JP2003290765A - Wastewater treatment method for cleaning printed wiring boards - Google Patents
Wastewater treatment method for cleaning printed wiring boardsInfo
- Publication number
- JP2003290765A JP2003290765A JP2002098907A JP2002098907A JP2003290765A JP 2003290765 A JP2003290765 A JP 2003290765A JP 2002098907 A JP2002098907 A JP 2002098907A JP 2002098907 A JP2002098907 A JP 2002098907A JP 2003290765 A JP2003290765 A JP 2003290765A
- Authority
- JP
- Japan
- Prior art keywords
- membrane
- wastewater
- printed wiring
- filtration
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
(57)【要約】
【課題】 濾過膜のフアウリングによるFlux低下が
少なく、さらにはFI値の低い水質も得られるプリント
配線板洗浄排水の処理方法を提供。
【解決手段】 プリント配線板製造工程から排出される
洗浄排水を処理する方法において、排水のpHをpH調
整槽で6〜10に調整し、pH調整された排水を膜濾過
装置で処理することを特徴とするプリント配線板洗浄排
水の処理方法。PROBLEM TO BE SOLVED: To provide a method for treating printed circuit board washing wastewater, which can reduce the flux reduction due to the fall of the filtration membrane and can obtain the water quality of low FI value. SOLUTION: In a method for treating washing wastewater discharged from a printed wiring board manufacturing process, the pH of the wastewater is adjusted to 6 to 10 in a pH adjusting tank, and the pH-adjusted wastewater is treated by a membrane filtration device. Characterized method of treating printed wiring board cleaning wastewater.
Description
【0001】[0001]
【発明の属する技術分野】本発明はプリント配線板洗浄
排水の処理方法に関する。具体的には、プリント配線板
製造工程中のレジスト工程、メッキ工程、エッチング工
程、はんだ工程、表面処理工程等から排出される洗浄排
水を処理する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for treating printed wiring board cleaning wastewater. Specifically, it relates to a method for treating cleaning wastewater discharged from a resist process, a plating process, an etching process, a soldering process, a surface treatment process and the like in a printed wiring board manufacturing process.
【0002】[0002]
【従来の技術】プリント配線板の製造では、レジスト工
程、メッキ工程、エッチング工程、はんだ工程、表面処
理工程等があり、各種工程では色々な薬剤を使用してお
り、様々な洗浄剤を使用して洗浄する。そのためプリン
ト配線板洗浄排水には、イオン成分として銅、鉄、錫、
無機酸、有機酸、アミド、イミド類等、非イオン成分と
しては、ロジン、ポリグリコール、界面活性剤等が含ま
れており、凝集処理法や砂濾過法によって処理されてい
る。近年、このような排水を高度に処理し、水を回収し
て再利用する試みがなされている。その方法の一つに、
まず排水を限外濾過膜又は精密濾過膜で濾過し、その濾
過水を逆浸透膜分離で処理する方法がある。しかしなが
ら、プリント配線板製造の工程から排出される洗浄排水
を濾過膜(限外濾過膜又は精密濾過膜をいう)で処理す
る場合、濾過膜のフアウリングによる濾過能力の低下
(以下Flux低下という)が起こる、といった問題が
あった。2. Description of the Related Art In the manufacture of printed wiring boards, there are resist processes, plating processes, etching processes, soldering processes, surface treatment processes, etc. Various chemicals are used in various processes, and various cleaning agents are used. To wash. Therefore, copper, iron, tin, and
Nonionic components such as inorganic acids, organic acids, amides and imides include rosin, polyglycol, surfactants and the like, which are treated by a coagulation method or a sand filtration method. In recent years, attempts have been made to highly treat such wastewater, recover water, and reuse it. One of the ways
First, there is a method of filtering waste water with an ultrafiltration membrane or a microfiltration membrane and treating the filtered water with a reverse osmosis membrane separation. However, when the cleaning wastewater discharged from the process of manufacturing a printed wiring board is treated with a filtration membrane (which is referred to as an ultrafiltration membrane or a microfiltration membrane), the filtration capacity of the filtration membrane is reduced (hereinafter referred to as Flux reduction). There was a problem that it would happen.
【0003】[0003]
【発明が解決しようとする課題】本発明の課題は、上記
の問題を解決するものである。即ち、濾過膜のフアウリ
ングによるFlux低下が少なく、さらにはFI値の低
い水質も得られるプリント配線板洗浄排水の処理方法を
提供することにある。An object of the present invention is to solve the above problems. That is, it is an object of the present invention to provide a method for treating waste water of a printed wiring board, which can reduce the decrease in Flux due to the outer ring of the filtration membrane and can also obtain water quality with a low FI value.
【0004】[0004]
【課題を解決するための手段】本発明者らは、上記課題
解決のために鋭意検討を重ねた結果、プリント配線板洗
浄排水をpH調整して濾過膜で分離する方法で課題が解
決することを見出し、本発明を完成した。即ち、本発明
は下記の通りである。
(1)プリント配線板製造工程から排出される洗浄排水
を処理する方法において、排水のpHをpH調整槽で6
〜10に調整し、pH調整された排水を膜濾過装置で処
理することを特徴とするプリント配線板洗浄排水の処理
方法。
(2)膜濾過装置に用いられる濾過膜が、分画分子量が
3000〜100万の限外濾過膜又は、孔径が0.01
〜1ミクロンの精密濾過膜であることを特徴とする
(1)記載のプリント配線板洗浄排水の処理方法。Means for Solving the Problems The inventors of the present invention have made extensive studies to solve the above problems, and as a result, the problems can be solved by a method of adjusting the pH of wastewater for washing a printed wiring board and separating it with a filtration membrane. And completed the present invention. That is, the present invention is as follows. (1) In the method of treating cleaning wastewater discharged from the printed wiring board manufacturing process, the pH of the wastewater is adjusted to 6 in a pH adjusting tank.
A method for treating printed wiring board cleaning wastewater, wherein the wastewater adjusted to pH -10 and treated with pH is treated with a membrane filtration device. (2) The filtration membrane used in the membrane filtration device is an ultrafiltration membrane having a molecular weight cutoff of 3,000 to 1,000,000 or a pore diameter of 0.01.
The method for treating printed wiring board cleaning wastewater according to (1), which is a microfiltration membrane of ˜1 micron.
【0005】[0005]
【発明の実施の形態】以下、本発明ついて、特にその好
ましい態様を中心に詳細に説明する。本発明でいうプリ
ント配線板洗浄排水とは、プリント配線板の製造工程か
らの排水である。具体的には、レジスト工程、メッキ工
程、エッチング工程、レジスト剥離工程、はんだ工程、
表面処理工程等からの排水である。また、これらの排水
を集合した集合排水も本発明の処理対象排水である。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below, focusing on particularly preferable embodiments thereof. The term “printed wiring board cleaning drainage” as used in the present invention refers to drainage from the printed wiring board manufacturing process. Specifically, a resist process, a plating process, an etching process, a resist stripping process, a soldering process,
It is the wastewater from the surface treatment process. Collected wastewater obtained by collecting these wastewater is also the wastewater to be treated in the present invention.
【0006】排水中には、エッチングに用いた塩化第二
鉄、塩酸、銅板から溶解した銅、メッキ成分の錫、はん
だ付けで用いる主成分がロジンのフラックス、他に無機
酸、有機酸、過酸化水素、レジスト由来のアミド、イミ
ド類、洗浄剤由来の珪酸ソーダ、炭酸ソーダ、ポリグリ
コール、界面活性剤等が含まれ、通常、pHは酸性側の
排水が多い。この排水を、pH調整槽に送り、pH調整
を行う。本発明で用いるpH調整槽は、調整槽、苛性ソ
ーダタンク、苛性ソーダ注入ポンプ、排水供給ポンプ、
送水ポンプ、pH計、pHコントローラ、液面レベル計
及び攪拌機で構成されることが好ましい。In the drainage, ferric chloride used for etching, hydrochloric acid, copper dissolved from a copper plate, tin as a plating component, flux of rosin as a main component used for soldering, other inorganic acids, organic acids, and peroxides. It contains hydrogen oxide, amides and imides derived from resists, sodium silicate derived from cleaning agents, sodium carbonate, polyglycols, surfactants, etc. Usually, the pH is often drained on the acidic side. This waste water is sent to a pH adjusting tank to adjust the pH. The pH adjusting tank used in the present invention includes an adjusting tank, a caustic soda tank, a caustic soda injection pump, a drainage supply pump,
It is preferably composed of a water feed pump, a pH meter, a pH controller, a liquid level meter and a stirrer.
【0007】pH調整槽の役割は、濾過膜に供給する排
水のpHを均一かつ精度よく制御し、濾過膜のFlux
低下を抑制することである。さらには、排水のpHを6
〜10に制御することで、鉄、銅、錫等のイオンを水酸
化第二鉄、水酸化銅、水酸化錫等にして限外濾過膜又は
精密濾過膜で分離できるようにすることである。又、有
機物や濁質も無機水酸化物に取り込まれて、濾過膜で分
離しやすくなる。 具体的にはpH6〜10、好ましく
はpH7〜9に調整する。The role of the pH adjusting tank is to control the pH of the waste water supplied to the filtration membrane uniformly and with high precision, and
It is to suppress the decrease. Furthermore, the pH of the drainage is set to 6
By controlling to 10 to 10, ions of iron, copper, tin, etc. are converted to ferric hydroxide, copper hydroxide, tin hydroxide, etc. so that they can be separated by an ultrafiltration membrane or a microfiltration membrane. . In addition, organic substances and suspended substances are also taken in by the inorganic hydroxide and are easily separated by the filtration membrane. Specifically, the pH is adjusted to 6 to 10, preferably 7 to 9.
【0008】pH調整槽で生成した無機水酸化物及び排
水中に含まれている有機物や濁質は本発明で用いる膜濾
過装置で分離し、FI値の低い濾過水を得る。本発明で
用いる膜濾過装置は、濾過膜、原水循環タンク、逆洗タ
ンク(濾過水タンク)、液面レベル計、圧力計、温度
計、流量計、循環ポンプ、逆洗ポンプ、濾過水送水ポン
プ、薬品タンク、エアー供給用コンプレッサー、薬品注
入ポンプ、自動弁等の機器で構成されることが好まし
い。The inorganic hydroxide produced in the pH adjusting tank and the organic matter and suspended matter contained in the waste water are separated by the membrane filtration device used in the present invention to obtain filtered water having a low FI value. The membrane filtration device used in the present invention includes a filtration membrane, a raw water circulation tank, a backwash tank (filtered water tank), a liquid level meter, a pressure gauge, a thermometer, a flow meter, a circulation pump, a backwash pump, and a filtered water feed pump. , A chemical tank, a compressor for supplying air, a chemical injection pump, an automatic valve and the like.
【0009】本発明で用いる膜濾過装置に限外濾過膜を
用いると、濁度の低い水質が得られる。しかし分画分子
量の小さい限外濾過膜だとFluxが低くなるので、好
ましくは分画分子量が3000〜100万、より好まし
くは6000〜100万の限外濾過膜を用いる。本発明
で用いる膜濾過装置に精密濾過膜を用いると高Flux
が得られる。しかし、孔径が大きいと目詰まりによって
Fluxが低くなる傾向があり、FI値も高くなる傾向
があるので、好ましくは孔径が0.01〜1ミクロン、
より好ましくは0.01〜0.2ミクロンの精密濾過膜
を用いる。また、モジュール型式については、スパイラ
ル型、中空糸型、管状型及びプレート型のいずれでも良
いが、モジュール1本当たりの膜面積が大きいもので、
膜に付着した汚染物を除去し易い構造の物、例えば本実
施例で用いるような中空糸型の外圧濾過用モジュールが
好ましい。When an ultrafiltration membrane is used in the membrane filtration device used in the present invention, water quality with low turbidity can be obtained. However, an ultrafiltration membrane having a small cutoff molecular weight has a low flux, and therefore, an ultrafiltration membrane having a cutoff molecular weight of 3,000 to 1,000,000, and more preferably 6,000 to 1,000,000 is used. High-flux is obtained when a microfiltration membrane is used in the membrane filtration device used in the present invention.
Is obtained. However, if the pore size is large, the flux tends to be low due to clogging, and the FI value also tends to be high. Therefore, the pore size is preferably 0.01 to 1 μm.
More preferably, a 0.01-0.2 micron microfiltration membrane is used. The module type may be any of spiral type, hollow fiber type, tubular type and plate type, but the membrane area per module is large,
A structure having a structure that easily removes contaminants attached to the membrane, for example, a hollow fiber type external pressure filtration module as used in this embodiment is preferable.
【0010】膜の材質については、ポリアクリルニトリ
ル、ポリスルフオン、ポリエーテルスルフオン、ポリオ
レフィン、酢酸セルロース、ポリアミド、ポリビニルア
ルコール、ポリフッ化ビニリデン等の有機質膜、アルミ
ナ、ジルコニア等の無機質膜いずれでも良いが、能力が
低下した時の薬剤洗浄及び排水中の過酸化水素等の薬剤
にたいする耐性のある材質の膜、例えばポリフッ化ビニ
リデン(PVdF)膜が好ましい。The material of the film may be any of organic films such as polyacrylonitrile, polysulfone, polyether sulfone, polyolefin, cellulose acetate, polyamide, polyvinyl alcohol and polyvinylidene fluoride, and inorganic films such as alumina and zirconia. A membrane made of a material resistant to chemicals such as hydrogen peroxide in the chemical cleaning and drainage when the capacity is lowered, for example, a polyvinylidene fluoride (PVdF) membrane is preferable.
【0011】膜濾過装置による処理方法は、クロスフロ
ー方式の外圧濾過もしくは内圧濾過または原水側を加圧
する加圧濾過、もしくは濾過水側を吸引する吸引濾過の
いずれでも良く、一定量の濾過水量で濾過する定流量濾
過又は一定圧で濾過する定圧濾過のいずれでも良い。原
水側と濾過水側の膜間差圧(以下TMPという)は10
KPa〜300KPaが好ましい。逆洗及び又はエア−
バブリング等の物理洗浄で膜に付着した有機物、無機水
酸化物及び微粒子を定期的に系外に排出することが好ま
しい。実施例で用いる、逆洗とエアーバブリングを同時
に行って汚染物を剥離し、次いで、水でフラッシングし
て系外に排出する方法が効果的である。The treatment method by the membrane filtration device may be either external pressure filtration or internal pressure filtration of the cross flow system, pressure filtration for pressurizing the raw water side, or suction filtration for sucking the filtered water side, and a fixed amount of filtered water is required. Either constant flow filtration for filtration or constant pressure filtration for filtration at a constant pressure may be used. Transmembrane pressure difference between the raw water side and the filtered water side (hereinafter referred to as TMP) is 10
KPa to 300 KPa is preferable. Backwash and / or air
It is preferable to periodically discharge the organic substances, inorganic hydroxides and fine particles attached to the film to the outside of the system by physical cleaning such as bubbling. A method of performing backwashing and air bubbling at the same time to remove contaminants and then flushing with water and discharging out of the system, which is used in the examples, is effective.
【0012】排出頻度は有機物、無機水酸化物及び微粒
子の濃度にもよるが、30分毎〜1、2時間毎に処理量
の5〜10%量を排出するのが好ましい。Flux低下
した濾過膜は、苛性ソーダ、次亜塩素酸ソーダ等のアル
カリ系薬剤や硝酸、蓚酸、塩酸、硫酸等の酸系薬剤で洗
浄することが好ましい。以上の方法で得られた濾過水は
FI値が低いので、後段の逆浸透膜の処理安定性も良好
である。以下、実施例および比較例により本発明をより
具体的に説明する。The discharge frequency depends on the concentrations of organic substances, inorganic hydroxides and fine particles, but it is preferable to discharge 5 to 10% of the treatment amount every 30 minutes to 1 or 2 hours. The Flux-reduced filtration membrane is preferably washed with an alkaline chemical such as caustic soda and sodium hypochlorite, and an acidic chemical such as nitric acid, oxalic acid, hydrochloric acid and sulfuric acid. Since the filtered water obtained by the above method has a low FI value, the treatment stability of the reverse osmosis membrane in the latter stage is also good. Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples.
【0013】[0013]
【実施例1】プリント配線板製造の各種工程から排出さ
れる洗浄排水を集合し、その一部を本発明のpH調整槽
に500リットル/Hrで送り、攪拌機で攪拌しなが
ら、1規定の苛性ソーダを苛性ソーダ注入ポンプで注入
してpHを調整した。pHが7.2以下になると苛性ソ
ーダ注入ポンプが作動してpH7.8になると停止する
ようにpHコントローラーのpHを設定し、排水のpH
を7.0〜8.0の範囲に調整した。pH調整した排水
を送水ポンプで本発明の濾過装置の循環タンクに送り、
旭化成株式会社製の孔径0.1ミクロンの精密濾過膜
(商品名:「USV−3003」;外圧濾過用モジュー
ル、内径0.8mmの中空糸膜、材質PVdF)で濾過
した。その時の運転条件は、定流量濾過運転で、濾過水
450リットル/Hr、濾過/逆洗+エアーバブリング
/フラッシング=30分/60秒/30秒、排出量50
リットル/Hr(回収率90%)でおこなった。[Example 1] Washing wastewater discharged from various steps of printed wiring board production was collected, and a part of the wastewater was sent to the pH adjusting tank of the present invention at 500 liters / hr and stirred with a stirrer while stirring with 1N sodium hydroxide. Was injected with a caustic soda injection pump to adjust the pH. Set the pH of the pH controller so that the caustic soda injection pump operates when the pH becomes 7.2 or less and stops when the pH becomes 7.8.
Was adjusted to a range of 7.0 to 8.0. The pH-adjusted wastewater is sent to the circulation tank of the filtration device of the present invention by a water supply pump,
It was filtered with a microfiltration membrane (trade name: "USV-3003"; external pressure filtration module, hollow fiber membrane with an inner diameter of 0.8 mm, material PVdF) having a pore size of 0.1 micron manufactured by Asahi Kasei Corporation. The operating conditions at that time were a constant flow filtration operation, filtered water 450 liters / hr, filtration / backwashing + air bubbling / flushing = 30 minutes / 60 seconds / 30 seconds, discharge 50
It was performed at liter / Hr (recovery rate 90%).
【0014】上記の条件で、濾過開始時のTMPは40
KPaであり、100KPaの圧力で濾過した値に換算
したFlux(以下100KPa換算Fluxという)
は1125リットル/Hrであった。1週間濾過後のT
MPは50KPaであり、100KPa換算Fluxは
900リットル/Hrであった。その時の精密濾過膜濾
過水の濁度とFI値の測定及びイオン分析を行い、表1
に記載した。なお、濁度はHAC社製の商品名「210
0PTURBIDIMETER」で測定し、イオン量は
TJA社製の商品名「SOLAAR」を用いて原子吸光
法で分析した。FI値はJISK3802の4005に
記載の方法で行った。Under the above conditions, the TMP at the start of filtration is 40
KPa, which is converted to a value filtered at a pressure of 100 KPa (hereinafter referred to as 100 KPa-converted Flux)
Was 1125 liters / hr. T after 1 week filtration
MP was 50 KPa and 100 KPa conversion Flux was 900 liter / Hr. At that time, the turbidity of the microfiltration membrane filtered water and the FI value were measured and the ion analysis was performed.
Described in. In addition, the turbidity is "210" manufactured by HAC.
0PTURBIDIMETER ", and the amount of ions was analyzed by an atomic absorption method using a trade name" SOLAAR "manufactured by TJA. The FI value was measured by the method described in JISK3802 4005.
【0015】[0015]
【実施例2】実施例1と同じプリント配線板洗浄排水の
一部を本発明のpH調整槽に500リットル/Hrで送
り、pHを7.0〜8.0の範囲に調整した排水を、旭
化成株式会社製の孔径0.45ミクロンの精密濾過膜
(商品名:「ULW−348」;内圧濾過用モジュー
ル、内径1.1mmの中空糸膜、材質PVdF)を用い
て、内圧でクロスフロー方式で濾過した。上記の条件
で、濾過開始時のTMPは20KPaであり、100K
Pa換算Fluxは2250リットル/Hrであった。
1週間濾過後のTMPは30KPaであり、100KP
a換算Fluxは1500リットル/Hrであった。そ
の時の、精密濾過膜濾過水の濁度とFI値の測定及びイ
オン分析を実施例1と同じ方法で行い、表1に記載し
た。Example 2 A part of the same printed wiring board cleaning wastewater as in Example 1 was sent to the pH adjusting tank of the present invention at 500 liters / hr to adjust the pH to a range of 7.0 to 8.0. Asahi Kasei Corp. 0.45 micron pore size microfiltration membrane (trade name: "ULW-348"; internal pressure filtration module, inner diameter 1.1 mm hollow fiber membrane, material PVdF) using internal pressure cross flow method Filtered through. Under the above conditions, the TMP at the start of filtration is 20 KPa and 100 K
The Pa-converted Flux was 2250 liter / Hr.
TMP after filtration for 1 week is 30 KPa, 100 KP
The a-converted Flux was 1500 liters / Hr. The turbidity and FI value of the microfiltration membrane filtered water and the ion analysis at that time were carried out by the same method as in Example 1, and the results are shown in Table 1.
【0016】[0016]
【比較例1】実施例1と同じプリント配線板洗浄排水の
一部を本発明のpH調整槽に500リットル/Hrで送
り、pHを4.6〜5.4の範囲に調整した以外は実施
例1と同じ条件で濾過した。上記の条件で、濾過開始時
のTMPは40KPaであり、100KPa換算Flu
xは1125リットル/Hrであった。1週間濾過後の
TMPは200KPaであり、100KPa換算Flu
xは225リットル/Hrであった。その時の精密濾過
膜濾過水の濁度とFI値の測定及びイオン分析を実施例
1と同じ方法で行い、表1に記載した。[Comparative Example 1] The same procedure as in Example 1 was carried out except that a part of the printed wiring board cleaning drainage was sent to the pH adjusting tank of the present invention at 500 liters / hr to adjust the pH to a range of 4.6 to 5.4. Filtration was carried out under the same conditions as in Example 1. Under the above conditions, TMP at the start of filtration is 40 KPa, and 100 KPa conversion Flu
x was 1125 liters / hr. TMP after filtration for 1 week is 200 KPa, and 100 KPa conversion Flu
x was 225 liters / Hr. The turbidity and FI value of the microfiltration membrane filtered water at that time and the ion analysis were carried out in the same manner as in Example 1, and the results are shown in Table 1.
【0017】[0017]
【表1】 [Table 1]
【0018】[0018]
【発明の効果】以上詳述したとおり、本発明の配線板洗
浄排水の処理方法によれば、濾過膜のファウリングによ
るFlux低下が少なく、濾過水中のイオン量の低減及
び濁度成分の除去もでき、FI値4以下の水質を得るこ
とができる。As described in detail above, according to the method for treating a wiring board cleaning wastewater of the present invention, the flux is less likely to be reduced due to fouling of the filtration membrane, and the ion amount in the filtered water and the turbidity component are removed. It is possible to obtain water quality with an FI value of 4 or less.
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4D006 GA06 GA07 HA01 HA21 HA41 HA61 KA02 KA12 KC03 KD11 KD12 KD16 KD24 MA01 MA02 MA03 MA22 MB05 MC03 MC18 MC22 MC29 MC33 MC39 MC54 MC62 PA01 PB08 PB70 PC22 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 4D006 GA06 GA07 HA01 HA21 HA41 HA61 KA02 KA12 KC03 KD11 KD12 KD16 KD24 MA01 MA02 MA03 MA22 MB05 MC03 MC18 MC22 MC29 MC33 MC39 MC54 MC62 PA01 PB08 PB70 PC22
Claims (2)
洗浄排水を処理する方法において、排水のpHをpH調
整槽で6〜10に調整し、pH調整された排水を膜濾過
装置で処理することを特徴とするプリント配線板洗浄排
水の処理方法。1. A method for treating cleaning wastewater discharged from a printed wiring board manufacturing process, wherein the pH of the wastewater is adjusted to 6 to 10 with a pH adjusting tank, and the pH adjusted wastewater is treated with a membrane filtration device. A method for treating printed wiring board cleaning wastewater, characterized by:
分子量が3000〜100万の限外濾過膜又は、孔径が
0.01〜1ミクロンの精密濾過膜であることを特徴と
する請求項1に記載のプリント配線板洗浄排水の処理方
法。2. The filtration membrane used in the membrane filtration device is an ultrafiltration membrane having a molecular weight cutoff of 3,000 to 1,000,000 or a microfiltration membrane having a pore size of 0.01 to 1 micron. Item 2. A method of treating printed wiring board cleaning wastewater according to Item 1.
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Cited By (1)
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| WO2018220982A1 (en) * | 2017-05-29 | 2018-12-06 | 栗田工業株式会社 | Method for treating nonionic surfactant-containing water, and water treatment method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018220982A1 (en) * | 2017-05-29 | 2018-12-06 | 栗田工業株式会社 | Method for treating nonionic surfactant-containing water, and water treatment method |
| JP2018199109A (en) * | 2017-05-29 | 2018-12-20 | 栗田工業株式会社 | Treatment method of water containing nonionic surface active agent and water treatment method |
| CN110662720A (en) * | 2017-05-29 | 2020-01-07 | 栗田工业株式会社 | Method for treating water containing nonionic surfactant and method for treating water |
| TWI752214B (en) * | 2017-05-29 | 2022-01-11 | 日商栗田工業股份有限公司 | Water treatment method and water treatment method containing nonionic surfactant |
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