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JP2004050513A - Bonding method between resin films - Google Patents

Bonding method between resin films Download PDF

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Publication number
JP2004050513A
JP2004050513A JP2002208684A JP2002208684A JP2004050513A JP 2004050513 A JP2004050513 A JP 2004050513A JP 2002208684 A JP2002208684 A JP 2002208684A JP 2002208684 A JP2002208684 A JP 2002208684A JP 2004050513 A JP2004050513 A JP 2004050513A
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JP
Japan
Prior art keywords
laser
resin film
resin
pressing plate
resin films
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002208684A
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Japanese (ja)
Inventor
Hiromi Suhara
栖原　広美
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Fine Device Co Ltd
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Fine Device Co Ltd
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Publication date
Application filed by Fine Device Co Ltd filed Critical Fine Device Co Ltd
Priority to JP2002208684A priority Critical patent/JP2004050513A/en
Publication of JP2004050513A publication Critical patent/JP2004050513A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
    • B29C65/245—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool the heat transfer being achieved contactless, e.g. by radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being non-straight, e.g. forming non-closed contours
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8122—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the composition of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81266—Optical properties, e.g. transparency, reflectivity
    • B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/836—Moving relative to and tangentially to the parts to be joined, e.g. transversely to the displacement of the parts to be joined, e.g. using a X-Y table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/009—Using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • B29C65/1661—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined scanning repeatedly, e.g. quasi-simultaneous laser welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/004—Preventing sticking together, e.g. of some areas of the parts to be joined
    • B29C66/0042—Preventing sticking together, e.g. of some areas of the parts to be joined of the joining tool and the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/84—Specific machine types or machines suitable for specific applications
    • B29C66/863—Robotised, e.g. mounted on a robot arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2909/00—Use of inorganic materials not provided for in groups B29K2803/00 - B29K2807/00, as mould material
    • B29K2909/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • B29K2995/0027—Transparent for light outside the visible spectrum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/712—Containers; Packaging elements or accessories, Packages
    • B29L2031/7128—Bags, sacks, sachets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/712—Containers; Packaging elements or accessories, Packages
    • B29L2031/7128—Bags, sacks, sachets
    • B29L2031/7129—Bags, sacks, sachets open

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laser Beam Processing (AREA)

Abstract

【課題】接合対象や接合パターンに対応した金型を用いることなくフィルム状の樹脂材同士を接合でき、したがってコストを低減したり、接合条件の変更に柔軟に対応することが可能な接合方法の実現。
【解決手段】レーザ吸収板１０の表面に、レーザに対する透過性を備えた第１の樹脂フィルム１２及び第２の樹脂フィルム１４を積層配置させる工程と、両樹脂フィルム１２，１４の表面にレーザに対する透過性を備えた押圧板１６を被せる工程と、押圧板１６の表面にレーザビームＬを照射してレーザ吸収板１０を加熱し、その伝導熱によって両樹脂フィルム１２，１４間を溶着させる工程とを備えた接合方法。
【選択図】　　　　図１The present invention relates to a bonding method capable of bonding film-shaped resin materials without using a mold corresponding to a bonding target and a bonding pattern, and thus reducing costs and flexibly responding to changes in bonding conditions. Realization.
A step of laminating and arranging a first resin film 12 and a second resin film 14 having laser transmission properties on the surface of a laser absorbing plate 10; A step of covering the pressing plate 16 having transparency, a step of irradiating the surface of the pressing plate 16 with the laser beam L to heat the laser absorbing plate 10 and welding the two resin films 12 and 14 by the conduction heat; A joining method comprising:
[Selection] Figure 1

Description

【０００１】
【発明の属する技術分野】
この発明は樹脂フィルム間の接合方法に係り、特に、積層配置された樹脂フィルムにレーザビームを照射することよって、各樹脂フィルム間を溶着させる方法に関する。
【０００２】
【従来の技術】
これまで、フィルム状の樹脂材同士を接合する場合、熱圧着による接合方法が一般に用いられてきた。
これは、図６に示すように、積層配置させた２枚の樹脂フィルム３０，３２の一方の表面に加熱した金型３４を押し当て、両フィルム３０，３２間を溶融・圧着させるものであり、比較的短時間で接合が完了する上に、溶融部３６において高い気密性を確保できる利点がある。
【０００３】
【発明が解決しようとする課題】
しかしながら、熱圧着の場合、上記のように加熱用の金型３４を用意する必要があり、そのためのコストを要することはもちろんのこと、接合対象や接合パターンに応じて金型３４を取り換えたり作り替える必要があり、仕様変更に対する柔軟性に欠けていた。
【０００４】
この発明は、従来の接合方法が抱えていた上記問題点を解決するために案出されたものであり、接合対象や接合パターンに対応した金型を用いることなくフィルム状の樹脂材同士を接合でき、したがってコストを低減したり、接合条件の変更に柔軟に対応することが可能な接合方法の実現を目的としている。
【０００５】
【課題を解決するための手段】
上記の目的を達成するため、請求項１に記載した樹脂フィルム間の接合方法は、少なくとも表面がレーザに対する吸収特性を備えたレーザ吸収部材の表面に、レーザに対する透過性を備えた少なくとも２枚の樹脂フィルムを積層配置させる工程と、該樹脂フィルム層の表面にレーザに対する透過性を備えた押圧板を被せる工程と、該押圧板の表面にレーザビームを照射して上記レーザ吸収部材を加熱し、その伝導熱によって各樹脂フィルム間を溶着させる工程とを備えたことを特徴としている。
【０００６】
請求項２に記載した樹脂フィルム間の接合方法は、少なくとも表面がレーザに対する吸収特性を備えたレーザ吸収部材の表面に、レーザに対する半透過性を備えた少なくとも２枚の樹脂フィルムを積層配置させる工程と、該樹脂フィルム層の表面にレーザに対する透過性を備えた押圧板を被せる工程と、該押圧板の表面にレーザビームを照射して各樹脂フィルム及び上記レーザ吸収部材を加熱し、各樹脂フィルムにおける発熱とレーザ吸収部材からの伝導熱とによって各樹脂フィルム間を溶着させる工程とを備えたことを特徴としている。
【０００７】
請求項３に記載した樹脂フィルム間の接合方法は、少なくとも表面がレーザに対する吸収特性を備えたレーザ吸収部材の表面に、レーザに対する半透過性を備えた少なくとも１枚の樹脂フィルムと、レーザに対する透過性を備えた少なくとも１枚の樹脂フィルムを積層配置させる工程と、該樹脂フィルム層の表面にレーザ透過性を備えた押圧板を被せる工程と、該押圧板の表面にレーザビームを照射して半透過性樹脂フィルム及び上記レーザ吸収部材を加熱し、半透過性樹脂フィルムにおける発熱とレーザ吸収部材からの伝導熱とによって各樹脂フィルム間を溶着させる工程とを備えたことを特徴としている。
【０００８】
請求項４に記載した樹脂フィルム間の接合方法は、請求項１〜３の接合方法を前提とし、さらに、上記押圧板の表面におけるレーザビームの照射位置を、所定のパターンに従って移動させることにより、上記の各樹脂フィルム間を同パターンに沿って溶着させることを特徴としている。
【０００９】
請求項５に記載した樹脂フィルム間の接合方法は、請求項１〜４の接合方法を前提とし、さらに、上記レーザ吸収部材が、金属板の表面に黒色系の皮膜を形成したものより構成されることを特徴としている。
【００１０】
【発明の実施の形態】
図１〜図３は、この発明に係る接合方法の基本原理を示すものである。
まず、図１に示すように、レーザ吸収板１０の表面に、第１の樹脂フィルム１２及び第２の樹脂フィルム１４が積層配置されている。
また、第２の樹脂フィルム１４の表面には、所定の厚みと重さを備えた押圧板１６が載置されている。
【００１１】
上記レーザ吸収板１０は、ステンレス等の金属板の表面に黒アルマイトなどの被覆処理を施したものよりなり、半導体レーザに対して高い吸収特性を備えている。
上記第１の樹脂フィルム１２及び第２の樹脂フィルム１４は、それぞれ半導体レーザに対する高い透過性を備えた材質より構成される。
上記押圧板１６は、硬質耐熱ガラスプレートよりなり、半導体レーザに対する高い透過性を備えている。
【００１２】
しかして、上記押圧板１６の表面に図示しない半導体レーザ発振器から出力されたレーザビームＬ（波長：７８０ｎｍ〜９４０ｎｍ）を照射すると、このレーザビームＬは押圧板１６、第２の樹脂フィルム１４、第１の樹脂フィルム１２を透過してレーザ吸収板１０に到達し、その表面を加熱する。
このレーザ吸収板１０の表面において発生した熱は、第１の樹脂フィルム１２及び第２の樹脂フィルム１４に伝わり、両者を部分的に溶融させる。
この結果、図２に示すように、第１の樹脂フィルム１２及び第２の樹脂フィルム１４間が溶融部１８を介して接合される。
なお、レーザ吸収板１０は金属材より構成されているため、レーザビームＬの照射によって損傷するとはない。また、押圧板１６も所定の耐熱性を備えているため、上記の伝導熱によって溶融することはない。
最後に、図３に示すように、押圧板１６及びレーザ吸収板１０の間から第１の樹脂フィルム１２及び第２の樹脂フィルム１４を取り出す。この際、押圧板１６及びレーザ吸収板１０は、第１の樹脂フィルム１２及び第２の樹脂フィルム１４と材質が異なるため溶融部１８が付着することがなく、きれいに取り出すことができる。
【００１３】
図４は、上記接合方法の応用例を示すものであり、レーザ吸収板１０及び押圧板１６の間に長方形状の第１の樹脂フィルム１２及び第２の樹脂フィルム１４が積層配置されている様子が描かれている。
この状態において、第２の樹脂フィルム１４の３辺に沿ってレーザビームＬを押圧板１６の表面に連続的に照射することにより、第１の樹脂フィルム１２及び第２の樹脂フィルム１４を、コ字状パターンに沿って袋状に接合することができる。
上記レーザビームＬの照射位置の移動は、例えばロボットハンドの先端部にレーザヘッドを取り付けたり、レーザ吸収板１０、第１の樹脂フィルム１２、第２の樹脂フィルム１４、及び押圧板１６をＸＹステージ上に載置させることで実現される。
もちろん、レーザビームＬの照射位置の移動は、上記のような直線状の移動に限定されるものではなく、所定の曲線パターンに沿って照射位置を移動させることにより、第１の樹脂フィルム１２及び第２の樹脂フィルム１４間を曲線状に接合することもできる。
【００１４】
第１の樹脂フィルム１２及び第２の樹脂フィルム１４がレーザビームＬに対して半透過性を備えている場合でも、この発明の接合方法は適用できる。
この場合、図５に示すように、第２の樹脂フィルム１４及び第１の樹脂フィルム１２においてレーザビームＬが部分的に吸収されて発熱すると共に、残りのレーザビームＬがレーザ吸収板１０に到達し、その表面を加熱する。
この結果、第１の樹脂フィルム１２及び第２の樹脂フィルム１４間は、各樹脂フィルム１２，１４自身における発熱作用の他、レーザ吸収板１０からの伝導熱によって溶融し、図２に示したように溶融部１８を介して接合される。
【００１５】
第１の樹脂フィルム１２及び第２の樹脂フィルム１４の何れか一方がレーザビームに対して半透過性を備えており、他方がレーザ透過性を備えている場合でも、この発明の接合方法は適用できる。
例えば、第１の樹脂フィルム１２が半透過性を備えている場合、レーザビームＬは第２の樹脂フィルム１４を透過して第１の樹脂フィルム１２に入射し、そこで半分近くが熱に変換されると共に、残りがレーザ吸収板１０の表面に入射して熱に変換される。
この結果、第１の樹脂フィルム１２及び第２の樹脂フィルム１４間は、レーザ吸収板１０からの伝導熱及び第１の樹脂フィルム１２における発熱作用によって溶着する。
また、第２の樹脂フィルム１４が半透過性を備えている場合、レーザビームＬは第２の樹脂フィルム１４において半分近くが熱に変換されると共に、残りが第１の樹脂フィルム１２を透過してレーザ吸収板１０の表面に入射し、そこで熱に変換される。
この結果、第１の樹脂フィルム１２及び第２の樹脂フィルム１４間は、レーザ吸収板１０からの伝導熱及び第２の樹脂フィルム１４における発熱作用によって溶着する。
【００１６】
上記においては、２枚の樹脂フィルム１２，１４を溶着させる場合について説明したが、レーザ吸収板１０及び押圧板１６の間に３枚以上の樹脂フィルムの積層体を挟み込み、押圧板１６の表面にレーザビームＬを照射することにより、各樹脂フィルム間を同時に接合させることもできる。
また、上記にあっては、レーザビームＬとして半導体レーザを用いる例を説明したが、ＹＡＧレーザなど他のレーザビームを用いることもできる。
【００１７】
【発明の効果】
この発明に係る接合方法によれば、金型を用いることなく樹脂フィルム間を高い位置精度で接合することが可能となる。
また、レーザビームの照射位置の移動パターンを調整することにより、接合パターンの変更に容易に対応できる利点がある。
【図面の簡単な説明】
【図１】この発明に係る接合方法を示す拡大断面図である。
【図２】この発明に係る接合方法を示す拡大断面図である。
【図３】この発明に係る接合方法を示す拡大断面図である。
【図４】この発明に係る接合方法の応用例を示す斜視図である。
【図５】この発明に係る他の接合方法を示す拡大断面図である。
【図６】従来の熱圧着による接合方法を示す拡大断面図である。
【符号の説明】
１０　レーザ吸収板
１２　第１の樹脂フィルム
１４　第２の樹脂フィルム
１６　押圧板
１８　溶融部
Ｌ　レーザビーム[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for joining resin films, and more particularly, to a method for welding resin films by irradiating a laminated resin film with a laser beam.
[0002]
[Prior art]
Until now, when joining film-like resin materials, the joining method by thermocompression bonding has been generally used.
As shown in FIG. 6, the heated mold 34 is pressed against one surface of the two resin films 30, 32 arranged in a stacked manner, and the films 30, 32 are melted and pressed together. In addition to completing the bonding in a relatively short time, there is an advantage that high hermeticity can be secured in the melting portion 36.
[0003]
[Problems to be solved by the invention]
However, in the case of thermocompression bonding, it is necessary to prepare the heating mold 34 as described above, and not only costs are required, but also the mold 34 is replaced or redesigned according to the joining object and the joining pattern. It was necessary and lacked flexibility in changing specifications.
[0004]
The present invention has been devised to solve the above-described problems of conventional bonding methods, and can join film-like resin materials together without using a mold corresponding to the bonding target or bonding pattern. Therefore, an object of the present invention is to realize a joining method capable of reducing costs and flexibly responding to changes in joining conditions.
[0005]
[Means for Solving the Problems]
In order to achieve the above-mentioned object, the method for joining between resin films according to claim 1 is characterized in that at least two sheets having a laser transmission property at least on a surface of a laser absorption member having a surface having absorption characteristics for a laser. A step of laminating and arranging the resin film, a step of covering the surface of the resin film layer with a pressing plate having laser permeability, and heating the laser absorbing member by irradiating the surface of the pressing plate with a laser beam, And a step of welding the resin films by the conduction heat.
[0006]
The method for bonding between resin films according to claim 2 is a step of laminating and arranging at least two resin films having semi-transmissivity for laser on the surface of a laser absorbing member having at least a surface having absorption characteristics for laser. And a step of covering the surface of the resin film layer with a pressure plate having laser permeability, and irradiating the surface of the pressure plate with a laser beam to heat the resin film and the laser absorbing member. And a step of welding the resin films with heat generated by the laser and conduction heat from the laser absorbing member.
[0007]
According to a third aspect of the present invention, there is provided a method for bonding between resin films, wherein at least one resin film having semi-transmissivity with respect to a laser is provided on a surface of a laser absorbing member having at least a surface having absorption characteristics with respect to a laser, A step of laminating and disposing at least one resin film having a property, a step of covering a surface of the resin film layer with a pressing plate having a laser transmission property, and irradiating a surface of the pressing plate with a laser beam The method includes heating the transmissive resin film and the laser absorbing member, and welding the resin films with heat generated in the semi-transmissive resin film and conduction heat from the laser absorbing member.
[0008]
The bonding method between the resin films described in claim 4 is based on the bonding method of claims 1 to 3, and further, by moving the irradiation position of the laser beam on the surface of the pressing plate according to a predetermined pattern, The above resin films are welded along the same pattern.
[0009]
The bonding method between the resin films described in claim 5 is based on the bonding method according to claims 1 to 4, and further, the laser absorbing member is formed by forming a black film on the surface of the metal plate. It is characterized by that.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
1 to 3 show the basic principle of the joining method according to the present invention.
First, as shown in FIG. 1, a first resin film 12 and a second resin film 14 are laminated on the surface of the laser absorbing plate 10.
A pressing plate 16 having a predetermined thickness and weight is placed on the surface of the second resin film 14.
[0011]
The laser absorbing plate 10 is made of a metal plate made of stainless steel or the like with a coating treatment such as black alumite, and has high absorption characteristics with respect to the semiconductor laser.
Each of the first resin film 12 and the second resin film 14 is made of a material having high transparency to the semiconductor laser.
The pressing plate 16 is made of a hard heat-resistant glass plate and has high transparency to the semiconductor laser.
[0012]
When the surface of the pressing plate 16 is irradiated with a laser beam L (wavelength: 780 nm to 940 nm) output from a semiconductor laser oscillator (not shown), the laser beam L is applied to the pressing plate 16, the second resin film 14, and the second resin film 14. 1 passes through the resin film 12 and reaches the laser absorbing plate 10 to heat its surface.
The heat generated on the surface of the laser absorbing plate 10 is transmitted to the first resin film 12 and the second resin film 14 and partially melts both.
As a result, as shown in FIG. 2, the first resin film 12 and the second resin film 14 are joined via the melting part 18.
Since the laser absorbing plate 10 is made of a metal material, it is not damaged by the irradiation of the laser beam L. Further, since the pressing plate 16 also has predetermined heat resistance, it is not melted by the conduction heat.
Finally, as shown in FIG. 3, the first resin film 12 and the second resin film 14 are taken out between the pressing plate 16 and the laser absorbing plate 10. At this time, the material of the pressing plate 16 and the laser absorbing plate 10 is different from that of the first resin film 12 and the second resin film 14, so that the melted portion 18 does not adhere and can be taken out cleanly.
[0013]
FIG. 4 shows an application example of the bonding method, in which a rectangular first resin film 12 and second resin film 14 are stacked between the laser absorbing plate 10 and the pressing plate 16. Is drawn.
In this state, by continuously irradiating the surface of the pressing plate 16 with the laser beam L along the three sides of the second resin film 14, the first resin film 12 and the second resin film 14 are coated. It can be joined in a bag shape along the letter pattern.
The movement of the irradiation position of the laser beam L may be performed by, for example, attaching a laser head to the tip of the robot hand, or moving the laser absorbing plate 10, the first resin film 12, the second resin film 14, and the pressing plate 16 to an XY stage. Realized by placing it on top.
Of course, the movement of the irradiation position of the laser beam L is not limited to the linear movement as described above. By moving the irradiation position along a predetermined curve pattern, the first resin film 12 and The second resin films 14 can be joined in a curved shape.
[0014]
Even when the first resin film 12 and the second resin film 14 are semi-transmissive to the laser beam L, the bonding method of the present invention can be applied.
In this case, as shown in FIG. 5, the second resin film 14 and the first resin film 12 partially absorb the laser beam L to generate heat, and the remaining laser beam L reaches the laser absorbing plate 10. And the surface is heated.
As a result, the space between the first resin film 12 and the second resin film 14 is melted by the conduction heat from the laser absorbing plate 10 in addition to the heat generation action of the resin films 12 and 14 themselves, as shown in FIG. Are joined to each other through a melting portion 18.
[0015]
Even when either one of the first resin film 12 and the second resin film 14 is semi-transmissive to the laser beam and the other is laser transmissive, the bonding method of the present invention is applied. it can.
For example, when the first resin film 12 has translucency, the laser beam L passes through the second resin film 14 and enters the first resin film 12, where almost half of the laser beam L is converted into heat. In addition, the remainder enters the surface of the laser absorption plate 10 and is converted into heat.
As a result, the first resin film 12 and the second resin film 14 are welded by the conduction heat from the laser absorption plate 10 and the heat generation action in the first resin film 12.
Further, when the second resin film 14 is semi-transmissive, the laser beam L is converted into heat in the second resin film 14 by almost half, and the remainder transmits the first resin film 12. Then, the light is incident on the surface of the laser absorbing plate 10 and converted into heat there.
As a result, the first resin film 12 and the second resin film 14 are welded by conduction heat from the laser absorption plate 10 and heat generation in the second resin film 14.
[0016]
In the above description, the case where the two resin films 12 and 14 are welded has been described. However, a laminate of three or more resin films is sandwiched between the laser absorbing plate 10 and the pressing plate 16, and the surface of the pressing plate 16 is sandwiched between them. By irradiating the laser beam L, the resin films can be simultaneously bonded.
In the above description, an example in which a semiconductor laser is used as the laser beam L has been described. However, other laser beams such as a YAG laser may be used.
[0017]
【The invention's effect】
According to the joining method according to the present invention, resin films can be joined with high positional accuracy without using a mold.
In addition, there is an advantage that the bonding pattern can be easily changed by adjusting the movement pattern of the irradiation position of the laser beam.
[Brief description of the drawings]
FIG. 1 is an enlarged sectional view showing a joining method according to the present invention.
FIG. 2 is an enlarged sectional view showing a joining method according to the present invention.
FIG. 3 is an enlarged sectional view showing a bonding method according to the present invention.
FIG. 4 is a perspective view showing an application example of the joining method according to the present invention.
FIG. 5 is an enlarged cross-sectional view showing another bonding method according to the present invention.
FIG. 6 is an enlarged cross-sectional view showing a conventional joining method by thermocompression bonding.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Laser absorption board 12 1st resin film 14 2nd resin film 16 Pressing plate 18 Melting part L Laser beam

Claims (5)

少なくとも表面がレーザに対する吸収特性を備えたレーザ吸収部材の表面に、レーザに対する透過性を備えた少なくとも２枚の樹脂フィルムを積層配置させる工程と、
該樹脂フィルム層の表面にレーザに対する透過性を備えた押圧板を被せる工程と、
該押圧板の表面にレーザビームを照射して上記レーザ吸収部材を加熱し、その伝導熱によって各樹脂フィルム間を溶着させる工程と、
を備えた樹脂フィルム間の接合方法。A step of laminating and arranging at least two resin films having laser permeability on the surface of a laser absorbing member having at least a surface having absorption characteristics for laser;
A step of covering the surface of the resin film layer with a pressing plate having laser permeability;
Irradiating the surface of the pressing plate with a laser beam to heat the laser absorbing member, and welding between the resin films by the conduction heat;
A method for joining resin films. 少なくとも表面がレーザに対する吸収特性を備えたレーザ吸収部材の表面に、レーザに対する半透過性を備えた少なくとも２枚の樹脂フィルムを積層配置させる工程と、
該樹脂フィルム層の表面にレーザに対する透過性を備えた押圧板を被せる工程と、
該押圧板の表面にレーザビームを照射して各樹脂フィルム及び上記レーザ吸収部材を加熱し、各樹脂フィルムにおける発熱とレーザ吸収部材からの伝導熱とによって各樹脂フィルム間を溶着させる工程と、
を備えた樹脂フィルム間の接合方法。A step of laminating and arranging at least two resin films having semi-transmissivity for laser on the surface of a laser absorbing member having at least a surface having absorption characteristics for laser; and
A step of covering the surface of the resin film layer with a pressing plate having laser permeability;
Irradiating the surface of the pressing plate with a laser beam to heat each resin film and the laser absorbing member, and welding between the resin films by heat generated in each resin film and conduction heat from the laser absorbing member;
A method for joining resin films. 少なくとも表面がレーザに対する吸収特性を備えたレーザ吸収部材の表面に、レーザに対する半透過性を備えた少なくとも１枚の樹脂フィルムと、レーザに対する透過性を備えた少なくとも１枚の樹脂フィルムを積層配置させる工程と、
該樹脂フィルム層の表面にレーザ透過性を備えた押圧板を被せる工程と、
該押圧板の表面にレーザビームを照射して半透過性樹脂フィルム及び上記レーザ吸収部材を加熱し、半透過性樹脂フィルムにおける発熱とレーザ吸収部材からの伝導熱とによって各樹脂フィルム間を溶着させる工程と、
を備えた樹脂フィルム間の接合方法。At least one resin film having semi-transmissivity with respect to a laser and at least one resin film having translucency with respect to a laser are laminated on the surface of a laser absorbing member having at least a surface having absorption characteristics with respect to the laser. Process,
Covering the surface of the resin film layer with a pressing plate having laser transparency;
The surface of the pressing plate is irradiated with a laser beam to heat the semi-transmissive resin film and the laser absorbing member, and the resin films are welded by heat generated in the semi-transmissive resin film and conduction heat from the laser absorbing member. Process,
A method for joining resin films. 上記押圧板の表面におけるレーザビームの照射位置を、所定のパターンに従って移動させることにより、上記の各樹脂フィルム間を同パターンに沿って溶着させることを特徴とする請求項１〜３の何れかに記載の樹脂フィルム間の接合方法。The laser beam irradiation position on the surface of the pressing plate is moved according to a predetermined pattern, so that the resin films are welded along the same pattern. The joining method between the resin films of description. 上記レーザ吸収部材が、金属板の表面に黒色系の皮膜を形成したものより構成されることを特徴とする請求項１〜４の何れかに記載の樹脂フィルム間の接合方法。The said laser absorption member is comprised from what formed the black-type membrane | film | coat on the surface of the metal plate, The joining method between the resin films in any one of Claims 1-4 characterized by the above-mentioned.
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US9795769B2 (en) 2010-04-01 2017-10-24 Seidensha Electronics Co., Ltd. Balloon catheter, balloon catheter manufacturing device, balloon catheter manufacturing method, catheter connection device, catheter connection method, and connected catheter
WO2011125263A1 (en) * 2010-04-01 2011-10-13 精電舎電子工業株式会社 Balloon catheter, balloon catheter manufacturing device, balloon catheter manufacturing method, catheter connection device, catheter connection method, and connected catheter
JP2011235570A (en) * 2010-05-12 2011-11-24 Shingijutsu Kenkyusho:Kk Member formed by bonding metal body and resin body, and method for manufacturing the same
US20120183748A1 (en) * 2011-01-17 2012-07-19 Nike, Inc. Joining Polymeric Materials
WO2012099722A1 (en) * 2011-01-17 2012-07-26 Nike International Ltd. Joining polymeric materials
US8968508B2 (en) * 2011-01-17 2015-03-03 Nike, Inc. Joining polymeric materials
DE102014108404A1 (en) * 2014-06-16 2015-12-17 Sartorius Stedim Biotech Gmbh Method for connecting a first plastic part with a second plastic part by laser welding
DE102014108404B4 (en) 2014-06-16 2018-08-09 Sartorius Stedim Biotech Gmbh Method for connecting a first plastic part with a second plastic part by laser welding
JP2017128360A (en) * 2016-01-20 2017-07-27 凸版印刷株式会社 Heat seal method and heat seal device
CN112739527A (en) * 2018-07-03 2021-04-30 杜肯Ias有限责任公司 Laser Welding System and Method
US11541609B2 (en) 2018-07-03 2023-01-03 Dukane Ias, Llc System and method for simultaneous welding of plastic bags using a carrier film
US11548235B2 (en) 2018-07-03 2023-01-10 Dukane Ias, Llc Laser welding system and method using machined clamping tool
CN113787255A (en) * 2021-09-30 2021-12-14 苏州大学 A kind of laser welding method of transparent plastic film

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