JP2003298174A - Optical pickup optical unit and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a high-precision optical pickup optical unit which can be manufactured with high throughput and a method of manufacturing the same. A submount 30 (hereinafter referred to as SM) is placed on a reference plane portion 71a of an assembling jig 70, and a first surface 30a of the SM abuts against a second positioning plane portion 72b of the assembling jig. And a heat sink 40 (hereinafter, referred to as HS) having a laser diode 50 (hereinafter, referred to as LD) is mounted on the SM surface positioned by the assembly jig 70,
The light emitting surface 51 of the LD is brought into contact with the first positioning plane portion of the assembly jig, and the light emitting surface and one end surface of the SM are positioned in parallel.
In this state, the HS is fixed to the SM, the SM is removed from the assembly jig, the SM is mounted on the submount mounting surface 24 of the mirror substrate 20, and the first end surface of the SM is abutted against the vertical reference plane portion, The first end face and the vertical reference plane portion are positioned in parallel, and in this state, the SM is fixed to the submount placement surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical pickup optical unit used in an optical pickup device mounted on an AV device, a storage device for a computer or the like, and a manufacturing method thereof.

[0002]

2. Description of the Related Art A high-precision optical pickup device is used in an optical disc device for recording and reproducing information using an optical disc as a recording medium. The optical pickup device includes an optical integrated element that records information on the optical disc by irradiating the optical disc with laser light from the laser diode and receives information reflected by the optical disc to read information. ing.

FIG. 7 is a schematic view showing an emission axis 103 of a laser beam 102 emitted from a laser diode 101 mounted on an optical pickup optical unit.

The optical pickup optical unit shown in FIG. 7 has a mirror substrate 105 having a reflection mirror 104. A laser diode 101 is mounted on a mirror substrate 105, and a laser beam 102 emitted from the laser diode 101 is reflected by a reflection mirror 104 at approximately 90 degrees to illuminate an optical disc (not shown). There is.

When assembling the optical pickup optical unit, it is necessary to accurately position the light emitting axis 103 of the laser diode 101 with respect to optical components such as a lens, a prism, and a mirror.

Specifically, the emission axis 103 of the laser diode 101 is managed with a tolerance of about 0.5 degree with respect to the design value (reference value). In order to realize this, the length of one side of the laser diode 101 is generally 3
Since it is about 00 [μm], the inclination of one side is 2 [μm]
It was necessary to assemble with an accuracy of about 3 [μm], and the assembly work was very difficult.

Therefore, in recent years, a method has been disclosed in which a pattern of the laser diode 101 is recognized by a camera using a high-precision mounter device, and an error from a reference value is rotationally corrected and mounted (for example, refer to Patent Document 1). .).

[0008]

[Patent Document 1] Japanese Patent Laid-Open No. 2000-228022.

[0009]

However, in the method of recognizing the pattern of the laser diode by the camera using the high precision mounter device and correcting the error from the reference value to mount the mount, the high precision mounter which is expensive to assemble is used. There is a problem that a device is required, and an increase in cost cannot be avoided.

Further, even if mounting is performed using a high-precision mounter device, high-precision positioning work is still required, and there is a problem that throughput is low.

The present invention has been made based on these circumstances, and an object of the present invention is to provide a highly accurate optical pickup optical unit which can be manufactured with high throughput and a manufacturing method thereof.

[0012]

In order to solve the above problems and achieve the object, the optical pickup optical unit of the present invention and the manufacturing method thereof are configured as follows.

(1) The reference flat surface portion of the assembly jig including a reference flat surface portion and a first positioning flat surface portion and a second positioning flat surface portion which are provided substantially perpendicular to the reference flat surface portion and are parallel to each other. A submount positioning step of positioning the submount by placing the submount on the second mounting surface and abutting one end surface of the submount against the second positioning flat surface portion; and a surface of the submount positioned by the assembly jig. A heat sink with a laser diode mounted thereon is placed, and the light emitting surface of the laser diode is abutted against the first positioning flat surface portion of the assembly jig so that the light emitting surface and one end surface of the submount are parallel to each other. Laser diode fixing step of fixing the heat sink to the submount in that state, and the laser die The over de and the submount together removed from the assembly jig, flat portion for abutment,
And placing the submount on the installation reference flat surface portion of the mirror substrate provided with the installation reference flat surface portion extending in a direction substantially perpendicular to the abutting flat surface portion, and abutting one end surface of the submount on the abutment surface. By abutting against the flat surface portion for positioning, the one end face and the flat surface for abutting are positioned so as to be parallel, and in that state, the submount mounting step of fixing the submount to the installation reference flat surface portion,
It is characterized by including.

(2) Abutting flat surface portion, an installation reference flat surface portion extending substantially perpendicular to the abutting flat surface portion,
A mirror substrate having a mirror flat portion that extends in a direction of approximately 45 degrees with respect to the abutting flat portion, and an adhesive on the installation reference flat portion with one end face abutting against the abutting flat portion of the mirror substrate. , A heat sink fixed to the surface of the submount, and a laser diode fixed to the surface of the heatsink so that its light emitting surface is substantially parallel to one end surface of the submount. And a box for accommodating the mirror substrate, the submount, the heat sink, and the laser diode.

(3) In the optical pickup optical unit described in (2), a groove is formed in the installation reference plane portion along the width direction of the mirror substrate, and other than the submount. The end surface projects from the installation reference flat surface portion to the groove portion.

(4) In the optical pickup optical unit described in (2), the width dimension of the mirror substrate and the width dimension of the submount are substantially the same.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic view showing the construction of an optical pickup optical unit according to an embodiment of the present invention, and FIG. 2 is a construction view showing the optical pickup optical unit according to the embodiment separately from a cap 3. So, (a) is a front view,
FIG. 3B is a plan view, FIG. 3C is a perspective view, and FIG. 3 is an enlarged schematic view of the step portion 22 according to the embodiment.

The optical pickup optical unit shown in FIG. 1 has a substrate 1 on the surface of which a wiring pattern (not shown) is formed.
0, the mirror substrate 20 made of silicon mounted on the surface of the substrate 10, the submount 30 mounted on the mirror substrate 20, the heat sink 40 mounted on the surface of the submount 30, and the heat sink 40. Laser diode 50 mounted on the surface of the mirror substrate 20, the mirror substrate 20, the submount 3 provided on the surface of the substrate 10.
0, a heat sink 40, and a cap 3 (box) that houses the laser diode 50.

As shown in FIGS. 2A and 2B, the mirror substrate 20 is composed of a block body having a substantially rectangular plane.
The back surface of the substrate 10 serves as a horizontal reference plane portion 21 joined to the front surface of the substrate 10. A concave step 22 is formed on the surface of the mirror substrate 20 in the width direction of the mirror substrate 20 (see FIG.
(B) It is formed over the entire length in the vertical direction.

The step portion 22 has a vertical reference flat surface portion 23 (abutting flat surface portion) extending in a substantially vertical direction with respect to the horizontal reference flat surface portion 21, and a substantially vertical direction from a lower end portion of the vertical reference flat surface portion 23. Sub-mount mounting surface 24 (installation reference flat surface portion) that is continuous and approximately 4 from the upper end of the vertical reference flat surface portion 23
Reflecting mirror surface 25 (mirror flat surface portion) extending in the 5 ° direction
And a photodiode mounting surface 26 extending from the upper end of the reflection mirror surface 25 in a direction substantially parallel to the horizontal reference flat surface portion 21. Then, on the reflection mirror surface 25, a Ti film, an Au film, or the like for reflecting the laser light is laminated by vapor deposition.

The horizontal reference plane portion 21, the vertical reference plane portion 23, the submount mounting surface 24, the reflection mirror surface 25,
The photodiode mounting surface 26 is formed such that these normal vectors are included in substantially the same plane.

As shown in FIG. 3, the submount mounting surface 2
4, a groove 28 is formed along the width direction of the mirror substrate 20 on the wall surface 27 side facing the vertical reference flat surface portion 23.

The groove 28 has a depth of 50 [μm] to 100.
The second end surface 30b of the submount 30 (described later) mounted on the submount mounting surface 24 is about [μm],
A predetermined protrusion width t, which is about 100 [μm] to 300 [μm] in this embodiment, is projected on the groove 28.

The depth dimension of the groove portion 28 is not limited to the above-mentioned value and can be variously changed depending on the design, but depending on the dimension of the submount 30, the predetermined protrusion width t described above is obtained. Must be set so that

As shown in FIGS. 2A to 2C, the submount 30 has a rectangular parallelepiped shape, and solder, heat-curable epoxy resin, or heat-curable conductive material is attached to the submount mounting surface 24. It is joined via a die bonding agent 31 (adhesive) such as a conductive paste.

The thickness of the submount 30 is about 500.
[μm], and the width dimension is substantially the same as the width dimension of the mirror substrate 20. The thickness dimension of the submount 30 is not limited to the above-mentioned value, and can be variously changed depending on the design.

The first end surface 30a (one end surface) of the submount 30 and the second end surface 30b (the other end surface) located on the opposite side thereof are substantially orthogonal to the back surface joined to the submount mounting surface 24. . The first end surface 30a is in close contact with the vertical reference surface 23 of the mirror substrate 20, and the second end surface 30b projects above the groove 28 by the above-described predetermined projection width t.

Heat sink 40 on the surface of submount 30
Beside (to be described later), an output adjusting photodiode 33 for monitoring the output of laser light emitted from a laser diode 50 (to be described later) is mounted. Then, as shown in FIG. 1, the output adjustment photodiode 33 and the electrodes of the wiring pattern formed on the substrate 10 are
It is electrically connected by the bonding wire 2a.

As shown in FIGS. 2A to 2C, the heat sink 40 has a rectangular parallelepiped shape, and the submount 3
No. 0 is joined to almost the center of the surface of the No. 0 via a silver epoxy conductive paste 32 (shown only in FIG. 4). The thickness dimension of the heat sink 40 is about 200 μm, and the plane dimension thereof is smaller than the plane dimension of the submount 30.

As the material of the heat sink 40,
A high heat dissipation ceramic such as SiC or AIN having good thermal conductivity is used. Further, the thickness dimension of the heat sink 40 is not limited to the above-mentioned value, and can be variously changed depending on the design.

The laser diode 50 is in the shape of a rectangular parallelepiped, and is adhered and fixed to the surface of the heat sink 40. The light emitting surface 51 of the laser diode 50 is directed to the reflection mirror surface 25 side and is positioned so as to be substantially parallel to the first end surface 30a of the submount 30 by a method described later. Then, as shown in FIG.
The laser diode 50 and the wiring pattern formed on the substrate 10 are electrically connected by a pair of bonding wires 2b.

As shown in FIGS. 2A to 2C, the light emitting point formed on the light emitting surface 51 is located on the heat sink 40 side of the light emitting surface 51 with the heat sink 40 fixed to the submount 30. is doing. That is, the laser light L is
The laser diode 50 is emitted from a position on the heat sink 40 side as shown by an arrow in FIG.

Therefore, the light emitting surface 51 of the laser diode 50 is several [μm] to several tens from the end surface of the heat sink 40.
It is projected by about [μm] to prevent a part of the laser light emitted while spreading from the light emitting point from being reflected by the heat sink 40.

The thickness of the laser diode 50 is about 13
At 0 [μm], the planar shape is smaller than the planar shape of the heat sink 40. The laser diode 5
The thickness dimension of 0 is not limited to the value described above, and can be variously changed depending on the design.

On the photodiode mounting surface 26 of the mirror substrate 20, the signal signal reading photodiode 1 for receiving the laser beam reflected by an information medium such as an optical disk.
1 is installed. Then, as shown in FIG. 1, the signal reading photodiode 11 and the substrate 10 are electrically connected by a bonding wire 2c.

On the surface of the substrate 10, the mirror substrate 2 is provided inside.
A cap 3 for accommodating 0 is provided. The ceiling of the cap 3 is provided with a reflection mirror surface 25, a signal reading photodiode 11, an output adjusting photodiode 33, and a hologram lens 3a having an area covering each optical path.

Next, a method of manufacturing the optical pickup optical unit having the above structure will be described.

FIG. 4 is a schematic view showing a manufacturing process of the optical pickup optical unit according to the same embodiment, and FIG. 5 shows the laser diode 50 according to the embodiment as a heat sink 40.
3A and 3B are schematic views showing a state of being mounted on a vehicle, wherein FIG. 6A is a perspective view and FIG.

First, FIG. 4 (a-1) is a side view, and FIG.
2) Prepare an assembly jig 70 as shown in a perspective view.
The assembling jig 70 has a plate-shaped base 71 whose surface serves as a reference plane portion 71a, and a stainless steel abutment block 72 is provided on one end side of the surface of the base 71.

The butting block 72 has a first positioning flat surface portion 72a and a second positioning flat surface portion 72b which are parallel to each other and substantially perpendicular to the reference flat surface portion 71a. First
The positioning flat surface portion 72a and the second positioning flat surface portion 72b are
The first positioning flat surface portion 72a is disposed at a predetermined distance from the flat surface direction of the reference flat surface portion 71a, and the first positioning flat surface portion 72a is located closer to the other end side of the reference flat surface portion than the second positioning flat surface portion 72b. is doing.

In the present embodiment, the butting block 72 is made of stainless steel, but ceramics,
It may be formed by grinding glass or silicon, or by coating these with a fluorine compound.

Next, FIG. 4 (b-1) is a side view, and FIG.
As shown in the perspective view in 2), the base material 7 of the assembly jig 70 is
1 mount the submount 30 on the surface of the submount 3
The first end surface 30a of 0 is abutted against the second positioning flat surface portion 72b of the butting block 71 to be in close contact (submount positioning step). Then, a predetermined amount of silver epoxy conductive paste 32 is supplied to the surface of the submount 30. In addition, the supply of the conductive paste 32 to the submount 30 is performed by setting the submount 30 to the second positioning plane portion 72b.
You may go before you hit.

On the other hand, as a step different from the above-mentioned step, as shown in FIG. 5, the laser diode 50 is bonded to the surface of the heat sink 40 so that the light emitting surface 51 projects from one end surface of the heat sink 40.

Then, FIG. 5C-1 shows a side view, and FIG.
As shown in the perspective view in 2), the heat sink 40 integrated with the laser diode 50 is placed on the surface of the submount 30 set in the assembly jig 70 from above the conductive paste 32, and the laser diode 50 The light emitting surface 51 of the above is abutted against the first positioning flat surface portion 72a of the abutment block 72 to be brought into close contact therewith.

Then, in that state, at about 150 degrees, 10
By heating for about a minute, the conductive paste 32 is hardened and the heat sink 40 is fixed to the submount 30.

As a result, the side view of FIG.
As shown in the plan view in (d-2) and the perspective view in (d-3), the first end surface 30a of the submount 30 and the light emitting surface 51 of the laser diode 50 are positioned substantially parallel to each other (fixed to the laser diode). Process).

Next, FIG. 4E-1 is a side view, and FIG.
As shown in a plan view in (2) and a perspective view in (e-3), solder, heat-curable epoxy resin, heat-curable conductive paste, or the like is applied to the surface of the submount mounting surface 24 of the mirror substrate 20. The die bond material 31 is supplied, and the submount 30 integrated with the laser diode 50 and the heat sink 40 is mounted on the submount mounting surface 24 from above the die bond material 31.

At this time, the die bonding agent 31 spreads between the submount mounting surface 24 and the submount 30 to form a fillet 31a as shown in FIG. 3 on the second end surface 30b side of the submount 30.

This fillet 31a is used for the submount 3
0 from the second end face 30b side toward the vertical reference plane portion 23 side of the mirror substrate 20, the fillet 31a
The surface tension generated on the second end face 30 of the submount 30 is
The side b acts in the direction indicated by arrow A in FIG. 3, that is, the submount 30 is pressed against the vertical reference plane portion 23 side. Thereby, the first end surface 30 of the submount 30
The a firmly adheres to the vertical reference plane portion 23.

Next, the first end face 30a of the submount 30
The die-bonding agent 31 is heated in a state of being in close contact with the vertical reference plane portion 23 of the mirror substrate 20 to fix the submount 30 to the mirror substrate 20 (submount mounting step).

As a result, the first end surface 30a of the submount 30 and the vertical reference plane portion 23 of the mirror substrate 20 are aligned and parallel to each other, so that the light emitting surface 51 of the laser diode 50 and the vertical reference plane 23 of the mirror substrate 20. And are positioned in parallel.

Further, the laser light is emitted from the laser diode 50.
Since the light is emitted perpendicularly to the light emitting surface 51, the light emitting axis L of the laser light is positioned substantially perpendicular to the vertical reference surface 23 of the mirror substrate 20.

Further, since the reflection mirror surface 25 is inclined in the direction of about 45 degrees with respect to the vertical reference plane portion 23,
The laser light emitted from the laser diode 50 is reflected by the reflection mirror surface 25 and positioned substantially perpendicular to the horizontal reference plane portion 21.

Next, the signal reading photodiode 1
1 is bonded and fixed to the photodiode mounting surface 26 of the mirror substrate 20. Then, as shown in FIG. 1, the mirror substrate 2
0 is mounted on the surface of the substrate 10, and the laser diode 50,
The signal reading photodiode 11 and the output adjusting photodiode 33 are connected to the electrodes on the wiring pattern formed on the substrate 10 by the bonding wires 2a to 2c.

Next, the whole is covered with the cap 3 having the hologram lens 3a on the ceiling to mechanically protect the laser diode 50 and the photodiodes 11 and 33.

As described above, according to the above-described embodiment, the assembly jig 70 having the first positioning flat surface portion 72a and the second positioning flat surface portion 72b which are parallel to each other is prepared. Then, the first and second positioning flat surface portions 7 of the assembly jig 70
Using 2a and 72b, the heat sink 40 is fixed to the submount 30 so that the light emitting surface 51 of the laser diode 50 and the first end surface of the submount 30 are substantially parallel to each other.

Then, the first end face 30a of the submount 30 integrated with the laser diode 50 is attached to the mirror substrate 2
The submount 30 is fixed to the submount mounting surface 24 of the mirror substrate 20 in such a state that the submount 30 is abutted against the vertical reference surface 23.

As a result, since the light emitting surface 51 of the laser diode 50 and the vertical reference surface 23 of the mirror substrate 20 become substantially parallel, the light emitting axis L of the laser light emitted from the laser diode 50 is the vertical reference surface of the mirror substrate 20. It is almost perpendicular to the plane portion 23. As a result, the emission axis L of the laser light reflected by the reflection mirror surface 25 at about 90 degrees is set to the mirror substrate 20.
Is positioned substantially perpendicular to the horizontal reference plane 21.

Therefore, as in the above-described embodiment, the laser diode 50 has a small thickness, and the assembly jig 70 is used.
Even when the contact area with the first positioning flat surface portion 72a is small, the light emitting surface 51 of the laser diode 50 is directly abutted against the first positioning flat surface portion 72a for positioning, so that the light emitting axis L of the laser light is high. It can be positioned with accuracy.

Further, since the laser light emitted from the laser diode 50 can be positioned by abutting, it is not necessary to use an expensive high-precision mounter device having a pattern recognition and rotation correction function, and a simple jig can be used. This enables highly accurate positioning. As a result, a highly accurate optical pickup optical unit can be manufactured at low cost. Moreover, since the positioning method is simple, the throughput can be improved.

Further, a groove 28 is formed on the submount mounting surface 24.
And the second end face 30b of the submount 30 is formed into the groove 2
8 is projected above.

Therefore, as shown in FIG. 6, when the submount 30 is bonded to the mirror substrate 20, the die bonding agent 3 is used.
Since the surface tension generated in the fillet 31b of No. 1 does not act to separate the submount 30 from the vertical reference plane portion 23, the vertical reference plane portion 23 used for positioning and the first end surface 30a of the submount 30 are positioned. The abutment is made firmly, and the emission axis L of the laser light can be positioned with high accuracy.

Moreover, in the present invention, as shown in FIG.
The groove portion 28 sandwiches the submount 30 and the vertical reference plane portion 2 is formed.
Since it is formed on the side opposite to 3, the surface tension generated in the fillet 31a of the die bonding agent 31 acts so as to press the submount 30 against the vertical reference flat surface portion 23, and positioning can be performed with higher accuracy.

Further, the width of the submount 30 and the width of the mirror substrate 20 are made substantially the same.

Therefore, when the sub-mount 30 is fixed to the mirror substrate 20, even if the die bonding agent 31 protrudes to both sides in the width direction of the sub-mount 30, the surface tension generated at the protruding portion is almost the same as that of the sub-mount mounting surface 24. Does not work in the plane direction.

Therefore, even if the die-bonding agent 31 spills out on both ends in the width direction of the submount 30 in an imbalanced manner,
Due to the surface tension generated in this protruding portion, the submount 30 does not move in the width direction of the mirror substrate 20 and does not rotate on the submount mounting surface 24. Therefore, the emission axis L of the laser light is also changed. Positioning can be performed with high accuracy.

The present invention is not limited to the above-mentioned embodiment, but can be variously modified without departing from the gist of the invention.

According to each of the above-described embodiments, the following configuration can be obtained.

(Supplementary Note 1) A horizontal reference plane (reference plane section), a first plane (first positioning plane section) and a second plane (second positioning plane section) which are perpendicular to the horizontal reference plane and are parallel to each other. A submount positioning step of placing a submount on the horizontal reference plane of an assembly jig having two planes, and abutting the end surface (first end surface) of the submount against the second surface. And a heat sink having a laser diode mounted on the surface of the submount, and the laser diode is positioned to bring the light emitting surface of the laser diode into contact with the first surface of the assembly jig so as to be in close contact with the submount. Laser diode fixing step of fixing the laser diode to the sub-mount, and removing the sub-mount on which the laser diode is fixed from the assembly jig, and mounting the sub-mount on the mirror substrate. A sub-mount mounting step of mounting the sub-mount on a surface and closely fixing the end face on the side where the laser diode is projected to the vertical reference plane of the mirror substrate by fixing the sub-mount on the mirror substrate. And a mirror substrate mounting step of mounting the substrate on a substrate.

(Additional remark 2) In the laser diode fixing step, the heat sink on which the laser diode is mounted is fixed to the submount with a conductive paste, and the optical integrated device according to the additional remark 1 is manufactured. Method.

(Additional remark 3) In the submount mounting step, the submount is adhered and fixed to the mirror substrate, and the method for manufacturing an optical integrated element according to Additional remark 1.

(Supplementary Note 4) A mirror substrate is mounted on the substrate,
The end surface of the submount fixed to the laser diode is in close contact with the vertical reference surface of the mirror substrate, and the laser light emitted from the laser diode mounted on the mirror substrate is reflected on the mirror substrate. It is formed so that it is reflected by a mirror surface and radiates parallel to a vertical reference plane formed on the mirror substrate, and at the position of the mirror substrate where the laser light receives the reflected light reflected by the object to be read. In an optical integrated device provided with a photodiode, assembling a laser diode on the mirror substrate,
An optical integrated device, wherein the assembled mirror substrate is mounted on the substrate by the method for manufacturing an optical integrated device according to any one of appendices 1 to 3.

[0074]

According to the present invention, it is possible to provide a method of manufacturing an optical pickup optical unit with high throughput and high accuracy, and an optical pickup optical unit manufactured by this method.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a configuration of an optical pickup optical unit according to an embodiment of the present invention.

FIG. 2 is a configuration diagram showing the optical pickup optical unit according to the embodiment separately from the cap, including (a) of FIG.
Is a front view, (b) is a plan view, and (c) is a perspective view.

FIG. 3 is an enlarged schematic view of a step portion according to the same embodiment.

FIG. 4 is a schematic view showing a manufacturing process of the optical pickup optical unit according to the embodiment.

FIG. 5 is a schematic diagram showing a state where the laser diode according to the embodiment is mounted on a heat sink,
(A) is a perspective view, (b) is a side view.

FIG. 6 is a schematic view showing a fillet of a die bonding agent when a groove is not formed on the submount mounting surface according to the same embodiment, and FIG. 6A is a vertical reference of a mirror substrate with a first end surface of the submount. The state when the die-bonding agent is in contact with the flat surface portion, (b) is the state after the die bonding agent is cured.

FIG. 7 is a schematic diagram showing an emission axis of laser light emitted from a laser diode of a conventional optical pickup optical unit.

[Explanation of symbols]

3 ... Cap (box), 20 ... Mirror substrate, 23 ... Vertical reference flat surface portion (abutting flat surface portion), 24 ... Submount mounting surface (installation reference flat surface portion), 25 ... Reflecting mirror surface (mirror flat surface portion) ), 28 ... Groove, 30 ... Submount, 30a
... 1st end surface (one end surface), 30b ... 2nd end surface (other end surface),
31 ... Die bond agent (adhesive), 32 ... Conductive paste, 40 ... Heat sink, 50 ... Laser diode, 5
1 ... Emitting surface, 70 ... Assembly jig, 71a ... Reference plane part, 7
2a ... 1st positioning plane part, 72b ... 2nd positioning plane part.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor K. Matsuda             33, Shinisogo-cho, Isogo-ku, Yokohama-shi, Kanagawa             Inside the Toshiba Production Technology Center (72) Inventor Akio Onuki             33, Shinisogo-cho, Isogo-ku, Yokohama-shi, Kanagawa             Inside the Toshiba Production Technology Center F-term (reference) 5D119 AA39 FA17                 5F073 AB27 AB29 BA05 EA29 FA02                       FA15 FA23 FA30

Claims (5)

[Claims] 1. The above-mentioned reference plane portion of an assembly jig comprising a reference plane portion and a first positioning plane portion and a second positioning plane portion which are provided substantially perpendicular to the reference plane portion and which are parallel to each other. A submount positioning step of positioning the submount by mounting the submount and abutting one end surface of the submount on the second positioning flat surface portion, and a submount surface positioned by the assembly jig. By mounting a heat sink having a laser diode mounted thereon and abutting the light emitting surface of the laser diode against the first positioning flat surface portion of the assembly jig, the light emitting surface and one end surface of the submount become parallel. Laser diode fixing step of fixing the heat sink to the submount in that state, and the laser diode. The sub-mount integrated with the above is removed from the assembling jig, and the above-mentioned installation standard of the mirror substrate having the abutting flat surface portion and the installation reference flat surface portion extending in a direction substantially perpendicular to the abutting flat surface portion. While placing the submount on the flat surface portion, by abutting one end surface of the submount against the abutting flat surface portion, the one end surface and the abutting flat surface portion are positioned in parallel, A submount mounting step of fixing the submount to the installation reference plane portion in that state, and a method for manufacturing an optical pickup optical unit. 2. The method for manufacturing an optical pickup optical unit according to claim 1, wherein the heat sink is fixed to the submount with a conductive paste. 3. An abutting flat surface portion, an installation reference flat surface portion extending substantially vertically to the abutting flat surface portion, and a mirror flat surface portion extending substantially 45 degrees to the abutting flat surface portion. A mirror substrate, a submount fixed to the above-mentioned installation reference flat portion with an adhesive in the state where one end face is abutted against the abutting flat portion of the mirror substrate, and a heat sink fixed to the surface of this submount, A laser diode which is positioned and fixed on the surface of the heat sink so that the light emitting surface is substantially parallel to the one end surface of the submount, and a box body which houses the mirror substrate, the submount, the heat sink, and the laser diode. An optical pickup optical unit comprising: 4. A groove portion is formed in the installation reference plane portion along the width direction of the mirror substrate, and the other end surface of the submount projects from the installation reference plane portion onto the groove portion. The optical pickup optical unit according to claim 3, wherein 5. The optical pickup optical unit according to claim 3, wherein the width of the mirror substrate and the width of the submount are substantially the same.