JP2004090260A - Liquid jet head and method of manufacturing the same - Google Patents

Abstract

A liquid ejecting head using a common nozzle plate, wherein the possibility of occurrence of damage in a flow path forming substrate which is separately formed and joined is significantly reduced, and the liquid ejecting head. An object of the present invention is to provide a method for manufacturing a head.
A connecting plate having a plurality of nozzle opening communication chambers, and a pressure for connecting one of the surfaces to the connecting plate to communicate with each of the nozzle opening communication chambers and discharging a liquid to the other surface. The unit is formed by joining the flow path forming substrate 10 in which the pressure generating chamber 12 having the vibration plate 50 having the generating means is formed. A plurality of units are joined to the common nozzle plate 200.
[Selection diagram] FIG.

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a liquid ejecting head that ejects a liquid droplet from a nozzle opening by changing a pressure of a liquid inside a pressure generating chamber communicating with the nozzle opening.
[0002]
[Prior art]
The liquid ejecting head has a piezoelectric vibration type that pressurizes a liquid such as ink by mechanically deforming the pressure generating chamber, and a heating element is provided in the pressure generating chamber, and the pressure of the bubbles generated by the heat of the heating element is used to form the ink. There are two types, such as a bubble jet type for pressurizing a liquid such as the above.
[0003]
The piezoelectric vibration type liquid ejecting head further includes a longitudinal vibration type liquid ejecting head using a piezoelectric vibrator displaced in the longitudinal direction and a flexible liquid ejecting head using a flexurally displaced piezoelectric vibrator. Classified into types.
[0004]
The vertical vibration type liquid ejecting head can drive at high speed and eject liquid droplets at a high density. However, when manufacturing a vertical vibration type liquid ejecting head, a cutting operation is required to process the piezoelectric vibrator, and a three-dimensional assembly operation is required when fixing the piezoelectric vibrator to the pressure generating chamber. There is a problem that the number of steps increases.
[0005]
On the other hand, a flexible liquid jet head uses a silicon single crystal substrate as a base material, forms channels such as pressure generating chambers and reservoirs by anisotropic etching, and uses a piezoelectric vibrator as a piezoelectric material. Since the elastic film can be formed extremely thin and the pressure generating chamber and the piezoelectric vibrator can be formed with high precision by the method of forming the film by the film forming technology such as the sputtering, the opening area of the pressure generating chamber is made as small as possible and the liquid is formed. It is possible to improve the droplet ejection density.
[0006]
[Problems to be solved by the invention]
In recent years, as the performance of liquid ejecting heads has become higher, there has been a demand for high-speed driving of liquid ejecting heads and higher density of nozzle openings for ejecting liquid droplets and increasing the number of nozzles.
[0007]
For example, if the nozzle array density is 360 dpi and one row is 360 nozzles, the total number of nozzles of an ink jet recording head having eight nozzle rows is 2880 nozzles.
[0008]
When these eight nozzle rows are formed on the same (common) nozzle plate, the flow path forming substrate having the pressure generating chamber corresponding to the (common) nozzle plate is also the same (common). It is impossible or difficult to form with a member due to the limitation of the size of the wafer that is the material of the flow path forming substrate. Furthermore, there is a possibility that the manufacturing yield of the piezoelectric vibrator as the pressure generating means may be reduced.
[0009]
Further, when the flow path forming substrate having the pressure generating chamber formed thereon is handled as it is and bonded to the nozzle plate, the pressure generating chamber of the flow path forming substrate or the partition of the pressure generating chamber may be damaged. Is high.
[0010]
The present invention has been made in view of such a point, and is directed to a liquid ejecting head using a common nozzle plate, which may cause damage to a flow path forming substrate which is individually formed and joined. It is an object of the present invention to provide a liquid ejecting head in which is significantly reduced, and a method for manufacturing the liquid ejecting head.
[0011]
[Means for Solving the Problems]
The present invention provides a common nozzle plate having a plurality of nozzle rows each including a plurality of nozzle openings, each of which is joined to the common nozzle plate, and each of the nozzle openings of at least one nozzle row of the plurality of nozzle rows. A plurality of connecting plates, each having a plurality of nozzle opening communicating chambers communicating with each other, each of which is joined to each connecting plate, and which communicates with each of the nozzle opening communicating chambers and discharges a liquid on a side opposite to the connecting plate. And a plurality of flow path forming substrates having a plurality of pressure generating chambers sealed in a diaphragm having a pressure generating means for performing the liquid jetting.
[0012]
According to the present invention, before joining with the common nozzle plate, the flow path forming substrate can be handled in a state of being joined to the connecting plate. For this reason, the possibility that the flow path forming substrate is damaged before joining with the common nozzle plate can be reduced.
[0013]
Alternatively, the present invention provides a first nozzle having a common nozzle plate having a plurality of nozzle openings, and a plurality of first nozzle opening communication chambers joined to the common nozzle plate and communicating with each of a part of the plurality of nozzle openings. A first flow having a connecting plate and a plurality of first pressure generating chambers joined to the first connecting plate, communicating with each of the first nozzle opening communication chambers, and opening on a side opposite to the first connecting plate. A path forming substrate, a first diaphragm commonly sealing the opening surfaces of the plurality of first pressure generating chambers of the first flow path forming substrate, and a pressure of a liquid inside the plurality of first pressure generating chambers. A first pressure generating means for changing each of the plurality of nozzle openings, a second connection plate joined to the common nozzle plate, and having a plurality of second nozzle opening communication chambers communicating with each other of the plurality of nozzle openings, The second nozzle is joined to a second connecting plate, A second flow path forming substrate having a plurality of second pressure generating chambers communicating with each of the mouth communication chambers and opening on a side opposite to the second connecting plate, and the plurality of second flow path forming substrates; A second diaphragm that commonly seals an opening surface of the second pressure generation chamber; and a second pressure generation unit that changes a pressure of a liquid inside the plurality of second pressure generation chambers. This is a characteristic liquid ejecting head.
[0014]
According to the present invention, before joining with the common nozzle plate, the first flow path forming substrate can be handled while being joined to the first connecting plate. For this reason, the possibility that the first flow path forming substrate is damaged before joining with the common nozzle plate can be reduced. Similarly, according to the present invention, before joining with the common nozzle plate, the second flow path forming substrate can be handled in a state of being joined to the second connecting plate. For this reason, the possibility that the second flow path forming substrate is damaged before joining with the common nozzle plate can be reduced.
[0015]
Alternatively, the present invention provides a common nozzle plate having a plurality of nozzle rows each including a plurality of nozzle openings, each of which is joined to the common nozzle plate, and each of at least one nozzle row of the plurality of nozzle rows. A plurality of connecting plates having a plurality of nozzle opening communicating chambers communicating with the nozzle openings, each being joined to each connecting plate, communicating with each of the nozzle opening communicating chambers, and a liquid on a side opposite to the connecting plate; And a plurality of flow path forming substrates having a plurality of pressure generating chambers sealed with a diaphragm having a pressure generating means for discharging the liquid. Forming the flow path forming substrate and the connecting plate so that the flow path forming substrate and the connecting plate are bonded to each other, and forming the bonded flow path forming substrate and the connecting plate into a common nozzle plate. It is a method of comprising the a step of joining the.
[0016]
According to the present invention, before joining with the common nozzle plate, the flow path forming substrate can be handled in a state of being joined to the connecting plate. For this reason, the possibility that the flow path forming substrate is damaged before joining with the common nozzle plate can be reduced.
[0017]
In this way, a plurality of flow path forming substrates are individually formed, handled in a state where they are bonded to a connecting plate for protection, and then bonded to a common nozzle plate, so that a wafer which is a material of the flow path forming substrates is formed. Regardless of size restrictions, a liquid jet head employing a common nozzle plate can be easily realized.
[0018]
If the arrangement density of the nozzle openings is higher, for example, 240 dpi or more, the partition walls of the pressure generating chamber formed in the flow path forming substrate become thinner, and the risk of damage to the flow path forming substrate increases. However, according to the present invention, the flow path forming substrate can be handled in a state of being bonded to the connecting plate before bonding with the common nozzle plate, so that the possibility of damage to the flow path forming substrate can be reduced. it can.
[0019]
Here, the shape and size of the nozzle opening communication chamber of the connection plate directly affect the liquid discharge characteristics. When the pressure generation chambers are formed at a higher density, for example, when the width of the pressure generation chamber is about 55 μm, the diameter of the nozzle opening communication chamber is 30 to 50 μm, particularly Is preferably a cylindrical space having a diameter of 45 μm. When the nozzle opening communication chamber is a small-diameter cylindrical space as described above, the thickness of the connecting plate is preferably 40 to 60 μm, and particularly preferably about 50 μm, from the viewpoint of the liquid flow path characteristics. When the thickness of the connecting plate is t [μm] and the diameter of the nozzle opening communication chamber is D [μm], the nozzle opening communication chamber satisfies 1.0 <t / D <1.2. If the shape and size are determined, the liquid discharge characteristics do not deteriorate due to the connecting plate.
[0020]
As described above, when the thickness of the connecting plate is 30 to 60 μm, the function of protecting the flow path forming substrate by the connecting plate may not be sufficient. In such a case, the method of the present invention preferably further comprises a step of bonding the protective film to the connecting plate, and a step of peeling the protective film from the connecting plate before bonding to the common nozzle plate.
[0021]
In this case, since the protective film is a member that is peeled off before being joined to the common nozzle plate, the thickness can be freely selected. Therefore, the flow path forming substrate can be sufficiently protected by the connecting plate and the protective film having a sufficient thickness until it is joined to the common nozzle plate.
[0022]
According to another aspect of the invention, there is provided a liquid ejecting apparatus including: a liquid ejecting head having any one of the above features; and a control unit for controlling a pressure generating unit of the liquid ejecting head.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0024]
FIG. 1 is a perspective view of a first flow path forming substrate of the liquid ejecting head according to an embodiment of the present invention, and FIG. 2 is a first flow path forming substrate, a first diaphragm, and a first connection joined together. FIG. 3 is a cross-sectional view of the plate in the longitudinal direction of the first pressure generating chamber, and FIG. 3 is a cross-sectional view of the first pressure generating chamber in FIG. 2 in the width direction.
[0025]
The first flow path forming substrate 10 shown in FIG. 1 is formed of a silicon single crystal substrate having a plane orientation (110) in the present embodiment. As the first flow path forming substrate 10, one having a thickness of about 50 to 300 μm is generally used according to the arrangement density of the nozzles. When the arrangement density of the nozzles is 360 dpi, the thickness of the flow path forming substrate 10 is preferably about 50 to 100 μm, and more preferably about 70 μm. This is because the arrangement density can be increased while maintaining the rigidity of the partition wall between the adjacent pressure generating chambers.
[0026]
As shown in FIGS. 2 and 3, one surface (lower surface) of the first flow path forming substrate 10 is an opening surface, and the other surface (upper surface) is made of silicon dioxide formed by thermal oxidation in advance. The elastic film 50 (diaphragm) having a thickness of 0.5 to 2 μm is formed.
[0027]
On the other hand, as shown in FIG. 1, the opening surface of the first flow path forming substrate 10 is provided with a first pressure generating chamber 12 partitioned by a plurality of partition walls 11 by anisotropically etching a silicon single crystal substrate. The rows 13 are two rows, and the reservoirs 14 arranged in a substantially U-shape so as to surround three sides of the row 13 of the two first pressure generating chambers 12, and the first pressure generating chambers 12 and the reservoirs 14 are fixed. And an ink supply port 15 that communicates with the fluid resistance. In addition, an ink introduction hole 16 for supplying ink to the reservoir 14 from the outside is formed at a substantially central portion of the reservoir 14.
[0028]
Here, in the anisotropic etching, when the silicon single crystal substrate is immersed in an alkaline solution such as KOH, it is gradually eroded, and the first (111) plane perpendicular to the (110) plane and the first (111) plane are formed. A second (111) plane that forms an angle of about 70 degrees with the (111) plane and forms an angle of about 35 degrees with the (110) plane appears, and is compared with the etching rate of the (110) plane by (111). The etching is performed using the property that the etching rate of the surface is about 1/180. By such anisotropic etching, precision processing can be performed based on depth processing of a parallelogram formed by two first (111) surfaces and two oblique second (111) surfaces. The first pressure generating chambers 12 can be arranged at a high density.
[0029]
In the present embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane, and the short side is formed by the second (111) plane. The pressure generating chamber 12 is formed by etching until it reaches the elastic film 50 substantially through the first flow path forming substrate 10. Here, the amount of the elastic film 50 that is attacked by the alkaline solution for etching the silicon single crystal substrate is extremely small. Each ink supply port 15 communicating with one end of each pressure generating chamber 12 is formed shallower than the first pressure generating chamber 12. That is, the ink supply port 15 is formed by partially etching (half-etching) the silicon single crystal substrate in the thickness direction. Note that the half etching is performed by adjusting the etching time.
[0030]
As shown in FIGS. 2 and 3, a first nozzle opening communication is provided on the opening surface side of the first flow path forming substrate 10 on a side opposite to the ink supply port 15 of each first pressure generating chamber 12. A first connecting plate 18 in which the chamber 17 is formed is fixed via an adhesive or a heat welding film. In the present embodiment, the thickness of the first connecting plate 18 is 50 μm, and the first nozzle opening communication chamber 17 is a φ45 μm cylindrical space. The first connecting plate 18 serves as a reinforcing plate that protects the first flow path forming substrate 10 that is a silicon single crystal substrate from impact or external force.
[0031]
On the other hand, the lower electrode film 60 having a thickness of, for example, about 0.5 μm and the piezoelectric film having a thickness of, for example, about 1 μm are formed on the elastic film 50 on the side opposite to the opening surface of the first flow path forming substrate 10. A piezoelectric vibrator (piezoelectric element) 300 is formed by laminating a layer 70 and an upper electrode film 80 having a thickness of, for example, about 0.1 μm by a process described later. Here, the piezoelectric vibrator 300 refers to a portion including the lower electrode film 60, the piezoelectric film 70, and the upper electrode film 80.
[0032]
Generally, one of the electrodes of the piezoelectric vibrator 300 is used as a common electrode, and the other electrode and the piezoelectric film 70 are patterned for each of the pressure generating chambers 12. A portion which is constituted by one of the patterned electrodes and the piezoelectric film 70 and in which a piezoelectric strain is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion 320. In the present embodiment, the lower electrode film 60 is a common electrode of the piezoelectric vibrator 300, and the upper electrode film 80 is an individual electrode of the piezoelectric vibrator 300. However, there is no problem even if this is reversed for the sake of the drive circuit and wiring. In any case, the piezoelectric active portion is formed for each pressure generating chamber. In the example described above, the elastic film 50 and the lower electrode film 60 function as a diaphragm, but the lower electrode film may also serve as the elastic film. Further, a film of insulating zirconia or the like may be formed on the elastic film 50 to be a part of the elastic film 50.
[0033]
In the present embodiment, the piezoelectric film 70 and the upper electrode film 80 are patterned in a region facing the pressure generating chamber 12 to constitute the piezoelectric active portion 320, and constitute the piezoelectric active portion 320. The piezoelectric film 70 and the upper electrode film 80 are continuously extended to a region facing the ink supply port 15. Further, a lead electrode 100 is connected to the upper electrode film 80 in a region facing the ink supply port 15 via a contact hole 90a described later.
[0034]
Here, a process of forming the piezoelectric film 70 and the like on the first flow path forming substrate 10 made of a silicon single crystal substrate will be described with reference to FIGS.
[0035]
As shown in FIG. 4A, first, a silicon single crystal substrate wafer serving as the flow path forming substrate 10 is thermally oxidized in a diffusion furnace at about 1100 ° C. to form an elastic film 50 made of silicon dioxide.
[0036]
Next, as shown in FIG. 4B, the lower electrode film 60 is formed by sputtering. Pt, Ir, and the like are preferable as the material of the lower electrode film 60. This is because the piezoelectric film 70 described later, which is formed by sputtering or a sol-gel method, needs to be crystallized by firing at a temperature of about 600 to 1000 ° C. in an air atmosphere or an oxygen atmosphere after the film formation. It is. That is, the material of the lower electrode film 60 must be able to maintain conductivity at such a high temperature and in an oxidizing atmosphere. In particular, when PZT is used for the piezoelectric film 70, the conductivity of the material by diffusion of PbO is increased. It is desirable that there is little change in sex, and Pt is preferred for these reasons.
[0037]
Next, as shown in FIG. 4C, a piezoelectric film 70 is formed. Sputtering can be used to form the piezoelectric film 70. In this embodiment, however, a so-called sol in which a metal organic substance is dissolved and dispersed in a solvent is applied, dried, gelled, and further fired at a high temperature. A so-called sol-gel method is used to obtain a piezoelectric film 70 made of a metal oxide. As a material for the piezoelectric film 70, a lead zirconate titanate (PZT) -based material is suitable when used in an ink jet recording head.
[0038]
Next, as shown in FIG. 4D, an upper electrode film 80 is formed. The upper electrode film 80 only needs to be a material having high conductivity, and many metals such as Al, Au, Ni, Pt, Ir, and Cu, and a conductive oxide can be used. In this embodiment, Ir is deposited by sputtering.
[0039]
Next, as shown in FIG. 4E, the upper electrode film 80 and the piezoelectric film 70 are patterned so that the piezoelectric vibrator is disposed substantially at the center of each pressure generating chamber 12.
[0040]
FIG. 4E shows a case where the piezoelectric film 70 is patterned with the same pattern as the upper electrode film 80. However, as described above, the piezoelectric film 70 does not necessarily need to be patterned. This is because when a voltage is applied using the pattern of the upper electrode film 80 as an individual electrode, an electric field is applied only between each upper electrode film 80 and the lower electrode film 60 which is a common electrode, and the other portions are not applied. This has no effect. However, in this case, it is necessary to apply a large voltage to obtain the same excluded volume. Therefore, it is preferable that the piezoelectric film 70 is also patterned.
[0041]
After that, the lower electrode film 60 may be patterned to remove unnecessary portions, for example, the vicinity of the inside of the edge on both sides in the width direction of the pressure generating chamber 12. The removal of the lower electrode film 60 is not necessarily performed, and when it is removed, the thickness may be reduced without removing all.
[0042]
Here, the patterning is performed by forming a resist pattern and then performing etching or the like.
[0043]
The resist pattern is formed by applying a negative resist by spin coating or the like, and performing exposure, development, and baking using a mask having a predetermined shape. Of course, a positive resist may be used instead of the negative resist.
[0044]
The etching is performed using a dry etching device, for example, an ion milling device. After the etching, the resist pattern is removed using an ashing device or the like.
[0045]
As the dry etching method, a reactive etching method or the like may be used in addition to the ion milling method. It is also possible to use wet etching instead of dry etching, but it is preferable to use dry etching because patterning accuracy is somewhat inferior to dry etching and the material of the upper electrode film 80 is limited. .
[0046]
Next, as shown in FIG. 5A, an insulator layer 90 is formed so as to cover the periphery of the upper electrode film 80 and the side surface of the piezoelectric film 70. In this embodiment, a negative photosensitive polyimide is used as a material of the insulator layer 90.
[0047]
Next, as shown in FIG. 5B, by patterning the insulator layer 90, a contact hole is formed in a portion facing the ink supply port 15 above the upper electrode 80 provided facing the pressure generating chamber 12. 90a is formed. The contact hole 90 a is for connecting a lead electrode 100 described later and the upper electrode film 80.
[0048]
Next, for example, a conductor such as Cr-Au is formed on the entire surface, and then patterned to form a portion facing the ink supply port 15 above the upper electrode 80 provided facing the pressure generating chamber 12. The lead electrode 100 is formed.
[0049]
The above is the film forming process. After forming the film in this manner, as shown in FIG. 5C, the silicon single crystal substrate is anisotropically etched with the above-described alkali solution to form the first pressure generating chamber 12 and the like.
[0050]
In the above-described series of film formation and anisotropic etching, a number of chips are simultaneously formed on one wafer, and after the process is completed, a connecting plate is further formed, as shown in FIGS. 2 and 3. Each chip is divided. As a result, a plurality of chips similar to the chips including the first flow path forming substrate 10 are formed substantially simultaneously and individually cut (chipping).
[0051]
Then, as shown in FIG. 6, for example, the first connecting plate 18 joined to the divided first passage forming substrate 10, the first connecting plate 128 joined to the second passage forming substrate 120, and the third passage forming The first connection plate 138 bonded to the substrate 130 and the first connection plate 148 bonded to the fourth flow path forming substrate 140 are bonded to the common nozzle plate 200 (that is, the liquid ejecting head having eight nozzle rows is used). Manufactured).
[0052]
FIG. 7 shows a flowchart of a method for manufacturing the above-described inkjet head.
[0053]
FIG. 8 shows a flowchart of a modification of the method of manufacturing an ink jet head. In the case shown in FIG. 8, a protective film is attached to each connecting plate before chipping, and the protective film is peeled off before joining to the common nozzle plate 200. According to this method, further protection of the flow path forming substrate can be achieved by using a protective film having a sufficient thickness. In particular, when the thickness of the connecting plate is as thin as about 50 μm, the method of FIG. 8 is effective.
[0054]
The size of each pressure generating chamber that applies ink droplet ejection pressure to ink and the size of the nozzle opening 201 that ejects ink droplets are optimized according to the amount of ink droplets to be ejected, the ejection speed, and the ejection frequency. . For example, when recording 360 ink droplets per inch, the nozzle opening 201 needs to be formed with a diameter of 10 to 30 μm with high accuracy.
[0055]
The ink jet head configured as described above takes in ink from the ink inlet 16 connected to an external ink supply unit (not shown), fills the inside with ink from the reservoir 14 to the nozzle opening 201, and then supplies an external drive circuit (not shown). Voltage is applied between the lower electrode film 60 and the upper electrode film 80 via the lead electrode 100 in accordance with the recording signal from the lead electrode 100, and the elastic film 50 and the piezoelectric film 70 are flexibly deformed. The pressure inside increases, and ink droplets are ejected from the nozzle opening 201.
[0056]
Further, each of the above embodiments is a thin film type ink jet recording head which can be manufactured by applying a film forming and lithography process, but is not limited to this. For example, various structures such as a structure in which a pressure generating chamber is formed by laminating substrates, a structure in which a piezoelectric film is formed by pasting a green sheet or screen printing, or a structure in which a piezoelectric film is formed by crystal growth. The present invention can be applied to an ink jet recording head.
[0057]
Further, in each of the above-described embodiments, the connection portion between the upper electrode film and the lead electrode may be provided at any position, and may be at any end or the center of the pressure generating chamber.
[0058]
Further, the example in which the insulator layer is provided between the piezoelectric vibrator and the lead electrode has been described. However, the present invention is not limited to this. For example, without providing the insulator layer, an anisotropic conductive film may be formed on each upper electrode. A configuration may be adopted in which this anisotropic conductive film is thermally welded and connected to a lead electrode, or connected using various bonding techniques such as wire bonding.
[0059]
As described above, the present invention can be applied to ink jet recording heads having various structures, as long as the gist of the present invention is not contradicted.
[0060]
Further, the ink jet recording head of each of the embodiments constitutes a part of a recording head unit having an ink flow path communicating with an ink cartridge and the like, and is mounted on the ink jet recording apparatus. FIG. 9 is a schematic view showing an example of the ink jet recording apparatus.
[0061]
As shown in FIG. 9, a recording head unit 1 having an ink jet type recording head is provided with detachable cartridges 2A and 2B constituting ink supply means, and a carriage 3 on which the recording head unit 1 is mounted is an apparatus main body. A carriage shaft 5 attached to the carriage 4 is provided so as to be movable in the axial direction. The recording head unit 1 discharges, for example, a black ink composition from the cartridge 2A and a color ink composition from the cartridge 2B. Each piezoelectric vibrator of the recording head unit 1 is independently driven by the control unit 9.
[0062]
Then, the driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears (not shown) and the timing belt 7, so that the carriage 3 on which the recording head unit 1 is mounted moves along the carriage shaft 5. On the other hand, the apparatus main body 4 is provided with a platen 8 along the carriage shaft 5, and a recording sheet S, which is a recording medium such as paper fed by a paper feed roller (not shown), is wound around the platen 8. It is designed to be transported.
[0063]
Although the above description has been made with respect to an ink jet recording head and an ink jet recording apparatus, the present invention is broadly applied to a liquid ejecting head and a liquid ejecting apparatus in general. As an example of the liquid, in addition to ink, glue, nail polish, chemicals, and the like can be used. Further, the present invention can be applied to an apparatus for manufacturing a color filter in a display such as a liquid crystal.
[0064]
【The invention's effect】
As described above, according to the present invention, before joining with the common nozzle plate, the flow path forming substrate can be handled while being joined to the connecting plate. For this reason, the possibility that the flow path forming substrate is damaged before joining with the common nozzle plate can be reduced.
[Brief description of the drawings]
FIG. 1 is a perspective view of a first flow path forming substrate of a liquid jet head according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view in the longitudinal direction of a first pressure generating chamber of a chip including a first flow path forming substrate, a first diaphragm, and a first connecting plate that are joined together.
FIG. 3 is a cross-sectional view in a width direction of a first pressure generating chamber of the chip of FIG. 2;
FIG. 4 is a diagram showing a thin film manufacturing process according to one embodiment of the present invention.
FIG. 5 is a diagram showing a thin film manufacturing process according to one embodiment of the present invention.
FIG. 6 is a schematic sectional view of a liquid jet head according to an embodiment of the present invention.
FIG. 7 is a flowchart illustrating one embodiment of a method for manufacturing a liquid jet head according to the present invention.
FIG. 8 is a flowchart showing another embodiment of the method for manufacturing a liquid jet head according to the present invention.
FIG. 9 is a schematic diagram of an ink jet recording apparatus according to one embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Recording head unit 2A, 2B Cartridge 3 Carriage 4 Ink jet recording apparatus main body 5 Carriage shaft 6 Drive motor 7 Timing belt 8 Platen 9 Control unit 10 First flow path forming substrate 11 Partition wall 12 First pressure generation chamber 14 Reservoir 15 Ink supply Port 17 First nozzle opening communication chamber 18 First connecting plate 50 Elastic film 60 Lower electrode film 70 Piezoelectric film 80 Upper electrode film 90 Insulator layer 90a Contact hole 100 Lead electrode 200 Common nozzle plate 201 Nozzle opening 300 Piezoelectric vibrator 320 Piezoelectric active part

Claims (8)

A common nozzle plate having a plurality of nozzle rows including a plurality of nozzle openings,
A plurality of connection plates, each joined to the common nozzle plate, and having a plurality of nozzle opening communication chambers communicating with respective nozzle openings of at least one nozzle row of the plurality of nozzle rows,
A plurality of pressures, each of which is joined to each connection plate, communicates with each of the nozzle opening communication chambers, and is sealed by a diaphragm having a pressure generating means for discharging liquid on the side opposite to the connection plate. Having a generation chamber, a plurality of flow path forming substrates,
A liquid jet head comprising: The liquid ejecting head according to claim 1, wherein the arrangement density of the nozzle openings is equal to or higher than 240 dots / inch (dpi). The liquid ejecting head according to claim 1, wherein the nozzle opening communication chamber is a cylindrical space having a diameter of 30 to 50 μm. The liquid ejecting head according to claim 1, wherein the connection plate has a thickness of 30 to 60 μm. When the thickness of the connection plate is t μm and the diameter of the nozzle opening communication chamber is D μm,
1.0 <t / D <1.2
The liquid ejecting head according to claim 1, wherein the following condition is satisfied. A liquid jet head according to any one of claims 1 to 4,
A control unit for controlling the pressure generating means,
A liquid ejecting apparatus comprising: A common nozzle plate having a plurality of nozzle rows including a plurality of nozzle openings,
A plurality of connection plates, each joined to the common nozzle plate, and having a plurality of nozzle opening communication chambers communicating with respective nozzle openings of at least one nozzle row of the plurality of nozzle rows,
A plurality of pressures, each of which is joined to each connection plate, communicates with each of the nozzle opening communication chambers, and is sealed by a diaphragm having a pressure generating means for discharging liquid on the side opposite to the connection plate. Having a generation chamber, a plurality of flow path forming substrates,
A method for manufacturing a liquid jet head comprising:
A step of forming a flow path forming substrate and a connecting plate so that the flow path forming substrate and the connecting plate are joined;
A step of joining the joined flow path forming substrate and the connecting plate to a common nozzle plate,
A method comprising: Joining the protective film to the connecting plate, and before joining with the common nozzle plate, removing the protective film from the connecting plate,
The method of claim 5, further comprising:

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