition and cured product thereof |
-
2002
- 2002-06-18 JP JP2002176979A patent/JP2004018711A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7396902B2 (en) * | 2003-02-13 | 2008-07-08 | Mitsubishi Gas Chemical Company, Inc. | Epoxy resin curing agent of aliphatic diamine/styrene addition product |
| US7414097B2 (en) | 2003-02-13 | 2008-08-19 | Mitsubishi Gas Chemical Company, Inc. | Curing epoxy resin with aliphatic diamine-styrene product and carboxyl- and hydroxyl-containing accelerator |
| JP2004263177A (en) * | 2003-02-13 | 2004-09-24 | Mitsubishi Gas Chem Co Inc | Low temperature curing type epoxy resin curing agent and epoxy resin composition |
| US8063157B2 (en) * | 2004-06-21 | 2011-11-22 | Huntsman Advanced Materials Americas Llc | Curing agents for epoxy resins |
| WO2005123800A1 (en) * | 2004-06-21 | 2005-12-29 | Huntsman Advanced Materials (Switzerland) Gmbh | Curing agents for epoxy resins |
| JP2008503627A (en) * | 2004-06-21 | 2008-02-07 | ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー | Curing agent for epoxy resin |
| CN104974333A (en) * | 2008-08-25 | 2015-10-14 | 气体产品与化学公司 | Curing Agent For Low Temperature Cure Applications |
| JP2011006499A (en) * | 2009-06-23 | 2011-01-13 | Mitsubishi Gas Chemical Co Inc | Epoxy resin curing agent and epoxy resin composition |
| JP2011057743A (en) * | 2009-09-07 | 2011-03-24 | Mitsubishi Gas Chemical Co Inc | Heat-curable epoxy resin composition |
| JP2015511983A (en) * | 2012-03-09 | 2015-04-23 | コンストラクション リサーチ アンド テクノロジー ゲーエムベーハーConstruction Research & Technology GmbH | Amine curable epoxy resin composition |
| WO2017179358A1 (en) * | 2016-04-12 | 2017-10-19 | 三菱瓦斯化学株式会社 | Epoxy resin curing agent, epoxy resin composition, and carbon fiber-reinforced composite material |
| JP6256666B1 (en) * | 2016-04-12 | 2018-01-10 | 三菱瓦斯化学株式会社 | Epoxy resin curing agent, epoxy resin composition, carbon fiber reinforced composite material |
| US10767001B2 (en) | 2016-04-12 | 2020-09-08 | Mitsubishi Gas Chemical Company, Inc. | Epoxy resin curing agent, epoxy resin composition, and carbon fiber-reinforced composite material |
| JP2018083905A (en) * | 2016-11-24 | 2018-05-31 | 三菱瓦斯化学株式会社 | Epoxy resin curing agent, epoxy resin composition and cured product thereof |
| JP7177580B2 (en) | 2016-11-24 | 2022-11-24 | 三菱瓦斯化学株式会社 | Epoxy resin curing agent, epoxy resin composition and cured product thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5140900B2 (en) | Amino compound and method for producing the same | |
| JP2004018711A (en) | Method for adjusting pot life of epoxy resin composition | |
| JP6164572B2 (en) | Aromatic aldehyde, and epoxy resin curing agent and epoxy resin composition containing the aromatic aldehyde | |
| JP7036005B2 (en) | Polyamine compounds, polyamine compositions, and epoxy resin hardeners | |
| US7572877B2 (en) | Modified cyclic aliphatic polyamine | |
| JP7177580B2 (en) | Epoxy resin curing agent, epoxy resin composition and cured product thereof | |
| CN1267468C (en) | Amino composition and preparation method thereof | |
| US7473806B2 (en) | Modified chain aliphatic polyamine | |
| JP4449350B2 (en) | Amino composition and method for producing the same | |
| JP4310614B2 (en) | Polyamino epoxy resin curing agent and epoxy resin composition | |
| JP4596123B2 (en) | Low temperature curing type epoxy resin curing agent and epoxy resin composition | |
| CN102181044B (en) | Novel diamino-alcohol compounds, their manufacture and use in epoxy resins | |
| TWI874961B (en) | Epoxy resin composition and cured product thereof | |
| EP4370576B1 (en) | Epoxide-acrylate hybrid molecules and their use for chemical anchoring | |
| JP6939365B2 (en) | Method for producing amine composition | |
| JPH1180322A (en) | Method for extending pot life of epoxy resin composition | |
| JPH1135661A (en) | Epoxy resin curing agent | |
| JP4182334B2 (en) | Modified cycloaliphatic polyamine | |
| JP4054987B2 (en) | Amino compounds | |
| EP4370575B1 (en) | Epoxy resin mixtures comprising epoxide-acrylate hybrid molecules and multicomponent reactive resin compositions therefrom | |
| JP7608847B2 (en) | Epoxy resin curing agent, epoxy resin composition, and coating material | |
| JP2023180850A (en) | Epoxy resin curing agents, epoxy resin compositions and paints | |
| JPH04211423A (en) | Curable epoxy resin composition | |
| TW202428570A (en) | Amino compound and method for producing the same, epoxy resin curing agent, epoxy resin composition and cured product thereof | |
| JPS60260670A (en) | Adhesive composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050526 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20071001 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071107 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080305 |