JP2004055414A - Method of manufacturing electron gun component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electron gun component mounted on an electric gun for a CRT, allowing the formation of the electron gun component to be fine in size and have various shapes with high dimension accuracy, and to provide the electron gun capable of controlling electrons with high accuracy. <P>SOLUTION: The method is provided for manufacturing an electron gun component having a penetrating opening and shaped such that there is a difference in a level between a plane having the opening and a surrounding plane. The method includes steps of: forming a first electroforming mold by photolithography or stereolithography for shaping the opening; forming a second electroforming mold for shaping the plane in which the opening is formed; forming an electroforming member having a shape to which the first electroforming mold and the second electroforming mold are transferred by electroforming; and removing the first and second electroforming molds from the electroforming member. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an electron gun component, and more particularly, to a method for manufacturing a fine and stepped electron gun component.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, there has been known a press working method in which electrodes of an electron gun used for a CRT or the like are formed by coining. However, in recent years, the demand for high resolution of CRT has been increased, and the accuracy of electrodes has also been required to be higher. In particular, the electrode near the electron lens is designed to be thinner and smaller in hole diameter.
[0003]
In such a situation, Japanese Patent Application Laid-Open No. H11-31455 discloses a method for improving the precision of an electrode by changing a conventional press working method. FIG. 4 is a view showing a conventional method of manufacturing an electron gun component disclosed in Japanese Patent Application Laid-Open No. 11-31455.
[0004]
According to this conventional manufacturing method, first, as shown in FIG. 4A, a plate-shaped base material made of, for example, a stainless steel plate is subjected to coining to manufacture a base material 1101 having a semi-thin portion 1112 formed thereon. In the step of FIG. 4A, the material of the processed portion of the base material 1101 flows only in the outer peripheral direction of the semi-thin portion 1112. As a result, a raised portion 1101A is formed along the outer periphery of the semi-thin portion 1112.
[0005]
In the process of FIG. 4A, a semi-thin portion 1112 thicker than the thin portion 1114 (shown in FIG. 4D) formed on the final electron gun component 1100 is formed. Is not large, and the work hardening can be suppressed to a small value. In this conventional manufacturing method, the thickness of the thin portion 1114 in the finishing stage is processed to be one third or less of the thickness of the electron gun component 1100, and the semi-thin portion 1112 is processed in the finishing stage. It is characterized in that it is formed with a plate thickness about twice that of 1114. For example, the thickness of the electron gun component 1100 is 0.2 mm to 0.4 mm, the thickness of the semi-thin portion 1112 is 0.10 mm to 0.20 mm, and the thickness of the thin portion 1114 is 0.07 mm to 0.15 mm. It was assumed that the size of the parts was large.
[0006]
Next, as shown in FIG. 4B, a pilot hole 1122 is formed in the center of the semi-thin portion 1112 of the base material 1101 by pressing to form a base material 1102. In the conventional example, the diameter of the pilot hole 1122 is processed to about 0.7 mm to 0.8 mm, and the pilot hole 1122 having a residual diameter of about 0.28 mm is formed by the process of FIG. Has been transformed. The diameter of the final finishing hole 1124 is assumed to be about 0.3 mm.
[0007]
Next, as shown in FIG. 4C, the semi-thin portion 1112 is coined to form a base material 1103 in which the semi-thin portion 1112 is transformed into a thin portion 1114. In this step, the material of the semi-thin portion 1112 flows in the center direction by the prepared hole 1122 and also flows in the outer peripheral direction of the thin portion 1114, so that it can be easily deformed. By this step, the prepared hole 1122 having a diameter of 0.7 to 0.8 mm is transformed into a prepared hole 1122 ′ having a diameter of 0.28 mm.
[0008]
Therefore, processing can be easily performed while suppressing the influence of work hardening, and a stable deformation state of the pilot hole 1122 can be obtained. Further, since the amount of processing from the semi-thin portion 1112 to the thin portion 1114 is small, the amount of deformation of the pilot hole 1122 is also small, and the remaining diameter can be effectively controlled.
[0009]
Thereafter, as shown in FIG. 4D, a finishing hole 1124 having a diameter of about 0.3 mm is formed in the thin portion 1114 by press working in a finishing hole working step.
[0010]
By the above-described press working method, an electron gun component 1100 having a thin portion 1114 having a thickness of about one third of the plate thickness and having a finished hole 1124 having a diameter of about 0.3 mm was manufactured. .
[0011]
[Problems to be solved by the invention]
In recent years, there has been a great demand for higher resolution of CRTs. Under such circumstances, an electron gun mounted on the CRT has to control electrons more accurately. In order to control electrons with high accuracy, it is necessary to form the electron gun parts in an optimum shape and high dimensional accuracy that match the required performance of the electron gun.
[0012]
In a conventional method for manufacturing an electron gun component, as disclosed in Japanese Patent Application Laid-Open No. 11-31455, the thickness of the electron gun component is 0.2 mm to 0.4 mm, and the thickness of the thin portion is 0.07 mm to 0 mm. .15 mm.
[0013]
Further, the diameter of the finished hole formed in the electron gun part is about 0.3 mm, and it is difficult to press a finer hole with high precision by the above-mentioned press working. Further, the precision can be formed only with a low precision having an error of at least ± 5 μm.
[0014]
Also, as can be seen from the above-mentioned dimensional restrictions on the thickness of the thin portion and the thickness of the thin portion, the thin portion formed on the electron gun part is about one third of the thickness of the electron gun component. Was the limit.
[0015]
SUMMARY OF THE INVENTION It is an object of the present invention to provide an electron gun component that can be formed in fine and various shapes, and that can be formed with high dimensional accuracy. It is to provide a manufacturing method. It is another object of the present invention to provide an electron gun capable of controlling electrons with high accuracy.
[0016]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a method for manufacturing an electron gun component according to the present invention is directed to a method for manufacturing an electron gun component having a penetrating opening and having a stepped shape around one of the planes where the opening is opened. So,
Forming a first electroforming mold to shape the shape of the opening,
Forming a second electroforming mold for shaping the shape of the flat part where the opening is opened,
A step of forming an electroformed member having a shape obtained by transferring the first electroforming mold and the second electroforming mold by electroforming,
Removing the first electroforming mold and the second electroforming mold from the electroformed member.
[0017]
Furthermore, it is desirable to form either one of the first and second electroforming molds or both the first and second electroforming molds with a photosensitive material.
[0018]
Furthermore, it is desirable to form either one of the first and second electroforming molds or both the first and second electroforming molds by a photolithography method.
[0019]
Alternatively, it is desirable that either one of the first and second electroforming molds, or both the first and second electroforming molds, be formed by stereolithography.
[0020]
Further, the electroformed member is formed of Ni, Cu, Co, Sn, Zn, Au, Pt, Ag or Pb, or an alloy containing Ni, Cu, Co, Sn, Zn, Au, Pt, Ag or Pb. It is desirable.
[0021]
(Action)
In the above-described means of the present invention, the first electroform in the shape of the opening, the second electroform in the shape of the opening forming surface is formed by photolithography or stereolithography to be very fine. In addition, the shape can be formed with high accuracy. As a fine shape that can be formed by this method, a shape of at least about 3 μm can be formed, and the precision is an accuracy of 1 μm or less.
[0022]
In this way, a fine and high-precision first electroforming mold and a second electroforming mold are formed, and the shapes of the first electroforming mold and the second electroforming mold are transferred and molded by the electroforming method, thereby obtaining a fine and high-precision. An electroformed member having the following shape can be formed. Generally, the transferability of the electroforming method is excellent enough to transfer a nanometer-level fine shape, and it is very easy to transfer the first electroforming mold and the second electroforming mold formed at the micron level. Further, the electroforming method has a feature that the thickness of the formed electroformed member can be arbitrarily determined by controlling the processing time of the electroforming method. The electroformed member can be formed with any thickness.
[0023]
After that, when the first electroformed mold in the shape of the opening and the second electroformed mold in the shape of the opening forming surface are removed from the electroformed member, the opening has a fine and high-precision opening, and the opening is opened. It is possible to manufacture an electron gun component made of an electroformed member having a shape in which the height of a given plane (opening forming surface) and the surrounding plane is different. Further, since the thickness can be controlled by the electroforming processing time as described above, an electron gun component having an arbitrary optimum thickness can be manufactured.
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION
(1st Embodiment)
FIG. 1 is a view showing a method for manufacturing an electron gun component of the present invention. Hereinafter, an electron having a stepped shape in which the height of a plane having an opening formed therein (hereinafter, referred to as an opening forming surface) and a surrounding plane is different from each other in the present invention. A method for manufacturing a gun component will be described. First, as shown in FIG. 1A, a first electroforming mold 200 made of a photosensitive material having a desired opening shape is formed on a conductive base 100.
[0025]
In the present embodiment, the conductive base 100 in which a copper (Cu) film having a thickness of 0.2 μm is formed on a polycarbonate plate having a thickness of 2 mm by a vapor deposition method is used. A thick-film resist (trade name: THB-130N) manufactured by JSR Corporation is patterned on the conductive base 100 into a cylindrical shape having a diameter of 100 μm and a height of 40 μm by a photolithography method widely used in an LSI field. Formed.
[0026]
Next, as shown in FIG. 1B, electroforming is performed while applying a current to the conductive base 100 to form the first electroformed member 11 with the same thickness as the desired thin portion. I do. In addition, the electroforming method is a method of forming a structure using a plating material deposited by an electroplating method, and is a method capable of transferring a very fine shape, and has recently attracted attention as one of fine processing methods. It is a processing method.
[0027]
In the present embodiment, the first electroformed member 11 made of nickel (Ni) is formed with a thickness of 40 μm by performing electroforming using a nickel (Ni) electroforming method. Since the electroforming method is a kind of the electroplating method as described above, the plating material grows only on the conductive portion. Therefore, the first electroformed member 11 is not formed on the first electroformed mold 200 made of a non-conductive (electrically insulating) thick film resist manufactured by JSR Corporation.
[0028]
Next, as shown in FIG. 1 (c), a second electroforming mold 210 having an opening forming surface shape is formed in accordance with the position of the first electroforming mold 200.
[0029]
In the present embodiment, similarly to the formation of the first electroforming mold 200, the second electroforming mold 210 is also formed by the photolithography method. In this embodiment, three layers of a thick film resist (trade name: THB-130N) manufactured by JSR Corporation are laminated and coated with a thickness of 120 μm, and then patterned by photolithography to obtain a 300 μm diameter and 120 μm height. A second electroforming mold 210 having a cylindrical shape was formed on the first electroforming mold 200.
[0030]
Thereafter, as shown in FIG. 1D, electroforming is performed by passing a current through the first electroformed member 11 to form the second electroformed member 12 in the future.
[0031]
In the present embodiment, the second electroformed member 12 made of nickel (Ni) is formed with a thickness of 120 μm by performing electroforming using a nickel (Ni) electroforming method. Also in this step, the electroforming is not performed on the non-conductive (insulating) second electroforming mold 210, and the second electroforming member 12 is formed only around the second electroforming mold 210. .
[0032]
Finally, as shown in FIG. 1 (e), the conductive base 100, the first electroformed mold 200, and the second electroformed mold 210 are removed, and the first electroformed member 11 and the second electroformed member 12 are laminated. Thus, the electron gun component 10 having the penetrating opening 1120 and the opening forming surface 1110 having a height different from the surrounding surface is completed.
[0033]
In the present embodiment, after the first electroforming mold 200 and the second electroforming mold 210 made of a thick film resist (THB-130N) are dissolved and removed by a stripping solution (trade name: THB-S2) dedicated to a thick film resist manufactured by JSR Corporation. Then, the conductive base 100 was peeled off from the electron gun component 10 to complete the electron gun component 10.
[0034]
In this way, the material is made of nickel (Ni), and the shape is such that the thickness of the opening forming surface 1110 is 40 μm (= 0.04 mm), the area of the opening forming surface 1110 is 300 μm (= 0.3 mm) in diameter. An opening 1120 having a diameter of 100 μm (= 0.1 mm) is formed in the center of the area of the opening forming surface 1110 so as to penetrate therethrough. Further, the opening forming surface 1110 and a plane (thick portion) around the opening are formed. Was 120 μm (= 0.12 mm), and the electron gun component 10 having a total plate thickness (thickness of the thick portion) of 160 μm (= 40 μm + 120 μm = 0.16 mm) could be manufactured.
[0035]
In the conventional method of manufacturing an electron gun component by a press working method, the thickness of the thin portion can be reduced to only about one third of the plate thickness of the electron gun component. According to the manufacturing method, a thin portion (opening forming surface) having a thickness of 40 μm can be formed with respect to the plate thickness (thickness of the thick portion) of 160 μm of the electron gun component, and the ratio is 4 minutes. In the case of No. 1, it was possible to process very thinly as compared with the related art.
[0036]
Further, according to the method for manufacturing an electron gun component of the present invention, an opening having a diameter of 0.3 mm or less, which could not be processed conventionally, could be formed. In this embodiment, an electron gun component having an opening with a diameter of 0.1 mm was manufactured. However, according to experiments performed by the present inventors, it has been confirmed that an opening having a diameter of 3 μm can be formed. . The shape of the opening does not necessarily have to be circular as in the present embodiment. In the present invention, it can be achieved even if the shape of the opening is an elongated slit shape, or even an elliptical shape or a polygonal shape (triangle, square, pentagon, etc.). In order to achieve such an irregular opening shape, a photolithography method is used in the step of forming the first electroforming mold 200 of the present invention, and the planar shape is a slit shape, an elliptical shape, a polygonal shape (triangle, square, pentagonal). Etc.) may be formed.
[0037]
Further, according to the method for manufacturing an electron gun component of the present invention, an electron gun component can be manufactured with very high accuracy. In the present embodiment, since the first electroform having the shape of the opening and the second electroform having the shape of the opening forming surface are formed by using the photolithography method used in the LSI field, They can be formed with dimensional accuracy of 1 μm or less. Furthermore, the transfer from the first electroforming mold and the second electroforming mold formed with such high precision to the electroformed member uses an electroforming method capable of transferring at higher precision and at the nanometer level. Therefore, the dimensional accuracy of the electron gun component, which is the final shape, can be assured as 1 μm or less.
[0038]
Further, in this embodiment, an electron gun component made of Ni is manufactured by using nickel (Ni) electroforming, but the electron gun component that can be manufactured by the present invention is not limited to Ni. Basically, any material that can be electroplated can use the manufacturing method of the present invention. Materials that can be electroplated in addition to Ni include, for example, copper (Cu), cobalt (Co), tin (Sn), zinc (Zn), gold (Au), platinum (Pt), silver (Ag), and lead. (Pb), and alloys containing Ni, Cu, Co, Sn, Zn, Au, Pt, Ag, and Pb.
[0039]
(Second embodiment)
In the manufacturing method of the electron gun of the present invention shown in FIG. 1, in the step of forming the first electroforming mold and the second electroforming mold, it is also possible to use a stereolithography method in addition to using the photolithography method. The stereolithography method is characterized in that the first and second electroforming molds can be formed thicker from the surface of the conductive base than the photolithography method. Parts can be manufactured.
[0040]
An embodiment using a stereolithography method will be described below. First, in the step of FIG. 1A, a photosensitive resin is patterned on a conductive base 100 made of a copper plate having a thickness of 2 mm by a stereolithography method in a cylindrical shape having a diameter of 300 μm and a height of 100 μm. An electroforming mold 200 was formed.
[0041]
Next, as shown in FIG. 1B, electroforming was performed using a nickel (Ni) electroforming method to form a first electroformed member 11 made of nickel (Ni) with a thickness of 100 μm.
[0042]
Further, as shown in FIG. 1C, a second electroforming mold 210 is formed in the shape of the opening forming surface in accordance with the position of the first electroforming mold 200. In the present embodiment, similarly to the formation of the first electroforming mold 200, the second electroforming mold 210 is also formed by stereolithography, and the second electroforming mold 210 having a cylindrical shape with a diameter of 800 μm and a height of 400 μm is attached to the first electroforming mold 210. It was formed on a mold 200.
[0043]
Thereafter, as shown in FIG. 1D, electroforming was performed using a nickel (Ni) electroforming method to form a second electroformed member 12 of nickel (Ni) with a thickness of 400 μm.
[0044]
Finally, as shown in FIG. 1 (e), the conductive base 100, the first electroformed mold 200, and the second electroformed mold 210 are removed, and the first electroformed member 11 and the second electroformed member 12 are laminated. Thus, an electron gun component 10 having a penetrating opening 1120 and an opening forming surface 1110 having a height different from the surrounding surface was completed.
[0045]
The electron gun component 10 completed in this way is made of nickel (Ni), and has a shape in which the thickness of the opening forming surface 1110 is 100 μm (= 0.1 mm) and the area of the opening forming surface 1110 has a diameter. An opening 1120 having a diameter of 300 μm (= 0.3 mm) is formed at 800 μm (= 0.8 mm) at the center of the area of the opening forming surface 1110. Further, the step between the opening forming surface 1110 and the surrounding plane (thick portion) is 400 μm (= 0.4 mm), and the plate thickness (thickness of the thick portion) is 500 μm (= 100 μm + 400 μm = 0.5 mm). We were able to.
[0046]
In the conventional method for manufacturing an electron gun component by a press working method, only an electron gun component having a thickness in the range of 0.2 mm to 0.4 mm could be manufactured. Was able to manufacture an electron gun part having a thickness of 0.5 mm. As described above, in the manufacturing method of the present invention, the electron gun component 10 having a larger plate thickness than the conventional one can be manufactured by using the stereolithography method in the process.
[0047]
In the present embodiment, both the first electroforming mold 200 and the second electroforming mold 210 are formed by stereolithography, but either one may be formed by stereolithography and the other may be formed by photolithography. I don't care. Various shapes can be formed by selectively using the feature that a thick shape can be formed by stereolithography and the feature that a fine shape can be formed by photolithography.
[0048]
(Third embodiment)
FIG. 2 is a view showing another method for manufacturing an electron gun component of the present invention. Another method of manufacturing an electron gun component having a penetrating opening according to the present invention and having a shape in which the height of a plane where the opening is formed (opening forming surface) and a plane around the opening is different. Will be described. First, as shown in FIG. 2A, a second electroforming mold 210 having a shape of an opening forming surface is formed on a base 110. In the present embodiment, the height of the second electroforming mold 210 is finally the difference (step) between the height of the opening forming surface of the electron gun component and the plane around it.
[0049]
In this embodiment, a thick film resist (trade name: THB-130N) manufactured by JSR Corporation is patterned into a columnar shape having a diameter of 300 μm and a height of 120 μm on a base 110 made of a polycarbonate plate having a thickness of 2 mm by photolithography. Thus, a second electroforming mold 210 was formed.
[0050]
Next, as shown in FIG. 2B, a conductive film 300 is formed on the base 110 and the second electroforming mold 210. In the present embodiment, a copper (Cu) film is formed to a thickness of 0.2 μm by an evaporation method.
[0051]
Next, as shown in FIG. 2C, a first electroforming mold 200 having an opening shape is formed on the conductive film 300 in accordance with the position of the second electroforming mold 210.
[0052]
In the present embodiment, similarly to the formation of the second electroforming mold 210, the first electroforming mold 200 is also formed by the photolithography method. In the present embodiment, a thick film resist (trade name: THB-130N) manufactured by JSR Co. is coated at a thickness of 40 μm, and then patterned by photolithography to form a cylindrical shape having a diameter of 100 μm and a height of 40 μm. The first electroforming mold 200 was formed.
[0053]
Thereafter, as shown in FIG. 2D, electroforming is performed while a current is applied to the conductive film 300, and the electroformed member 21 is formed on the conductive film 300.
[0054]
In the present embodiment, electroforming is performed using a nickel (Ni) electroforming method, and an electroformed member 21 made of nickel (Ni) is formed with a thickness of 30 μm. In this step, the electroforming is not performed on the non-conductive (insulating) first electroforming mold 200, and the electroforming member 21 is formed only around the first electroforming mold 200.
[0055]
Finally, as shown in FIG. 2 (e), the base 110, the first electroforming mold 200, and the second electroforming mold 210 were removed, and the electroformed member 21 and the conductive film 300 were laminated and penetrated. The electron gun component 20 having the opening 1120 and having a height different from the height of the opening forming surface 1110 and a plane around the opening is completed. In the present invention, the conductive film 300 does not necessarily need to be configured as a part of the electron gun component 20, but is removed from the electroformed member 21 by etching or the like, and the There is no problem even if it is manufactured.
[0056]
Thus, according to the present embodiment, the thickness of the opening forming surface 1110 is 30 μm (= 0.03 mm), the area of the opening forming surface 1110 has a diameter of 300 μm (= 0.3 mm), and the opening forming surface 1110 is formed. An opening 1120 having a diameter of 100 μm (= 0.1 mm) is penetrated at the center of the area of the surface 1110, and a step between the opening forming surface 1110 and the periphery is 120 μm (= 0.12 mm). The part 10 was able to be manufactured.
[0057]
In the conventional method for manufacturing an electron gun component by a press working method, an opening having a diameter of 0.3 mm or less could not be formed. We were able to.
[0058]
Further, in the conventional electron gun component, a thick portion and a thin portion are provided on a member to form a step, but in the present embodiment, a step shape is formed by providing a bent shape. According to experiments performed by the present inventors, even if the electron gun component has a step formed between the opening forming surface 1110 and a plane around the opening by providing a bent shape without providing a thick portion in this way, It has been confirmed that sufficient control of electrons can be performed and that it can serve as an electron gun component. Also in the electron gun component 20 of the present embodiment, it can be said that this is a very effective manufacturing method in that various shapes which could not be achieved conventionally can be achieved.
[0059]
Note that, also in the present embodiment shown in FIG. 2, in the step of forming the first electroforming mold 200 and the second electroforming mold 210, it is possible to use a stereolithography method. It can be easily inferred that when the stereolithography method is used, it is possible to achieve an electron gun part having a deep step.
[0060]
(Fourth embodiment)
FIG. 3 is a view showing another method of manufacturing the electron gun component of the present invention. Another manufacturing method of an electron gun component having a penetrating opening according to the present invention and having a shape in which the height of a plane (opening forming surface) formed with the opening and a plane around the opening is different. Will be described. First, as shown in FIG. 3A, a second electroforming mold 210 having a shape of an opening forming surface is formed on a conductive base 100.
[0061]
In the present embodiment, the conductive base 100 in which a copper (Cu) film having a thickness of 0.2 μm is formed on a polycarbonate plate having a thickness of 2 mm by a vapor deposition method is used. The second electroforming mold 210 was formed on the conductive base 100 by patterning a thick film resist (trade name: THB-130N) manufactured by JSR Corporation in a cylindrical shape having a diameter of 160 μm and a height of 100 μm by photolithography. .
[0062]
Next, as shown in FIG. 3B, the first electroforming mold 200 having an opening shape is formed in accordance with the position of the second electroforming mold 210.
[0063]
In the present embodiment, similarly to the formation of the second electroforming mold 210, the first electroforming mold 200 is also formed by the photolithography method. In the present embodiment, a thick-film resist (trade name: THB-130N) manufactured by JSR Co. is coated at a thickness of 50 μm, and then patterned by photolithography, thereby forming a cylindrical shape having a diameter of 100 μm and a height of 50 μm. The first electroforming mold 200 was formed on the second electroforming mold 210.
[0064]
Thereafter, as shown in FIG. 3C, electroforming is performed by passing a current through the conductive base 100 to form an electroformed member 31.
[0065]
In the present embodiment, the electroforming member 31 is formed by performing electroforming with a thickness of 140 μm by using a nickel (Ni) electroforming method. In this step, the electroformed member 31 made of Ni first starts plating growth from the conductive base 100, but when its thickness exceeds 100 μm, it grows over the second electroforming mold 210 and starts growing. . This is because plating growth is isotropic. Thereafter, the electroformed member 31 is formed so as to surround the first electroforming mold 200.
[0066]
Finally, as shown in FIG. 3 (d), the conductive base 100, the first electroforming mold 200, and the second electroforming mold 210 are removed to have a penetrating opening 1120, and further have an opening forming surface 1110. An electron gun component 30 made of an electroformed member 31 having a different height from the surrounding plane is completed.
[0067]
Thus, according to the present embodiment, the opening 1120 having a diameter of 100 μm (= 0.1 mm) is penetrated at the center of the opening forming surface 1110 having a diameter of 160 μm (= 0.16 mm). The electron gun component 30 in which the step between the portion forming surface 1110 and the periphery was 100 μm (= 0.10 mm) could be manufactured.
[0068]
In the conventional method for manufacturing an electron gun component by a press working method, an opening having a diameter of 0.3 mm or less could not be formed. We were able to.
[0069]
【The invention's effect】
As described above, in the method for manufacturing an electron gun component according to the present invention, the first and second fine electroforming molds are formed by photolithography or stereolithography. By transferring and molding an electroformed member from an electroforming mold, an electron gun component having a shape that could not be manufactured conventionally was achieved.
[0070]
That is, according to the method for manufacturing an electron gun component of the present invention, an electron gun component mounted on an electron gun for a CRT can be formed in fine and various shapes, and formed with high dimensional accuracy. You can now. As a result, a shape capable of controlling electrons with high precision was achieved, and an electron gun capable of controlling electrons with high precision was achieved.
[Brief description of the drawings]
FIG. 1 is a view showing a method for manufacturing an electron gun component of the present invention.
FIG. 2 is a view showing another method for manufacturing an electron gun component of the present invention.
FIG. 3 is a view showing still another method of manufacturing the electron gun component of the present invention.
FIG. 4 is a view showing a conventional method for manufacturing an electron gun component.
[Explanation of symbols]
10, 20, 30 electron gun parts
11 First electroformed member
12 Second electroformed member
21 Electroformed parts
100 conductive base
110 base
200 first mold
210 Second mold
300 conductive film
1100 electron gun parts
1110 Opening forming surface
1112 Semi-thin part
1114 Thin part
1120 opening
1122 pilot hole
1124 Finishing hole
1101, 1102, 1103 Base material
1101A climax part

Claims (5)

A method of manufacturing an electron gun component having a penetrating opening and having a stepped shape around one of the planes where the opening is opened,
Forming a first electroforming mold for shaping the shape of the opening,
Forming a second electroforming mold for shaping the shape of the one flat portion where the opening is opened;
A step of forming an electroformed member having a shape obtained by transferring the first electroforming mold and the second electroforming mold by electroforming,
Removing the first electroforming mold and the second electroforming mold from the electroformed member. The electron according to claim 1, wherein one of the first and second electroforming molds, or both the first and second electroforming molds are formed of a photosensitive material. How to make gun parts. 3. The method according to claim 1, wherein one of the first electroforming mold and the second electroforming mold, or both the first electroforming mold and the second electroforming mold are formed by a photolithography method. 3. The method for manufacturing an electron gun component according to claim 1. 3. The method according to claim 1, wherein one of the first and second electroforming molds, or both the first and second electroforming molds, are formed by stereolithography. 3. The method for manufacturing an electron gun component according to claim 1. The electroformed member is formed of Ni, Cu, Co, Sn, Zn, Au, Pt, Ag or Pb, or an alloy containing Ni, Cu, Co, Sn, Zn, Au, Pt, Ag or Pb. The method for manufacturing an electron gun component according to any one of claims 1 to 4, wherein

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