JP2004079477A - Pattern shaping device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern shaping device accurately shaping a pattern formed on a substrate. <P>SOLUTION: The pattern shaping device is provided with a stage holding a substrate 9 with a pattern of a partition wall 91 formed and a shaping member 43 having a plurality of concave parts, and the shaping member 43 moves relatively to the substrate 9 by a stage moving mechanism 2. The concave parts of the shaping member 43 is set at a position corresponding to that of the partition wall 91 on the substrate 9, with a width and a depth of the recessed parts made smaller at a rear face than at a front face. Further, a front part of the shaping member is slanted toward a rear side in a relative movement direction from a normal line of the main face of the substrate 9. With this, the partition wall 91 is shaped with accuracy while making the shaping member 43 smoothly move on the substrate 9. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a technique for forming a pattern on a substrate.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, sandblasting (also called photolithography), screen printing, lift-off, and the like have been known as a method for forming a pattern of partition walls and electrodes on a panel used for a plasma display device or an organic EL display device. I have. However, these methods are complicated and cause an increase in production cost. Therefore, in Japanese Patent Application Laid-Open No. H11-283497, a partition pattern is formed by moving a blade having a comb shape relatively to a substrate on which a pattern forming material is uniformly applied (that is, a pattern forming material). ) Is disclosed.
[0003]
[Problems to be solved by the invention]
However, in the above method, the smooth movement of the blade is hindered as the pattern forming material scraped off by the comb-shaped blade accumulates in the front in the relative movement direction of the blade, or the flatness of the pattern forming material before shaping has There were problems such as disturbed sex. Further, in order to smoothly move the blade, it is preferable to use a pattern forming material having a low viscosity. In this case, the pattern forming material is formed before a curing process (for example, a drying process or a baking process) is performed. The shape of the pattern may be deformed by the influence of gravity or the like. Further, when the pattern forming material adheres to the blade (particularly, the surface on the rear side of the blade), there are problems such as an abnormality in the shape of the pattern and hindrance of movement of the blade.
[0004]
The present invention has been made in view of the above problems, and has as its object to form an appropriate pattern on a substrate.
[0005]
[Means for Solving the Problems]
The invention according to claim 1 is a pattern shaping device for shaping a pattern formed on a substrate, comprising: a holding portion for holding the substrate; and a plurality of linear members formed on the substrate with a pattern forming material. A pattern shaping member having a plurality of recesses corresponding to the pattern, and a moving mechanism for relatively moving the pattern shaping member along the plurality of patterns on the substrate and shaping each pattern by the recesses of the pattern shaping member. A front surface of the pattern shaping member is inclined from a direction normal to a main surface of the substrate to a rear side in a relative movement direction.
[0006]
An invention according to claim 2 is a pattern shaping device for shaping a pattern formed on a substrate, comprising: a holding unit for holding the substrate; and a plurality of linear members formed on the substrate with a pattern forming material. A pattern shaping member having a plurality of recesses corresponding to the pattern, and a moving mechanism for relatively moving the pattern shaping member along the plurality of patterns on the substrate and shaping each pattern by the recesses of the pattern shaping member. And at least one of the depth and the width of each concave portion of the pattern shaping member is smaller at the rear side of each concave portion than at the front side.
[0007]
The invention according to claim 3 is the pattern shaping device according to claim 1 or 2, further comprising a curing unit that sequentially cures the pattern shaped by the pattern shaping member.
[0008]
According to a fourth aspect of the present invention, there is provided the pattern shaping device according to any one of the first to third aspects, further comprising a collection unit that collects a removed matter removed by the pattern shaping member in front of the pattern shaping member. Further prepare.
[0009]
According to a fifth aspect of the present invention, in the pattern shaping device according to any one of the first to fourth aspects, the surface of the pattern shaping member or the plurality of recesses is formed of a fluororesin or a silicon resin.
[0010]
The invention according to claim 6 is a pattern shaping apparatus for shaping a pattern forming material provided on a substrate, wherein the holding unit holds the substrate, a pattern shaping member having a recess, and the pattern shaping member is mounted on the substrate. A movement mechanism for relatively moving along the main surface of the substrate and shaping the pattern forming material on the substrate by the recess, wherein the front surface of the pattern shaping member is moved relative to the normal direction of the main surface of the substrate. It is inclined to the rear side.
[0011]
The invention according to claim 7 is a pattern shaping apparatus for shaping a pattern forming material provided on a substrate, wherein the holding unit holds the substrate, a pattern shaping member having a concave portion, and the pattern shaping member is mounted on the substrate. A moving mechanism for relatively moving along the main surface of the concave portion to shape the pattern forming material on the substrate by the concave portion, wherein at least one of the depth or the width of the concave portion is on the rear side of the concave portion. Is smaller than the front side.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a diagram showing a schematic configuration of a pattern shaping device 1 according to one embodiment of the present invention. The pattern shaping device 1 includes a glass substrate (hereinafter, referred to as a “substrate”) 9 of a plasma display device on which a pattern forming material (for example, a photoinitiator is 1 to 30% and a binder such as an acrylic monomer is 5 to 50%). A plurality of types of low softening point glass frit of 40 to 90%, and a mixture of a solvent and an additive), which is a device for shaping a pattern of linear partition walls 91 extending in the X direction. The substrate 9 on which the partition pattern has been formed becomes a panel (usually a rear panel) which is an assembly part of the plasma display device through another process.
[0013]
In the pattern shaping apparatus 1, a stage moving mechanism 2 is provided on a base 11, and the stage 3 holding the substrate 9 can be moved in the X direction shown in FIG. A frame 12 is fixed to the base 11 so as to straddle the stage 3, and the pattern shaping head unit 4 is attached to the frame 12.
[0014]
The stage moving mechanism 2 has a structure in which a ball screw 22 is connected to a motor 21, and a nut 23 fixed to the stage 3 is attached to the ball screw 22. A guide rail 24 is fixed above the ball screw 22. When the motor 21 rotates, the stage 3 moves smoothly along the guide rail 24 in the X direction together with the nut 23.
[0015]
The pattern shaping head unit 4 includes a shaping member 43 formed of metal, ceramic, or the like, and a support member 42 for detachably supporting the shaping member 43, and a support member provided below the base 41 fixed to the frame 12. 42 is attached. The pattern shaping head unit 4 further includes a suction nozzle 44 close to the shaping member 43 and a light irradiation unit 45 that emits ultraviolet light toward the substrate 9. The suction nozzle 44 is located on the (+ X) side of the shaping member 43. The light irradiation unit 45 is attached to the lower part of the base 41 so as to be located on the (−X) side of the shaping member 43. The suction nozzle 44 is connected to a pump 442 via a suction pipe 441. When the pump 442 performs a suction operation, unnecessary pattern forming material near the suction port of the suction nozzle 44 is sucked. The light irradiating section 45 is connected to a light source unit 452 that generates ultraviolet rays via an optical fiber 451, and emits light toward the substrate 9.
[0016]
The motor 21, the pump 442, and the light source unit 452 of the stage moving mechanism 2 are connected to the control unit 6. These components are controlled by the control unit 6, so that the pattern shaping device 1 shapes the partition 91 on the substrate 9. Is performed.
[0017]
FIG. 2 is a diagram illustrating a state when the shaping member 43 is viewed from the (+ X) side in the (−X) direction, and FIG. 3 is a diagram illustrating the shaping member 43 from the (−X) side in the (+ X) direction. FIG. 2 and 3, the illustration of the partition wall 91 on the substrate 9 is omitted. As shown in FIGS. 2 and 3, a plurality of recesses 431 extending in the X direction are formed on the lower surface of the shaping member 43, and the surface on the (+ X) side of the shaping member 43 shown in FIG. The depth and width of the concave portion 431 of the head portion 4 in the direction of relative movement with respect to the substrate 9 are hereinafter referred to as “front surface”. It is larger than the surface 433 (that is, the surface on the rear side in the direction of relative movement of the pattern shaping head unit 4 with respect to the substrate 9; hereinafter, referred to as “rear surface”).
[0018]
Specifically, the length of the upper bottom of the trapezoidal concave portion 431 on the front surface 432 (that is, the width of the bottom surface 431b of the concave portion 431) is 60 μm, and the length of the lower base (that is, the width of the concave portion 431 on the opening side) is 90 μm and the height (that is, the depth of the concave portion 431) is 160 μm, while the rear surface 433 has side surfaces of the concave portion 431 such that the upper base is 50 μm, the lower base is 80 μm, and the height is 150 μm. The 431a and the bottom surface 431b are formed with a gentle inclination in the X direction (that is, in a tapered shape). The distance between the centers of the concave portions 431 in the Y direction is made equal to the center distance (for example, 300 μm) of the partition pattern formed in advance on the substrate 9.
[0019]
FIG. 4 is a longitudinal sectional view of the shaping member 43 at the position of arrow AA in FIGS. 2 and 3. In FIG. 4, as in FIGS. 2 and 3, illustration of the partition wall 91 is omitted. As shown in FIG. 4, the front surface 432 of the shaping member 43 is inclined from the normal direction of the substrate 9 to the (−X) side (in other words, the front surface 432 is in the relative movement direction ((+ X) direction)). For example, the angle between the front surface 432 and the substrate 9 is about 70 degrees. Further, a suction port 443 of the suction nozzle 44 is located in front of the front surface 432 (that is, on the (+ X) side) (also shown in FIG. 2). Although only a part of the shaping member 43 is shown in FIG. 2, the suction port 443 has a rectangular shape whose length in the Y direction is substantially equal to the length of the front surface 432, and adheres to the front surface 432, or Unnecessary pattern forming material located near the front surface 432 is sucked from the suction port 443.
[0020]
On the rear surface 433 side, as shown in FIGS. 3 and 4, a light irradiating section 45 for forming a light spot corresponding to each recess 431 on the substrate 9 is provided. The side surface 431 a and the bottom surface 431 b of the concave portion 431 are covered with a coating material containing a fluororesin or a silicon resin, and the thickness of the shaping member 43 (that is, the distance from the front surface 432 to the rear surface 433) depends on the width of the partition wall 91. The thickness is sufficient for the height (for example, about 5 mm). Note that the material itself of the shaping member 43 may be fluororesin or silicon resin.
[0021]
Next, the operation of the pattern shaping device 1 for shaping the partition pattern on the substrate 9 will be described with reference to FIGS. First, the substrate 9 on which the partition pattern is formed with the pattern forming material is carried into the pattern shaping apparatus 1, and the control unit 6 controls the light source unit 452, so that the light irradiation unit 45 starts emitting ultraviolet light. Further, under the control of the control unit 6, the suction operation of the pump 442 is started, and the suction by the suction nozzle 44 is started. Subsequently, the drive of the motor 21 of the stage moving mechanism 2 is controlled, and the stage 3 is continuously moved so that the surface of the substrate 9 moves in the (−X) direction while contacting the lower surface of the shaping member 43. Thereby, the partition wall 91 on the substrate 9 is guided from the front surface 432 side of the shaping member 43 to the concave portion 431, and the partition wall pattern is shaped.
[0022]
FIGS. 5A and 5B are diagrams for explaining how the shaping member 43 shapes the partition 91 on the substrate 9, and FIG. 5A illustrates the partition 91 shaped by the shaping member 43. The state immediately before is shown. FIG. 5A shows a state when viewed from the (+ X) side in the (-X) direction. Since the shaping member 43 slides on the substrate 9 in the direction along the partition pattern, as shown in FIG. 5B, the shaping member 43 passes through the position of the partition 91 shown in FIG. The partition wall 91 is shaped into a shape corresponding to the concave portion 431.
[0023]
More specifically, first, the periphery of the partition wall 91 is removed by the front surface 432 of the shaping member 43 or is removed so as to be deformed and peeled off. Further, as shown in FIGS. 2 to 4, since the concave portion 431 is provided in a tapered shape from the front surface 432 to the rear surface 433, the partition wall 91 guided to the concave portion 431 moves in accordance with the relative movement with respect to the shaping member 43. It is gradually compacted by the side surface 431a and the bottom surface 431b, and is shaped into the shape of the concave portion 431 in the rear surface 433 as shown in FIG. The partition wall 91 is pressed into the concave portion 431 to have a highly accurate shape and a dense state.
[0024]
Subsequently, as shown in FIG. 6, immediately after shaping by the shaping member 43, the partition wall 91 is irradiated with ultraviolet rays from the light irradiating section 45, and is sequentially cured. Thereby, the shape of the partition 91 after shaping is appropriately held. As a result, the ratio of the height (H) to the length (W) of the portion of the partition wall 91 in contact with the substrate 9 (so-called aspect ratio (H / W)) is high, and the partition 91 has a stable shape (that is, a sufficient shape). A pattern of a (hard) partition wall 91 is formed. The curing by the irradiation of the ultraviolet rays may be a completely uncured state (a so-called semi-cured state) as long as the partition wall 91 is not deformed by gravity or surface tension.
[0025]
In the pattern shaping device 1, as shown in FIG. 4, the front surface 432 of the shaping member 43 is inclined, so that the pattern forming material removed by the front surface 432 (hereinafter, referred to as "removed object") is shaped. In accordance with the relative movement of the member 43, the member 43 is smoothly guided upward along the front surface 432, and the relative movement of the shaping member 43 with respect to the substrate 9 can be performed smoothly. Furthermore, since the removed matter guided to the vicinity of the suction port 443 of the suction nozzle 44 is sucked by the suction nozzle 44, the removed matter is prevented from adversely affecting the shaping of the partition wall pattern and the movement of the shaping member 43. .
[0026]
As described above, since the side surface 431a and the bottom surface 431b of the concave portion 431 are covered with a coating material containing a fluororesin or a silicon resin, the partition wall 91 is smoothly shaped and the pattern forming material is made of the side surface 431a or the bottom surface. Adhesion to the 431b is suppressed, and abnormalities in the shape of the partition wall 91 are prevented. The shaping member 43 may be entirely formed of fluororesin or silicon resin.
[0027]
The shaping of the partition pattern is performed continuously with the movement of the substrate 9, and when the end point of the pattern on the substrate 9 passes through the shaping member 43, the movement control of the stage 3, the suction operation, and the emission of ultraviolet rays are stopped. The shaped partition pattern is fired in another step to remove the resin component in the pattern forming material, and the low softening point glass frit is fused to form the partition. Note that a drying step or the like is appropriately performed before firing depending on the pattern forming material to be used.
[0028]
As described above, in the pattern shaping apparatus 1, the shaping member 43 having the plurality of recesses 431 corresponding to the partition pattern formed on the substrate 9 relatively moves along the partition pattern, thereby shaping the partition pattern. Is performed. By inclining the front surface 432 of the shaping member 43 from the normal direction of the substrate 9 to the rear side in the relative movement direction, the relative movement of the shaping member 43 with respect to the substrate 9 can be smoothly performed. In addition, by making the depth and width of each recess 431 smaller on the rear surface 433 than on the front surface 432, accurate shaping (that is, formation of a highly accurate partition pattern) is also realized.
[0029]
The pattern shaping head unit 4 is smaller in width in the X direction than the substrate 9, and is intermittently moved in the X direction each time the pattern shaping head unit 4 is moved in the Y direction with respect to the substrate 9. Thereby, the partition pattern on the entire surface of the substrate 9 may be shaped.
[0030]
The pattern shaping apparatus 1 has been described above. However, the pattern shaping by the pattern shaping apparatus 1 does not necessarily need to be performed on the partition pattern formed in a linear shape, and is uniformly applied on the substrate 9. May be performed on the patterned material formed. Hereinafter, a mode in which the pattern shaping device 1 shapes the pattern forming material uniformly applied on the substrate 9 into a predetermined pattern shape (it can be regarded as pattern formation) will be described.
[0031]
FIGS. 7A and 7B are views for explaining a state in which the pattern forming material 92 uniformly applied on the substrate 9 by the shaping member 43 is shaped, and FIG. FIG. 4 is a diagram illustrating a state immediately before a material 92 is shaped by a shaping member 43. FIG. 7A shows a state when viewed from the (+ X) side in the (-X) direction.
[0032]
As shown in FIG. 7A, the shaping member 43 is applied to the substrate 9 on which the pattern forming material 92 is applied with a uniform thickness (for example, 120 to 200 μm) by a slit coater or a roll coater. By relatively moving so as to be in contact with each other, the portion other than the portion corresponding to the concave portion 431 of the pattern forming material 92 is removed by the front surface 432 of the shaping member 43. At this time, since the front surface 432 is inclined rearward in the direction of relative movement with respect to the normal direction of the substrate 9, the removed pattern forming material is smoothly guided upward along the front surface 432, The relative movement of the shaping member 43 with respect to the substrate 9 is performed smoothly.
[0033]
In addition, a relatively large amount of removed matter is generated as compared with a case where the partition pattern formed on the substrate 9 is previously shaped. However, since the removed matter is sucked by the suction nozzle 44, the removed matter is subjected to pattern shaping or shaping. The effect on the movement of the member 43 is suppressed.
[0034]
As shown in FIG. 7B, the pattern forming material 92 remaining on the substrate 9 is pressed into the shape corresponding to the concave portion 431 on the rear surface 433 side while being pressed by the concave portion 431 formed in a tapered shape. Be shaped. Further, since the shaped partition pattern led out from the rear surface 433 is promptly irradiated with ultraviolet rays by the light irradiation unit 45, the shape of the partition pattern is also prevented from being collapsed by the influence of gravity or the like.
[0035]
As described above, in the pattern shaping device 1, the shaping member 43 having the concave portion 431 is relatively moved along the main surface of the substrate 9, so that the pattern forming material 92 uniformly applied on the substrate 9 is formed. Also, the shaping can be performed with high accuracy.
[0036]
FIG. 8 is a diagram illustrating a state in which the pattern shaping device 1 is arranged in the pattern forming system 8. In the pattern forming system 8, first, the substrate 9 placed on the substrate carry-in section 81 is transported to the next device 82 by the transport mechanism 80a. When a temporary partition pattern is formed on the substrate 9 in advance, a temporary partition is formed by the device 82. The temporary partition may be formed by any method. For example, the partition is formed by relatively moving the substrate 9 while discharging a pattern forming material from a number of nozzle holes. When the viscosity of the pattern forming material is low, the pattern forming material immediately after the discharge is slightly irradiated with ultraviolet light to bring the pattern forming material into a semi-cured state.
[0037]
When a pattern forming material is uniformly applied on the substrate 9 in advance, a slit coater, a roll coater, or the like is disposed as the device 82.
[0038]
Next, the substrate 9 is sent to the pattern shaping device 1 by the transport mechanism 80b, and the shaping of the pattern forming material described above is performed, so that a highly accurate partition pattern is formed on the substrate 9. The substrate 9 on which the pattern formation is completed is transported to the substrate unloading section 84 by the transport mechanism 80c. Further, the substrate 9 is transported from the substrate unloading section 84 to a drying device, a baking device, or the like separately provided.
[0039]
The device 82 and the pattern shaping device 1 may be integrated within a technically possible range. For example, even if a nozzle for discharging the pattern forming material from a large number of minute openings and the shaping member 43 are provided in one device, the formation and shaping of the temporary partition pattern are performed in parallel while moving the substrate 9. Alternatively, a slit for uniformly applying the pattern forming material and the shaping member 43 may be provided in one device, and the application and shaping of the pattern forming material may be performed in parallel while moving the substrate 9.
[0040]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible.
[0041]
The concave portion 431 of the shaping member 43 does not necessarily require both the depth and the width on the rear surface 433 to be smaller than those on the front surface 432. Even when only one of the depth and the width is smaller, the pattern can be accurately formed. Can be shaped. Further, for example, the side surface 431a and the bottom surface 431b of each concave portion 431 need not be flat, but may be curved.
[0042]
The removed matter may be collected by a mechanism other than the suction nozzle 44. For example, a collecting unit that accumulates the removed matter collected along the slope of the front surface 432 may be provided in the shaping member 43.
[0043]
In the above-described embodiment, the ultraviolet light from the light irradiation unit 45 is irradiated toward the substrate 9 from above, but when the substrate 9 is a glass substrate, the ultraviolet light may be irradiated from the back surface side of the substrate 9. . In addition, the light irradiation section 45 does not necessarily need to cure the partition pattern with ultraviolet rays, and may be cured by applying light, heat, gas, or the like other than ultraviolet rays.
[0044]
When shaping is performed on the temporary partition pattern formed on the substrate 9 in advance, the temporary partition pattern on the substrate 9 is formed by various other methods (for example, a sandblast method or a screen printing method). May be used. When the temporary partition pattern has a sufficient hardness, the light irradiation unit 45 may be omitted in the pattern shaping apparatus 1.
[0045]
In the above embodiment, the pattern shaping head 4 moves relative to the substrate 9 by moving the stage 3, but the stage 3 may be fixed and the pattern shaping head 4 may move.
[0046]
Further, in the above embodiment, since the shaping member 43 is relatively moved while being in contact with the substrate 9, pattern shaping in which the absolute height is controlled with the surface of the substrate 9 as a reference plane is easily realized. However, depending on the pattern to be shaped, a gap may be provided between the substrate 9 and the lower surface of the shaping member 43 so that the shaping member 43 moves relatively to the substrate 9.
[0047]
The pattern shaping device 1 may be used for forming a pattern of a partition, a wiring, an electrode, and the like in another type of flat display device (flat panel display) such as an organic EL display device or a liquid crystal display device. The substrate 9 is not limited to a glass substrate, but may be a resin substrate, a semiconductor substrate, or the like.
[0048]
【The invention's effect】
According to the first and sixth aspects of the present invention, the relative movement of the pattern shaping member with respect to the substrate can be smoothly performed.
[0049]
According to the second and seventh aspects of the present invention, the pattern forming material can be accurately shaped.
[0050]
According to the third aspect of the present invention, the shape of the shaped pattern can be appropriately maintained.
[0051]
Further, according to the fourth aspect of the present invention, it is possible to prevent the removed object from adversely affecting the pattern shaping.
[0052]
Further, according to the invention of claim 5, it is possible to suppress the pattern forming material from adhering to the surface of the concave portion.
[Brief description of the drawings]
FIG. 1 is a diagram showing a schematic configuration of a pattern shaping device.
FIG. 2 is a diagram showing a front surface of a shaping member.
FIG. 3 is a diagram showing a rear surface of a shaping member.
FIG. 4 is a longitudinal sectional view of a shaping member.
FIGS. 5A and 5B are views for explaining a state in which a partition is shaped.
FIG. 6 is a perspective view showing how a partition is shaped.
FIGS. 7A and 7B are diagrams for explaining how a pattern forming material is shaped.
FIG. 8 is a diagram showing a pattern forming system.
[Explanation of symbols]
Reference Signs List 1 pattern shaping device 2 stage moving mechanism 3 stage 9 substrate 43 shaping member 44 suction nozzle 45 light irradiation section 91 partition wall 92 pattern forming material 431 concave portions 432, 433

Claims (7)

A pattern shaping device for shaping a pattern formed on a substrate,
A holding unit for holding the substrate,
A pattern shaping member having a plurality of concave portions corresponding to a plurality of linear patterns formed on the substrate with a pattern forming material,
A movement mechanism for relatively moving the pattern shaping member along a plurality of patterns on the substrate and shaping each pattern by a concave portion of the pattern shaping member;
With
A pattern shaping device, wherein a front surface of the pattern shaping member is inclined from a direction normal to a main surface of the substrate to a rear side in a relative movement direction. A pattern shaping device for shaping a pattern formed on a substrate,
A holding unit for holding the substrate,
A pattern shaping member having a plurality of concave portions corresponding to a plurality of linear patterns formed on the substrate with a pattern forming material,
A movement mechanism for relatively moving the pattern shaping member along a plurality of patterns on the substrate and shaping each pattern by a concave portion of the pattern shaping member;
With
A pattern shaping device, wherein at least one of a depth and a width of each recess of the pattern shaping member is smaller at a rear side of each recess than at a front side thereof. The pattern shaping device according to claim 1 or 2,
The pattern shaping device further includes a curing unit that sequentially cures the pattern shaped by the pattern shaping member. The pattern shaping device according to any one of claims 1 to 3,
The pattern shaping device further comprising a collecting unit that collects a removed matter removed by the pattern shaping member in front of the pattern shaping member. The pattern shaping device according to any one of claims 1 to 4,
A pattern shaping device, wherein a surface of the pattern shaping member or the plurality of recesses is formed of a fluorine resin or a silicon resin. A pattern shaping device for shaping a pattern forming material provided on a substrate,
A holding unit for holding the substrate,
A pattern shaping member having a recess,
A moving mechanism for relatively moving the pattern shaping member along the main surface of the substrate and shaping the pattern forming material on the substrate by the concave portion;
With
A pattern shaping device, wherein a front surface of the pattern shaping member is inclined from a direction normal to a main surface of the substrate to a rear side in a relative movement direction. A pattern shaping device for shaping a pattern forming material provided on a substrate,
A holding unit for holding the substrate,
A pattern shaping member having a recess,
A moving mechanism for relatively moving the pattern shaping member along the main surface of the substrate and shaping the pattern forming material on the substrate by the concave portion;
With
A pattern shaping device, wherein at least one of the depth and the width of the concave portion is smaller on the rear side of the concave portion than on the front side.

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