JP2004095580A - Method for manufacturing semiconductor device - Google Patents

Abstract

An object of the present invention is to provide a method of manufacturing a semiconductor device, which can accurately mold a resin sealing body for sealing a semiconductor element into a predetermined shape and does not require manufacturing costs or man-hours.
A method for manufacturing a resin-sealed light emitting diode, comprising: a mounting step of mounting a light emitting element on a substrate; and a sealing step of sealing the mounted light emitting element with a resin material. The sealing body 26 formed by the resin molding in the sealing step is formed into a predetermined shape by a blade 29 capable of scanning control in the X-axis, Y-axis, and Z-axis directions.
[Selection diagram] FIG.

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a resin-sealed semiconductor device.
[0002]
[Prior art]
In general, as shown in FIG. 6, a semiconductor device (semiconductor chip 1) is formed by mounting a semiconductor element 4 such as silicon by die bonding or wire bonding 5 on a chip substrate 3 such as glass epoxy on which a circuit pattern and electrodes 2 are formed. , And the upper portion thereof is sealed with a resin material 6. Among the semiconductor chips 1, an optical device such as a light emitting diode uses a light emitting element as the semiconductor element 4, and a transparent material is used as the resin material 6 in order to diffuse light emitted from the light emitting element. You.
[0003]
Conventionally, the semiconductor chip 1 is manufactured by a mounting step of mounting the semiconductor element 4 on the chip substrate 3 and a sealing step of sealing the mounted semiconductor element 4 with a resin. FIG. 7 shows a step of resin-sealing the semiconductor element 4 mounted in the mounting step. First, a mold 12 on which a predetermined molding die 11 is formed is prepared, and the resin material 6 is filled in the molding die 11 (a). Then, the chip substrate 3 is lowered before the filled resin material 6 is cured, and the mold 12 is mounted on the surface of the chip substrate 3 while the semiconductor element 4 is embedded in the resin material 6 (b). In this state, after the resin material 6 is solidified, the mold 12 is removed from the surface of the chip substrate 3 (c). Through these steps, the semiconductor chip 1 including the resin sealing body 7 having the shape as shown in FIG. 6 is formed.
[0004]
In the method of manufacturing the resin sealing body 7 using such a mold 12, since the mold 12 can be used repeatedly, mass production of semiconductor chips having the same shape of the resin sealing body can be performed. Is possible.
[0005]
[Problems to be solved by the invention]
However, the conventional method of forming the resin sealing body 7 using the mold 12 does not form a clean resin sealing body 7 as shown in FIG. When the resin material 6 is peeled off from the mold 12, a part of the resin sealing body 7 is chipped or the mounting position of the mold 12 is shifted as shown in FIG. It may not be aligned with the center of the resin sealing body 7. In particular, in the case of an optical device such as a light emitting diode that obtains a light emitting effect depending on the shape of the resin sealing body 7, the shape of the mold 11 formed on the mold 12 is complicated. The defect rate at the time of taking out from the product has increased, leading to a decrease in product yield. Further, in order to enhance the releasability from the mold 12, the inner surface of the mold 12 may be processed into a mirror-like shape. However, in an optical device manufactured using such a mold 12, In addition, only a monotonous light emitting effect can be obtained with a flat light receiving / emitting surface.
[0006]
Further, when manufacturing semiconductor products provided with the resin sealing bodies 7 of various shapes, the die 12 must be manufactured for each of the products, so that the cost and the number of manufacturing steps required in the initial stage of manufacturing are large. For this reason, the conventional manufacturing method of resin molding using the mold 12 is not suitable for small-quantity, multi-product products.
[0007]
Therefore, an object of the present invention is to provide a method of manufacturing a semiconductor device which can accurately mold a resin sealing body for sealing a semiconductor element into a predetermined shape and does not require manufacturing cost or man-hour.
[0008]
[Means for Solving the Problems]
In order to solve the above problem, a method of manufacturing a semiconductor device according to claim 1 of the present invention includes a mounting step of mounting a semiconductor element on a substrate, and a sealing step of sealing the mounted semiconductor element with a resin material. In the method for manufacturing a semiconductor device provided with the above, the surface of the resin sealing body formed in the sealing step is cut and formed into a predetermined shape.
[0009]
According to the present invention, by cutting the surface of the resin sealing body roughly formed in the sealing step, the resin sealing body can be accurately formed into a predetermined shape.
[0010]
Since the cutting is performed by a blade provided on a cutting main body that can scan in a horizontal direction or a vertical direction with respect to the resin sealing body, it can be easily formed into a predetermined shape.
[0011]
In addition, the blade has a plurality of blades having different shapes and sizes, and is replaceably attached to the cutting main body, so that the resin sealing body can be formed into various shapes and the cutting surface can be formed. Since the surface roughness of the molded article can be slightly changed, a light scattering effect can be obtained when the molded article is a sealed body of an optical device. Further, since a highly adherent plating can be applied to the surface cut by the blade, a light emitting effect such as masking a part of the sealing body of the optical device by plating can be obtained.
[0012]
The blade can be cut into a planar shape by controlling the directions of the X axis and the Y axis, and can be formed into an arbitrary three-dimensional shape by controlling the direction of the Z axis.
[0013]
By automatically controlling the horizontal and vertical movement amounts of at least one of the semiconductor device on which the cutting body and the resin sealing body are formed, the resin sealing body can be precisely formed into a predetermined shape by a predetermined procedure. Can be cut and formed well.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of a method for manufacturing a semiconductor device according to the present invention will be described in detail with reference to the accompanying drawings. In the present embodiment, a surface-mounted light-emitting diode is used as a semiconductor device. FIG. 1 is a perspective view of a light emitting diode manufactured by the method for manufacturing a semiconductor device of the present invention, FIG. 2 is a process diagram showing a manufacturing process of the light emitting diode, and FIG. 3 is a perspective view showing a molding example of a resin sealing body. is there.
[0015]
As shown in FIG. 1, a light emitting diode 21 manufactured by the method of manufacturing a semiconductor device according to the present invention is mounted on a substrate 22 made of glass epoxy, BT resin (Bismaleimide Triazine Resin), or the like. The light emitting device 24 includes a light emitting element 24 and a sealing body 26 for sealing the light emitting element 24 on the substrate 22. The substrate 22 is provided with electrodes 23a and 23b for conduction with the light emitting element 24 and mounting on an external substrate such as a motherboard. The light emitting element 24 is a minute square silicon chip having a pair of element electrode portions (anode electrode and cathode electrode) on the upper and lower surfaces, and the lower surface is electrically conductive on one electrode 23 a provided on the substrate 22. It is fixed via an adhesive, and the element electrode portion on the upper surface is connected to the other electrode 23 b provided on the substrate 22 by a bonding wire 25.
[0016]
The sealing body 26 is a transparent resin material that covers above the light emitting element 24, the bonding wires 25, and the pair of electrodes 23a and 23b exposed on the substrate 22, and is formed into a predetermined shape by a manufacturing method described later. You. The shape of the sealing body 26 has a pyramid shape, and has a lens function of condensing light emitted from the light emitting element 24 toward the center. In addition, in order to produce a light scattering effect when emitting light, it is formed with a step.
[0017]
When the sealing body 26 transmits the light emitted from the light emitting element 24 as it is, a base material such as transparent plastic or glass without coloring is used, but when it is desired to change the emission color or luminance, It is formed by mixing an appropriate amount of a fluorescent material such as fine YAG or a coloring material of each color into the inside of the base material. When the fluorescent material is mixed, white light is emitted, and when a coloring material is mixed, light of a desired color is obtained. Further, when an organic film such as SiO ₂ or TiO ₂ is formed on the surface of the sealing body 26, a filter effect of selectively transmitting a specific wavelength can be obtained.
[0018]
Next, a method of manufacturing the light emitting diode 21 having the above structure will be described with reference to FIG. This manufacturing method includes a mounting step of mounting the light emitting element 24 on the substrate 22, a sealing step of filling a resin material on the light emitting element 24, and a forming step of forming the filled resin material into a predetermined shape. It has.
[0019]
In the mounting step, as shown in FIG. 2A, one element electrode portion of the light emitting element 24 is die-bonded on a substrate 22 on which a circuit pattern and electrodes (not shown) are formed in advance, and the other is formed. The electrode portion and the electrode formed on the substrate 22 are mounted by bonding with a wire 25. The die bonding of the light emitting element 24 is performed using a chip mounter, and the wire bonding is performed collectively and automatically using a bonding machine.
[0020]
In the sealing step, as shown in FIG. 2B, first, partition walls 27 that individually separate the light emitting elements 24 mounted on the substrate 22 are attached at regular intervals. Next, as shown in FIG. 2C, the resin material 6 is filled in the space partitioned by the partition wall 27 and cured. The filling of the resin material 6 is performed such that the light emitting element 24 and the wire 25 are completely embedded. After a while, when the resin material 6 is completely cured, as shown in FIG. 2D, the partition wall 27 is removed, and the sealing body 26 is exposed.
[0021]
In the forming step, as shown in FIG. 2E, the blade 29 is moved along the exposed surface of the sealing body 26 and cut. In the case of forming a pyramid having a step as shown in FIG. 1, cutting is performed while moving the blade 29 from the outer peripheral portion of the sealing body 26 toward the center.
[0022]
FIG. 3 shows an example of scanning of the blade 29 in the molding step. As shown in the figure, the light emitting diode 21 on which the sealing body 26 made of a resin material is formed in the sealing step is fixed to the processing table 32 together with the substrate 22 for positioning. Then, the tip of the blade 29 set in the cutting main body 28 is aligned with the upper end of the positioned light emitting diode 21. Then, the blade 29 is lowered to cut the surface while moving the cutting body 28 along the X direction and the Y direction while maintaining the state where the pressing force is applied to the surface of the resin sealing body 26. The outer periphery of the resin body 26 can be uniformly cut by scanning the blade 29 in the order of ABCDA in the order of A. In addition, by performing vertical scanning in the Z direction in addition to horizontal scanning in the X and Y directions of the blade 29, a resin is formed into a step-like pyramid as shown in FIG.
[0023]
Several types of blades having different shapes and sizes of cutting surfaces are prepared, and are detachable from the cutting body 28. For example, when molding the light emitting diode 31 provided with the sealing body 36 as shown in FIG. 4, the wide blade 39 as shown in FIG. It can be formed into a predetermined shape in a small number of times in a short time.
[0024]
As shown in FIG. 3, when the sealing body 26 is formed into a fine and complicated shape, precise processing can be performed by repeating the number of cuts using a narrow blade 29, as shown in FIG. In the case where a very precise processing accuracy is not required as in the case of the sealed body 36, the processing can be performed in a short time by using the wide blade 39.
[0025]
When forming the light emitting diode 41 having the stepped sealing body 46 as shown in FIG. 5, the position of the blade 29 in the Z direction (cutting depth) is determined, and the X direction (between AB) is determined. Scan along and cut. Next, the blade 29 is slid in the Y direction for one step, the position in the Z direction is set, and scanning is performed along the X direction (between CD) to cut. By repeating such scanning, a multi-stage sealing body 46 is formed.
[0026]
The scanning of the blades 29 and 39 is controlled by a drive control unit (not shown) that supports the cutting body 28. The drive control unit is provided with an adjustment mechanism for adjusting the movement amount and speed of the blades 29 and 39 in the X, Y, and Z directions, and can be operated manually or automatically.
[0027]
In the manufacturing method of the three examples described above, while the semiconductor device is fixed to the processing table 32, the cutting main body 28 supporting the blades 29, 39 can be controlled, but the blades 29, 39 are fixed. In addition, it is also possible to adopt a configuration in which the processing table 32 is driven and controlled, or a configuration in which both the blades 29 and 39 and the processing table 32 are driven and controlled.
[0028]
In the above-described manufacturing method, the light-emitting diodes 21, 31, and 41 in which various light-emitting effects can be obtained depending on the shapes of the sealing bodies 26, 36, and 46 are described as examples. However, the present invention is not limited to such light-emitting diodes. There is also an advantage of applying the manufacturing method of the present invention to other optical devices such as light receiving devices in general. Further, by manufacturing the semiconductor device other than the optical device by the manufacturing method of the present invention, it is possible to provide a semiconductor device of constant quality.
[0029]
【The invention's effect】
As described above, according to the method for manufacturing a semiconductor device according to the present invention, the resin-sealed body of the semiconductor device can be accurately formed into a predetermined shape. In the optical device, various light receiving and emitting effects can be obtained.
[0030]
Further, since a dedicated mold is not required for molding the sealing body as in the conventional case, the initial manufacturing cost can be significantly reduced.
[Brief description of the drawings]
FIG. 1 is a perspective view of a semiconductor device formed by a manufacturing method of the present invention.
FIG. 2 is a process chart showing a method for manufacturing the semiconductor device.
FIG. 3 is an explanatory view showing a first molding method of a sealing body in the above-mentioned manufacturing method.
FIG. 4 is an explanatory view showing a second molding method of the sealing body in the above production method.
FIG. 5 is an explanatory view showing a third molding method of the sealing body in the above production method.
FIG. 6 is a cross-sectional view illustrating a structure of a resin-sealed semiconductor device (light-emitting diode).
FIG. 7 is a process chart showing a method for manufacturing the conventional semiconductor device.
FIG. 8 is a cross-sectional view showing an example of a semiconductor device formed by the conventional manufacturing method.
[Explanation of symbols]
21,31,41 Light emitting diode (semiconductor device)
22 substrate 24 light emitting element 26, 36, 46 sealing body 28 cutting body 29, 39 blade 32 working table

Claims (5)

In a method of manufacturing a semiconductor device comprising a mounting step of mounting a semiconductor element on a substrate and a sealing step of sealing the mounted semiconductor element with a resin material,
A method of manufacturing a semiconductor device, comprising cutting a surface of a resin sealing body formed in the sealing step to form a predetermined shape. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the cutting is performed by scanning a cutting main body provided with a blade along at least one of a horizontal direction and a vertical direction of the resin sealing body. The method for manufacturing a semiconductor device according to claim 2, wherein the blades can be combined or exchanged according to a molding shape of a resin sealing body. 4. The method of manufacturing a semiconductor device according to claim 2, wherein the blade cuts the resin sealing body into an arbitrary three-dimensional shape by controlling directions of an X axis, a Y axis, and a Z axis. 5. The manufacturing of the semiconductor device according to claim 2, wherein the resin molding is cut and formed by automatically scanning at least one of the resin molding and the cutting body in accordance with a preset procedure. Method.

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