[go: up one dir, main page]

JP2004055369A - Surface mount type airtight terminal and method of manufacturing the same - Google Patents

Surface mount type airtight terminal and method of manufacturing the same Download PDF

Info

Publication number
JP2004055369A
JP2004055369A JP2002212022A JP2002212022A JP2004055369A JP 2004055369 A JP2004055369 A JP 2004055369A JP 2002212022 A JP2002212022 A JP 2002212022A JP 2002212022 A JP2002212022 A JP 2002212022A JP 2004055369 A JP2004055369 A JP 2004055369A
Authority
JP
Japan
Prior art keywords
terminal
lead terminal
base
lead
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002212022A
Other languages
Japanese (ja)
Inventor
Hiroshi Nakai
博 中井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2002212022A priority Critical patent/JP2004055369A/en
Publication of JP2004055369A publication Critical patent/JP2004055369A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that, in a conventional structure, it is needed to apply a secondary process such as formation of a lead terminal 2 by brazing or welding an electrode terminal 6, a parallel terminal 5 and a supporter 10 to one another. <P>SOLUTION: This surface-mounted airtight terminal is so structured that a lead terminal sealing part sealed by an insulating member is biased in either direction in the base long body direction, and both ends of the lead terminal is formed by bending them in parallel with the base bottom surface. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、表面実装型気密端子およびその製造方法に関する。
【0002】
【従来の技術】
従来から、水晶振動子は周波数および時間の基準源として、様々な電子機器に用いられている。最近では、ダイオードやコンデンサなどの電子部品同様に、小型化および表面実装化が要求され、例えば、特開平8−31481号公報に開示された構成をとった表面実装型気密端子が提案されている。
【0003】
図4は従来の表面実装型気密端子の長手方向の中心線に沿った断面図であり、101は箱状に形成された金属ベース、102は金属ベース101の底部、103は底部102に形成されたリード端子貫通孔、104はリード端子、105はリード端子104の直立端子、106はリード端子の平行端子、107は金属ベース101の内側に構成される気密空間、108は圧電素子、109は圧電素子を保持するサポータ、110は封着ガラス、111は金属ベース101に固着封止される蓋体、112は金属ベース101と蓋体111とを接着する低融点ガラスである。
【0004】
詳細な構成を下記に説明する。FeおよびFe系合金からなる金属ベース101の底部102にリード端子貫通孔103が設けられ、リード端子104は、直立端子105と平行端子106とよりなる二分割構造になっており、直立端子105および平行端子106ならびにサポータ109は所定箇所で、例えばろう付け、溶接などにより接合されている。リード端子貫通孔103に直立端子105と平行端子106よりなるリード端子104を金属ベース101の内側で構成される気密空間107に貫通するように挿通すると共に、封着ガラス110で封着され、圧電素子108が気密空間107に装着された後、蓋体111が接着され圧電素子108が封入されている。このとき、金属ベース101およびリード端子104の直立端子105および平行端子106ならびにサポータ109は封着ガラス110により、絶縁されている。
【0005】
【発明が解決しようとする課題】
上記従来の構成では、リード端子104を二分割構造とすることでリード端子104の設計自由度が増すことが考えられるが、金属ベース101とリード端子104とを封着ガラス110で封着した後、直立端子105および平行端子106ならびにサポータ109とをろう付けまたは溶接し、リード端子104を形成するなど、二次加工を施す必要がある。
【0006】
本発明は、上記問題を解決するものであり、金属ベース101とリード端子104とを封着ガラス110で封着後に、二次加工を施すことなく信頼性が高い表面実装型気密端子およびその製造方法を提供することを目的とする。
【0007】
【課題を解決するための手段】
上記課題を解決するために本発明による表面実装型気密端子は、金属板材からなるリード端子を挿通する貫通孔が形成されたベース、ベースとリード端子とを封着する絶縁部材、ベースを覆うように気密封止する蓋体からなり、リード端子の両端がベース底面と水平方向に曲げ加工されたものである。
【0008】
これによれば、絶縁部材により封着される前に、リード端子に予め曲げ加工が施されており、リード端子封着後にサポータおよび平行端子の二次加工を施す必要が無い。また、リード端子封着部が、ベース長胴方向に偏倚しており、サポータおよび平行端子の面積を大きく確保することが出来る。
【0009】
次に、本発明の製造方法は、貫通孔が形成されたベースにリード端子を挿通する工程と、前記貫通孔に絶縁部材を挿入する工程と、前記ベースと前記リード端子を前記絶縁部材を介して封着する工程とを有し、さらに、曲げ加工したリード端子を挿通する工程とを有し、絶縁部材を孔無し形状に形成したものである。
【0010】
これによれば、絶縁部材で封着した後、サポータおよび平行端子を形成する二次加工を必要とすることが無く、封着部にろう付け、溶接などによる、機械的衝撃および熱的衝撃などの外部応力を防ぐものである。
【0011】
【発明の実施の形態】
以下、本発明の一実施形態について図面を参照しながら説明する。図1(a)は本発明に係る表面実装型気密端子を示した上面図であって、図1(b)は図1(a)の断面図を示したものである。図1(a)、図1(b)において、1はFeまたはFe系合金などの金属板材からなる金属ベース、2はFe−Ni−Co合金などの金属板に予め折り曲げ加工が施されたリード端子、3は金属ベース1に形成されたリード端子2を挿通するために形成された貫通孔、4は金属ベース1と貫通孔3に挿通されたリード端子2を気密的、絶縁的に封着する絶縁部材として例えば、硼珪酸ガラスからなる封着ガラス、5は金属ベース1から外側に露出したリード端子2の一方端である平行端子、6は金属ベース1から内側に露出したリード端子2の一方端である電極端子、7は圧電素子、8は金属ベース1を覆う蓋体、9は封着部である。
【0012】
金属ベース1に形成された貫通孔3に、Fe−Ni−Co合金などの金属板に予め曲げ加工を施したリード端子2を挿通し、封着ガラス4で金属ベース1とリード端子2とを貫通孔3で気密的、絶縁的に封着している。このとき、貫通孔3で封着されているリード端子2の封着部9が、ベース長胴方向に偏倚している点が従来例と異なる。図1(b)に示した様に、金属ベース1にリード端子2を封着ガラス4を介して封着する際に、リード端子2の封着部9を金属ベース1の長胴方向に偏倚するよう形成している。これにより、外部基板との実装に用いられる平行端子5およびサポータ10として用いられる電極端子6の面積を大きく確保することができ、外部基板との実装が安定し、また、サポータ10に接続される電子部品、例えば圧電素子7との接続が安定すると共に、面積を大きく確保し、電極端子6がサポータとしての役割を果たすものである。次に、表面実装型気密端子の製造方法の実施形態の工程を示した上面図である図2とその断面図である図3を用いて説明する。FeまたはFe系合金などの金属板材からなる金属ベース1に形成した貫通孔3に、Fe−Ni−Co合金などの金属板に予め曲げ加工を施したリード端子2および孔無し形状に形成した封着ガラス4を挿通する(図2(a)、図3(a))。次に、900〜1000℃の高温で封着ガラス4を溶融させた後、冷却し、金属ベース1とリード端子2とを封着ガラス4を介して接着する(図2(b)、図3(b))。次に、適宜、NiやAuなどの機能めっきを施し、電極端子6に形成したサポータ10に圧電素子7を接着する(図2(c)、図3(c))。次に、金属ベース1および蓋体8をろう付けまたは溶接する(図2(d)、図3(d))。これにより、リード端子2の両端を予め曲げ加工を施すことが出来、リード端子2封着後に平行端子5および電極端子6をろう付けや溶接し取り付けるなど、リード端子2に二次加工を施す必要が無くなる。さらに、封着ガラス4を孔無し形状とすることで、リード端子2の形状を自由に設定することが出来る。
【0013】
以上、本発明による表面実装型気密端子とその製造方法の一実施形態について説明したが本発明の思想に逸脱しない限り適宜変更可能である。
【0014】
【発明の効果】
以上説明したように本発明の表面実装型気密端子によれば、金属ベース1にリード端子2を封着ガラスを介して封着する際に、リード端子2の封着部を金属ベース1の長胴方向に偏倚するよう形成している。これにより、外部基板との実装に用いられる平行端子5およびサポータとして用いられる電極端子6の面積を大きく確保することができ、外部基板との実装が安定し、また、サポータに接続される電子部品、例えば圧電素子との接続が安定すると共に、面積を大きく確保し、電極端子6がサポータとしての役割を果たすことができる。
【0015】
また、本発明の製造方法によれば、リード端子2封着後に平行端子5および電極端子6をろう付けや溶接し取り付けるなど、リード端子2に二次加工を施す必要が無くなる。さらに、封着ガラス4を孔無し形状とすることで、リード端子2の形状を自由に設定することが出来る。
【図面の簡単な説明】
【図1】本発明の一実施形態による表面実装型気密端子を示すもので、
(a)は上面図
(b)は断面図
【図2】本発明の一実施形態による表面実装型気密端子の製造工程フローに沿った上面図
【図3】本発明の一実施形態による表面実装型気密端子の製造工程フローに沿った断面図
【図4】従来例の断面図
【符号の説明】
1 金属ベース
2 リード端子
3 貫通孔
4 封着ガラス
5 平行端子
6 電極端子
7 圧電素子
8 蓋体
9 封着部
10 サポータ
101 金属ベース
102 底部
103 貫通孔
104 リード端子
105 直立端子
106 平行端子
107 気密空間
108 圧電素子
109 サポータ
110 封着ガラス
111 蓋体
112 低融点ガラス
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a surface-mounted airtight terminal and a method for manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, quartz resonators have been used in various electronic devices as frequency and time reference sources. Recently, as with electronic components such as diodes and capacitors, miniaturization and surface mounting have been required. For example, a surface mounting type airtight terminal having a configuration disclosed in Japanese Patent Application Laid-Open No. 8-31481 has been proposed. .
[0003]
FIG. 4 is a cross-sectional view taken along a longitudinal center line of a conventional surface mount type hermetic terminal, where 101 is a metal base formed in a box shape, 102 is the bottom of the metal base 101, and 103 is formed on the bottom 102. Lead terminal through hole, 104 is a lead terminal, 105 is an upright terminal of the lead terminal 104, 106 is a parallel terminal of the lead terminal, 107 is an airtight space formed inside the metal base 101, 108 is a piezoelectric element, and 109 is a piezoelectric element. A supporter for holding the element, 110 is sealing glass, 111 is a lid fixed and sealed to the metal base 101, and 112 is a low-melting glass for bonding the metal base 101 and the lid 111.
[0004]
The detailed configuration will be described below. A lead terminal through hole 103 is provided in a bottom portion 102 of a metal base 101 made of Fe and an Fe-based alloy, and the lead terminal 104 has a two-part structure including an upright terminal 105 and a parallel terminal 106. The parallel terminal 106 and the supporter 109 are joined at predetermined locations by, for example, brazing, welding, or the like. A lead terminal 104 composed of an upright terminal 105 and a parallel terminal 106 is inserted through the lead terminal through hole 103 so as to penetrate an airtight space 107 formed inside the metal base 101, and is sealed with a sealing glass 110 to form a piezoelectric element. After the element 108 is mounted in the airtight space 107, the lid 111 is adhered and the piezoelectric element 108 is sealed. At this time, the metal base 101, the upright terminal 105 and the parallel terminal 106 of the lead terminal 104, and the supporter 109 are insulated by the sealing glass 110.
[0005]
[Problems to be solved by the invention]
In the above-described conventional configuration, it is conceivable that the degree of freedom in designing the lead terminal 104 may be increased by forming the lead terminal 104 into a two-part structure, but after the metal base 101 and the lead terminal 104 are sealed with the sealing glass 110, It is necessary to perform secondary processing such as brazing or welding the upright terminal 105, the parallel terminal 106, and the supporter 109 to form the lead terminal 104.
[0006]
The present invention solves the above-described problem. After sealing a metal base 101 and a lead terminal 104 with a sealing glass 110, a highly reliable surface mount type airtight terminal without performing secondary processing, and manufacturing thereof. The aim is to provide a method.
[0007]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a surface-mounted hermetic terminal according to the present invention has a base formed with a through-hole through which a lead terminal made of a metal plate is inserted, an insulating member for sealing the base and the lead terminal, and a cover for the base. In this case, both ends of the lead terminal are bent horizontally with respect to the bottom surface of the base.
[0008]
According to this, the lead terminals are preliminarily bent before being sealed by the insulating member, and there is no need to perform secondary processing of the supporter and the parallel terminals after the lead terminals are sealed. Further, the lead terminal sealing portion is deviated in the direction of the base body, so that the supporter and the parallel terminal can have a large area.
[0009]
Next, the manufacturing method of the present invention includes a step of inserting a lead terminal into a base having a through-hole formed therein, a step of inserting an insulating member into the through-hole, and a step of connecting the base and the lead terminal through the insulating member. And a step of inserting a bent lead terminal. The insulating member is formed in a shape without holes.
[0010]
According to this, after sealing with an insulating member, there is no need for secondary processing for forming a supporter and a parallel terminal, and mechanical and thermal shocks due to brazing, welding, etc. to the sealing portion. To prevent external stress.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a top view showing a surface-mounted hermetic terminal according to the present invention, and FIG. 1B is a cross-sectional view of FIG. 1A. 1A and 1B, reference numeral 1 denotes a metal base made of a metal plate material such as Fe or an Fe-based alloy, and 2 denotes a lead obtained by bending a metal plate such as an Fe-Ni-Co alloy in advance. Terminals 3 are through holes formed for inserting lead terminals 2 formed in the metal base 1, and 4 are airtightly and insulatively sealed between the metal base 1 and the lead terminals 2 inserted in the through holes 3. For example, sealing glass made of borosilicate glass, 5 is a parallel terminal which is one end of the lead terminal 2 exposed to the outside from the metal base 1, and 6 is a lead terminal 2 exposed to the inside from the metal base 1. One end is an electrode terminal, 7 is a piezoelectric element, 8 is a cover for covering the metal base 1, and 9 is a sealing portion.
[0012]
A lead terminal 2 formed by bending a metal plate such as an Fe—Ni—Co alloy in advance is inserted into a through hole 3 formed in the metal base 1, and the metal base 1 and the lead terminal 2 are sealed with sealing glass 4. Airtight and insulating sealing is performed with the through hole 3. At this time, the point different from the conventional example is that the sealing portion 9 of the lead terminal 2 sealed by the through hole 3 is deviated in the base long body direction. As shown in FIG. 1B, when the lead terminal 2 is sealed to the metal base 1 via the sealing glass 4, the sealing portion 9 of the lead terminal 2 is displaced in the longitudinal direction of the metal base 1. It is formed so that. Thereby, the area of the parallel terminal 5 used for mounting on the external substrate and the area of the electrode terminal 6 used as the supporter 10 can be secured large, the mounting on the external substrate is stabilized, and the connection to the supporter 10 is made. The connection with the electronic component, for example, the piezoelectric element 7 is stabilized, and a large area is secured. The electrode terminal 6 plays a role as a supporter. Next, description will be made with reference to FIG. 2 which is a top view and FIG. 3 which is a cross-sectional view showing the steps of the embodiment of the method for manufacturing a surface-mounted hermetic terminal. A through hole 3 formed in a metal base 1 made of a metal plate material such as Fe or an Fe-based alloy has a lead terminal 2 formed by bending a metal plate such as an Fe-Ni-Co alloy in advance, and a sealing formed in a holeless shape. The glass 4 is inserted (FIGS. 2A and 3A). Next, after melting the sealing glass 4 at a high temperature of 900 to 1000 ° C., the sealing glass 4 is cooled, and the metal base 1 and the lead terminal 2 are bonded via the sealing glass 4 (FIG. 2B, FIG. 3). (B)). Next, a functional plating such as Ni or Au is appropriately performed, and the piezoelectric element 7 is bonded to the supporter 10 formed on the electrode terminal 6 (FIGS. 2C and 3C). Next, the metal base 1 and the lid 8 are brazed or welded (FIGS. 2D and 3D). Accordingly, both ends of the lead terminal 2 can be bent in advance, and the lead terminal 2 needs to be subjected to secondary processing such as brazing or welding the parallel terminal 5 and the electrode terminal 6 after sealing the lead terminal 2. Disappears. Furthermore, by making the sealing glass 4 into a shape without holes, the shape of the lead terminal 2 can be freely set.
[0013]
As described above, one embodiment of the surface-mounted hermetic terminal and the method of manufacturing the same according to the present invention have been described. However, the terminal can be appropriately changed without departing from the spirit of the present invention.
[0014]
【The invention's effect】
As described above, according to the surface mount type airtight terminal of the present invention, when the lead terminal 2 is sealed to the metal base 1 via the sealing glass, the sealing portion of the lead terminal 2 is fixed to the length of the metal base 1. It is formed so as to be deviated in the trunk direction. Thereby, the area of the parallel terminal 5 used for mounting on the external substrate and the area of the electrode terminal 6 used as the supporter can be secured large, the mounting on the external substrate is stabilized, and the electronic components connected to the supporter can be secured. For example, the connection with the piezoelectric element is stabilized, and a large area is secured, so that the electrode terminal 6 can serve as a supporter.
[0015]
Further, according to the manufacturing method of the present invention, it is not necessary to perform secondary processing on the lead terminal 2 such as brazing or welding the parallel terminal 5 and the electrode terminal 6 after the lead terminal 2 is sealed. Furthermore, by making the sealing glass 4 into a shape without holes, the shape of the lead terminal 2 can be freely set.
[Brief description of the drawings]
FIG. 1 shows a surface-mounted hermetic terminal according to an embodiment of the present invention.
FIG. 2A is a top view, and FIG. 2B is a cross-sectional view. FIG. 2 is a top view along a manufacturing process flow of a surface-mounted hermetic terminal according to an embodiment of the present invention. FIG. Sectional view along the manufacturing process flow of the mold airtight terminal [Figure 4] Sectional view of conventional example [Description of reference numerals]
REFERENCE SIGNS LIST 1 metal base 2 lead terminal 3 through hole 4 sealing glass 5 parallel terminal 6 electrode terminal 7 piezoelectric element 8 lid 9 sealing portion 10 supporter 101 metal base 102 bottom 103 through hole 104 lead terminal 105 upright terminal 106 parallel terminal 107 airtight Space 108 piezoelectric element 109 supporter 110 sealing glass 111 lid 112 low melting glass

Claims (6)

金属板材からなるリード端子を挿通する貫通孔が形成されたベースと、前記ベースと前記リード端子とを封着する絶縁部材と、前記ベースを覆うように気密封止する蓋体からなり、前記リード端子の両端が前記ベース底面と水平方向に曲げ加工されてなることを特徴とする表面実装型気密端子。A base formed with a through-hole through which a lead terminal made of a metal plate is inserted, an insulating member for sealing the base and the lead terminal, and a lid hermetically sealed to cover the base; A surface-mounted airtight terminal, wherein both ends of the terminal are bent in a horizontal direction with respect to the bottom surface of the base. 前記リード端子の蓋体が被う一方端が内部端子で、前記内部端子の反対端が外部端子であり、前記内部端子の先端および前記外部端子の先端のいずれか一方の先端または両方の先端が前記リード端子封着部外径より大きく形成されてなることを特徴とする請求項1記載の表面実装型気密端子。One end covered by the lid of the lead terminal is an internal terminal, the opposite end of the internal terminal is an external terminal, and either one or both ends of the internal terminal and the external terminal have an end. 2. The surface mount type airtight terminal according to claim 1, wherein the terminal is formed to be larger than the outer diameter of the lead terminal sealing portion. 前記絶縁部材で封着された前記リード端子封着部が、前記貫通孔内で偏倚されてなることを特徴とする請求項1または2記載の表面実装型気密端子。The surface-mounted airtight terminal according to claim 1, wherein the lead terminal sealing portion sealed with the insulating member is biased in the through hole. 貫通孔が形成されたベースにリード端子を挿通する工程と、前記貫通孔に絶縁部材を挿入する工程と、前記ベースと前記リード端子を前記絶縁部材を介して封着する工程とを有することを特徴とする表面実装型気密端子の製造方法。A step of inserting a lead terminal into a base having a through hole, a step of inserting an insulating member into the through hole, and a step of sealing the base and the lead terminal via the insulating member. Characteristic method of manufacturing surface-mounted airtight terminals. 貫通孔が形成されたベースに曲げ加工したリード端子を挿通する工程と、前記貫通孔に絶縁部材を挿入する工程と、前記ベースと前記リード端子を前記絶縁部材を介して封着する工程とを有することを特徴とする表面実装型気密端子の製造方法。Inserting a bent lead terminal into a base having a through-hole formed therein, inserting an insulating member into the through-hole, and sealing the base and the lead terminal through the insulating member. A method for manufacturing a surface-mounted airtight terminal, comprising: 前記絶縁部材にリード端子を挿通する貫通孔が未形成であることを特徴とした請求項5記載の表面実装型気密端子の製造方法。6. The method according to claim 5, wherein a through hole through which the lead terminal is inserted is not formed in the insulating member.
JP2002212022A 2002-07-22 2002-07-22 Surface mount type airtight terminal and method of manufacturing the same Pending JP2004055369A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002212022A JP2004055369A (en) 2002-07-22 2002-07-22 Surface mount type airtight terminal and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002212022A JP2004055369A (en) 2002-07-22 2002-07-22 Surface mount type airtight terminal and method of manufacturing the same

Publications (1)

Publication Number Publication Date
JP2004055369A true JP2004055369A (en) 2004-02-19

Family

ID=31935063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002212022A Pending JP2004055369A (en) 2002-07-22 2002-07-22 Surface mount type airtight terminal and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP2004055369A (en)

Similar Documents

Publication Publication Date Title
CN100388622C (en) Piezoelectric oscillator and shell enclosed piezoelectric oscillator assembly
JP2002319838A (en) Piezoelectric device and its package
JP2001196488A (en) Electronic component device and manufacturing method thereof
JP4010293B2 (en) Metal package manufacturing method
JP2003218265A (en) Electronic component container
KR100537263B1 (en) Surface mounting package
JP2003124382A (en) Thin metal package and method of manufacturing the same
JP2004055369A (en) Surface mount type airtight terminal and method of manufacturing the same
US20060012269A1 (en) Quartz crystal unit and holding structure for same
JP4380419B2 (en) Manufacturing method of electronic device
JP2015122413A (en) Package and manufacturing method of the same
JP2004055370A (en) Surface mount type airtight terminals
JP4893296B2 (en) Piezoelectric vibration device
JP5026016B2 (en) Method for manufacturing piezoelectric device
JP2004248113A (en) Package structure of piezoelectric device and method of manufacturing piezoelectric device
JP2009060260A (en) Electronic component package and piezoelectric vibration device using the same
JP2003297453A (en) Surface mount type hermetic terminal and crystal oscillator using it
JPH0645022A (en) Surface mounting type air-tight sealing terminal
JP2002217645A (en) Surface mount type piezoelectric oscillator
JPH0878955A (en) Surface mount piezoelectric oscillator and manufacturing method thereof
JP2006156558A (en) Multi-circuit board, electronic component storage package and electronic device
JP2000134054A (en) Airtight container for piezoelectric body
JPS6036898Y2 (en) Cage for crystal unit
JP3053662U (en) Hermetically sealed packaging structure of die
JPH03171915A (en) Oscillator device for surface mounting

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040406

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20050707

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070409

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070417

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070528

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070717