JP2004055584A - Component mounting equipment - Google Patents

Abstract

An object of the present invention is to make a component picking-up means of a component transfer device a reversing or turning single axis, and control a control device to perform a series of operations of picking up and delivering components from component supply means. Obtaining a mounting method and a component mounting apparatus.
A component mounting apparatus (1A) according to an embodiment of the present invention receives a component (S) face-down from a tray (T) in which the component (S) is face-up, and extends in a horizontal state to a vicinity of a bonding apparatus (140) mounted on a substrate (P). The component suction arm 1331 incorporated in the component reversing device 133 of the component transfer device 130 that slides on the existing X-axis rail 124 approaches slightly upward from the horizontal state until immediately before suctioning the component S on the tray T. When the component S is sucked, the component S is in a horizontal state. When the component S is sucked, the component suction arm 1331 is turned over, and approaches the bonding device 140 in a slightly lower state until just before being delivered to the bonding device 140. And a control device 180 for controlling the apparatus to be in a horizontal state when it is transferred to the apparatus.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention performs image processing on various small chip-shaped components (hereinafter, simply referred to as “components”) such as semiconductor chips arranged on a tray which is a part of a component supply device, and performs semiconductor processing on the semiconductor wafers and electronic circuits. The present invention relates to a component mounting method and a component mounting apparatus for positioning and mounting a substrate such as a substrate (hereinafter simply referred to as a “substrate”) at a predetermined mounting position, and particularly to a component transfer apparatus. .
[0002]
[Prior art]
First, a component mounting apparatus according to one aspect of the prior application to which the present applicant has applied for a patent is taken, and its configuration and operation will be described with reference to the drawings.
[0003]
FIG. 11 is a top view of the component mounting apparatus of one aspect of the prior application to which the present applicant has applied for a patent, as viewed from above, and FIG. 12 is a side view of the component mounting apparatus shown in FIG. FIG. 13 is a side view of the component mounting apparatus shown in FIG. 11 as viewed from the arrow B side, and FIG. 14 is a view showing the operation principle of the component suction nozzle in the component transfer apparatus.
[0004]
Note that the semiconductor chip S will be described as a component to be mounted. The semiconductor chip S is a chip-shaped chip before being divided from a semiconductor wafer on which a large number of identical integrated circuits are formed in a predetermined arrangement, and is a so-called IC chip.
[0005]
In the drawing, reference numeral 1C indicates a conventional component mounting apparatus as a whole. The illustrated device is generally called a flip chip bonder, and is an apparatus for mounting various components S in a predetermined pattern on a substrate P via an adhesive material, and generally has an alignment function of the components S, It has a mounting function, heating and pressurizing functions.
[0006]
The component mounting apparatus 1C includes the following, as shown in FIGS. That is, it is composed of a base 10, a tray device 20, a component transfer device 30, a bonding device 40, a work stage device 50, a camera device 60, a control device 70, and the like.
[0007]
The base 10 includes a horizontal surface plate 11 serving as a reference surface, and a control device 70 and various mechanisms are incorporated therein. However, the control device 70 may be provided outside the base 10.
[0008]
The tray device 20 has a Y table 22 that can be adjusted in the direction of the Y axis 21, and has a function of arranging the components S on the Y tape 22 in a predetermined arrangement and fixing the tray 23 in which the components S are stored. The component S is accommodated with its electrode side facing upward. The type of the component S to be accommodated may be one type or a plurality of different types.
[0009]
The component transfer device 30 includes a driving device 31 and a component suction nozzle 32. The drive device 31 is configured on a surface plate 33 fixed on the surface plate 11. A rail 34 (FIG. 11) is laid on the surface plate 33, and a driving device 31 is mounted on the rail 34 so as to be movable in the X-axis direction where the tray device 20 and the bonding device 40 exist. Further, as shown in FIG. 14, the driving device 31 further includes a lifting mechanism that allows the component suction nozzle 32 to move in the vertical direction indicated by the arrow Z and a component suction nozzle 32 illustrated by the arrow θ. A reversing mechanism (not shown) for reversing 32 parts is incorporated.
[0010]
The component suction nozzle 32 includes a reversing arm 35, and a spindle 36 having a base end connected to the driving device 31 and a tip 37 to which a nozzle 37 for suctioning the component S is attached (FIGS. 12 and 12). 13).
[0011]
When the reversing arm 35 is reversed, the component suction nozzle 32 reverses the front and back surfaces of the component S sucked and taken out of the tray 23 by the nozzle 37, and transfers the component S to the bonding head 45 of the bonding head unit 43 of the bonding apparatus 40 described later. It has a delivery function.
[0012]
The bonding apparatus 40 includes a support plate 41 vertically mounted on the base 11, a Z-axis table 42 supported by the support plate 41, a bonding head 43, and the like. The bonding head 43 is mounted on the Z-axis table 42. The bonding head part 43 is composed of a rotating shaft 44 and a bonding head 45 exchangeably fixed below the rotating shaft 44 (FIG. 12).
[0013]
The bonding head unit 43 sucks and receives the component S inverted by the component transfer device 30 with the bonding head 45 when it is at the upper position, and lowers the bonding head 45 to suck and hold the component. It has a function of placing a component S at a predetermined position of a substrate P on a work stage device 50 to be described later via an adhesive or the like, and fixing and mounting the component S by pressing and heating.
[0014]
The work stage device 50 includes an XY table 53 that can be adjusted in the X-axis 51 and Y-axis 52 directions, and has a function of fixing a substrate P on which the component S is to be mounted on the XY table 53.
[0015]
The camera device 60 can enter and exit between the bonding head 45 and the substrate P on the XY table 53, and recognizes the camera 61 that recognizes the electrode surface of the component S and the position of the substrate P on which the component S is to be mounted, The position information data is fed back to the control device 70 to rotate the camera 61 or to move and control the XY table 53 of the work stage device 50 in the X-axis direction and / or the Y-axis direction.
[0016]
The control device 70 includes a microcomputer, and in addition to the above functions, the XY table 23 of the tray device 20, the component transfer device 30, the bonding device 40, the work stage device 50, and the camera device in accordance with the sequence for mounting the component S. It has a function of controlling a part or the whole of the component mounting apparatus 1C such as 60.
[0017]
In the component mounting apparatus 1C configured as described above, as a general operation, as illustrated in FIG. 14, the component transfer device 30 moves toward the tray 23, and the component suction nozzle 32 descends. The electrode surface side of the predetermined component S is sucked from the tray 23 by the nozzle 37 attached to the tip end thereof, then raised, the reversing arm 35 is reversed by the reversing mechanism, and the component suction nozzle 32 is rotated. The part S is turned upside down. In this state, the component transfer device 30 moves the component S toward the bonding head unit 42 of the bonding device 40 and brings the component S, which is vacuum-sucked by the nozzle 37, below the bonding head 45 of the bonding head unit 43. When this movement is completed, the component suction nozzle 32, and thus the nozzle 37, rises toward the bonding head 45 as shown by the arrow Z, and is placed on the lower surface of the bonding head 45 by the vacuum suction force. The vacuum suction of the part of the nozzle 37 is stopped, and the part S is delivered to the bonding head 45.
[0018]
After moving the component transfer device 30 in the X-axis direction and confirming that the component transfer device 30 has moved out of the area of the bonding device 40, the camera 61 of the camera device 60 moves the substrate P fixed to the bonding head 45 and the work stage device 50. To move between.
[0019]
The camera 61 recognizes the image of the electrode pattern of the component S held by the bonding head 45 and the electrode land pattern on the substrate P, and controls position information (shift information) as to whether or not the positions match. The calculation is performed by a computer incorporated in the device 70, and the result is output to the work stage device 50 as feedback data. Based on this data, the XY table 53 of the work stage device 50 is finely controlled and positioned so that the electrode of the component S matches the electrode pad position at a predetermined position on the substrate P.
[0020]
Next, the bonding head 45 holding the component S is lowered, and the component S is mounted in a state where it is precisely positioned at a predetermined position on the substrate P.
[0021]
Although the operation of the component mounting apparatus 1C has been described as a general operation, there are various types of components S, and various sizes and shapes of the components S. The 30 nozzles 37 are switched according to the type, size, and shape of the component S.
[0022]
[Problems to be solved by the invention]
However, the component transfer device 30 in the conventional component mounting device 1C configured as described above includes a total of three axes: a component reversal θ axis, a component suction / transfer Z axis, and a straight X axis.
[0023]
Although not shown, an arm floating mechanism composed of a single guide for shock absorption and mounting of a preload spring for sucking and mounting the component S is built in the Z axis. as a result,
1. More drive shafts make control more complicated and at the same time increase costs
2. 2. The play increases as the number of movable parts increases, which deteriorates the accuracy of part delivery. When it is necessary to cover the component suction nozzle 32 with a cover in order to handle a component that dislikes dust, it is difficult to completely cover and suction the component.
Become structure
There is such a problem.
[0024]
The present invention is intended to solve such a problem, and the component suction means of the component transfer device is configured with a single axis of reversing or turning and controlled by a control device, so that components from the component supply means can be transferred. It is an object of the present invention to obtain a component mounting method and a component mounting apparatus capable of performing a series of operations of picking up and delivering.
[0025]
[Means for Solving the Problems]
Therefore, in order to solve the above-mentioned problem, in the component mounting method according to the present invention, the component to be mounted on the board is supplied in a face-up manner, and the component is supplied from the component supply means. Means for mounting a substrate mounted on a predetermined position, a component for receiving a component from the component supply means face down, and mounting the component at a predetermined position on the substrate supported by the substrate mounting means A component mounting apparatus comprising: component mounting means for picking up a component in a face-up state from the component supply means and transferring the component picked up by the component mounting means face-down while reversing the component mounting face. Until immediately before sucking a component housed in a face-up state in the component supply means, it approaches slightly upward from the horizontal state and sucks the component. When in the horizontal state, the component is sucked and turned upside down, approaches slightly lower than the horizontal state until just before being delivered to the component mounting means, and is in the horizontal state when delivered to the component mounting means. And transfers the predetermined part under the control of the control unit.
[0026]
In the component mounting apparatus according to the second aspect of the present invention, a component supply unit in which a component to be mounted on the substrate is accommodated in a face-up manner, and a substrate on which a component from the component supply unit is mounted at a predetermined position. A supporting means for mounting the substrate, a guide means extending in a horizontal state from the component supplying means to the vicinity of the substrate mounting means, and a component which is located above the substrate mounting means and faces down from the component supplying means. And a component mounting means for mounting at a predetermined position on a substrate supported by the substrate mounting means, guided by the guide means, and sucking a component housed in a face-up state in the component supply means. When the component is sucked, the component sucking means is turned over, and the component sucking means transferred to the component mounting means and the component sucking means guided by the guide means comprise the component. Until immediately before sucking the components housed in the face-up state to the feeding means, the parts approach in a slightly upward state from the horizontal state, and when sucking the parts, the horizontal state is reached. Upside down, approaching in a slightly downward state from the horizontal state until just before being delivered to the component mounting means, and control means for controlling to be in a horizontal state when delivering to the component mounting means. I have.
[0027]
The component suction means includes a rotation shaft, a component suction arm offset and attached to a tip of the rotation shaft, and a rotation motor for rotating the component suction arm. And
[0028]
Furthermore, a floating mechanism is incorporated in the component suction means.
[0029]
According to a fifth aspect of the present invention, there is provided a component mounting apparatus configured to support a component supply unit in which a component to be mounted on a substrate is accommodated face up, and a substrate on which a component from the component supply unit is mounted at a predetermined position. Board mounting means, component mounting which is located above the board mounting means, receives the component from the component supply means face down, and mounts the board at a predetermined position on the substrate supported by the board mounting means Means for picking up a component housed in a face-up state in the component supply means, and for picking up the component, rotating the component suction means and simultaneously inverting the component suction means, and transferring the component suction means to the component mounting means; Until immediately before the component sucking unit sucks the component housed in the component supply unit in a face-up state, it approaches slightly upward from the horizontal state and sucks the component. When the component is picked up, the component is sucked upside down, the component sucking means is turned over, and approaches slightly lower than the horizontal state until just before being delivered to the component mounting means. And control means for controlling to be in a state.
[0030]
The component suction means includes a turning arm, a component suction means attached to a tip end of the turning arm, a turning motor for turning the turning arm, and a turning motor for turning the component suction means, The swing motor is provided at a position sufficiently below the swing arm.
[0031]
Furthermore, a floating mechanism is incorporated in the component suction means.
[0032]
Therefore, according to the component mounting method and the component mounting apparatus of the present invention, the component suction unit picks up the component supply unit and the components contained therein by suction without contacting the component supply unit, and contacts the component mounted unit with the component mounting unit. Without having to do so.
[0033]
The component pick-up means of the component mounting apparatus is constituted by a single reversing axis and controlled by the control device, whereby a series of operations of picking up, picking up, and delivering components from the component supply means can be performed.
[0034]
Further, by incorporating the floating mechanism in the component suction means, the component can be mounted on the board without damaging the component.
[0035]
Furthermore, by incorporating the floating mechanism coaxially with the reversing rotation shaft, the component suction arm can be floated with less play, and the components can be delivered with high precision. Good component delivery accuracy means that when processing an image to correct the mounting position of the process later, processing near the center of the processing area, which is not affected by aberrations, becomes possible, and therefore component mounting This leads to improved accuracy.
[0036]
Furthermore, since there is little backlash, it is possible to pick up parts having a contact-prohibited area such as an imager with high positional accuracy, and it is possible to prevent scratches and chipping due to collet contact.
[0037]
Furthermore, by making the reversing direction of the reversing arm coincide with the direction of the transfer axis of the straight-moving operation, the transfer distance can be reduced by twice the reversing arm length, and the transfer time can be reduced. Even when the turning angle of the transfer shaft is 90 °, the turning radius can be reduced by the length of the reversing arm, and the rigidity at the operating point can be increased.
[0038]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a component mounting apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention, and therefore, various technically preferable limitations are given. However, the scope of the present invention is not limited to the embodiments described below. Unless stated to limit, it is previously refused that the present invention is not limited to these forms.
[0039]
FIG. 1 is a side view of a partial configuration of a component mounting apparatus according to a first embodiment of the present invention, FIG. 2 is a top view of a component transfer device portion in the component mounting apparatus shown in FIG. 1, and FIG. A shows a side view of the component reversing device in the component transfer apparatus, FIG. B shows a side view of a part of the same taken along the line BB of FIG. A, and FIG. 4 shows the component shown in FIG. FIG. 5 is an enlarged sectional view of the floating mechanism as viewed from the arrow C incorporated in the reversing device, FIG. 5 is an operation explanatory diagram of the component mounting device shown in FIG. 1, and FIG. 6 is a component mounting device of a second embodiment of the present invention. 9 is a top view of the component transfer device, FIG. 7 is a partial cross-sectional side view taken along line BB of the component transfer device shown in FIG. 6, FIG. 8 is a front view seen from the arrow C shown in FIG. FIG. 10 is a sectional side view of an arm floating mechanism incorporated in a swing arm unit, and FIG. It is a diagram for describing operation of the component transfer device in the component mounting apparatus of the second embodiment.
[0040]
First, a component mounting apparatus according to a first embodiment of the present invention will be described with reference to FIGS. First, the component mounting apparatus according to the first embodiment will be described with reference to FIGS.
[0041]
In FIG. 1, reference numeral 1A indicates a component mounting apparatus according to the first embodiment of the present invention. The component mounting apparatus 1A is configured as a so-called ultrasonic flip chip bonder, and as shown in FIG. 2, a component reversing device 133 described later is of a straight type, and the component reversing device 133 and the X-axis The (transfer) motor 135 is a system in which a commonly used guided ball screw is driven by a motor.
[0042]
The component mounting apparatus 1A includes a base 110, a tray device 120, a component transfer device 130, a bonding device 140, a work stage device 150, a first camera device 160, and a second camera device, similarly to the conventional component mounting device 1C. It comprises a camera device 170, a control device 180 and the like.
[0043]
The base 110 includes a horizontal surface plate 111 serving as a reference surface, and a control device 180 and various mechanisms are incorporated therein. However, the control device 180 may be provided outside the base 110.
[0044]
The tray device 120 includes a θ table 122 rotated from below by a θ motor 121 mounted on a surface plate 111, a horizontal X-axis rail 124 driven by an X-axis motor 123 assembled thereon, and a side surface thereof. A Y-axis rail 126 driven by the assembled Y-axis motor 125, a saddle 127 attached to the X-axis rail 124, a column 128 fixed vertically to the saddle 127, and horizontally mounted on the column 128 The stage 129 is configured to be movable in the X-axis direction and the Y-axis direction and to be rotatable.
[0045]
A tray T in which a plurality of components S to be mounted are stored in a predetermined arrangement is placed horizontally on a stage 129 and fixed.
[0046]
As shown in FIG. 2, the component transfer device 130 includes an X-axis rail 131 horizontally supported by a plurality of columns (not shown) vertically attached to the base 110, and the X-axis rail 131 on the X-axis rail 131. , A component reversing device 133 which is attached below the slider 132 and is a feature of the present invention, and a cover 134 which covers the X-axis rail 131. The configuration and structure of the component reversing device 133 will be described later with reference to FIGS.
[0047]
The bonding apparatus 140 includes a bonding head 141 using ultrasonic waves as a bonding means, a linear guide 142, and the like. The linear guide 142 is vertically supported on the base 110 by a support member (not shown). Is guided by the linear guide 142 to move up and down in the Z-axis direction. Further, a suction nozzle (not shown) is provided on the lower surface of the bonding head 141, and receives and holds the component S from the component reversing device 133 by suction. Furthermore, the bonding head 141 has a built-in ultrasonic oscillation power supply (not shown), and the bonding to the electrode lands on the substrate P is performed by using a horn 143 oscillated at a high frequency oscillated by the ultrasonic oscillation power supply to join the ultrasonic energy. And is performed at the bonding energy.
[0048]
The work stage device 150 includes a θ table 152 rotated from below by a θ motor 151 installed on the surface plate 111, and a horizontal X-axis rail (not shown) driven by an X-axis motor 153 assembled thereon. An X-axis table 154 to be guided, a Y-axis rail 156 driven by a Y-axis motor 155 assembled on the upper surface thereof, a Y-axis table 157 horizontally assembled on the Y-axis rail 156, and a Y-axis table 157 The stage 158 includes a fixed stage 158 and the like. The stage 158 is configured to be movable in the X-axis direction and the Y-axis direction and to be rotatable.
[0049]
A board P on which a plurality of components S are mounted in a predetermined arrangement is placed and fixed on a horizontal surface of the stage 158. On the substrate P, electrode lands (not shown) and the like are formed in an arrangement corresponding to the electrodes of the component S to be mounted.
[0050]
The second camera device 170 includes an X-axis and a Y-axis that operate in a horizontal direction (not shown). The camera 171 is guided by an X-axis rail 172 by driving an X-axis motor 173, and is connected to the bonding head 141. When the device enters and exits from the substrate P on which the component S is to be mounted, and enters between the two, the electrodes of the component S adsorbed by the bonding head 141 and the electrode lands at the mounting position on the substrate P are imaged. Recognition, position information (shift information) as to whether or not the positions match, is calculated by a computer incorporated in the control device 180, and the result is output to the work stage device 150 as feedback data. Based on this data, the θ table 152, the X-axis table 154, and the Y-axis table 157 of the work stage device 150 are finely moved and controlled so that the electrodes of the component S match the electrode land positions at predetermined positions on the substrate P. Is positioned.
[0051]
Next, the component reversing device 133 will be described with reference to FIGS. The component reversing device 133 is supported by the slider 132 and moves on the X-axis rail 131 toward the tray device 120 and toward the bonding device 140 on the X-axis indicated by the arrow X. This movement is performed by the X-axis motor 135. Reference numeral 136a indicates an origin sensor for the slider 132, reference numeral 136b indicates a (+) limit sensor for the slider 132, and reference numeral 136c indicates a (-) limit sensor for the slider 132, but they are not the gist of the present invention. Their description is omitted.
[0052]
The component reversing device 133 is fixed to the component suction arm 1332 and the slider 132, which are mounted on the base end in the tangential direction of the outer peripheral portion of the reversing shaft 1331 as shown in an enlarged manner in FIGS. A reversing motor 1334 having a built-in encoder and reduced in rotation speed by a speed reducer 1333, a rotating shaft 1337 fixed to a spindle 1335 of the reversing motor 1334 by a screw 1336 and rotating integrally with the spindle 1335. Two rotating bearings 1338 fitted between the rotating shaft 1337 and the reversing shaft 1331 at a predetermined interval in the axial direction, and a stopper pin attached to an outer peripheral portion of the rotating shaft 1337. 1339, a stopper block 1340 in contact with a stopper pin 1339 disposed below the reversing shaft 1331, a reversing shaft 331 and the rotation shaft 1337 and the multiplying passed tension coil spring 1342, inversion axis 1331 side of the spring hook 1341, and a like limit sensor 1343 is disposed below the stopper block 1340.
[0053]
A component suction nozzle N is replaceably attached to the tip of the component suction arm 1332, and a component suction path 1344 is formed in the center of the component suction arm 1332 by drilling (FIG. 3A). It is mounted and connected to an opening 1346 of a component suction path formed at the center of the driving shaft 1345. The component suction path of the rotating shaft 1345 is connected to an external air pipe 1348 through a rotatable joint 1347 having a built-in pipe.
[0054]
In the configuration of the component reversing device 133, the two rotating bearings 1338, the tension coil springs 1342, the stopper pins 1339, and the stopper blocks 1340 are members constituting an arm floating mechanism.
[0055]
Next, the operation of the component mounting apparatus 1A according to the first embodiment of the present invention will be described with reference to FIG.
[0056]
First, a component S such as a semiconductor chip is stored in the tray T face-up, that is, with the electrodes facing upward, and is mounted and fixed on the stage 129 of the tray device 120 having a built-in XYθ operation axis. In this case, the position of the component S is roughly corrected by the first camera device 160 and supplied.
[0057]
Next, the component reversing device 133 of the component transfer device 130 sucks the face-up component S of the tray T fixed on the stage 129, reverses and turns the component S, and uses a bonding device that uses ultrasonic waves as bonding means. It is delivered face down, that is, with the electrode side down, to the bonding head 141 of 140.
[0058]
The component S delivered face down to the bonding head 141 is accurately positioned at a predetermined position of the substrate P on the work stage device 150 having the XYθ operation axis built therein by the second camera device 170 having a vertical field of view. The position is corrected and implemented. The position correction is performed on the XYθ axis of the work stage device 150, and the component mounting is performed on the Z axis built in the bonding device 140.
[0059]
Further, the bonding and mounting of the component S to the substrate P are performed by converting ultrasonic energy into bonding energy by a horn 143 built in the bonding apparatus 140 and vibrating at a high frequency generated by being driven by an ultrasonic oscillation power supply (not shown). Done.
[0060]
FIG. 5 shows four possible positions of the component suction nozzle N attached to the tip of the component suction arm 1332 in the component reversing device 133 during the actual operation of the component mounting apparatus 1A. The respective states are A, B, C, and D. Assuming that the angle of the component suction nozzle N is A at 0 °, the angle at B is about 2 °, the angle at C is 182 °, and the angle at D is about 180 °. The state A is a posture in which the component S is picked up from the tray T on the component supply stage 14 face up, and the state B is a major feature of the present invention. The component suction nozzle N is a mechanism of the component supply stage 129 and the tray T. The position C is a posture that approaches or moves away from the component supply stage 14, and the state C is also one of the major features of the present invention, and the posture that avoids interference with the bonding head 141. The state of D is a posture in which the component S is delivered face down to the bonding head 141 while approaching or moving away from the component 141.
[0061]
The angle 2 ° in the state B and the angle 182 ° in the state C may be the minimum angles that avoid interference with other mechanisms when the component suction nozzle N suctions the component S. This is because the smaller these angles are, the shorter the transfer time of the component S can be.
[0062]
Further, in the present invention, since the above-mentioned floating mechanism is built in, even if some excessive turning power is applied to the reversing shaft 1331, the elasticity of the tension coil spring 1342 coaxial with the rotating shaft 1337 is buffered. When the components are delivered, the impact on the components caused by the sandwiching of the tray T and the component suction nozzles N can be prevented. Therefore, the components S are not damaged such as scratches and chippings. An impact on the component due to the pinching between the N and the bonding head 141 can also be prevented, thus also preventing the component S from being damaged such as scratching and chipping.
[0063]
The distance between the stopper pin 1339 and the stopper block 1340 is a mechanism for restricting the extension of the tension coil spring 1342.
[0064]
Further, since the floating mechanism is configured so that the reversing shaft 1331 and the rotating shaft 1337 are coaxial with each other via the rotating bearing 1338, the floating of the reversing shaft 1331 can be realized with little play, and the high precision component S Can be delivered. High component delivery accuracy means that when performing image processing for mounting position correction in subsequent processes, processing near the center of the processing area, which is not affected by aberrations, can be performed, which in turn improves component mounting accuracy It leads to.
[0065]
In addition, since there is little backlash, it is possible to pick up a component having a contact-prohibited area such as an imager with high positional accuracy, and it is possible to prevent scratches and chipping due to collet contact.
[0066]
As described above, the component reversing device 133 of the present invention controls the component suction arm 1332 with one axis of the reversing shaft 1331 by teaching the series of operations to a computer built in the control device 80. Thus, a series of operations of picking up the component S from the tray T and delivering the component S to the bonding head 141 can be realized.
[0067]
In the component mounting apparatus 1A of the first embodiment, the X-axis motor 135 and the driving mechanism of the component transfer device 130 are one of the dust generating sources, and these are mounted above the tray device 120. Therefore, the chance that the parts stored in the tray T are contaminated with the dust increases. In particular, if dust adheres to the contact-prohibited area of a component having a contact-prohibited area such as an imager, it becomes a defective product. Therefore, it is preferable to minimize dust adhesion to this component no matter which component is mounted on the board P.
[0068]
The component mounting apparatus 1B according to the second embodiment of the present invention shown in FIGS. 6 to 10 is an example of an apparatus configured to minimize the adhesion of dust to this component.
[0069]
Hereinafter, a component mounting apparatus 1B according to a second embodiment of the present invention will be described with reference to FIGS. Note that the entire configuration of the component mounting apparatus is not shown in these drawings, and only the component transfer apparatus 230 is shown. It corresponds to the tray device 120, the bonding device 140, the work stage device 150, the first camera device 160, the second camera device 170, and the control device 180 housed in the gantry 110 attached to the surface of the surface plate 111. The device is still provided, and therefore, for convenience, reference numeral 1B is attached to distinguish it from the component mounting device 1A of the first embodiment.
[0070]
First, the configuration of the component transfer device 230 of the component mounting device 1B will be described. The component transfer device 230 prevents dust from adhering to the component S contained in the tray T and the component S picked up from the tray T as much as possible, and also allows the dust to adhere to the substrate P on the work stage device 150. As shown in FIGS. 6 to 8, the swivel arm 232 is swung in a horizontal state over a predetermined angular range between the tray T and the substrate P by the swivel motor 231 as shown in FIGS. , So that it can be inverted. In this component transfer device 230, the turning motor unit 231 and the turning arm unit 232 are separated, and the turning motor unit 231 is substantially the same as the XYθ table portion of the tray device 120, the XYθ table portion of the work stage device 150, and the like. At the same level below, it is arranged below the turning arm 232 via the turning shaft 2313 and far below the tray T and the substrate P.
[0071]
The turning motor 2311 of the turning motor unit 231 incorporates an encoder and a speed reducer for reducing the number of revolutions, is supported by a frame 2312, and a turning shaft 2313 of the turning motor 2311 is fixed vertically to the upper surface of the frame 2312. It is rotatably accommodated in 2314, and its upper end is fixed to a bracket 234 for the rotation motor 233 of the rotation arm 232, and supports the rotation arm 232 so that it can turn horizontally.
[0072]
The pivot arm 232 includes the rotation motor 233, the bracket 234 to which the rotation motor 233 is fixed on one side, a sleeve 235 that is fixed to the other side of the bracket 234, and one end inside the sleeve 235. It comprises a rotating shaft 236 rotatably supported, and a component suction portion 237 connected to the other end.
[0073]
A hollow path 2332 is formed at the center of the rotation shaft 2331 of the rotation motor 233, and the rotation shaft 236 is formed such that a hollow path 2361 is formed at a portion closer to the sleeve 235 than the center of the bracket 234. It is connected to the shaft 236. One end of the rotation shaft 236 is rotatably supported at both ends inside the sleeve 235 by a rotation bearing 2351.
[0074]
Through holes 2352 (FIGS. 6 and 7) are formed on both sides of the sleeve 235 near the bracket 234, and a discharge pipe 2353 (FIG. 6) is connected to each of the through holes 2352. Further, dust generated when the dust is generated from a floating mechanism formed in a component suction portion 237 described later is configured to be sucked and discharged, thereby achieving cleanness.
[0075]
Further, a suction pipe communicating with the hollow path 2332 is connected to the outer end of the rotation motor 233. The other end of the suction tube is connected to a vacuum source (not shown), and is configured so that a predetermined component S can be sucked by the nozzle N through the hollow path 2332 and the hollow path 2361 by suction. At the time of suction, dust generated from the bearing of the rotation motor 233 is also discharged from the suction pipe 2333 to the outside, thereby achieving cleanliness.
[0076]
Needless to say, the rotating shaft 2331 of the rotating motor 233 and its hollow path 2332, its rotating shaft 236 and its hollow path 2361, and the rotating shaft 2381 and the rotating shaft 2381 in the component suction part 237 described later with reference to FIG. The hollow passage 2384 has a structure in which the hollow passage 2384 is integrally connected in a straight line with a screw or the like. Reference numeral 2334 denotes a power cord for the rotation motor 233.
[0077]
Next, the configuration and structure of the component suction unit 237 will be described with reference to FIG. 9 in which the component suction unit 237 shown in FIG. 7 is enlarged.
[0078]
The component suction portion 237 includes a component suction nozzle 238 and a nozzle bearing portion 239 that rotatably supports the component suction nozzle 238.
[0079]
The component suction nozzle 238 has an integral structure including a rotating shaft 2381 and a disc-shaped nozzle mounting reversing portion 2382 formed at the tip thereof, and a nozzle mounting portion 2383 is formed at one position of the nozzle mounting reversing portion 2382. Have been. A hollow path 2384 having one end connected to the hollow path 2361 of the rotation shaft 236 is formed at the center of the rotation shaft 2381 in the axial direction, and the other end is formed at the center of the center of the nozzle mounting reversing part 2382. It extends to a hollow path 2385 communicating with the nozzle mounting portion 2383 in a radial direction from one location of the tip. A nozzle N (FIG. 10) suitable for the component S to be sucked is replaceably attached to the nozzle mounting portion 2383.
[0080]
The rotating shaft 2381 is supported by two rotating bearings 2391 disposed within the nozzle bearing portion 239 at a predetermined interval.
[0081]
An arm floating mechanism corresponding to the arm floating mechanism in the component mounting apparatus 1A of the first embodiment is also provided in the component mounting apparatus 1B of the second embodiment. As shown in FIG. 9, it is formed on two rotary bearings 2391, a rotary hook 241 formed on one end surface of the rotary shaft 2381, and the same side end surface of the nozzle bearing portion 239. The fixed-side hook 242, a tension coil spring 243 that extends over the rotation-side hook 241 and the fixed-side hook 242, and a predetermined width on the inner peripheral surface of the nozzle bearing portion 239 on the side facing the tension coil spring 243. A concave stopper 2392 (FIG. 9A) formed, and a stopper pin 2386 (FIG. 9A) which is formed in the outer periphery of the rotating shaft 2381 and is inserted into the concave stopper 2392 and moves by a predetermined moving amount. It is composed of
[0082]
This arm floating mechanism also performs the same function as the arm floating mechanism in the component mounting apparatus 1A of the first embodiment. The function is that the stopper pin 2386 press-fitted into the rotating shaft 2381 is pulled by the coil spring 243 and the nozzle bearing portion. By pressing against the inner wall of the concave stopper 2392 of the 239, the rotating shaft 2381 and the nozzle bearing portion 239 are assembled so as to maintain the relative position when no load is applied, and when a load is applied to the action point of the component suction nozzle 238, The tension coil spring 243 flexes, and the arm floating function operates. The floating pressure can be freely set by selecting the tension coil spring 243.
[0083]
Next, the operation of the component mounting apparatus 1B according to the second embodiment will be described with reference to FIG.
[0084]
As shown in FIG. 10, when the turning motor unit 231 operates, the turning arm unit 232 turns around the turning shaft 2313 in a horizontal plane in a counterclockwise direction and a clockwise direction as shown by an arrow R. I do. When the nozzle N is in the state shown in the figure, it turns counterclockwise as indicated by the arrow R to the position where the tray T is present, and sucks one component S stored face up from the tray T. Then, the nozzle N is turned to the clockwise direction as shown by the arrow R to the position where the substrate P is present, and the nozzle N is face-down received by the bonding head 141 of the bonding apparatus 140 using ultrasonic waves as bonding means. hand over. Hereinafter, the mounting of the component S on the board P is the same as that of the component mounting apparatus 1A of the first embodiment, and thus will be omitted. Alternatively, the angle of the nozzle N moving away from the tray T and approaching the bonding head 141, and the angle at which the part S is delivered from the nozzle N to the bonding head 141 are shown in FIG. The states A, B, C, and D are the same, and a detailed description thereof will be omitted.
[0085]
As described above, the component mounting apparatus 1B of the present embodiment also controls the turning arm 232 by the turning motor unit 231 by teaching the series of operations to the computer built in the control device 80. Further, the reversal of the component suction nozzle 238 can be controlled by the rotation motor 233, and a series of operations of picking up the component S from the tray T and delivering the component S to the bonding head 141 can be realized.
[0086]
As is clear from the above description, a series of operations of picking up and delivering the component S can be realized by controlling the control unit with one rotation axis.
[0087]
【The invention's effect】
As is clear from the above description, the component mounting apparatus of the present invention
1. Since the number of axes is small, control becomes simple, and equipment can be manufactured at low cost.
2. The play during operation is reduced, the accuracy of the component suction section (pickup nozzle) is improved, and the handling of parts with non-contact areas such as
Can prevent strike and chipping
3. The backlash during operation is reduced, and the accuracy of component delivery is improved.
Processing at the center becomes possible, improving the joining position accuracy of parts
4. By matching the turning direction of the turning arm with the component transfer direction, it becomes possible to subtract twice the turning radius from the moving distance. As a result, the moving distance can be shortened, and the turning and moving can be performed. At the time of parts delivery operation because they are performed simultaneously
Can save time
5. By combining the rotary reversing shaft of the present invention with the rotary moving shaft, dust is generated only at the respective rotary sliding portions, dust can be easily sucked, and the device can be closed.
Can be leaned
Many excellent effects can be obtained.
[Brief description of the drawings]
FIG. 1 is a top view of a partial configuration of a component mounting apparatus according to a first embodiment of the present invention.
FIG. 2 is a top view of a component transfer device in the component mounting device shown in FIG. 1;
3 shows a component reversing device in the component transfer device shown in FIG. 2; FIG. 3A is a front view thereof, and FIG. 3B is a partial cross-sectional side view taken along line BB of FIG. .
FIG. 4 is an enlarged sectional view of the floating mechanism as viewed from an arrow C incorporated in the component reversing device shown in FIG. 3;
FIG. 5 is an operation explanatory view of the component mounting apparatus shown in FIG. 1;
FIG. 6 is a top view of a component transfer device in a component mounting device according to a second embodiment of the present invention.
7 is a partial cross-sectional side view of the component transfer device shown in FIG. 6 taken along line BB.
FIG. 8 is a front view as viewed from an arrow C shown in FIG. 7;
FIG. 9 is a cross-sectional side view of an arm floating mechanism incorporated in the turning arm unit.
FIG. 10 is an operation explanatory view of a component transfer device in the component mounting device according to the second embodiment of the present invention.
FIG. 11 is a top view of the component mounting apparatus of one embodiment of the prior application to which the present applicant has applied for a patent, as viewed from above.
FIG. 12 is a side view of the component mounting apparatus shown in FIG. 11, as viewed from an arrow A side.
FIG. 13 is a side view of the component mounting apparatus shown in FIG. 11 as viewed from an arrow B side.
FIG. 14 is an operation principle diagram of a component suction nozzle in the component transfer device.
[Explanation of symbols]
1A: Component mounting apparatus of the first embodiment of the present invention, 110: Base, 120: Tray device, 129: Stage, 130: Component transfer device, 131: X-axis rail, 133: Component reversing device, 135: X Shaft motor, 1331: reversing shaft, 1332: component suction arm, 1334: reversing motor, 1335: spindle, 1337: rotating shaft, 1338: rotating bearing, 1342, 243: tension coil spring, 1343: limit sensor, 140: bonding Device, 141: bonding head, 150: work stage device, 158: stage, 160: first camera device, 170: second camera device, 230: component transfer device in the component mounting device of the second embodiment of the present invention, 231, a turning motor unit, 2311, a turning motor, 2312, a frame, 2313, a rotating shaft 2314: Sleeve, 232: Revolving arm, 233: Rotating motor, 2332, 2361, 384: Hollow path, 234: Bracket, 235: Sleeve, 236: Rotating shaft, 237: Component suction unit, 238: Component suction nozzle .., 2381... Rotating shaft, 2382.

Claims (7)

A component supply unit in which a component to be mounted on a substrate is stored face-up, a substrate mounting unit that supports a substrate on which a component from the component supply unit is mounted at a predetermined position, and a component from the component supply unit. A component mounting unit that receives the component in a face-up state from the component supply unit, receiving the component in a predetermined position on a substrate supported by the substrate mounting unit; In a component mounting apparatus equipped with a component suction means for transferring a component sucked face down face down,
The component suction unit approaches slightly upward from the horizontal state until just before sucking the component housed in the component supply unit in a face-up state, and when the component suction unit sucks the component, the horizontal state is reached. It sucks upside down, approaches slightly downward from the horizontal state until just before being delivered to the component mounting means, and is controlled to be in a horizontal state when being delivered to the component mounting means, and the predetermined component is controlled. A component mounting method characterized by transferring. A component supply unit in which components to be mounted on the board are stored face up,
Board mounting means for supporting a board on which a component from the component supply means is mounted at a predetermined position;
Guide means extending in a horizontal state from the component supply means to the vicinity of the substrate mounting means,
Component mounting means located above the substrate mounting means, receiving the component from the component supply means face down, and mounting the component at a predetermined position on a substrate supported by the substrate mounting means;
A component suction unit that is guided by the guide unit and sucks a component housed in the component supply unit in a face-up state, and when sucking the component, inverts the component suction unit and transfers the component suction unit to the component mounting unit;
Until immediately before the component suction means guided by the guide means suctions a component housed in a face-up state in the component supply means, it approaches slightly upward from the horizontal state, and when sucking the component, It becomes a horizontal state, when the component is sucked, the component sucking means is inverted, approaching slightly downward from the horizontal state until just before being delivered to the component mounting means, and in a horizontal state when being delivered to the component mounting means. And a control unit for controlling the mounting of the component mounting apparatus. The component suction means,
A pivot axis,
A component suction arm mounted offset to the tip of the rotating shaft;
The component mounting apparatus according to claim 2, further comprising: a rotation motor configured to rotate the component suction arm. 4. The component mounting apparatus according to claim 3, wherein a floating mechanism is further incorporated in the component suction means. A component supply unit in which components to be mounted on the board are stored face up,
Board mounting means for supporting a board on which a component from the component supply means is mounted at a predetermined position;
Component mounting means located above the substrate mounting means, receiving the component from the component supply means face down, and mounting the component at a predetermined position on a substrate supported by the substrate mounting means;
A component suction unit that sucks a component housed in a face-up state in the component supply unit and, when the component is sucked, turns the component suction unit and simultaneously reverses the component suction unit, and transfers the component suction unit to the component mounting unit;
The component suction unit approaches slightly upward from the horizontal state until just before sucking the component housed in the component supply unit in a face-up state, and when the component suction unit sucks the component, the horizontal state is reached. Control means for inverting the component suction means when sucked, approaching slightly downward from the horizontal state until just before transferring to the component mounting means, and controlling to be in a horizontal state when transferring to the component mounting means; A component mounting apparatus characterized by comprising: The component suction means,
Swivel arm,
Component suction means attached to the tip of the turning arm;
A turning motor for turning the turning arm;
A rotation motor for rotating the component suction means,
The component mounting apparatus according to claim 5, wherein the turning motor is disposed at a position sufficiently below the turning arm. The component mounting apparatus according to claim 6, wherein a floating mechanism is further incorporated in the component suction means.

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