JP2003218571A - Cooling device and method of manufacturing the same - Google Patents

Abstract

(57) [Summary] A leakage of a liquid medium passed as a cooling medium between cooling fins arranged inside a chassis can be prevented,
Provided is a cooling device having excellent maintainability and a method for manufacturing the same. A cooling device that mounts an electronic device and cools the electronic device by using a liquid medium that passes between cooling fins disposed inside a chassis includes a chassis including four plate-shaped chassis members. Each of the chassis members has a structure in which cooling fins are inserted into the chassis member from a direction that becomes an outer surface of the chassis.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for cooling an electronic device that has generated heat via a liquid medium and a method for manufacturing the same, and more particularly to a semiconductor device mounted on an electronic board mounted on an aircraft or a computer. The present invention relates to a cooling device for removing heat generated from an electronic device such as an electronic device such as a chip and a hard disk drive to prevent malfunction of the electronic device, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Electronic components generate a considerable amount of heat as they operate. An electronic substrate manufactured by combining such electronic components, an electronic device, or a semiconductor chip in which various electronic components are integrated into one electronic component (hereinafter,
These are collectively referred to as "electronic devices"), and the amount of heat generated by their operation also increases.

Electronic equipment is generally vulnerable to heat, and the heat generated by its own operation may interfere with its operation. Therefore, the electronic equipment must be provided with various measures for increasing heat dissipation efficiency. There are many. For example, a metal component called a heat sink is directly attached to a semiconductor chip, or a fan is attached to directly blow air to improve heat dissipation efficiency and prevent malfunction of the semiconductor chip.

On the other hand, in recent years, since the mounting density and the integration density of electronic parts have been improved, the amount of heat generated has increased. for that reason,
If a heat sink is simply attached to an electronic device that generates a large amount of heat, heat dissipation is insufficient.Furthermore, even if air is blown directly, if dust, dust, or moisture contained in the air adheres to the fine wiring, Corrosion progresses from the site,
Problems such as easy insulation occurred. Therefore, a method of indirectly cooling an electronic device with cooling air has been developed (see, for example, Japanese Patent Application Laid-Open No. 7-221479).

FIG. 1 is a perspective view showing an example of a cooling device (hereinafter, referred to as "air cooling device") for indirectly cooling an electronic device with cooling air. The air-cooling device shown in the figure is configured so that an electronic board (not shown) can be mounted inside the box-shaped chassis 1, and the cooling fins 2 arranged inside the chassis 1 generate the electronic board. The dispersed heat is efficiently dispersed and the cooling air is caused to flow between the cooling fins 2, so that the dispersed heat is radiated to the cooling air, and malfunction of the electronic substrate is prevented.

At this time, the pressure applied to the chassis 2 by the passage of the cooling air is about 4903 Pa (0.05 kg / cm ² ), which is not large enough to cause damage such as cracks in the chassis 2. For example, even if the chassis 2 cracks, it is the cooling air that leaks, so the design of the air cooling device is
It does not need to be performed extremely strictly, and the production itself is not difficult.

[0007]

As the packaging density and the integration density of electronic components are further improved, the amount of heat generated from electronic equipment is also increased, and therefore a more efficient heat dissipation method is required. As an alternative to the cooling method using cooling air, there is a cooling method using a liquid medium. For example, Japanese Patent Laid-Open No. 10-2
Japanese Patent No. 13370 discloses an invention of a cooling device that allows a liquid medium to pass through a pipe to radiate heat from a semiconductor chip.

If such a cooling method using a liquid medium is applied to the air-cooling device shown in FIG. 1 and the liquid medium is passed instead of the cooling air, the heat dissipation effect of the liquid medium and the heat dispersion effect of the cooling fins can be achieved. Thereby, an extremely high heat dissipation effect can be obtained.

However, since the liquid medium has a higher density than the cooling air, a pump for applying pressure to the liquid medium is required to pass the liquid medium between the cooling fins, and at this time, the liquid medium is cooled. The pressure applied to the chassis by passing between the fins is 980665Pa (10kg / c
It reaches about m ² ).

Therefore, in the air-cooling device as shown in FIG. 1, if the liquid medium is simply used instead of the cooling air, the chassis will be destroyed. Further, unlike the cooling air, since a liquid medium is used, if the liquid medium leaks from the destruction site, even a small amount leads to damage of the electronic device. Therefore, conventionally, a cooling device using such a liquid medium has not been manufactured.

The present invention solves the above problems and provides a cooling device for cooling an electronic device by passing a liquid medium between cooling fins arranged inside a chassis, and a manufacturing method thereof. .

[0012]

[Means for Solving the Problems] In designing the structure of a cooling device, the present inventors have examined a portion where a liquid medium may leak. As mentioned above, the liquid medium passes between the cooling fins at high pressure. At this time, the pressure applied to the cooling device can be considered to be constant at any part. Therefore, if there is a leak, it is considered that there is a leak at a site where the strength is relatively weak.

In the case of the cooling device in which the cooling fins are arranged inside the chassis as in the present invention, since the cooling fins are arranged inside the chassis, it is necessary to join the cooling fins. Further, the chassis has a complicated structure and cannot be manufactured integrally. Therefore, it is necessary to divide the chassis into a plurality of chassis members and join the chassis members together. Since these joints are mechanically joined, the strength is relatively weak. Therefore, leakage is likely to occur at these joints.

Therefore, the cooling device is designed so as to avoid providing the joining portion inside the chassis for mounting the electronic equipment, except for the joining portion of the chassis member where the joining inside is unavoidable.

The present invention is a completed invention as described above, and has as its gist a cooling device of the following (1) and (2) and a manufacturing method of the cooling device of (3).

(1) A cooling device in which an electronic device is mounted and which cools the electronic device using a liquid medium passing between cooling fins arranged inside the chassis, wherein the chassis has four plate shapes. The cooling device is configured to insert the cooling fins into the chassis member from the direction of the outer surface of the chassis.

(2) The chassis member is joined by welding, and the joint portion of the chassis member is provided at a position having a predetermined distance from the inner surface of one chassis member associated with the joint portion. apparatus.

(3) A method for manufacturing a cooling device, in which an electronic device is mounted, and the electronic device is cooled by using a liquid medium passing between cooling fins arranged inside the chassis, the method comprising: From this direction, the cooling fins are inserted into the chassis member, the cooling fins are enclosed, and the joint portion when the chassis members are joined is predetermined from the inner surface of one chassis member related to the joined portion. A method for manufacturing a cooling device, wherein welding is performed so as to be at a position where the distance is provided.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention is a cooling device for mounting an electronic device and cooling the electronic device using a liquid medium passing between cooling fins arranged inside a chassis, and a manufacturing method thereof. Here, an antifreeze liquid such as ethylene glycol can be used as the liquid refrigerant. The present invention will be described below with reference to the drawings.

FIG. 2 is a perspective view showing an example of the cooling device of the present invention.

FIG. 3 is a sectional view showing an example of the cooling device of the present invention. In addition, FIG. 3 shows P of the cooling device shown in FIG.
The surface is a cross section, and for convenience of explanation, in FIG.
The description of the cooling fins is omitted.

Electronic equipment is mounted on the cooling device. In the cooling device shown in FIG. 2 or 3, a groove 5 is formed on the inner side surface, and an electronic substrate (not shown) is sandwiched in the groove 5 for mounting. The mounting mode of the electronic device is not particularly limited, and when the electronic device is an electronic device or a semiconductor chip, the mode can be appropriately changed according to them.

Cooling fins 7 are arranged inside the chassis 6. The liquid medium introduced from the liquid medium introduction port 8 passes between the cooling fins 7. At this time, the liquid medium flows as shown by the arrow in FIG. 3, and at that time, heat exchange is performed between the electronic device generating heat and the liquid medium, and the electronic device is cooled. The liquid medium whose temperature has risen due to heat exchange is discharged from the liquid medium outlet 9 to the outside of the cooling device.

The chassis 6 is composed of four plate-shaped chassis members, and each chassis member has a structure in which cooling fins are inserted into the chassis member from the direction of the outer surface of the chassis 6.

FIG. 4 is a perspective view showing a chassis member constituting the chassis and its internal structure. 2A shows the chassis member on the left front surface of the cooling device shown in FIG. 2, and FIG. 8B shows the chassis member on the right front surface of the cooling device. Note that the right rear surface and the left rear surface of the cooling device shown in FIG. 2 have symmetrical shapes with (a) and (b), respectively, and are not shown.

The chassis members 10 and 10 'are plate-shaped,
Concavities and convexities may be formed in a portion to be combined with another chassis member, such as a portion indicated by A in FIG. The chassis members 10 and 10 ′ have an opening 14 for inserting the cooling fin 7, and the opening 14 has another chassis member 1.
Liquid medium passage hole 15 to be connected when joined to 0, 10 '
Is formed.

The opening 14 is opened from the direction of the outer surface of the chassis, and the cooling fins 7 can be inserted into the chassis members 10 and 10 'through the opening 14. Opening 1
Reference numeral 4 does not penetrate the plate-shaped chassis members 10 and 10 '. That is, the surface indicated by B in FIG. 4 is the inner surface of the chassis members 10 and 10 ′ forming the inside of the cooling device.

Since the opening 14 is opened from the direction of the outer surface of the chassis, even if the liquid medium should leak, it does not leak to the inside of the cooling device, and there is a weak joint portion. Since the liquid leaks to the outside, the liquid medium does not interfere with the built-in electronic device and the repair work can be easily performed. Furthermore, maintenance can be performed easily.

When the cooling fin 7 is loaded into the opening 14, it is preferable to insert the cooling fin 7 between the brazing sheets 11. Further, the opening 14 is closed and joined by the port plate 12 or the side plate 13 having the inlet 8 or the outlet 9 for the liquid medium, so that the cooling fin 7 is sealed inside the chassis.
The joining method at this time is not particularly limited.
However, as described above, if the brazing sheet 11 is sandwiched in advance, brazing can be performed for joining, and higher thermal conductivity can be expected. After joining, it is preferable to inspect the presence or absence of leakage of the liquid medium by flowing the liquid medium through the liquid medium passage hole 15 for each chassis member 10.

The four chassis members 10 enclosing the cooling fins 7 are assembled and joined together. The joining method at this time is also not particularly limited. However, in this case, unlike the above-mentioned encapsulation of the cooling fins 7, it is also necessary to join the inside of the chassis, and therefore, welding that allows firm joining is preferable.

FIG. 5 is a perspective view showing an example of a cooling device when the chassis members are assembled and welded. As shown in the figure, the joint part when the chassis member 10 is welded
20 is preferably provided at a position having a predetermined distance (L or L ′) from the inner surface of the one chassis member related to the joint. In other words, in FIG.
It is preferable to assemble and weld a chassis member having a portion indicated by A in (b). By shifting the position of the joining portion (welding portion) inward, welding work can be easily performed. The welded portion formed on the upper end of the chassis member 10 is smoothed by machining.

Thereafter, if necessary, heat treatment, machining such as formation of screw holes, surface treatment and the like are performed. By performing these processes, the cooling device as shown in FIG. 2 described above can be manufactured.

[0033]

According to the present invention, the chassis 4
From the direction where the two chassis members are the outer surface of the chassis,
The cooling fins are inserted inside the chassis member, and the joining portion for encapsulation is outside the cooling device. Therefore, even if a liquid medium leaks,
The liquid medium does not leak to the outside of the cooling device having a weakly bonded joint portion, and the liquid medium does not splash on the electronic device built in the cooling device. In addition, repair work and maintenance can be performed easily.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a conventional cooling device that indirectly cools an electronic device with cooling air.

FIG. 2 is a perspective view showing an example of a cooling device of the present invention.

FIG. 3 is a plan view showing an example of a cooling device of the present invention.

FIG. 4 is a perspective view showing a chassis member constituting the chassis and its internal structure.

FIG. 5 is a perspective view showing an example of a cooling device when a chassis member is assembled and welded.

[Explanation of symbols]

1, 6 chassis 2,7 cooling fins 8 Liquid medium inlet 9 Liquid medium outlet 10, 10 'chassis member 11 brazing sheet 12 port plate 13 Side plate 14 openings 15 Passage hole 20 joints 21 Inner surface of chassis member

Claims (3)

[Claims] 1. A cooling device for mounting an electronic device and cooling the electronic device by using a liquid medium passing between cooling fins arranged inside a chassis, wherein the chassis comprises 4
A cooling device comprising a single plate-shaped chassis member, wherein each chassis member has a structure in which the cooling fins are inserted into the chassis member from the direction of the outer surface of the chassis. 2. The chassis member is joined by welding,
The cooling device according to claim 1, wherein the joint portion of the chassis member is provided at a position having a predetermined distance from the inner surface of one chassis member related to the joint portion. 3. A method of manufacturing a cooling device, in which an electronic device is mounted and which cools the electronic device by using a liquid medium passing between cooling fins arranged inside the chassis, which is an outer surface of the chassis. From the direction, the cooling fins are inserted into the chassis member, the cooling fins are enclosed, and the joint portion at the time of joining the chassis members is a predetermined portion from the inner surface of one chassis member related to the joint portion. A method of manufacturing a cooling device, which comprises welding so as to be positioned at a distance.