JP2003340581A - Laser processing apparatus and laser beam axial deviation detection member - Google Patents

Abstract

(57) [Summary] [Problem] When a laser beam deviates from an optical axis of a laser beam path,
This misalignment is detected quickly. A laser cutting apparatus A irradiates and cuts a laser beam oscillated from a laser oscillator 4 from a laser torch 7 toward a material to be cut B. An optical axis 5a set in a laser beam path 5 is cut. Operation of the laser oscillator 4 that is disposed around and has electrical conductivity and is disconnected when irradiated with laser light, an energization member 17 that energizes the wire, an energization detection member 18 that detects an energization state of the wire, and State and energization detection member 18
And a control device 31 for recognizing that the laser beam has been displaced when the energization detecting member 18 detects the non-energized state of the wire when the laser beam is emitted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus configured to detect that laser light from a laser oscillator to a laser torch is deviated from a preset optical axis, and a laser light is deviated from the optical axis. The present invention relates to an axial misalignment detection member that is advantageous when detecting that something is wrong.

[0002]

2. Description of the Related Art By irradiating a laser beam to a work material made of metal or non-metal and moving it relatively, the work material is cut, welded, or subjected to other processing including thermal spraying. It is being given. For example, when the laser processing is laser cutting for cutting a workpiece, laser light oscillated from a laser oscillator passes along an axis (optical axis) of a laser optical path including a plurality of mirrors provided in a laser cutting device. The laser torch and irradiate the material to be processed from the laser torch, and at the same time ejecting the assist gas to evaporate or melt the base material and at the same time eliminate the vaporized material and the molten base material and maintain this state. Then, the laser torch is moved along the contour line of the shape to be cut, so that the workpiece is cut into the target shape.

A laser cutting device for cutting a two-dimensional shape from a work material has a traveling carriage that travels on a rail, and a laser torch mounted on the carriage so that the carriage can traverse in a direction orthogonal to the rail. It has a traverse trolley,
The laser torch is moved by controlling the traveling of the traveling carriage and the traverse of the traverse carriage in synchronization, and the workpiece can be cut by operating the laser torch with this movement.

Laser light has a slight diffusion angle,
The thickness increases as the distance from the laser oscillator increases. Therefore, if the optical path length, which is the distance from the laser oscillator to the laser torch, changes, the thickness of the laser light emitted from the laser torch changes, which changes the processing accuracy and the quality of the processed portion. Therefore, the laser processing apparatus is configured so that the length of the laser optical path can be kept constant even if the position of the laser torch moves along with the processing.

Particularly, in a laser cutting device configured to cut a workpiece having a large area, the laser oscillator is mounted and fixed on a traveling carriage, and the position of the laser torch with respect to the laser oscillator is fixed along with the processing. The laser optical path is configured so that the optical path length is constant even when the optical path length changes.

Explaining the structure of such a laser optical path, a mirror carriage provided with a plurality of mirrors is arranged in the middle of the laser optical path, and when the distance from the laser oscillator of the laser torch changes with machining, the laser torch moves. The mirror carriage is controlled so as to move so as to absorb the change in the distance in synchronism with. That is, when the laser torch approaches the laser oscillator, the mirror carriage is separated from the laser oscillator, and when the laser torch is separated from the laser oscillator, the mirror carriage is moved so as to approach the laser oscillator. We keep it constant.

[0007]

By the way, in the laser processing apparatus, the traveling angle of the laser beam may fluctuate for some reason. In this case, since the laser light has a straight traveling property, when the length of the laser light path becomes long and the distance from the laser oscillator becomes large, the irradiated laser light deviates from the optical axis of the laser light path. Occurs.
This problem is that the laser light leaves the mirror and does not enter the laser torch, making it impossible to perform the intended processing. Derives the problem of causing damage.

An object of the present invention is to provide a laser processing apparatus capable of detecting a deviation of a laser beam from the optical axis of the laser optical path, and an axis deviation detecting member advantageous for use in the laser processing apparatus. To do.

[0009]

In order to solve the above problems, a laser processing apparatus according to the present invention has a laser oscillator, a laser torch, and a laser optical path provided between the laser oscillator and the laser torch. In a laser processing apparatus for irradiating a workpiece with a laser beam oscillated from a laser torch to perform a target processing, a laser beam is disposed around an optical axis preset in the laser optical path and has conductivity. Further, a wire rod that is broken when irradiated with laser light, an energizing member that energizes the wire member, an energization detecting member that detects an energized state of the wire member, and the energization when laser light is oscillated from a laser oscillator. And a shaft misalignment detection member that recognizes that the laser beam has misaligned when the detection member detects a non-energized state of the wire.

In the above laser processing apparatus, since the wire rod which has conductivity and which is broken when the laser beam is irradiated is arranged around the optical axis preset in the laser beam path, the laser beam with the axis misalignment is generated. When the wire rod irradiates, the wire rod is broken due to this irradiation. Therefore, it is possible to detect whether or not the laser beam is misaligned by comparing the oscillation state of the laser oscillator with the energization state of the wire rod.

That is, the wire member is energized by the energizing member, the energization detecting member detects the energizing state, and the axis deviation detecting member detects the energizing state of the wire member by the energizing detecting member and the oscillation state of the laser oscillator. Compare
If the laser oscillator keeps oscillating and the wire is energized, it recognizes that there is no disconnection in the wire and the laser beam is not misaligned, and the laser oscillator keeps oscillating. In addition, when the energized state of the wire is not maintained, it can be recognized that the wire is irradiated with the laser beam and is broken, and the laser beam is misaligned.

In the above laser processing apparatus, it is preferable that the wire is wired on the base material, and the end portion of the wire material is fixed to a terminal provided on the base material. By configuring the laser processing device in this way, it is possible to replace a wire rod that has been broken due to axial misalignment of the laser light. Therefore, the laser processing device can be returned to the operating state in a short time.

The laser beam axis shift detecting member according to the present invention is electrically insulative and has a substrate having a preset surface configured to allow the laser beam to pass therethrough. A wire which is broken when a light beam is irradiated, the wire is wired around a preset surface of the substrate, and the end of the wire is fixed to a terminal.

In the above-mentioned laser beam axis shift detecting member, a preset surface is on a substrate configured to allow the laser light to pass therethrough, and the periphery of the surface is insulative and can be changed to the laser light. Since the wire material that is irradiated and disconnected is wired and the end portion of the wire is fixed to the terminal, the board and the wire material can be configured as one component. For this reason, it is possible to replace the substrate, which has been broken by the irradiation of the laser beam with the axis deviation, together with the substrate, and the maintenance due to the axis deviation of the laser processing apparatus becomes easy.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the laser processing apparatus and the axis deviation detecting member will be described below with reference to the drawings. FIG. 1 is a diagram illustrating the overall configuration of the laser processing apparatus. FIG. 2 is a diagram for explaining the arrangement of the axis shift detecting member in the laser optical path. FIG. 3 is a block diagram for detecting the axis shift of the laser light. FIG. 4 is a diagram for explaining the configuration of the axis shift detection member.

In the present invention, the laser processing apparatus is a laser cutting apparatus for irradiating a work material such as a steel plate with laser light and for moving and cutting the laser torch while injecting an assist gas composed of oxygen gas. A laser welding device for approaching or abutting a work material and irradiating the approaching or abutting portion with a laser beam and spraying an assist gas consisting of an inert gas for welding, or a metal powder or a synthetic resin powder Is melted by laser light, sprayed on the material to be processed and sprayed, and is configured as any one of laser spraying devices and the like.

In this embodiment, the laser processing device is constructed as a laser cutting device. That is, as shown in FIG.
The laser cutting device A according to the present embodiment is configured so that it can be mounted on a pair of rails 1 laid in parallel and run.

The laser cutting device A comprises a saddle 2a mounted on the rail 1 and two garters 2b and 2c arranged in a direction orthogonal to the rail 1, and the saddle 2a and the garters 2b and 2c are connected to each other. It has a frame 2 configured by connecting, a traveling motor 3 is attached to a position corresponding to the rail 1 of the saddle 2a, and a laser oscillator 4 is placed on the upper part of the garter 2c.

A laser optical path 5 is formed starting from the emission port 4a of the laser oscillator 4. The laser optical path 5 is formed between the laser oscillator 4 and the laser torch 7, and maintains a constant distance between the laser torch 7 and the laser oscillator 4 regardless of the position of the laser torch 7 in the frame 2. The reversing mirror 6 is provided.

The laser torch 7 is mounted on a carriage 8 provided so as to traverse along the garter 2b forming the frame 2. Therefore, by controlling the rotation of the traverse motor 9 provided on the carriage 8, it is possible to traverse the garter 2b in a direction orthogonal to the rail 1.

Since the carriage 8 is constructed so as to be able to traverse along the garter 2b, the laser optical path 5 is also formed using the garter 2b. That is, the laser optical path 5 returns from the emission port 4a of the laser oscillator 4 in the direction opposite to the laser oscillator 4 along the garter 2b, is inverted by the reversing mirror 6, and again passes through the emission port 4a of the laser oscillator 4 along the garter 2b. It is formed so that the laser beam can be changed in direction and incident on the laser torch 7.

In the laser optical path 5 constructed as described above,
Mirrors 10a to 10c are provided at the portions for changing directions, and the reversing mirror 6 is provided with a pair of mirrors 6a and 6b at positions facing each other.

The reversing mirror 6 is constructed so as to be able to move along the garter 2b by half the amount of movement of the carriage 8.

In the straight line portion from the emission port 4a of the laser oscillator 4 to the laser torch 7 in the laser optical path 5,
A cover 11 composed of an expandable bellows and a cylindrical body is arranged to prevent the laser light from being exposed by the cover 11 and prevent dust in the air from entering the laser optical path 5.

The control panel 12 incorporates a numerical control (NC) device for controlling the laser cutting device A.
After inputting information such as the material and thickness of the material B to be cut and the information of the figure to be cut by using the input device 13 and the display 14 provided with the keyboard and switches provided in the By starting the process, the traveling motor 3, the traverse motor 9, and the laser oscillator 4 sequentially control the emission of the laser light, so that the material B to be cut can be cut.

In the laser optical path 5, as shown in FIG. 2, a plurality of axis deviation detecting portions 16 are arranged. This axis misalignment detection unit 16 causes the laser light emitted from the laser oscillator 4 to deviate from the optical axis 5a preset in the laser optical path 5 (for example, as shown by the dotted line 5b) in the mirrors 10a to 10c, 6a, 6b.
It is detected that the laser torch 7 cannot be reached due to deviation from any of the above.

For this reason, the axis misalignment detection section 16 has a transmissive section for transmitting the laser beam around the optical axis 5a, and the perimeter of the transmissive section is electrically conductive and is disconnected when the laser beam is irradiated. It is configured by wiring a wire rod. The wire is energized by an energization member 17 such as a power source, and the energization state is monitored by an energization detection member 18 such as an ammeter or a voltmeter.

The energization detecting member 18 is connected to a controller 31 which will be described later, and the controller 31 compares the operating state of the laser oscillator 4 with the energizing state of the wire rod of the misalignment detector 16 to operate the laser oscillator 4. It is in the state and the axis misalignment detection unit 16
When any one of the above is disconnected, it is detected that the laser beam is misaligned.

In this way, the axis misalignment detecting section 16 can instantly evaporate or melt when irradiated with laser light to break the wire, and the conductive wire is used as the laser optical path 5.
It is configured by wiring around the optical axis 5a.

When the laser beam oscillates from the optical axis 5a for some reason and the laser beam irradiates the wire, the wire breaks almost instantaneously, so that the energized state of the wire shifts to the non-energized state. Is detected by the energization detection member 18. Therefore, in the control device, by comparing the operating state of the laser oscillator 4 and the energization state of the wire rod by the energization detection member 18, it becomes possible to recognize whether or not the laser beam has been misaligned. .

The arrangement position and the number of arrangements of the axis misalignment detectors 16 in the laser optical path 5 are not limited, and they may be appropriately arranged at one place or a plurality of places. Further, the axis misalignment detection member 16 is
In short, what is necessary is that the wire can be broken in an extremely short time (instantaneously) when irradiated with the laser beam. Therefore, the axis misalignment detection unit 16 simply uses a wire rod as the optical axis 5 of the laser optical path 5.
It may be arranged around a.

However, if the wire rod is erected in a free state, the rigidity is poor, and vibration may occur as the frame 2 travels, making it impossible to detect an accurate axial displacement. Therefore, wire the wire material that constitutes the axis misalignment detection unit 16 to the substrate,
It is preferable to use the rigidity of the substrate so that the substrate can stand upright in the laser optical path 5.

It is preferable to use the axial deviation detecting member C shown in FIG. 4 as the axial deviation detecting section 16. In the figure, the axial misalignment detecting member C is configured to have an insulating substrate 21, a wire 22, and a terminal 23. The axis shift detecting member C may be provided at any position in the laser optical path 5. However, since the axial misalignment detecting member C needs to be firmly fixed, it is preferably installed on the frame forming the reversing mirror 6 or on the carriage 8 corresponding to the upper end portion of the laser torch 7.

The substrate 21 is made of an insulating material (ceramic, bakelite, etc.), and in particular, the axial deviation detecting member C is arranged and fixed inside the cover 11 arranged in the laser optical path 5. The outer diameter of the substrate 21 is formed smaller than the inner diameter of the cover 11. A plurality of holes 21a are formed in the vicinity of the outer edge of the substrate 21, and the holes 21a are used to be attachable to and detachable from the reversing mirror 6 or the carriage 8 provided in the laser optical path 5.

A hole for transmitting laser light is formed in the center of the substrate 21.
21b is formed, and the center of the hole 21b coincides with the optical axis 5a of the laser optical path 5. A large number of holes 21 are formed around the hole 21b.
c are formed, and the wire rods 22 are wired alternately through the holes 21c in the thickness direction of the substrate 21 (alternately on both surfaces of the substrate 21). Therefore, when the axis shift detection member C is installed in the laser optical path 5, the wires 22 are wired so as to surround the optical axis 5a without contacting each other.

In FIG. 4, the wire rod 22 shown by a solid line in the vertical direction is wired on the front side surface of the substrate 21, and the wire rod 22 shown by a solid line in the horizontal direction is on the other side surface of the substrate 21. It is wired. Also, the horizontal wiring at the intersection of the horizontal wiring and the vertical wiring is shown in a partially cut state, but this is for the sake of convenience to show that both wirings are not in contact with each other. And the actual wiring is not cut.

As described above, the wires 22 are alternately wired in the thickness direction of the substrate 21 in the holes 21b, so that the wires 22 intersecting in the holes 21b are stretched without contacting each other. Therefore,
It is possible to reliably detect the disconnection of the wire 22 without causing the wire 22 to short-circuit.

The substrate 21 is provided with terminals 23, and the ends of the wire 22 are fixed to the terminals 23. In addition, the terminal 23 is connected to a conducting wire 24 connected to the current-carrying member 17 and the current-carrying detection member 18.

The wire 22 is not limited as long as it has conductivity and can be instantly broken when irradiated with laser light. As such a material, for example, solder, magnesium (Mg) ribbon, or the like is used, and solder is used in this embodiment.

In the axis shift detecting member C constructed as described above, when installed in the laser optical path 5, the wire 22 can be stretched firmly around the optical axis 5a to be self-supporting.
Further, since the axis shift detecting member C is configured as a component, when the wire rod 22 is broken, it can be easily replaced.

Next, the control system of the laser cutting apparatus A according to this embodiment will be described with reference to the block diagram of FIG.

In the figure, 31 is a control device, which is a calculation unit.
31a, a program storage unit 31b in which a preset cutting program is written, and a temporary storage unit that temporarily stores data such as the cutting conditions such as the plate thickness of the workpiece B input from the input device 13. 31c and.

The calculation unit 31a also serves as a comparison unit, and compares the signal from the energization detection unit 18 with the operating state of the laser oscillator 4 to determine whether the laser beam is deviated or not. Has a function of generating an axis deviation occurrence signal. Therefore, the control device 31
Has a function as an axis deviation detecting member.

Reference numeral 32 denotes an alarm unit, which has a function of issuing an alarm on the basis of the axis deviation generation signal to warn a worker when the axis deviation generation signal is generated from the control device 31. Further, when an axis deviation occurrence signal is generated from the control device 31, it is possible to stop the cutting based on the axis deviation occurrence signal, or control so as to be able to store the progress position of the program when the cutting is stopped. is there.

In the laser cutting apparatus A constructed as described above, a procedure for detecting that the laser beam is misaligned will be described.

When the material B to be cut is cut, the laser optical path 5
The wire 22 of the shaft misalignment detecting member C arranged in the above position is energized by the energizing member 17 and the energization state is detected by the energization detecting member 18. When the laser beam emitted from the laser oscillator 4 is irradiated along the optical axis 5a, the laser beam does not irradiate the wire 22 of the axis shift detecting member C, and the wire 22 does not break. Therefore, the energization detection member 18 is a wire rod.
A signal is transmitted to the control device 31 by detecting that the energization state to 22 continues.

Therefore, in the control device 31, the laser oscillator 4
And the signal indicating that the energization detection member 18 continues to energize the wire 22. As a result, in the laser cutting device A, the axial deviation of the laser light has not occurred.
It is possible to recognize In this case, the cutting of the material B to be cut is continuously executed.

When the laser light emitted from the laser oscillator 4 is displaced from the optical axis 5a and is irradiated along the dotted line 5b for some reason, the laser light is reflected by the mirrors 10a and 10b as shown in FIG. To the mirror 6a. At this time, in the process in which the laser beam is displaced from the optical axis 5a to the dotted line 5b, the wire 22 of the axis misalignment detecting member C disposed in the middle of the mirror 6a is irradiated and the wire 22 is broken. Therefore, the energization detection member 18 detects that the wire 22 is not energized, and a signal indicating that the wire 22 is in the non-energized state is generated and transmitted to the control device 31.

The control device 31 compares the operating state of the laser oscillator 4 with the signal indicating that the wire 22 by the energization detecting member 18 is not energized. As a result, in the laser cutting device A, the laser beam It is possible to recognize that an axis shift has occurred. In this case, the control device 31 generates a signal indicating that the laser beam is off-axis, and based on this signal, the cutting of the material B to be cut is stopped, and at the same time, the alarm unit 32.
Generates an alarm based on the occurrence of laser beam misalignment to warn the worker.

As described above, when the laser light is deviated from the optical axis 5a, the deviation of the axis is promptly detected to stop the operation of the laser cutting device A or generate an alarm to warn the operator. It becomes possible to do. Therefore, the cutting of the material B to be cut is interrupted because the laser beam is not irradiated with the laser beam due to the axial displacement of the laser beam, or the cover is provided by the laser beam due to the axial displacement of the laser beam. It is possible to prevent troubles such as occurrence of damage to 11.

[0051]

As described above in detail, in the laser processing apparatus according to the present invention, since the wire rod which is broken by the laser light is arranged in the laser optical path, when the laser light with the axis misalignment irradiates the wire rod, The wire breaks with irradiation. Therefore, it is possible to detect whether or not the laser beam is misaligned by comparing the energized state of the wire and the oscillated state of the laser oscillator.

Therefore, processing is interrupted due to the fact that the laser beam is not emitted from the laser torch that is generated when the laser beam is deviated, or the laser beam path due to the deviated laser beam is generated when the laser beam is deviated. It is possible to prevent troubles such as occurrence of damage to the member that regulates.

Further, in the laser beam axis shift detecting member according to the present invention, since the substrate and the wire can be constructed as one component, the wire rod broken by the irradiation of the laser beam with the axis shift is removed from the board. It becomes possible to replace them, which facilitates maintenance due to misalignment of the laser processing device.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an overall configuration of a laser processing apparatus.

FIG. 2 is a diagram illustrating an arrangement of an axis deviation detecting member in a laser optical path.

FIG. 3 is a block diagram for detecting an axis shift of laser light.

FIG. 4 is a diagram illustrating a configuration of an axis deviation detecting member.

[Explanation of symbols]

A laser cutting device B Cut material C axis deviation detection member 1 rail 2 frames 2a saddle 2b, 2c garter 3 traveling motor 4 Laser oscillator 4a exit port 5 Laser optical path 5a optical axis 5b dotted line 6 reverse mirror 6a, 6b mirror 7 laser torch 8 carriage 9 Traverse motor 10a-10c mirror 11 cover 12 Control panel 12a Control panel 13 Input device 14 Display 16 axis misalignment detector 17 Conducting member 18 Current detection member 21 board 21a, 21c holes 21b hole 22 wire rod 23 terminals 24 conductors 31 Control device 31a Operation unit 31b Program storage section 31c Temporary storage 32 Alarm unit

Continued front page    (72) Inventor Mitsuru Watanabe             Koike acid, 3-35-16 Nishikoiwa, Edogawa-ku, Tokyo             Inside (72) Inventor Ryuichi Izawa             Koike acid, 3-35-16 Nishikoiwa, Edogawa-ku, Tokyo             Inside F-term (reference) 4E068 CA06 CA18 CB01 CE07

Claims (3)

[Claims] 1. A laser oscillator, a laser torch, and a laser optical path provided between the laser oscillator and the laser torch. The laser light oscillated from the laser oscillator is irradiated from the laser torch onto a workpiece to obtain a target. In a laser processing device that performs processing, a wire rod that is disposed around an optical axis that is preset in the laser optical path and that has electrical conductivity and that breaks when irradiated with laser light and an electric current that energizes the wire rod. A member, an energization detection member that detects the energization state of the wire, and a laser beam when the energization detection member detects the de-energized state of the wire when laser light is oscillated from a laser oscillator A laser processing apparatus, comprising: 2. The laser processing apparatus according to claim 1, wherein the wire is wired on a base material, and an end portion of the wire is fixed to a terminal provided on the base material. 3. A substrate having an insulating property and having a preset surface configured to allow laser light to pass therethrough, and a wire rod having conductivity and breaking when irradiated with a laser beam. A wire misalignment detecting member for laser light, wherein the wire is wired around a preset surface of the substrate and an end of the wire is fixed to a terminal.