JP2004088127A - Electronic component material and electronic component manufacturing method - Google Patents

Abstract

An object of the present invention is to provide an inexpensive, small, and highly reliable leadless package type electronic component, and an electronic component material and a manufacturing method for manufacturing the electronic component.
A rectangular substrate provided with a plurality of external electrodes on its periphery, an element component mounted on a surface of the substrate while being electrically connected to the external electrode, and an element component mounted on the surface of the substrate. In a leadless package type electronic component having a molding resin 5 molded on the surface of the substrate, the surface of the molding resin 5 is formed flat, and each side surface of the molding resin 5 is flush with each side surface of the substrate 6. Is formed.
[Selection diagram] Fig. 4

Description

(4) The present invention relates to an electronic component having an IC chip, an LSI, or the like mounted on a printed circuit board, an electronic component material, and a method of manufacturing an electronic component, for use in, for example, consumer / industrial electronic devices.

2. Description of the Related Art In recent years, various consumer and industrial electronic devices have been rapidly reduced in size, weight, thickness, and performance due to remarkable progress in electronics technology. Therefore, in order to increase the circuit density and increase the number of electronic components to be used, to achieve higher density and higher speed, thinner and finer patterns of printed circuit boards, adoption of multilayer structure, miniaturization of electronic components, etc. Various mounting techniques for connecting electronic components have been developed.
In particular, a chip carrier type electronic component as shown in FIG. 14 has conventionally been known as a technique for connecting an IC chip, LSI, or the like to a substrate.

FIG. 14A is a plan view of a chip carrier type electronic component as viewed from a surface side on which a semiconductor element is mounted. FIG. 14B is a cross-sectional view taken along line A-A ′ of FIG. As shown in FIG. 14 (b), this electronic component is obtained by die-attaching the semiconductor element 1 onto a substrate 6 which has been cut in advance so as to pass through the vicinity of the axis of the through-hole 7. Is electrically connected to the wiring pattern 3 formed by the wire 2 using a wire 2. The wiring pattern 3 is connected to a through-hole (external electrode) 7 and a connection land 8 provided on the back surface of the substrate 6. The wiring pattern 3 is usually soldered to a motherboard (not shown) by soldering. The connection is made via 8. The substrate 6 is usually a printed circuit board, but may be a ceramics substrate. The semiconductor element 1 die-attached on the substrate 6 is connected to the wiring pattern 3 by wire bonding, and then molded with the molding resin 5.

A mold frame 4 constituting a dam is provided at a peripheral portion of the surface of the substrate 6. The mold frame 4 allows the mold resin 5 to be filled up to the height of the semiconductor element 1, and the mold resin 5 to pass through the through hole 7. It does not flow into the back surface of the substrate 6. When the mold frame 4 is not used, for the same reason, the substrate 6 is designed so that the through hole 7 is kept away from the semiconductor element 1 and the mold resin 5 also has high thixotropy (those having a high thixotropy = A resin with little resin flow and good swelling) was used.

However, in the above-described conventional chip carrier type electronic component, since it is necessary to form the mold frame 4 on the substrate 6, an increase in the cost of forming the frame is unavoidable, and the chip carrier type There has been a problem that the dimensions of the electronic component are increased.

Further, when the mold frame 4 is not used, since the through holes 7 need to be kept away from the semiconductor element 1, the size of the chip carrier type electronic component also becomes large, and the mold resin 5 having high thixotropic property, that is, Since it is necessary to use a molding material having poor performance, the molding resin 5 does not easily flow into the gap in the vicinity of the semiconductor element 1, and an unfilled portion of the molding resin 5 occurs. Has been reduced.

Accordingly, an object of the present invention is to solve the above-mentioned problems, to provide an inexpensive, small, and highly reliable leadless package type electronic component, and to provide an electronic component material and a manufacturing method for manufacturing the electronic component. It is aimed at.

た め In order to solve the above problems, the electronic component of the present invention is characterized by having the following means. Here, an element component mounted on a substrate described below is a concept including an active element typified by a semiconductor element and a so-called passive element such as an inductance element and a capacitance element.

The electronic component according to claim 1, wherein the substrate has a rectangular substrate provided with a plurality of external electrodes, an element component mounted on a surface of the substrate in a state of being electrically connected to the external electrode, and an element component mounted on the surface of the substrate. In a leadless package type electronic component having a molded resin, the surface of the molded resin is formed flat, and each side surface of the molded resin is formed flush with each side surface of the substrate. Features.

In the electronic component according to the first aspect, it is preferable that the external electrode is formed by cutting a through hole in an axial direction.

In the electronic component according to the second aspect, it is preferable that the external electrode is filled with a conductive paste or a metal material having solder wettability.

電子 In the electronic component according to claim 4, it is preferable that the metal material is solder or gold.

The electronic component according to claim 2, further comprising a covering member that closes an opening of the external electrode on the mold resin side, wherein the covering member is molded on the surface of the substrate by the mold resin, and the side of the covering member is closed. It is preferable that the end surface is formed flush with the side surface of the mold resin and the substrate.

In the electronic component according to the seventh aspect, it is preferable that a pad made of exactly the same material as the covering member is further provided between the substrate and the element component.

9. The electronic component according to claim 8, wherein the pad is formed with a through-hole penetrating the covering member in a front-to-back direction, and the through-hole includes a conductive member that conducts between the component and the wiring area of the substrate. Is preferred.

に お い て In the electronic component according to claim 7, 8, or 9, it is preferable that the covering member is an adhesive sheet, a dry film, a glass epoxy plate, or a ceramic plate.

に お い て In the electronic component according to any one of claims 1 to 13, it is preferable that the external electrode is provided at a corner of the substrate.

In the electronic component material according to the fifteenth aspect, a through-hole in which an external electrode is formed by being cut by a line substantially passing through the axis is surrounded by a substrate material disposed on a grid-like virtual line and a virtual line of the substrate material. And a mold resin poured into the entire surface of the substrate material so as to mold the element component.

電子 In the electronic component material according to claim 15, it is preferable to further include a dam at a peripheral portion of the substrate material for preventing the flow of the poured mold resin.

電子 In the electronic component material according to claim 15 or 16, it is preferable that the substrate material further includes a plating lead connected to each through hole.

電子 In the electronic component material according to claim 17, it is preferable that the plating leads are provided on both front and back surfaces of the substrate material.

In the electronic component material according to any one of claims 15 to 18, it is preferable that each through hole is filled with a conductive paste or a metal material having solder wettability.

電子 In the electronic component material according to claim 20, the metal material is preferably solder or gold.

電子 In the electronic component material according to any one of claims 15 to 18, it is preferable that the surface of the substrate material further include a covering material molded in a mold resin while closing an opening of each through hole.

電子 In the electronic component material according to claim 23, it is preferable that a pad made of exactly the same material as the covering material is further provided between the substrate material and each element component.

電子 In the electronic component material according to claim 23 or 24, the covering material is preferably an adhesive sheet, a dry film, a glass epoxy plate, or a ceramic plate.

に お い て In the electronic component material according to any one of claims 15 to 28, it is preferable that the through holes are arranged at intersections of the grid-like virtual lines.

A method of manufacturing an electronic component according to claim 30, wherein a through hole in which an external electrode is formed by cutting along a line substantially passing through an axis is formed in a substrate material along a grid-like virtual line; A mounting process of mounting element components in a region surrounded by virtual lines of the substrate material, a connection process of electrically connecting the element components and corresponding through holes, and pouring mold resin over the entire surface of the substrate material. And a cutting step of cutting the substrate material, the mold resin and the through-holes along the imaginary line after the molding resin is cured.

Preferably, the method for manufacturing an electronic component according to claim 30, further comprising a dam forming step of forming a dam at a peripheral portion of the substrate material to prevent the flow of the poured mold resin before the molding step.

In the method for manufacturing an electronic component according to claim 31 or 32, it is preferable to use a jig for holding the substrate material horizontally and to cure the mold resin while the substrate material is held horizontally by the jig.

In the electronic component manufacturing method according to claim 32, it is preferable that the poured mold resin is controlled by weight.

In the method for manufacturing an electronic component according to any one of claims 30 to 33, it is preferable that the method further includes a filling step of filling each through hole with a conductive paste before the molding step.

In the electronic component manufacturing method according to claim 34, it is preferable that the filling step is performed by filling the conductive paste into each through-hole and then heating and curing the conductive paste.

Preferably, the method for manufacturing an electronic component according to any one of claims 30 to 33, further comprises, before the molding step, a filling step of filling each through hole with a metal material having solder wettability.

In the electronic component manufacturing method according to claim 36, the metal material is preferably solder, and the filling step is preferably performed by filling a solder paste into each through hole and then heating and melting the solder paste.

In the electronic component manufacturing method according to claim 36, the metal material is preferably solder, and the filling step is preferably performed by bringing the opening of the through hole into contact with the molten and wavy solder.

In the method for manufacturing an electronic component according to claim 36, the metal material is solder, and the filling step is performed by masking a portion of the substrate material other than an opening of the through hole, and then immersing the substrate material in molten solder. It is preferably performed.

In the method for manufacturing an electronic component according to claim 36, the filling step is preferably performed by plating the through-hole thickly.

The method for manufacturing an electronic component according to any one of claims 30 to 33, wherein, prior to the molding step, a closing step of closing an opening of each through hole opened on the back surface of the substrate material using a closing member; It is preferable that the method further includes an opening step of removing the closing member after the completion.

In the method for manufacturing an electronic component according to claim 41, the closing member is a non-adhesive flat plate member capable of covering the entire back surface of the substrate material, and the closing step is by pressing the flat member against the back surface of the substrate material. It is preferably performed.

に お い て In the method for manufacturing an electronic component according to claim 42, the flat member is preferably made of silicone rubber.

42. The method for manufacturing an electronic component according to claim 41, wherein the closing member is an adhesive sheet capable of covering the entire back surface of the substrate material, and the closing step is performed by attaching the sheet to the back surface of the substrate material. Is preferred.

The method for manufacturing an electronic component according to claim 44, wherein the sheet is an ultraviolet-curable sheet whose adhesiveness is reduced by irradiation with ultraviolet light, and between the closing step and the opening step, it is preferable to irradiate the ultraviolet-curable sheet with ultraviolet light. .

In the method for manufacturing an electronic component according to claim 44, the sheet is a thermosetting sheet whose tackiness is reduced by heating, and it is preferable to heat the thermosetting sheet between the closing step and the opening step.

42. The method of manufacturing an electronic component according to claim 41, wherein the closing member is a soluble resin that dissolves in an alkaline aqueous solution, and the closing step is performed by pouring the soluble resin into each through hole and curing the resin. Is preferably carried out by washing away the soluble resin with an aqueous alkali solution.

34. The method for manufacturing an electronic component according to claim 30, further comprising, before the molding step, a covering step of attaching a covering material for closing an opening of each through hole to a surface of the substrate material. preferable.

In the method for manufacturing an electronic component according to claim 48, the covering material is preferably an adhesive sheet, and the covering step is preferably performed by attaching the sheet to the surface of the substrate material.

In the method for manufacturing an electronic component according to claim 48, the covering member is preferably a dry film, and the covering step is preferably performed by attaching the dry film to the surface of the substrate material.

In the electronic component manufacturing method according to claim 48, it is preferable that the covering member is a molded plate of glass epoxy, and the covering step is performed by bonding the molded plate to the surface of the substrate material.

In the electronic component manufacturing method according to claim 48, the covering member is preferably a prepreg made of glass epoxy, and the covering step is preferably performed by heat-pressing the prepreg on the surface of the substrate material.

In the method for manufacturing an electronic component according to claim 48, it is preferable that the covering member is a ceramic molded plate, and the covering step is performed by bonding the molded plate to the surface of the substrate material.

In the electronic component manufacturing method according to claim 48, the covering member is preferably a ceramic green sheet, and the covering step is preferably performed by heat-pressing the green sheet on the surface of the substrate material.

55. The method for manufacturing an electronic component according to claim 30, wherein prior to the molding step, a step of attaching a plane holding means for holding the flatness of the substrate material to the substrate material, and a step of cutting after curing of the mold resin. Before removing the flat surface holding means.

In the electronic component manufacturing method according to claim 55, it is preferable that the substrate material is heated and gradually cooled after the curing of the mold resin and before removing the plane holding means.

55. The method for manufacturing an electronic component according to claim 30, wherein after the curing of the mold resin and before the cutting step, attaching a plane holding means for holding the flatness of the substrate material to the substrate material; It is preferable that the method further includes a step of heating and gradually cooling the material, and a step of removing the plane holding means.

The method for manufacturing an electronic component according to claim 55, 56 or 57, wherein the plane holding means comprises: a plane holding plate applied to the back side of the substrate material; and a holding member for holding the plane holding plate and the substrate material together. Preferably, it is configured.

In the method for manufacturing an electronic component according to any one of claims 30 to 58, it is preferable that, in the substrate manufacturing step, the substrate material is integrally formed with the through-holes and the plating leads connected to the respective through-holes.

60. A method of manufacturing an electronic component according to claim 59, wherein prior to the cutting step, a semi-cutting step of cutting a plating lead from a through hole by making a cut in the substrate material and the mold resin, and an electrical inspection of the subsequent component parts are performed. It is preferable to further include an inspection step.

電子 In the electronic component manufacturing method according to claim 60, it is preferable that the cut in the half-cutting step is performed along a virtual line.

62. The method for manufacturing an electronic component according to claim 30, further comprising, prior to the cutting step, a step of attaching an adhesive sheet to one entire surface of the substrate material, and the cutting step completely cuts the sheet. It is preferred that this be done without.
(Action)

According to the electronic component of the first aspect, since the surface of the mold resin is formed flat, the entire thickness can be made constant. Further, since each side surface of the mold resin is formed flush with each side surface of the substrate, the entire planar shape can be formed small without wasting space due to a dam or the like.

According to the electronic component of claim 2, since the external electrode is formed by cutting the through hole in the axial direction, for example, unless the external electrode is filled with solder or the like, the external electrode is used as a positioning hole for the probe pin. Use makes electrical inspection easier.

According to the electronic component according to the third and fourth aspects, the external electrode is filled with a conductive paste or a metal material having solder wettability, so that the handleability is improved and when soldering to a motherboard or the like. In addition, a fillet is easily formed at the lower portion of the external electrode on the motherboard side, and the solderability can be improved. In addition, in the molding process, the molding resin does not flow into the external electrodes, thereby facilitating the production, omitting the members corresponding to the conventional dam, and disposing the component parts and the external electrodes in close proximity. can do. For this reason, the manufacturing cost can be reduced, and the whole can be formed compact. In addition, it is possible to use a mold material having low thixotropy, that is, a good wraparound.

According to the electronic components of claims 5 and 6, by using solder or gold for the metal material, solderability to a motherboard or the like can be further improved.

According to the electronic component of the present invention, a covering member for closing the opening of the external electrode on the mold resin side is provided, and the side end surface of the covering member is formed flush with the side surfaces of the mold resin and the substrate. Thus, similarly to the second and third aspects, in the molding step, the molding resin does not flow into the external electrodes, so that the manufacturing cost can be reduced and the whole can be formed compact. Further, a mold material having low thixotropy can be used.

According to the electronic component of the eighth aspect, by providing the same pad as the covering member between the substrate and the element component, the element component can be mounted with this pad as a positioning target. Further, it is possible to prevent a problem that the end of the element component is placed on the covering member and the element component is mounted in an inclined state.

According to the electronic component of the ninth aspect, a through-hole is formed in the pad, and a conductive member is provided inside the through-hole, so that in the element component requiring the die pad, the element component and the die pad are electrically connected. The same potential can be set.

According to the electronic components of the tenth to thirteenth aspects, by forming the covering member from an adhesive sheet, a dry film, a glass epoxy plate, or a ceramic plate, processing and mounting can be easily performed. In particular, in the case of a dry film or the like, a photo process used in a manufacturing process of a substrate can be applied, and processing and mounting can be further easily performed.

According to the electronic component of the fourteenth aspect, since the external electrodes are provided at the corners of the board, the printed pattern of the board can be dispersedly arranged, and the corners of the board that tend to be dead spaces can be removed. It can be used effectively. For this reason, the print pattern can be optimized, and the whole can be formed compact because the dead space is eliminated.

According to the electronic component material of the fifteenth aspect, by cutting this along the imaginary line, a leadless electronic component in which element components are mounted and molded is formed on a substrate having peripheral external electrodes. be able to. In this cut-out electronic component, each side surface of the mold resin and each side surface of the substrate are flush with each other, so that an electronic component similar to the second aspect can be manufactured. In this case, an electronic component material that can cut out one electronic component may be used, but an electronic component material that can cut out many electronic components by incorporating a large number of electronic component elements in a lattice shape like a semiconductor wafer. It is preferable to use a component material. In this way, a compact electronic component can be manufactured easily and quickly.

According to the electronic component material of the sixteenth aspect, by providing the dam at the peripheral portion of the substrate material, it is possible to prevent the molding resin from flowing out of the substrate material in the molding process, and to flow (apply) the molding resin. Can be performed efficiently, and a mold material having low thixotropy can be used.

According to the electronic component material of the seventeenth aspect, by further providing the plating lead, a plurality of electronic component elements can be plated at a time. In this case, since the electronic component elements are arranged collectively, unevenness and waste of plating can be reduced.

According to the electronic component material of the eighteenth aspect, since the plating leads are provided on both the front and back surfaces of the substrate material, localization of the plating current is suppressed, and the plating thickness can be kept constant over the entire area.

According to the electronic component material of claims 19 and 20, a plurality of electronic component elements are formed by filling a through hole with a conductive paste or a metal material having solder wettability by a printing process or a plating process in a substrate manufacturing technique. The metal material can be filled all at once, and the molding resin does not flow into the through holes in the molding process, thereby facilitating the production. Moreover, the through-holes (external electrodes) of the cut out electronic component are filled with the above-mentioned metal material, and the same electronic component as in claim 3 or 4 can be manufactured.

According to the electronic component material of claims 21 and 22, by using solder or gold as the metal material, the cut out electronic component is made an electronic component having good solderability as in claims 5 and 6. be able to.

According to the electronic component material of the twenty-third aspect, by providing the covering material for closing the opening of the through hole on the surface of the substrate material, the covering material can be provided collectively for a plurality of electronic component elements. In the molding process, the molding resin does not flow into the through-holes, and the manufacturing is facilitated. In addition, the cut out electronic component can be the same electronic component as in claim 7.

According to the electronic component material of the twenty-fourth aspect, by providing exactly the same pad as the covering material between the substrate material and each component, it is possible to easily attach the pad and improve the yield. it can. Further, the cut out electronic component can be the same electronic component as in claim 8.

According to the electronic component material of claims 25 to 28, by forming the covering material with an adhesive sheet, a dry film, a glass epoxy plate, or a ceramic plate, processing and mounting can be easily performed, and The cut out electronic component can be the same electronic component as in claims 10 to 13.

According to the electronic component material of claim 29, the cut-out electronic component is provided with a through-hole (external electrode) at a corner of the substrate by providing the through-hole at the intersection of the grid-like virtual lines. The same electronic component as described above can be obtained.

According to the electronic component manufacturing method of the present invention, when the mold resin is cured through the substrate manufacturing process, the mounting process, the connecting process, and the molding process, the same electronic component material as in claim 15 is formed, and the cutting process is further performed. , The same electronic component as in claim 2 is cut out. For this reason, if many electronic component elements are formed in the electronic component material, many electronic components can be manufactured at once. Further, by cutting, the side surface of the mold resin of each electronic component and the side surface of the substrate can be formed completely flush. The cutting position (line) may be on the virtual line as long as it is along the virtual line, or may be slightly off the virtual line. As the cutting method, dicing is preferable, but braking may be used.

According to the electronic component manufacturing method of the twenty-first aspect, the dam is formed on the peripheral portion of the substrate material prior to the molding step, so that the molding resin can be prevented from flowing out of the substrate material. Pouring (application) can be performed efficiently, and a mold material having low thixotropy can be used. Further, the mold resin can be uniformly applied.

According to the electronic component manufacturing method of the present invention, the mold resin can be more uniformly applied by using the jig and curing the mold resin while holding the substrate material horizontally.

According to the method for manufacturing an electronic component of claim 33, by controlling the poured mold resin by weight, the thickness accuracy of the mold resin is remarkably improved as compared with the conventional method of controlling the discharge time from the supply device. Therefore, the thickness of the electronic component can be controlled with high accuracy.

According to the electronic component manufacturing method of claims 34 and 35, the through-hole is filled with a conductive paste prior to the molding step, whereby the same electronic component material as in claim 18 can be formed. By cutting, an electronic component similar to the third aspect can be manufactured.

According to the electronic component manufacturing method of the thirty-sixth aspect, the same electronic component material as the nineteenth aspect can be formed by filling the through-hole with a metal material having solder wettability prior to the molding step. By further cutting the same, an electronic component similar to the fourth aspect can be manufactured.

According to the electronic component manufacturing method of the present invention, the solder paste is filled in the through-hole and then heated and melted to fill the through-hole with the solder. In this method, since a substrate manufacturing technique using a stencil, a dry film, or the like can be applied, solder can be accurately and easily filled.

According to the electronic component manufacturing method of the thirty-eighth aspect, by bringing the opening of the through hole into contact with the molten and ruffled solder, the solder penetrates and fills the through hole by capillary action. According to this method, solder can be quickly filled, and solder for mounting on a motherboard can be supplied to electronic components in advance.

According to the electronic component manufacturing method of claim 39, after masking the substrate material and rinsing it with molten solder, the solder penetrates only through holes and is filled therein. In this method, the filling of the solder can be performed accurately and easily. If the above-mentioned method is used in combination, the solder can be filled accurately and quickly.

According to the method for manufacturing an electronic component of the present invention, by plating the through-hole thickly, the inside of the through-hole is filled with plating, and the through-hole is filled with a plating material. In this method, plating of the printed pattern of the substrate material can be used together, and the filling of the solder can be performed extremely easily.

According to the electronic component manufacturing method of claim 41, prior to the molding step, a closing step of closing an opening of the through hole opened on the back surface of the substrate material using a closing member, and a closing step after the molding resin is cured. By providing an opening step of removing the member, in the molding step, air is sealed in each through hole, and the intrusion of the molding resin into the through hole is prevented. For this reason, it is possible to prevent the mold resin from flowing into the through-hole without using a covering member or a filling member that is formed in the electronic component.

According to the electronic component manufacturing method of Claims 42 and 43, by closing the entire through hole by pressing the flat plate member so as to cover the entire back surface of the substrate material and performing the closing step. And the opening step can be performed extremely easily. At this time, the use of silicone rubber as the flat member does not impair the adhesiveness against a temperature change or the like, and does not cause any trouble such as escape of the enclosed air.

According to the electronic component manufacturing method of claim 44, by forming the closing member with an adhesive sheet covering the entire back surface of the substrate material, it is possible to maintain desired adhesion without holding down the adhesive member. And can be easily attached to the substrate material.

According to the method for manufacturing an electronic component according to claims 45 and 46, the sheet is constituted by a sheet whose adhesive strength is reduced by ultraviolet light or heat, and after the mold resin is cured, these sheets are irradiated with ultraviolet light, Alternatively, if heat is applied, even a sheet having a strong adhesive force can be easily peeled off.

According to the electronic component manufacturing method of claim 47, the closing member is made of a resin that is dissolved in an alkali aqueous solution that has been poured into each through hole and hardened, so that after the mold resin is hardened, preferably in a cutting step. After washing with an alkaline aqueous solution, the closing member can be easily and completely removed from the electronic component.

According to the manufacturing method of an electronic component of the present invention, before the molding step, when the molding resin is cured by attaching a covering material for closing the through hole to the surface of the substrate material, the same electronic device as in claim 23 can be obtained. An electronic component similar to the seventh aspect is manufactured by forming the component material and further performing a cutting step.

According to the electronic component manufacturing method of claims 49 to 54, the covering material is formed of an adhesive sheet, a dry film, a molded plate of glass epoxy, or a molded plate of ceramic to facilitate processing and mounting. And the cut-out electronic component can be used as the same electronic component as in claims 10 to 13. Further, by using a prepreg made of glass epoxy or a green sheet made of ceramic, and then heat-pressing the green sheet to form a covering material, the processing can be further facilitated.

According to the electronic component manufacturing method of the present invention, prior to the molding step, by attaching the plane holding means for holding the flatness of the substrate material, when the molding resin is hardened, the heat of the molding resin and the substrate material is reduced. The warpage of the substrate material based on the difference in expansion coefficient can be reduced. As a result, the cut-out electronic component can have good solderability without warpage.

According to the electronic component manufacturing method of claims 56 and 57, before removing the plane holding means, the substrate material is heated again and gradually cooled together with the hardened mold resin, thereby alleviating the relaxation phenomenon due to the viscous component of the mold resin. (Creep phenomenon), and the warpage of the substrate material can be further reduced. It should be noted that the creep phenomenon can be generated even if the flat surface holding means is attached after the mold resin is hardened, and then heated and gradually cooled.

According to the electronic component manufacturing method of claim 58, the plane holding means is constituted by the plane holding plate applied to the substrate material from the back side, and the holding member for holding the plane holding plate and the substrate material together. With this, it is possible to maintain the flatness of the substrate material simply by attaching the plane holding plate and the holding member to the substrate material, and the plane holding means is disturbed in a molding process or the like. Absent. However, if the holding member is formed in a frame shape, the function of the dam can be provided. Further, the flat holding member may also serve as the flat plate-shaped member according to claim 42.

According to the electronic component manufacturing method of claim 59, by forming plated leads in the substrate material, the same electronic component material as in claim 17 is formed, and a plurality of electronic component elements are collectively plated. Can be.

According to the method for manufacturing an electronic component of claim 60, prior to the cutting step, after the plating lead is separated from the through hole by half-cutting, an electrical inspection of the element component is performed, so that a state of the electronic component material is obtained. The electronic component elements can be electrically independent, and inspection of each electronic component element can be performed in this state. Therefore, the inspection process can be simplified.

According to the electronic component manufacturing method of the present invention, since the half cutting is performed along the virtual line, the cutting line in the half cutting step and the complete cutting line in the cutting step can be made the same, and the cutting can be performed. It can be performed efficiently.

According to the electronic component manufacturing method of the above aspect, before the cutting step, an adhesive sheet is stuck on the entire surface of one side of the substrate material, so that the cut electronic component is cut in the same manner as the semiconductor wafer dicing step. Parts can be prevented from falling apart, and the post-process can be facilitated.

の Since the present invention is configured as described above, the following effects can be obtained.

According to the electronic component of the first aspect, since the surface of the mold resin is formed flat, the entire thickness can be made constant and thin. In addition, since there is no dam, the structure is simple and the planar shape can be reduced. Further, electrical inspection can be facilitated by using the through holes. Therefore, it can be manufactured inexpensively and small. On the other hand, by filling the through hole with a metal material having solder wettability, a dam is not required, solderability can be improved, and miniaturization and reliability can be improved. Similarly, by providing a covering member for closing the opening of the through hole, downsizing can be achieved. Further, by providing the three holes at the corners of the substrate, downsizing can be achieved.

According to the electronic component material of the fifteenth aspect, it is possible to manufacture a large number of electronic component elements that become electronic components by cutting at one time, and it is possible to efficiently manufacture (cut out) the electronic component of the second aspect. Further, by providing a dam in the substrate material, the mold resin can be uniformly and favorably applied to each electronic component element. Further, by forming the plating leads, it is possible to perform plating on each electronic component element at the same time.

According to the electronic component manufacturing method of claim 30, a large number of the electronic components of claim 2 can be manufactured at one time. That is, an inexpensive and small electronic component can be efficiently manufactured. Further, by controlling the mold resin by weight and curing it while holding it horizontally, the electronic component can be formed as thin as possible without impairing the reliability of the mold. Further, when the mold resin is cured, the flatness of the substrate can be accurately held by a simple method by using the flatness holding means, and the reliability of the electronic component can be improved. Moreover, electrical inspection can be performed at the stage of the electronic component element before being separated as an electronic component, and the inspection process can be simplified.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a structural view of a chip carrier type (leadless package type) electronic component according to an embodiment of the present invention. FIG. 1B is a rear view of the chip carrier type electronic component as viewed from the rear side. FIG. 1A is a cross-sectional view taken along line C-C ′ of FIG. As shown in FIG. 1 (a), this electronic component is obtained by mounting a semiconductor element 1 on a substrate 6 cut in an outline passing near the axis of a through hole (external electrode) 7 in which solder 9 is filled in advance. The semiconductor element 1 and the wiring pattern 3 formed on the substrate 6 are electrically connected to each other by wires 2 while being die-attached.

Here, the semiconductor element 1 will be described as an example of an element component, but the element element may be an active element such as a semiconductor element (IC, LSI, etc.) or a so-called passive element such as an inductance element or a capacitance element. In general, those placed on a substrate correspond to this.

(4) Then, a part of the wiring pattern 3 is configured to be a bonding pad for wire bonding. The wiring pattern 3 is connected to the connection land 8 via a through hole (external electrode) 7, and is normally soldered to a motherboard (not shown) to be connected via the through hole 7 and the connection land 8. Can be In this case, the inside of the through hole 7 is filled with the solder 9, so that a solder fillet (a hem of the solder) of the through hole (side surface of the electronic component) is easily formed. As a result, it is possible to improve the reliability of the electronic component as well as to improve the appearance inspection property in the mounting process of the electronic component, as is known.

The substrate 6 is usually a printed circuit board, but may be a ceramics substrate. The mold resin 5 is cut into the same outer shape as the substrate 6 by a method described later. The die attach of the semiconductor element 1 is often performed with an epoxy adhesive or a silver paste. The wire 2 is often a gold wire or an aluminum wire, and is connected by a known wire bonding method. When the board 6 is a printed board, the wiring pattern 3 and the surface of the through hole 7 and the inside thereof are often gold-plated on a copper foil. In the case of a ceramics board, the wiring pattern 3 is made of copper, silver, tungsten, or the like. In many cases, the system paste is gold-plated or formed of a gold paste.
In this case, the through hole 7 may be plated with nickel or gold on copper formed by plating similarly to the printed circuit board, or may be filled with the above-mentioned conductive paste.

In this case, as the material of the conductive paste, a material containing any of copper, silver, gold, and the like is preferably used. In particular, when an organic substrate is used as the substrate 6, it is preferable to use a conductive paste containing copper as the material of the conductive paste because the firing temperature is low. It is particularly preferable to use a conductive paste in which copper particles are silver-plated. In addition, the conductive paste is filled by filling the inside of the through-hole 7 with the squeegee 24 and then heating and curing the same as in the case of the solder 9 described later with reference to FIG.

On the other hand, here, the example in which the solder 9 is filled in the through hole 7 has been described. However, as long as the metal material has solder wettability, for example, gold or the like may be filled, or the conductive paste may be filled. Is also good.

Next, a method for manufacturing a chip carrier type electronic component having the structure shown in FIG. 1 will be described with reference to FIG. As shown in FIG. 2A, a substrate (substrate material) 6 in which a through hole 7 is previously formed in a connection portion of a chip carrier is prepared. Next, a stencil 23 having a small hole 22 corresponding to the through hole 7 is aligned so that the holes overlap each other, and the cream solder 21 is printed with a squeegee 24 on a table (not shown) for receiving the substrate 6. . At this time, by making the hole diameter of the stencil 23 equal to or slightly smaller than the hole diameter of the through hole 7, or by controlling the moving speed and pressing of the squeegee 24, the cream solder 21 is inserted only into the inside of the through hole 7. With this, even if the solder 9 is melted later, the solder 9 can be filled only in the through hole 7. The stencil 23 generally has a thickness of 100 to 200 μm, but the volume of the solder 9 to be filled is determined by the volume of the through hole 7, and the thickness and the hole diameter of the stencil 23 are also determined.

塗布 As a method of applying the solder 9, other known methods used for surface mounting, for example, a method using a dispenser can be used in addition to the above. Next, the through-hole 7 of the substrate 6 is heated by a reflow oven, hot air, infrared rays, or the like, so that the cream solder 21 is melted, and the solder 9 is filled in the through-hole 7. Then, if necessary, this is washed to remove the flux contained in the cream solder 21.

In addition, a mask having only the through-holes 7 formed on one or both sides of the substrate 6 with a resist, a dry film or the like is formed in advance, and the cream 9 is printed on the substrate 6 so that the solder 9 can be passed through more reliably. Only the holes 7 can be filled. Then, after the solder 9 is filled or the solder 9 is melted, the resist, the dry film and the like may be removed. In addition, according to this method, the cream solder 21 can be filled only in the through-hole 7 by directly placing the cream solder 21 on the substrate 6 and rubbing it with the squeegee 24 without using the stencil 23.

(2) Thereafter, as shown in FIG. 2B, the semiconductor element 1 is die-attached, and the semiconductor element 1 that has been die-attached and the wiring pattern 3 formed on the substrate 6 are electrically connected with the wires 2. Further, as shown in FIG. 2C, the molding resin 5 is potted (coated) on the substrate. At this time, since the solder 9 is filled in the through hole 7, the molding resin 5 is And does not seep into the back surface of the substrate 6. Of course, the above-described potting mold that does not require a mold is sufficient, even if it is not a transfer mold that requires an expensive mold having a structure in which the through hole 7 is escaped. Even if a transfer mold is used, since the through holes 7 are filled with the solder 9, it is not necessary to adopt a structure for escaping the through holes 7, and it is possible to mold the through holes 7 at once including the through holes 7. .

In the case of the potting mold, if the peripheral portion of the substrate 6 is designed to be slightly wider or a dam is provided in the peripheral portion of the substrate 6, the molding resin 5 may not be a molding material having a high thixotropic property. For this reason, since the mold resin 5 satisfactorily flows into the gap around the semiconductor element 1, no unfilled portion of the mold resin 5 occurs, and the reliability can be improved. In addition, when vacuum degassing is also used in the application step of the mold resin 5, the occurrence of unfilled portions can be completely prevented. Further, if the surface of the substrate 6 and the surface of the semiconductor element 1 are activated by a plasma of oxygen, argon or the like immediately before the step of applying the mold resin 5, the adhesion of the mold resin 5 becomes better, and Reliability is further improved.

Next, the mold resin 5 is cured by a curing method such as heating, ultraviolet irradiation, or standing in a humidity. Through the above steps, an electronic component material is formed. The electronic component material is configured by mounting a plurality of semiconductor elements 1 on a large substrate (substrate material) 6 in which a through hole 7 is formed, and applying a mold resin 5 to the semiconductor element 1. That is, the electronic component element sharing the through hole 7 is formed on the substrate 6. In this case, as shown in the figure, a small number of electronic component elements such as two or one may be formed, but it is preferable to form a large number in a matrix.

Finally, as shown in FIG. 2C, the electronic component material is diced along the portion of the through hole 7 which is the outer shape of the chip carrier type electronic component, that is, along a virtual line passing substantially through the axis of the through hole 7. It is cut by the blade 20 to make the electronic component alone. The last cutting step may be a breaking step of breaking the substrate 6 without using dicing. In this case, a V-groove, a perforation, or the like is formed in advance on the substrate 6 along an imaginary line substantially passing through the axis of the through hole 7.

As described above, a structure in which a large number of electronic components are taken from one substrate 6 may be adopted. In this case, if the positions of the through holes 7 of the adjacent electronic components match, the through holes 7 are connected to the adjacent electronic components. It is preferable to share with. However, when the through hole 7 is crushed at the time of cutting because the dicing blade 20 is thick, the through hole 7 is cut at a position slightly deviated from the axis of the through hole 7 so that only one cut side is used. (See FIG. 13).

Next, another method of manufacturing the chip carrier type electronic component having the structure shown in FIG. 1 will be described with reference to FIG. As shown in FIG. 3A, a substrate 6 having a through hole 7 formed in advance at a connection portion of a chip carrier is prepared, and a flux coating device (not shown) is provided only in the vicinity of the opening of the through hole 7 of the substrate 6. ) To apply flux. Next, the substrate 6 is brought close to the liquid surface of the molten solder 31, and a solder jet 30 is ejected from a nozzle or the like provided corresponding to the through hole 7, and the substrate 6 is exposed to the opening of the through hole 7. The molten solder 31 is brought into contact. In this case, if the diameter of the through hole 7 is about 0.5 mm or less, only the inside of the through hole 7 can be filled with the solder 9 by a capillary phenomenon.

In addition, if a mask having only the through hole 7 made of a resist, a dry film or the like is formed on the surface of the substrate 6 or the both surfaces of the substrate 6 to which the solder jet 30 is applied, the solder 9 can be accurately filled only in the through hole 7. it can. After the solder 9 is filled, the resist, the dry film and the like are removed. According to such a manufacturing method, only through-hole 7 can be filled with solder 9 even if substrate 6 is immersed in a solder bath as it is. Also, by using a solder resist so as not to spread the solder 9 more than necessary, the solder 9 can be accurately filled only in the through hole 7. In such a case, the flux is removed by washing as necessary.

(3) Subsequent steps are the same as the steps described in FIG. 2 described above, as shown in FIGS. 3 (b) and 3 (c). 3B and 3C, since the connection lands 8 on the back surface of the substrate 6 are not masked with a resist, a dry film, or the like, the solder 9 is supplied to the connection lands 8 together with the through holes 7. become. In this way, if the solder 9 is also supplied to the connection lands 8 in advance, the solderability can be improved when the cut-out electronic components are later soldered to the motherboard. In addition, the supply of the solder 9 to the connection lands 8 may be performed at the same time as the printing of the cream solder 21 described with reference to FIG. 2 or may be performed at the same time as the plating of the through holes 7 described later.

In addition, in addition to the methods shown in FIGS. 2 and 3, the through-hole 7 may be partially closed with plating of solder, gold, or the like, or may be closed with a conductive paste. However, since the connection to the motherboard is generally made by soldering, it is desirable that the metal material to be filled in the through hole 7 as the connection portion is hard to be oxidized and has good solder wettability. Specifically, as the conductive paste, a gold paste is more preferable than a copper paste.

Furthermore, another embodiment of the present invention will be described. FIG. 4 is a structural view of another chip carrier type electronic component according to the present invention. FIG. 4B is a back view of the chip carrier type electronic component as viewed from the back side. FIG. 4A is a cross-sectional view taken along line B-B ′ of FIG. 4B. As shown in FIG. 4, this electronic component has the same structure as that of FIG. 1 except that solder 9 is not filled in through holes (external electrodes) 7 of the electronic component of FIG. Since the solder 9 is not filled in the through hole 7, the structure is simplified and the cost does not increase. Further, since there is no metal material filled in the through-hole 7, the through-hole 7 can be used as a positioning hole for a probe pin for inspection during an electrical inspection of an electronic component in a later process, and conduction can be reliably achieved. it can.

Next, a method of manufacturing the chip carrier type electronic component shown in FIG. 4 will be described with reference to FIG. In FIG. 5A, a substrate 6 in which a through hole 7 is formed in advance at a connection portion of a chip carrier is prepared, and an adhesive sheet 40 is stuck on the entire back surface of the substrate 6. The pressure-sensitive adhesive sheet 40 may be of any type as long as it does not allow air to pass through. However, the one used in the dicing step of the semiconductor element 1 is reliable because it has few impurities. Further, the pressure-sensitive adhesive sheet 40 may be one that keeps the pressure-sensitive adhesive property, but is preferably a pressure-sensitive adhesive sheet that is easily peeled off in a later step and has a reduced pressure-sensitive adhesive property by known ultraviolet light or heat. Then, in this state, as shown in FIG. 5B, the semiconductor element 1 is die-attached, and the semiconductor element 1 and the wiring pattern 3 formed on the substrate 6 are electrically connected with the wires 2. .

Here, the mold resin 5 is potted on the substrate 6. At this time, the mold resin 5 is applied in a state where the opening of the through hole 7 opened on the back surface side of the substrate 6 is closed with the adhesive sheet 40. . For this reason, air is sealed in the through hole 7 and the inflow of the mold resin 5 which is a viscous fluid into the through hole 7 is prevented. Therefore, the mold resin 5 does not flow into the through-hole 7 even if no special cover member or the like is provided. Although no experimental results are shown, in the case of a commonly used mold resin 5 having a viscosity of 20,000 to 50,000 centipoise, the above effect has been confirmed in a through hole 7 having a diameter of 0.5 mm or less. The above effect can be obtained by increasing the viscosity of the mold resin 5 even in the through hole 7 having a diameter of 0.5 mm or more.

In this state, after the mold resin 5 is cured, as shown in FIG. 5C, the adhesive sheet 40 is peeled off, and finally, the adhesive sheet 40 is cut along the through holes (virtual lines) 7 by the dicing blade 20. To make the electronic component alone. As described above, the pressure-sensitive adhesive sheet 40 is preferably a sheet whose adhesive force is reduced by heat or the like, because it is easy to peel off. As a method of molding, a potting mold that does not require a mold may be used, and a normal thixotropy can be used as in the description of FIG. 2 described above. However, if vacuum defoaming is performed after molding by such a manufacturing method, there is a possibility that the mold resin 5 may enter the inside of the through hole 7. You need to stop it to foam.

By adopting the above-described manufacturing method, a gold-plated through-hole (external electrode) 7 is exposed on the side surface of the cut out electronic component, and a solder fillet is easily formed in this through-hole 7 when connected to a motherboard. Thus, the solderability of the electronic component can be improved. Even in the case of the ceramic substrate, the case of the hollow through hole 7 is the same as the above-described printed circuit board. When the conductive paste is filled, the structure is the same as that described with reference to FIG.

Next, another method of manufacturing the chip carrier type electronic component having the structure shown in FIG. 4 will be described with reference to FIG. As shown in FIG. 6A, a substrate 6 in which a through hole 7 is previously formed in a connection portion of a chip carrier is prepared, and the semiconductor element 1 is die-attached on the substrate 6, and the semiconductor element 1 is The wiring 2 is electrically connected to the wiring pattern 3 formed thereon. Then, as shown in FIG. 6B, the silicone rubber 50 is pressed against the back surface of the substrate 6 to close the through hole 7, and the mold resin 5 is potted and cured as it is. The reason that the mold resin 5 does not flow into the through holes 7 is based on the same principle as in the case where the pressure-sensitive adhesive sheet 40 is used. The subsequent steps are the same as the steps described in FIG. 5 described above, as shown in FIG.

In order to improve the adhesion between the through-hole 7 and the silicone rubber 50 and more reliably hold the air in the through-hole 7, the contact portion of the silicone rubber 50 with the through-hole 7 and the connection land 8 are May be formed in a concave shape complementary to these convex shapes, or a pin-like projection for closing the inside of the through hole 7 may be formed on the surface of the silicone rubber 50. Good.

In order to prevent the mold resin 5 from flowing into the through-hole 7, the through-hole 7 is closed by a well-known method for manufacturing a substrate, and the filled resin is removed after the dicing process. You may. In this case, generally, a resin soluble in an alkaline aqueous solution is used, and after the dicing step, the resin is removed by washing with an alkaline aqueous solution.

Furthermore, another embodiment of the present invention will be described. FIG. 7 is a structural view of another chip carrier type electronic component according to the present invention. FIG. 7B is a back view of the chip carrier type electronic component as viewed from the back side. FIG. 7A is a cross-sectional view taken along line D-D ′ of FIG. 7B. As shown in FIG. 7, this electronic component is obtained by mounting a through-hole covering member 70 on a through-hole (external electrode) 7 in advance and cutting the substrate 6 into an outer shape passing near the axis of the through-hole 7. The semiconductor element 1 is die-attached, and the semiconductor element 1 and a wiring pattern 3 formed on a substrate 6 are electrically connected by wires 2.

The through-hole covering member 70 is provided only on the through-hole 7, and is made of an adhesive sheet such as a dry film, a glass epoxy plate, or a ceramic plate used in a substrate manufacturing process. In this case, these through-hole covering members 70 may be stamped and formed with a mold or the like so as to be placed on the through-holes 7, and may be attached to the substrate 6. Of course, in the case of a dry film, it is bonded to the entire surface of the substrate 6 and only a necessary portion of the through hole 7 is left by a photo process similar to the conventional substrate manufacturing technology.

In addition, the glass epoxy plate that has already been formed may be bonded to the substrate 6 with an adhesive, or an unformed glass epoxy prepreg may be formed in a required shape in advance using a mold or the like, and the positioning may be performed. Thereafter, the substrate 6 may be heated and pressed. Further, when the substrate 6 is a ceramic, the unsintered green sheet is previously formed into a required shape by a mold or the like, and after molding, the green sheet and the substrate 6 are heated and pressed together with the green sheet. The green sheet may be sintered. The basic structure of the parts other than the through-hole covering member 70 is the same as that of the electronic component shown in FIGS.

Furthermore, another embodiment of the present invention will be described. FIG. 8 is a structural view of another chip carrier type electronic component according to the present invention. FIG. 8B is a back view of the chip carrier type electronic component as viewed from the back side. FIG. 8A is a cross-sectional view taken along line E-E ′ of FIG. 8B. As shown in FIG. 8, in this electronic component, the through-hole covering member 70 is provided not only between the through-hole (external electrode) 7 but also between the semiconductor element 1 and the substrate 6. That is, the semiconductor element 1 is not directly attached on the substrate 6 but is die-attached on the through-hole covering member (pad) 70. Other structures are the same as those in FIG.

Therefore, the through-hole covering member 70 only needs to be opened at a portion where the wire 2 is connected to the wiring pattern 3. As the through-hole covering member 70, an adhesive sheet, a glass epoxy plate, or a ceramic plate is used. When such a structure is used, unlike the structure shown in FIG. 7, it is not always necessary to form a punched opening with an expensive mold, but may be formed by processing with a drill bit. In addition, the positioning of the semiconductor element 1 becomes easy. Therefore, when the structure of FIG. 8 is employed, the manufacture of the through-hole covering member 70 and the mounting of the semiconductor element 1 are easier than in the structure of FIG. 7, and the cost of the electronic component can be reduced.

Furthermore, another embodiment of the present invention will be described. FIG. 9 is a structural view of another chip carrier type electronic component according to the present invention. FIG. 9B is a back view of the chip carrier type electronic component as viewed from the back side. FIG. 9A is a cross-sectional view of the chip carrier type electronic component of FIG. 9B taken along the line F-F ′. As shown in FIG. 9, in this electronic component, a through-hole 73 is formed in a through-hole covering member (pad) 70 between the semiconductor element 1 and the substrate 6 in FIG. Holes 73 are filled with silver paste 72. The silver paste 72 electrically connects the die pad 71 formed on the substrate 6 to the back surface of the semiconductor element 1.

Generally, the die pad 71 is often connected to a certain fixed potential, and the structure of FIG. 9 is an effective structure when the potential of the die of the semiconductor element 1 must be fixed. In this case, of course, the through-hole covering member 70 only needs to be open at the portion where the wire 2 is connected to the wiring pattern 3 and at the portion of the through-hole 73 described above. When an adhesive sheet, a glass epoxy plate, a ceramics plate, or the like is used, an inexpensive through-hole covering member 70 processed with a drill bit may be attached similarly to the structure of FIG.

Next, a method of manufacturing a chip carrier type electronic component having the structure shown in FIGS. 7 to 9 will be described with reference to FIG. As shown in FIG. 10A, first, a substrate (substrate material) 6 having a through hole 7 formed in a connection portion of a chip carrier is prepared. Next, the through-hole covering member 70 is mounted on the through-hole 7. The through-hole covering member 70 is formed by punching out a sheet having adhesiveness, a dry film used in the substrate manufacturing technology, a glass epoxy plate, a ceramic plate, or the like so as to be positioned only on the through-hole 7, and the like. This may be attached to the substrate 6. Of course, in the case of a dry film, it may be bonded to the entire surface of the substrate, and only the through hole 7 may be left by a photo process similar to the conventional substrate manufacturing technology.

As shown in FIG. 10A, the through-hole covering member 70 may be provided only in the portion of the through-hole 7, or in addition to this, as described in FIGS. May be provided as a pad of the semiconductor element 1. Thereafter, the semiconductor element 1 is die-attached, and the semiconductor element 1 thus die-attached and the wiring pattern 3 formed on the substrate 6 are electrically connected with the wires 2. Further, as shown in FIG. 10B, the mold resin 5 is potted (coated) on the substrate. At this time, since the through-hole 7 is covered with the through-hole covering member 70, the mold resin 5 Does not flow into the through hole 7 and does not seep into the back surface of the substrate. Finally, as in FIG. 2C, the electronic component material is removed along the portion of the through hole 7 which is the outer shape of the chip carrier type electronic component, that is, along a virtual line passing substantially through the axis of the through hole 7. It is cut by the dicing blade 20 to make the electronic component alone.

Further, a method for manufacturing another electronic component will be described with reference to FIG. Similarly to the above embodiments, the semiconductor element 1 is die-attached, wire-bonded, and the mold resin 5 is potted (applied) on the substrate 6. In this embodiment, as shown in FIG. When the mold resin 5 is cured, a flat surface holding means for holding the flatness of the substrate 6 is attached to the substrate 6.
The plane holding means includes a plane holding plate 80 applied to the back surface of the substrate 6, and a holding member 81 having a “U” cross section for holding the plane holding plate 80 and the substrate 6 together. Removably attached to. In this state, the mold resin 5 is cured by a method suitable for the mold material to be used. Generally, since the mold resin 5 is made of a thermosetting epoxy resin, it is placed in a thermostat and cured.

By the way, in general, the thermal expansion coefficient of the mold resin 5 (2 to 3 × 10 −5 / ° C. for a frequently used resin) is determined by the thermal expansion coefficient of a substrate (FR-4 as a typical substrate example). , About 1.5 × 10 −5 / ° C.), and the molding resin 5 undergoes several percent to several tens of percent cure shrinkage. Therefore, if the substrate 6 coated with the mold resin 5 is cured as it is, the substrate 6 warps in a concave shape around the mold resin 5. However, when the mold resin 5 is cured in a state where the above-mentioned flat surface holding means is attached to the substrate 6, a relaxation phenomenon (creep phenomenon) due to a viscous component of the mold resin 5 causes the substrate (the electronic component material 6) in this state. The degree of warpage is reduced. Finally, the warpage of the substrate 6 from which the plane holding means has been removed becomes extremely small, and works advantageously in the subsequent steps such as dicing and probing electrical characteristic inspection, in which flatness of the substrate 6 is required. In addition, the warpage of the electronic component, which is the final product, can naturally be reduced.

Further, after the mold resin 5 is cured, as shown in FIG. 11, a flat holding means is attached to the warped substrate 6, and in this state, the substrate (electronic component material) 6 is heated again and further cooled down. In this case, the warpage of the substrate 6 is reduced. This is a step generally called annealing, but also because of a relaxation phenomenon (creep phenomenon) due to a viscous component of the mold resin 5. Of course, if the step of attaching the plane holding means to the substrate 6 to cure the mold resin 5 and the step of annealing with the plane holding means attached are combined, the warpage of the substrate 6 can be further reduced. Needless to say.

Next, a method of applying a useful mold resin in the method of manufacturing an electronic component of the present embodiment will be described. Although not particularly shown, in this method of applying a mold resin, the amount of the mold resin poured (applied) to the substrate is controlled by its weight. That is, the area to which the mold resin is applied is determined by the corresponding substrate, and the specific gravity of the mold resin (thermosetting epoxy resin) is approximately 1.8. Therefore, by controlling the applied mold resin by weight, the applied thickness of the mold resin can be controlled. In consideration of the volume of the component element to be molded, such as a semiconductor element, the thickness of the applied mold resin can be accurately controlled.
For example, a mold resin can be applied to a 0.4 mm substrate with an accuracy of 0.8 mm to 0.9 mm thickness, without mold cracking, and minimizing the thickness as an electronic component. can do.

Further, in this method of applying the mold resin, the substrate on which the mold resin is applied is held horizontally and cured. That is, using a jig for holding the substrate horizontally, the mold resin is cured while the substrate is held horizontally in the constant temperature bath.
In this way, the applied thickness of the mold resin of the electronic component material can be made uniform, and the applied thickness of the cut electronic component mold resin, and thus the thickness of the electronic component, can be made constant. As a means for measuring the weight of the mold resin, various types of balances such as an electronic balance are considered, and the jig is a three-point support provided with a level (height adjustable). A table with three legs is conceivable.

Next, another embodiment of the present invention applicable to the structure of any of the above electronic components will be described. FIG. 12 is a substrate structure diagram of another chip carrier type electronic component according to the present invention. Here, the two types of substrate structures will be described with reference to an overlapped view so that they can be compared with each other. In FIG. 12, reference numeral 61 denotes a die attach portion of a semiconductor element common to two types of substrate structures. Hereinafter, the substrate 6, the wiring pattern 3, and the through hole 7 are indicated by solid lines in one substrate structure 62 and by two-dot chain lines in the other substrate structure 63. The solid line is the substrate structure 62 of the embodiment, and the through-hole 7 and the wiring pattern 3 serving as a bonding pad for wire bonding are formed at four corners of the substrate 6. The two-dot chain line indicates the known substrate structure 63, and the through hole 7 and the wiring pattern 3 are formed on four sides of the substrate 6.

In particular, when the semiconductor element 1 and the wiring pattern 3 are connected to each other in four or less, as shown in FIG. It can be seen that the formation at the four corners of the substrate 6 instead of the side portions can effectively utilize the four corners of the substrate 6 that are liable to be a dead space, which is advantageous in reducing the size of the substrate. Here, when the number of the semiconductor elements 1 and the wiring patterns 3 is three or less, the through holes 7 do not need to use all four corners of the substrate 4. On the other hand, in the case of manufacturing an electronic component having the substrate structure 62, a substrate (substrate material) 6 having a through-hole (through-hole material) 7 formed at an intersection of a virtual line which will be a cutting line later is prepared. An electronic component material is formed and cut along a virtual line.

Similarly, another manufacturing method applicable to any chip carrier type electronic component will be described with reference to FIG. The cutting step of the substrate 6 described below is a step performed after mounting the semiconductor element 1 and applying the mold resin 5 as described above. The element 1 and the wire 2 are omitted. FIG. 13A is a rear view of a substrate (substrate material) 6 used for a chip carrier type electronic component according to the present invention, and FIG. 13B is a plan view thereof.

符号 Reference numeral 71 shown in FIG. 13B denotes a die pad, to which the semiconductor element 1 is die-attached. The semiconductor element 1 is connected to the wiring pattern 3, and further connected to the back surface of the substrate 6 through the through hole 7. The broken line in the figure is a full dicing line (virtual line) 91, and the area surrounded by this line 91 finally becomes the outer shape of the chip carrier type electronic component. Of course, in an actual process, the molding resin 5 is applied to the entire surface of the substrate 6, and the wiring pattern 3, the through hole 7, and the like in FIG. Further, the back surface of the substrate 6 in FIG. 13A does not change in appearance before and after mounting before dicing.

As shown in FIG. 13A, a plating lead 92 connected to each through hole 7 is provided at a peripheral portion of the back surface of the substrate 6, and the wiring pattern 3 and the wiring pattern 3 on the surface of the substrate 6 are formed by the plating lead 92. Electroplating is performed on the through holes 7 and the connection lands 8 on the back surface of the substrate 6. Therefore, all the through holes 7, the wiring patterns 3 following the through holes 7, and the external connection portions of the semiconductor element 1 are all electrically short-circuited by the plating leads 92.

Therefore, in order to eliminate this short circuit state after plating, the plating lead 92 is cut by the half dicing line 90 in the embodiment. The half dicing is performed at least not less than the thickness of the plating lead 92 and not more than the total thickness of the electronic component including the mold. In this case, it is preferable that an adhesive sheet be attached to the surface of the molded substrate 6 so that the chip carrier type electronic components do not fall apart in the subsequent full dicing step. Since the plating lead 92 is cut in this half dicing step, all the through holes 7, the wiring patterns 3 following them, and the external connection portions of the semiconductor element 1 are all electrically short-circuited, and the through holes 7 are removed. To the semiconductor element 1 are electrically independent electronic component elements like the final chip carrier type electronic component. Thus, the electrical inspection of the semiconductor element 1 can be performed from the back surface of the substrate 6 such that the pin probe is set up in the through hole 7. After the inspection, the external shape of the final chip carrier type electronic component is cut by the full dicing line 91.

よ う By doing so, the chip carrier type electronic component can be inspected in the outer shape of the substrate, so that the handling and positioning at the time of inspection are greatly improved as compared with the case where the electronic component is used alone. Further, the half dicing line 90 and the full dicing line 91 may overlap. That is, even if half dicing is performed at the final outer shape position of the chip carrier type electronic component, full dicing is performed at the same position after the component inspection, and the final chip carrier type electronic component is finished, the effect remains unchanged.

Further, half dicing may be omitted, and full dicing may be directly performed on the full dicing line 91 to obtain a final chip carrier type electronic component.
Also in this case, the process is performed after a sticky sheet is attached to the surface of the substrate 6. As a result, the electronic components that have been fully diced do not fall apart, and the plating leads 92 are also cut, so that the chip carrier type electronic components can be inspected in the outer shape of the substrate.

Although not shown, the plating leads 92 may be formed on both front and back surfaces of the substrate 6. In such a case, localization of the plating current is suppressed, and the plating thickness can be made uniform. In this case, it is preferable to perform full dicing directly as described above.
(Modification)

In the embodiment described above, the method of mounting the semiconductor element on the substrate by the so-called wire bonding method has been described. However, the semiconductor element may be mounted by another known method such as the TAB method or the flip chip method. . In particular, when the flip-chip mounting is performed by the face-down method, the area corresponding to the region where the wires are routed can be omitted, and it goes without saying that the size can be further reduced. Further, in the above-described embodiment, the case where the semiconductor element is mounted on the chip carrier type electronic component has been described. However, the mounted component is not limited to the semiconductor element, and any other component parts such as a capacitor and an inductor may be used. . Further, not only a single component but also a plurality of components may be mounted on the substrate in the embodiment. Of course, it can also be used as a package on which a so-called MCM (multi-chip module) is mounted.

1 is a structural diagram of an electronic component according to an embodiment of the present invention. FIG. 4 is an explanatory view of a manufacturing method corresponding to the embodiment of FIG. 1 of the present invention. FIG. 7 is an explanatory diagram of another manufacturing method corresponding to the embodiment of FIG. 1 of the present invention. FIG. 4 is a structural view of an electronic component according to another embodiment of the present invention. FIG. 5 is an explanatory diagram of a manufacturing method corresponding to the embodiment of FIG. 4 of the present invention. FIG. 13 is an explanatory diagram of another manufacturing method corresponding to the embodiment of FIG. 4 of the present invention. FIG. 4 is a structural view of an electronic component according to another embodiment of the present invention. FIG. 4 is a structural view of an electronic component according to another embodiment of the present invention. FIG. 4 is a structural view of an electronic component according to another embodiment of the present invention. FIG. 10 is an explanatory diagram of a manufacturing method corresponding to the embodiment of FIGS. 7, 8 and 9 of the present invention. FIG. 4 is an explanatory diagram of a method for manufacturing an electronic component according to one embodiment of the present invention. FIG. 2 is a diagram illustrating a substrate structure of an electronic component according to an embodiment of the present invention. FIG. 4 is an explanatory diagram of a method for manufacturing an electronic component according to one embodiment of the present invention. It is a structural diagram of the conventional electronic component.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Wire 3 Wiring pattern 4 Mold frame 5 Mold resin 6 Substrate 7 Through hole (external electrode)
Reference Signs List 8 connection land 9 solder 20 dicing blade 21 cream solder 22 small hole 23 stencil 24 squeegee 30 solder jet 31 molten solder 40 adhesive sheet 50 silicone rubber 61 diamond touch part 62 solid line substrate structure 63 two-dot chain line substrate structure 70 through hole Covering member 71 Die pad 72 Silver paste 73 Through hole 80 Flat plate 81 Holding member 90 Half dicing line 91 Full dicing line 92 Plating lead

Claims (62)

A rectangular substrate having a plurality of external electrodes provided therearound, an element component mounted on the surface of the substrate in a state electrically connected to the external electrode, and a mold formed by molding the element component on the surface of the substrate In a leadless package type electronic component having a resin, the surface of the mold resin is formed flat, and each side surface of the mold resin is formed flush with each side surface of the substrate. And electronic components. The electronic component according to claim 1, wherein the external electrode is formed by cutting a through hole in an axial direction. The electronic component according to claim 2, wherein the external electrode is filled with a conductive paste. The electronic component according to claim 2, wherein the external electrode is filled with a metal material having solder wettability. The electronic component according to claim 4, wherein the metal material is solder. The electronic component according to claim 4, wherein the metal material is gold. A covering member for closing an opening on the mold resin side of the external electrode, further comprising:
The method according to claim 2, wherein the covering member is molded on the surface of the substrate by the molding resin, and a side end surface thereof is formed flush with the side surface of the molding resin and the substrate. Electronic components as described. The electronic component according to claim 7, further comprising a pad made of exactly the same material as the covering member, between the substrate and the element component. The pad is formed with a through-hole penetrating the covering member in the front-back direction, and the through-hole includes a conductive member for conducting the element component and a wiring region of the substrate. The electronic component according to claim 8, wherein: The electronic component according to claim 7, wherein the covering member is an adhesive sheet. The electronic component according to claim 7, wherein the covering member is a dry film. The electronic component according to claim 7, wherein the covering member is a glass epoxy plate. The electronic component according to claim 7, wherein the covering member is a ceramic plate. The electronic component according to claim 1, wherein the external electrode is provided at a corner of the substrate. A substrate material in which through-holes in which external electrodes are formed by cutting along a line passing substantially through the axis are arranged on a grid-like virtual line,
Element components mounted in an area of the substrate material surrounded by the virtual line,
A mold resin poured over the entire surface of the substrate material so as to mold the element component. The electronic component material according to claim 15, further comprising a dam at a peripheral portion of the substrate material, the dam preventing flow of the poured mold resin. 17. The electronic component material according to claim 15, wherein the substrate material further includes a plating lead connected to each through hole. 18. The electronic component material according to claim 17, wherein the plating leads are provided on both front and back surfaces of the substrate material. The electronic component material according to any one of claims 15 to 18, wherein a conductive paste is filled in each of the through holes. 19. The electronic component material according to claim 15, wherein each of the through holes is filled with a metal material having solder wettability. The electronic component material according to claim 20, wherein the metal material is solder. The electronic component material according to claim 20, wherein the metal material is gold. 19. The surface of the substrate material, further comprising a covering material that closes the opening of each of the through holes and is molded with a molding resin. Electronic component material. 24. The electronic component material according to claim 23, further comprising a pad made of exactly the same material as the covering material, between the substrate material and each of the component parts. 25. The electronic component material according to claim 23, wherein the covering material is an adhesive sheet. 25. The electronic component material according to claim 23, wherein the covering material is a dry film. 25. The electronic component material according to claim 23, wherein the covering material is a glass epoxy plate. 25. The electronic component material according to claim 23, wherein the covering material is a ceramic plate. The electronic component material according to any one of claims 15 to 28, wherein the through holes are arranged at intersections of grid-like virtual lines. A substrate manufacturing process of making a through hole in which an external electrode is formed by cutting along a line passing substantially through the axis in a substrate material along a grid-like virtual line,
A mounting step of mounting an element component in a region surrounded by the virtual line of the substrate material, and a connection step of electrically connecting the element component and the corresponding through-hole,
A molding step of pouring a mold resin over the entire surface of the substrate material to mold the element parts,
A cutting step of cutting the substrate material, the mold resin, and the through hole along the virtual line after the mold resin is cured. 31. The manufacturing of an electronic component according to claim 30, further comprising a dam forming step of forming a dam at a peripheral portion of the substrate material to prevent the flow of the poured mold resin before the molding step. Method. 32. The electronic component according to claim 30, wherein the mold resin is cured while using a jig for holding the substrate material horizontally and holding the substrate material horizontally by the jig. Production method. 33. The method for manufacturing an electronic component according to claim 32, wherein the mold resin to be poured is managed by weight. 34. The method for manufacturing an electronic component according to claim 30, further comprising, before the molding step, a filling step of filling each of the through holes with a conductive paste. 35. The method according to claim 34, wherein the filling step is performed by filling the through-holes with the conductive paste and then heating and curing the through-holes. 34. The electronic component according to claim 30, further comprising, before the molding step, a filling step of filling each of the through holes with a metal material having solder wettability. Production method. The method for manufacturing an electronic component according to claim 36, wherein the metal material is solder, and the filling step is performed by filling each of the through holes with a solder paste and then heating and melting the through holes. . 37. The manufacturing of an electronic component according to claim 36, wherein the metal material is solder, and the filling step is performed by bringing an opening of the through hole into contact with molten and wavy solder. Method. The metal material is solder, and the filling step is performed by masking a portion of the substrate material excluding the opening of the through hole, and then immersing the substrate material in molten solder. The method for producing an electronic component according to claim 36, wherein The method according to claim 36, wherein the filling step is performed by plating the through hole thickly. Prior to the molding step, a closing step of closing the opening of each through hole opened on the back surface of the substrate material using a closing member,
The method for manufacturing an electronic component according to any one of claims 30 to 33, further comprising: an opening step of removing the closing member after the mold resin has hardened. The closing member is a non-adhesive plate member that can cover the entire back surface of the substrate material, and the closing step is performed by pressing the plate member against the back surface of the substrate material. The method for manufacturing an electronic component according to claim 41. 43. The method according to claim 42, wherein the flat member is a silicone rubber. The closing member is an adhesive sheet that can cover the entire back surface of the substrate material, and the closing step is performed by attaching the sheet to the back surface of the substrate material. 42. The method for manufacturing an electronic component according to 41. 45. The sheet according to claim 44, wherein the sheet is an ultraviolet curable sheet whose adhesiveness is reduced by irradiation with ultraviolet light, and between the closing step and the opening step, the ultraviolet curable sheet is irradiated with ultraviolet light. Manufacturing method of electronic components. The electronic component according to claim 44, wherein the sheet is a thermosetting sheet whose adhesiveness is reduced by heating, and the thermosetting sheet is heated between the closing step and the opening step. Manufacturing method. The closing member is a soluble resin that dissolves in an aqueous alkaline solution, and the closing step is performed by pouring the soluble resin into each of the through holes and curing the resin. The method for manufacturing an electronic component according to claim 41, wherein the method is performed by washing the resin. 34. The method according to claim 30, further comprising, before the molding step, a covering step of attaching a covering material for closing an opening of each through hole to a surface of the substrate material. 13. The method for producing an electronic component according to item 9. 49. The manufacturing of an electronic component according to claim 48, wherein the covering material is an adhesive sheet, and the covering step is performed by attaching the sheet to a surface of the substrate material. Method. 49. The method according to claim 48, wherein the covering member is a dry film, and the covering step is performed by attaching the dry film to a surface of the substrate material. . 49. The electronic component according to claim 48, wherein the covering member is a molded plate of glass epoxy, and the covering step is performed by bonding the molded plate to a surface of the substrate material. Production method. 49. The manufacturing of an electronic component according to claim 48, wherein the covering member is a prepreg made of glass epoxy, and the covering step is performed by heat-pressing the prepreg on a surface of the substrate material. Method. 49. The manufacturing of the electronic component according to claim 48, wherein the covering member is a ceramic molded plate, and the covering step is performed by bonding the molded plate to a surface of the substrate material. Method. The electronic component according to claim 48, wherein the covering member is a ceramic green sheet, and the covering step is performed by heat-pressing the green sheet on a surface of the substrate material. Production method. Prior to the molding step, a step of attaching to the substrate material a plane holding means for holding the flatness of the substrate material,
The electronic component according to any one of claims 30 to 54, further comprising: removing the plane holding means after the curing of the mold resin and before the cutting step. Production method. 56. The method according to claim 55, wherein the substrate material is heated and gradually cooled after the curing of the mold resin and before removing the plane holding means. After the curing of the mold resin and before the cutting step, a step of attaching flat holding means for holding the flatness of the substrate material to the substrate material,
A step of heating and slowly cooling the substrate material,
55. The method for manufacturing an electronic component according to claim 30, further comprising: removing the plane holding means. The said plane holding | maintenance means is comprised by the holding | maintenance member which hold | maintains the said plane holding plate and the said board | substrate material together, and the flat holding board which abuts on the back surface side of the said board | substrate material, The claim | item 55. The method for producing an electronic component according to 55, 56 or 57. The electronic component according to any one of claims 30 to 58, wherein, in the substrate manufacturing step, a plating lead connected to each through hole is integrally formed with the substrate material together with the through hole. Production method. Prior to the cutting step, a semi-cutting step of cutting a plating lead from the through hole by making a cut in the substrate material and the mold resin,
The method of manufacturing an electronic component according to claim 59, further comprising: an inspection step of performing an electrical inspection of the element component subsequent thereto. The method of manufacturing an electronic component according to claim 60, wherein the cut in the half-cutting step is performed along the virtual line. Prior to the cutting step, further comprising a step of sticking an adhesive sheet on one entire surface of the substrate material,
62. The method for manufacturing an electronic component according to claim 30, wherein the cutting step is performed without completely cutting the sheet.

Images