JP2004079975A - Printed board mounting screw - Google Patents
Printed board mounting screw Download PDFInfo
- Publication number
- JP2004079975A JP2004079975A JP2002242195A JP2002242195A JP2004079975A JP 2004079975 A JP2004079975 A JP 2004079975A JP 2002242195 A JP2002242195 A JP 2002242195A JP 2002242195 A JP2002242195 A JP 2002242195A JP 2004079975 A JP2004079975 A JP 2004079975A
- Authority
- JP
- Japan
- Prior art keywords
- screw
- circuit board
- printed circuit
- flange
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims abstract description 12
- 229920006015 heat resistant resin Polymers 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【0001】
【発明の属する技術分野】
本発明はプリント基板に固定し、他のプリント基板とを重ねる時に使用し、あるいは、アース用のリード線や信号線を導電パターンに接続する時などに使用するネジに関する。
【0002】
【従来の技術】
従来、前記したような用途に使用するネジの一例としては、図4に示すようにプリント基板Pのネジを取付けるスルーホールP1 に形成された導電パターンDにナットNを半田Sによって固定したものがあった。
【0003】
また、他の例としては、図5に示すように内部にネジが形成されたハトメ部材H(一端に鍔部H1 が形成され内部にネジが形成された筒部H2 とからなる金属管)を導電パターンDに形成されたスルーホールP1 内に挿入し、次いで、カシメ具を用いてネジが形成された鍔部とは反対側の筒部の先端をスルーホールの外側に向かって拡開して固定したものもあった。
【0004】
【発明が解決しようとする課題】
ところで、前記したナットを半田付けによってプリント基板に取付けた場合には、半田付け時においてナットが導電パターンから移動してしまい位置ズレが生じ、この位置ズレによってナットがスルーホールを塞いでしまうといった問題があると共に、半田付けという手間がかかってしまうという問題があった。
【0005】
また、ハトメによる場合には、前記した位置ズレという問題は解決することはできるが、カシメ具を使用しての作業となるため作業性の点で問題があり、さらに、ナットの半田付けをも含めてプリント基板への自動実装が不可能であるといった問題があった。
【0006】
本発明は前記した問題点を解決せんとするもので、その目的とするところは、プリント基板への部品自動実装装置を使用しての実装が可能であると共に、スルーホールに対して実装することから位置ズレが生じることがなく、また、自動半田装置による半田付けにおいて半田がネジ孔内に入り込むことがないプリント基板実装用ネジを提供せんとするにある。
【0007】
【課題を解決するための手段】
本発明のプリント基板実装用ネジは前記した目的を達成せんとするもので、その手段は、外径がプリント基板のスルーホールに嵌入可能な外径に形成された雌ネジを有する筒部および該筒部の一端に形成されプリント基板の導電パターンに半田付けされる鍔部とからなるネジ本体と、前記鍔部の前記雌ネジを塞ぐ大きさに形成され、かつ、鍔部に対して剥離可能に接着されたフィルムとを具備したものである。
【0008】
また、前記フィルムをリフロー炉による半田付け時の温度に耐え得る耐熱性の樹脂フィルムとしたことである。
【0009】
【発明の実施の形態】
以下、本発明に係るプリント基板実装用ネジの実施の形態を図1〜図3と共に説明する。
1は半田付け可能な銅や黄銅等の金属材で構成したネジ本体にして、内面に雌ネジ11aが形成された筒部11と、該筒部11の一端に一体的に形成された鍔部12とから構成されている。
【0010】
そして、筒部11の外径はプリント基板Pに形成されているスルーホールP1 に嵌挿できる大きさであり、また、長さはプリント基板Pの厚みと略同じ程度に形成されている。
【0011】
2はリフロー炉による半田付けしても剥離や変形することのない耐熱性の樹脂(例えば、カプトン)であるフィルムにして、外径寸法が前記雌ネジ11bの外径より大きく前記鍔部12の外径よりも小さなものである。そして、このフィルムの片面には両面接着剤や接着剤が形成され、前記鍔部12にはみ出さないように接着固定されている。
【0012】
なお、ネジ本体1はプリント基板Pへの実装時にはキャリアテープの長手方向に沿ってストックされた状態でプリント基板Pが搬送されてくるコンベアの近傍に配置されているものとする。
【0013】
次に、前記した本発明のネジ本体1を使用してプリント基板Pに実装する方法について説明する。
プリント基板Pがコンベアによって搬送されてくると、キャリアテープにストックされているネジ本体1が部品自動実装装置によって鍔部12に貼着されているフィルム2の部分が吸着され、プリント基板Pの所定の位置のスルーホール11a内に筒部11が挿入される。
【0014】
このようにネジ本体1がスルーホールP1 に挿入されたプリント基板Pは、次の工程であるリフロー炉に搬送されるので、該リフロー炉においてネジ本体1の鍔部12は導電パターンDに半田付け固定される。この半田付け時において、フィルム2は鍔部12に取付けられた状態を維持しているので、半田が雌ネジ11a内に入り込むことがなく、後の雄ネジ螺合時にねじ込みができないといった不都合は生じないものである。
【0015】
そして、ネジ本体1が取付けられたプリント基板Pに雄ネジを螺合して他の基板を積層したり、アース線や信号線を取付ける際には、雌ネジ11a側からピン等でフィルム2を押し上げることにより、該フィルム2は鍔部12から剥離して雌ネジ11aが貫通することとなるので、雄ネジの螺合が可能となる。
【0016】
【発明の効果】
本発明は前記したように、雌ネジが形成された筒体と一体的に形成された鍔部にフィルムを貼着して雌ネジを塞いだので、プリント基板への部品自動実装装置を使用してのスルーホールに対して実装が可能となり、従って、自動化によりネジ本体のプリント基板への取付けに行えると共に位置ズレが発生することがないものである。
【0017】
また、フィルムをリフロー炉による半田付け時の温度に耐え得る耐熱性の樹脂フィルムとすることで、リフロー炉による半田付けにおいて半田がネジ孔内に入り込むことがなく、雄ネジ螺合時にねじ込みができないといった不都合が生じることがない等の効果を有するものである。
【図面の簡単な説明】
【図1】本発明に係るプリント基板実装用ネジの一実施の形態を示す斜視図である。
【図2】同上の縦断面図である。
【図3】プリント基板に取付けた状態のプリント基板を断面した断面図である。
【図4】従来のネジ取付け状態の一例を示す断面図である。
【図5】他の従来例のネジ取付け状態を示す断面図である。
【符号の説明】
1 ネジ本体
11 筒部
11a 雌ネジ
12 鍔部
2 フィルム[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a screw which is fixed to a printed circuit board and used when overlapping another printed circuit board, or used when connecting a ground lead or signal line to a conductive pattern.
[0002]
[Prior art]
Conventionally, as an example of a screw to be used in applications as described above, those with a fixed nut N by the solder S to the printed circuit board conductive pattern D formed in the through hole P 1 mounting the screws P as shown in FIG. 4 was there.
[0003]
As another example, a metal tube made inside the screw is flanged portion H 1 is formed in the eyelet H (one end which is formed a screw therein forming a cylinder portion H 2 Metropolitan as shown in FIG. 5 ) was inserted into the inside conductive pattern through hole P 1 formed in D, then expanding toward the front end of the cylindrical portion of the opposite outside of the through hole and the flange portion screw is formed with a caulking tool Some were opened and fixed.
[0004]
[Problems to be solved by the invention]
By the way, when the above-mentioned nut is attached to a printed circuit board by soldering, the nut moves from the conductive pattern during soldering, causing a positional shift, and the positional shift causes the nut to block the through hole. In addition, there is a problem that the work of soldering is required.
[0005]
In the case of eyelets, the above-described problem of positional deviation can be solved, but there is a problem in workability because the operation is performed using a caulking tool. There has been a problem that automatic mounting on a printed circuit board is impossible.
[0006]
An object of the present invention is to solve the above-described problems, and an object of the present invention is to enable mounting using a component automatic mounting apparatus on a printed circuit board and mount the through-hole. An object of the present invention is to provide a printed circuit board mounting screw which does not cause a positional shift from the above and does not allow solder to enter a screw hole during soldering by an automatic soldering device.
[0007]
[Means for Solving the Problems]
The printed board mounting screw of the present invention does not achieve the above-mentioned object, and the means includes a cylindrical portion having a female screw formed to have an outer diameter that can be fitted into a through hole of the printed board, and A screw body formed at one end of the cylindrical portion and having a flange portion soldered to a conductive pattern on a printed circuit board; formed in a size to close the female screw of the flange portion, and capable of being peeled off from the flange portion And a film adhered to the substrate.
[0008]
Further, the film is a heat-resistant resin film that can withstand the temperature during soldering in a reflow furnace.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of a screw for mounting a printed circuit board according to the present invention will be described below with reference to FIGS.
[0010]
The outer diameter of the
[0011]
[0012]
When the
[0013]
Next, a method of mounting on the printed circuit board P using the
When the printed circuit board P is conveyed by the conveyor, the
[0014]
Thus the printed board P on which the
[0015]
When a male screw is screwed into the printed board P to which the
[0016]
【The invention's effect】
As described above, the present invention uses a device for automatically mounting components on a printed circuit board because a film is attached to a flange formed integrally with a cylindrical body formed with a female screw to close the female screw. Mounting can be performed on all the through holes, so that the screw body can be mounted on the printed circuit board by automation, and no positional deviation occurs.
[0017]
In addition, since the film is made of a heat-resistant resin film that can withstand the temperature at the time of soldering in the reflow furnace, the solder does not enter the screw hole in the soldering by the reflow furnace, and cannot be screwed in when the male screw is screwed. This has the effect of not causing such inconvenience.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a printed circuit board mounting screw according to the present invention.
FIG. 2 is a longitudinal sectional view of the same.
FIG. 3 is a cross-sectional view of a printed circuit board mounted on the printed circuit board.
FIG. 4 is a sectional view showing an example of a conventional screw mounting state.
FIG. 5 is a cross-sectional view showing a screw mounting state of another conventional example.
[Explanation of symbols]
DESCRIPTION OF
Claims (2)
前記鍔部の前記雌ネジを塞ぐ大きさに形成され、かつ、鍔部に対して剥離可能に接着されたフィルムと、
を具備したことを特徴とするプリント基板実装用ネジ。A screw body comprising: a cylindrical portion having a female screw whose outer diameter is formed so as to fit into a through hole of a printed circuit board; and a flange formed at one end of the cylindrical portion and soldered to a conductive pattern of the printed circuit board. When,
A film formed to a size to close the female screw of the flange, and is peelably adhered to the flange,
A printed circuit board mounting screw, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002242195A JP2004079975A (en) | 2002-08-22 | 2002-08-22 | Printed board mounting screw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002242195A JP2004079975A (en) | 2002-08-22 | 2002-08-22 | Printed board mounting screw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2004079975A true JP2004079975A (en) | 2004-03-11 |
Family
ID=32024462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002242195A Pending JP2004079975A (en) | 2002-08-22 | 2002-08-22 | Printed board mounting screw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004079975A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007267883A (en) * | 2006-03-30 | 2007-10-18 | Samii Kk | Board case of game machine |
| EP2244545A3 (en) * | 2009-04-23 | 2012-10-10 | Kathrein-Werke KG | Electrical connection device |
| US20200215632A1 (en) * | 2019-01-09 | 2020-07-09 | Dtech Precision Industries Co., Ltd. | Structure and method for retaining fastening element solder |
| EP4280236A1 (en) * | 2022-05-16 | 2023-11-22 | Goodrich Control Systems | Wound core circuit component |
-
2002
- 2002-08-22 JP JP2002242195A patent/JP2004079975A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007267883A (en) * | 2006-03-30 | 2007-10-18 | Samii Kk | Board case of game machine |
| EP2244545A3 (en) * | 2009-04-23 | 2012-10-10 | Kathrein-Werke KG | Electrical connection device |
| US20200215632A1 (en) * | 2019-01-09 | 2020-07-09 | Dtech Precision Industries Co., Ltd. | Structure and method for retaining fastening element solder |
| US11638963B2 (en) * | 2019-01-09 | 2023-05-02 | Dtech Precision Industries Co., Ltd. | Structure for retaining fastening element solder |
| EP4280236A1 (en) * | 2022-05-16 | 2023-11-22 | Goodrich Control Systems | Wound core circuit component |
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| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040624 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061205 |
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