JP2003318541A - Manufacturing method of ceramic multilayer wiring board - Google Patents

Abstract

[Problem] To manufacture a wiring board with high dimensional accuracy while suppressing firing shrinkage of a ceramic green sheet, using a conductive paste containing metal powder, having a high bonding strength and a high frequency signal. A wiring board having excellent transmission characteristics and less warpage is obtained. A process for producing a ceramic green sheet, and an organic binder and a solvent are added to 100 parts by mass of an inorganic component containing 99.5% by mass or more of a metal powder having an average particle size of 1 to 10 μm in the inorganic component. 15 organic components of
A step of printing and applying a thickness of 10 to 30 μm on the surface of the ceramic green sheet 11 using a conductive paste containing the conductive circuit layer in an amount of about 30 parts by mass, and forming the wiring circuit layer 13 in the same manner as in the previous step. A green sheet laminate 15 is formed by laminating a plurality of green sheets on which the green sheets are formed, and firing is performed while laminating ceramic sheets 16 that are not sintered at the firing temperature of the ceramic green sheets 11 on both surfaces of the green sheet laminate 15. And a step of removing a non-sintered ceramic sheet 16 from the fired laminate 15 to obtain a wiring board 17.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic multilayer wiring board suitable for a package for accommodating semiconductor elements.

[0002]

2. Description of the Related Art In recent years, a semiconductor device housing package for mounting semiconductor devices such as ICs and LSIs, which has been highly integrated, and a wiring board applied to a hybrid integrated circuit device in which various electronic components are mounted, There is a demand for higher density, lower resistance, smaller size and lighter weight, lower dielectric constant than that of alumina ceramic materials, and low resistance metal such as Cu can be used for the wiring circuit layer. Is 1
The so-called glass-ceramic wiring board having a temperature of 000 ° C. or less is receiving more attention.

In such a glass-ceramic wiring board, as a method of forming a wiring conductor layer, there is often a method of printing a conductor paste containing a metal such as Cu or Ag as a main component on an insulating substrate by a screen printing method or the like. It is used. In order to match the firing shrinkage behavior of the glass ceramics, the conductor paste is usually added with an inorganic substance such as ceramic powder or glass powder in addition to the metal component, thereby increasing the bonding strength of the wiring layer, Substrate warpage is being reduced.

However, when such a conductor paste is used, the proportion of metal components in the wiring layer after firing becomes small, and the transmission characteristics are remarkably deteriorated when transmitting high frequency signals such as microwaves and millimeter waves. There is a problem of doing.

When the glass-ceramic substrate is fired to improve the dimensional accuracy of the substrate, an inorganic composition green sheet that does not sinter at the firing temperature of the glass-ceramic substrate is sandwiched on both sides of the glass-ceramic laminate to be laminated. A firing method has been proposed in which firing treatment is performed and shrinkage hardly occurs in the surface direction of the substrate.

However, in the case where the firing is performed so as not to shrink in the plane direction as described above, when the conductor paste containing the metal powder is printed and applied to the wiring pattern on the surface of the green sheet and the firing is performed together with the green sheet, the conductor paste is formed. Since itself causes shrinkage during firing, strain occurs between the conductor paste and the green sheet during firing, warpage occurs, and the bonding strength between the fired conductor layer and the ceramic sheet is extremely low. There was a problem.

Therefore, in order to form a conductor layer in the case of firing such that shrinkage in the plane direction hardly occurs, the dense metal foil is etched and patterned to shrink the conductor layer. It has been attempted to match the shrinkage behavior by suppressing the above together with the green sheet, but such a pattern forming method has many steps and is complicated, so that the yield is reduced and the manufacturing cost is increased. There was a problem. In addition, when the metal foil is used, it is a rigid body by itself, so that it is not plastically deformed and there is a problem that a gap corresponding to the thickness of the metal foil is likely to occur at the end portion of the wiring circuit layer.

Further, by using a high-purity conductor paste containing a large amount of metal powder, pattern formation can be performed by a screen printing method or the like according to the conventional method, but it is very good in terms of manufacturing method, but the conductor paste is very good. However, there was a problem that the firing shrinkage could not be completely suppressed, and as a result, the problem of low adhesion strength could not be solved.

Therefore, according to the present invention, when manufacturing a wiring board having a high dimensional accuracy while suppressing the shrinkage of the ceramic green sheet by firing, a conductive paste containing a metal powder is used, so that the bonding strength is high and there is no warp. It is an object of the present invention to provide a method for producing a ceramic multilayer wiring board that does not generate.

[0010]

Means for Solving the Problems The inventors of the present invention have made earnest studies on the above-mentioned problems, and as a result, as a method of manufacturing a wiring board having high dimensional accuracy while suppressing firing shrinkage of a ceramic green sheet, a ceramic Inorganic component 1 containing 99.5% by mass or more of a metal powder having an average particle size of 1 to 10 μm in the inorganic component
A conductive paste containing an organic binder and an organic component such as a solvent in an amount of 15 to 30 parts by weight with respect to 00 parts by weight is used to form 10 to 3 on the surface of the ceramic green sheet.
Printing with a thickness of 0 μm to form a wiring circuit layer,
As in the previous step, a step of producing a green sheet laminate by laminating a plurality of green sheets on which wiring circuit layers are formed, and a ceramic sheet that does not sinter at the firing temperature of the ceramic green sheet is attached to both sides of the green sheet laminate. And a step of firing the laminated ceramic sheet, and a step of removing the unsintered ceramic sheet from the fired laminated body,
It is characterized by including.

According to the present invention, the metal powder for forming the wiring circuit layer is preferably Cu powder or Ag powder in order to reduce the resistance and loss of the wiring circuit layer.

Further, according to the present invention, the bonding strength of the wiring circuit layer with the substrate is 50 N or more in the pattern of 2 mm □, and the insertion loss of the wiring circuit layer after firing at 5 GHz | It is desirable that S21 | is 0.15 dB / cm or less in order to improve the reliability of the wiring circuit layer.

The inorganic component in the ceramic green sheet is a ceramic composition that can be fired at 850 to 1050 ° C., and the inorganic component in the ceramic sheet that does not sinter at the firing temperature has an average particle size of 0.5 to 0.5. 5
80 to 99.5 mass% of the hard-to-sinter ceramic powder of 0.5 μm and 0.5 to 20 mass% of the glass powder having a softening point at 450 to 950 ° C. are included, whereby firing shrinkage is effectively suppressed and dimensional accuracy is improved. It is possible to obtain a high wiring board.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to the drawings. FIG. 1 is an example of a schematic sectional view of an inorganic composition that does not sinter at the firing temperature of the ceramic of the ceramic multilayer wiring board according to the present invention. According to the cross-sectional view of FIG. 1, the ceramic multilayer wiring board 1 includes an insulating substrate 2 composed of a laminate of a plurality of ceramic insulating layers 2a to 2c, and between the insulating layers 2a to 2c and on the surface of the insulating substrate 2. The wiring circuit layer 3 is deposited. Further, via-hole conductors 4 having a diameter of 80 to 200 μm are formed so as to penetrate through the ceramic insulating layers 2a to 2c in the thickness direction, thereby connecting the wiring circuit layers 2a to 2c to each other to achieve a predetermined circuit. A circuit network is formed to do so.

The ceramic forming the insulating substrate 2 is 8
It is desirable to consist of a ceramic composition that can be fired at 50 to 1050 ° C., specifically, glass powder or a mixture of glass powder and ceramic filler powder, and in particular, 30 to 90 mass% of glass component and ceramic. It is desirable that the composition of 10 to 70% by mass of the filler component be fired. The glass component used includes at least SiO ₂ , Al ₂ O ₃ ,
It contains at least one of B ₂ O ₃ , ZnO, PbO, an alkaline earth metal oxide, and an alkali metal oxide, for example, SiO ₂ —B ₂ O ₃ system, SiO ₂ —B.
₂ O ₃ -Al ₂ O ₃ system-MO system (where M is Ca, Sr, M
g, Ba or Zn) etc., borosilicate glass, alkali silicate glass, Ba-based glass, Pb-based glass, Bi
Examples include system glass. These glasses are those that are also amorphous glass by firing treatment, and by firing treatment, lithium silicate, quartz, cristobalite, cordierite, mullite, anorthite,
Crystallized glass that precipitates at least one crystal of Sergian, spinel, garnite, willemite, dolomite, petalite or a substituted derivative thereof is used. Also,
As the ceramic filler, SiO ₂ such as quartz and cristobalite, Al ₂ O ₃ , ZrO ₂ , mullite, forsterite, enstatite, spinel, magnesia and the like are preferably used.

The wiring circuit layer 3 and the via-hole conductor 4 are both produced by firing a conductor paste containing metal powder.

According to the present invention, a method for manufacturing the above-mentioned ceramic multilayer wiring board will be described with reference to FIG.
First, a crystallized glass component or an amorphous glass component as described above is mixed with the ceramic filler component to prepare a ceramic composition, and an organic binder or the like is added to the mixture, and then a doctor blade method or a rolling method. Then, the green sheet 11 having a thickness of about 50 to 500 μm is formed by forming into a sheet by a pressing method or the like (FIG. 2A).

As the organic binder used for forming the green sheet, it is desirable to use an acrylic resin in order to enhance the strength of the green sheet, remove the binder, and prevent delamination between the substrate layers after firing. As the acrylic resin, i-BMA (isobutyl methacrylate), N-BMA (normal butyl methacrylate), Et-MA (ethyl methacrylate), MMA
At least one selected from the group of (methyl methacrylate) can be mentioned, and among these, i-BMA is the most desirable.

When the molecular weight of the organic binder is large, the strength tends to be high, and when the molecular weight is low, the strength tends to be low. Desirably, the molecular weight (MW) is 200,000 to 1,500,000.

Further, as the content of the organic binder increases, the strength of the green sheet can be increased.
From the viewpoint of the strength of this sheet, it is desirable that the amount is 8 parts by mass or more per 100 parts by mass of the inorganic component. However, when the content of the organic binder is too large, it becomes difficult to remove the organic binder and causes delamination. Therefore, the content of the organic binder is preferably 20 parts by mass or less. Optimally, it is 10 to 18 parts by mass.

Next, a plasticizer such as DBP (dibutyl phthalate) may be added as an organic component to the green sheet for imparting elasticity, but the amount of such plasticizer added is The greater the amount, the lower the strength of the sheet, so the content of the plasticizer is 1
It is desirable that the amount is 3 to 10 parts by mass, particularly 4 to 8 parts by mass with respect to 00 parts by mass.

Then, the diameter of the green sheet 11 is reduced to 80 by laser, microdrill, punching or the like.
A through hole having a thickness of up to 200 μm is formed, and a conductor paste is filled in the through hole to form a via hole conductor 12 (FIG. 2).
(B)). In the conductor paste, in addition to metal components such as Cu and Ag, an organic binder such as an acrylic resin and an organic solvent such as toluene, isopropyl alcohol, acetone, and terpineol are homogeneously mixed and formed.
The organic binder is based on 100 parts by mass of the metal component.
It is desirable that 0.5 to 15.0 parts by mass of the organic solvent be mixed in a ratio of 5 to 100 parts by mass with respect to 100 parts by mass of the solid component and the organic binder. Note that 2% by mass or less of a glass component or the like may be added to this conductor paste.

Next, on the surface of the green sheet 11,
A conductor paste containing a metal powder of Cu or Ag is used to form a wiring pattern by printing and coating to form the wiring circuit layer 13 (FIG. 2C).

According to the present invention, as the conductor paste used here, the average particle size of the metal powder is 1 to 10 μm, especially 2
Is 8 μm, and the amount of such metal powder is 99.5% by mass or more, particularly 9% by mass in the inorganic component in the conductor paste.
It is important that the content is 9.7% by mass or more, and particularly 99.8% by mass or more. This is because the average particle size of the metal powder is 1 μm.
If it is smaller than this, the viscosity of the paste becomes extremely high, and printing cannot be performed by the screen printing method. Average particle size is 10
When it is larger than μm, the linearity of the end portion of the print pattern is deteriorated, and the absolute value of the insertion loss S21 at 5 GHz becomes larger than 0.15 dB / cm. Further, even when the content of the metal powder is less than 99.5 mass%, the absolute value of the insertion loss S21 is 0.15 dB / c due to the decrease in the ratio of the metal component of the wiring circuit layer.
It becomes larger than m.

Further, the conductor paste contains an organic binder and an organic solvent in order to enhance printability. According to the present invention, these organic components are the inorganic components 1 described above.
15 to 30 parts by mass, especially 20 to 25 parts by mass with respect to 00 parts by mass
It is important to include it in a ratio of parts by mass. That is, when the content of the organic component is less than 15 parts by mass, poor dispersion of the metal powder occurs, which causes the paste viscosity to be remarkably increased and printing by the screen printing method cannot be performed. On the other hand, if the amount is more than 30 parts by mass, a large amount of the solvent and the binder are vaporized during firing, so that delamination occurs between the substrate layers. Suitable viscosity of the conductor paste is 55-75 Pa
・ S.

Furthermore, according to the present invention, the coating thickness of 10 to 3 when printing and coating using such a conductor paste.
It is important that it is 0 μm, especially 15 to 25 μm.
That is, if the thickness at this time is less than 10 μm, the bonding strength of the wiring circuit layer 13 with the substrate is significantly reduced. Also, 30
If it is thicker than μm, voids are generated at the interface of the laminated green sheets, which causes delamination.

The thickness of the wiring circuit layer 13 after firing with this coating thickness is preferably 4 to 25 μm, and particularly 6 to 18 μm.

As the organic binder added to the conductor paste, an organic binder is an acrylic resin,
At least one selected from the group of cellulosic resins is suitable, and 10 to 20 parts by mass is suitable for 100 parts by mass of the inorganic component. Further, as the organic solvent, at least one selected from the group of α-terpineol (TPO), dibutyl phthalate (DBP), dioctyl phthalate (DOP) and butyl carbitol acetate (BCA) is suitable, and per 100 parts by mass of the inorganic component. 5 to 15 parts by mass is suitable.

Next, a plurality of green sheets 11 on which the wiring circuit layer 13 is formed are laminated and pressure bonded in the same manner as described above to form a laminated body 15 (FIG. 2 (d)). For stacking the green sheets, a method of applying heat and pressure to the stacked green sheets 11 to perform thermocompression bonding, an organic binder, a plasticizer,
A method of applying an adhesive composed of a solvent or the like between the sheets and thermocompression-bonding can be adopted.

Thereafter, when firing the laminate 15, firing is performed while suppressing firing shrinkage in the plane direction. As a method of firing while suppressing shrinkage in the plane direction, as shown in FIG. 3E, a non-sinterable ceramic sheet 16 such as alumina that does not shrink at the firing temperature is applied to the surface of the laminate 15 or It is adhered to the front and back surfaces and baked.

The hardly-sinterable ceramic sheet 16 in this method is obtained by molding a slurry obtained by adding an organic binder, a plasticizer, a solvent and the like to a ceramic component containing a hardly-sinterable ceramic material as a main component into a sheet shape. To be The non-sinterable ceramic material is specifically composed of a ceramic composition that does not densify at a temperature of 1100 ° C. or lower, and specifically, Al ₂ O ₃ , SiO ₂ , MgO, ZrO ₂ ,
Powders of at least one of BN and TiO ₂ or a compound thereof (forsterite, enstatite, etc.) can be mentioned. Further, as the organic binder, the plasticizer and the solvent, the same materials as those used for the glass ceramic green sheet can be used. Further, by adding a glass component in an amount of 0.5 to 20% by mass to the hardly-sinterable ceramic sheet, the adhesion with the green sheet is increased and the effect of suppressing shrinkage is increased, and the surface of the green sheet is also increased. It has an advantage that the generation of voids due to the diffusion of the glass component can be suppressed.

As a more preferred example, the average particle size is 0.5 to
Alumina powder having a particle size of 5 μm was added in an amount of 80 to 99.5% by mass, 450
Glass powder having a softening point at 950C to 950C for 0.5 to 20
Contains 50% by mass and has a powder filling rate of 53 as a green sheet.
It is desirable that it is -60%.

Firing is carried out at 100 to 850 ° C., especially 400 to 850 ° C.
After heat treatment is performed in a nitrogen atmosphere at 750 ° C. to decompose and remove organic components in the green sheet 11, the wiring circuit layer 13, and the via-hole conductor 12, firing is performed in a nitrogen atmosphere at 850 to 1050 ° C. When an Ag conductor is used for the wiring circuit layer, the firing atmosphere can be performed in the air.

After that, the multilayer ceramic substrate 17 can be produced by appropriately removing the hardly-sinterable ceramic sheet 16 by ultrasonic cleaning, polishing, water jet, chemical blast, sand blast, wet blast, or the like.

The multilayer wiring board 17 thus obtained
Since the shrinkage during firing is suppressed only in the thickness direction by the pressure or the hardly-sinterable ceramic sheet 16, the shrinkage in the plane direction can be suppressed to 0.5% or less, and the glass ceramic green Since the sheets are uniformly and surely joined to each other by the restraint sheet, it is possible to prevent the restraint sheet from being warped or deformed due to partial peeling or the like.

According to the present invention, in the above firing process, the wiring circuit layer 13 formed by using the predetermined conductor paste is aligned with the state in which the shrinkage of the green sheet 11 in the plane direction is suppressed, and the conductor paste is formed. As a result, the wiring circuit layer 13 formed by the above can also proceed with the sintering without generation of stress or the like in the state where the contraction in the plane direction is suppressed, and as a result, the sheet resistance is high and the adhesive strength to the ceramic sheet 11 is excellent. The wiring circuit layer 13 can be formed.

The wiring circuit layer 1 made of a conductor paste
Since No. 3 itself is plastically deformable, it is possible to prevent the occurrence of gaps on both sides of the wired circuit layer 13 that occur when the wired circuit layer 13 is formed of a metal foil.

[0038]

EXAMPLES SiO ₂ : 37% by mass, Al ₂ O ₃ : 27% by mass, CaO: 11% by mass, ZnO: 12% by mass, B
₂ O ₃ : 73% by mass of crystallized glass A powder (softening point 850 ° C.) having a composition of 13% by mass and an average particle size of 3 μm, and 27% by mass of silica having an average particle size of 2 μm as a ceramic filler. To 100 parts by mass of the powder, 11 parts by mass of isobutyl methacrylate resin as an organic binder and 5 parts by mass of dibutyl phthalate as a plasticizer were added, and toluene was mixed as an organic solvent for 36 hours by a ball mill to prepare a slurry. did. The obtained slurry is 0.4m thick by the doctor blade method.
m green sheet A was formed.

Next, the green sheet A has a diameter of 2
A through hole of 00 μm was formed by punching. Then, with respect to 100 parts by mass of Cu powder having an average particle diameter of 5 μm, 1 part by mass of alumina powder and 2 parts by mass of borosilicate glass are added, and 2 parts by mass of acrylic resin as an organic binder per 100 parts by mass of inorganic components, Α-Terpineol as a solvent was added and kneaded at a ratio of 6 parts by mass to prepare a paste sample for a via hole conductor, and this Cu conductor paste was filled in a through hole formed in a green sheet by a screen printing method.

Next, Cu having an average particle size of 0.5 to 15 μm
Alumina powder and borosilicate glass were added at a ratio shown in Table 1 to 100 parts by mass of the powder, and acrylic resin as an organic binder and α-terpineol as an organic solvent were weighed at a ratio shown in Table 1 per 100 parts by mass of the inorganic component. By mixing, a conductor paste for the wiring circuit layer having the viscosity shown in Table 1 was prepared. Then, this conductor paste was applied by screen printing by the thickness shown in Table 1. In addition, the presence or absence of agglomeration of the paste was observed.

Further, in order to measure the bonding strength of the wiring circuit layer, a 2 mm square pattern was also formed by printing. After that, the green sheet printed with this wiring circuit layer
The sheets were laminated and pressure-laminated under the conditions of 50 ° C. and 5 MPa to produce a laminated body.

On the other hand, the Al ₂ O ₃ powder having an average particle diameter of ₂ μm and the SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —BaO system glass powder having an average particle diameter of 3 μm are respectively 95% by mass: 5% by mass. A constraining sheet having a ratio of a thickness of 250 μm and a powder filling rate of 58% was produced. The organic binder, the plasticizer, the solvent and the like during the production of the sheet were the same as the green sheet. This constraining sheet is coated with an adhesive made of an acrylic organic solvent, and the both surfaces of the green sheet laminate are kept at 60 ° C. and 20M.
By laminating under pressure at Pa, a laminated body including a constraining sheet and a ceramic green sheet was obtained.

Next, this laminated body is placed on an Al ₂ O ₃ setter and heated to 700 ° C. in a nitrogen atmosphere in order to decompose and remove organic components such as an organic binder, and further 950 ° C. in a nitrogen atmosphere. Firing for 1 hour. The cooling rate after firing was 300 ° C / hr. After that, the constraining sheet was removed by blasting to produce a ceramic multilayer wiring board. After that, this substrate was plated with Ni / Au. The plating thickness at this time is 3 μm and 1 respectively.
μm.

Using the obtained wiring board, the bonding strength of the plated wiring circuit layer was evaluated. For the evaluation, φ0.4 mm was applied to the 2 mm square pattern part for evaluating the bonding strength.
A mm-mm tin-plated copper wire was bonded using solder, the end portion of the copper wire was pulled at a speed of 10 mm / sec, and the load until the pattern portion was peeled off was measured with a load cell. The evaluation results are shown in Table 1. In addition, the transmission characteristics were evaluated using a sample having a microstrip structure. Measurement is 0.1-1
Insertion loss at 5 GHz performed at 0 GHz
S21 | was measured. The results are shown in Table 1.

The amount of warpage of the wiring board was also measured. The amount of warpage is 10 mm when the wiring board is placed on a flat plate.
The convex shape of the corner pattern portion was measured with a surface roughness meter and defined as the amount of warpage. The insertion loss | S21 | becomes larger than 0.15 dB / cm.

Further, the cross section of the wiring board was observed to observe the presence or absence of delamination in the periphery of the wiring circuit layer formed inside.

[0047]

[Table 1]

From the results shown in Table 1, the sample No. having an average particle size smaller than 1 μm was obtained. In No. 1, the paste viscosity became extremely high, and printing could not be performed by the screen printing method. Also, 1
Sample No. larger than 0 μm. In No. 7, the linearity of the end portion of the printed pattern was poor, and as a result, the insertion loss | S21 | at 5 GHz was larger than 0.15 dB / cm. Furthermore, the sample No. containing less than 99.5% by mass of the metal powder. 12, the insertion loss | S21 | at 5 GHz is 0.15 dB /
It became larger than cm.

Furthermore, the organic component in this conductor paste was less than 15 parts by mass with respect to 100 parts by mass of the inorganic component. In No. 13, printing was not possible because the paste viscosity was too high. Sample N more than 30 parts by mass
o. In No. 17, delamination occurred between the substrate layers.

Further, when the conductive paste is used for printing, the coating thickness is less than 10 μm. In Sample No. 18, the bonding strength between the wiring circuit layer and the substrate was lower than 50 N, and the sample No. 18 was thicker than 30 μm. In No. 22, delamination occurred between the substrate layers.

On the other hand, all the samples based on the manufacturing method of the present invention have a bonding strength of 50 N or more and a warp amount of 10 μm.
m or less, and the insertion loss | S21 | at 5 GHz is 0.
It was 15 dB / cm or less, and was good without delamination.

Each of the wiring boards manufactured in the examples has a shrinkage in the plane direction of 0.5% or less, which is excellent in dimensional accuracy.

[0053]

As described above in detail, in the production of a wiring board having high dimensional accuracy while suppressing the firing shrinkage of the ceramic green sheet, the predetermined average particle diameter, the metal content, etc. are controlled to bond the It is possible to manufacture a wiring board having high strength, excellent transmission characteristics of high-frequency signals, and less warpage.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing an example of a ceramic multilayer wiring board according to the present invention.

FIG. 2 is a manufacturing process diagram in the method for manufacturing a ceramic multilayer wiring substrate of the present invention.

[Explanation of symbols]

1 Multilayer wiring board 2 insulating substrate 2a to 2c insulating layer 3 wiring circuit layer 4 Via hole conductor 5 Semiconductor element

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 5E346 AA32 AA43 CC18 CC32 CC39                       DD02 DD13 DD34 DD45 EE24                       EE29 FF18 FF22 GG04 GG06                       GG08 GG09 GG28 HH05 HH06                       HH11 HH33

Claims (6)

[Claims] 1. A step of producing a ceramic green sheet, and a step of preparing a metal powder having an average particle diameter of 1 to 10 μm in an inorganic component,
Organic components such as an organic binder and a solvent are added in an amount of 15 to 3 with respect to 100 parts by mass of the inorganic component containing 99.5% by mass or more.
A step of forming a wiring circuit layer by printing with a thickness of 10 to 30 μm on the surface of the ceramic green sheet using a conductor paste containing 0 part by weight, and a plurality of wiring circuit layers formed in the same manner as in the previous step. The step of laminating the green sheets to produce a green sheet laminate, the step of firing the ceramic sheets that are not sintered at the firing temperature of the ceramic green sheet while being laminated on both sides of the green sheet laminate, And a step of removing the non-sintered ceramic sheet from the laminated body. 2. The method for manufacturing a ceramic multilayer wiring board according to claim 1, wherein the metal powder is Cu powder or Ag powder. 3. The bonding strength of the wiring circuit layer substrate is 2 m.
The method for manufacturing a ceramic multilayer wiring board according to claim 1 or 2, wherein the pattern of m □ is 50 N or more. 4. The ceramic multilayer wiring board according to claim 1, wherein an insertion loss | S21 | at 5 GHz of the wiring circuit layer after firing is 0.15 dB / cm or less. Manufacturing method. 5. The inorganic component in the ceramic green sheet comprises a ceramic composition that can be fired at 850 to 1050 ° C.
9. A method for manufacturing a ceramic multilayer wiring board according to any one of 1. 6. The inorganic component in the ceramic sheet that does not sinter at the firing temperature is 80 to 99.5% by mass of 450, which is a non-sinterable ceramic powder having an average particle size of 0.5 to 5 μm.
Glass powder having a softening point at 950C to 950C for 0.5 to 20
6. The composition according to claim 1, wherein the content is% by mass.
9. A method for manufacturing a ceramic multilayer wiring board according to any one of 1.