JP2003221693A - Process for manufacturing electrocast core - Google Patents
Process for manufacturing electrocast coreInfo
- Publication number
- JP2003221693A JP2003221693A JP2002020299A JP2002020299A JP2003221693A JP 2003221693 A JP2003221693 A JP 2003221693A JP 2002020299 A JP2002020299 A JP 2002020299A JP 2002020299 A JP2002020299 A JP 2002020299A JP 2003221693 A JP2003221693 A JP 2003221693A
- Authority
- JP
- Japan
- Prior art keywords
- electroformed
- layer
- electroformed layer
- core
- electroforming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title abstract description 21
- 238000005323 electroforming Methods 0.000 claims abstract description 49
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 110
- 230000008719 thickening Effects 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 abstract description 30
- 239000010959 steel Substances 0.000 abstract description 30
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000005422 blasting Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010297 mechanical methods and process Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電鋳中子の製造方
法に関する。TECHNICAL FIELD The present invention relates to a method for manufacturing an electroformed core.
【0002】[0002]
【従来の技術】従来の中子の作製方法においては、表面
に複数の微小な構造を有する基材を直接電鋳し、所定の
厚さの電鋳層(例えばニッケル層)を形成し、中子を形
成する。樹脂射出成形用モルドの中子を形成するとき、
一般に、所定の厚さ(例えば20mm)が必要である。2. Description of the Related Art In a conventional method for producing a core, a base material having a plurality of minute structures is directly electroformed on its surface to form an electroformed layer (for example, nickel layer) having a predetermined thickness. Form a child. When forming a mold core for resin injection molding,
Generally, a certain thickness (eg 20 mm) is required.
【0003】しかしながら、一般に、1mmの電鋳層を
形成しようとすれば、24時間の電鋳時間が必要である
ので、20mmの厚さの電鋳層を形成したいのなら、2
0日の長い電鋳時間が必要であり、多くの時間が必要で
あり、製作コストが増加する。一方、表面に複数の微小
な構造を有する基材に電鋳を行っているとき、ミスが発
生すると、電鋳をもう一度やり直す必要があるので、作
業効率が低下する。However, in general, if an electroformed layer of 1 mm is to be formed, it takes 24 hours to form an electroformed layer. Therefore, if it is desired to form an electroformed layer of 20 mm in thickness, 2
A long electroforming time of 0 days is required, a lot of time is required, and the manufacturing cost is increased. On the other hand, when an electroforming is performed on a base material having a plurality of minute structures on the surface, if an error occurs, it is necessary to perform electroforming again, so that the work efficiency decreases.
【0004】図7に示すのは、従来のモルドの作製方法
の概略図であり、この方法では予めモルド原型71の表
面に電鋳でモルド面殻層72を形成してから、ショット
ブラスト技術によりモルド面殻層72を清浄にし、次に
アーク溶射方法で金属ワイヤを電鋳層の表面に溶射し、
溶射層73を形成し、溶射層73を補修した後、真空ろ
う付けにより溶射層73をモルドプレート74と結合す
る。FIG. 7 is a schematic view of a conventional method for producing a mold. In this method, a mold surface shell layer 72 is formed on a surface of a mold master 71 in advance by electroforming, and then a shot blasting technique is used. Cleaning the mold surface shell layer 72, then spraying a metal wire on the surface of the electroformed layer by an arc spraying method,
After forming the sprayed layer 73 and repairing the sprayed layer 73, the sprayed layer 73 is bonded to the mold plate 74 by vacuum brazing.
【0005】しかしながら、前述の方法は、電鋳で薄い
モルド面殻層72を形成してから、他の加工方法の利用
すれば、モルドを増厚し、モルドの形成時間を短縮する
ことができるが、この電鋳のモルド面殻層72の表面は
一般にモルドと対応する微小構造を有するため、モルド
面殻層72に対しショットブラストを行っているとき、
モルド面殻層72が高圧衝撃を受け、破壊され易く、中
子の精度が悪化する。However, in the above-mentioned method, if the thin mold shell layer 72 is formed by electroforming and then another processing method is used, the mold can be thickened and the mold forming time can be shortened. However, since the surface of the electroformed mold surface shell layer 72 generally has a microstructure corresponding to the mold, when performing shot blasting on the mold surface shell layer 72,
The mold surface shell layer 72 is subject to high-pressure impact and is easily broken, and the accuracy of the core deteriorates.
【0006】[0006]
【発明が解決しようとする課題】そこで、本発明の目的
は、中子の厚さを迅速に増加し、電鋳の時間を短縮でき
る電鋳中子の製造方法を提供することにある。本発明の
別の目的は、製造過程中での中子の変形を防止できる電
鋳中子の製造方法を提供することにある。SUMMARY OF THE INVENTION It is, therefore, an object of the present invention to provide a method for manufacturing an electroformed core which can rapidly increase the thickness of the core and shorten the electroforming time. Another object of the present invention is to provide a method for manufacturing an electroformed core that can prevent deformation of the core during the manufacturing process.
【0007】[0007]
【課題を解決するための手段】本発明の請求項1記載の
電鋳中子の製造方法によると、少なくとも1つの加工面
を有し前記加工面に複数の凹凸部を有する、基材を電鋳
タンクの内部に配置する。電鋳タンクの内部に所定の量
の電鋳液を入れ、基材と電鋳液にそれぞれ極性の異なる
電流を流す。加工面に電鋳で第1電鋳層を形成し、第1
電鋳層の加工面と対応する面に凹凸部と互いに補うモル
ド面を形成する。また、第1増厚材を第1電鋳層の基材
と離れた一面に結合し、第1増厚材、第1電鋳層および
基材から結合体を形成する。基材を第1電鋳層と分離し
た後、少なくとも第1電鋳層および第1増厚材より電鋳
中子を形成する。According to the method of manufacturing an electroformed core according to claim 1 of the present invention, a base material having at least one processed surface and a plurality of uneven portions on the processed surface is electrically charged. It is placed inside the casting tank. A predetermined amount of electroforming liquid is placed in the electroforming tank, and electric currents having different polarities are supplied to the base material and the electroforming liquid. The first electroformed layer is formed on the processed surface by electroforming, and the first electroformed layer is formed.
Molded surfaces are formed on the surface of the electroformed layer corresponding to the processed surface to complement the irregularities. Further, the first thickened material is bonded to one surface of the first electroformed layer separated from the base material to form a combined body from the first thickened material, the first electroformed layer and the base material. After separating the base material from the first electroformed layer, an electroformed core is formed from at least the first electroformed layer and the first thickened material.
【0008】本発明の請求項2記載の電鋳中子の製造方
法によると、まず第1増厚材の表面を荒らし、粘着剤で
第1増厚材を第1電鋳層に粘着する。本発明の請求項3
記載の電鋳中子の製造方法によると、第1増厚材および
第1電鋳層の表面に、一層の溶接剤を塗布する。溶接剤
を加熱し、溶接剤で第1増厚材を第1電鋳層に結合す
る。According to the method of manufacturing an electroformed core according to the second aspect of the present invention, first, the surface of the first thickening material is roughened, and the first thickening material is adhered to the first electroformed layer with an adhesive. Claim 3 of the present invention
According to the method for producing an electroformed core described above, one layer of the welding agent is applied to the surfaces of the first thickened material and the first electroformed layer. The welding agent is heated to bond the first thickened material to the first electroformed layer with the welding agent.
【0009】本発明の請求項4記載の電鋳中子の製造方
法によると、第1増厚材を第1電鋳層に接触させ、レー
ザビームを第1増厚材と第1電鋳層との周縁部に平均に
投射し、第1増厚材を第1電鋳層に結合する。本発明の
請求項5記載の電鋳中子の製造方法によると、第1増厚
材を第1電鋳層に結合した後、第1増厚材の第1電鋳層
と離れた一面に電鋳で第2電鋳層を形成する。基材を第
1電鋳層と分離し、第2電鋳層、第1増厚材および第1
電鋳層から金属層を形成する。第2増厚材を金属層の第
1電鋳層と離れた一面に結合し、中子を形成する。According to the method of manufacturing an electroformed core according to claim 4 of the present invention, the first thickened material is brought into contact with the first electroformed layer, and the laser beam is applied to the first thickened material and the first electroformed layer. The first thickened material is bonded to the first electroformed layer by projecting evenly on the peripheral edge of the. According to the method for producing an electroformed core according to claim 5 of the present invention, after the first thickened material is bonded to the first electroformed layer, the first thickened material is provided on one surface separated from the first electroformed layer. The second electroformed layer is formed by electroforming. The base material is separated from the first electroformed layer, and the second electroformed layer, the first thickening material and the first electroformed layer are formed.
A metal layer is formed from the electroformed layer. The second thickening material is bonded to one surface of the metal layer separated from the first electroformed layer to form a core.
【0010】本発明の請求項6記載の電鋳中子の製造方
法によると、第1電鋳層を基材の表面に形成した後、基
材を第1電鋳層から分離する。本発明の請求項7記載の
電鋳中子の製造方法によると、結合体における第1増厚
材の第1電鋳層と離れた一面を第2増厚材と結合し、基
材を第1電鋳層から分離した後、第2増厚材、第1増厚
材および第1電鋳層から中子を形成する。According to the method for producing an electroformed core according to the sixth aspect of the present invention, after the first electroformed layer is formed on the surface of the base material, the base material is separated from the first electroformed layer. According to the method for producing an electroformed core according to claim 7 of the present invention, one surface of the combined body which is apart from the first electroformed layer of the first thickened material is bonded to the second thickened material, and the base material is After separating from the first electroformed layer, a core is formed from the second thickened material, the first thickened material and the first electroformed layer.
【0011】本発明は、電鋳でより薄い電鋳層を形成し
た後、電鋳層を増厚材と結合するため、中子の厚さを短
時間で増加でき、電鋳の時間を短縮できる。また、本発
明は、電鋳で第1電鋳層を基材に形成し、第1電鋳層の
基材と隣接する表面に基材と互いに補うモルド面を形成
し、増厚材の下表面に対しショットブラストを行った
後、増厚材の下表面を第1電鋳層のモルド面と相対する
一面の反対面に結合するため、第1電鋳層のモルド面の
破壊を回避でき、製造過程での中子の変形を防止でき
る。According to the present invention, since a thinner electroformed layer is formed by electroforming and then the electroformed layer is combined with a thickening material, the thickness of the core can be increased in a short time and the electroforming time can be shortened. it can. In addition, the present invention forms a first electroformed layer on a base material by electroforming, forms a mold surface on the surface adjacent to the base material of the first electroformed layer to complement the base material, and After performing shot blasting on the surface, the lower surface of the thickened material is bonded to the opposite surface of the first electroformed layer opposite to the molded surface, so that the destruction of the molded surface of the first electroformed layer can be avoided. It is possible to prevent the core from being deformed during the manufacturing process.
【0012】[0012]
【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて説明する。
(実施例1)図1および図2は、本発明の実施例1であ
り、説明のために挙げる一例であり、特許請求範囲はこ
の構造に限定しない。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) FIGS. 1 and 2 show Embodiment 1 of the present invention, which is an example given for explanation, and the claims are not limited to this structure.
【0013】本発明の実施例1による電鋳中子の製造方
法によると、下記のプロセスを有する。
(イ)電鋳:基材11を電鋳タンク(図示省略)の内部
に配置し、基材11は非導電性材料(例えばアクリルや
ガラス)、導電性材料(例えば金型鋼)又はこの技術の
熟練者が良く知る材料のいずれかで作製する。基材11
は加工面111を有し、加工面111は黄光プロセスま
たは機械加工などの方法(それらは全て周知の加工技術
であるため、説明を省略)で所定の数量または外形を有
する凹凸構造を形成する。電鋳タンクの内部には所定の
量の電鋳液を入れる。電鋳液はニッケルスルファメート
(Nickel Sulfamate、Ni(SO3NH2)2)溶液であ
る。なお、基材11と電鋳液にはそれぞれ異なる極性の
操作電流密度(2ASD〜8ASD、ASDはA/10
0cm2)を流す。基材11の加工面111に電鋳で第
1電鋳層12を形成し、第1電鋳層12の加工面111
と相対する面に複数の凹凸構造と互いに補うモルド面1
21を形成する。第1電鋳層12の厚さは1〜2mmで
ある。The method of manufacturing an electroformed core according to the first embodiment of the present invention has the following processes. (A) Electroforming: The base material 11 is placed inside an electroforming tank (not shown), and the base material 11 is made of a non-conductive material (for example, acrylic or glass), a conductive material (for example, mold steel), or of this technology. Made of any of the materials familiar to the skilled person. Base material 11
Has a processed surface 111, and the processed surface 111 forms a concave-convex structure having a predetermined number or outer shape by a method such as a yellow light process or machining (these are all known processing techniques, and therefore description thereof is omitted). . A predetermined amount of electroforming liquid is put in the electroforming tank. The electroforming liquid is a nickel sulfamate (Nickel Sulfamate, Ni (SO 3 NH 2 ) 2 ) solution. The substrate 11 and the electroforming liquid have different operating current densities (2 ASD to 8 ASD, ASD is A / 10, respectively).
0 cm 2 ) is poured. The first electroformed layer 12 is formed by electroforming on the processed surface 111 of the base material 11, and the processed surface 111 of the first electroformed layer 12 is formed.
Mold surface 1 that complements each other with a plurality of uneven structures on the surface opposite to
21 is formed. The thickness of the first electroformed layer 12 is 1 to 2 mm.
【0014】(ロ)結合:スプレーガン(図示省略)を
利用し、第1増厚材に対しショットブラストを行う。本
実施例では、第1増厚材は第1金型鋼13であり、ショ
ットブラストにより第1金型鋼13の下表面131を荒
らす。第1金型鋼13の硬さはHRC30〜40であ
る。粘着剤16(例えば銀のりBR57又は錫のり)に
より第1金型鋼13の下表面131を第1電鋳層12の
基材11と離れた一面に粘着し、第1金型鋼13、第1
電鋳層12および基材11から結合体60を形成する。(B) Bonding: Shot blasting is performed on the first thickened material using a spray gun (not shown). In this embodiment, the first thickening material is the first die steel 13, and the lower surface 131 of the first die steel 13 is roughened by shot blasting. The hardness of the first mold steel 13 is HRC30-40. The adhesive 16 (for example, silver paste BR57 or tin paste) adheres the lower surface 131 of the first mold steel 13 to one surface of the first electroformed layer 12 apart from the base material 11 to form the first mold steel 13 and the first mold steel 13.
The combined body 60 is formed from the electroformed layer 12 and the base material 11.
【0015】(ハ)2回目電鋳:結合体60を電鋳タン
クの内部に配置し、2回目電鋳を行い、第2電鋳層14
を第1金型鋼13の表面に形成する。第2電鋳層14の
厚さはおおむね1〜2mmである。図3に示すように、
2回目電鋳時に、金属イオンを第1金型鋼13と第1電
鋳層12との間の空所Aに付着する。(C) Second electroforming: The combined body 60 is placed inside the electroforming tank, the second electroforming is performed, and the second electroformed layer 14 is formed.
Are formed on the surface of the first die steel 13. The thickness of the second electroformed layer 14 is approximately 1 to 2 mm. As shown in FIG.
During the second electroforming, metal ions are attached to the space A between the first mold steel 13 and the first electroformed layer 12.
【0016】(ニ)分離:機械方法で基材11を第1電
鋳層から分離し、第1電鋳層12、第1金型鋼13およ
び第2電鋳層14より金属層10を形成する。金属層1
0の厚さはおおむね8mm〜10mmである。
(ホ)2回目結合:金属層10に複数のねじ孔を形成す
る。複数のねじ15でねじ孔を介し金属層10を第2増
厚材に固定する。第2増厚材は第2金型鋼20であり、
第2金型鋼20の硬さはHRC30〜40である。第2
金型鋼20と金属層10が結合した厚さが約20mmで
ある中子を形成する。(D) Separation: The substrate 11 is separated from the first electroformed layer by a mechanical method, and the metal layer 10 is formed from the first electroformed layer 12, the first die steel 13 and the second electroformed layer 14. . Metal layer 1
The thickness of 0 is approximately 8 mm to 10 mm. (E) Second connection: forming a plurality of screw holes in the metal layer 10. The metal layer 10 is fixed to the second thickened material through the screw holes with the plurality of screws 15. The second thickening material is the second mold steel 20,
The hardness of the second mold steel 20 is HRC30-40. Second
The mold steel 20 and the metal layer 10 are combined to form a core having a thickness of about 20 mm.
【0017】本実施例では、わずかに2回の電鋳で厚さ
が20mmの中子を製造できる。それぞれ1〜2mmの
電鋳層12および電鋳層14を形成し、すなわち2〜4
mmの電鋳層を作製する。本実施例は、従来技術の電鋳
で20mmの電鋳層の形成に必要な時間と比べ、大幅に
電鋳時間を短縮し、製造コストを低減する。In the present embodiment, a core having a thickness of 20 mm can be manufactured by electroforming only twice. The electroformed layer 12 and the electroformed layer 14 each having a thickness of 1 to 2 mm are formed, namely, 2 to 4
A mm electroformed layer is prepared. This example significantly shortens the electroforming time and reduces the manufacturing cost as compared with the time required to form an electroformed layer of 20 mm in the electroforming of the prior art.
【0018】第1金型鋼13を第1電鋳層12に粘着す
るとき、第1電鋳層12の表面が滑らか過ぎて粘着が困
難になることを回避するため、第1金型鋼13の表面に
対しショットブラストを行い、第1金型鋼13の表面と
第1電鋳層12との間の粘着面積及び摩擦力を増加す
る。このため、第1金型鋼13を強固に第1電鋳層12
に粘着できる。When the first mold steel 13 is adhered to the first electroformed layer 12, the surface of the first mold steel 13 is avoided in order to prevent the surface of the first electroformed layer 12 from being too smooth and making the adhesion difficult. Then, shot blasting is performed to increase the adhesion area and the frictional force between the surface of the first die steel 13 and the first electroformed layer 12. Therefore, the first die steel 13 is firmly fixed to the first electroformed layer 12
Can stick to.
【0019】また、本実施例は、第1電鋳層12ではな
く、第1金型鋼13の表面に対しショットブラストを行
うため、第1電鋳層12のモルド面121はショットブ
ラストの高圧で破壊されない。このため、中子の第1電
鋳層12およびモルド面121の変形および損傷を回避
できる。Further, in this embodiment, since the shot blasting is performed not on the first electroformed layer 12 but on the surface of the first die steel 13, the mold surface 121 of the first electroformed layer 12 is exposed to the high pressure of shot blasting. Not destroyed. Therefore, the deformation and damage of the first electroformed layer 12 and the mold surface 121 of the core can be avoided.
【0020】図3に示すAのように、第2電鋳層14を
電鋳している間に、金属イオンを第1電鋳層12と第1
金型鋼13との間の空所に付着し、電鋳層を形成する。
このため、第1金型鋼13と第1電鋳層12との間の空
所を補填する効果を達成できる。As indicated by A in FIG. 3, while the second electroformed layer 14 is being electroformed, metal ions are applied to the first electroformed layer 12 and the first electroformed layer 12.
It adheres to the space between the mold steel 13 and forms an electroformed layer.
Therefore, the effect of filling the void between the first die steel 13 and the first electroformed layer 12 can be achieved.
【0021】第1増厚材および第2増厚材は技術の熟練
者がよく知る他の材料を採用できる。前述したことをま
とめると、本実施例のプロセスは、まず電鋳で基材の表
面に電鋳層を形成し、電鋳層に基材と互いに補うモルド
面を形成する。また、増厚材を電鋳層に粘着してから、
それらを基材から分離する。なお、2個の電鋳層と増厚
材より構成される金属層に増厚材を固定し、所定の厚さ
を有する中子を短時間で形成できる。このため、本実施
例は、中子の製造時間を短縮し、中子の変形を回避でき
る。As the first thickening material and the second thickening material, other materials familiar to those skilled in the art can be adopted. To summarize the above, in the process of this example, first, an electroformed layer is formed on the surface of the base material by electroforming, and a mold surface that complements the base material is formed on the electroformed layer. Also, after adhering the thickened material to the electroformed layer,
Separate them from the substrate. The thickening material can be fixed to a metal layer composed of two electroformed layers and the thickening material to form a core having a predetermined thickness in a short time. Therefore, in this embodiment, the core manufacturing time can be shortened and the core deformation can be avoided.
【0022】(実施例2)本発明は、細部の変化のみの
その他の様々な変化例を有する。図4および図5に示す
ように、本発明の実施例2である電鋳中子の製造方法に
よると、下記のプロセスを有する。(Embodiment 2) The present invention has various other modifications only in the details. As shown in FIGS. 4 and 5, according to the method for manufacturing an electroformed core, which is Embodiment 2 of the present invention, it has the following processes.
【0023】(イ)電鋳:基材31を実施例1で述べた
電鋳タンクの内部に配置し、基材11は所定の量および
外形で形成する凹凸構造を有する加工面311を有す
る。電鋳タンクの内部に所定の量の電鋳液を入れる。な
お、極性の異なる電流をそれぞれ基材31および電鋳液
に流して、電鋳により基材31の加工面311に第1電
鋳層32を形成し、第1電鋳層32の加工面311と相
対する面に複数の凹凸構造と互いに補うモルド面321
を形成する。(A) Electroforming: The base material 31 is placed inside the electroforming tank described in the first embodiment, and the base material 11 has a processed surface 311 having a concavo-convex structure formed with a predetermined amount and outer shape. Pour a predetermined amount of electroforming liquid into the electroforming tank. It is to be noted that currents having different polarities are respectively passed through the base material 31 and the electroforming liquid to form the first electroformed layer 32 on the processed surface 311 of the base material 31 by electroforming, and the processed surface 311 of the first electroformed layer 32 is formed. Mold surface 321 that complements each other with a plurality of uneven structures on the surface opposite to
To form.
【0024】(ロ)分離:機械方法により第1電鋳層3
2を基材31から分離する。
(ハ)結合:第1増厚材33と第1電鋳層32との表面
に溶接剤36を塗布すしてから、この溶接剤36を加熱
し、第1増厚材33を溶接剤36により第1電鋳層32
と結合する。なお、第1増厚材33および第1電鋳層3
2に対し温度および圧力を連続的に加え、第1増厚材3
3を第1電鋳層32に強固に結合する。(B) Separation: First electroformed layer 3 by mechanical method
2 is separated from the base material 31. (C) Bonding: After the welding agent 36 is applied to the surfaces of the first thickening material 33 and the first electroformed layer 32, the welding agent 36 is heated and the first thickening material 33 is bonded by the welding agent 36. First electroformed layer 32
Combine with. The first thickened material 33 and the first electroformed layer 3
The temperature and pressure are continuously applied to the second thickening material 3
3 is firmly bonded to the first electroformed layer 32.
【0025】(ニ)2回目結合:第1増厚材33に複数
のねじ孔を形成し、ねじ35で第1増厚材33および第
1電鋳層32を第2増厚材40に固定し、本実施例の中
子を形成する。実施例2では、第1電鋳層32を第1増
厚材33と結合してから、それらを第2増厚材40に固
定するため、より短時間で中子を増厚することができ
る。(D) Second connection: A plurality of screw holes are formed in the first thickening material 33, and the first thickening material 33 and the first electroformed layer 32 are fixed to the second thickening material 40 with screws 35. Then, the core of this embodiment is formed. In the second embodiment, since the first electroformed layer 32 is bonded to the first thickening material 33 and then they are fixed to the second thickening material 40, the core can be thickened in a shorter time. .
【0026】さらに、第1電鋳層32は基材31の凹凸
構造と対応するモルド面321を有するため、第1電鋳
層32を第1増厚材33と結合し、中子を形成できる。
(実施例3)図6に示すように、本発明の実施例3であ
る電鋳中子の製造方法によると、下記の、実施例2と異
なる点を有する。Further, since the first electroformed layer 32 has the mold surface 321 corresponding to the concavo-convex structure of the base material 31, the first electroformed layer 32 can be combined with the first thickening material 33 to form a core. . (Embodiment 3) As shown in FIG. 6, the electrocasting core manufacturing method according to Embodiment 3 of the present invention has the following different points from Embodiment 2.
【0027】第1金型鋼53をレーザビームで第1電鋳
層52と結合する。レーザビーム(波長は1064μ
m)を第1金型鋼53と第1電鋳層52の周縁部(D点
に示す)に平均に投射する。レーザビームの直径は0.
2〜0.6mmである。なお、第1金型鋼53および第
1電鋳層52は半分の溶接点(0.1〜0.3mm)を
占める。第1増厚材53をレーザビームで第1電鋳層5
2と結合するため、中子の製造効率を有効に向上でき、
実施例1と同様の効果を達成できる。The first die steel 53 is joined to the first electroformed layer 52 by a laser beam. Laser beam (wavelength is 1064μ
m) is evenly projected onto the peripheral edges (shown at point D) of the first die steel 53 and the first electroformed layer 52. The laser beam diameter is 0.
It is 2 to 0.6 mm. The first die steel 53 and the first electroformed layer 52 occupy a half welding point (0.1 to 0.3 mm). The first thickened material 53 is irradiated with the laser beam to the first electroformed layer 5
Since it is combined with 2, the manufacturing efficiency of the core can be effectively improved,
The same effect as that of the first embodiment can be achieved.
【0028】[0028]
【発明の効果】本発明は下記の効果を有する。
(イ)電鋳でより薄い電鋳層を形成した後、電鋳層を増
厚材と結合するため、中子の厚さを短時間で増加し、電
鋳の時間を短縮できる。
(ロ)電鋳で第1電鋳層を基材に形成し、第1電鋳層の
基材と隣接する表面に基材と互いに補うモルド面を形成
する。増厚材の下表面に対しショットブラストを行った
後、増厚材の下表面を第1電鋳層のモルド面と相対する
面の反対面に結合する。このため、第1電鋳層のモルド
面の破壊を回避でき、製造過程での中子の変形を防止で
きる。The present invention has the following effects. (A) Since a thinner electroformed layer is formed by electroforming and the electroformed layer is bonded to the thickened material, the thickness of the core can be increased in a short time and the electroforming time can be shortened. (B) A first electroformed layer is formed on a base material by electroforming, and a mold surface that complements the base material is formed on the surface of the first electroformed layer adjacent to the base material. After shot blasting the lower surface of the thickened material, the lower surface of the thickened material is bonded to the surface of the first electroformed layer opposite to the mold surface. For this reason, it is possible to avoid the destruction of the mold surface of the first electroformed layer and prevent the deformation of the core during the manufacturing process.
【図1】本発明の実施例1による電鋳中子の製造方法の
フローを示す図である。FIG. 1 is a diagram showing a flow of a method for manufacturing an electroformed core according to Example 1 of the present invention.
【図2】本発明の実施例1による電鋳中子の製造方法を
説明するための模式図である。FIG. 2 is a schematic diagram for explaining a method for manufacturing an electroformed core according to Example 1 of the present invention.
【図3】図2の局部拡大図である。3 is a partially enlarged view of FIG.
【図4】本発明の実施例2による電鋳中子の製造方法の
フローを示す図である。FIG. 4 is a diagram showing a flow of a method for manufacturing an electroformed core according to Example 2 of the present invention.
【図5】本発明の実施例2による電鋳中子の製造方法を
示す模式図である。FIG. 5 is a schematic view showing a method for manufacturing an electroformed core according to Example 2 of the present invention.
【図6】本発明の実施例3による電鋳中子の製造方法に
おいてレーザで金型鋼を第1電鋳層と結合させる方法を
説明するための模式図である。FIG. 6 is a schematic diagram for explaining a method of bonding a die steel to a first electroformed layer by a laser in a method for manufacturing an electroformed core according to Example 3 of the present invention.
【図7】従来の金型作製方法を説明するための模式図で
ある。FIG. 7 is a schematic diagram for explaining a conventional die manufacturing method.
10 金属層 11 基材 12 第1電鋳層 13 第1金型鋼 14 第2電鋳層 15 ねじ 16 粘着剤 20 第2金型鋼 31 基材 32 第1電鋳層 33 第1増厚材 35 ねじ 36 溶接剤 40 第2増厚材 52 第1電鋳層 53 第1金型鋼 60 結合体 111 加工面 121 モルド面 311 加工面 321 モルド面 10 metal layers 11 Base material 12 First electroformed layer 13 First mold steel 14 Second electroformed layer 15 screws 16 Adhesive 20 Second mold steel 31 Base material 32 First electroformed layer 33 First thickening material 35 screws 36 Welding agent 40 Second thickening material 52 First electroformed layer 53 1st die steel 60 combination 111 Processing surface 121 Mold surface 311 Processing surface 321 Mold surface
Claims (7)
面に複数の凹凸部を有する基材を電鋳タンクの内部に配
置し、前記電鋳タンクの内部に所定の量の電鋳液を入
れ、前記基材および前記電鋳液にそれぞれ極性の異なる
電流を流し、前記加工面に電鋳で第1電鋳層を形成し、
前記第1電鋳層の前記加工面と対応する面に前記凹凸部
と互いに補うモルド面を形成し、第1増厚材を前記第1
電鋳層の前記基材と離れた一面に結合し、前記第1増厚
材、前記第1電鋳層および前記基材から結合体を形成
し、前記基材を前記第1電鋳層と分離した後、少なくと
も前記第1電鋳層および前記第1増厚材より電鋳中子を
形成することを特徴とする電鋳中子の製造方法。1. A base material having at least one machined surface and having a plurality of concave and convex portions on the machined surface is disposed inside an electroforming tank, and a predetermined amount of electroforming liquid is introduced into the electroforming tank. Then, the base material and the electroforming liquid are respectively supplied with electric currents having different polarities to form a first electroformed layer on the processed surface by electroforming,
Formed on the surface of the first electroformed layer corresponding to the processed surface is a mold surface that complements the uneven portion, and the first thickening material is used as the first thickened material.
Bonding to one surface of the electroformed layer separated from the base material, a combined body is formed from the first thickening material, the first electroformed layer and the base material, and the base material is the first electroformed layer. After the separation, an electroformed core is formed from at least the first electroformed layer and the first thickened material.
で前記第1増厚材を前記第1電鋳層に粘着することを特
徴とする請求項1記載の電鋳中子の製造方法。2. The electroformed core according to claim 1, wherein the surface of the first thickened material is roughened, and the first thickened material is adhered to the first electroformed layer with an adhesive. Production method.
表面に一層の溶接剤を塗布し、前記溶接剤を加熱し、前
記溶接剤で前記第1増厚材を前記第1電鋳層に結合する
ことを特徴とする請求項1記載の電鋳中子の製造方法。3. A layer of welding agent is applied to the surfaces of the first thickening material and the first electroformed layer, the welding agent is heated, and the first thickening material is applied to the first thickening material with the welding agent. The method for producing an electroformed core according to claim 1, wherein the electroformed core is bonded to the electroformed layer.
させ、レーザビームを前記第1増厚材および前記第1電
鋳層の周縁部に平均に投射し、前記第1増厚材を前記第
1電鋳層に結合することを特徴とする請求項1記載の電
鋳中子の製造方法。4. The first thickened material is brought into contact with the first electroformed layer, and a laser beam is projected evenly on the peripheral portions of the first thickened material and the first electroformed layer to form the first thickened material. The method of manufacturing an electroformed core according to claim 1, wherein a thickening material is bonded to the first electroformed layer.
し、前記第1増厚材の前記第1電鋳層と離れた一面に電
鋳で第2電鋳層を形成し、前記基材を前記第1電鋳層と
分離し、前記第2電鋳層、前記第1増厚材および前記第
1電鋳層から金属層を形成し、第2増厚材を前記金属層
の前記第1電鋳層と離れた一面に結合し、前記電鋳中子
を形成することを特徴とする請求項1記載の電鋳中子の
製造方法。5. The second thickening material is bonded to the first electroformed layer, and a second electroformed layer is formed by electroforming on one surface of the first thickened material separated from the first electroformed layer. Then, the base material is separated from the first electroformed layer, a metal layer is formed from the second electroformed layer, the first thickened material and the first electroformed layer, and the second thickened material is formed as described above. The method for producing an electroformed core according to claim 1, wherein the electroformed core is formed by bonding the metal layer to one surface of the metal layer which is separated from the first electroformed layer.
した後、前記基材を前記第1電鋳層から分離することを
特徴とする請求項1記載の電鋳中子の製造方法。6. The electroformed core according to claim 1, wherein the base material is separated from the first electroformed layer after the first electroformed layer is formed on the surface of the base material. Production method.
記第1電鋳層と離れた一面を第2増厚材と結合し、前記
基材を前記第1電鋳層から分離した後、前記第2増厚
材、前記第1増厚材および前記第1電鋳層から前記電鋳
中子を形成することを特徴とする請求項1記載の電鋳中
子の製造方法。7. A surface of the bonded body, which is away from the first electroformed layer of the first thickened material, is bonded to a second thickened material, and the base material is separated from the first electroformed layer. The method for producing an electroformed core according to claim 1, wherein the electroformed core is formed from the second thickened material, the first thickened material, and the first electroformed layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002020299A JP2003221693A (en) | 2002-01-29 | 2002-01-29 | Process for manufacturing electrocast core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002020299A JP2003221693A (en) | 2002-01-29 | 2002-01-29 | Process for manufacturing electrocast core |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003221693A true JP2003221693A (en) | 2003-08-08 |
Family
ID=27743826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002020299A Pending JP2003221693A (en) | 2002-01-29 | 2002-01-29 | Process for manufacturing electrocast core |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003221693A (en) |
-
2002
- 2002-01-29 JP JP2002020299A patent/JP2003221693A/en active Pending
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