JP2004094118A5 - - Google Patents

Description

［式中、Ｚは芳香族テトラカルボン酸二無水物残基である４価の芳香族基、Ｙ^１は下記一般式（ＩＩ）で表される芳香族ジアミン残基
【化２】

（式中、Ｒ^１、Ｒ^２及びＲ^３は、炭素数１〜９のアルキル基、炭素数１〜１０のアルコキシ基、ＣＯＯＲ（Ｒは炭素数１〜６のアルキル基を示す）または水素であり、相互に異なっていても同一でもよく；Ｒ^４、Ｒ^５、Ｒ^６、Ｒ^７は炭素数１〜９のアルキル基または水素であり、相互に異なっていても同一でもよく；Ｘは−Ｏ−、−Ｓ−、−ＳＯ_２−、−Ｃ（ＣＨ_３）_２−、−ＣＨ_２−、−Ｃ（ＣＨ_３）（Ｃ_２Ｈ_５）−、または−Ｃ（ＣＦ_３）_２−を示し；ｎは１以上の整数である。）を示す。］で表される繰り返し単位１種以上と、下記一般式（ＩＩＩ）
【化３】

（式中、Ｚは芳香族テトラカルボン酸二無水物残基である４価の芳香族基、Ｙ^２はシロキサンジアミン残基または非フェノール性芳香族ジアミン残基を示す。）で表される繰り返し単位１種以上とからなるポリイミド樹脂と、（Ｂ）キノンジアジド化合物を含有するポジ型感光性樹脂組成物。 (1)
(A) The following general formula (I)
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[In the formula, Z is a tetravalent aromatic group which is an aromatic tetracarboxylic dianhydride residue, and Y ¹ is an aromatic diamine residue represented by the following general formula (II).

(Wherein R ¹ , R ² and R ³ are an alkyl group having 1 to 9 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, COOR (R represents an alkyl group having 1 to 6 carbon atoms) or hydrogen. R ⁴ , R ⁵ , R ⁶ , and R ⁷ are an alkyl group having 1 to 9 carbon atoms or hydrogen, and may be different or the same; X is- _{O -, - S -, -} SO 2 -, - C (CH 3) 2 -, - CH 2 -, - C (CH 3) (C 2 H 5) -, or -C _{(CF 3) 2} - and N is an integer of 1 or more). And at least one repeating unit represented by the following general formula (III)
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(In the formula, Z is a tetravalent aromatic group which is an aromatic tetracarboxylic dianhydride residue , and Y ² is a siloxane diamine residue or a non-phenolic aromatic diamine residue.) A positive photosensitive resin composition comprising a polyimide resin comprising at least one unit and (B) a quinonediazide compound.

(In the formula, Z is a tetravalent aromatic group which is an aromatic tetracarboxylic dianhydride residue , and Y ² is a siloxane diamine residue or a non-phenolic aromatic diamine residue.) A positive photosensitive resin composition comprising a polyimide resin comprising one or more units and (B) a quinonediazide compound.

In the above general formula (III), Y ² is a siloxane diamine residue or a non-phenolic aromatic diamine residue. When Y ² is a non-phenolic aromatic diamine residue, the aromatic diamine is not particularly limited as long as it is non-phenolic. For example, p-phenylenediamine, m-phenylenediamine, 4,4 '-Diphenylenediamine, 3,3'-diphenylenediamine, 3,4'-diphenylenediamine, various bis (aminophenyl) ethers, various bis (aminophenyloxy) benzenes, various 2,2-bis (aminophenyl (Oxyphenyl) propane . When Y ² is a siloxane diamine residue can be exemplified by siloxane diamine residue represented by the following general formula (IV).

The polyimide resin of the present invention can be produced by a conventionally known method except that a specific diamine is used as a part of the diamine. In this case, examples of the tetracarboxylic dianhydride as a raw material include the tetracarboxylic dianhydrides exemplified in the description of Z in the general formula (I).
As the aromatic diamine having a phenolic hydroxyl group as a raw material, an aromatic diamine corresponding to the divalent organic group represented by the general formula (II) may be mentioned.
As the siloxane diamines or non-phenolic aromatic diamine ingredients, the corresponding siloxane diamine or an aromatic diamine to the illustrated siloxane diamine residue or an aromatic diamine residue in Y ² in the general formula (III) can be mentioned Can be