JP2003301140A - Coating material for forming transparent electroconductive film and emboss processed electronic part carrier tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transparent electroconductive coating material which forms a transparent electroconductive film possessing transparency, electroconductivity and extensibility and an emboss processed carrier tape obtained by using the same. <P>SOLUTION: The coating material for forming the transparent electroconductive coating film comprises a hybrid electroconductive material which comprises a mixture of (a) electroconductive particles comprising a minute electroconductive fine particle (a1) and a coarse electroconductive fine particle (a2) with (b) an organic electroconductive material, where the ratio of the electroconductive fine particle (a) to the organic electroconductive material (b) is such that (a):(b) is 10:(0.02-5.0) in terms of weight ratio, and a binder component. The emboss processed carrier tape having a coating film formed thereon using the coating material is featured in an elongation of at least 60%, a total light transmission at a film thickness of 2 μm of at least 50% and a surface resistance at an elongated part after emboss processing of 5×10<SP>6</SP>-9×10<SP>10</SP>Ω/(square). <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a transparent conductive film-forming coating material capable of forming a transparent conductive film which is transparent and has excellent conductivity even after stretching, and a transparent film formed by the transparent conductive film-forming coating material on the surface. The present invention relates to an embossed electronic component carrier tape having a conductive film formed thereon.

[0002]

2. Description of the Related Art In recent years, small electronic parts such as transistors, diodes, capacitors, and piezoelectric element resistors, including ICs, are housed in a pocket formed by embossing a thermoplastic resin tape, and a cover tape is placed on the pocket. Storage and transportation as a carrier tape
It is being worn.

Static electricity is generated in the carrier tape due to vibration and friction, and the carrier tape is charged. When the cover tape is peeled off, the static electricity is discharged and electrostatically destroys the contained electronic parts. There is. Further, since it is checked whether or not electronic parts are stored in the pocket of the carrier tape by reading the light transmitted through the carrier tape with a reading sensor, the carrier tape has a total light transmittance of 50% or more. It is required to have transparency.

As a method of preventing the carrier tape from being charged, a carbon powder is added to a thermoplastic resin as a raw material of the carrier tape
A method of kneading conductive fine particles such as metal powder and a method of forming a metal layer on the surface of a carrier tape by sputtering etc. are known, but in the former method, the carrier tape becomes opaque and electrons in the pocket There is a problem that the parts cannot be confirmed, and the latter method has a problem that the manufacturing cost becomes high.

Further, recently, it has been proposed to apply a transparent conductive coating material containing ITO or ATO onto a thermoplastic resin film to maintain the transparency of the coating film. The carrier tape formed from the thermoplastic resin film provided with has a problem that the desired conductivity cannot be obtained because the film is greatly stretched by embossing even if it retains a predetermined conductivity in a flat state. there were. In addition, recently, JP-A-2000-52
A coating film made of a paint containing an organic-inorganic composite conductive sol composed of conductive oxide colloidal particles having a primary particle size of 5 to 50 nm and conductive polymer colloidal particles as disclosed in Japanese Patent No. 522 is also proposed. However, in the organic-inorganic composite conductive coating containing only the conductive material having a fine particle size disclosed herein, the antistatic effect after embossing due to the processing temperature and stretching during embossing is not sufficiently satisfactory. It was

Furthermore, when a large amount of conductive fine particles are added to increase the conductivity, the required transparency cannot be obtained, and in addition, the conductive fine particles are partially dropped from the film.

Generally, in order to impart an antistatic function to an embossed carrier tape by applying a transparent conductive coating, the total light transmittance is 50% or more when the dry coating film of the transparent conductive coating has a thickness of 2 to 10 μm. The surface resistance value after embossing is 5 × 10 ^{6 to} 9 × 10 ¹⁰ Ω / □, and the elongation of the coating film (in the state of being in close contact with the base material) is required to be 60% or more. There is no known thing that satisfies such a condition.

[0008]

As described above, among the conventional carrier tapes provided with the antistatic function, the thermoplastic resin as the raw material of the carrier tape is kneaded with conductive fine particles such as carbon powder and metal powder. However, there is a problem that it becomes opaque and the electronic components in the pocket cannot be confirmed, and a product in which a metal layer is formed on the surface of the carrier tape by sputtering or the like has a problem of high manufacturing cost. In the case where a coating film made of a transparent conductive paint is formed on the surface, there is a problem that the necessary conductivity cannot be obtained because the film is greatly stretched when embossed, and when the conductivity is increased, the necessary transparency is not obtained. There was a problem that you could not get it.

The present invention has been made to solve the above-mentioned conventional problems, and a transparent conductive paint and an embossed carrier for forming a transparent conductive film having transparency, conductivity and elongation required for an embossed carrier tape. Intended to provide tape.

[0010]

The transparent conductive film-forming coating material of the present invention is (A) (a) having an average particle size of 5 nm or more and 0.1 μm.
Fine conductive fine particles (a1) with an average particle diameter of 0.1 μm
As described above, a mixture of conductive fine particles (A2) and coarse conductive fine particles (a2) having a size of less than 30 μm and organic conductive materials (A) and (b), wherein fine conductive fine particles (a1) and coarse conductive fine particles (a2) are used. The weight ratio is (a1) :( b2) = 1.
0: 0.05 to 10 and the ratio of the conductive fine particles (a) to the organic conductive material (b) is (a) :( b) = 1 in weight ratio.
0: 0.02-5.0, which is 10 of the hybrid conductive material
It is characterized by containing 0 parts by weight and 20 to 300 parts by weight of the binder component (B). That is, the present invention provides (a1) fine conductive fine particles (having an average particle size of 5 nm or more,
Appropriate conductivity and transparency even after embossing by adding (a2) coarse conductive fine particles (average particle size of 0.1 μm or more and less than 30 μm) to (a) (less than 0.1 μm) and further adding (b) an organic conductive material. This is to ensure the sex. In the present specification, the particle size means the particle size in the major axis direction in the case of acicular or flat non-circular conductive particles.

The conductive fine particles (a1) used in the present invention are (aI) Sb, Sn, In, Ti, Si and Zn.
Oxide fine particles containing at least one metal selected from
(AII) Ag, Pd, Cu, Ni, Ru, Rh, Fe,
It is preferable to contain one or more kinds of metal colloid fine particles selected from Pt, Cr, Co, Al, Ta, Pb, Os and Ir. As the conductive fine particles suitable for the present invention,
Conductive fine particles of tin oxide or indium oxide as a main component or a mixture of two or more thereof, or tin oxide or indium oxide containing Sb, Sn, Mg, Ga, Ti, P, Zn,
Conductive fine particles doped with different metals such as Those obtained by subjecting these conductive particles to a treatment for promoting oxygen defects, a treatment for heat treatment in a nitrogen atmosphere to form a nitride, a treatment for reducing the surface in a reducing atmosphere such as hydrogen are also preferably used. It Preferable specific examples of the conductive fine particles include, for example, silver-containing colloidal liquid, tin oxide fine particles, indium oxide fine particles, tin oxide or indium oxide fine particles, and Sb, Sn, Mg, Ga, Ti, P, Zn.
Fine particles doped with dissimilar metals such as ATO fine particles
(For example, SN-100P [trade name, manufactured by Ishihara Sangyo Co., Ltd.] (tin dioxide / antimony pentoxide = 88/12 (wt%), average primary particles: spherical particles having a particle size of 0.01 to 0.03 μm), needle -Shaped ATO fine particles FS-10P [trade name, manufactured by Ishihara Sangyo Co., Ltd.]: (tin dioxide / antimony pentoxide = 88/12, short axis average particle size 0.005 of average primary particles)
.About.0.05 .mu.m, long axis average particles 0.1 to 3 .mu.m: aspect ratio 5 to 600, ITO fine particles (for example, F-IT).
O [trade name, manufactured by Dowa Mining Co., Ltd.] (tin oxide / indium oxide = 5/95. (Wt%), average primary particles: 0.0
5 to 0.2 μm)) and the like.

The conductive fine particles (A) and (a) of the present invention are
The average particle size is 5 nm or more and less than 0.1 μm, and preferably 0.01 to 0.1 μm.

If the average particle size of the conductive fine particles is less than 5 nm, sufficient conductivity cannot be obtained, and if it is 0.1 μm or more, the transparency becomes low when a sufficient amount of conductivity is obtained.

The coarse conductive fine particles of (a2) are, in particular, needle-shaped or flat non-circular conductive fine particles (aspect ratio of 3 to 10).
600, preferably 5-300) is preferred. The acicular or flat non-circular conductive fine particles have an average particle diameter of 0.1 μm.
Or more and less than 30 μm, preferably 0.2 μm or more, 1
It is less than 0 μm.

(A2) As the coarse conductive fine particles, S
It is preferable to use a nitride, an oxide, a metal-doped oxide, conductive carbon, or a combination thereof containing one or more metals selected from b, Sn, In, Ti, Si and Zn.

Specific examples of the coarse conductive fine particles (a2) include, for example, needle-shaped ATO fine particles such as FS-10.
P [manufactured by Ishihara Sangyo Co., Ltd.]: (tin dioxide / antimony pentoxide = 88/12, short axis average particle size of average primary particles 0.0
05 to 0.05 μm, long axis average particle diameter 0.1 to 3 μm: aspect ratio 5 to 600), and composite conductive fine particles of TiN / TiO ₂ / C, for example, DENTOL NT-100 [manufactured by Otsuka Chemical Co., Ltd., product Name] ・ (TiN / TiO ₂ / C-based plate-like powder, average particle size 5 to 15 μm, aspect ratio 5-1
0), Dentol NT-200 [same as above] (particle size: 5 to 1
5 μm / needle-like crystals) or tin oxide-based composite particles, for example, Dentol WK-200B (trade name, manufactured by Otsuka Chemical Co., Ltd.) (K ₂ 0.6 TiO ₂ / SnO ₂ , average particle size 10 to
20 μm, aspect ratio 30-60); Dentor WK
-500 [same as above] (TiO ₂ / SnO ₂ series powder, average particle size 5 to 15 μm, aspect ratio 20 to 50), Dentol WK-600 [same as above] (TiO ₂ / SnO ₂ series powder,
Average particle size 1 to 5 μm, aspect ratio 10 to 30), or plate-like crystal SiO ₂ / C-based conductive fine particles such as DENTOL TM-200 (average particle size 5 to 15 μm aspect ratio 3
0-100) and plate silicate / C-based dentol BK-
400M (average particle size 3 to 8 μm, aspect ratio 20 to 3
0 [manufactured by Otsuka Chemical Co., Ltd., trade name] or conductive carbon black, for example, # 3050 [manufactured by Mitsubishi Kasei Co., Ltd.,
Product name] (Particle size: 40 nm-Secondary particles, secondary aggregate 1 μm
Used above), # 3150 [Same as above] (particle size: 25 nm-
Secondary particle, secondary aggregate 1 μm or more), # 3750
[Same as above] (Particle size: 28 nm-Secondary particles, secondary aggregate 1 μm
(Used above) and the like are exemplified.

The transparent conductive film formed when the average particle size of the coarse conductive particles (a2) is less than 0.1 μm, that is, only the fine conductive particles (a1) has a conductivity of It will be low.

The mixing ratio of the fine conductive particles (a1) and the coarse conductive particles (a2) is (a1):
(A2) = 10: 0.05-10, preferably 10:
The range is 0.1 to 5. If the weight ratio of the coarse conductive fine particles of (a2) is less than 0.05, the conductivity of the transparent conductive coating film after embossing will be insufficient, and conversely if it exceeds 10, the light transmittance of the transparent conductive coating film will be insufficient. Both are not preferable because they become insufficient.

Fine conductive particles (a1) and (a2)
The conductive fine particles having an average particle size other than the coarse conductive fine particles may be mixed, but it is desirable that the fine conductive fine particles and the coarse conductive fine particles occupy 90% by weight or more of the whole,
In particular, it is desirable that substantially no conductive fine particles having an average particle size of 30 μm or more are contained.

Examples of the organic conductive material of (A) and (b) of the present invention include (a) dioxythiophene polystyrene-based conductive resin solution, (b) polypyrrole-based conductive resin solution, (c) charge transfer type complex, Examples thereof include (d) radical type conductive compounds and (e) chelate type conductive compounds.

The dioxythiophene polystyrene-based resin liquid of (a) includes PEDT / PS represented by the formula (I).
S (Polyethylene Dioxythiophene polystylene sulphon
ate) [Bayer brand name].

[Chemical 1] This resin has a surface resistance of a single coating of 1 depending on the conditions.
It has high conductivity up to 50Ω / □.

The polypyrrole-based conductive resin liquid (b) is, for example, a Basotronic liquid represented by the formula (II).
PYR [trade name of Basuf Company] is mentioned.

[Chemical 2] This resin can be prepared by using an appropriate dopant.
High conductivity of -3Ω / □.

As the charge transfer complex of (c), for example, the following TCNQ (Tetra cyano quino dimethane) complex is well known, and Li + TCNQ-

As the radical type conductive compound (d), for example, the following diphenylhydrazyl is known,

[Chemical 3]

(E) As the chelate-type conductive compound,
For example, the following copper phthalocyanine salt is known.

[0026]

[Chemical 4] Among these organic conductive materials, polymer conductive materials are particularly suitable.

The ratio of the conductive fine particles of (a) to the organic conductive material of (b) is (a) :( b) = 10: 0.0 in weight ratio.
2 to 5.0, preferably (a) :( b) = 10: 0.0
It is desirable to set it to 5 to 5.0.

As the binder component (B) of the present invention, thermoplastic acrylic resin, cellulose resin, polyamide resin, vinyl chloride resin, modified alkyd resin, polyethylene, polyphenol, polyamino acid, polystyrene, vinyl acetate resin, ethylene. -Vinyl acetate copolymer,
Examples thereof include thermoplastic resins such as polystyrene resins; thermosetting resins such as polyurethane resins, epoxy resins and aminoalkyd resins; nitrification cotton, UV (ultraviolet) curing resins and the like. Specific examples of the UV curable resin include monofunctional acrylate monomers such as stearyl acrylate, isodecyl methacrylate and n-vinyl-2-pyrrolidone, and bifunctional acrylates such as polyethylene glycol diacrylate and polypropylene glycol diacrylate. Examples thereof include monomers, trifunctional acrylate monomers such as trimethylolpropane triacrylate, tetrafunctional or higher-functional acrylate monomers such as pentaerythritol tetraacrylate, acrylate oligomers such as epoxy acrylates and polyurethane acrylates. Examples of the photopolymerization initiator for these UV curable resins include thioxanthone photopolymerization initiators, benzophenone photopolymerization initiators, and anthraquinone photopolymerization initiators. Furthermore, examples of the photopolymerization accelerator used in combination with the photopolymerization initiator for these UV curable resins include p-dimethylaminobenzoic acid isoamyl ester and p-dimethylaminobenzoic acid ethyl ester.

The binder component is a factor that determines the adhesiveness to the thermoplastic resin film of the base material of the electronic component carrier tape, and therefore the adhesiveness to the thermoplastic resin film of the base material is as good as possible, and also the synthesis with a large elongation. It is desirable to select a resin.

Many water-soluble resins such as water-soluble alkyd resins and water-soluble acrylic resins and thermosetting resins generally have a small elongation and follow the elongation of the base thermoplastic resin film during embossing. However, the transparent conductive film is likely to be cracked or cracked.

In the transparent conductive coating material of the present invention, a solvent (dispersant) for the above binder which also functions as a dispersant for the conductive fine particles.
Is not particularly limited as long as it does not attack the substrate and dissolves or disperses the binder. However, from the environmental point of view, it is better to avoid BTX and the like, and the following solvents are preferable.

The solvent used in the present invention is an aqueous solvent,
Examples thereof include alcohol-based, ether alcohol-based, ether-based, ester-based, ether ester-based, ketone-based and mixed solvent thereof. Specific examples of these solvents include water, methanol, ethanol, propanol, butanol, diacetone alcohol, furfuryl alcohol, tetrahydrofurfuryl alcohol, ethylene glycol, hexylene glycol, and other alcohols; acetic acid methyl ester, acetic acid ethyl ester. Ethers such as diethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, etc .; ketones such as acetone, methyl ethyl ketone, acetylacetone, acetoacetic acid ester, etc. Etc. are illustrated.

In the transparent conductive film-forming coating material, it is desirable that free ions are as small as possible. In particular, halogen ions and alkali metal ions corrode the metal electrode terminals of electronic devices, so the content thereof is high. Is desirable to be minimal. More preferably, the content of halogen ions is 1
0ppm or less, the content of alkali metal ions is 1p
pm or less.

The proportion of the (A) hybrid conductive material and the (B) binder forming component in the present invention is 20 to 300 parts by weight of the (B) binder component with respect to 100 parts by weight of the (A) hybrid conductive material. Is desirable.

If the content of the binder component (B) exceeds 300 parts by weight, the electric conductivity of the coating film becomes insufficient, and conversely, if it is less than 20 parts by weight, the light transmittance and mechanical properties of the coating film become insufficient. Not preferable.

The transparent conductive coating film-forming coating material of the present invention may contain a surfactant and other additives in addition to the above components. Examples of the above-mentioned surfactant include nonionic and cationic surfactants, anionic surfactants and amphoteric surfactants.

The transparent conductive coating film of the present invention is formed by coating and drying a transparent conductive coating film-forming coating material prepared by dispersing and dissolving a hybrid conductive material, a binder component and an optional additive component in the above-mentioned ratio. To be done.

The thermoplastic film to which the transparent conductive film-forming coating material of the present invention is applied includes polystyrene, polyester, polypropylene, polyvinyl chloride and the like, and polystyrene is particularly preferable for embossed carrier tapes.

As a method for forming a transparent conductive film,
For example, a transparent conductive film-forming coating material is applied on a substrate by a method such as a dipping method, a spinner method, a spray method, a roll coater method, or a flexographic printing method, and then dried at a temperature in the range of room temperature to about 80 ° C. To do. Specifically, when the transparent conductive coating film-forming coating material is a room temperature dry coating material,
On a thermoplastic film, such as a polystyrene film,
After coating with a bar coater, it is obtained by drying at 60 ± 5 ° C. for about 1 to 3 minutes.

Further, the transparent conductive coating film-forming coating material contains no solvent.
In the case of UV curable paint, for example,
After coating with a bar coater on the film, 50 ± 5 ℃
After drying for 1 to 2 minutes, UV light is irradiated with an ultraviolet irradiation device.
It is obtained by irradiation and curing. UV irradiation machine
For example, the system ECS-151U [Eyegra
Product name by Fick Co., Ltd.] (Metal Halide Lamp M
015-L312 cold mirror condensing, conveyor speed
Do 2 m / min, integrated light intensity: 667 mJ / cm ²) For
Can be

The thickness of the coating film obtained by the present invention is 2 μm,
The light transmittance is preferably 50% or more when the thickness is 5 μm, more preferably 10 μm.

The film thickness of the transparent conductive film formed by the above method is about 1 to 20 μm, preferably 1 to 20 μm.
A range of 10 μm is preferable, and a film thickness within this range makes it possible to obtain a transparent conductive film-coated substrate having an excellent antistatic effect.

Generally, the transparent conductive coating film has a surface resistance of 5 at the stretched portion after embossing for the purpose of preventing static electricity.
It is required that it be approximately 10 ^{6 to} 9 × 10 ¹⁰ Ω / □. The transparent conductive coating film of the present invention has a light transmittance of 70% or more while having such surface resistance.

The transparent conductive film-coated substrate according to the present invention is such that the carrier tape has a surface resistance of 9 × 10 ¹⁰ Ω / □ or less, which is necessary for antistatic, and is sufficient in the visible light region and the near infrared region. Since it has various antireflection properties and antiglare properties, it is suitably used as a front plate of a transparent display device.

The carrier tape for embossed electronic parts of the present invention has a transparent conductive coating film formed on the transparent thermoplastic resin film by the above-mentioned method. It is obtained by forming a pocket for accommodating an electronic device or the like by embossing by the method.

The transparent conductive coating film of the present invention can be used as a coating film alone.
Since it has an elongation percentage of not less than%, it does not extend and crack or break together with the base thermoplastic resin film during embossing.

The embossed electronic component carrier tape thus obtained is 5 × 10 ^{6 to} 9 × 10 ¹⁰ Ω / □.
Since it has a surface resistance of a certain degree and effectively eliminates static electricity generated by vibration, friction, etc., the stored electronic components will not be electrostatically destroyed.

[0048]

Example 1 19 parts by weight of ATO fine particles having an average primary particle diameter of 0.01 to 0.03 μm (trade name: SN-100P) and coarse conductive fine particles of TiO ₂ / having an average particle diameter of 5 to 15 μm
1 part by weight of SnO ₂ fine particles (trade name: WK-500 [manufactured by Otsuka Chemical Co., Ltd.]) and dioxythiophene polystyrene resin solution (trade name: Baytron P [manufactured by Bayer Co.]) of organic conductive material: PEDT = 0. 5%, PSS = 0.8
%) 1 part by weight and 30 parts by weight of a polyurethane resin solution (trade name: Nipporan 5120: solid content 30% [manufactured by Nippon Polyurethane Industry Co., Ltd.]), Leodol SP-030
[Kao Corporation, trade name] (nonionic surfactant) 2
Parts by weight, 20 parts by weight of ethyl acetate, 1 methyl ethyl ketone
7 parts by weight, ethylene glycol monobutyl ether 10
By mixing parts by weight and dispersing with a bead mill, a bright conductive film-forming coating material was obtained. The end point is the maximum of the grind gauge value, which is 1
It was set to 0 μm or less.

This transparent conductive film-forming coating material was applied by a bar coater on a polystyrene film having a thickness of 400 μm so that the dry coating film thickness would be 2 μm, and dried by passing through an oven at 50 ± 5 ° C. Next, this polystyrene film was embossed by press molding to form pockets (maximum stretching ratio 200%). The molding temperature is 20
The molding time is 0 ° C. and the pocket time is 20 seconds.

[0050]

Example 2 Example 1 was repeated except that 19 parts by weight of the ATO fine particles used in Example 1 was changed to 17 parts by weight and 1 part by weight of the organic conductive material dioxythiophene polystyrene resin solution was changed to 3 parts by weight. A transparent conductive film-forming coating material was obtained with the same composition and the same method.

Example 1 using this transparent conductive film-forming coating material
In the same manner as above, a transparent conductive film was formed on a polystyrene film having a thickness of 400 μm so that the dry coating film thickness was 2 μm. Next, this polystyrene film was embossed under the same conditions as in Example 1 to form pockets.

[0052]

Example 3 A transparent conductive film-forming coating material was obtained by the same composition and method as in Example 1 except that the organic conductive material of Example 1 was replaced with a polypyrrole conductive resin liquid (trade name: Bastronic PYR).

Example 1 using this transparent conductive film-forming coating material
In the same manner as above, a transparent conductive film was formed on a polystyrene film having a thickness of 400 μm so that the dry coating film thickness was 2 μm. Next, this polystyrene film was embossed under the same conditions as in Example 1 to form pockets.

[0054]

Example 4 19 parts by weight of the ATO fine particles of Example 1 were added,
16 parts by weight of coarse conductive fine particles of TiO ₂ / SnO
₂ fine particles (trade name: WK-500 [manufactured by Otsuka Chemical Co., Ltd.]) 1 part by weight is needle-shaped ATO fine particles FS-10P [manufactured by Ishihara Sangyo Co., Ltd., trade name] 4 parts by weight, and a polyurethane resin solution 30 30 parts by weight of a thermoplastic acrylic resin solution (trade name: Thermolac F-1: non-volatile content 30% [manufactured by Soken Chemical Industry Co., Ltd.]), except that 17 parts by weight of methyl ethyl ketone was replaced by 17 parts by weight of isopropyl alcohol A transparent conductive film-forming coating material was obtained with the same composition and method as in Example 1.

Example 1 using this transparent conductive film-forming coating material
In the same manner as above, a transparent conductive film was formed on a polystyrene film having a thickness of 400 μm so that the dry coating film thickness was 2 μm. Next, this polystyrene film was embossed under the same conditions as in Example 1 to form pockets.

[0056]

Example 5 ATO fine particles (trade name: SN-100
P) 18 parts by weight and coarse conductive fine particles having an average particle size of 1 to 5 μm, TiO ₂ / SnO ₂ powder (trade name: DENTOL W
K-600 [manufactured by Otsuka Chemical Co., Ltd.] 2 parts by weight mixed conductive fine particles 20 parts by weight, organic conductive material dioxythiophene polystyrene resin liquid (trade name: Baytron P [manufactured by Bayer]) 1 part by weight And thermoplastic acrylic resin (trade name: B-38 [ROHMAND HAAS COMPA
NY company]] 9 parts by weight, Leodol SP-030 [Kao Corporation, trade name] (nonionic surfactant) 2 parts by weight, ethyl acetate 30 parts by weight, isopropyl alcohol 3
0 parts by weight and ethylene glycol monobutyl ether 8
Part by weight was mixed and dispersed by a ball mill to obtain a conductive film-forming coating material.

Example 1 using this transparent conductive film-forming coating material
In the same manner as above, a transparent conductive film was formed on a polystyrene film having a thickness of 400 μm so that the dry coating film thickness was 2 μm. Next, this polystyrene film was embossed under the same conditions as in Example 1 to form pockets.

[0058]

[Example 6] ATO fine particles of Example 5 (trade name: SN-
100 P) as 14 parts by weight, and the average primary particle diameter is 0.05
˜0.2 μm ITO fine particles F-ITO [trade name, manufactured by Dowa Mining Co., Ltd.] (tin oxide / indium oxide = 5 /
A transparent conductive film-forming coating material was obtained by the same composition and method as in Example 5, except that 5 parts by weight of 95. (wt%) was added to form fine conductive particles.

Example 1 using this transparent conductive film-forming coating material
In the same manner as above, a transparent conductive film was formed on a polystyrene film having a thickness of 400 μm so that the dry coating film thickness was 2 μm. Next, this polystyrene film was embossed under the same conditions as in Example 1 to form pockets.

[0060]

Example 7 ATO fine particles of Example 1 (trade name: SN-
100 P) was replaced with 15 parts by weight and 5 parts by weight of a 20% by weight silver colloid solution (average particle size 0.005-0.06 μm), and a transparent conductive film-forming coating material was obtained by the same composition and method as in Example 1. It was

Example 1 using this transparent conductive film-forming coating material
In the same manner as above, a transparent conductive film was formed on a polystyrene film having a thickness of 400 μm so that the dry coating film thickness was 2 μm. Next, this polystyrene film was embossed under the same conditions as in Example 1 to form pockets.

[0062]

Comparative Example 1 ATO fine particles (trade name:
SN-100P: average primary particle diameter 0.01 to 0.03 μ
m) is 21 parts by weight, and coarse conductive fine particles of TiO ₂ /
A transparent conductive film-forming coating material was obtained by the same composition and method as in Example 1, except that 1 part by weight of SnO ₂ fine particles (trade name: WK-500 [manufactured by Otsuka Chemical Co., Ltd.]) was not added at all.

Example 1 using this transparent conductive film-forming coating material
In the same manner as above, a transparent conductive film was formed on a polystyrene film having a thickness of 400 μm so that the dry coating film thickness was 2 μm. Next, this polystyrene film was embossed under the same conditions as in Example 1 to form pockets.

[0064]

Comparative Example 2 ATO fine particles (trade name:
SN-100P) 20 parts by weight and 0.01 parts by weight of an organic conductive material dioxythiophene polystyrene resin liquid (trade name: Baytron P: PEDT = 0.5%, PSS = 0.8%). A transparent conductive film-forming coating material was obtained with the same composition and method as in Example 1.

Example 1 using this transparent conductive film-forming coating material
In the same manner as above, a transparent conductive film was formed on a polystyrene film having a thickness of 400 μm so that the dry coating film thickness was 2 μm. Next, this polystyrene film was embossed under the same conditions as in Example 1 to form pockets.

[0066]

Comparative Example 3 ATO fine particles (trade name:
SN-100P) 19 parts by weight, and a transparent conductive film-forming coating material was prepared by the same composition and method as in Example 5, except that the organic conductive material dioxythiophene polystyrene resin solution (trade name: Baytron P) was not added at all. Obtained.

Example 1 using this transparent conductive film-forming coating material
In the same manner as above, a transparent conductive film was formed on a polystyrene film having a thickness of 400 μm so that the dry coating film thickness was 2 μm. Next, this polystyrene film was embossed under the same conditions as in Example 1 to form pockets.

[0068]

Comparative Example 4 ATO fine particles of Example 5 (trade name: SN-
100P) in an amount of 8 parts by weight, and T is a coarse conductive fine particle.
1 iO ₂ / SnO ₂ fine particle (trade name: WK-600)
A transparent conductive film-forming coating material was obtained by the same composition and method as in Example 5, except that the amount was changed to 2 parts by weight.

Example 1 using this transparent conductive film-forming coating material
In the same manner as above, a transparent conductive film was formed on a polystyrene film having a thickness of 400 μm so that the dry coating film thickness was 2 μm. Next, this polystyrene film was embossed under the same conditions as in Example 1 to form pockets.

The amount of conductive fine particles, the amount of organic conductive material, and the surface resistance value in the coating films of the transparent conductive films of Examples 1 to 7 and Comparative Examples 1 to 4 (stretched portion before embossing and after embossing), all The light transmittance and the comprehensive evaluation are shown in Table 1.

The amount of conductive fine particles, the amount of organic conductive material, and the surface resistance value in the coating films of the transparent conductive films of Examples 1 to 7 and Comparative Examples 1 to 4 (stretched parts before embossing and after embossing), all The light transmittance and the comprehensive evaluation are shown in Table 1.

[0072]

[Table 1]

[0073]

As is apparent from the above examples, the coating film of the coating composition for forming a transparent conductive film of the present invention has excellent conductivity and adhesion to a base material, and the coated film is embossed. Even so, the conductivity is maintained so that a sufficient charge eliminating effect can be obtained. Therefore, the embossed electronic component carrier tape of the present invention is suitable as a carrier tape for small electronic components such as transistors, diodes, capacitors, and piezoelectric element resistors.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shozo Murata             4-21-1 Ichinomiya, Samukawa-cho, Takaza-gun, Kanagawa Prefecture             Morimura Chemical Co., Ltd. (72) Inventor Shujiro Kudo             3-28-6 Omorinishi, Ota-ku, Tokyo             Court Co., Ltd. F-term (reference) 4J038 HA066 KA20 NA20                 5G301 DA02 DA17 DA23 DA28 DD02                       DD08

Claims (7)

[Claims] 1. (A) (a) Average particle size of 5 nm or more, 0.
Fine conductive particles (a1) having a particle size of less than 1 μm and an average particle size of 0.
Coarse conductive fine particles (a2) of 1 μm or more and less than 30 μm
A mixture of conductive fine particles consisting of (A) and (b) an organic conductive material, comprising fine conductive fine particles (a1) and coarse conductive fine particles (a2)
Is a weight ratio of (a1) :( b2) = 10: 0.05.
10 to 10 and conductive fine particles (a) and organic conductive material (b)
The ratio by weight is (a) :( b) = 10: 0.02
100 parts by weight of the hybrid conductive material of 5.0,
(B) A coating material for forming a transparent conductive film, which comprises 20 to 300 parts by weight of a binder component. 2. The fine conductive fine particles (a1) are (aI)
1 selected from Sb, Sn, In, Ti, Si and Zn
Oxide fine particles containing at least one metal, and (aII) Ag, P
d, Cu, Ni, Ru, Rh, Fe, Pt, Cr, C
The coating composition for forming a transparent conductive film according to claim 1, further comprising one or more kinds of metal colloid fine particles selected from o, Al, Ta, Pb, Os and Ir. 3. The coarse conductive fine particles (a2) are Sb, S.
2. A nitride, an oxide, a metal-doped oxide, conductive carbon, or a combination thereof containing one or more metals selected from n, In, Ti, Si and Zn, or a combination thereof. 2. The transparent conductive film-forming coating material according to 2. 4. The coating composition for forming a transparent conductive film according to claim 1, wherein the binder component (B) is a thermoplastic resin. 5. A thermoplastic resin film having a transparent conductive film formed by the transparent conductive film-forming coating composition according to claim 1 formed on the surface thereof by embossing to form pockets for housing electronic components. Embossed electronic component carrier tape characterized by the following. 6. The elongation of the transparent conductive film before embossing is 60% or more, and the total light transmittance is 5 at a thickness of 2 μm.
It is 0% or more, The embossed electronic component carrier tape of Claim 5 characterized by the above-mentioned. 7. The carrier tape for embossed electronic parts according to claim 5, wherein the surface resistance value of the stretched part after embossing is 5 × 10 ^{6 to} 9 × 10 ¹⁰ Ω / □.