JP2004095801A

JP2004095801A - Component mounting jig and method of manufacturing ceramic substrate with component

Info

Publication number: JP2004095801A
Application number: JP2002254177A
Authority: JP
Inventors: Hiroyuki Fukuda; 福田　博之; Shinji Hirano; 平野　真治
Original assignee: NGK Spark Plug Co Ltd
Current assignee: Niterra Co Ltd
Priority date: 2002-08-30
Filing date: 2002-08-30
Publication date: 2004-03-25

Abstract

【課題】セラミック基板本体の搭載面を基準として、部品を高い位置精度でセラミック基板本体に接合することができる部品取付用治具、及び、部品付きセラミック基板の製造方法を提供すること。
【解決手段】部品取付用治具２０１は、部品１５１に当接する第１当接面２３７、及び、この第１当接面２３７に対し所定の位置に設けられた第２当接面２３３を有する部品保持部材２３１を備え、さらに、セラミック基板本体１１１の搭載面１１７に当接する第３当接面２１９、及び、この第３当接面２１９に対し所定の位置に設けられた第４当接面２２１であって、第２当接面２３３に当接する第４当接面２２１を有する基板保持部材２１１を備える。
【選択図】　　　図２１A component mounting jig capable of bonding a component to a ceramic substrate main body with high positional accuracy with reference to a mounting surface of the ceramic substrate main body, and a method of manufacturing a ceramic substrate with components.
A component mounting jig has a first contact surface that contacts a component, and a second contact surface provided at a predetermined position with respect to the first contact surface. A third contact surface 219 that includes a component holding member 231 and contacts the mounting surface 117 of the ceramic substrate body 111; and a fourth contact surface that is provided at a predetermined position with respect to the third contact surface 219. 221, a substrate holding member 211 having a fourth contact surface 221 that contacts the second contact surface 233.
[Selection] Fig. 21

Description

【０００１】
【発明の属する技術分野】
本発明は、セラミック基板本体に部品が接合された部品付きセラミック基板の製造にあたり、セラミック基板本体に部品を接合する際に用いる部品取付用治具、及び、上記部品付きセラミック基板の製造方法に関する。
【０００２】
【従来の技術】
従来より、セラミック基板本体に部品が接合された様々な部品付きセラミック基板が知られている。これらの部品付きセラミック基板には、電子部品を搭載する搭載面を有する収容部が設けられたセラミック基板本体に、その搭載面を基準として部品が位置決めされ接合されたものがある。
【０００３】
例えば、図２３に基板主面９１２側から見た簡略化した平面図、図２４に図２３のＡＡにおける簡略化した断面図を示す部品付きセラミック基板９０１が挙げられる。
この部品付きセラミック基板９０１は、セラミック基板本体９１１に光学部品保持部材（部品）９５１が接合されている。このうち、セラミック基板本体９１１は、基板主面９１２とその反対側に位置する基板裏面９１３とこれらの面を結ぶ４つの基板側面（第１基板側面９１４ｓ、第２基板側面９１４ｔ、第３基板側面９１４ｕ及び第４基板側面９１４ｖ）とを有する略直方体形状である。セラミック基板本体９１１には、フォトダイオード等の電子部品を収容するための収容部９１５が設けられている。収容部９１５は、基板主面９０２側及び第１基板側面９１４ｓ側にそれぞれ開口している。この収容部９１５内には、電子部品を搭載する搭載面９１７が形成され、搭載面９１７には、電子部品と接合されるメタライズ層９１９が形成されている。また、セラミック基板本体９１１の基板主面９１２側には、電子部品を搭載した後にリッド（蓋）で収容部９１５を封止するため、平面視略口字形状のリング９２１が接合されている。
一方、光学部品保持部材９５１は、略円筒状の金具９５３の孔に球状レンズ９５５が取り付けられたものである。この光学部品保持部材９５１は、セラミック基板本体９１１の第１基板側面９１４ｓ側の開口を塞ぐように、第１基板９１４ｓに接合されている。
【０００４】
【発明が解決しようとする課題】
このような部品付きセラミック基板９０１においては、球状レンズ９５５を通じて入出力される光の光軸と搭載する電子部品との間で高い位置精度が求められる。即ち、電子部品を搭載する搭載面９１７から球状レンズ９５５の中心までの距離（高さ）ｈについて、高い精度が要求される。従って、セラミック基板本体９１１の第１基板側面９１４ｓに、球状レンズ９５５が保持された光学部品保持部材９５１を接合するにあたり、セラミック基板本体９１１の搭載面９１７を基準として、高い位置精度で光学部品保持部材９５１の位置を合わせ、これを接合する必要がある。
【０００５】
本発明は、かかる現状に鑑みてなされたものであって、セラミック基板本体にその搭載面を基準として高い位置精度で部品を接合することができる部品取付用治具、及び、部品付きセラミック基板の製造方法を提供することを目的とする。
【０００６】
【課題を解決するための手段、作用及び効果】
その解決手段は、電子部品を収容する収容部が設けられ、上記収容部内に上記電子部品を搭載する搭載面が形成されたセラミック基板本体と、上記セラミック基板本体に上記搭載面を基準として位置決めされ接合された部品と、を備える部品付きセラミック基板を製造するにあたり、上記セラミック基板本体に上記部品を位置決めして接合するための部品取付用治具であって、上記部品に当接し上記部品を所定の位置に保持する第１当接面、及び、この第１当接面に対し所定の位置に設けられた第２当接面、を有する部品保持部材と、上記搭載面に当接し上記セラミック基板本体を所定の位置に保持する第３当接面、及び、この第３当接面に対し所定の位置に設けられた第４当接面であって、上記第２当接面に当接し上記部品保持部材を所定の位置に保持する第４当接面、を有する基板保持部材と、を備える部品取付用治具である。
【０００７】
本発明は、電子部品を収容する収容部が設けられ、収容部内に電子部品を搭載する搭載面が形成されたセラミック基板本体と、セラミック基板本体に搭載面を基準として位置決めされ接合された部品とを備える部品付きセラミック基板を製造するにあたり、セラミック基板本体に部品を位置決めして接合するための部品取付用治具についてものである。この部品取付用治具は、部品に当接し部品を所定の位置に保持する第１当接面、及び、この第１当接面に対し所定の位置に設けられた第２当接面を有する部品保持部材を備える。また、部品取付用治具は、搭載面に当接しセラミック基板本体を所定の位置に保持する第３当接面、及び、この第３当接面に対し所定の位置に設けられた第４当接面であって、第２当接面に当接し部品保持部材を所定の位置に保持する第４当接面を有する基板保持部材を備える。
【０００８】
このような部品取付用治具は、セラミック基板本体に部品を位置決めして接合する際、部品を部品保持部材の第１当接面に当接させて、部品を部品保持部材に対し所定の位置に保持することができる。また、セラミック基板本体の搭載面を基板保持部材の第３当接面に当接させて、セラミック基板本体を基板保持部材に対し所定の位置に保持することができる。さらに、部品保持部材のうち、第１当接面に対し所定の位置に設けられた第２当接面を、基板保持部材のうち、第３当接面に対し所定の位置に設けられた第４当接面に当接させて、部品保持部材を基板保持部材に対し所定の位置に保持することできる。
【０００９】
即ち、この部品取付用治具を利用すれば、部品と第１当接面を当接させ、この第１当接面に対し所定の位置関係にある第２当接面と第４当接面に当接させ、さらに、この第４当接面に対し所定の位置関係にある第３当接面とセラミック基板本体の搭載面を当接させることができるので、部品とセラミック基板本体の搭載面とを精度良く位置決めすることができる。
従って、セラミック基板本体にその搭載面を基準として高い位置精度で部品を接合することができる。
【００１０】
さらに、上記の部品取付用治具であって、前記セラミック基板本体の搭載面を前記基板保持部材の第３当接面に押圧し上記セラミック基板本体を所定の姿勢に保持するように、上記セラミック基板本体を付勢する基板付勢部材を備える部品取付用治具とすると良い。
【００１１】
本発明によれば、部品取付用治具は、セラミック基板本体の搭載面を基板保持部材の第３当接面に押圧しセラミック基板本体を所定の姿勢に保持するように、セラミック基板本体を付勢する基板付勢部材を備える。
このため、セラミック基板本体の搭載面を基板保持部材の第３当接面に押圧しつつ、セラミック基板本体を基板保持部材に対し所定の姿勢で確実に保持することができる。従って、部品とセラミック基板本体の搭載面とを、より精度良く位置決めすることができるので、搭載面を基準として、より高い位置精度で部品をセラミック基板本体に接合することができる。
【００１２】
さらに、上記の部品取付用治具であって、前記セラミック基板本体が前記基板付勢部材により前記基板保持部材に所定の姿勢で保持された状態で、これらセラミック基板本体、基板付勢部材及び基板保持部材を固定する固定部材を備える部品取付用治具とすると良い。
【００１３】
本発明によれば、部品取付用治具は、セラミック基板本体が基板付勢部材により基板保持部材に所定の姿勢で保持された状態でこれらを固定する固定部材を備える。
このため、セラミック基板本体と基板付勢部材を基板保持部材にセットした状態で、セラミック基板本体を基板保持部材に対し所定の姿勢でより確実に保持することができる。従って、部品とセラミック基板本体の搭載面とを、より精度良く位置決めすることができるので、搭載面を基準として、より高い位置精度で部品をセラミック基板本体に接合することができる。
【００１４】
さらに、上記のいずれかに記載の部品取付用治具であって、前記部品保持部材を前記セラミック基板本体側に向けて付勢する部品保持部材用付勢部材を備える部品取付用治具とすると良い。
【００１５】
本発明によれば、部品取付用治具は、部品保持部材をセラミック基板本体側に向けて付勢する部品保持部材用付勢部材を備える。
このため、部品保持部材を基板保持部材にセットした状態で、部品保持部材を基板保持部材に対して所定の姿勢で確実に保持することができる。従って、部品とセラミック基板本体の搭載面とを、より精度良く位置決めすることができるので、搭載面を基準として、より高い位置精度で部品をセラミック基板本体に接合することができる。
【００１６】
さらに、上記のいずれかに記載の部品取付用治具であって、前記部品は、光学部品を保持する光学部品保持部材である部品取付用治具とすると良い。
【００１７】
本発明によれば、セラミック基板本体に接合する部品は、光学部品を保持する光学部品保持部材である。
光学部品は、一般に、セラミック基板本体に搭載される電子部品との間で高い位置精度が要求される。このため、光学部品保持部材をセラミック基板本体に接合する際には、その搭載面に対して高い位置精度で接合しなければならない。従って、部品が光学部品を保持する光学部品保持部材である場合に、特に、上述の部品取付用治具を適用するのが好ましい。
なお、光学部品は、部品付きセラミック基板に収容する電子部品の種類や部品付きセラミック基板の使用目的に応じて適宜選択することができるが、例えば、球状レンズ、半球状レンズ、平板状レンズ、ロートレンズ、セルフォックマイクロレンズなどが挙げられる。
【００１８】
また、他の解決手段は、電子部品を収容する収容部が設けられ、上記収容部内に上記電子部品を搭載する搭載面が形成されたセラミック基板本体と、上記セラミック基板本体に上記搭載面を基準として位置決めされ接合された部品と、を備える部品付きセラミック基板の製造方法であって、上記セラミック基板本体の搭載面を基準として、上記セラミック基板本体に対して上記部品の位置を合わせる位置合わせ工程と、上記セラミック基板本体に上記部品を接合する接合工程と、を備える部品付きセラミック基板の製造方法である。
【００１９】
本発明は、電子部品を収容する収容部が設けられ、収容部内に電子部品を搭載する搭載面が形成されたセラミック基板本体と、セラミック基板本体に搭載面を基準として位置決めされ接合された部品とを備える部品付きセラミック基板の製造方法についてのものである。本発明では、位置合わせ工程において、セラミック基板本体の搭載面を基準として、セラミック基板本体に対して部品の位置を合わせる。そして、接合工程において、セラミック基板本体に部品を接合する。
従って、セラミック基板本体の搭載面を基準として、セラミック基板本体に高い位置精度で部品を接合することができる。
【００２０】
さらに、上記の部品付きセラミック基板の製造方法であって、前記位置合わせ工程は、前記部品に当接し上記部品を所定の位置に保持する第１当接面、及び、この第１当接面に対し所定の位置に設けられた第２当接面、を有する部品保持部材と、前記搭載面に当接し前記セラミック基板本体を所定の位置に保持する第３当接面、及び、この第３当接面に対し所定の位置に設けられた第４当接面であって、上記第２当接面に当接し上記部品保持部材を所定の位置に保持する第４当接面、を有する基板保持部材と、を備える部品取付用治具を用いて、上記搭載面を上記第３当接面に当接させて上記セラミック基板を所定の位置に保持すると共に、上記部品を上記第１当接面に当接させて上記部品を所定の位置に保持しつつ、上記第２当接面を上記第３当接面に当接させて上記部品保持部材を所定の位置に保持する部品付きセラミック基板の製造方法とすると良い。
【００２１】
本発明では、位置合わせ工程において、部品取付用治具を利用する。即ち、部品に当接し部品を所定の位置に保持する第１当接面、及び、この第１当接面に対し所定の位置に設けられた第２当接面を有する部品保持部材と、搭載面に当接しセラミック基板本体を所定の位置に保持する第３当接面、及び、この第３当接面に対し所定の位置に設けられた第４当接面であって、第２当接面に当接し部品保持部材を所定の位置に保持する第４当接面を有する基板保持部材とを備える部品取付用治具を用意する。そして、搭載面を第３当接面に当接させてセラミック基板を所定の位置に保持すると共に、部品を第１当接面に当接させて部品を所定の位置に保持しつつ、第２当接面を第３当接面に当接させて部品保持部材を所定の位置に保持する。
【００２２】
このように位置合わせ工程を行えば、部品と第１当接面を当接させ、この第１当接面に対し所定の位置関係にある第２当接面と第４当接面を当接させ、さらに、この第４当接面に対し所定の位置関係にある第２当接面とセラミック基板本体の搭載面を当接させることができるので、部品とセラミック基板本体の搭載面とを精度良く位置決めすることができる。
従って、セラミック基板本体の搭載面を基準として、セラミック基板本体に高い位置精度で部品を接合することができる。
【００２３】
さらに、上記のいずれかに記載の部品付きセラミック基板の製造方法であって、上記部品付きセラミック基板の前記部品は、光学部品を保持する光学部品保持部材である部品付きセラミック基板の製造方法とすると良い。
【００２４】
本発明によれば、セラミック基板本体に接合する部品は、光学部品を保持する光学部品保持部材である。
光学部品は、前述したように、セラミック基板本体に搭載される電子部品との間で高い位置精度が要求されるので、光学部品保持部材をセラミック基板本体の搭載面に対し高い位置精度で接合しなければならない。従って、部品が光学部品を保持する光学部品保持部材である場合に、特に、上述の製造方法を適用するのが好ましい。
【００２５】
【発明の実施の形態】
以下、本発明の実施の形態を、図面を参照しつつ説明する。
本実施形態に係る部品付きセラミック基板１０１について、図１に基板主面１１２側から見た平面図を、図２に図１におけるＡＡ断面図を示す。
この部品付きセラミック基板１０１は、セラミック基板本体１１１に光学部品保持部材（部品）１５１が、融点約２８０℃のＡｕＳｎ材１７１により、ろう接されたものである。
【００２６】
このうち、セラミック基板本体１１１は、基板主面１１２とその反対側に位置する基板裏面１１３とこれらの面を結ぶ４つの基板側面（第１基板側面１１４ｓ、第２基板側面１１４ｔ、第３基板側面１１４ｕ及び第４基板側面１１４ｖ）とを有する略直方体形状である。その外形の大きさは、約１３．２１ｍｍ×約７．３７ｍｍ×約４．３２ｍｍである。
【００２７】
セラミック基板本体１１１には、図示しないフォトダイオード、レーザダイオード、フォトトランジスタ等（電子部品）を収容するための収容部１１５が設けられている。この収容部１１５内には、上記電子部品を搭載する搭載面１１７が形成されている。そして、収容部１１５は、基板主面１１２側及び第１基板側面１１４ｓ側にそれぞれ開口している。基板主面１１２側の開口の大きさは約８．００ｍｍ×約５．７２ｍｍであり、第１基板側面１１４ｓ側の開口の大きさは幅約３．２０ｍｍ×高さ約３．１２ｍｍである。また、搭載面１１７から基板主面１１２までの高さ（収容部１１５の深さ）は、約３．０３５ｍｍである。搭載面１１７には、電子部品と接続される搭載面メタライズ層１１９が平面視略矩形状に形成されている。この搭載面メタライズ層１１９は、タングステンからなり、その表面にはＮｉメッキが被着され、さらにＡｕメッキが被着されている。
【００２８】
セラミック基板本体１１１の基板主面１１２には、平面視略口字形状に主面メタライズ層１２１が形成されている。そして、この主面メタライズ層１２１上には、電子部品を搭載した後にリッド（蓋）で収容部１１５を封止するため、平面視略口字形状のコバールからなるリング１２３が、融点約７８０℃のＡｇＣｕ材により、ろう接されている。また、第１基板側面１１４ｓには、光学部品保持部材１５１を接合するため、その略全面に側面メタライズ層（図示しない）が形成されている。また、第２基板側面１１４ｔ及び第４基板側面１１４ｖには、端子としての役割を担う所定パターンの側面メタライズ層（図示しない）が形成されている。なお、基板主面１１２等には、部分的にアルミナコート（図示しない）が被着されている。
【００２９】
次に、内部について説明すると、セラミック基板本体１１１は、アルミナセラミックからなる１０層のセラミック層から構成されている。このうち、基板主面１１２側の７層のセラミック層には、収容部１１５に対応した孔が形成され、収容部１１５の壁部を構成している。一方、基板裏面１１３側の３層のセラミック層は、収容部１１５の底部を構成している。
これらのセラミック層のうち、基板主面１１２側から５層目のセラミック層と６層目のセラミック層との層間、即ち、６層目のセラミック層の主面には、所定パターンのメタライズ層（図示しない）が形成されている。また、基板主面１１２側から６層目のセラミック層と７層目のセラミック層との層間、即ち、７層目のセラミック層の主面にも、所定パターンのメタライズ層（図示しない）が形成されている。さらに、基板主面１１２側から７層目のセラミック層と８層目のセラミック層との層間、即ち、８層目のセラミック層も主面にも、上述したように、所定パターンの搭載面メタライズ層１１９が形成されている。
【００３０】
一方、部品付きセラミック基板１０１のうち、光学部品保持部材１５１は、略円筒状のコバールからなる金具１５３の孔に、球状レンズ１５５が取り付けられたものである。この光学部品保持部材１５１は、セラミック基板本体１１１の第１基板側面１１４ｓ側の開口を塞ぐように、第１基板側面１１４ｓの側面メタライズ層に接合されている。
この光学部品保持部材１５１は、セラミック基板本体１１１の搭載面１１７を基準として高い位置精度で接合されている。即ち、搭載面１１７から光学部品保持部材１５１の球状レンズ１５５の中心までの距離（高さ）ｈは、０．９１６ｍｍで、誤差が０．０５ｍｍ以内とされている。
【００３１】
このような部品付きセラミック基板１０１は、以下のようにして製造する。
即ち、まず、公知の手法により上記セラミック基板本体１１１を製造する。つまり、公知のセラミック基板の製法に従ってセラミック基板本体１１１の主要部を製造した後、ＡｇＣｕ材により、基板主面１１２にリング１２３をろう接する。そして、ＮｉメッキとＡｕメッキを順次施せば、セラミック基板本体１１１ができる。また、金具１５３に球状レンズ１５５を取り付けた光学部品保持部材１５１も用意する。
【００３２】
また一方で、図３〜図１３及び図２１に示す部品取付用治具２０１を用意する。この部品取付用治具２０１は、図３〜図５に示す基板保持部材２１１と、図６〜図８に示す部品保持部材２３１と、図９〜図１１に示す基板付勢部材２５１と、図１２及び図１３に示す固定部材２７１と、図２２に示す部品保持部材用付勢部材２９１とからなる。
【００３３】
各部材について順番に説明すると、基板保持部材２１１は、主面２１２とその反対側の裏面２１３とこれらを結ぶ４つの側面（第１側面２１４ｓ、第２側面２１４ｔ、第３側面２１４ｕ及び第４側面２１４ｖ）を有する略直方体形状である。なお、図３は主面２１２側から見た平面図、図４は図３におけるＡＡ断面図、図５は第１側面２１４ｓ側から見た平面図を示している。
基板保持部材２１１には、その主面２１２側及び第１側面２１４ｓ側に開口する階段状の収容部２１５が形成されている。このため、後述するように、主面２１２側からセラミック基板本体１１１及び基板付勢部材２５１を載置することができると共に、第１側面２１４ｓ側から部品保持部材２３１を挿入することができる。
【００３４】
収容部２１５の略中央には、収容部２１５の底面から主面２１２側に向けて突出する略直方体形状の突出部２１７が形成されている。この突出部２１７の頂面は、部品付きセラミック基板１０１を製造する際にセラミック基板本体１１１の搭載面１１７が当接する第３当接面２１９である。この第３当接面２１９には、ポリイミドからなる厚さ約１５μｍの樹脂がコーティングされている。この樹脂は、ペースト状のポリイミドを第３当接面２１９に塗布し硬化させたものである。
【００３５】
このような第３当接面２１９と収容部２１５の壁面により、セラミック基板本体１１１を収容部２１５に載置したときに、セラミック基板本体１１１を所定の位置に保持することができる。
また、収容部２１５の第１側面２１４ｓ側の開口の裏面２１３側には、後述する部品保持部材２３１の第２当接面２３３が当接する第４当接面２２１が形成されている。このため、後述する部品保持部材２３１を収容部２１５に挿入したときに、部品保持部材２３１を所定の位置に保持することができる。
【００３６】
部品保持部材２３１は、主面２３２とその反対側の裏面２３３とこれらを結ぶ４つの側面（第１側面２３４ｓ、第２側面２３４ｔ、第３側面２３４ｕ及び第４側面２３４ｔ）を有する略直方体形状である。なお、図６は第１側面２３４ｓ側から見た平面図、図７は図６におけるＡＡ断面図、図８は第２側面２３４ｔ側から見た平面図を示している。この部品保持部材２３１の裏面２３３は、上述した基板保持部材２１１の第４当接面２２１と当接する第２当接面２３３でもある。部品保持部材２３１の第１側面２３４ｓの略中央には、平面視円形状の凹部２３５が形成されている。この凹部２３５の内周面は、光学部品保持部材１５１が当接する第１当接面２３７である。そして、凹部２３５の略中央には、凹部２３５の底面から第１側面２３４ｓ側に向けて突出する円柱状の突出部２３９が形成されている。このため、光学部品保持部材１５１を凹部２３５に挿入したときに、光学部品保持部材１５１を第１当接面２３７に当接させて、光学部品保持部材１５１を所定の位置に保持することができる。
【００３７】
基板付勢部材２５１は、主面２５２とその反対側の裏面２５３とこれらを結ぶ４つの側面（第１側面２５４ｓ、第２側面２５４ｔ、第３側面２５４ｕ及び第４側面２５４ｖ）を有する略直方体形状である。なお、図９は主面２５２側から見た平面図、図１０は第１側面２５４ｓ側から見た平面図、図１１は第４側面２５４ｖ側から見た平面図を示している。このうち裏面２５３は、上述したセラミック基板本体１１１の基板裏面１１３に当接し、セラミック基板本体１１１を付勢するための面である。一方、主面２５２には、その略中央から第１側面２５４ｓまで繋がった平面視略矩形状の突出部２５５が形成されている。この突出部２５５は、後述する固定部材２７１が当接する部分である。また、基板付勢部材２５１には、主面２５２と裏面２５３との間を貫通する平面視長円形状の２つの貫通孔２５７が、突出部２５５と平行に突出部２５５の両側に形成されている。
【００３８】
固定部材２７１は、主面２７２とその反対面の裏面２７３とこれらを結ぶ４つの側面（第１側面２７４ｓ、第２側面２７４ｔ、第３側面２７４ｕ及び第４側面２７４ｖ）を有し、外形が略直方体形状である。なお、図１２は主面２７２側から見た平面図、図１３は第１側面２７４ｓ側から見た平面図を示している。この固定部材２７１には、主面２７２と裏面２７３との間を貫通する平面視略矩形状の大きな貫通孔２７５が形成されている。従って、固定部材２７１は、平面視口字形状でリング状をなしている。
【００３９】
部品保持部材用付勢部材２９１は、図２２に示すように、２つの分離した部材から構成される。各々の部材は、平板形状の金属板が２個所で折り曲げられ、概略コ字形状をなしている。
【００４０】
次に、このような部品取付部材２０１を用いて、セラミック基板本体１１１に光学部品保持部材１５１を接合する。
まず、位置合わせ工程において、図１４に上方（基板保持部材２１１の主面２１２側）から見た平面図、図１５に図１４のＡＡ断面図を示すように、基板保持部材２１１にセラミック基板本体１１１をセットする。即ち、セラミック基板本体１１１の基板主面１０２を下方に向け、かつ、セラミック基板本体１１１の第１基板側面１１４ｓを基板保持部材２１１の第１側面２１４ｓ側に向けて、基板保持部材２１１の収容部２１５内の略中央の所定の位置に、セラミック基板本体１１１を載置する。そして、セラミック基板本体１１１の搭載面１１７を、基板保持部材２１１の突出部２１７の頂面である第３当接面２１９に当接させ、セラミック基板本体１１１を収容部２１５内の所定の位置に保持する。その際、第３当接面２１９は、樹脂によりコーティングされているため、搭載面メタライズ層１１９にはキズ等が付きにくい。
【００４１】
次に、図１６に上方から見た平面図、図１７に図１６のＡＡ断面図を示すように、基板保持部材２１１に基板付勢部材２５１をセットする。即ち、基板付勢部材２５１の裏面２５３を下方に向け、かつ、基板付勢部材２５１の第１側面２５４ｓを基板保持部材２１１の第１側面２１４ｓ側に向けて、基板保持部材２１１の収容部２１５内の所定の位置に、基板付勢部材２５１を載置する。そして、基板付勢部材２５１の裏面２５３をセラミック基板本体１１１の裏面１１３に当接させて、基板付勢部材２５１の自重によりセラミック基板本体１１１を基板保持部材２１１に（下方に）付勢する。これにより、セラミック基板本体１１１は、その搭載面１１７が第３当接面２１９を押圧した状態で、基板保持部材２１１に対して所定の姿勢で確実に保持される。
【００４２】
次に、図１８に上方から見た平面図、図１９に図１８のＡＡ断面図を示すように、セラミック基板本体１１１及び基板付勢部材２５１をセットした基板保持部材２１１を固定部材２７１で固定する。即ち、リング状の固定部材２７１を基板保持部材２１１の第１側面２１４ｓ側からはめ込む。そして、固定部材２７１の貫通孔２７５の内周面を、基板付勢部材２５１の突出部２５５に当接させると共に、基板保持部材２１１の裏面２１３にも当接させて、セラミック基板本体１１１及び基板付勢部材２５１を基板保持部材２１１に固定する。これにより、セラミック基板本体１１１は、基板保持部材２１１に対して所定の姿勢でより確実に保持されるようになる。
【００４３】
次に、部品保持部材２３１に光学部品保持部材１５１をセットする（図２１参照）。即ち、部品保持部材２３１の凹部２３５に光学部品保持部材１５１の一部を挿入する。そして、光学部品保持部材１５１を凹部２３５の内周面である第１当接面２３７に当接させて、光学部品保持部材１５１を部品保持部材２３１に対し所定の位置に保持する。
【００４４】
次に、図２０に上方から見た平面図、図２１に図２０のＡＡ断面図を示すように、光学部品保持部材１５１を挿入した部品保持部材２３１を、固定部材２７１で固定した状態の基板保持部材２１１にセットする。即ち、部品保持部材２３１に挿入された光学部品保持部材１５１を基板保持部材２１１の第１側面２１４ｓ側に向け、部品保持部材２３１を第１側面２１４ｓ側から基板保持部材２１１の収容部２１５に挿入する。そして、部品保持部材２３１の裏面である第２当接面２３３を、基板保持部材２１１の第４当接面２２１に当接させて、部品保持部材２３１を基板保持部材２１１に対し所定の位置に保持する。
【００４５】
次に、図２２上方から見た平面図を示すように、部品保持部材用付勢部材２９１を用いて、部品保持部材２３１を基板保持部材２１１に固定する。即ち、２個所で折れ曲がった２つの部品保持部材用固定部材２９１の一方の端部をそれぞれ部品保持部材２３１の第４側面２３４ｖに当接させると共に、他方の端部側をそれぞれ基板保持部材２１１の第３側面２１４ｕに当接させて、部品保持部材２３１を基板保持部材２１１側に付勢する。これにより、部品保持部材２３１は、基板保持部材２１１に対して所定の姿勢で確実に保持されるようになる。
以上で、セラミック基板本体１１１及び光学部品保持部材１５１の部品取付部材２０１へのセットは完了する。光学部品保持部材１５１は、セラミック基板本体１１１の搭載面１１７に対して精度よく位置合わせされる。
【００４６】
次に、接合工程において、部品取付部材２０１等をリフロー炉に入れ、セラミック基板本体１１１と光学部品保持部材１５１とを、加熱しろう接する。そうすれば、上述の部品付きセラミック基板１０１が完成する。
その後は、部品保持部材用付勢部材２９１と、部品保持部材２３１と、固定部材２７１と、基板付勢部材２５１を順次取り除き、部品付きセラミック基板１０１を基板保持部材２１１から取り出せばよい。
このようにして、部品付きセラミック基板１０１を製造する。
【００４７】
以上で説明したように、本実施形態の部品取付用治具２０１は、セラミック基板本体１１１に光学部品保持部材１５１を位置決めして接合する際、光学部品保持部材１５１を部品保持部材２３１の第１当接面２３７に当接させて、光学部品保持部材１５１を部品保持部材２３１に対し所定の位置に保持することができる。また、セラミック基板本体１１１の搭載面１１７を基板保持部材２１１の第３当接面２１９に当接させて、セラミック基板本体１１１を基板保持部材２１１に対し所定の位置に保持することができる。さらに、部品保持部材２３１のうち、第１当接面２３７に対し所定の位置に設けられた第２当接面２３３を、基板保持部材２１１のうち、第３当接面２１９に対し所定の位置に設けられた第４当接面２２１に当接させて、部品保持部材２３１を基板保持部材２１１に対し所定の位置に保持することできる。
【００４８】
即ち、この部品取付用治具２０１を利用すれば、光学部品保持部材１５１と第１当接面２３７を当接させ、この第１当接面２３７に対し所定の位置関係にある第２当接面２３３と第４当接面２２１を当接させ、さらに、この第４当接面２２１に対し所定の位置関係にある第３当接面２１９とセラミック基板本体１１１の搭載面１１７を当接させることができるので、光学部品保持部材１５１とセラミック基板本体１１１の搭載面１１７とを精度良く位置決めすることができる。
従って、セラミック基板本体１１１に搭載面１１７を基準として高い位置精度で光学部品保持部材１５１を接合することができる。
【００４９】
さらに、本実施形態では、部品取付用治具２０１が基板付勢部材２５１を備えるため、セラミック基板本体１１１の搭載面１１７を基板保持部材２１１の第３当接面２１９に押圧しつつ、セラミック基板本体１１１を所定の姿勢で確実に保持することができる。このため、光学部品保持部材１５１とセラミック基板本体１１１の搭載面１１７とを、より精度良く位置決めすることができる。従って、搭載面１１７を基準として、より高い位置精度で光学部品保持部材１５１をセラミック基板本体１１１に接合することができる。
【００５０】
また、本実施形態では、部品取付用治具２０１が固定部材２７１を備えるため、セラミック基板本体１１１と基板付勢部材２５１を基板保持部材２１１にセットした状態で、セラミック基板本体１１１を所定の姿勢でより確実に保持することができる。従って、光学部品保持部材１５１とセラミック基板本体１１１の搭載面１１７とを、より精度良く位置決めすることができるので、搭載面１１７を基準として、より高い位置精度で光学部品保持部材１５１をセラミック基板本体１１１に接合することができる。
【００５１】
また、本実施形態では、部品取付用治具２０１が部品保持部材用付勢部材２９１を備えるため、部品保持部材２３１を基板保持部材２１１にセットした状態で、部品保持部材２３１を所定の姿勢で確実に保持することができる。従って、光学部品保持部材１５１とセラミック基板本体１１１の搭載面１１７とを、より精度良く位置決めすることができるので、搭載面１１７を基準として、より高い位置精度で光学部品保持部材１５１をセラミック基板本体１１１に接合することができる。
【００５２】
また、本実施形態では、セラミック基板本体１１１に接合する部品は、球状レンズ（光学部品）１５５を保持する光学部品保持部材１５１である。従って、上述の部品取付用治具２０１を利用して、搭載面１１７に対して高い位置精度で光学部品保持部材１５１をセラミック基板本体１１１に接合するのが、特に重要となる。
【００５３】
また、本実施形態の製造方法では、位置合わせ工程において、セラミック基板本体１１１の搭載面１１７を基準として、セラミック基板本体１１１に対して光学部品保持部材１５１の位置を合わせる。そして、接合工程において、セラミック基板本体１１１に光学部品保持部材１５１を接合する。従って、セラミック基板本体１１１の搭載面１１７を基準として、セラミック基板本体１１１に高い位置精度で光学部品保持部材１５１を接合することができる。
【００５４】
さらに、位置合わせ工程において、部品取付用治具２０１を利用するので、光学保持部材１５１と第１当接面２３７を当接させ、この第１当接面２３７に対し所定の位置関係にある第２当接面２３３と第４当接面２２１を当接させ、さらに、この第４当接面２２１に対し所定の位置関係にある第３当接面２１９とセラミック基板本体１１１の搭載面１１７を当接させることができる。このため、光学部品保持部材１５１とセラミック基板本体１１１の搭載面１１７とを精度良く位置決めすることができる。従って、セラミック基板本体１１１の搭載面１１７を基準として、セラミック基板本体１１１に高い位置精度で光学部品保持部材１５１を接合することができる。
【００５５】
特に、本実施形態では、セラミック基板本体１１１に接合する部品は、球状レンズ（光学部品）１５５を保持する光学部品保持部材１５１であるので、上述の製造方法により、搭載面１１７に対して高い位置精度で光学部品保持部材１５１をセラミック基板本体１１１に接合するのが、特に重要となる。
【００５６】
以上において、本発明を実施形態に即して説明したが、本発明は上記実施形態に限定されるものではなく、その要旨を逸脱しない範囲で、適宜変更して適用できることはいうまでもない。
例えば、上記実施形態では、光学部品保持部材１５１として球状レンズ１５５を保持するものを示したが、半球状レンズや平板状レンズ、ロッドレンズ、セルフォックマイクロレンズ（商標名）、光ファイバ等の光学部品を保持する光学部品保持部材をセラミック基板本体１１１に接合することもできる。
【図面の簡単な説明】
【図１】実施形態に係り、部品付きセラミック基板の基板主面側から見た平面図である。
【図２】実施形態に係り、部品付きセラミック基板の図１におけるＡＡ断面図である。
【図３】実施形態に係る部品取付用治具のうち、基板保持部材の主面側から見た平面図である。
【図４】実施形態に係る部品取付治具のうち、基板保持部材の図３におけるＡＡ断面図である。
【図５】実施形態に係る部品取付用治具のうち、基板保持部材の第１側面側から見た平面図である。
【図６】実施形態に係る部品取付用治具のうち、部品保持部材の第１側面側から見た平面図である。
【図７】実施形態に係る部品取付用治具のうち、部品保持部材の図６におけるＡＡ断面図である。
【図８】実施形態に係る部品取付用治具のうち、部品保持部材の第２側面側から見た平面図である。
【図９】実施形態に係る部品取付用治具のうち、基板付勢部材の主面側から見た平面図である。
【図１０】実施形態に係る部品取付用治具のうち、基板付勢部材の第１側面側から見た平面図である。
【図１１】実施形態に係る部品取付用治具のうち、基板付勢部材の第３側面側から見た平面図である。
【図１２】実施形態に係る部品取付用治具のうち、固定部材の主面側から見た平面図である。
【図１３】実施形態に係る部品取付用治具のうち、固定部材の第１側面側から見た平面図である。
【図１４】実施形態に係る部品付きセラミック基板の製造方法に関し、基板保持部材にセラミック基板本体を載置した状態を上方から見た平面図である。
【図１５】実施形態に係る部品付きセラミック基板の製造方法に関し、基板保持部材にセラミック基板本体を載置した状態を示す図１４におけるＡＡ断面図である。
【図１６】実施形態に係る部品付きセラミック基板の製造方法に関し、基板保持部材に基板付勢部材を載置した状態を上方から見た平面図である。
【図１７】実施形態に係る部品付きセラミック基板の製造方法に関し、基板保持部材に基板付勢部材を載置した状態を示す図１６におけるＡＡ断面図である。
【図１８】実施形態に係る部品付きセラミック基板の製造方法に関し、基板保持部材等にに固定部材取り付けた状態を上方から見た平面図である。
【図１９】実施形態に係る部品付きセラミック基板の製造方法に関し、基板保持部材等にに固定部材取り付けた状態を示す図１８におけるＡＡ断面図である。
【図２０】実施形態に係る部品付きセラミック基板の製造方法に関し、基板保持部材等にに光学保持部材を保持した部品保持部材を挿入した状態を上方から見た平面図である。
【図２１】実施形態に係る部品付きセラミック基板の製造方法に関し、基板保持部材等にに光学保持部材を保持した部品保持部材を挿入した状態を示す図２０におけるＡＡ断面図である。
【図２２】実施形態に係る部品付きセラミック基板の製造方法に関し、部品保持部材等を部品保持部材用固定部材で付勢した状態を上方から見た平面図である。
【図２３】従来技術に係り、部品付きセラミック基板の基板主面側から見た簡略化した平面図である。
【図２４】従来技術に係り、部品付きセラミック基板の図２３における簡略化したＡＡ断面図である。
【符号の説明】
１０１　　部品付きセラミック基板
１１１　　セラミック基板本体
１１５　　収容部
１１７　　搭載面
１５１　　光学部品保持部材（部品）
１５３　　球状レンズ（光学部品）
２０１　　部品取付用治具
２１１　　基板保持部材
２１９　　第３当接面
２２１　　第４当接面
２３１　　部品保持部材
２３３　　第２当接面
２３７　　第１当接面
２５１　　基板付勢部材
２７１　　固定部材
２９１　　部品保持部材用付勢部材[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a component mounting jig used for bonding a component to a ceramic substrate main body when manufacturing a ceramic substrate with a component in which a component is bonded to a ceramic substrate main body, and a method for manufacturing the above-described ceramic substrate with a component.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, various ceramic substrates with components in which components are bonded to a ceramic substrate body are known. Among these ceramic substrates with components, there are those in which components are positioned and joined to a ceramic substrate main body provided with a housing portion having a mounting surface for mounting electronic components on the basis of the mounting surface.
[0003]
For example, FIG. 23 shows a simplified plan view seen from the substrate main surface 912 side, and FIG. 24 shows a ceramic substrate with components 901 showing a simplified cross-sectional view taken along AA in FIG.
In the ceramic substrate with components 901, an optical component holding member (component) 951 is joined to a ceramic substrate main body 911. Among them, the ceramic substrate main body 911 includes a substrate main surface 912, a substrate back surface 913 located on the opposite side, and four substrate side surfaces (a first substrate side surface 914s, a second substrate side surface 914t, and a third substrate side surface) connecting these surfaces. 914u and a fourth substrate side surface 914v). The ceramic substrate main body 911 is provided with a housing 915 for housing electronic components such as a photodiode. The accommodation portions 915 are open on the substrate main surface 902 side and the first substrate side surface 914s side, respectively. A mounting surface 917 for mounting an electronic component is formed in the housing portion 915, and a metallization layer 919 to be bonded to the electronic component is formed on the mounting surface 917. A ring 921 having a substantially square shape in plan view is joined to the substrate main surface 912 side of the ceramic substrate main body 911 in order to seal the accommodating portion 915 with a lid (lid) after mounting electronic components.
On the other hand, the optical component holding member 951 has a spherical lens 955 attached to a hole of a substantially cylindrical fitting 953. The optical component holding member 951 is joined to the first substrate 914s so as to close the opening on the first substrate side surface 914s side of the ceramic substrate main body 911.
[0004]
[Problems to be solved by the invention]
In such a ceramic substrate 901 with components, high positional accuracy is required between the optical axis of light input / output through the spherical lens 955 and the mounted electronic component. That is, high accuracy is required for the distance (height) h from the mounting surface 917 on which the electronic component is mounted to the center of the spherical lens 955. Therefore, when joining the optical component holding member 951 holding the spherical lens 955 to the first substrate side surface 914s of the ceramic substrate main body 911, the optical component holding member 951 is held with high positional accuracy based on the mounting surface 917 of the ceramic substrate main body 911. It is necessary to align the position of the member 951 and join it.
[0005]
The present invention has been made in view of such circumstances, and has a component mounting jig capable of bonding components with high positional accuracy with respect to a mounting surface of a ceramic substrate main body, and a component-mounted ceramic substrate. It is intended to provide a manufacturing method.
[0006]
Means for Solving the Problems, Functions and Effects
A solution is provided in which a housing portion for housing an electronic component is provided, a ceramic substrate body in which a mounting surface for mounting the electronic component is formed in the housing portion, and the ceramic substrate body is positioned with reference to the mounting surface. A component mounting jig for positioning and bonding the component to the ceramic substrate body when manufacturing a ceramic substrate with a component having the bonded component and And a second contact surface provided at a predetermined position with respect to the first contact surface, a component holding member having the first contact surface, and the ceramic substrate contacting the mounting surface. A third contact surface for holding the main body at a predetermined position, and a fourth contact surface provided at a predetermined position with respect to the third contact surface, wherein the fourth contact surface comes into contact with the second contact surface and Predetermined component holding member The fourth abutment surface for holding the position, a component mounting jig comprising: a substrate holding member, the having.
[0007]
The present invention provides a ceramic substrate main body in which a housing portion for housing an electronic component is provided, and a mounting surface for mounting the electronic component in the housing portion, and a component positioned and joined to the ceramic substrate main body with reference to the mounting surface. The present invention relates to a component mounting jig for positioning and joining a component to a ceramic substrate main body when manufacturing a component-attached ceramic substrate having the following. The component mounting jig has a first contact surface that contacts the component and holds the component at a predetermined position, and a second contact surface provided at a predetermined position with respect to the first contact surface. A component holding member is provided. The component mounting jig includes a third contact surface that contacts the mounting surface and holds the ceramic substrate body at a predetermined position, and a fourth contact surface that is provided at a predetermined position with respect to the third contact surface. A substrate holding member having a fourth contact surface that is a contact surface and contacts the second contact surface and holds the component holding member at a predetermined position.
[0008]
When positioning and joining the component to the ceramic substrate body, such a component mounting jig contacts the component to the first contact surface of the component holding member, and moves the component to a predetermined position with respect to the component holding member. Can be held. Further, the mounting surface of the ceramic substrate main body can be brought into contact with the third contact surface of the substrate holding member, and the ceramic substrate main body can be held at a predetermined position with respect to the substrate holding member. Further, of the component holding member, a second contact surface provided at a predetermined position with respect to the first contact surface is replaced with a second contact surface provided at a predetermined position with respect to the third contact surface of the substrate holding member. The component holding member can be held at a predetermined position with respect to the substrate holding member by making contact with the four contact surfaces.
[0009]
That is, if this component mounting jig is used, the component is brought into contact with the first contact surface, and the second contact surface and the fourth contact surface which have a predetermined positional relationship with respect to the first contact surface. And the third contact surface having a predetermined positional relationship with the fourth contact surface can be brought into contact with the mounting surface of the ceramic substrate main body. Can be accurately positioned.
Therefore, components can be bonded to the ceramic substrate main body with high positional accuracy based on the mounting surface.
[0010]
Further, in the component mounting jig, the ceramic mounting body may be pressed against a third contact surface of the substrate holding member to hold the ceramic substrate main body in a predetermined posture. It is preferable to use a component mounting jig provided with a substrate urging member for urging the substrate body.
[0011]
According to the present invention, the component mounting jig attaches the ceramic substrate main body so that the mounting surface of the ceramic substrate main body is pressed against the third contact surface of the substrate holding member to hold the ceramic substrate main body in a predetermined posture. A substrate urging member for urging the substrate.
For this reason, the ceramic substrate main body can be reliably held in a predetermined posture with respect to the substrate holding member while pressing the mounting surface of the ceramic substrate main body against the third contact surface of the substrate holding member. Therefore, since the component and the mounting surface of the ceramic substrate main body can be positioned with higher accuracy, the component can be bonded to the ceramic substrate main body with higher positional accuracy based on the mounting surface.
[0012]
Further, in the component mounting jig, the ceramic substrate main body, the substrate urging member, and the substrate are held in a state where the ceramic substrate main body is held in a predetermined posture by the substrate holding member by the substrate urging member. A component mounting jig including a fixing member for fixing the holding member may be used.
[0013]
According to the present invention, the component mounting jig includes the fixing member that fixes the ceramic substrate body in a state where the ceramic substrate main body is held in the substrate holding member in the predetermined posture by the substrate urging member.
For this reason, in a state where the ceramic substrate main body and the substrate urging member are set on the substrate holding member, the ceramic substrate main body can be more reliably held in a predetermined posture with respect to the substrate holding member. Therefore, since the component and the mounting surface of the ceramic substrate main body can be positioned with higher accuracy, the component can be bonded to the ceramic substrate main body with higher positional accuracy based on the mounting surface.
[0014]
Further, the component mounting jig according to any one of the above, wherein the component mounting jig includes a component holding member urging member for urging the component holding member toward the ceramic substrate body side. good.
[0015]
According to the present invention, the component mounting jig includes the component holding member urging member that urges the component holding member toward the ceramic substrate body.
For this reason, in a state where the component holding member is set on the board holding member, the component holding member can be reliably held in a predetermined posture with respect to the board holding member. Therefore, since the component and the mounting surface of the ceramic substrate main body can be positioned with higher accuracy, the component can be bonded to the ceramic substrate main body with higher positional accuracy based on the mounting surface.
[0016]
Further, in the component mounting jig according to any of the above, it is preferable that the component is a component mounting jig that is an optical component holding member that holds an optical component.
[0017]
According to the present invention, the component bonded to the ceramic substrate body is an optical component holding member that holds the optical component.
Optical components generally require high positional accuracy with respect to electronic components mounted on a ceramic substrate body. For this reason, when joining the optical component holding member to the ceramic substrate main body, it is necessary to join the optical component holding member to the mounting surface with high positional accuracy. Therefore, when the component is an optical component holding member that holds an optical component, it is particularly preferable to apply the component mounting jig described above.
The optical component can be appropriately selected according to the type of electronic component to be accommodated in the component-attached ceramic substrate and the purpose of use of the component-attached ceramic substrate. Examples thereof include a spherical lens, a hemispherical lens, a flat lens, and a funnel. A lens, a SELFOC microlens, and the like.
[0018]
Another solution is to provide a housing portion for housing an electronic component, a ceramic substrate body having a mounting surface on which the electronic component is mounted in the housing portion, and the ceramic substrate body having the mounting surface as a reference. A method for manufacturing a component-attached ceramic substrate, comprising: a component that is positioned and joined as a reference, with reference to a mounting surface of the ceramic substrate main body, a positioning step of aligning the position of the component with respect to the ceramic substrate main body; And a joining step of joining the component to the ceramic substrate body.
[0019]
The present invention provides a ceramic substrate main body in which a housing portion for housing an electronic component is provided, and a mounting surface for mounting the electronic component in the housing portion, and a component positioned and joined to the ceramic substrate main body with reference to the mounting surface. The present invention relates to a method for manufacturing a ceramic substrate with components provided with: In the present invention, in the positioning step, the positions of the components are adjusted with respect to the ceramic substrate main body with reference to the mounting surface of the ceramic substrate main body. Then, in the joining step, the components are joined to the ceramic substrate body.
Therefore, components can be bonded to the ceramic substrate main body with high positional accuracy based on the mounting surface of the ceramic substrate main body.
[0020]
Further, in the method of manufacturing a ceramic substrate with components described above, the positioning step includes: a first contact surface that contacts the component and holds the component at a predetermined position; A component holding member having a second abutting surface provided at a predetermined position, a third abutting surface abutting against the mounting surface and holding the ceramic substrate body at a predetermined position, and a third abutting surface. A board holding member having a fourth contact surface provided at a predetermined position with respect to the contact surface, the fourth contact surface being in contact with the second contact surface and holding the component holding member at a predetermined position; And a component mounting jig including the member, the mounting surface is brought into contact with the third contact surface, the ceramic substrate is held at a predetermined position, and the component is placed on the first contact surface. While holding the component in a predetermined position, while holding the second contact surface 3 may abut on the abutment surface and method for producing a component with a ceramic substrate for holding the component holding member at a predetermined position.
[0021]
In the present invention, a component mounting jig is used in the alignment step. That is, a component holding member having a first contact surface that contacts the component and holds the component at a predetermined position, and a second contact surface provided at a predetermined position with respect to the first contact surface; A third contact surface that contacts the surface and holds the ceramic substrate body at a predetermined position, and a fourth contact surface provided at a predetermined position with respect to the third contact surface, the second contact surface comprising: A component mounting jig including a substrate holding member having a fourth contact surface that contacts the surface and holds the component holding member at a predetermined position is prepared. Then, the mounting surface is brought into contact with the third contact surface to hold the ceramic substrate at a predetermined position, and the component is brought into contact with the first contact surface to hold the component at the predetermined position, The component holding member is held at a predetermined position by bringing the contact surface into contact with the third contact surface.
[0022]
When the positioning process is performed in this manner, the component is brought into contact with the first contact surface, and the second contact surface and the fourth contact surface having a predetermined positional relationship with respect to the first contact surface are brought into contact with each other. Further, the second contact surface having a predetermined positional relationship with the fourth contact surface can be brought into contact with the mounting surface of the ceramic substrate main body. Good positioning can be achieved.
Therefore, components can be bonded to the ceramic substrate main body with high positional accuracy based on the mounting surface of the ceramic substrate main body.
[0023]
Further, in the method for manufacturing a component-attached ceramic substrate according to any one of the above, wherein the component of the component-attached ceramic substrate is a component-attached ceramic substrate that is an optical component holding member that holds an optical component. good.
[0024]
According to the present invention, the component bonded to the ceramic substrate body is an optical component holding member that holds the optical component.
As described above, optical components require high positional accuracy with respect to the electronic components mounted on the ceramic substrate main body. Therefore, the optical component holding member is bonded to the mounting surface of the ceramic substrate main body with high positional accuracy. There must be. Therefore, when the component is an optical component holding member that holds an optical component, it is particularly preferable to apply the above-described manufacturing method.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view of the ceramic substrate with components 101 according to the present embodiment viewed from the substrate main surface 112 side, and FIG. 2 is a cross-sectional view taken along the line AA in FIG.
This ceramic substrate with components 101 is obtained by brazing an optical component holding member (component) 151 to a ceramic substrate main body 111 with an AuSn material 171 having a melting point of about 280 ° C.
[0026]
Among them, the ceramic substrate main body 111 has a substrate main surface 112 and a substrate back surface 113 located on the opposite side, and four substrate side surfaces (a first substrate side surface 114s, a second substrate side surface 114t, and a third substrate side surface) connecting these surfaces. 114u and a fourth substrate side surface 114v). The size of the outer shape is about 13.21 mm × about 7.37 mm × about 4.32 mm.
[0027]
The ceramic substrate main body 111 is provided with a housing 115 for housing a photodiode, a laser diode, a phototransistor, and the like (electronic components) (not shown). A mounting surface 117 for mounting the electronic component is formed in the housing 115. The accommodating portions 115 are open on the substrate main surface 112 side and the first substrate side surface 114s side, respectively. The size of the opening on the substrate main surface 112 side is about 8.00 mm × about 5.72 mm, and the size of the opening on the first substrate side surface 114s side is about 3.20 mm in width × about 3.12 mm in height. The height from the mounting surface 117 to the substrate main surface 112 (the depth of the housing 115) is about 3.035 mm. On the mounting surface 117, a mounting surface metallization layer 119 connected to the electronic component is formed in a substantially rectangular shape in plan view. The mounting surface metallization layer 119 is made of tungsten, and its surface is coated with Ni plating and further plated with Au.
[0028]
On the substrate main surface 112 of the ceramic substrate main body 111, a main surface metallization layer 121 is formed in a substantially square shape in plan view. Then, on the main surface metallization layer 121, a ring 123 made of Kovar having a substantially square shape in plan view has a melting point of about 780 ° C. in order to seal the housing 115 with a lid (lid) after mounting electronic components. AgCu material is soldered. A side surface metallization layer (not shown) is formed on substantially the entire surface of the first substrate side surface 114s to join the optical component holding member 151 thereto. A side surface metallization layer (not shown) having a predetermined pattern serving as a terminal is formed on the second substrate side surface 114t and the fourth substrate side surface 114v. The substrate main surface 112 and the like are partially coated with an alumina coat (not shown).
[0029]
Next, the inside will be described. The ceramic substrate body 111 is composed of ten ceramic layers made of alumina ceramic. Of these, holes corresponding to the housing portion 115 are formed in the seven ceramic layers on the substrate main surface 112 side, forming a wall of the housing portion 115. On the other hand, the three ceramic layers on the back surface 113 of the substrate constitute the bottom of the housing 115.
Among these ceramic layers, a metallized layer (predetermined pattern) is provided between the fifth ceramic layer and the sixth ceramic layer from the substrate main surface 112 side, that is, on the main surface of the sixth ceramic layer. (Not shown). A metallized layer (not shown) of a predetermined pattern is formed between the sixth ceramic layer and the seventh ceramic layer from the substrate main surface 112 side, that is, also on the main surface of the seventh ceramic layer. Have been. Further, as described above, the metallized surface of the predetermined pattern is provided between the seventh ceramic layer and the eighth ceramic layer from the substrate main surface 112 side, that is, both the eighth ceramic layer and the main surface. A layer 119 is formed.
[0030]
On the other hand, in the component-attached ceramic substrate 101, the optical component holding member 151 has a spherical lens 155 attached to a hole of a metal fitting 153 made of substantially cylindrical Kovar. The optical component holding member 151 is joined to the side metallization layer on the first substrate side surface 114s so as to close the opening on the first substrate side surface 114s side of the ceramic substrate main body 111.
The optical component holding member 151 is joined with high positional accuracy with reference to the mounting surface 117 of the ceramic substrate main body 111. That is, the distance (height) h from the mounting surface 117 to the center of the spherical lens 155 of the optical component holding member 151 is 0.916 mm, and the error is within 0.05 mm.
[0031]
Such a ceramic substrate 101 with components is manufactured as follows.
That is, first, the ceramic substrate main body 111 is manufactured by a known method. That is, after the main part of the ceramic substrate main body 111 is manufactured in accordance with a known method for manufacturing a ceramic substrate, the ring 123 is soldered to the main surface 112 of the substrate with an AgCu material. Then, by sequentially performing Ni plating and Au plating, the ceramic substrate main body 111 is completed. Further, an optical component holding member 151 in which the spherical lens 155 is attached to the metal fitting 153 is also prepared.
[0032]
Meanwhile, a component mounting jig 201 shown in FIGS. 3 to 13 and 21 is prepared. The component mounting jig 201 includes a board holding member 211 shown in FIGS. 3 to 5, a component holding member 231 shown in FIGS. 6 to 8, a board urging member 251 shown in FIGS. 12 and 13 and a component holding member urging member 291 shown in FIG.
[0033]
Describing each member in order, the substrate holding member 211 includes a main surface 212, a back surface 213 on the opposite side, and four side surfaces (a first side surface 214s, a second side surface 214t, a third side surface 214u, and a fourth side surface). 214v). 3 is a plan view seen from the main surface 212 side, FIG. 4 is a sectional view taken along the line AA in FIG. 3, and FIG. 5 is a plan view seen from the first side surface 214s side.
The substrate holding member 211 is formed with a step-like accommodation portion 215 that opens on the main surface 212 side and the first side surface 214s side. Therefore, as described later, the ceramic substrate main body 111 and the substrate urging member 251 can be placed from the main surface 212 side, and the component holding member 231 can be inserted from the first side surface 214s side.
[0034]
A substantially rectangular parallelepiped protruding portion 217 protruding from the bottom surface of the housing portion 215 toward the main surface 212 is formed substantially at the center of the housing portion 215. The top surface of the protrusion 217 is a third contact surface 219 with which the mounting surface 117 of the ceramic substrate main body 111 contacts when the ceramic substrate with components 101 is manufactured. The third contact surface 219 is coated with a polyimide resin having a thickness of about 15 μm. This resin is obtained by applying paste-form polyimide on the third contact surface 219 and curing the same.
[0035]
With the third contact surface 219 and the wall surface of the housing 215, when the ceramic substrate main body 111 is placed on the housing 215, the ceramic substrate main body 111 can be held at a predetermined position.
Further, a fourth contact surface 221 with which a second contact surface 233 of a component holding member 231 described later contacts is formed on the back surface 213 side of the opening on the first side surface 214s side of the housing portion 215. Therefore, when a component holding member 231 described later is inserted into the housing portion 215, the component holding member 231 can be held at a predetermined position.
[0036]
The component holding member 231 has a substantially rectangular parallelepiped shape having a main surface 232, a back surface 233 on the opposite side, and four side surfaces (a first side surface 234s, a second side surface 234t, a third side surface 234u, and a fourth side surface 234t) connecting these. is there. 6 is a plan view as viewed from the first side surface 234s side, FIG. 7 is a cross-sectional view along AA in FIG. 6, and FIG. 8 is a plan view as viewed from the second side surface 234t side. The back surface 233 of the component holding member 231 is also a second contact surface 233 that contacts the fourth contact surface 221 of the board holding member 211 described above. At a substantially center of the first side surface 234s of the component holding member 231, a circular concave portion 235 in a plan view is formed. The inner peripheral surface of the concave portion 235 is a first contact surface 237 with which the optical component holding member 151 contacts. At a substantially center of the recess 235, a columnar projection 239 projecting from the bottom surface of the recess 235 toward the first side surface 234s is formed. Therefore, when the optical component holding member 151 is inserted into the concave portion 235, the optical component holding member 151 can be brought into contact with the first contact surface 237 to hold the optical component holding member 151 at a predetermined position. .
[0037]
The substrate urging member 251 has a substantially rectangular parallelepiped shape having a main surface 252, a back surface 253 opposite thereto, and four side surfaces (first side surface 254s, second side surface 254t, third side surface 254u, and fourth side surface 254v) connecting these. It is. 9 is a plan view as viewed from the main surface 252 side, FIG. 10 is a plan view as viewed from the first side surface 254s side, and FIG. 11 is a plan view as viewed from the fourth side surface 254v side. Of these, the back surface 253 is a surface for abutting on the substrate back surface 113 of the above-described ceramic substrate main body 111 to bias the ceramic substrate main body 111. On the other hand, on the main surface 252, a substantially rectangular projecting portion 255 in a plan view is formed, which is connected from substantially the center to the first side surface 254s. The protruding portion 255 is a portion where a fixing member 271 described later contacts. In the substrate urging member 251, two through holes 257 having an oval shape in a plan view penetrating between the main surface 252 and the back surface 253 are formed on both sides of the protrusion 255 in parallel with the protrusion 255. I have.
[0038]
The fixing member 271 has a main surface 272, a back surface 273 opposite to the main surface 272, and four side surfaces (a first side surface 274s, a second side surface 274t, a third side surface 274u, and a fourth side surface 274v) connecting the main surface 272 and the opposite surface. It has a rectangular parallelepiped shape. FIG. 12 is a plan view as viewed from the main surface 272 side, and FIG. 13 is a plan view as viewed from the first side surface 274s side. The fixing member 271 has a large through hole 275 having a substantially rectangular shape in a plan view and penetrating between the main surface 272 and the back surface 273. Accordingly, the fixing member 271 has a ring shape with a square shape in plan view.
[0039]
The component holding member urging member 291 is composed of two separate members as shown in FIG. Each member is formed in a substantially U-shape by bending a flat metal plate at two locations.
[0040]
Next, the optical component holding member 151 is joined to the ceramic substrate main body 111 using such a component mounting member 201.
First, in the alignment step, as shown in FIG. 14 as a plan view as viewed from above (the main surface 212 side of the substrate holding member 211) and FIG. 15 as an AA sectional view in FIG. Set 111. That is, with the substrate main surface 102 of the ceramic substrate body 111 facing downward and the first substrate side surface 114s of the ceramic substrate body 111 facing the first side surface 214s side of the substrate holding member 211, The ceramic substrate main body 111 is placed at a predetermined position substantially at the center of the ceramic substrate 215. Then, the mounting surface 117 of the ceramic substrate main body 111 is brought into contact with the third contact surface 219 which is the top surface of the protruding portion 217 of the substrate holding member 211, and the ceramic substrate main body 111 is placed at a predetermined position in the accommodation portion 215. Hold. At this time, since the third contact surface 219 is coated with a resin, the mounting surface metallization layer 119 is not easily scratched.
[0041]
Next, the substrate urging member 251 is set on the substrate holding member 211 as shown in a plan view seen from above in FIG. 16 and an AA sectional view in FIG. 16 in FIG. That is, with the back surface 253 of the substrate urging member 251 facing downward and the first side surface 254s of the substrate urging member 251 facing the first side surface 214s side of the substrate holding member 211, the housing portion 215 of the substrate holding member 211 is placed. The substrate urging member 251 is placed at a predetermined position in the inside. Then, the back surface 253 of the substrate urging member 251 is brought into contact with the back surface 113 of the ceramic substrate main body 111, and the ceramic substrate main body 111 is urged (downward) by the weight of the substrate urging member 251 to the substrate holding member 211. Accordingly, the ceramic substrate main body 111 is reliably held in a predetermined posture with respect to the substrate holding member 211 with the mounting surface 117 pressing the third contact surface 219.
[0042]
Next, the substrate holding member 211 on which the ceramic substrate main body 111 and the substrate urging member 251 are set is fixed with the fixing member 271 as shown in FIG. I do. That is, the ring-shaped fixing member 271 is fitted from the first side surface 214s side of the substrate holding member 211. Then, the inner peripheral surface of the through hole 275 of the fixing member 271 is brought into contact with the protruding portion 255 of the substrate urging member 251, and is also brought into contact with the back surface 213 of the substrate holding member 211. The urging member 251 is fixed to the substrate holding member 211. Thus, the ceramic substrate main body 111 is more reliably held in the predetermined posture with respect to the substrate holding member 211.
[0043]
Next, the optical component holding member 151 is set on the component holding member 231 (see FIG. 21). That is, a part of the optical component holding member 151 is inserted into the concave portion 235 of the component holding member 231. Then, the optical component holding member 151 is brought into contact with the first contact surface 237 which is the inner peripheral surface of the concave portion 235, and the optical component holding member 151 is held at a predetermined position with respect to the component holding member 231.
[0044]
Next, as shown in a plan view seen from above in FIG. 20 and a cross-sectional view taken along the line AA in FIG. 20, the component holding member 231 in which the optical component holding member 151 is inserted is fixed by a fixing member 271. It is set on the holding member 211. That is, the optical component holding member 151 inserted into the component holding member 231 is directed toward the first side surface 214s of the substrate holding member 211, and the component holding member 231 is inserted into the housing portion 215 of the substrate holding member 211 from the first side surface 214s side. I do. Then, the second contact surface 233 which is the back surface of the component holding member 231 is brought into contact with the fourth contact surface 221 of the board holding member 211, and the component holding member 231 is positioned at a predetermined position with respect to the board holding member 211. Hold.
[0045]
Next, as shown in a plan view seen from above in FIG. 22, the component holding member 231 is fixed to the substrate holding member 211 using the component holding member urging member 291. That is, one end of each of the two component holding member fixing members 291 bent at two locations is brought into contact with the fourth side surface 234v of the component holding member 231, and the other end side of the substrate holding member 211 is used as the other end. The component holding member 231 is urged toward the board holding member 211 by making contact with the third side surface 214u. As a result, the component holding member 231 is securely held in a predetermined posture with respect to the board holding member 211.
Thus, the setting of the ceramic substrate main body 111 and the optical component holding member 151 to the component mounting member 201 is completed. The optical component holding member 151 is accurately positioned with respect to the mounting surface 117 of the ceramic substrate main body 111.
[0046]
Next, in the joining step, the component mounting member 201 and the like are placed in a reflow furnace, and the ceramic substrate main body 111 and the optical component holding member 151 are heated and brazed. Then, the above-described ceramic substrate with components 101 is completed.
Thereafter, the component holding member urging member 291, the component holding member 231, the fixing member 271, and the substrate urging member 251 may be sequentially removed, and the component-attached ceramic substrate 101 may be taken out of the substrate holding member 211.
Thus, the ceramic substrate with components 101 is manufactured.
[0047]
As described above, when the component mounting jig 201 of the present embodiment positions and joins the optical component holding member 151 to the ceramic substrate main body 111, the optical component holding member 151 is moved to the first position of the component holding member 231. The optical component holding member 151 can be held at a predetermined position with respect to the component holding member 231 by making contact with the contact surface 237. Further, the mounting surface 117 of the ceramic substrate main body 111 is brought into contact with the third contact surface 219 of the substrate holding member 211, so that the ceramic substrate main body 111 can be held at a predetermined position with respect to the substrate holding member 211. Further, the second contact surface 233 provided at a predetermined position with respect to the first contact surface 237 of the component holding member 231 is moved to a predetermined position with respect to the third contact surface 219 of the substrate holding member 211. The component holding member 231 can be held at a predetermined position with respect to the substrate holding member 211 by making contact with the fourth contact surface 221 provided on the substrate.
[0048]
That is, if the component mounting jig 201 is used, the optical component holding member 151 and the first contact surface 237 are brought into contact with each other, and the second contact with a predetermined positional relationship with the first contact surface 237 is provided. The surface 233 is brought into contact with the fourth contact surface 221, and the third contact surface 219 having a predetermined positional relationship with the fourth contact surface 221 is brought into contact with the mounting surface 117 of the ceramic substrate body 111. Accordingly, the optical component holding member 151 and the mounting surface 117 of the ceramic substrate main body 111 can be accurately positioned.
Therefore, the optical component holding member 151 can be joined to the ceramic substrate main body 111 with high positional accuracy based on the mounting surface 117.
[0049]
Furthermore, in this embodiment, since the component mounting jig 201 includes the substrate urging member 251, the mounting surface 117 of the ceramic substrate main body 111 is pressed against the third contact surface 219 of the substrate holding member 211 while the ceramic substrate is pressed. The main body 111 can be reliably held in a predetermined posture. Therefore, the optical component holding member 151 and the mounting surface 117 of the ceramic substrate main body 111 can be positioned with higher accuracy. Therefore, the optical component holding member 151 can be bonded to the ceramic substrate main body 111 with higher positional accuracy based on the mounting surface 117.
[0050]
In this embodiment, since the component mounting jig 201 includes the fixing member 271, the ceramic substrate main body 111 is set in a predetermined posture with the ceramic substrate main body 111 and the substrate urging member 251 set on the substrate holding member 211. Can be held more reliably. Therefore, the optical component holding member 151 and the mounting surface 117 of the ceramic substrate main body 111 can be positioned with higher accuracy, so that the optical component holding member 151 can be positioned with higher positional accuracy with respect to the mounting surface 117 with respect to the ceramic substrate main body. 111.
[0051]
In the present embodiment, since the component mounting jig 201 includes the component holding member urging member 291, the component holding member 231 is set in a predetermined posture with the component holding member 231 set on the substrate holding member 211. It can be securely held. Therefore, the optical component holding member 151 and the mounting surface 117 of the ceramic substrate main body 111 can be positioned with higher accuracy, so that the optical component holding member 151 can be positioned with higher positional accuracy with respect to the mounting surface 117 with respect to the ceramic substrate main body. 111.
[0052]
In the present embodiment, the component bonded to the ceramic substrate main body 111 is the optical component holding member 151 that holds the spherical lens (optical component) 155. Therefore, it is particularly important to join the optical component holding member 151 to the ceramic substrate main body 111 with high positional accuracy with respect to the mounting surface 117 using the above-described component mounting jig 201.
[0053]
In the manufacturing method of the present embodiment, in the positioning step, the position of the optical component holding member 151 is adjusted with respect to the ceramic substrate main body 111 with reference to the mounting surface 117 of the ceramic substrate main body 111. Then, in the joining step, the optical component holding member 151 is joined to the ceramic substrate main body 111. Therefore, the optical component holding member 151 can be joined to the ceramic substrate main body 111 with high positional accuracy with reference to the mounting surface 117 of the ceramic substrate main body 111.
[0054]
Further, since the component mounting jig 201 is used in the positioning process, the optical holding member 151 and the first contact surface 237 are brought into contact with each other, and the first holding surface 237 is in a predetermined positional relationship with the first contact surface 237. The second contact surface 233 and the fourth contact surface 221 are brought into contact with each other, and the third contact surface 219 and the mounting surface 117 of the ceramic substrate main body 111 which are in a predetermined positional relationship with respect to the fourth contact surface 221. Can be abutted. For this reason, the optical component holding member 151 and the mounting surface 117 of the ceramic substrate main body 111 can be accurately positioned. Therefore, the optical component holding member 151 can be joined to the ceramic substrate main body 111 with high positional accuracy with reference to the mounting surface 117 of the ceramic substrate main body 111.
[0055]
Particularly, in the present embodiment, the component to be joined to the ceramic substrate main body 111 is the optical component holding member 151 that holds the spherical lens (optical component) 155. It is particularly important to join the optical component holding member 151 to the ceramic substrate main body 111 with high precision.
[0056]
In the above, the present invention has been described in accordance with the embodiments. However, it is needless to say that the present invention is not limited to the above embodiments, and can be appropriately modified and applied without departing from the gist thereof.
For example, in the above-described embodiment, the one that holds the spherical lens 155 as the optical component holding member 151 has been described. An optical component holding member for holding components can also be joined to the ceramic substrate main body 111.
[Brief description of the drawings]
FIG. 1 is a plan view of a component-attached ceramic substrate viewed from a substrate main surface side according to an embodiment.
FIG. 2 is a cross-sectional view of the ceramic substrate with components according to the embodiment, taken along the line AA in FIG. 1;
FIG. 3 is a plan view of the component mounting jig according to the embodiment as viewed from a main surface side of a substrate holding member.
FIG. 4 is a cross-sectional view of the board holding member of the component mounting jig according to the embodiment, taken along the line AA in FIG. 3;
FIG. 5 is a plan view of the component mounting jig according to the embodiment as viewed from the first side surface of the substrate holding member.
FIG. 6 is a plan view of the component holding jig according to the embodiment as viewed from the first side surface of the component holding member.
7 is a cross-sectional view of the component holding member according to the embodiment, taken along the line AA in FIG. 6, of the component holding member.
FIG. 8 is a plan view of the component holding jig according to the embodiment as viewed from the second side surface of the component holding member.
FIG. 9 is a plan view of the component mounting jig according to the embodiment as viewed from the main surface side of the substrate urging member.
FIG. 10 is a plan view of the component mounting jig according to the embodiment as viewed from the first side surface of the substrate urging member.
FIG. 11 is a plan view of the board urging member of the component mounting jig according to the embodiment, as viewed from the third side surface side.
FIG. 12 is a plan view of the component mounting jig according to the embodiment as viewed from the main surface side of the fixing member.
FIG. 13 is a plan view of a fixing member of the component mounting jig according to the embodiment as viewed from a first side surface of a fixing member.
FIG. 14 is a plan view of the method of manufacturing the ceramic substrate with components according to the embodiment, as viewed from above, in a state where the ceramic substrate main body is placed on the substrate holding member.
FIG. 15 is a cross-sectional view taken along the line AA of FIG. 14 showing a state in which the ceramic substrate main body is mounted on the substrate holding member in the method of manufacturing the ceramic substrate with components according to the embodiment.
FIG. 16 is a plan view showing a state in which a substrate urging member is mounted on a substrate holding member, as viewed from above, in the method of manufacturing a ceramic substrate with components according to the embodiment.
FIG. 17 is a cross-sectional view taken along the line AA in FIG. 16 showing a state in which the substrate urging member is mounted on the substrate holding member in the method of manufacturing the ceramic substrate with components according to the embodiment.
FIG. 18 is a plan view of a state in which a fixing member is attached to a substrate holding member or the like, as viewed from above, in the method of manufacturing the ceramic substrate with components according to the embodiment.
19 is a cross-sectional view taken along the line AA in FIG. 18 showing a state in which a fixing member is attached to a substrate holding member or the like in the method for manufacturing a ceramic substrate with components according to the embodiment.
FIG. 20 is a plan view of the method for manufacturing the component-attached ceramic substrate according to the embodiment, showing a state where the component holding member holding the optical holding member is inserted into the board holding member or the like, as viewed from above.
FIG. 21 is a cross-sectional view taken along the line AA in FIG. 20, showing a state in which the component holding member holding the optical holding member is inserted into the board holding member or the like in the method of manufacturing the ceramic substrate with components according to the embodiment.
FIG. 22 is a plan view of the method of manufacturing the component-attached ceramic substrate according to the embodiment, as viewed from above, in a state where the component holding member and the like are urged by the component holding member fixing member.
FIG. 23 is a simplified plan view of a ceramic board with components according to the related art, viewed from the main surface side of the board.
FIG. 24 is a simplified AA cross-sectional view of the ceramic substrate with components according to the prior art in FIG. 23;
[Explanation of symbols]
101 Ceramic substrate with components 111 Ceramic substrate main body 115 Housing 117 Mounting surface 151 Optical component holding member (component)
153 Spherical lens (optical parts)
201 Component mounting jig 211 Board holding member 219 Third contact surface 221 Fourth contact surface 231 Component holding member 233 Second contact surface 237 First contact surface 251 Board urging member 271 Fixed member 291 Component holding member Biasing member

Claims

A housing portion for housing the electronic component is provided, and a ceramic substrate body having a mounting surface for mounting the electronic component in the housing portion,
A component positioned and joined to the ceramic substrate body with reference to the mounting surface,
A component mounting jig for positioning and joining the component to the ceramic substrate body upon manufacturing a component-equipped ceramic substrate comprising:
A component holding member having a first contact surface that contacts the component and holds the component at a predetermined position, and a second contact surface provided at a predetermined position with respect to the first contact surface; A third contact surface that contacts the mounting surface and holds the ceramic substrate main body at a predetermined position, and a fourth contact surface provided at a predetermined position with respect to the third contact surface, A board holding member having a fourth contact surface that contacts the second contact surface and holds the component holding member at a predetermined position;
A jig for mounting components, comprising:

The component mounting jig according to claim 1, wherein
A component comprising a substrate urging member for urging the ceramic substrate body so as to press the mounting surface of the ceramic substrate body against a third contact surface of the substrate holding member and hold the ceramic substrate body in a predetermined posture. Mounting jig.

The component mounting jig according to claim 2, wherein
A component mounting jig including a fixing member for fixing the ceramic substrate main body, the substrate urging member, and the substrate holding member in a state where the ceramic substrate main body is held in a predetermined posture by the substrate holding member by the substrate urging member. Utensils.

It is a component mounting jig according to any one of claims 1 to 3,
A component mounting jig comprising a component holding member urging member for urging the component holding member toward the ceramic substrate body.

The component mounting jig according to any one of claims 1 to 4, wherein
The component is a component mounting jig that is an optical component holding member that holds an optical component.

A housing portion for housing the electronic component is provided, and a ceramic substrate body having a mounting surface for mounting the electronic component in the housing portion,
A component positioned and joined to the ceramic substrate body with reference to the mounting surface,
A method for manufacturing a ceramic substrate with components comprising:
An alignment step of aligning the position of the component with respect to the ceramic substrate body with reference to the mounting surface of the ceramic substrate body,
A joining step of joining the component to the ceramic substrate body,
A method for manufacturing a ceramic substrate with components comprising:

It is a manufacturing method of the ceramic board with components of Claim 6, Comprising:
The positioning step includes:
A component holding member having a first contact surface that contacts the component and holds the component at a predetermined position, and a second contact surface provided at a predetermined position with respect to the first contact surface;
A third contact surface that contacts the mounting surface and holds the ceramic substrate body at a predetermined position, and a fourth contact surface provided at a predetermined position with respect to the third contact surface, A board holding member having a fourth contact surface that contacts the second contact surface and holds the component holding member at a predetermined position;
Using a component mounting jig with
While holding the ceramic substrate in a predetermined position by bringing the mounting surface into contact with the third contact surface,
The component is held in a predetermined position by contacting the component with the first contact surface, and the component holding member is held in a predetermined position by contacting the second contact surface with the third contact surface. A method for manufacturing a ceramic substrate with components to be held in position.

The method of manufacturing a ceramic substrate with components according to claim 6, wherein the component of the ceramic substrate with components is an optical component holding member that holds an optical component.