[go: up one dir, main page]

JP2004095751A - Electronic circuit module - Google Patents

Electronic circuit module Download PDF

Info

Publication number
JP2004095751A
JP2004095751A JP2002253152A JP2002253152A JP2004095751A JP 2004095751 A JP2004095751 A JP 2004095751A JP 2002253152 A JP2002253152 A JP 2002253152A JP 2002253152 A JP2002253152 A JP 2002253152A JP 2004095751 A JP2004095751 A JP 2004095751A
Authority
JP
Japan
Prior art keywords
circuit module
electronic circuit
core
coil
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002253152A
Other languages
Japanese (ja)
Inventor
Kazuhiro Nakayama
中山 一博
Keizo Watanabe
渡辺 敬三
Shuichi Matsuura
松浦 修一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HIKARI DENSHI KK
Toko Inc
Original Assignee
HIKARI DENSHI KK
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HIKARI DENSHI KK, Toko Inc filed Critical HIKARI DENSHI KK
Priority to JP2002253152A priority Critical patent/JP2004095751A/en
Publication of JP2004095751A publication Critical patent/JP2004095751A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that, since a conventional electronic circuit module is configured by arranging individual circuit components in a plane, the mounting area of electronic equipment at the time of mounting it on a printed circuit board is increased. <P>SOLUTION: This electronic circuit module is provided with a drum core 10 whose both edges are provided with flanges 11 and 12, a coil 15 wound around the core 10, a plurality of terminal electrodes 20 equipped with an integrally formed element connecting part 21 which is fixed to the surface of one flange 11 or 12 of the core, and an electronic component 40 configuring an electric circuit with the coil 15. A lead wire 15a of the coil 15 is connected to the terminal 20, and the electronic component 40 is electrically connected and attached to the element connecting part 21. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、ビデオカメラ等の携帯型電子機器の電源部に用いるのに適した電子回路モジュールに係り、インダクタ又はトランスと、その他の回路部品をコンパクトに一体化した表面実装型の電子回路モジュールに関するものである。
【0002】
【従来の技術】
従来の電子回路モジュールとしては、たとえば図7に示すようなものがある。これは、図示しない導体パターンが設けられた基板1の上面に、インダクタ2やIC(集積回路装置)3、抵抗4等の電子部品を取り付けたものである。
【0003】
【発明が解決しようとする課題】
この電子回路モジュールは個別の電子部品を平面的に配置した構成なので、電子機器のプリント基板に取付ける際の実装面積が大きくなる問題があった。
【0004】
【課題を解決するための手段】
本発明の電子回路モジュールは、両端に鍔11、12を有するドラム型のコア10と、コア10に巻回されたコイル15と、一体に成形された素子接続部21を有し素子接続部21をコアの一方の鍔11、12の表面に固定した複数の端子電極20と、コイル10と共に電気回路を構成する電子部品40とを備え、コイル15のリード線15aを端子電極20に接続するとともに、素子接続部21に電子部品40を電気的に接続して取付けた構成を特徴とする。
【0005】
【実施例】
図1〜図3に本発明の電子回路モジュールの一実施例を示す。両端に鍔11、12を有するドラム型のコア10にはコイル15を巻回してある。図3の下面図に示すように、複数の端子電極20の一端部には素子接続部21をそれぞれ一体に成形してある。また、端子電極20のうちの2本には、図1及び図2に示すように、上方に折り曲げたコイル接続部22をさらに一体成形してある。コイル接続部22にはコイル15のリード線15aが接続されている。
【0006】
絶縁性の樹脂からなるベース30の上面には円形の浅い窪み31を設け、下面には四角形の凹部32を形成してある。ベース30は、それぞれの端子電極20の一部を内部に埋め込んで植設した状態に成形してある。端子電極20の素子接続部21は、窪み31及び凹部32の底部にそれぞれ露出している。これらの素子接続部21は、窪み31の中に挿入されたコア10の下側の鍔12の下面に接着してある。
【0007】
ベース30の下面に設けた凹部32の中には電子部品40を取付けてある。電子部品40は端子電極20の素子接続部21に電気的に接続してあり、コイル15と共に電気回路を構成する。実施例には、電子部品40としてICのベアチップをフリップチップ実装した例を示してある。ICの他にコンデンサや抵抗等の電子部品を取付けてもよい。
【0008】
ベース30の外部に露出した部分の端子電極20は、ベース30の表面に沿って折り曲げ成形してあり、ベース30の側面から底面まで延びている。なお、端子電極20を埋め込んだベース30の成形工程や、端子電極20とコア10の接着工程は、個別の端子電極20に切り離される前のリードフレームの状態で行うとよい。また、凹部32の中に樹脂を充填して電子部品40を樹脂内に封じ込めた構成としてもよい。
【0009】
図4〜図6は本発明の他の実施例を示している。この実施例は、前述の電子回路モジュールにおけるコア10と電子部品40の位置関係を上下逆にするとともに、ベース30を用いず、端子電極20の一部を除く電子回路モジュール全体を絶縁性の樹脂50で封止したもので、他の部分の構成はほぼ同様である。
【0010】
【発明の効果】
本発明によれば、DC−DCコンバータやインバータの回路の大部分、例えば大型の外付けコンデンサ以外の、インダクタまたはトランスと、その他の周辺回路部品を一体化した小型で薄型の電子回路モジュールを構成できる。
【図面の簡単な説明】
【図1】本発明の電子回路モジュールの第1実施例を示す正面断面図
【図2】同、斜視図
【図3】同、下面図
【図4】本発明の電子回路モジュールの第2実施例を示す正面断面図
【図5】同、斜視図
【図6】樹脂50を省いて示す同電子回路モジュール要部の平面図
【図7】従来の電子回路モジュールの斜視図
【符号の説明】
10 コア
20 端子電極
21 素子接続部
30 ベース
40 電子部品
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic circuit module suitable for use in a power supply unit of a portable electronic device such as a video camera, and more particularly to a surface-mounted electronic circuit module in which an inductor or a transformer and other circuit components are compactly integrated. Things.
[0002]
[Prior art]
As a conventional electronic circuit module, for example, there is one as shown in FIG. In this embodiment, electronic components such as an inductor 2, an IC (integrated circuit device) 3, and a resistor 4 are mounted on the upper surface of a substrate 1 provided with a conductor pattern (not shown).
[0003]
[Problems to be solved by the invention]
Since this electronic circuit module has a configuration in which individual electronic components are arranged in a plane, there has been a problem that a mounting area when mounting the electronic circuit module on a printed circuit board of an electronic device becomes large.
[0004]
[Means for Solving the Problems]
The electronic circuit module of the present invention has a drum-shaped core 10 having flanges 11 and 12 at both ends, a coil 15 wound around the core 10, and an element connection part 21 integrally formed. A plurality of terminal electrodes 20 that are fixed to the surface of one of the flanges 11 and 12 of the core, and an electronic component 40 that forms an electric circuit together with the coil 10. The lead wire 15 a of the coil 15 is connected to the terminal electrode 20. The electronic component 40 is electrically connected to and attached to the element connecting portion 21.
[0005]
【Example】
1 to 3 show an embodiment of an electronic circuit module according to the present invention. A coil 15 is wound around a drum-shaped core 10 having flanges 11 and 12 at both ends. As shown in the bottom view of FIG. 3, the element connection portions 21 are integrally formed at one end of the plurality of terminal electrodes 20, respectively. As shown in FIGS. 1 and 2, two of the terminal electrodes 20 are further integrally formed with a coil connection portion 22 bent upward. The lead wire 15 a of the coil 15 is connected to the coil connection part 22.
[0006]
A circular shallow depression 31 is provided on the upper surface of the base 30 made of an insulating resin, and a square concave portion 32 is formed on the lower surface. The base 30 is formed in a state where a part of each of the terminal electrodes 20 is embedded and implanted therein. The element connection portion 21 of the terminal electrode 20 is exposed at the bottom of the depression 31 and the bottom of the recess 32, respectively. These element connection portions 21 are bonded to the lower surface of the lower flange 12 of the core 10 inserted into the recess 31.
[0007]
An electronic component 40 is mounted in a concave portion 32 provided on the lower surface of the base 30. The electronic component 40 is electrically connected to the element connection portion 21 of the terminal electrode 20 and forms an electric circuit together with the coil 15. In the embodiment, an example in which an IC bare chip is flip-chip mounted as the electronic component 40 is shown. Electronic components such as capacitors and resistors may be attached in addition to the IC.
[0008]
The portion of the terminal electrode 20 that is exposed to the outside of the base 30 is bent along the surface of the base 30 and extends from the side surface to the bottom surface of the base 30. Note that the step of forming the base 30 in which the terminal electrodes 20 are embedded and the step of bonding the terminal electrodes 20 to the core 10 may be performed in a state of the lead frame before being separated into individual terminal electrodes 20. Further, the electronic component 40 may be sealed in the resin by filling the recess 32 with resin.
[0009]
4 to 6 show another embodiment of the present invention. In this embodiment, the positional relationship between the core 10 and the electronic component 40 in the electronic circuit module described above is turned upside down. It is sealed at 50, and the configuration of other parts is almost the same.
[0010]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the small and thin electronic circuit module which integrated most of the circuit of a DC-DC converter and an inverter, for example, other than a large external capacitor, an inductor or a transformer, and other peripheral circuit components is comprised. it can.
[Brief description of the drawings]
FIG. 1 is a front sectional view showing a first embodiment of an electronic circuit module according to the present invention; FIG. 2 is a perspective view thereof; FIG. 3 is a bottom view thereof; FIG. FIG. 5 is a front cross-sectional view showing an example. FIG. 6 is a perspective view. FIG. 6 is a plan view of a main part of the electronic circuit module, omitting a resin 50. FIG. 7 is a perspective view of a conventional electronic circuit module.
DESCRIPTION OF SYMBOLS 10 Core 20 Terminal electrode 21 Element connection part 30 Base 40 Electronic component

Claims (3)

両端に鍔を有するドラム型のコアと、該コアに巻回されたコイルと、一体に成形された素子接続部を有し該素子接続部をコアの一方の鍔の表面に固定した複数の端子電極と、電子部品とを備え、コイルのリード線を端子電極に接続するとともに、素子接続部に電子部品を電気的に接続して取付けたことを特徴とする電子回路モジュール。A plurality of terminals having a drum-type core having flanges at both ends, a coil wound around the core, and an element connection portion formed integrally, and having the element connection portion fixed to the surface of one flange of the core. An electronic circuit module comprising: an electrode; and an electronic component, wherein a lead wire of a coil is connected to a terminal electrode, and an electronic component is electrically connected to and attached to an element connection portion. 該コアを上面に取付けた絶縁性の樹脂からなるベースを設け、該ベースの下面に形成した凹部内に素子接続部を露出させて端子電極をベースに植設し、電子部品を該凹部内に配置した請求項1の電子回路モジュール。A base made of an insulating resin having the core attached to the upper surface is provided, and the element connection portion is exposed in a concave portion formed on the lower surface of the base, and a terminal electrode is planted on the base, and the electronic component is placed in the concave portion. 2. The electronic circuit module according to claim 1, wherein the electronic circuit module is arranged. 端子電極の一部を除く電子回路モジュール全体を絶縁性の樹脂で封止した請求項1の電子回路モジュール。2. The electronic circuit module according to claim 1, wherein the entire electronic circuit module except a part of the terminal electrode is sealed with an insulating resin.
JP2002253152A 2002-08-30 2002-08-30 Electronic circuit module Pending JP2004095751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002253152A JP2004095751A (en) 2002-08-30 2002-08-30 Electronic circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002253152A JP2004095751A (en) 2002-08-30 2002-08-30 Electronic circuit module

Publications (1)

Publication Number Publication Date
JP2004095751A true JP2004095751A (en) 2004-03-25

Family

ID=32059237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002253152A Pending JP2004095751A (en) 2002-08-30 2002-08-30 Electronic circuit module

Country Status (1)

Country Link
JP (1) JP2004095751A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008118021A (en) * 2006-11-07 2008-05-22 Seiko Epson Corp Semiconductor module and manufacturing method thereof
JP2014072350A (en) * 2012-09-28 2014-04-21 Sanken Electric Co Ltd Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008118021A (en) * 2006-11-07 2008-05-22 Seiko Epson Corp Semiconductor module and manufacturing method thereof
JP2014072350A (en) * 2012-09-28 2014-04-21 Sanken Electric Co Ltd Semiconductor device

Similar Documents

Publication Publication Date Title
US5926373A (en) Encapsulated, board-mountable power supply and method of manufacture
US6373714B1 (en) Surface mounting part
JP5934154B2 (en) Substrate structure on which electronic components are mounted and method for manufacturing the same
WO2006070722A1 (en) Noise filter
TW201743345A (en) Electronic module and method for forming package structure thereof
US8659383B2 (en) Magnetic member
JP2004095751A (en) Electronic circuit module
JP2000060125A (en) Power supply
JPH07221419A (en) Hybrid integrated circuit device
KR101254322B1 (en) In-board type inductor and method for assembling the same
US6545855B1 (en) Low inductance termination for electronic components
JPS5828470Y2 (en) Step motor drive coil connection structure for electronic watches
JP2004281777A (en) choke coil
JP2004095715A (en) Chip component cap and chip component mounting structure on printed circuit board
JP3032379B2 (en) Thin power supply
JP2715957B2 (en) Hybrid integrated circuit device
JP2002009414A (en) Electromechanical connection device between power supply module and printed circuit board
JPH041744Y2 (en)
JPH0722577A (en) Hybrid integrated circuit device
JPH097856A (en) Circuit component
JPH088507A (en) Hybrid IC and its mounting method
JP2007028838A (en) Power supply circuit device
JP2002374049A (en) Mounting structure for power-supply device
JPS62208691A (en) Double-sided hybrid integrated circuit
JPH06302434A (en) Face mounting coil