JP2004071772A - High frequency package - Google Patents

Abstract

Provided is a high-frequency package that improves high-frequency characteristics, protects against external high-frequency noise, reduces leakage power to the outside, and enables heat radiation of a high-output element.
A dielectric multilayer substrate (251, 296, 301, 306) made of a dielectric material, a lid (281), and a high frequency element (381) formed by the dielectric substrate and the lid are housed. (271), a ground conductor (211 and 321) provided in the dielectric substrate, and a via conductor filled in a through-hole that is electrically connected to the ground conductor and penetrates the dielectric substrate. (221, 231). As a result, the generation of leakage power and high-frequency noise can be prevented, the need for an auxiliary mounting guard area is eliminated, and the need for a shield plate around the package is eliminated, thus increasing the mounting area.
[Selection] Fig. 2

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a surface-mount type high-frequency package for a MMIC (monolithic microwave or millimeter wave integrated circuit) in a high-frequency region. In particular, the present invention relates to a miniaturization, automatic mounting, and a high output element of the MMIC. And a high-frequency package using low-temperature fired ceramics (LTCC).
[0002]
[Prior art]
Conventionally, as this type of high-frequency package, for example, a product name: CHA5093TCF manufactured by United Monolithic Semiconductor (France) has been proposed. FIG. 11 is a cross-sectional view when the conventional high-frequency package is mounted on an external circuit board. 11, reference numeral 2001 denotes an insulating layer of an external circuit board; 2061, a dielectric substrate of a high-frequency package made of a dielectric material; 2011, a lid of a high-frequency package; 2031, a high-frequency element; 2051, a high-frequency signal input / output high-frequency package; A terminal conductor, 2151 is a die bond conductor for die bonding the high frequency element, 2041 is a wire for wire bonding the high frequency element and the terminal conductor for high frequency signal input / output, and 2131 is the external for high frequency signal input / output. A terminal conductor of the circuit board; 2081, a ground conductor of the external circuit board; 2111, a ground conductor of the external circuit board; 2161, a mounting terminal conductor of a high-frequency package for conducting the high-frequency package to the terminal conductor of the external circuit board; 2091 is an external circuit board and high frequency package Solder for through, 2141,2101 will penetrate the dielectric substrate of the high-frequency package - a via conductor which is filled in the hole.
[0003]
[Problem to be solved]
However, in the conventional configuration, the electromagnetic wave is not shielded, and external high-frequency noise reaches the inside of the package, the signal in the package leaks, the confidentiality is poor, and the heat of the high-power element can be sufficiently dissipated. There is a problem that there is no. Also, since the components are mounted with the solders 2121 and 2091, the distance between the high-frequency package and the external circuit board is small, and there is a problem that the parasitic elements are attached or the distance varies, resulting in poor high-frequency characteristics. .
[0004]
The present invention solves the above-mentioned conventional problems, and provides a high-frequency package that improves high-frequency characteristics, protects against external high-frequency noise, reduces leakage power to the outside, and enables heat dissipation of high-output elements. The purpose is to:
[0005]
[Means for Solving the Problems]
To achieve the above object, the high-frequency package of the present invention is a dielectric multilayer substrate made of a dielectric material, a lid, and a cavity formed by the dielectric substrate and the lid to house a high-frequency element, A ground conductor provided in the dielectric substrate, and a via conductor filled in a through-hole that is electrically connected to the ground conductor and penetrates the dielectric substrate is provided.
[0006]
Next, another high-frequency package according to the present invention includes a dielectric multilayer substrate made of a dielectric material, a lid having a shield conductor layer, and a cavity formed by the dielectric substrate and the lid for housing a high-frequency element. And a ground conductor provided in the dielectric substrate; and a via conductor filled in a through-hole that is electrically connected to the ground conductor and penetrates the dielectric substrate. The layer and the via conductor are electrically connected.
[0007]
Still another high-frequency package according to the present invention includes a dielectric multilayer substrate made of a dielectric material, a lid having a shield conductor, and a cavity formed by the dielectric substrate and the lid to house a high-frequency element. It is characterized by having done.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
In the present invention, a via conductor filled in a through-hole penetrating the dielectric multilayer substrate and a die bond conductor are arranged in a die bonding region for mounting the high-frequency element in the cavity on the dielectric multilayer substrate. In addition, it is preferable that the conductive member is electrically connected to the ground conductor.
[0009]
In the die bonding region, a via conductor and a die bond conductor filled in a through hole penetrating the dielectric substrate are arranged in a peripheral region thereof, and the die bond conductor and a terminal conductor for inputting / outputting a high-frequency signal use microwaves. Preferably, a transmission line is formed.
[0010]
It is preferable that the via conductor and the conductor layer arranged in the die bonding region have a multilayer structure.
[0011]
Further, on a mounting surface for mounting on an external circuit board provided on the dielectric multilayer substrate, a solder dam for isolating solder made of an insulating material was formed between the signal terminal conductor and the ground conductor on the mounting surface. Is preferred.
[0012]
In addition, it is preferable that a resin ball plated with solder is disposed between a mounting conductor for mounting on an external circuit board provided on the dielectric multilayer substrate and a conductor layer of the external circuit board.
[0013]
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0014]
(Embodiment 1)
FIG. 1 is a plan view showing a high-frequency package viewed from above when a lid of the high-frequency package according to Embodiment 1 of the present invention is removed. In FIG. 1, reference numeral 101 denotes a via land conductor formed of a first conductor layer, which is the uppermost conductor layer of the high-frequency package body, and 131, a first insulating layer which is the uppermost insulating layer of a dielectric multilayer substrate of a high-frequency package made of a dielectric material. , 171 are high-frequency elements such as MMICs. 141 is a high-frequency signal terminal conductor formed of the second conductor layer, 161 is a die bond conductor for die-bonding the high-frequency element formed of the third conductor layer, 151 is a second insulating layer, and 121 is a second conductor layer. 4 shows a formed signal terminal conductor.
[0015]
FIG. 2 is a cross-sectional view of the high-frequency package taken along line II in FIG. 1 when the high-frequency package according to Embodiment 1 of the present invention is mounted on an external circuit board. 2, 321 is a ground conductor formed of a fourth conductor layer, 371 is a shield conductor of a lid, 291 is a conductive adhesive, 251 is a first insulating layer of the high-frequency package body, and 296 is a first insulating layer of the high-frequency package body. A second insulating layer, 301 is a third insulating layer, 306 is a fourth insulating layer, 281 is a lid insulating layer formed of the same material as that of 251, and 391 is a second conductor layer of the high-frequency package body. This is a high-frequency signal terminal conductor. Reference numeral 361 denotes a die bond conductor formed of a third conductor, and a die bonding region for mounting the high-frequency element in the cavity on the dielectric multilayer substrate, and a through hole penetrating the dielectric substrate in a peripheral region thereof. A via conductor and a die bond conductor filled inside are arranged, and a microwave transmission line is formed by the die bond conductor and the terminal conductor 391 that inputs and outputs a high-frequency signal. The die bond conductor 361 is electrically connected to the ground conductors 321 and 211 via the via conductors 231 and 221. Reference numeral 211 denotes a ground conductor formed as a fifth conductor layer, which is a mounting conductor on a mounting surface for mounting the high-frequency package on the external circuit board. 331 is a via conductor filled in a through-hole penetrating the second insulating layer, 231 and 332 are via conductors filled in a through-hole penetrating the third insulating layer, and 221 and 333 are the via conductors. 4 Via conductors filled in through holes penetrating through the insulating layer. 201 is an insulating layer of the external circuit board, 351 is a high-frequency signal terminal conductor formed of a conductive layer of the external circuit board, 341 is a ground conductor layer formed of the conductive layer of the external circuit board, and 311 is a solder made of an insulating material. It is a solder dam for isolation, and is applied only between the signal terminal conductor and the ground conductor. 381 is a high-frequency element, and 271 is a cavity formed by the dielectric substrate and the lid for housing the high-frequency element. 261 is a wire for wire bonding the high-frequency element 381 and the high-frequency credit terminal conductor 391, and 241 is a resin ball of a solder plating exterior for electrically conducting and mounting the high-frequency package to the circuit board conductor. The high-frequency signal terminal conductors 391 and 307 are electrically conductive.
[0016]
With this configuration, when the high-frequency element 381 in the cavity 271 is mounted on the high-frequency package of the present invention, only the die bonding region 161 is filled in the through-hole penetrating the third and fourth insulating layers 301 and 306. Via conductors 221 and 231 and a die bond conductor 361 can be arranged. As a result, even if the high-frequency element 381 generates heat with the high-power element by conducting to the ground conductor 211, the heat is transmitted to the ground conductor 341 of the external circuit board via the via conductors 221 and 231 and the die bond conductor 361, and heat is released. The element 381 does not become hot. Therefore, performance degradation or destruction can be prevented.
[0017]
Further, via conductors 342 and 343 and a die bond conductor 361 filled in through holes penetrating the third and fourth insulating layers 301 and 306 are arranged in a die bonding region 161 and a peripheral region thereof, and a terminal conductor for high frequency signals is provided. Since a microwave transmission line is formed using the signal conductor 391 as the signal conductor and the die bond conductor 361 as the ground conductor, a signal can be extracted from the high frequency element 381 without attenuation. Also, a signal can be input without attenuation.
[0018]
In particular, in low-temperature fired ceramics (LTCC), the material of the via conductor is less airtight than the material of the conductor layer, and if a large number of via conductors are arranged for heat dissipation, the airtightness of the cavity in the package is poor. As a result, moisture is mixed in from the outside or gas in the cavity leaks out. In the present embodiment, this problem can be solved by forming the via conductors 221 and 231 arranged in the die bonding region and the conductor layers 361, 321 and 211 in a multilayer structure.
[0019]
FIG. 3 is a cross-sectional view of the high-frequency package taken along line II-II in FIG. 1 when the high-frequency package according to Embodiment 1 of the present invention is mounted on an external circuit board. 3, reference numeral 401 denotes a lid, 402 denotes a shield conductor of the lid, 403 denotes a conductive adhesive, 404 denotes a via land conductor formed of the first conductor layer of the high-frequency package main body, and 405 denotes a first conductor of the high-frequency package main body. An insulating layer, 406 is a via conductor filled in a through hole passing through the first insulating layer 405, 407 is a second insulating layer, and 408 is filled in a through hole passing through the second insulating layer 407. Via conductors, 409 is a second conductor, 451 is an insulating layer of an external circuit board, 452 is a signal terminal conductor formed of a conductive layer of the external circuit board, 453 is a resin ball plated with solder, and 454 is a third insulating layer , 455 is a fourth insulating layer, 456 is a via conductor filled in a through hole penetrating the third insulating layer 454, and 457 is a via conductor penetrating the fourth insulating layer 455 Hama vias conductor, 458 is a signal terminal conductors formed by the fifth conductor layer. The shield conductor 402 of the lid and the via land conductor 404 formed of the first conductor layer of the high-frequency package body are adhered by a conductive adhesive 403 and are electrically connected. By arranging and heating the resin balls 453 between the signal terminal conductors 458 and 452, the signal terminal conductors 458 and 452 are electrically conducted.
[0020]
FIG. 4 is a cross-sectional view of the high-frequency package taken along line III-III in FIG. 1 when the high-frequency package according to Embodiment 1 of the present invention is mounted on an external circuit board. In FIG. 4, reference numeral 501 denotes a shield conductor of a lid, 502 denotes a via conductor filled in a through hole penetrating the second insulating layer 511, and 503 denotes a via conductor penetrating the third insulating layer 512. A filled via conductor, 504 is a cavity for accommodating a high-frequency element, 505 is a high-frequency element, 506 is a second insulating layer, 507 is a first insulating layer, 508 is a conductive adhesive, and 509 is a high-frequency package body. It is a via land formed of the first conductor layer, and is electrically connected to the ground conductors 526 and 527. 511 is a second insulating layer of the high-frequency package body, 512 is a second insulating layer of the high-frequency package body, 513 is a third insulating layer of the high-frequency package body, 514 is a fourth insulating layer of the high-frequency package body, and 521 is the fourth insulating layer. The via conductor filled in the through hole penetrating the layer 514 and the via conductor filled in the through hole penetrating the third insulating layer 513 were formed of a conductor layer of an external circuit board. The ground conductor 524 is a resin ball, 525 is an insulating layer of an external circuit board, 526 is a ground conductor formed of the fifth conductor layer of the high-frequency package body, and 527 is a ground conductor formed of the fourth conductor layer of the high-frequency package body. Reference numeral 528 denotes a die bond conductor formed of the third conductor layer of the high-frequency package body, and 529 denotes a vial formed of the second conductor layer of the high-frequency package body. A de conductor.
[0021]
A ground conductor provided in the dielectric substrate around a cavity for accommodating a high-frequency element, and a via conductor 502 which is electrically connected to the ground conductor and is filled in a through-hole penetrating the dielectric substrate. , 503 and a conductive layer, and via lands 509 and 529, and the shield conductive layer 501 of the lid and the via conductor 509 are electrically connected by a conductive adhesive 508. With this configuration, the electromagnetic shield of the high-frequency element housed in the cavity in the high-frequency package is perfect, and external high-frequency noise does not reach the package or the signal in the package does not leak.
[0022]
By disposing the shield conductor layer 501 of the lid on the cavity 504 side, another circuit, for example, an antenna or a filter can be formed or installed on the surface of the insulating layer 281 of the lid opposite to the shield conductor layer. Will be possible.
[0023]
A resin ball 524 plated with solder is placed between a mounting conductor 526 for mounting on an external circuit board provided on the dielectric multilayer substrate and a conductor 523 of the external circuit board, and is heated. The conductors 526 and 523 become conductive. Conventionally, the purpose was to increase the gap, enable parts mounting, or work as an interference material with an external circuit board to improve reliability, but use resin balls for high-frequency package mounting. As a result, the distance between the high-frequency package and the external circuit board is increased, and the parasitic element can be reduced. In addition, the intervals do not vary, and the accuracy is high, and the high-frequency characteristics are improved. Further, when the high-frequency package is enlarged, the effect is increased.
[0024]
FIG. 5 is a plan view illustrating the first insulating layer, the first conductor layer, and the via conductor of the high-frequency package according to Embodiment 1 of the present invention. In FIG. 5, reference numeral 601 denotes a first insulating layer which is an uppermost insulating layer of a dielectric multilayer substrate of a high-frequency package made of a dielectric material; 611, a via land conductor formed of a first conductor layer of the high-frequency package body; This is a via conductor filled in a through-hole penetrating the insulating layer 601.
[0025]
FIG. 6 is a plan view illustrating the second insulating layer, the second conductor layer, and the via conductor of the high-frequency package according to Embodiment 1 of the present invention. 701 is a second insulating layer, 711 is a via land conductor formed of the second conductor layer, 721 is a via conductor, 731 is a high-frequency signal input / output terminal conductor formed of the second conductor layer, and 741 is a second conductor layer. It is a formed signal input / output or power supply terminal conductor.
[0026]
FIG. 7 is a plan view illustrating the third insulating layer, the third conductor layer, and the via conductor of the high-frequency package according to Embodiment 1 of the present invention. In FIG. 7, reference numeral 801 denotes a via conductor; 802, a via land conductor formed of a third conductive layer; 803, a third insulating layer; 804, a via conductor; 805, a die bond conductor formed of the third conductive layer; Conduction is provided by the conductor and the via conductor 804.
[0027]
FIG. 8 is a plan view illustrating the fourth insulating layer, the fourth conductor layer, and the via conductor of the high-frequency package according to Embodiment 1 of the present invention. 8, reference numeral 901 denotes a via conductor; 902, a via land formed of a fourth conductive layer; 903, a fourth insulating layer; 904, a via conductor; and 905, a ground conductor formed of the fourth conductive layer.
[0028]
FIG. 9 is a plan view illustrating a fourth insulating layer and a fifth conductor layer of the high-frequency package according to Embodiment 1 of the present invention. 1001 is a signal terminal conductor formed of the fifth conductor layer, 1002 is a ground conductor formed of the fifth conductor layer, 1003 is a high-frequency terminal conductor, and 1004 is a fourth insulating layer. This surface is a mounting surface on which the high-frequency package is mounted on the external circuit board. The fifth conductor layer is a mounting conductor layer for conducting the high-frequency package with the conductor layer of the external circuit board.
[0029]
FIG. 10 is a bottom view of the high-frequency package according to Embodiment 1 of the present invention when viewed from below. In FIG. 10, 1101 is a signal terminal conductor formed of the fifth conductor layer, 1102 is a ground conductor formed of the fifth conductor layer, 1103 is a high-frequency terminal conductor, 1104 is a fourth insulating layer, and 1105 is a solder sheath. The plated resin balls 1106 are solder dams made of insulating material for solder isolation, and are formed only between the signal terminal conductors 1101 and 1103 and the ground conductor 1102 on the mounting surface. By not forming a solder dam between the signal terminals 1101 and 1103, dielectric loss inherent to the material of the solder dam does not occur, and high-frequency characteristics can be maintained at a high level. Conventionally, a dam for solder isolation was formed to prevent the flow of solder between each terminal and between patterns in surface mounting.However, in a high-frequency package, the performance is satisfied depending on the arrangement of the solder dam. May not be possible. The method of arranging the solder dams of the present embodiment is arranged so as not to affect the high frequency characteristics at all.
[0030]
In the first embodiment, the shield conductor layer of the lid and the via conductor are electrically connected, but a ground conductor provided in the dielectric substrate is provided around a cavity for accommodating a high-frequency element, Electromagnetic shielding of a high-frequency element is possible at low frequencies only by providing a via land formed of a conductive layer and a via conductor filled in a through-hole penetrating the dielectric substrate through the ground conductor. .
[0031]
Further, the electromagnetic shielding of the high-frequency element can be performed at a low frequency only by providing the cover with the shield conductor.
[0032]
【The invention's effect】
As described above, the present invention can provide a high-frequency package that improves high-frequency characteristics, protects against external high-frequency noise, reduces power leakage to the outside, and enables heat radiation of a high-output element. Furthermore, the generation of leakage power and high-frequency noise can be prevented, the mounting auxiliary guard area is not required, the shield plate is not required around the package, and the mounting area is widened.
[Brief description of the drawings]
FIG. 1 is a plan view of a high-frequency package viewed from above when a lid of the high-frequency package according to the first embodiment of the present invention is attached and detached. FIG. 2 is a diagram illustrating the high-frequency package according to the first embodiment of the present invention mounted on an external circuit board. FIG. 3 is a cross-sectional view of the high-frequency package taken along the line II in FIG. 1; FIG. 3 is a cross-sectional view of the high-frequency package taken along the line II-II in FIG. FIG. 4 is a sectional view of the high-frequency package according to the first embodiment of the present invention taken along line III-III in FIG. 1 when the high-frequency package according to the first embodiment of the present invention is mounted on an external circuit board. FIG. 6 is a plan view showing a first insulating layer, a first conductor layer, and a via conductor of the package. FIG. FIG. 7 is a plan view showing a conductor layer and a via conductor. FIG. 7 is a plan view showing a third insulating layer, a third conductor layer, and a via conductor of the high-frequency package according to the first embodiment of the present invention. FIG. 9 is a plan view illustrating a fourth insulating layer, a fourth conductor layer, and a via conductor of the high-frequency package according to the first embodiment. FIG. 9 illustrates a fourth insulating layer and a fifth conductor layer of the high-frequency package according to the first embodiment of the present invention. FIG. 10 is a bottom view of the high-frequency package according to the first embodiment of the present invention viewed from below. FIG. 11 is a cross-sectional view of the high-frequency package when a conventional high-frequency package is mounted on an external circuit board. Description]
101 Via Land Conductor 121 Signal Terminal Conductor 131 First Insulating Layer 141 of Uppermost Insulating Layer of Dielectric Multilayer Substrate 141 High Frequency Signaling Terminal Conductor 151 Second Insulating Layer 161 Die Bonding Conductor 171 High Frequency Element 201 Insulating Layer 211 Grounding Conductors 221 231 331 332, 333 Via conductor 241 Solder-plated resin ball 251 First insulation layer 261 Wire 271 Cavity 281 Cover insulation layer 291 Conductive adhesive 296 Second insulation layer 301 Third insulation layer 306 Fourth insulation layer 311 Solder isolation Solder dam 321 Ground conductor 341 Ground conductor layer 351 High frequency signal terminal conductor 361 Die bond conductor 371 Shield conductor 381 of lid body High frequency element 391 High frequency signal terminal conductor

Claims (8)

A dielectric multilayer substrate made of a dielectric material;
A lid,
A cavity formed by the dielectric substrate and the lid to house a high-frequency element,
A ground conductor provided in the dielectric substrate,
A high-frequency package comprising: a via conductor that is electrically connected to the ground conductor and is filled in a through-hole penetrating the dielectric substrate. A dielectric multilayer substrate made of a dielectric material;
A lid having a shield conductor layer,
A cavity formed by the dielectric substrate and the lid to house a high-frequency element,
A ground conductor provided in the dielectric substrate,
And a via conductor filled in a through-hole that penetrates the ground conductor and penetrates the dielectric substrate,
A high-frequency package wherein the shield conductor layer of the lid and the via conductor are conducted. A via conductor filled in a through-hole penetrating the dielectric multilayer substrate and a die bond conductor are arranged in a die bonding region for mounting the high-frequency element in the cavity on the dielectric multilayer substrate, and the ground conductor The high-frequency package according to claim 1, wherein the high-frequency package is made conductive. In the die bonding region, a via conductor and a die bond conductor filled in a through-hole penetrating the dielectric substrate are arranged in a peripheral region thereof, and a microwave is formed by the die bond conductor and a terminal conductor for inputting and outputting a high-frequency signal. The high-frequency package according to claim 3, wherein a transmission line is formed. The high-frequency package according to claim 3, wherein the via conductor and the conductor layer arranged in the die bonding region have a multilayer structure. A solder dam for isolating solder made of an insulating material is formed between a signal terminal conductor and a ground conductor on the mounting surface on a mounting surface for mounting on an external circuit board provided on the dielectric multilayer substrate. 3. The high-frequency package according to 1 or 2. 3. The high-frequency package according to claim 1, wherein a resin ball plated with solder is disposed between a mounting conductor for mounting on an external circuit board provided on the dielectric multilayer substrate and a conductor layer of the external circuit board. . A high-frequency package comprising: a dielectric multilayer substrate made of a dielectric material; a lid having a shield conductor; and a cavity formed by the dielectric substrate and the lid for housing a high-frequency element.

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