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JP2004076022A - Substrate holder and plating apparatus - Google Patents

Substrate holder and plating apparatus Download PDF

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Publication number
JP2004076022A
JP2004076022A JP2002213209A JP2002213209A JP2004076022A JP 2004076022 A JP2004076022 A JP 2004076022A JP 2002213209 A JP2002213209 A JP 2002213209A JP 2002213209 A JP2002213209 A JP 2002213209A JP 2004076022 A JP2004076022 A JP 2004076022A
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JP
Japan
Prior art keywords
substrate
holding member
movable holding
fixed holding
substrate holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2002213209A
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Japanese (ja)
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JP4124327B2 (en
JP2004076022A5 (en
Inventor
Junichiro Yoshioka
吉岡　潤一郎
Kuniaki Horie
堀江　邦明
Yokou Kaku
郭　誉綱
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Ebara Corp
Original Assignee
Ebara Corp
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Publication date
Priority to JP2002213209A priority Critical patent/JP4124327B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to PCT/JP2003/007855 priority patent/WO2004001813A2/en
Priority to EP03760917A priority patent/EP1516357A2/en
Priority to TW092116755A priority patent/TWI316097B/en
Priority to KR1020047000836A priority patent/KR100980051B1/en
Priority to CN2008100040249A priority patent/CN101281858B/en
Priority to US10/482,476 priority patent/US7601248B2/en
Priority to CNB038008459A priority patent/CN100370578C/en
Publication of JP2004076022A publication Critical patent/JP2004076022A/en
Publication of JP2004076022A5 publication Critical patent/JP2004076022A5/ja
Priority to JP2008075465A priority patent/JP4669019B2/en
Application granted granted Critical
Publication of JP4124327B2 publication Critical patent/JP4124327B2/en
Priority to US12/585,141 priority patent/US7901551B2/en
Priority to US13/017,294 priority patent/US8337680B2/en
Priority to US13/684,902 priority patent/US8936705B2/en
Priority to US14/565,841 priority patent/US9388505B2/en
Priority to US15/180,477 priority patent/US9593430B2/en
Priority to US15/180,457 priority patent/US9624596B2/en
Priority to US15/180,448 priority patent/US9506162B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To widen an effective area used as a pattern-forming region of a substrate, further to hold the substrate while easily centralizing it, and to easily and surely take out the substrate. <P>SOLUTION: In a substrate holder for releasably holding the substrate W by putting the substrate W between a fixed holding member 54 and a movable holding member 58 provided with a sealing member 60, pushing the movable hold member 58 toward the fixed hold member 54, and sealing a region surrounding the peripheral edge of the substrate W with the sealing member 60, this substrate holder has electrical contacts 92 of a flat spring form, which are electrically connected to an electric conductor 88 in the region sealed by the sealing member 60 and pass an electric current to the substrate W, when the fixed hold member 54 holds the electric conductor 88, and the movable hold member 58 holds the substrate W with itself and the fixed holding member 54. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、例えば基板の被めっき面にめっきを施すめっき装置、特に半導体ウエハ等の表面に設けられた微細な配線用溝やホール、レジスト開口部にめっき膜を形成したり、半導体ウエハの表面にパッケージの電極等と電気的に接続するバンプ（突起状電極）を形成したりするめっき装置等に使用される基板ホルダ、及び係る基板ホルダを備えためっき装置に関する。
【０００２】
【従来の技術】
例えば、ＴＡＢ（Ｔａｐｅ　Ａｕｔｏｍａｔｅｄ　Ｂｏｎｄｉｎｇ）やフリップチップにおいては、配線が形成された半導体チップの表面の所定箇所（電極）に金、銅、はんだ、或いはニッケル、更にはこれらを多層に積層した突起状接続電極（バンプ）を形成し、このバンプを介してパッケージの電極やＴＡＢ電極と電気的に接続することが広く行われている。このバンプの形成方法としては、電解めっき法、蒸着法、印刷法、ボールバンプ法といった種々の手法があるが、半導体チップのＩ／Ｏ数の増加、細ピッチ化に伴い、微細化が可能で性能が比較的安定している電解めっき法が多く用いられるようになってきている。
【０００３】
ここで、電解めっき法は、半導体ウエハ等の基板の被めっき面を下向き（フェースダウン）にして水平に置き、めっき液を下から噴き上げてめっきを施す噴流式またはカップ式と、めっき槽の中に基板を垂直に立て、めっき液をめっき槽の下から注入しオーバーフローさせつつめっきを施すディップ式に大別される。ディップ方式を採用した電解めっき法は、めっきの品質に悪影響を与える泡の抜けが良く、フットプリントが小さいという利点を有しており、このため、めっき穴の寸法が比較的大きく、めっきにかなりの時間を要するバンプめっきに適していると考えられる。
【０００４】
従来のディップ方式を採用した電解めっき装置にあっては、気泡が抜けやすくできる利点を有しており、半導体ウエハ等の基板をその端面と裏面をシールし表面（被めっき面）を露出させて着脱自在に保持する基板ホルダを備え、この基板ホルダを基板ごとめっき液中に浸漬させて基板の表面にめっきを施すようにしている。
【０００５】
基板ホルダは、めっき液中に浸漬させて使用するため、この基板ホルダで基板を保持した時に、基板の裏面（反被めっき面）側へめっき液が周り込まないよう、基板の外周部を確実にシールする必要がある。このため、例えば、一対のサポート（保持部材）で基板を着脱自在に保持するようにした基板ホルダにあっては、一方のサポートにシール部材を取付け、このシール部材を他方のサポートに載置保持した基板の周縁部に圧接させることで、基板の外周部をシールするようにしている。
【０００６】
ここで、基板ホルダで保持した基板にめっきを行う際には、この基板を電源のマイナス側に電気的に接続する必要がある。このため、例えばシール部材内部の該シール部材でシールされた領域内に位置して、外部から延びる配線と基板とを電気的に繋ぐ電気接点が備えられている。
【０００７】
この電気接点としては、ステンレス等の金属製板材を横断面コ字状に成形した金属接片と、この金属接片を基板方向に向けて付勢するコイルばねを有し、シール部材で基板の外周部を気密的にシールした状態で基板を基板ホルダで保持した時、コイルばねの弾性力を介して、金属接片の外周側に位置する一方の足が外部配線に接触し、金属接片の内周側に位置する他方の足が基板と接触するようにしたものが知られている。
【０００８】
【発明が解決しようとする課題】
しかしながら、従来のこの種の基板ホルダにあっては、電気接点を構成する金属接片が一般に剛体で構成されているため、接点が点接触（片当たり）となって接触不良が生じ易いばかりでなく、基板の周縁部のやや内に入った位置で基板と金属接片が互いに接触するようにしているため、基板のパターン形成領域として有効に利用できる面積が狭くなってしまう。
【０００９】
また、基板や部材には、一般に寸法のばらつきがあり、この寸法のばらつき、更には一対のサポートの位置関係等によって、このサポートで保持される基板のサポートに取付けたシール部材に対する位置決め（センタリング）が一般に困難で、この基板の位置決めのための特別な部材を別途設けると、基板ホルダとしての大型化や複雑化に繋がってしまう。
【００１０】
更に、前述のように、一方のサポートにシール部材を取付け、このシール部材を他方のサポートに載置保持した基板の周縁部に圧接させることで、基板の外周部をシールするようにしているため、めっき終了後に、シール部材を取付けたサポートを開いて基板を基板ホルダから取出す際に、基板がシール部材にくっついたままサポートが開き、基板が脱落してしまうことがあり、この脱落防止のための何らかの対策を施す必要がある。
【００１１】
本発明は上記事情に鑑みて為されたもので、基板のパターン形成領域として有効に利用できる面積を広め、しかも基板のセンタリングを容易に行って基板を保持でき、更に基板を容易かつ確実に取出すことができるようにした基板ホルダ及び該基板ホルダを備えためっき装置を提供することを目的とする。
【００１２】
【課題を解決するための手段】
請求項１に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダにおいて、前記固定保持部材に導電体を、前記可動保持部材に該可動保持部材と前記固定保持部材で基板を保持した時に前記シール部材でシールされた領域内で前記導電体と電気的に接続して基板に通電する板ばね形状の電気接点をそれぞれ設けたことを特徴とする基板ホルダである。
【００１３】
これにより、電気接点を板ばね形状に形成し、この電気接点自体の弾性力を介して電気接点が基板に弾性的に接触するようにすることで、接点不良を減少させ、しかも、電気接点が基板のより外周部で該基板と接触するようにして、基板のパターン形成領域として有効に利用できる面積を広めることができる。
【００１４】
請求項２に記載の発明は、前記電気接点は、前記固定保持部材と前記可動保持部材で基板を保持した時に該基板の表面に弾性的に接触するように構成されていることを特徴とする請求項１記載の基板ホルダである。
【００１５】
請求項３に記載の発明は、前記電気接点は、前記固定保持部材と前記可動保持部材で基板を保持した時に該基板の外周端面に弾性的に接触するように構成されていることを特徴とする請求項１記載の基板ホルダである。
これにより、基板ホルダで基板を保持する際に、基板を板ばね形状の電気接点の弾性力で内方に付勢することで、この電気接点を介して、基板の基板ホルダに対する位置決め（センタリング）を行うことができる。しかも、可動保持部材にシール部材と電気接点を設け、この電気接点に基板の位置決め（センタリング）機能を持たせることで、基板のシール部材及び電気接点に対する位置決めを行って、基板を基板ホルダで保持した時に、基板、シール部材及び電気接点の位置関係が常に一定となるようにすることができる。
【００１６】
請求項４に記載の発明は、前記電気接点は、その基板に接触する先端部が、少なくとも２つ以上に分岐するか、または互いに隣接した位置に並設されていることを特徴とする請求項２または３記載の基板ホルダである。これにより、電気接点と基板とが複数の箇所で接触するようにすることで、一部の接点部分にゴミ等が付着しても、他の接点部分で基板との導通をとることができる。
【００１７】
請求項５に記載の発明は、前記２つ以上に分岐した電気接点の先端部または互いに隣接した位置に並設された電気接点の基板への接触部分が、基板の半径方向にずれていることを特徴とする請求項４記載の基板ホルダである。これにより、基板に多少の位置ずれが生じても、電気接点の少なくとも一部が基板と確実に接触するようにすることができる。
【００１８】
請求項６に記載の発明は、固定保持部材と可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を着脱自在に保持するようにした基板ホルダにおいて、前記固定保持部材と前記可動保持部材には、基板を保持した時に互いに係合して両者の中心に対する位置決めを行うテーパ部がそれぞれ設けられていることを特徴とする基板ホルダである。
これにより、固定保持部材と可動保持部材が離れた位置では両者の位置合わせが正確でなくとも、基板を固定保持部材と可動保持部材で保持する過程で、互いに係合するテーパ部を介して、両者の中心に対する位置決めを自動的に行うことができる。
【００１９】
請求項７に記載の発明は、前記可動保持部材に設けられたテーパ部は、前記固定保持部材と前記可動保持部材で基板を保持する時に該基板の外周端面を案内して基板の位置決めを行うように構成されていることを特徴とする請求項６記載の基板ホルダである。
これにより、前述のようにして、基板を固定保持部材と可動保持部材で保持する過程で、両者の中心に対する位置決めを行い、可動保持部材に設けられたテーパ部を介して、基板の基板ホルダに対する位置決め（センタリング）を同時に行うことができる。
【００２０】
請求項８に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダにおいて、前記固定保持部材に、該固定保持部材と前記可動保持部材で基板を保持した時に自由端部が該基板の外周よりも内側に位置し、前記固定保持部材と前記可動保持部材での基板の保持を解いた時に自由端部が基板の外周よりも外側に位置するばね性を有する板ばね部材を設けたことを特徴とする基板ホルダである。
【００２１】
これにより、めっき終了後、可動保持部材を移動させ基板の保持を解いて、基板を基板ホルダから取出す際に、先ず基板の外周よりも内側に位置する板ばね部材の自由端部で基板の動きを規制して、可動保持部材に取付けたシール部材を基板から引き離すことで、基板がシール部材にひっついたまま該シール部材と一緒に移動してしまうことを防止し、しかもこの移動に伴って、板ばね部材の自由端部を基板の外周より外側に位置させることで、この板ばね部材の存在によって、基板の基板ホルダからの取出しが阻害されてしまうことを防止することができる。
【００２２】
請求項９に記載の発明は、前記板ばね部材は、前記固定保持部材と前記可動保持部材で基板を保持した時に自由端部が該基板の表面に弾性的に接触するように構成されていることを特徴とする請求項８記載の基板ホルダである。
【００２３】
請求項１０に記載の発明は、前記板ばね部材は、前記固定保持部材と前記可動保持部材で基板を保持した時に自由端部が該基板の外周端面に弾性的に接触するように構成されていることを特徴とする請求項８記載の基板ホルダである。これにより、基板ホルダで基板を保持する際に、基板を板ばね部材の弾性力で内方に付勢することで、この板ばね部材を介して、基板の基板ホルダに対する位置決め（センタリング）を行うことができる。
【００２４】
請求項１１に記載の発明は、前記板ばね部材は、前記固定保持部材と前記可動保持部材で基板を保持した時に該基板に給電する電気接点を兼用していることを特徴とする請求項９または１０記載の基板ホルダである。これにより、基板を基板ホルダから取出す際に、基板をシール部材から引き離すことのみを目的とする専用の板ばね部材を設ける必要をなくして、構造の簡素化を図ることができる。
【００２５】
請求項１２に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダにおいて、前記可動保持部材に、該可動保持部材と前記固定保持部材で基板を保持した時に前記シール部材でシールされた領域内で基板の外周端面と弾性的に接触して該基板の位置決めを行うばね性を有する板ばね部材を設けたことを特徴とする基板ホルダである。
これにより、基板ホルダで基板を保持する過程で、基板をばね性を有する板ばね部材の弾性力で内方に付勢することで、この板ばね部材を介して、基板の基板ホルダに対する位置決め（センタリング）を行うことができる。しかも、可動保持部材にシール部材と電気接点を設け、この電気接点を介して基板の位置決めを行うことで、基板を基板ホルダで保持した時に、基板、シール部材及び電気接点の位置関係が常に一定となるようにすることができる。
【００２６】
請求項１３に記載の発明は、前記可動保持部材は、該可動保持部材と前記固定保持部材で基板を保持した時に該基板に弾性的に接触して給電する電気接点を更に有することを特徴とする請求項１２記載の基板ホルダである。
【００２７】
請求項１４に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダにおいて、前記シール部材は、前記固定保持部材と前記可動保持部材で基板を保持した時に該基板の周縁部と前記固定保持部材の表面にそれぞれ接触するリップ部を有し、該リップ部の間に装着した支持体に一体的に保持されていることを特徴とする基板ホルダである。
これにより、めっき終了後、可動保持部材を移動させ基板の保持を解いて、基板を基板ホルダから取出す際に、シール部材のシール部が基板に付着して捲れてしまうことを防止して、シール部材と基板との剥離性を向上させることができる。
【００２８】
請求項１５に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダであって、前記固定保持部材に導電体を、前記可動保持部材に該可動保持部材と前記固定保持部材で基板を保持した時に前記シール部材でシールされた領域内で前記導電体と電気的に接続して基板に通電する板ばね形状の電気接点をそれぞれ設けた基板ホルダを用いることを特徴とするめっき装置である。
【００２９】
請求項１６に記載の発明は、固定保持部材と可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を着脱自在に保持するようにした基板ホルダであって、前記固定保持部材と前記可動保持部材には、基板を保持した時に互いに係合して両者の中心に対する位置決めを行うテーパ部がそれぞれ設けられている基板ホルダを用いることを特徴とするめっき装置である。
【００３０】
請求項１７に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダであって、前記固定保持部材に、該固定保持部材と前記可動保持部材で基板を保持した時に自由端部が該基板の外周よりも内側に位置し、前記固定保持部材と前記可動保持部材での基板の保持を解いた時に自由端部が基板の外周よりも外側に位置するばね性を有する板ばね部材を設けた基板ホルダを用いることを特徴とするめっき装置である。
【００３１】
請求項１８に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダであって、前記可動保持部材に、該可動保持部材と前記固定保持部材で基板を保持した時に前記シール部材でシールされた領域内で基板の外周端面と弾性的に接触して該基板の位置決めを行うばね性を有する板ばね部材を設けた基板ホルダを用いることを特徴とするめっき装置である。
【００３２】
請求項１９に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダであって、前記シール部材は、前記固定保持部材と前記可動保持部材で基板を保持した時に該基板の周縁部と前記固定保持部材の表面にそれぞれ接触するリップ部を有し、該リップ部の間に装着した支持体に一体的に保持されている基板ホルダを用いることを特徴とするめっき装置である。
【００３３】
【発明の実施の形態】
以下、本発明の実施の形態を図面を参照して説明する。
図１は、本発明の実施の形態の基板ホルダを備えためっき装置の全体配置図を示す。図１に示すように、このめっき装置には、半導体ウエハ等の基板Ｗを収納したカセット１０を搭載する２台のカセットテーブル１２と、基板Ｗのオリフラやノッチなどの位置を所定の方向に合わせるアライナ１４と、めっき処理後の基板Ｗを高速回転させて乾燥させるスピンドライヤ１６が備えられている。更に、この近くには、基板ホルダ１８を載置して基板Ｗの該基板ホルダ１８との着脱を行う基板着脱部２０が設けられ、これらのユニットの中央には、これらの間で基板Ｗを搬送する搬送用ロボットからなる基板搬送装置２２が配置されている。
【００３４】
そして、基板着脱部２０側から順に、基板ホルダ１８の保管及び一時仮置きを行うストッカ２４、基板Ｗを純水に浸漬させるプリウェット槽２６、基板Ｗの表面に形成したシード層５００（図１２参照）表面の酸化膜をエッチング除去するプリソーク槽２８、基板Ｗの表面を純水で水洗する第１の水洗槽３０ａ、洗浄後の基板Ｗの水切りを行うブロー槽３２、第２の水洗槽３０ｂ及びめっき槽３４が順に配置されている。このめっき槽３４は、オーバーフロー槽３６の内部に複数の銅めっきユニット３８を収納して構成され、各銅めっきユニット３８は、内部に１個の基板Ｗを収納して、銅めっき等のめっきを施すようになっている。なお、この例では、銅めっきについて説明するが、ニッケルやはんだ、銀、更には金めっきにおいても同様であることは勿論である。
【００３５】
更に、これらの各機器の側方に位置して、これらの各機器の間で基板ホルダ１８を基板Ｗとともに搬送する、例えばリニアモータ方式を採用した基板ホルダ搬送装置４０が備えられている。この基板ホルダ搬送装置４０は、基板着脱部２０とストッカ２４との間で基板Ｗを搬送する第１のトランスポータ４２と、ストッカ２４、プリウェット槽２６、プリソーク槽２８、水洗槽３０ａ，３０ｂ、ブロー槽３２及びめっき槽３４との間で基板Ｗを搬送する第２のトランスポータ４４を有している。なお、第２のトランスポータ４４を備えることなく、第１のトランスポータ４２のみを備えるようにしてもよい。
【００３６】
また、この基板ホルダ搬送装置４０のオーバーフロー槽３６を挟んだ反対側には、各銅めっきユニット３８の内部に位置してめっき液を攪拌する掻き混ぜ棒としてのパドル（図示せず）を駆動するパドル駆動装置４６が配置されている。
【００３７】
基板着脱部２０は、レール５０に沿って横方向にスライド自在な平板状の載置プレート５２を備えており、この載置プレート５２に２個の基板ホルダ１８を水平状態で並列に載置して、この一方の基板ホルダ１８と基板搬送装置２２との間で基板Ｗの受渡しを行った後、載置プレート５２を横方向にスライドさせて、他方の基板ホルダ１８と基板搬送装置２２との間で基板Ｗの受渡しを行うようになっている。
【００３８】
前記基板ホルダ１８は、図２乃至図７に示すように、例えば塩化ビニル製で矩形平板状の固定保持部材５４と、この固定保持部材５４にヒンジ５６を介して開閉自在に取付けた可動保持部材５８とを有している。なお、この例では、可動保持部材５８を、ヒンジ５６を介して開閉自在に構成した例を示しているが、例えば可動保持部材５８を固定保持部材５４に対峙した位置に配置し、この可動保持部材５８を固定保持部材５４に向けて前進させて開閉するようにしてもよい。
この可動保持部材５８は、基部５８ａと、この例ではリング状の支持部５８ｂとを有し、例えば塩化ビニル製で、下記の押えリング６２との滑りを良くしており、その支持部５８ｂの固定保持部材５４側表面に、リング状で一方のリップ部を長くした横断面略コ字状のシール部材（シールリング）６０が固定保持部材５４側に開口して取付けられている。
【００３９】
可動保持部材５８の固定保持部材５４と反対側には、押えリング６２が回転自在に支承され、この押えリング６２の外周面にスライドプレート６４が取付けられている。この押えリング６２は、酸化性環境に対して耐食性に優れ、十分な剛性を有する、例えばチタンから構成されている。
【００４０】
スライドプレート６４の外側方に位置して、固定保持部材５４には、内方に突出する突出部を有する逆Ｌ字状のクランパ７０が円周方向に沿って等間隔で立設されている。そして、スライドプレート６４の表面及び該表面を覆うように位置するクランパ７０の内方突出部の下面は、回転方向に沿って互いに逆方向に傾斜するテーパ面となっている。更に、押えリング６２の表面の円周方向に沿った複数箇所（例えば４カ所）には、例えば押えリング６２にねじ込んだ回転ピンからなる突起７３が設けられ、この突起７３を回転機構で引っ掛けて押えリング６２をスライドプレート６４と一体に回転させるようになっている。
【００４１】
これにより、可動保持部材５８を開いた状態で、固定保持部材５４の中央部に基板Ｗを挿入し、ヒンジ５６を介して可動保持部材５８を閉じた後、押えリング６２を時計回りに回転させて、スライドプレート６４をクランパ７０の突出部の内部に滑り込ませることで、固定保持部材５４と可動保持部材５８とをテーパ面を介して互いに締付けてロックし、押えリング６２を反時計回りに回転させて逆Ｌ字状のクランパ７０の突出部からスライドプレート６４を引き抜くことで、このロックを解くようになっている。そして、このようにして可動保持部材５８をロックした時、シール部材６０の内周面側の短いリップ部６０ａが基板Ｗの表面に、外周面側の長いリップ部６０ｂが固定保持部材５４の表面にそれぞれ圧接し、シール部材６０を均一に押圧して、ここを確実にシールするようになっている。
【００４２】
固定保持部材５４の中央部には、基板Ｗの大きさに合わせてリング状に突出し、表面を基板Ｗの周縁部に当接させて該基板Ｗを支持する支持面８０となる突条部８２が設けられており、この突条部８２の円周方向に沿った所定位置に凹部８４が設けられている。
【００４３】
そして、図２及び図５に示すように、この各凹部８４内に、下記のハンド９８に設けた外部接点から延びる複数の配線にそれぞれ接続した複数（図示では８個）の導電体（電気接点）８８が配置されて、固定保持部材５４の支持面８０上に基板Ｗを載置した際、この導電体８８の端部が基板Ｗの側方で固定保持部材５４の表面にばね性を有した状態で露出するようになっている。
【００４４】
一方、シール部材６０の一対のリップ部６０ａ，６０ｂで挟まれた内部には、支持体９０が取付けられ、この支持体９０の導電体８８に対向した位置に、電気接点９２の脚部９２ａが固着されている。この電気接点９２は、板ばね形状に形成されている。つまり、この電気接点９２は、内方に板ばね状に突出する接点端部９２ｂを有しており、この接点端部９２ｂにおいて、その弾性力によるばね性を有して容易に屈曲するようになっている。
【００４５】
つまり、この例では、接点端部９２ｂは、図１１（ａ）に示すように、基板Ｗに向けた突出長さが均等な、複数の矩形状の細片が並列に配列された形状に形成されている。そして、電気接点９２は、この各接点端部（細片）９２ｂの先端部を結ぶ線が基板Ｗの接線方向に対して僅かに傾くような状態となるように、支持体９０に取付けられている。これにより、図１１（ａ）に示すように、各接点端部（細片）９２ｂの各先端部が、基板Ｗの表面の、斜線で示す電気接点との接触領域Ａに、この幅方向の異なる位置で接触し、これによって、基板Ｗに多少の位置ずれが生じても、接点端部（細片）９２ｂの各先端部の少なくとも一部が、基板Ｗの接触領域Ａで基板Ｗと接触するようになっている。
【００４６】
なお、図１１（ｂ）に示すように、複数の長尺状の電気接点９２を基板の直径方向に沿った位置に所定間隔離間させて配置し、この各接点端部９２ｂの各先端部が、基板Ｗの表面の、斜線で示す電気接点との接触領域Ａに、この円周方向に沿った位置で接触するようにしてもよい。これにより、一部の電気接点９２の接点端部９２ｂにゴミ等が付着しても、他の電気接点９２で基板Ｗとの導通をとるようにすることができる。
【００４７】
また、図１１（ｃ）に示すように、基板Ｗに向けた突出長さが均等な、複数の矩形状の細片が並列に配列された形状の各接点端部（細片）９２ｂの先端部を結ぶ線が、基板Ｗの接線方向と平行となるように、電気接点９２を支持体９０に取付けるようにしてもよく、更に、図１１（ｄ）に示すように、複数の矩形状の細片が並列に配列された形状の各接点端部（細片）９２ｂの基板Ｗに向けた突出長さが異なるようにしてもよい。これらによっても、各接点端部（細片）９２ｂの各先端部が、基板Ｗの表面の、斜線で示す電気接点との接触領域Ａに、この幅方向の異なる位置で接触して、基板Ｗに多少の位置ずれが生じても、接点端部（細片）９２ｂの各先端部の少なくとも一部が、基板Ｗの接触領域Ａで基板Ｗと接触するようにすることができる。
【００４８】
そして、可動保持部材５８をロックして固定保持部材５４と可動保持部材５８で基板Ｗを保持した時、図５（ｂ）に示すように、シール部材６０でシールされた位置、すなわちシール部材６０の一対のリップ部６０ａ，６０ｂで挟まれた領域で、導電体８８の露出部が電気接点９２の脚部９２ａの下面に導電体８８の露出部の弾性力を介して弾性的に接触して電気的に接続され、基板Ｗが電気接点９２の接点端部９２ｂの先端に該接点端部９２ｂの弾性力を介して弾性的に接触する。これによって、基板Ｗをシール部材６０でシールして基板ホルダ１８で保持した状態で、電気接点９２を介して基板Ｗに給電が行えるようになっている。
【００４９】
このように、電気接点９２を板ばね形状に形成し、この電気接点９２自体の弾性力を介して電気接点９２の接点端部９２ｂの先端が基板Ｗに接触するようにすることで、接点不良を減少させ、しかも、電気接点９２が基板Ｗのより外周部で該基板Ｗと接触するようにして、基板Ｗのパターン形成領域として有効に利用できる面積を広めることができる。
なお、導電体８８の表面の、少なくとも電気接点９２との当接面に、例えば金または白金めっきを施して被覆することが好ましい。
【００５０】
また、図６に示すように、固定保持部材５４の突条部８２の一部には、尖塔状のテーパ面を有するテーパ部８２ａが設けられ、また、支持体９０の内周面の該テーパ部８２ａと対向する位置には、該テーパ部８２ａのテーパ面と逆テーパ面で、固定保持部材５４と可動保持部材５８とで基板Ｗを保持した時に互いに係合して両者５４，５８の中心に対する位置決めを行うテーパ部９０ａが設けられている。つまり、図６（ｂ）に示すように、固定保持部材５４と可動保持部材５８とで基板Ｗを保持する際に、テーパ部８２ａ，９０ａが互いに案内となって、可動保持部材５８の固定保持部材５４に対する（またはその逆の）位置決めが行われるようになっている。
【００５１】
このように、固定保持部材５４の突条部８２と可動保持部材５８の支持体９０に互いに係合するテーパ部８２ａ，９０ａを設けることにより、固定保持部材５４と可動保持部材５８が離れた位置では両者５４，５８の位置合わせが正確でなくとも、基板Ｗを固定保持部材５４と可動保持部材５８で保持する過程で、互いに係合するテーパ部８２ａ，９０ａを介して、両者５４，５８の中心に対する位置決めを自動的に行うことができる。
【００５２】
ここで、可動保持部材５８の支持体９０に設けられたテーパ部９０ａは、固定保持部材５４と可動保持部材５８で基板Ｗを保持する時に、固定保持部材５４の突条部８２の支持面８０上に支持された基板Ｗの外周端面を案内して基板Ｗの位置決めを行うように構成されている。つまり、図６（ｂ）に示すように、基板Ｗの外周部が突条部８２の支持面８０から外方に突出した時に、この基板Ｗの外周端面がテーパ部９０ａに接触し、これによって、基板Ｗの基板ホルダ、ひいてはシール部材６０に対する位置決め（センタリング）が行われるようになっている。
【００５３】
これにより、前述のようにして、基板Ｗを固定保持部材５４と可動保持部材５８で保持する過程で、両者５４，５８の中心に対する位置決めを行い、可動保持部材５８の支持体９０に設けられたテーパ部９０ａを介して、基板Ｗの基板ホルダに対する位置決め（センタリング）を同時に行うことができる。
【００５４】
更に、図７に示すように、固定保持部材５４の表面のシール部材６０と対面する円周方向に沿った所定の位置には、複数の凹溝９４が設けられ、この各凹溝９４の内部に、上方に向けて延出する板ばね部材９６がその下端を固定して配置されている。この板ばね部材９６は、その下端を固定して上方をフリーとすることでばね性を有しており、上方に向け外方に傾斜して延出するばね性を有する延出部（自由端部）９６ａの先端には、円弧状に丸めた係合部９６ｂが設けられている。
【００５５】
一方、可動保持部材５８の支持体９０の板ばね部材９６と対向する内周面には、上方に向けて内方に傾斜するテーパ面９０ｃと該テーパ面９０ｃに連続して鉛直方向に立上る鉛直面９０ｄからなる案内面が形成されている。
【００５６】
これにより、図７（ａ）から図７（ｂ）に示すように、可動保持部材５８の下降に伴って、板ばね部材９６の先端係合部９６ｂが支持体９０のテーパ面９０ｃに当接し該テーパ面９０ｃに案内されて、板ばね部材９６は内方に向けて屈曲する。そして、可動保持部材５８が更に下降すると、図７（ｃ）に示すように、板ばね部材９６の先端係合部９６ｂが支持体９０の鉛直面９０ｄの内方に位置し、延出部９６ａが垂直となって、板ばね部材９６は、これ以上内方に屈曲しないが、板ばね部材９６の係合部９６ｂが固定保持部材５４の支持面８０上に支持された基板Ｗの外周部の上方を覆う位置に位置する。そして、可動保持部材５８が更に下降することで、シール部材６０の内周面側の短いリップ部６０ａが基板Ｗの表面に、外周面側の長いリップ部６０ｂが固定保持部材５４の表面にそれぞれ圧接し、シール部材６０を均一に押圧して、ここを確実にシールし、この状態で、めっき等の基板の処理が行われる。
【００５７】
そして、一連の処理を終了して、基板ホルダで保持した基板Ｗを取出す時には、可動保持部材５８を上昇させるのであるが、この時、先ず、図７（ｄ）に示すように、板ばね部材９６の先端係合部９６ｂが支持体９０の鉛直面９０ｄの内方に位置しているため、この板ばね部材９６の動きが規制される。このため、例えシール部材６０に基板Ｗがひっついていたとしても、板ばね部材９６の先端係合部９６ｂが基板Ｗの外周部上面に当接してこの上昇を規制し、シール部材６０、可動保持部材５８、支持体９０が上昇して、基板Ｗをシール部材６０から強制的に切り離す。そして、可動保持部材５８が更に上昇すると、板ばね部材９６は、その先端係合部９６ｂが支持体９０のテーパ面９０ｃに当接しながら、その弾性力で徐々に外方に拡がり、図７（ｆ）に示すように元の状態に復帰する。この時、板ばね部材９６の係合部９６ｂが固定保持部材５４の支持面８０上に支持された基板Ｗの外周部の外方に位置する。これによって、この板ばね部材９６によって、処理後の基板Ｗの取出しや、処理前の基板の装着が阻害されてしまうことはない。
【００５８】
これにより、めっき終了後、可動保持部材５８を移動させ基板Ｗの保持を解いて、基板Ｗを基板ホルダから取出す際に、基板Ｗがシール部材６０にひっついたまま該シール部材６０と一緒に移動してしまうことを防止し、しかもこの移動に伴って、板ばね部材９６の自由端部を基板の外周より外側に位置させることで、この板ばね部材９６の存在によって、基板Ｗの基板ホルダからの取出しが阻害されてしまうことを防止することができる。
【００５９】
シール部材６０は、前述のように、固定保持部材５４と可動保持部材５８で基板Ｗを保持した時に該基板Ｗの周縁部と固定保持部材５８の表面にそれぞれ接触するリップ部６０ａ，６０ｂを有しており、このリップ部６０ａ，６０ｂの間に装着した支持体９０に一体的に保持されている。つまり、シール部材６０は、リップ部６０ａ，６０ｂを繋ぐ平坦部を可動保持部材５８の支持部５８ａと支持体９０で挟み、この可動保持部材５８の支持部５８ａと支持体９０とをボルト９１（図６参照）で締付けることで固定されている。更に、可動保持部材５８の支持部５８ａとシール部材６０の上面との間にシール材９３が介装されて、ここを確実にシールするように構成されている。
【００６０】
このように、シール部材６０を支持体９０に一体的に保持することで、めっき終了後、可動保持部材５８を移動させ基板Ｗの保持を解いて、基板Ｗを基板ホルダ１８から取出す際に、シール部材６０のリップ部（シール部）６０ａが基板Ｗに付着して固定保持部材５８の支持部５８ｂから捲れてしまうことを防止して、シール部材６０と基板Ｗとの剥離性を向上させることができる。
【００６１】
可動保持部材５８の開閉は、図示しないシリンダと可動保持部材５８の自重によって行われる。つまり、固定保持部材５４には通孔５４ａが設けられ、載置プレート５２の上に基板ホルダ１８を載置した時に該通孔５４ａに対向する位置にシリンダが設けられている。これにより、シリンダロッドを伸展させ、通孔５４ａを通じて押圧棒で可動保持部材５８の基部５８ａを上方に押上げることで可動保持部材５８を開き、シリンダロッドを収縮させることで、可動保持部材５８をその自重で閉じるようになっている。
【００６２】
この例にあっては、押えリング６２を回転させることにより、可動保持部材５８のロック・アンロックを行うようになっているが、このロック・アンロック機構は、天井側に設けられている。つまり、このロック・アンロック機構は、載置プレート５２の上に基板ホルダ１８を載置した時、この中央側に位置する基板ホルダ１８の押えリング６２の各突起７３に対応する位置に位置させた把持部材を有し、載置プレート５２を上昇させ、突起７３を把持部材で把持した状態で把持部材を押えリング６２の軸芯周りに回転させることで、押えリング６２を回転させるように構成されている。このロック・アンロック機構は、１個備えられ、載置プレート５２の上に載置した２個の基板ホルダ１８の一方をロック（またはアンロック）した後、載置プレート５２を横方向にスライドさせて、他方の基板ホルダ１８をロック（またはアンロック）するようになっている。
【００６３】
また、基板ホルダ１８には、基板Ｗを装着した時の該基板Ｗと接点との接触状態を確認するセンサが備えられ、このセンサからの信号がコントローラ（図示せず）に入力されるようになっている。
【００６４】
基板ホルダ１８の固定保持部材５４の端部には、基板ホルダ１８を搬送したり、吊下げ支持したりする際の支持部となる一対の略Ｔ字状のハンド９８が連接されている。そして、ストッカ２４内においては、この周壁上面にハンド９８の突出端部を引っ掛けることで、これを垂直に吊下げ保持し、この吊下げ保持した基板ホルダ１８のハンド９８を基板ホルダ搬送装置４０のトランスポータ４２で把持して基板ホルダ１８を搬送するようになっている。なお、プリウェット槽２６、プリソーク槽２８、水洗槽３０ａ，３０ｂ、ブロー槽３２及びめっき槽３４内においても、基板ホルダ１８は、ハンド９８を介してそれらの周壁に吊下げ保持される。
【００６５】
このように構成しためっき装置による一連のバンプめっき処理を説明する。先ず、図１２（ａ）に示すように、表面に給電層としてのシード層５００を成膜し、このシード層５００の表面に、例えば高さＨが２０〜１２０μｍのレジスト５０２を全面に塗布した後、このレジスト５０２の所定の位置に、例えば直径Ｄが２０〜２００μｍ程度の開口部５０２ａを設けた基板をその表面（被めっき面）を上にした状態でカセット１０に収容し、このカセット１０をカセットテーブル１２に搭載する。
【００６６】
このカセットテーブル１２に搭載したカセット１０から、基板搬送装置２２で基板を１枚取出し、アライナ１４に載せてオリフラやノッチなどの位置を所定の方向に合わせる。このアライナ１４で方向を合わせた基板を基板搬送装置２２で基板着脱部２０まで搬送する。
【００６７】
基板着脱部２０においては、ストッカ２４内に収容されていた基板ホルダ１８を基板ホルダ搬送装置４０のトランスポータ４２で２基同時に把持して、基板着脱部２０まで搬送する。そして、基板ホルダ１８を水平な状態として下降させ、これによって、２基の基板ホルダ１８を基板着脱部２０の載置プレート５２の上に同時に載置し、シリンダを作動させて基板ホルダ１８の可動保持部材５８を開いた状態にしておく。
【００６８】
この状態で、中央側に位置する基板ホルダ１８に基板搬送装置２２で搬送した基板を挿入し、シリンダを逆作動させて可動保持部材５８を閉じ、しかる後、ロック・アンロック機構で可動保持部材５８をロックする。そして、一方の基板ホルダ１８への基板の装着が完了した後、載置プレート５２を横方向にスライドさせて、同様にして、他方の基板ホルダ１８に基板を装着し、しかる後、載置プレート５２を元の位置に戻す。
【００６９】
これにより、基板Ｗは、そのめっき処理を行う面を基板ホルダ１８の開口部から露出させた状態で、周囲をシール部材６０でめっき液が浸入しないようにシールされ、シールによってめっき液に触れない部分において複数の接点と電気的に導通するように固定される。ここで、接点からは基板ホルダ１８のハンド９８まで配線が繋がっており、ハンド９８の部分に電源を接続することにより基板のシード層５００に給電することができる。
【００７０】
次に、基板Ｗを装着した基板ホルダ１８を基板ホルダ搬送装置４０のトランスポータ４２で２基同時に把持し、ストッカ２４まで搬送する。そして、基板ホルダ１８を垂直な状態となして下降させ、これによって、２基の基板ホルダ１８をストッカ２４に吊下げ保持（仮置き）する。
【００７１】
これらの基板搬送装置２２、基板着脱部２０及び基板ホルダ搬送装置４０のトランスポータ４２においては、前記作業を順次繰り返して、ストッカ２４内に収容された基板ホルダ１８に順次基板を装着し、ストッカ２４の所定の位置に順次吊り下げ保持（仮置き）する。
なお、基板ホルダ１８に備えられていた基板と接点との接触状態を確認するセンサで、この接触状態が不良である判断とした時には、その信号をコントローラ（図示せず）に入力する。
【００７２】
一方、基板ホルダ搬送装置４０の他方のトランスポータ４４にあっては、基板を装着しストッカ２４に仮置きした基板ホルダ１８を２基同時に把持し、プリウェット槽２６まで搬送して下降させ、これによって、２基の基板ホルダ１８をプリウェット槽２６内に入れる。
【００７３】
なお、この時、基板ホルダ１８に備えられていた基板と接点との接触状態を確認するセンサで、この接触状態が不良であると判断した基板を収納した基板ホルダ１８は、ストッカ２４に仮置きしたままにしておく。これにより、基板ホルダ１８に基板を装着した時に該基板と接点との間に接触不良が生じても、装置を停止させることなく、めっき作業を継続することができる。この接触不良を生じた基板にはめっき処理が施されないが、この場合には、カセットを戻した後にめっき未処理の基板をカセットから排除することで、これに対処することができる。
【００７４】
次に、この基板を装着した基板ホルダ１８を、前記と同様にして、プリソーク槽２８に搬送し、プリソーク槽２８で酸化膜をエッチングし、清浄な金属面を露出させる。更に、この基板を装着した基板ホルダ１８を、前記と同様にして、水洗槽３０ａに搬送し、この水洗槽３０ａに入れた純水で基板の表面を水洗する。
【００７５】
水洗が終了した基板を装着した基板ホルダ１８を、前記と同様にして、めっき液を満たしためっき槽３４に搬送し、めっきユニット３８に吊り下げ保持する。基板ホルダ搬送装置４０のトランスポータ４４は、上記作業を順次繰り返し行って、基板を装着した基板ホルダ１８を順次めっき槽３４のめっきユニット３８に搬送して所定の位置に吊下げ保持する。
【００７６】
全ての基板ホルダ１８の吊下げ保持が完了した後、オーバーフロー槽３６のめっき液を循環させ、かつ、オーバーフローさせながら、めっき槽３４内のアノード（図示せず）と基板Ｗとの間にめっき電圧を印加し、同時にパドル駆動装置４６によりパドルを基板の表面と平行に往復移動させることで、基板の表面にめっきを施す。この時、基板ホルダ１８は、めっきユニット３８の上部でハンド９８により吊り下げられて固定され、めっき電源から導電体８８及び電気接点９２を通して、シード層５００（図１２参照）に給電される。
【００７７】
めっきが終了した後、めっき電源の印加、めっき液の供給及びパドル往復運動を停止し、めっき後の基板Ｗを装着した基板ホルダ１８を基板ホルダ搬送装置４０のトランスポータ４４で２基同時に把持し、前述と同様にして、水洗槽３０ｂまで搬送し、この水洗槽３０ｂに入れた純水に浸漬させて基板の表面を純水洗浄する。次に、この基板Ｗを装着した基板ホルダ１８を、前記と同様にして、ブロー槽３２に搬送し、ここで、エアーの吹き付けによって基板ホルダ１８に付着した水滴を除去する。しかる後、この基板Ｗを装着した基板ホルダ１８を、前記と同様にして、ストッカ２４の所定の位置に戻して吊下げ保持する。
【００７８】
基板ホルダ搬送装置４０のトランスポータ４４は、上記作業を順次繰り返し、めっきが終了した基板を装着した基板ホルダ１８を順次ストッカ２４の所定の位置に戻して吊下げ保持する。
【００７９】
一方、基板ホルダ搬送装置４０の他方のトランスポータ４２にあっては、めっき処理後の基板Ｗを装着しストッカ２４に戻した基板ホルダ１８を２基同時に把持し、前記と同様にして、基板着脱部２０の載置プレート５２の上に載置する。この時、基板ホルダ１８に備えられていた基板と接点との接触状態を確認するセンサで、この接触状態が不良であると判断した基板を装着しストッカ２４に仮置きしたままの基板ホルダ１８も同時に搬送して載置プレート５２の上に載置する。
【００８０】
そして、中央側に位置する基板ホルダ１８の可動保持部材５８のロックを、ロック・アンロック機構を介して解き、シリンダを作動させて可動保持部材５８を開く。この時、前述のように、基板Ｗが可動保持部材５８にくっついたまま可動保持部材５８が開くことが防止される。この状態で、基板ホルダ１８内のめっき処理後の基板Ｗを基板搬送装置２２で取出して、スピンドライヤ１６に運び、このスピンドライヤ１６の高速回転によってスピンドライ（水切り）した基板を基板搬送装置２２でカセット１０に戻す。
【００８１】
そして、一方の基板ホルダ１８に装着した基板をカセット１０に戻した後、或いはこれと並行して、載置プレート５２を横方向にスライドさせて、同様にして、他方の基板ホルダ１８に装着した基板をスピンドライしてカセット１０に戻す。
【００８２】
載置プレート５２を元の状態に戻した後、基板を取出した基板ホルダ１８を基板ホルダ搬送装置４０のトランスポータ４２で２基同時に把持し、前記と同様にして、これをストッカ２４の所定の場所に戻す。しかる後、めっき処理後の基板を装着しストッカ２４に戻した基板ホルダ１８を基板ホルダ搬送装置４０で２基同時に把持し、前記と同様にして、基板着脱部２０の載置プレート５２の上に載置して、前記と同様な作業を繰り返す。
【００８３】
そして、めっき処理後の基板を装着しストッカ２４に戻した基板ホルダ１８から全ての基板を取出し、スピンドライしてカセット１０に戻して作業を完了する。これにより、図１２（ｂ）に示すように、レジスト５０２に設けた開口部５０２ａ内にめっき膜５０４を成長させた基板Ｗが得られる。
【００８４】
次に、前述のようにしてスピンドライした基板Ｗを、例えば温度が５０〜６０℃のアセトン等の溶剤に浸漬させて、図１２（ｃ）に示すように、基板Ｗ上のレジスト５０２を剥離除去する。そして、図１２（ｄ）に示すように、めっき後の外部に露出する不要となったシード層５００を除去し、バンプ５０４を形成する。
【００８５】
なお、この例では、基板着脱部２０と銅めっきユニット３８との間に基板ホルダ１８を縦置きで収納するストッカ２４を配置し、基板着脱部２０とストッカ２４との間での基板ホルダ１８の搬送を基板ホルダ搬送装置４０の第１のトランスポータ４２で、ストッカ２４と銅めっきユニット３８との間での基板ホルダ１８の搬送を第２のトランスポータ４４でそれぞれ行うことで、不使用時の基板ホルダ１８をストッカ２４に保管しておき、またストッカ２４を挟んだ前後における基板ホルダ１８の搬送をスムーズに行ってスループットを向上させるようにしている。１つのトランスポータで全ての搬送を行うようにしても良いことは勿論である。
【００８６】
また、基板搬送装置２２として、ドライハンドとウェットハンドを有するロボットを使用し、基板ホルダ１８からめっき後の基板を取出す時にのみウェットハンドを使用し、他はドライハンドを使用するようにしている。基板ホルダ１８のシールによって基板の裏面はめっき液に接触しないように保たれており、原則的にはウェットハンドとすることは必ずしも必要ではないが、このようにハンドを使い分けることで、リンス水の回り込みやシール不良によるめっき液汚染が生じ、この汚染が新しい基板の裏面を汚染することを防止することができる。
【００８７】
なお、上記の例では、電気接点９２として、その接点端部９２ｂの先端が、固定保持部材５４の支持面８０上に支持された基板Ｗの表面に弾性的に接触するようにした例を示しているが、図８に示すように、固定保持部材５４と可動保持部材５８で基板Ｗを保持した時に、電気接点９２の接点端部９２ｂが、固定保持部材５４の支持面８０上に支持された基板Ｗの外周面に弾性的に接触するようにして、この電気接点９２が基板の位置決めを行う板ばね部材を兼用するように構成してもよい。
【００８８】
これにより、基板ホルダで基板Ｗを保持する際に、基板Ｗを板ばね形状の電気接点９２の弾性力で内方に付勢することで、この電気接点（板ばね部材）９２を介して、基板Ｗの基板ホルダ１８に対する位置決め（センタリング）を行うことができる。しかも、可動保持部材５８にシール部材６０と電気接点９２を設け、この電気接点９２を介して基板Ｗの基板ホルダ１８に対する位置決めを行うことで、基板Ｗを基板ホルダ１８で保持した時に、基板Ｗ、シール部材６０及び電気接点９２の位置関係が常に一定となるようにすることができる。
【００８９】
また、図９に示すように、前述の電気接点９２としての役割と、前述の板ばね部材９６としての役割を兼用する電気接点兼板ばね部材１００を、固定保持部材５４の表面のシール部材６０と対面する円周方向に沿った所定の位置に設けた凹状部１０２内に設けてもよい。
【００９０】
この電気接点兼板ばね部材１００の前述の板ばね部材９６との作用上の相違は、図９（ｃ）に示すように、電気接点兼板ばね部材１００の先端係合部１００ｂが支持体９０の鉛直面９０ｄの内方に位置し、延出部１００ａが垂直となって、電気接点兼板ばね部材１００がこれ以上内方に屈曲しない状態となった時、電気接点兼板ばね部材１００が固定保持部材５４の支持面８０上に支持された基板Ｗの外周部に接触して基板Ｗに給電し、更に、図９（ｄ）に示すように、基板Ｗの保持を解く際、電気接点兼板ばね部材１００の先端係合部１００ｂを基板Ｗの外周部に当接させ続けることで、シール部材６０のみを上昇させて、基板Ｗを強制的に切り離すようにしている点である。その他の作用は、図７に示す板ばね部材９６と基本的に同様である。
【００９１】
このように、電気接点９２としての役割と板ばね部材９６としての役割を兼用する電気接点兼板ばね部材１００を設けることで、基板ホルダの基板Ｗの保持を解く際に、基板Ｗをシール部材から引き離すことのみを目的とする専用の板ばね部材を設ける必要をなくして、構造の簡素化を図ることができる。
【００９２】
なお、図示しないが、前述と同様に、固定保持部材５４と可動保持部材５８で基板Ｗを保持した時に、電気接点兼板ばね部材１００の先端係合部１００ｂが、固定保持部材５４の支持面８０上に支持された基板Ｗの外周面に弾性的に接触するように構成し、基板ホルダで基板Ｗを保持する際に、基板Ｗを板ばね形状の電気接点兼板ばね部材１００の弾性力で内方に付勢することで、この電気接点兼板ばね部材１００を介して、基板Ｗの基板ホルダに対する位置決め（センタリング）を行うようにしてもよい。
【００９３】
更に、図１０に示すように、可動保持部材５８と固定保持部材５４で基板Ｗを保持した時に基板Ｗの外周端面と弾性的に接触して該基板Ｗの位置決めを行うばね性を有する板ばね部材１１０を、電気接点９２とは別に、支持体９０に設けるようにしても良い。この板ばね部材１１０は、例えば図５に示す電気接点９２に挟まれた位置に配置される。
【００９４】
これにより、基板ホルダ１８で基板Ｗを保持する過程で、基板Ｗをばね性を有する板ばね部材１１０の弾性力で内方に付勢することで、この板ばね部材１１０を介して、基板Ｗの基板ホルダ１８に対する位置決め（センタリング）を行うことができる。しかも、可動保持部材５８にシール部材６０、電気接点９２及び基板の位置決めを行う板ばね部材１１０を設け、この板ばね部材１１０を介して基板Ｗの位置決めを行うことで、基板Ｗを基板ホルダ１８で保持した時に、板ばね部材１１０を介して、基板Ｗ、シール部材６０及び電気接点９２の位置関係が常に一定となるようにすることができる。
【００９５】
以上説明したように、このめっき装置によれば、基板を収納したカセットをカセットテーブルにセットして装置を始動することで、ディップ方式を採用した電解めっきを全自動で行って、基板の表面にバンプ等に適した金属めっき膜を自動的に形成することができる。
【００９６】
【発明の効果】
以上説明したように、本発明によれば、電気接点を板ばね形状に形成し、この電気接点自体の弾性力を介して電気接点が基板に接触するようにすることで、接点不良を減少させ、しかも、電気接点が基板のより外周部で該基板と接触するようにして、基板のパターン形成領域として有効に利用できる面積を広めることができる。
【００９７】
また、固定保持部材と可動保持部材に、基板を保持した時に互いに係合して両者の中心に対する位置決めを行うテーパ部をそれぞれ設けることで、基板を固定保持部材と可動保持部材で保持する過程で、互いに係合するテーパ部を介して、両者の中心に対する位置決めを自動的に行うことができる。
【００９８】
更に、固定保持部材の基板を保持した時に前記シール部材でシールされた領域に、固定保持部材と可動保持部材で基板を保持した時に自由端部が該基板の外周よりも内側に位置し、固定保持部材と可動保持部材での基板の保持を解いた時に自由端部が基板の外周よりも外側に位置するばね性を有する板ばね部材を設けることで、めっき終了後、可動保持部材を移動させ基板の保持を解いて、基板を基板ホルダから取出す際に、基板がシール部材にひっついたまま該シール部材と一緒に移動して、最悪の場合には基板の脱落に繋がってしまうことを防止することができる。
【図面の簡単な説明】
【図１】本発明の実施の形態の基板ホルダを備えためっき装置の全体配置図である。
【図２】基板ホルダの一部を省略した平面図である。
【図３】基板ホルダの縦断正面図である。
【図４】基板ホルダの右側面図である。
【図５】基板ホルダにおける導電体と電気接点を示す断面図で、（ａ）は基板保持前、（ｂ）は基板保持後の状態を示す。
【図６】基板ホルダにおける固定保持部材と可動保持部材のテーパ部を示す断面図で、（ａ）は基板保持前、（ｂ）は基板保持後の状態を示す。
【図７】基板ホルダにおける板ばね部材と該板ばね部材と係合して該板ばね部材を変形させる部材との関係を工程順に示す断面図である。
【図８】電気接点の他の例を示す断面図で、（ａ）は基板保持前、（ｂ）は基板保持後の状態を示す。
【図９】電気接点と板ばね部材とを兼用した電気接点兼板ばね部材と該電気接点兼板ばね部材と係合して該電気接点兼板ばね部材を変形させる部材との関係を工程順に示す断面図である。
【図１０】基板の位置決めを行う板ばね部材を示す断面図で、（ａ）は基板保持前、（ｂ）は基板保持後の状態を示す。
【図１１】電気接点のそれぞれ異なる例を示す平面図である。
【図１２】基板上にバンプ（突起状電極）を形成する過程を工程順に示す断面図である。
【符号の説明】
１０　カセット
１２　カセットテーブル
１４　アライナ
１６　スピンドライヤ
１８　基板ホルダ
２０　基板着脱部
２２　基板搬送装置
２４　ストッカ
２６　プリウェット槽
２８　プリソーク槽
３０ａ，３０ｂ　水洗槽
３２　ブロー槽
３４　めっき槽
３６　オーバーフロー槽
３８　めっきユニット
４０　基板ホルダ搬送装置
４２，４４　トランスポータ
４６　パドル駆動装置
５４　固定保持部材
５６　ヒンジ
５８　可動保持部材
６０　シール部材
６２　押えリング
６４　スライドプレート
７０　クランパ
７３　突起
８０　支持面
８２　突条部
８２ａ　テーパ部
８８　導電体
９０　支持体
９０ａ　テーパ部
９０ｂ　延出部
９０ｃ　テーパ面
９０ｄ　鉛直面
９２　電気接点
９２ａ　脚部
９２ｂ　接点端部
９６　板ばね部材
９６ａ　延出部（自由端部）
９６ｂ　係合部
１００　電気接点兼板ばね部材
１００ａ　延出部（自由端部）
１００ｂ　係合部
１１０　板ばね部材[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides, for example, a plating apparatus for plating a surface to be plated of a substrate, particularly, a fine wiring groove or hole provided on a surface of a semiconductor wafer or the like, a plating film formed on a resist opening, or a surface of a semiconductor wafer. The present invention relates to a substrate holder used for a plating apparatus or the like for forming a bump (protruding electrode) electrically connected to a package electrode or the like, and a plating apparatus provided with the substrate holder.
[0002]
[Prior art]
For example, in a TAB (Tape Automated Bonding) or a flip chip, gold, copper, solder, or nickel, or a protruding connection in which these are stacked in a multilayer at predetermined positions (electrodes) on the surface of a semiconductor chip on which wiring is formed. 2. Description of the Related Art It is widely practiced to form electrodes (bumps) and electrically connect to electrodes of a package or TAB electrodes via the bumps. As a method for forming the bump, there are various methods such as an electrolytic plating method, a vapor deposition method, a printing method, and a ball bump method. However, with the increase in the number of I / Os and the fine pitch of the semiconductor chip, miniaturization is possible. Electroplating methods, which have relatively stable performance, have come to be used frequently.
[0003]
Here, the electrolytic plating method is a jet type or a cup type in which the surface to be plated of a substrate such as a semiconductor wafer is placed horizontally with the surface to be plated facing downward (face down), and a plating solution is blown up from below to perform plating. The substrate is set up vertically, and the plating solution is roughly divided into a dip type in which a plating solution is poured from below the plating tank and plating is performed while overflowing. The electroplating method using the dip method has the advantages that the bubbles that adversely affect the plating quality are well removed and the footprint is small, so the dimensions of the plating holes are relatively large and It is considered that it is suitable for bump plating which requires time.
[0004]
A conventional dipping type electroplating apparatus has an advantage that air bubbles can be easily removed, and a substrate such as a semiconductor wafer is sealed at its end surface and back surface to expose the surface (plated surface). A substrate holder for detachably holding the substrate is provided, and the substrate holder is immersed in a plating solution together with the substrate to perform plating on the surface of the substrate.
[0005]
Since the substrate holder is used by immersing it in the plating solution, when the substrate is held by this substrate holder, make sure that the outer periphery of the substrate does not enter the plating solution to the back surface (anti-plating surface) side of the substrate. Need to be sealed. Therefore, for example, in a substrate holder in which a substrate is detachably held by a pair of supports (holding members), a seal member is attached to one support, and the seal member is placed and held on the other support. The outer peripheral portion of the substrate is sealed by being pressed against the peripheral portion of the substrate.
[0006]
Here, when plating the substrate held by the substrate holder, it is necessary to electrically connect this substrate to the negative side of the power supply. For this purpose, for example, an electrical contact is provided in a region inside the seal member, which is located in a region sealed by the seal member and electrically connects a wiring extending from the outside and the substrate.
[0007]
The electrical contact includes a metal contact piece formed by forming a metal plate material such as stainless steel into a U-shaped cross section, and a coil spring for urging the metal contact piece toward the substrate. When the substrate is held by the substrate holder in a state in which the outer peripheral portion is hermetically sealed, one leg located on the outer peripheral side of the metal contact comes into contact with the external wiring via the elastic force of the coil spring, and the metal contact Is known in which the other foot located on the inner peripheral side of the substrate contacts the substrate.
[0008]
[Problems to be solved by the invention]
However, in this type of conventional substrate holder, since the metal contact pieces constituting the electric contacts are generally formed of a rigid body, the contacts are likely to be point contacts (per contact) and poor contact is likely to occur. In addition, since the substrate and the metal contact piece are in contact with each other at a position slightly inside the peripheral portion of the substrate, the area which can be effectively used as a pattern formation region of the substrate is reduced.
[0009]
Further, the substrates and members generally have dimensional variations, and the dimensional variations and the positional relationship between the pair of supports and the like position the substrate held by the supports with respect to the seal member attached to the support (centering). In general, it is difficult to provide a special member for positioning the substrate, which leads to an increase in size and complexity of the substrate holder.
[0010]
Further, as described above, the seal member is attached to one support, and the seal member is pressed against the peripheral portion of the substrate placed and held on the other support, thereby sealing the outer peripheral portion of the substrate. When the support with the seal member is opened and the substrate is removed from the substrate holder after plating is completed, the support may open while the substrate is stuck to the seal member and the substrate may fall off. It is necessary to take some measures.
[0011]
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and can increase an area that can be effectively used as a pattern forming region of a substrate, easily perform centering of the substrate, hold the substrate, and easily and reliably take out the substrate. An object of the present invention is to provide a substrate holder and a plating apparatus including the substrate holder.
[0012]
[Means for Solving the Problems]
According to the first aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member so that an outer peripheral end of the substrate is formed. In a substrate holder in which a surrounding area is sealed by the seal member and the substrate is detachably held, a conductor is provided on the fixed holding member, and a substrate is provided on the movable holding member by the movable holding member and the fixed holding member. And a plate spring-shaped electrical contact for electrically connecting to the conductor and energizing the substrate in a region sealed by the seal member when the substrate is held.
[0013]
Thereby, the electric contact is formed in a leaf spring shape, and the electric contact is elastically contacted with the substrate through the elastic force of the electric contact itself, so that the contact failure is reduced. By making the outer peripheral portion of the substrate contact with the substrate, the area which can be effectively used as the pattern formation region of the substrate can be increased.
[0014]
The invention according to claim 2 is characterized in that the electric contact is configured to elastically contact the surface of the substrate when the substrate is held by the fixed holding member and the movable holding member. A substrate holder according to claim 1.
[0015]
The invention according to claim 3 is characterized in that the electric contact is configured to elastically contact an outer peripheral end surface of the substrate when the substrate is held by the fixed holding member and the movable holding member. The substrate holder according to claim 1.
Thus, when the substrate is held by the substrate holder, the substrate is urged inward by the elastic force of the leaf-spring-shaped electric contact, so that the substrate is positioned (centered) with respect to the substrate holder via the electric contact. It can be performed. Moreover, the movable holding member is provided with a seal member and an electric contact, and the electric contact is provided with a function of positioning (centering) the substrate, thereby positioning the substrate with respect to the seal member and the electric contact, and holding the substrate with the substrate holder. Then, the positional relationship between the substrate, the seal member, and the electrical contacts can be kept constant.
[0016]
According to a fourth aspect of the present invention, in the electrical contact, a tip portion of the electrical contact which contacts the substrate is branched into at least two or more, or is juxtaposed at a position adjacent to each other. 4. A substrate holder according to 2 or 3. In this way, by making the electrical contacts and the substrate contact at a plurality of locations, even if dust or the like adheres to some of the contact portions, conduction with the substrate can be achieved at other contact portions.
[0017]
According to a fifth aspect of the present invention, the tip of the two or more branched electrical contacts or the contact portion of the electrical contacts juxtaposed at positions adjacent to each other with the substrate is shifted in the radial direction of the substrate. The substrate holder according to claim 4, wherein: This makes it possible to ensure that at least a part of the electrical contacts make contact with the substrate even if the substrate is slightly displaced.
[0018]
According to a sixth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member, and the movable holding member is pressed toward the fixed holding member to detachably hold the substrate. In the substrate holder, the fixed holding member and the movable holding member are provided with tapered portions that engage with each other when holding the substrate and perform positioning with respect to the center of the two. .
Thereby, even if the positioning of the fixed holding member and the movable holding member is not accurate at a position where they are apart from each other, in the process of holding the substrate with the fixed holding member and the movable holding member, via the tapered portions engaging with each other, Positioning with respect to both centers can be automatically performed.
[0019]
According to a seventh aspect of the present invention, the tapered portion provided on the movable holding member guides the outer peripheral end surface of the substrate when the fixed holding member and the movable holding member hold the substrate, thereby positioning the substrate. The substrate holder according to claim 6, wherein the substrate holder is configured as described above.
Thus, in the process of holding the substrate with the fixed holding member and the movable holding member as described above, positioning is performed with respect to the centers of the two, and the substrate is positioned relative to the substrate holder via the tapered portion provided on the movable holding member. Positioning (centering) can be performed simultaneously.
[0020]
According to an eighth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member so that an outer peripheral end of the substrate is formed. In a substrate holder in which the surrounding area is sealed by the seal member and the substrate is detachably held, a free end portion is held by the fixed holding member when the substrate is held by the fixed holding member and the movable holding member. A leaf spring member having a resilience in which the free end is located outside the outer periphery of the substrate when the holding of the substrate by the fixed holding member and the movable holding member is released. It is a substrate holder characterized by being provided.
[0021]
Thus, after the plating is completed, the movable holding member is moved to release the holding of the substrate, and when the substrate is taken out from the substrate holder, the movement of the substrate is firstly performed at the free end of the leaf spring member located inside the outer periphery of the substrate. By restricting the seal member attached to the movable holding member from the substrate, the substrate is prevented from moving together with the seal member while being stuck to the seal member, and with this movement, By positioning the free end of the leaf spring member outside the outer periphery of the substrate, it is possible to prevent the removal of the substrate from the substrate holder due to the presence of the leaf spring member.
[0022]
According to a ninth aspect of the present invention, the leaf spring member is configured such that a free end portion elastically contacts a surface of the substrate when the substrate is held by the fixed holding member and the movable holding member. 9. The substrate holder according to claim 8, wherein:
[0023]
According to a tenth aspect of the present invention, the leaf spring member is configured such that a free end portion elastically contacts an outer peripheral end surface of the substrate when the substrate is held by the fixed holding member and the movable holding member. 9. The substrate holder according to claim 8, wherein: Accordingly, when the substrate is held by the substrate holder, the substrate is urged inward by the elastic force of the leaf spring member, thereby positioning (centering) the substrate with respect to the substrate holder via the leaf spring member. be able to.
[0024]
The invention according to claim 11 is characterized in that the leaf spring member also serves as an electrical contact for supplying power to the substrate when the substrate is held by the fixed holding member and the movable holding member. Or a substrate holder according to 10. Accordingly, when the substrate is taken out of the substrate holder, it is not necessary to provide a dedicated leaf spring member only for separating the substrate from the seal member, and the structure can be simplified.
[0025]
According to a twelfth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member so that an outer peripheral end of the substrate is formed. In a substrate holder in which the surrounding area is sealed by the seal member to hold the substrate in a detachable manner, the movable holding member includes the movable holding member and the fixed holding member. A substrate holder provided with a leaf spring member having a spring property for positioning the substrate by elastically contacting the outer peripheral end surface of the substrate in a sealed area.
Thus, in the process of holding the substrate by the substrate holder, the substrate is urged inward by the elastic force of the leaf spring member having spring properties, and the positioning of the substrate with respect to the substrate holder via the leaf spring member ( Centering) can be performed. In addition, by providing the movable holding member with the sealing member and the electrical contact, and positioning the substrate via the electrical contact, the positional relationship between the substrate, the sealing member and the electrical contact is always constant when the substrate is held by the substrate holder. It can be made to be.
[0026]
The invention according to claim 13 is characterized in that the movable holding member further includes an electric contact for elastically contacting and supplying power to the substrate when the substrate is held by the movable holding member and the fixed holding member. The substrate holder according to claim 12.
[0027]
According to a fourteenth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member so that an outer peripheral end of the substrate is formed. In a substrate holder in which a surrounding area is sealed by the seal member and the substrate is detachably held, the seal member includes a peripheral portion of the substrate when the substrate is held by the fixed holding member and the movable holding member. And a lip portion that comes into contact with the surface of the fixed holding member, respectively, and is integrally held by a support mounted between the lip portions.
With this, after the plating is completed, the movable holding member is moved to release the holding of the substrate, and when the substrate is taken out from the substrate holder, the sealing portion of the sealing member is prevented from sticking to the substrate and being turned up, and the sealing is performed. The peelability between the member and the substrate can be improved.
[0028]
According to a fifteenth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member so that an outer peripheral end of the substrate is formed. What is claimed is: 1. A substrate holder in which a surrounding area is sealed with said seal member to detachably hold a substrate, wherein said fixed holding member is provided with a conductor, said movable holding member is provided with said movable holding member and said fixed holding member. Using a substrate holder provided with a leaf spring-shaped electrical contact that is electrically connected to the conductor in a region sealed by the sealing member when the substrate is held by the plate member and that supplies electricity to the substrate. Device.
[0029]
According to a sixteenth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member, and the movable holding member is pressed toward the fixed holding member to hold the substrate detachably. A substrate holder, wherein each of the fixed holding member and the movable holding member is provided with a tapered portion that engages with each other when holding the substrate and performs positioning with respect to the center of the two. It is a plating apparatus.
[0030]
The invention according to claim 17 is such that a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member so that an outer peripheral end of the substrate is formed. What is claimed is: 1. A substrate holder in which a surrounding area is sealed by said seal member to detachably hold a substrate, wherein said fixed holding member has a free end when said substrate is held by said fixed holding member and said movable holding member. A leaf spring having a resilient property in which the free end is located outside the outer periphery of the substrate when the portion is located inside the outer periphery of the substrate and the holding of the substrate by the fixed holding member and the movable holding member is released. A plating apparatus characterized by using a substrate holder provided with members.
[0031]
The invention according to claim 18 is such that a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member so that an outer peripheral end of the substrate is formed. What is claimed is: 1. A substrate holder in which a surrounding area is sealed by said seal member and said substrate is detachably held, said seal being held when said movable holding member holds said substrate by said movable holding member and said fixed holding member. A plating apparatus characterized by using a substrate holder provided with a leaf spring member having a spring property for positioning the substrate by elastically contacting the outer peripheral end surface of the substrate in a region sealed by the member.
[0032]
According to a nineteenth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member so that an outer peripheral end of the substrate is formed. A substrate holder in which a surrounding area is sealed with the seal member to hold the substrate in a detachable manner, wherein the seal member holds the substrate when the fixed holding member and the movable holding member hold the substrate. A plating apparatus having a lip portion that contacts a peripheral portion and a surface of the fixed holding member, and using a substrate holder that is integrally held by a support mounted between the lip portions. .
[0033]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows an overall layout of a plating apparatus provided with a substrate holder according to an embodiment of the present invention. As shown in FIG. 1, in this plating apparatus, two cassette tables 12 on which a cassette 10 containing a substrate W such as a semiconductor wafer is mounted, and a position such as an orientation flat or a notch of the substrate W are aligned in a predetermined direction. An aligner 14 and a spin dryer 16 for rotating the substrate W after the plating process at a high speed and drying the substrate W are provided. Further, near this, there is provided a substrate attaching / detaching portion 20 for mounting the substrate holder 18 and attaching / detaching the substrate W to / from the substrate holder 18, and in the center of these units, the substrate W is placed between them. A substrate transfer device 22 including a transfer robot for transferring is provided.
[0034]
Then, in order from the substrate attaching / detaching portion 20, the stocker 24 for storing and temporarily placing the substrate holder 18, the pre-wet bath 26 for immersing the substrate W in pure water, and the seed layer 500 formed on the surface of the substrate W (FIG. Reference) A presoak tank 28 for etching and removing an oxide film on the surface, a first washing tank 30a for washing the surface of the substrate W with pure water, a blow tank 32 for draining the washed substrate W, and a second washing tank 30b. And a plating tank 34 are arranged in this order. The plating tank 34 is configured by housing a plurality of copper plating units 38 inside an overflow tank 36, and each copper plating unit 38 houses one substrate W inside and performs plating such as copper plating. To be applied. In this example, copper plating will be described, but it goes without saying that the same applies to nickel, solder, silver, and even gold plating.
[0035]
Further, there is provided a substrate holder transfer device 40 which is located at a side of each of these devices and which transfers the substrate holder 18 together with the substrate W between the respective devices, for example, adopts a linear motor system. The substrate holder transport device 40 includes a first transporter 42 that transports a substrate W between the substrate attaching / detaching portion 20 and the stocker 24, a stocker 24, a pre-wet tank 26, a pre-soak tank 28, a washing tank 30a, 30b, A second transporter 44 that transports the substrate W between the blow tank 32 and the plating tank 34 is provided. Note that the second transporter 44 may not be provided, and only the first transporter 42 may be provided.
[0036]
A paddle (not shown) serving as a stirring rod for stirring the plating solution, which is located inside each copper plating unit 38, is driven on the opposite side of the overflow holder 36 of the substrate holder transporting device 40. A paddle driving device 46 is provided.
[0037]
The substrate attaching / detaching portion 20 includes a flat mounting plate 52 that is slidable along the rail 50 in the horizontal direction, and the two substrate holders 18 are mounted on the mounting plate 52 in a horizontal state in parallel. After the transfer of the substrate W between the one substrate holder 18 and the substrate transfer device 22, the mounting plate 52 is slid in the horizontal direction, and the transfer between the other substrate holder 18 and the substrate transfer device 22 is performed. The transfer of the substrate W is performed between them.
[0038]
As shown in FIGS. 2 to 7, the substrate holder 18 is, for example, a rectangular flat plate-shaped fixed holding member 54 made of vinyl chloride, and a movable holding member which is attached to the fixed holding member 54 via a hinge 56 so as to be freely opened and closed. 58. In this example, the movable holding member 58 is configured to be openable and closable via the hinge 56. However, for example, the movable holding member 58 is disposed at a position facing the fixed holding member 54, and the movable holding member 58 The member 58 may be advanced toward the fixed holding member 54 to open and close.
The movable holding member 58 has a base portion 58a and a ring-shaped support portion 58b in this example. The movable holding member 58 is made of, for example, vinyl chloride and has a good sliding with a holding ring 62 described below. A ring-shaped seal member (seal ring) 60 having a substantially U-shaped cross section and having one elongated lip portion is opened and attached to the fixed holding member 54 side on the surface of the fixed holding member 54.
[0039]
A holding ring 62 is rotatably supported on the opposite side of the movable holding member 58 from the fixed holding member 54, and a slide plate 64 is attached to an outer peripheral surface of the holding ring 62. The holding ring 62 has excellent corrosion resistance to an oxidizing environment and has sufficient rigidity, for example, is made of titanium.
[0040]
An inverted L-shaped clamper 70 having a protruding portion protruding inward is provided on the fixed holding member 54 at an equal interval along the circumferential direction on the outer side of the slide plate 64. The lower surface of the surface of the slide plate 64 and the lower surface of the inwardly protruding portion of the clamper 70 located so as to cover the surface are tapered surfaces inclined in opposite directions along the rotation direction. Further, at a plurality of places (for example, four places) along the circumferential direction of the surface of the holding ring 62, projections 73 made of, for example, rotating pins screwed into the holding ring 62 are provided, and the projections 73 are hooked by a rotating mechanism. The press ring 62 is rotated integrally with the slide plate 64.
[0041]
Thus, with the movable holding member 58 opened, the substrate W is inserted into the center of the fixed holding member 54, the movable holding member 58 is closed via the hinge 56, and then the holding ring 62 is rotated clockwise. Then, by sliding the slide plate 64 into the protrusion of the clamper 70, the fixed holding member 54 and the movable holding member 58 are tightened and locked to each other via the tapered surface, and the holding ring 62 is rotated counterclockwise. The lock is released by pulling out the slide plate 64 from the protrusion of the inverted L-shaped clamper 70. When the movable holding member 58 is locked in this way, the short lip portion 60a on the inner peripheral surface side of the seal member 60 is on the surface of the substrate W, and the long lip portion 60b on the outer peripheral surface is on the surface of the fixed holding member 54. , And presses the sealing member 60 uniformly so as to securely seal it.
[0042]
At the center of the fixed holding member 54, a ridge 82 is formed to protrude in a ring shape according to the size of the substrate W, the surface of which abuts against the peripheral edge of the substrate W to form a support surface 80 for supporting the substrate W. And a concave portion 84 is provided at a predetermined position along the circumferential direction of the ridge portion 82.
[0043]
As shown in FIGS. 2 and 5, a plurality (eight in the illustrated example) of conductors (electrical contacts) connected to a plurality of wirings extending from external contacts provided on a hand 98 described below are provided in each recess 84. When the substrate W is placed on the support surface 80 of the fixed holding member 54 and the end of the conductor 88 has a spring property on the surface of the fixed holding member 54 on the side of the substrate W. It is designed to be exposed in the state where it was done.
[0044]
On the other hand, a support 90 is attached to the inside of the seal member 60 sandwiched between the pair of lips 60a and 60b, and the leg 92a of the electrical contact 92 is provided at a position facing the conductor 88 of the support 90. It is fixed. The electric contact 92 is formed in a leaf spring shape. That is, the electric contact 92 has a contact end portion 92b that protrudes inward like a leaf spring, and the contact end portion 92b has a spring property by its elastic force and is easily bent. Has become.
[0045]
That is, in this example, as shown in FIG. 11A, the contact end portion 92b is formed in a shape in which a plurality of rectangular strips having a uniform projection length toward the substrate W are arranged in parallel. Have been. The electrical contact 92 is attached to the support body 90 such that the line connecting the tip of each contact end (strip) 92b is slightly inclined with respect to the tangential direction of the substrate W. I have. As a result, as shown in FIG. 11A, each tip of each contact end portion (strip) 92b is placed in a contact area A on the surface of the substrate W with an electric contact indicated by oblique lines in the width direction. At different positions, even if a slight displacement occurs in the substrate W, at least a part of each tip of the contact end portion (strip) 92b contacts the substrate W in the contact area A of the substrate W. It is supposed to.
[0046]
As shown in FIG. 11 (b), a plurality of long electrical contacts 92 are arranged at predetermined intervals along the diametrical direction of the substrate, and each tip end of each contact end 92b has Alternatively, the surface of the substrate W may be brought into contact with a contact area A with an electric contact indicated by oblique lines at a position along the circumferential direction. Thus, even if dust or the like adheres to the contact end portions 92b of some of the electrical contacts 92, conduction with the substrate W can be established at the other electrical contacts 92.
[0047]
Further, as shown in FIG. 11 (c), the tip of each contact end (strip) 92b having a shape in which a plurality of rectangular strips having a uniform projection length toward the substrate W are arranged in parallel. The electrical contacts 92 may be attached to the support body 90 so that the lines connecting the parts are parallel to the tangential direction of the substrate W. Further, as shown in FIG. The projecting length of the contact end portions (strips) 92b of the shape in which the strips are arranged in parallel toward the substrate W may be different. Also according to these, each tip end of each contact end portion (strip) 92b comes into contact with a contact area A on the surface of the substrate W with a hatched electric contact at a different position in the width direction, and the substrate W However, at least a part of each tip of the contact end portion (strip) 92b can be brought into contact with the substrate W in the contact region A of the substrate W even if the position is slightly shifted.
[0048]
Then, when the movable holding member 58 is locked and the substrate W is held by the fixed holding member 54 and the movable holding member 58, as shown in FIG. 5B, the position sealed by the seal member 60, that is, the seal member 60 The exposed portion of the conductor 88 elastically contacts the lower surface of the leg portion 92a of the electric contact 92 via the elastic force of the exposed portion of the conductor 88 in a region sandwiched between the pair of lip portions 60a and 60b. The substrate W is electrically connected, and the substrate W elastically contacts the tip of the contact end 92b of the electric contact 92 via the elastic force of the contact end 92b. Thus, power can be supplied to the substrate W via the electrical contacts 92 while the substrate W is sealed by the seal member 60 and held by the substrate holder 18.
[0049]
As described above, the electric contact 92 is formed in a leaf spring shape, and the tip of the contact end portion 92b of the electric contact 92 is brought into contact with the substrate W through the elastic force of the electric contact 92 itself. And the electrical contact 92 is brought into contact with the substrate W at the outer peripheral portion of the substrate W, so that the area that can be effectively used as the pattern formation region of the substrate W can be increased.
It is preferable that at least the surface of the conductor 88 that is in contact with the electrical contact 92 be covered with, for example, gold or platinum plating.
[0050]
As shown in FIG. 6, a tapered portion 82 a having a spire-shaped tapered surface is provided on a part of the ridge portion 82 of the fixed holding member 54, and the tapered portion 82 a of the inner peripheral surface of the support 90 is provided. At the position opposed to the portion 82a, the tapered surface and the reverse tapered surface of the tapered portion 82a engage with each other when the substrate W is held by the fixed holding member 54 and the movable holding member 58, and the center of the two members 54, 58 And a taper portion 90a for positioning with respect to. That is, as shown in FIG. 6B, when the substrate W is held by the fixed holding member 54 and the movable holding member 58, the tapered portions 82a and 90a guide each other, and the fixed holding of the movable holding member 58 is performed. Positioning with respect to member 54 (or vice versa) is provided.
[0051]
Thus, by providing the tapered portions 82a and 90a that engage with each other on the protrusion 82 of the fixed holding member 54 and the support body 90 of the movable holding member 58, the fixed holding member 54 and the movable holding member 58 are separated from each other. Even if the positioning of the two members 54 and 58 is not accurate, in the process of holding the substrate W with the fixed holding member 54 and the movable holding member 58, the two members 54 and 58 are connected via the tapered portions 82a and 90a engaged with each other. Positioning with respect to the center can be performed automatically.
[0052]
Here, when the substrate W is held by the fixed holding member 54 and the movable holding member 58, the tapered portion 90 a provided on the support body 90 of the movable holding member 58 supports the support surface 80 of the ridge 82 of the fixed holding member 54. The configuration is such that the substrate W is positioned by guiding the outer peripheral end surface of the substrate W supported thereon. That is, as shown in FIG. 6B, when the outer peripheral portion of the substrate W protrudes outward from the support surface 80 of the ridge portion 82, the outer peripheral end surface of the substrate W comes into contact with the tapered portion 90a. The positioning (centering) of the substrate W with respect to the substrate holder and the sealing member 60 is performed.
[0053]
Thus, in the process of holding the substrate W with the fixed holding member 54 and the movable holding member 58 as described above, the positioning of the substrate W with respect to the centers of the two members 54 and 58 is performed, and the substrate W is provided on the support 90 of the movable holding member 58. The positioning (centering) of the substrate W with respect to the substrate holder can be performed simultaneously via the tapered portion 90a.
[0054]
Further, as shown in FIG. 7, a plurality of concave grooves 94 are provided at predetermined positions along the circumferential direction facing the seal member 60 on the surface of the fixed holding member 54. In addition, a leaf spring member 96 extending upward is fixedly disposed at its lower end. The leaf spring member 96 has resilience by fixing its lower end to make the upper part free, and has a resilient extension part (free end) which extends upward and inclines outward. An engagement portion 96b rounded in an arc is provided at the tip of the portion 96a.
[0055]
On the other hand, on the inner peripheral surface of the movable holding member 58 that faces the leaf spring member 96 of the support body 90, a tapered surface 90c that is inclined inward upward and rises in the vertical direction continuously from the tapered surface 90c. A guide surface composed of a vertical surface 90d is formed.
[0056]
Thereby, as shown in FIGS. 7A to 7B, the lower end of the movable holding member 58 causes the distal end engaging portion 96b of the leaf spring member 96 to contact the tapered surface 90c of the support body 90. The leaf spring member 96 is bent inward by being guided by the tapered surface 90c. Then, when the movable holding member 58 is further lowered, as shown in FIG. 7C, the distal end engaging portion 96b of the leaf spring member 96 is positioned inside the vertical plane 90d of the support body 90, and the extending portion 96a Are vertical, and the leaf spring member 96 does not bend further inward, but the engaging portion 96b of the leaf spring member 96 has an outer peripheral portion of the substrate W supported on the support surface 80 of the fixed holding member 54. It is located at a position covering the upper side. When the movable holding member 58 is further lowered, the short lip portion 60a on the inner peripheral surface side of the seal member 60 is on the surface of the substrate W, and the long lip portion 60b on the outer peripheral surface is on the surface of the fixed holding member 54, respectively. The sealing member 60 is pressed in a uniform manner, and the sealing member 60 is uniformly pressed to securely seal the sealing member 60. In this state, processing of the substrate such as plating is performed.
[0057]
When a series of processing is completed and the substrate W held by the substrate holder is taken out, the movable holding member 58 is raised. At this time, first, as shown in FIG. Since the distal end engaging portion 96b of the 96 is located inside the vertical plane 90d of the support body 90, the movement of the leaf spring member 96 is restricted. For this reason, even if the substrate W is stuck to the seal member 60, the distal end engaging portion 96b of the leaf spring member 96 abuts on the upper surface of the outer peripheral portion of the substrate W to regulate this rise, and the seal member 60 and the movable holding member The member 58 and the support 90 move upward to forcibly separate the substrate W from the seal member 60. When the movable holding member 58 further rises, the leaf spring member 96 gradually expands outward by its elastic force while the distal end engaging portion 96b abuts on the tapered surface 90c of the support body 90, and FIG. Return to the original state as shown in f). At this time, the engaging portion 96b of the leaf spring member 96 is located outside the outer peripheral portion of the substrate W supported on the support surface 80 of the fixed holding member 54. Thus, the leaf spring member 96 does not hinder removal of the substrate W after processing or mounting of the substrate before processing.
[0058]
Thereby, after the plating is completed, the movable holding member 58 is moved to release the holding of the substrate W, and when the substrate W is taken out from the substrate holder, the substrate W moves together with the sealing member 60 while being stuck to the sealing member 60. By moving the free end of the leaf spring member 96 outside the outer periphery of the substrate with this movement, the presence of the leaf spring member 96 allows the substrate W to be removed from the substrate holder of the substrate W. Can be prevented from being obstructed.
[0059]
As described above, the sealing member 60 has the lip portions 60a and 60b that come into contact with the peripheral portion of the substrate W and the surface of the fixed holding member 58 when the substrate W is held by the fixed holding member 54 and the movable holding member 58, respectively. And is integrally held by a support 90 mounted between the lip portions 60a and 60b. That is, in the seal member 60, the flat portion connecting the lip portions 60a and 60b is sandwiched between the support portion 58a of the movable holding member 58 and the support body 90, and the support portion 58a of the movable holding member 58 and the support body 90 are bolted 91 ( (See FIG. 6). Further, a seal member 93 is interposed between the support portion 58a of the movable holding member 58 and the upper surface of the seal member 60, so that the seal member 93 is securely sealed.
[0060]
As described above, by holding the seal member 60 integrally with the support body 90, after the plating is completed, the movable holding member 58 is moved to release the holding of the substrate W, and when the substrate W is taken out from the substrate holder 18, To prevent the lip portion (seal portion) 60a of the seal member 60 from being attached to the substrate W and being rolled up from the support portion 58b of the fixed holding member 58, thereby improving the peelability between the seal member 60 and the substrate W. Can be.
[0061]
The movable holding member 58 is opened and closed by the weight of a cylinder (not shown) and the movable holding member 58. That is, the fixed holding member 54 is provided with a through hole 54a, and a cylinder is provided at a position facing the through hole 54a when the substrate holder 18 is mounted on the mounting plate 52. Thus, the cylinder rod is extended, the movable holding member 58 is opened by pushing up the base 58a of the movable holding member 58 upward with a pressing rod through the through-hole 54a, and the movable rod 58 is contracted by contracting the cylinder rod. It is designed to close under its own weight.
[0062]
In this example, the movable holding member 58 is locked / unlocked by rotating the press ring 62. This lock / unlock mechanism is provided on the ceiling side. That is, when the substrate holder 18 is mounted on the mounting plate 52, the lock / unlock mechanism is positioned at a position corresponding to each projection 73 of the holding ring 62 of the substrate holder 18 located at the center side. The holding plate 52 is lifted, and the holding ring 62 is rotated by rotating the holding member around the axis of the holding ring 62 in a state where the mounting plate 52 is held by the holding member. Have been. This lock / unlock mechanism is provided, locks (or unlocks) one of the two substrate holders 18 placed on the mounting plate 52, and then slides the mounting plate 52 in the horizontal direction. Thus, the other substrate holder 18 is locked (or unlocked).
[0063]
The substrate holder 18 is provided with a sensor for confirming a contact state between the substrate W and the contact when the substrate W is mounted, and a signal from this sensor is input to a controller (not shown). Has become.
[0064]
A pair of substantially T-shaped hands 98 serving as support portions for transporting and suspending and supporting the substrate holder 18 are connected to an end of the fixed holding member 54 of the substrate holder 18. Then, in the stocker 24, the protruding end of the hand 98 is hooked on the upper surface of the peripheral wall so as to be vertically suspended and held, and the hand 98 of the suspended and held substrate holder 18 is moved to the substrate holder transport device 40. The substrate holder 18 is transported while being held by the transporter 42. In the pre-wet tank 26, the pre-soak tank 28, the rinsing tanks 30a and 30b, the blow tank 32, and the plating tank 34, the substrate holder 18 is also suspended from and held by the peripheral walls thereof via the hand 98.
[0065]
A series of bump plating processes performed by the plating apparatus configured as described above will be described. First, as shown in FIG. 12A, a seed layer 500 as a power supply layer is formed on the surface, and a resist 502 having a height H of, for example, 20 to 120 μm is applied to the entire surface of the seed layer 500. Thereafter, a substrate provided with an opening 502a having a diameter D of, for example, about 20 to 200 μm at a predetermined position of the resist 502 is accommodated in the cassette 10 with its surface (plated surface) facing upward. Is mounted on the cassette table 12.
[0066]
One substrate is taken out from the cassette 10 mounted on the cassette table 12 by the substrate transfer device 22, placed on the aligner 14, and the orientation of the orientation flat or notch is adjusted in a predetermined direction. The substrate aligned by the aligner 14 is transported to the substrate attaching / detaching portion 20 by the substrate transporting device 22.
[0067]
In the substrate attaching / detaching section 20, two substrate holders 18 accommodated in the stocker 24 are simultaneously held by the transporters 42 of the substrate holder transporting device 40, and are transported to the substrate attaching / detaching section 20. Then, the substrate holder 18 is lowered in a horizontal state, whereby the two substrate holders 18 are simultaneously mounted on the mounting plate 52 of the substrate attaching / detaching portion 20, and the cylinder is operated to move the substrate holder 18. The holding member 58 is kept open.
[0068]
In this state, the substrate transferred by the substrate transfer device 22 is inserted into the substrate holder 18 located on the center side, the cylinder is reversely operated to close the movable holding member 58, and then the movable holding member 58 is locked and unlocked by the lock / unlock mechanism. Lock 58. After the mounting of the substrate on one of the substrate holders 18 is completed, the mounting plate 52 is slid in the lateral direction, and the substrate is mounted on the other substrate holder 18 in the same manner. Return 52 to its original position.
[0069]
Accordingly, the substrate W is sealed by the sealing member 60 so that the plating solution does not enter, and the plating solution is not touched by the seal while the surface on which the plating process is performed is exposed from the opening of the substrate holder 18. The portion is fixed so as to be electrically connected to the plurality of contacts. Here, wiring is connected from the contact to the hand 98 of the substrate holder 18, and power can be supplied to the seed layer 500 of the substrate by connecting a power source to the hand 98.
[0070]
Next, the two substrate holders 18 on which the substrates W are mounted are simultaneously held by the transporters 42 of the substrate holder transport device 40 and transported to the stocker 24. Then, the substrate holder 18 is lowered in a vertical state, whereby the two substrate holders 18 are suspended and held (temporarily placed) on the stocker 24.
[0071]
In the substrate transporter 22, the substrate attaching / detaching unit 20, and the transporter 42 of the substrate holder transporter 40, the above-described operation is sequentially repeated, and the substrates are sequentially mounted on the substrate holders 18 accommodated in the stocker 24. At a predetermined position (temporary placement).
Note that a sensor provided on the substrate holder 18 for checking the contact state between the substrate and the contact. If the contact state is determined to be defective, a signal is input to a controller (not shown).
[0072]
On the other hand, in the other transporter 44 of the substrate holder transport device 40, the two substrate holders 18 on which the substrates are mounted and temporarily placed on the stocker 24 are simultaneously grasped, transported to the pre-wet tank 26 and lowered. Thereby, the two substrate holders 18 are put into the pre-wet bath 26.
[0073]
At this time, the sensor for checking the contact state between the substrate and the contact provided on the substrate holder 18, and the substrate holder 18 containing the substrate determined to have a bad contact state is temporarily placed in the stocker 24. And leave. Thus, even if a contact failure occurs between the substrate and the contact when the substrate is mounted on the substrate holder 18, the plating operation can be continued without stopping the apparatus. The substrate having the poor contact is not subjected to the plating treatment. In this case, it is possible to cope with this by removing the unplated substrate from the cassette after returning the cassette.
[0074]
Next, the substrate holder 18 on which the substrate is mounted is transferred to the presoak tank 28 in the same manner as described above, and the oxide film is etched in the presoak tank 28 to expose a clean metal surface. Further, the substrate holder 18 on which the substrate is mounted is transported to the washing tank 30a in the same manner as described above, and the surface of the substrate is washed with pure water in the washing tank 30a.
[0075]
The substrate holder 18 on which the rinsed substrate is mounted is transported to the plating bath 34 filled with the plating solution and suspended and held by the plating unit 38 in the same manner as described above. The transporter 44 of the substrate holder transport device 40 sequentially repeats the above-described operations, sequentially transports the substrate holders 18 on which the substrates are mounted to the plating unit 38 of the plating tank 34, and suspends the substrate holders 18 at predetermined positions.
[0076]
After the suspension of all the substrate holders 18 is completed, the plating solution in the overflow tank 36 is circulated, and the plating voltage is applied between the anode (not shown) in the plating tank 34 and the substrate W while overflowing. Is applied, and at the same time, the paddle is reciprocated by the paddle driving device 46 in parallel with the surface of the substrate, thereby plating the surface of the substrate. At this time, the substrate holder 18 is suspended and fixed by a hand 98 above the plating unit 38, and power is supplied from a plating power supply to the seed layer 500 (see FIG. 12) through the conductors 88 and the electrical contacts 92.
[0077]
After the plating is completed, the application of the plating power supply, the supply of the plating solution, and the reciprocating motion of the paddle are stopped. In the same manner as described above, the substrate is conveyed to the washing tank 30b, and is immersed in pure water in the washing tank 30b to wash the surface of the substrate with pure water. Next, the substrate holder 18 on which the substrate W is mounted is transported to the blow tank 32 in the same manner as described above, where water droplets attached to the substrate holder 18 are removed by blowing air. Thereafter, the substrate holder 18 on which the substrate W is mounted is returned to a predetermined position of the stocker 24 and suspended and held in the same manner as described above.
[0078]
The transporter 44 of the substrate holder transport device 40 sequentially repeats the above operation, and returns the substrate holder 18 on which the plated substrate is mounted to the predetermined position of the stocker 24 in sequence, and suspends and holds the substrate holder 18.
[0079]
On the other hand, in the other transporter 42 of the substrate holder transport device 40, the two substrate holders 18 having the plated substrates W mounted thereon and returned to the stocker 24 are simultaneously grasped, and the substrate is removed and attached in the same manner as described above. It is mounted on the mounting plate 52 of the unit 20. At this time, the sensor provided on the substrate holder 18 for checking the contact state between the substrate and the contact point is mounted on the substrate holder 18 which is determined to have a bad contact state and is temporarily placed in the stocker 24. At the same time, they are transported and placed on the placement plate 52.
[0080]
Then, the lock of the movable holding member 58 of the substrate holder 18 located at the center side is released via the lock / unlock mechanism, and the movable holding member 58 is opened by operating the cylinder. At this time, as described above, the movable holding member 58 is prevented from being opened while the substrate W is attached to the movable holding member 58. In this state, the substrate W after the plating process in the substrate holder 18 is taken out by the substrate transport device 22 and transported to the spin dryer 16, and the spin-dried (water drained) substrate is rotated by the high speed rotation of the spin dryer 16. To return to the cassette 10.
[0081]
Then, after the substrate mounted on one substrate holder 18 was returned to the cassette 10 or in parallel with this, the mounting plate 52 was slid in the horizontal direction, and similarly mounted on the other substrate holder 18. The substrate is spin-dried and returned to the cassette 10.
[0082]
After the mounting plate 52 is returned to the original state, the two substrate holders 18 from which the substrates have been taken out are simultaneously held by the transporters 42 of the substrate holder transporting device 40, and in the same manner as described above, this is Return to place. Thereafter, the two substrate holders 18 on which the plated substrates have been mounted and returned to the stocker 24 are simultaneously held by the substrate holder transport device 40, and placed on the mounting plate 52 of the substrate attaching / detaching portion 20 in the same manner as described above. Place it and repeat the same operation as above.
[0083]
Then, all the substrates are taken out from the substrate holder 18 having the plated substrate mounted thereon and returned to the stocker 24, spin-dried and returned to the cassette 10 to complete the operation. As a result, as shown in FIG. 12B, a substrate W is obtained in which the plating film 504 is grown in the opening 502a provided in the resist 502.
[0084]
Next, the substrate W spin-dried as described above is immersed in a solvent such as acetone at a temperature of, for example, 50 to 60 ° C., and the resist 502 on the substrate W is peeled off as shown in FIG. Remove. Then, as shown in FIG. 12D, the unnecessary seed layer 500 exposed to the outside after plating is removed, and a bump 504 is formed.
[0085]
In this example, a stocker 24 for vertically storing the substrate holder 18 is disposed between the substrate attaching / detaching portion 20 and the copper plating unit 38, and the substrate holder 18 between the substrate attaching / detaching portion 20 and the stocker 24 is disposed. The first transporter 42 of the substrate holder transport device 40 transports the substrate holder 18 between the stocker 24 and the copper plating unit 38 by the second transporter 44, so that the transport when not in use is performed. The substrate holder 18 is stored in the stocker 24, and the transfer of the substrate holder 18 before and after sandwiching the stocker 24 is performed smoothly to improve the throughput. Needless to say, all transports may be performed by one transporter.
[0086]
In addition, a robot having a dry hand and a wet hand is used as the substrate transfer device 22, a wet hand is used only when the substrate after plating is taken out from the substrate holder 18, and a dry hand is used in other cases. The back surface of the substrate is kept out of contact with the plating solution by the seal of the substrate holder 18, and in principle, it is not always necessary to use a wet hand. Plating solution contamination due to wraparound or poor sealing occurs, and this contamination can be prevented from contaminating the back surface of a new substrate.
[0087]
In the above example, an example is shown in which the tip of the contact end portion 92b is elastically contacted with the surface of the substrate W supported on the support surface 80 of the fixed holding member 54 as the electrical contact 92. However, as shown in FIG. 8, when the substrate W is held by the fixed holding member 54 and the movable holding member 58, the contact end 92b of the electric contact 92 is supported on the support surface 80 of the fixed holding member 54. The electrical contact 92 may be configured to elastically contact the outer peripheral surface of the substrate W so that the electrical contact 92 also serves as a leaf spring member for positioning the substrate.
[0088]
Accordingly, when the substrate W is held by the substrate holder, the substrate W is urged inward by the elastic force of the electrical contact 92 in the form of a leaf spring. The positioning (centering) of the substrate W with respect to the substrate holder 18 can be performed. In addition, by providing the movable holding member 58 with the sealing member 60 and the electric contacts 92 and positioning the substrate W with respect to the substrate holder 18 via the electric contacts 92, the substrate W is held when the substrate W is held by the substrate holder 18. , The positional relationship between the sealing member 60 and the electrical contact 92 can be kept constant.
[0089]
As shown in FIG. 9, the electric contact and leaf spring member 100, which also serves as the above-mentioned electric contact 92 and the above-mentioned leaf spring member 96, is attached to the sealing member 60 on the surface of the fixed holding member 54. May be provided in the concave portion 102 provided at a predetermined position along the circumferential direction facing the same.
[0090]
The difference between the operation of the electric contact / leaf spring member 100 and the operation of the above-described leaf spring member 96 is that, as shown in FIG. Is located inside the vertical plane 90d, the extension 100a is vertical, and the electric contact / leaf spring member 100 is not bent further inward. As shown in FIG. 9 (d), when the substrate W is released from the electrical contact, the power is supplied to the substrate W by contacting the outer peripheral portion of the substrate W supported on the support surface 80 of the fixed holding member 54. The point is that the distal end engaging portion 100b of the double leaf spring member 100 is kept in contact with the outer peripheral portion of the substrate W, whereby only the seal member 60 is raised to forcibly separate the substrate W. Other operations are basically the same as those of the leaf spring member 96 shown in FIG.
[0091]
As described above, by providing the electrical contact and leaf spring member 100 that also serves as the electrical contact 92 and the leaf spring member 96, the substrate W is sealed by the sealing member when the substrate W is released from the substrate holder. The structure can be simplified by eliminating the need to provide a dedicated leaf spring member only for the purpose of separating the member from the main body.
[0092]
Although not shown, similarly to the above, when the substrate W is held by the fixed holding member 54 and the movable holding member 58, the distal end engaging portion 100b of the electric contact / leaf spring member 100 is brought into contact with the support surface of the fixed holding member 54. When the substrate W is held by the substrate holder, the elastic force of the leaf spring-shaped electric contact / leaf spring member 100 is applied when the substrate W is held by the substrate holder. By biasing the substrate W inward, positioning (centering) of the substrate W with respect to the substrate holder may be performed via the electric contact / leaf spring member 100.
[0093]
Further, as shown in FIG. 10, when the substrate W is held by the movable holding member 58 and the fixed holding member 54, a leaf spring having a spring property for elastically contacting the outer peripheral end surface of the substrate W and positioning the substrate W is provided. The member 110 may be provided on the support 90 separately from the electrical contact 92. The leaf spring member 110 is disposed, for example, at a position sandwiched between the electrical contacts 92 shown in FIG.
[0094]
Accordingly, in the process of holding the substrate W by the substrate holder 18, the substrate W is urged inward by the elastic force of the leaf spring member 110 having a spring property, so that the substrate W (Centering) with respect to the substrate holder 18 can be performed. Moreover, the movable holding member 58 is provided with the seal member 60, the electrical contacts 92, and the leaf spring member 110 for positioning the substrate, and the substrate W is positioned via the leaf spring member 110, whereby the substrate W , The positional relationship between the substrate W, the sealing member 60 and the electrical contact 92 can be always kept constant via the leaf spring member 110.
[0095]
As described above, according to this plating apparatus, by setting the cassette containing the substrate on the cassette table and starting the apparatus, the electroplating employing the dipping method is performed fully automatically, and the plating is performed on the surface of the substrate. A metal plating film suitable for a bump or the like can be formed automatically.
[0096]
【The invention's effect】
As described above, according to the present invention, the electric contact is formed in a leaf spring shape, and the electric contact comes into contact with the substrate through the elastic force of the electric contact itself, thereby reducing the contact failure. In addition, the area that can be effectively used as a pattern formation region of the substrate can be increased by making the electrical contact contact the substrate at the outer peripheral portion of the substrate.
[0097]
Further, by providing the fixed holding member and the movable holding member with tapered portions that engage with each other when holding the substrate and perform positioning with respect to the center of the both, in the process of holding the substrate with the fixed holding member and the movable holding member. Positioning with respect to the centers of the two can be automatically performed via the tapered portions that engage with each other.
[0098]
Furthermore, when the substrate of the fixed holding member is held by the seal member in the region sealed by the seal member, the free end is located inside the outer periphery of the substrate when the substrate is held by the fixed holding member and the movable holding member, When the holding of the substrate by the holding member and the movable holding member is released, by providing a leaf spring member having a spring property whose free end is located outside the outer periphery of the substrate, the movable holding member is moved after plating is completed. When releasing the holding of the substrate and removing the substrate from the substrate holder, the substrate moves together with the sealing member while being stuck to the sealing member, and in the worst case, prevents the substrate from falling off. be able to.
[Brief description of the drawings]
FIG. 1 is an overall layout view of a plating apparatus including a substrate holder according to an embodiment of the present invention.
FIG. 2 is a plan view in which a part of a substrate holder is omitted.
FIG. 3 is a vertical sectional front view of a substrate holder.
FIG. 4 is a right side view of the substrate holder.
5A and 5B are cross-sectional views showing conductors and electrical contacts in a substrate holder, wherein FIG. 5A shows a state before holding the substrate, and FIG. 5B shows a state after holding the substrate.
6A and 6B are cross-sectional views showing tapered portions of a fixed holding member and a movable holding member in a substrate holder, wherein FIG. 6A shows a state before holding the substrate, and FIG. 6B shows a state after holding the substrate.
FIG. 7 is a cross-sectional view illustrating a relationship between a leaf spring member and a member that engages with the leaf spring member and deforms the leaf spring member in the substrate holder in the order of steps.
8A and 8B are cross-sectional views showing another example of the electric contact, in which FIG. 8A shows a state before holding the substrate, and FIG. 8B shows a state after holding the substrate.
FIG. 9 shows the relationship between an electric contact / leaf spring member serving both as an electric contact and a leaf spring member and a member engaging with the electric contact / leaf spring member to deform the electric contact / leaf spring member in the order of steps. FIG.
10A and 10B are cross-sectional views showing a leaf spring member for positioning a substrate, wherein FIG. 10A shows a state before holding the substrate, and FIG. 10B shows a state after holding the substrate.
FIG. 11 is a plan view showing different examples of electric contacts.
FIG. 12 is a cross-sectional view showing a process of forming a bump (protruding electrode) on a substrate in the order of steps.
[Explanation of symbols]
10 cassettes
12 cassette table
14 Aligner
16 Spin dryer
18 Substrate holder
20 Board detachable part
22 Substrate transfer device
24 Stocker
26 Pre-wet tank
28 presoak tank
30a, 30b Rinse tank
32 blow tank
34 Plating tank
36 Overflow tank
38 Plating unit
40 Substrate holder transfer device
42,44 Transporter
46 paddle drive
54 Fixed holding member
56 Hinge
58 Movable holding member
60 Sealing member
62 Presser ring
64 slide plate
70 Clamper
73 Projection
80 Support surface
82 ridge
82a taper part
88 conductor
90 Support
90a taper part
90b extension
90c taper surface
90d vertical surface
92 electrical contacts
92a leg
92b Contact end
96 leaf spring member
96a Extension (free end)
96b engaging part
100 Electric contact and leaf spring member
100a Extension (free end)
100b engaging part
110 leaf spring member

Claims (19)

固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダにおいて、
前記固定保持部材に導電体を、前記可動保持部材に該可動保持部材と前記固定保持部材で基板を保持した時に前記シール部材でシールされた領域内で前記導電体と電気的に接続して基板に通電する板ばね形状の電気接点をそれぞれ設けたことを特徴とする基板ホルダ。A substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to seal a region surrounding an outer peripheral end of the substrate with the seal member. In the substrate holder, which holds the substrate detachably by
A substrate electrically connected to the conductor in the region sealed by the seal member when the substrate is held by the movable holding member and the fixed holding member on the movable holding member; A board holder characterized by having leaf spring-shaped electrical contacts for supplying current to the substrate holder. 前記電気接点は、前記固定保持部材と前記可動保持部材で基板を保持した時に該基板の表面に弾性的に接触するように構成されていることを特徴とする請求項１記載の基板ホルダ。2. The substrate holder according to claim 1, wherein the electric contact is configured to elastically contact a surface of the substrate when the substrate is held by the fixed holding member and the movable holding member. 前記電気接点は、前記固定保持部材と前記可動保持部材で基板を保持した時に該基板の外周端面に弾性的に接触するように構成されていることを特徴とする請求項１記載の基板ホルダ。2. The substrate holder according to claim 1, wherein the electrical contact is configured to elastically contact an outer peripheral end surface of the substrate when the substrate is held by the fixed holding member and the movable holding member. 前記電気接点は、その基板に接触する先端部が、少なくとも２つ以上に分岐するか、または互いに隣接した位置に並設されていることを特徴とする請求項２または３記載の基板ホルダ。4. The substrate holder according to claim 2, wherein the electrical contact has a distal end portion that contacts the substrate, and is branched into at least two or arranged adjacent to each other. 5. 前記２つ以上に分岐した電気接点の先端部または互いに隣接した位置に並設された電気接点の基板への接触部分が、基板の半径方向にずれていることを特徴とする請求項４記載の基板ホルダ。5. The contact portion of the electrical contact, which is arranged in parallel at a tip end portion of the two or more branched electrical contacts or adjacent to each other with the substrate, is shifted in a radial direction of the substrate. 6. Substrate holder. 固定保持部材と可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を着脱自在に保持するようにした基板ホルダにおいて、
前記固定保持部材と前記可動保持部材には、基板を保持した時に互いに係合して両者の中心に対する位置決めを行うテーパ部がそれぞれ設けられていることを特徴とする基板ホルダ。A substrate holder in which a substrate is interposed between a fixed holding member and a movable holding member, and the movable holding member is pressed toward the fixed holding member so as to detachably hold the substrate.
The substrate holder, wherein the fixed holding member and the movable holding member are provided with tapered portions that engage with each other when holding the substrate and perform positioning with respect to the center of the two. 前記可動保持部材に設けられたテーパ部は、前記固定保持部材と前記可動保持部材で基板を保持する時に該基板の外周端面を案内して基板の位置決めを行うように構成されていることを特徴とする請求項６記載の基板ホルダ。The tapered portion provided on the movable holding member is configured to guide the outer peripheral end surface of the substrate when the substrate is held by the fixed holding member and the movable holding member, thereby positioning the substrate. The substrate holder according to claim 6, wherein 固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダにおいて、
前記固定保持部材に、該固定保持部材と前記可動保持部材で基板を保持した時に自由端部が該基板の外周よりも内側に位置し、前記固定保持部材と前記可動保持部材での基板の保持を解いた時に自由端部が基板の外周よりも外側に位置するばね性を有する板ばね部材を設けたことを特徴とする基板ホルダ。A substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to seal a region surrounding an outer peripheral end of the substrate with the seal member. In the substrate holder, which holds the substrate detachably by
When the substrate is held by the fixed holding member and the movable holding member on the fixed holding member, a free end is located inside the outer periphery of the substrate, and the substrate is held by the fixed holding member and the movable holding member. A substrate holder provided with a leaf spring member having a resilient property in which a free end is located outside the outer periphery of the substrate when the above is released. 前記板ばね部材は、前記固定保持部材と前記可動保持部材で基板を保持した時に自由端部が該基板の表面に弾性的に接触するように構成されていることを特徴とする請求項８記載の基板ホルダ。9. The leaf spring member according to claim 8, wherein a free end portion elastically contacts a surface of the substrate when the substrate is held by the fixed holding member and the movable holding member. Substrate holder. 前記板ばね部材は、前記固定保持部材と前記可動保持部材で基板を保持した時に自由端部が該基板の外周端面に弾性的に接触するように構成されていることを特徴とする請求項８記載の基板ホルダ。9. The leaf spring member according to claim 8, wherein a free end elastically contacts an outer peripheral end surface of the substrate when the substrate is held by the fixed holding member and the movable holding member. The described substrate holder. 前記板ばね部材は、前記固定保持部材と前記可動保持部材で基板を保持した時に該基板に給電する電気接点を兼用していることを特徴とする請求項９または１０記載の基板ホルダ。The substrate holder according to claim 9, wherein the leaf spring member also serves as an electrical contact for supplying power to the substrate when the substrate is held by the fixed holding member and the movable holding member. 固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダにおいて、
前記可動保持部材に、該可動保持部材と前記固定保持部材で基板を保持した時に前記シール部材でシールされた領域内で基板の外周端面と弾性的に接触して該基板の位置決めを行うばね性を有する板ばね部材を設けたことを特徴とする基板ホルダ。A substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to seal a region surrounding an outer peripheral end of the substrate with the seal member. In the substrate holder, which holds the substrate detachably by
When the movable holding member holds the substrate with the movable holding member and the fixed holding member, the movable holding member elastically contacts the outer peripheral end surface of the substrate within a region sealed by the seal member to perform positioning of the substrate. A substrate holder provided with a leaf spring member having: 前記可動保持部材は、該可動保持部材と前記固定保持部材で基板を保持した時に該基板に弾性的に接触して給電する電気接点を更に有することを特徴とする請求項１２記載の基板ホルダ。13. The substrate holder according to claim 12, wherein the movable holding member further includes an electric contact for elastically contacting and supplying power to the substrate when the substrate is held by the movable holding member and the fixed holding member. 固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダにおいて、
前記シール部材は、前記固定保持部材と前記可動保持部材で基板を保持した時に該基板の周縁部と前記固定保持部材の表面にそれぞれ接触するリップ部を有し、該リップ部の間に装着した支持体に一体的に保持されていることを特徴とする基板ホルダ。A substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to seal a region surrounding an outer peripheral end of the substrate with the seal member. In the substrate holder, which holds the substrate detachably by
The sealing member has a lip portion that comes into contact with a peripheral portion of the substrate and a surface of the fixed holding member when the substrate is held by the fixed holding member and the movable holding member, and is mounted between the lip portions. A substrate holder which is integrally held by a support. 固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダであって、
前記固定保持部材に導電体を、前記可動保持部材に該可動保持部材と前記固定保持部材で基板を保持した時に前記シール部材でシールされた領域内で前記導電体と電気的に接続して基板に通電する板ばね形状の電気接点をそれぞれ設けた基板ホルダを用いることを特徴とするめっき装置。A substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to seal a region surrounding an outer peripheral end of the substrate with the seal member. A substrate holder that detachably holds the substrate.
A substrate electrically connected to the conductor in the region sealed by the seal member when the substrate is held by the movable holding member and the fixed holding member on the movable holding member; A plating apparatus characterized by using a substrate holder provided with a leaf spring-shaped electric contact for energizing a plate. 固定保持部材と可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を着脱自在に保持するようにした基板ホルダであって、
前記固定保持部材と前記可動保持部材には、基板を保持した時に互いに係合して両者の中心に対する位置決めを行うテーパ部がそれぞれ設けられている基板ホルダを用いることを特徴とするめっき装置。A substrate holder having a substrate interposed between a fixed holding member and a movable holding member, and pressing the movable holding member toward the fixed holding member so as to detachably hold the substrate,
A plating apparatus, wherein the fixed holding member and the movable holding member use substrate holders each provided with a tapered portion that engages with each other when holding the substrate and performs positioning with respect to the center of the two. 固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダであって、
前記固定保持部材に、該固定保持部材と前記可動保持部材で基板を保持した時に自由端部が該基板の外周よりも内側に位置し、前記固定保持部材と前記可動保持部材での基板の保持を解いた時に自由端部が基板の外周よりも外側に位置するばね性を有する板ばね部材を設けた基板ホルダを用いることを特徴とするめっき装置。A substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to seal a region surrounding an outer peripheral end of the substrate with the seal member. A substrate holder that detachably holds the substrate.
When the substrate is held by the fixed holding member and the movable holding member on the fixed holding member, a free end is located inside the outer periphery of the substrate, and the substrate is held by the fixed holding member and the movable holding member. A plating apparatus using a substrate holder provided with a leaf spring member having a spring property, the free end of which is located outside the outer periphery of the substrate when solving the above. 固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダであって、
前記可動保持部材に、該可動保持部材と前記固定保持部材で基板を保持した時に前記シール部材でシールされた領域内で基板の外周端面と弾性的に接触して該基板の位置決めを行うばね性を有する板ばね部材を設けた基板ホルダを用いることを特徴とするめっき装置。A substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to seal a region surrounding an outer peripheral end of the substrate with the seal member. A substrate holder that detachably holds the substrate.
When the movable holding member holds the substrate with the movable holding member and the fixed holding member, the movable holding member elastically contacts the outer peripheral end surface of the substrate within a region sealed by the seal member to perform positioning of the substrate. A plating apparatus using a substrate holder provided with a leaf spring member having the following. 固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧し基板の外周端部を包囲する領域を前記シール部材でシールして基板を着脱自在に保持するようにした基板ホルダであって、
前記シール部材は、前記固定保持部材と前記可動保持部材で基板を保持した時に該基板の周縁部と前記固定保持部材の表面にそれぞれ接触するリップ部を有し、該リップ部の間に装着した支持体に一体的に保持されている基板ホルダを用いることを特徴とするめっき装置。A substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to seal a region surrounding an outer peripheral end of the substrate with the seal member. A substrate holder that detachably holds the substrate.
The sealing member has a lip portion that comes into contact with a peripheral portion of the substrate and a surface of the fixed holding member when the substrate is held by the fixed holding member and the movable holding member, and is mounted between the lip portions. A plating apparatus using a substrate holder integrally held by a support.
JP2002213209A 2002-06-21 2002-07-22 Substrate holder and plating apparatus Expired - Lifetime JP4124327B2 (en)

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PCT/JP2003/007855 WO2004001813A2 (en) 2002-06-21 2003-06-20 Substrate holder and plating apparatus
EP03760917A EP1516357A2 (en) 2002-06-21 2003-06-20 Substrate holder and plating apparatus
TW092116755A TWI316097B (en) 2002-06-21 2003-06-20 Substrate holder and plating apparatus
KR1020047000836A KR100980051B1 (en) 2002-06-21 2003-06-20 Substrate Holder and Plating Equipment
CN2008100040249A CN101281858B (en) 2002-06-21 2003-06-20 Substrate holder and plating apparatus
US10/482,476 US7601248B2 (en) 2002-06-21 2003-06-20 Substrate holder and plating apparatus
CNB038008459A CN100370578C (en) 2002-06-21 2003-06-20 Substrate holding device and plating apparatus
JP2008075465A JP4669019B2 (en) 2002-06-21 2008-03-24 Substrate holder and electrolytic plating apparatus
US12/585,141 US7901551B2 (en) 2002-06-21 2009-09-04 Substrate holder and plating apparatus
US13/017,294 US8337680B2 (en) 2002-06-21 2011-01-31 Substrate holder and plating apparatus
US13/684,902 US8936705B2 (en) 2002-06-21 2012-11-26 Electrochemical deposition apparatus
US14/565,841 US9388505B2 (en) 2002-06-21 2014-12-10 Electrochemical deposition method
US15/180,477 US9593430B2 (en) 2002-07-22 2016-06-13 Electrochemical deposition method
US15/180,457 US9624596B2 (en) 2002-07-22 2016-06-13 Electrochemical deposition method
US15/180,448 US9506162B2 (en) 2002-06-21 2016-06-13 Electrochemical deposition method

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