JP2003289849A - Heating device - Google Patents
Heating deviceInfo
- Publication number
- JP2003289849A JP2003289849A JP2002101829A JP2002101829A JP2003289849A JP 2003289849 A JP2003289849 A JP 2003289849A JP 2002101829 A JP2002101829 A JP 2002101829A JP 2002101829 A JP2002101829 A JP 2002101829A JP 2003289849 A JP2003289849 A JP 2003289849A
- Authority
- JP
- Japan
- Prior art keywords
- microplate
- base
- heating
- heat transfer
- heating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 57
- 238000001816 cooling Methods 0.000 claims description 17
- 238000009826 distribution Methods 0.000 description 5
- 239000012472 biological sample Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
- C12M23/00—Constructional details, e.g. recesses, hinges
- C12M23/02—Form or structure of the vessel
- C12M23/12—Well or multiwell plates
-
- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
- C12M41/00—Means for regulation, monitoring, measurement or control, e.g. flow regulation
- C12M41/12—Means for regulation, monitoring, measurement or control, e.g. flow regulation of temperature
- C12M41/18—Heat exchange systems, e.g. heat jackets or outer envelopes
- C12M41/22—Heat exchange systems, e.g. heat jackets or outer envelopes in contact with the bioreactor walls
Landscapes
- Apparatus Associated With Microorganisms And Enzymes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば培養装置に
搭載される加温装置に関する。TECHNICAL FIELD The present invention relates to a heating device mounted on, for example, a culture device.
【０００２】[0002]
【従来の技術】生物試料を用いた各種分析には、例えば
９６個、３８４個などの多数個のウェル（穴）が形成さ
れたマイクロプレートが用いられている。2. Description of the Related Art For various analyzes using a biological sample, a microplate having a large number of wells (holes) such as 96 and 384 is used.
【０００３】また、分析に先立ち、マイクロプレートの
各ウェル内に生物試料（微生物）を入れ、これを所定時
間加温した状態で培養することが行なわれる。Prior to analysis, a biological sample (microorganism) is placed in each well of a microplate, and the microplate is incubated while being heated for a predetermined time.
【０００４】このようなマイクロプレートの加温は、従
来、平坦な加熱板の上にマイクロプレートを載置するこ
とにより行なわれていた。Conventionally, such heating of the microplate has been performed by placing the microplate on a flat heating plate.
【０００５】しかしながら、このような方法では、マイ
クロプレートの脚部（外壁部）の内側において、加熱板
の表面と各ウェルの底部との間に相当の隙間が生じ、各
ウェルへの熱伝導性が低い。特に、マイクロプレートの
中央部付近にあるウェルが外周部付近にあるウェルに比
べて熱伝導性が劣り、温度分布（温度ムラ）が生じ易
い。However, in such a method, a considerable gap is generated between the surface of the heating plate and the bottom of each well inside the leg portion (outer wall portion) of the microplate, and the thermal conductivity to each well is increased. Is low. In particular, the well near the center of the microplate is inferior in thermal conductivity to the well near the periphery, and temperature distribution (temperature unevenness) is likely to occur.
【０００６】このような加温の際の温度ムラが生じる
と、各ウェル内の生物試料に対し等しい培養条件が与え
られないこととなり、分析結果の信頼性に影響を及ぼ
す。[0006] When such temperature unevenness occurs during heating, the biological sample in each well cannot be given the same culture condition, which affects the reliability of the analysis result.
【０００７】[0007]
【発明が解決しようとする課題】本発明の目的は、マイ
クロプレートに対する熱伝導効率が高く、温度ムラを抑
制することができる加温装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a heating device which has a high heat transfer efficiency with respect to a microplate and which can suppress temperature unevenness.
【０００８】[0008]
【課題を解決するための手段】このような目的は、下記
（１）〜（６）の本発明により達成される。The above objects are achieved by the present invention described in (1) to (6) below.
【０００９】（１） マイクロプレートを載置して加温
する基台を備え、前記基台は、マイクロプレートの脚部
が当接する面より突出し、マイクロプレートの底部側に
形成された凹部内に挿入可能な伝熱部を有することを特
徴とする加温装置。(1) A base for placing and heating the microplate is provided, the base protruding from the surface with which the legs of the microplate come into contact, and inside a recess formed on the bottom side of the microplate. A heating device having a heat transfer part that can be inserted.
【００１０】（２） 前記伝熱部は、加熱板または加熱
ブロックで構成されている上記（１）に記載の加温装
置。(2) The heating device according to (1), wherein the heat transfer section is composed of a heating plate or a heating block.
【００１１】（３） 前記伝熱部は、前記マイクロプレ
ートの底部側に形成された凹部に対応した形状をなして
いる上記（１）または（２）に記載の加温装置。(3) The heating device according to (1) or (2) above, wherein the heat transfer section has a shape corresponding to a recess formed on the bottom side of the microplate.
【００１２】（４） 前記伝熱部は、マイクロプレート
を載置した際、マイクロプレートの底部と非接触である
上記（１）ないし（３）のいずれかに記載の加温装置。(4) The heating device according to any one of the above (1) to (3), wherein the heat transfer section is in non-contact with the bottom of the microplate when the microplate is placed.
【００１３】（５） 前記基台および／または伝熱部を
冷却する冷却手段を備える上記（１）ないし（４）のい
ずれかに記載の加温装置。(5) The heating device according to any one of the above (1) to (4), comprising a cooling means for cooling the base and / or the heat transfer section.
【００１４】（６） 前記冷却手段は、ペルチェ素子で
構成されている上記（５）に記載の加温装置。(6) The heating device according to (5), wherein the cooling means is composed of a Peltier element.
【００１５】[0015]
【発明の実施の形態】以下、本発明の加温装置を添付図
面に示す好適な実施形態に基づいて詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION The heating device of the present invention will be described below in detail with reference to the preferred embodiments shown in the accompanying drawings.
【００１６】図１は、本発明の加温装置の第１実施形態
を示す断面側面図である。以下の説明では、図１（図
２、３も同様）中の上側を「上」または「上方」、下側
を「下」または「下方」と言う。FIG. 1 is a sectional side view showing a first embodiment of a heating device of the present invention. In the following description, the upper side in FIG. 1 (also in FIGS. 2 and 3) is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”.
【００１７】図１に示す加温装置１は、マイクロプレー
トを載置して加温する基台（基部）２を備えている。こ
こで、加温装置１の構成を説明する前に、まずマイクロ
プレート１０の構成について説明する。The heating device 1 shown in FIG. 1 is provided with a base (base) 2 on which a microplate is placed for heating. Here, before describing the configuration of the heating device 1, the configuration of the microplate 10 will be described first.
【００１８】マイクロプレート（試料収納容器）１０
は、多数のウェル（穴）１１と、その外周に形成された
脚部１３とを有し、これらが樹脂材料により一体的に形
成された構成となっている。Microplate (Sample Storage Container) 10
Has a large number of wells (holes) 11 and leg portions 13 formed on the outer periphery thereof, and these are integrally formed of a resin material.
【００１９】ウェル１１は、例えば１２行×８列、２４
行×１６列のように行列状に配置されている。図示の構
成では、各ウェル１１の底部１２は、それぞれ丸みを帯
びた形状をなしているが、平坦な形状であってもよい。
各ウェル１１の内部には、検体、例えば生物試料（図示
せず）が入れられる。The well 11 has, for example, 12 rows × 8 columns and 24 wells.
They are arranged in a matrix like rows × 16 columns. In the illustrated configuration, the bottom portion 12 of each well 11 has a rounded shape, but may have a flat shape.
A specimen, for example, a biological sample (not shown) is placed inside each well 11.
【００２０】脚部１３は、マイクロプレート１０の全周
を囲むように形成された壁状部材で構成されており、マ
イクロプレート１０は、この脚部１３の下端が基台２の
上面（載置面）２１に当接することにより載置される。The leg portion 13 is composed of a wall-shaped member formed so as to surround the entire circumference of the microplate 10. The lower end of the leg portion 13 of the microplate 10 is an upper surface (mounting position) of the base 2. It is placed by contacting the surface 21.
【００２１】各ウェル１１の底部１２は、脚部１３の下
端よりも所定距離（例えば２ｍｍ程度）上方に位置して
おり、マイクロプレート１０の底部側、即ち各ウェル１
１の下方位置には、凹部１４が形成されている。前述し
たように、ウェル１１が行列状に配置されたマイクロプ
レート１０では、凹部１４の平面形状は、ほぼ長方形と
なる。The bottom portion 12 of each well 11 is located above the lower end of the leg portion 13 by a predetermined distance (for example, about 2 mm), and is located on the bottom portion side of the microplate 10, that is, each well 1
A recess 14 is formed at a position below 1. As described above, in the microplate 10 in which the wells 11 are arranged in a matrix, the planar shape of the recess 14 is almost rectangular.
【００２２】基台２は、板状またはブロック状をなして
おり、例えば、ステンレス鋼、アルミニウム、チタン、
銅またはこれらを含む合金等の各種金属材料で構成され
ている。The base 2 has a plate shape or a block shape, and is made of, for example, stainless steel, aluminum, titanium,
It is made of various metal materials such as copper or alloys containing them.
【００２３】基台２の内部には、図示しない通電手段の
通電により作動するヒーター（熱源）３が設置されてい
る。ヒーター３の種類は、特に限定されず、例えば、棒
状ヒーター、電熱線、セラミックヒーター、ラバーヒー
ター等が挙げられる。Inside the base 2, a heater (heat source) 3 which is operated by energization of an energizing means (not shown) is installed. The type of the heater 3 is not particularly limited, and examples thereof include a rod-shaped heater, a heating wire, a ceramic heater, and a rubber heater.
【００２４】なお、このようなヒーターは、基台２の内
部に設置されている場合に限らず、基台２の外部に接合
されていてもよい。Note that such a heater is not limited to being installed inside the base 2, but may be joined to the outside of the base 2.
【００２５】基台２には、その上面２１より突出する伝
熱部４が設けられている（好ましくは、溶接、ろう付
け、嵌合等により固定されている）。マイクロプレート
１０は、この伝熱部４を覆うように基台２上に載置され
る。即ち、マイクロプレート１０を基台２上に載置した
とき、伝熱部４は、マイクロプレート１０の底部側に形
成された凹部１４内に挿入される。この場合、伝熱部４
の上面４１は、各ウェル１１の底部１２に接近するが、
非接触である。The base 2 is provided with a heat transfer portion 4 protruding from the upper surface 21 thereof (preferably fixed by welding, brazing, fitting, etc.). The microplate 10 is placed on the base 2 so as to cover the heat transfer section 4. That is, when the microplate 10 is placed on the base 2, the heat transfer section 4 is inserted into the recess 14 formed on the bottom side of the microplate 10. In this case, the heat transfer unit 4
The top surface 41 of the well approaches the bottom 12 of each well 11,
It is non-contact.
【００２６】このような構成としたことにより、基台２
の熱が伝熱部４を介して各ウェル１１に効率的に伝達さ
れる。即ち、ある程度の熱容量を持ち、伝熱性に優れる
伝熱部４が、凹部１４内を占め、かつその上面４１が各
ウェル１１の底部１２に接近している状態となるので、
各ウェル１１への伝熱効率が向上する。With this structure, the base 2
Is efficiently transferred to each well 11 via the heat transfer section 4. That is, since the heat transfer portion 4 having a certain amount of heat capacity and excellent in heat transfer occupies the inside of the recess 14 and the upper surface 41 thereof is close to the bottom 12 of each well 11,
The heat transfer efficiency to each well 11 is improved.
【００２７】このような伝熱部４としては、加熱板また
は加熱ブロックで構成されているものが好ましい。伝熱
部４の構成材料としては、特に限定されないが、例え
ば、ステンレス鋼、アルミニウム、チタン、銅またはこ
れらを含む合金等の各種金属材料が好ましい。このよう
な材料は、熱伝導性に優れているからである。It is preferable that the heat transfer section 4 is composed of a heating plate or a heating block. The constituent material of the heat transfer section 4 is not particularly limited, but for example, various metal materials such as stainless steel, aluminum, titanium, copper or alloys containing these are preferable. This is because such a material has excellent thermal conductivity.
【００２８】伝熱部４の平面形状は、マイクロプレート
１０の凹部１４の平面形状に対応した形状とするのが好
ましい。例えば、凹部１４の平面形状が前述したように
長方形の場合、伝熱部４の平面形状もほぼ長方形とす
る。これにより、各ウェル１１を加熱する際の伝熱効率
がさらに向上し、温度分布も均一となる。It is preferable that the planar shape of the heat transfer section 4 corresponds to the planar shape of the recess 14 of the microplate 10. For example, when the recess 14 has a rectangular planar shape as described above, the heat transfer section 4 also has a substantially rectangular planar shape. Thereby, the heat transfer efficiency when heating each well 11 is further improved, and the temperature distribution becomes uniform.
【００２９】なお、図示の構成では、伝熱部４自体にヒ
ーターが内蔵されていないが、ヒーター３と同様のヒー
ターが設置（内蔵）されていてもよい。In the illustrated construction, the heat transfer section 4 itself does not have a built-in heater, but a heater similar to the heater 3 may be installed (built-in).
【００３０】また、伝熱部４の上面４１は、ウェル１１
の底部１２と対面する面であるが、この上面４１は、平
坦な面であるのが好ましい。これにより、各ウェル１１
を加熱する際の温度分布をより均一にすることができ
る。In addition, the upper surface 41 of the heat transfer section 4 has the well 11
The upper surface 41 is preferably a flat surface, which is the surface facing the bottom 12 of the. This allows each well 11
The temperature distribution during heating can be made more uniform.
【００３１】図２は、本発明の加温装置の第２実施形態
を示す断面側面図である。以下、この第２実施形態につ
いて説明するが、前述の第１実施形態と同様の事項につ
いてはその説明を省略し、相違点を中心に説明する。FIG. 2 is a sectional side view showing a second embodiment of the heating device of the present invention. Hereinafter, the second embodiment will be described, but the description of the same matters as the first embodiment will be omitted, and the differences will be mainly described.
【００３２】図２に示す加温装置１は、基台２と伝熱部
４とが一体化された構成のものである。即ち、基台２に
は、その上面２１に開放する溝２２が形成されている。
この溝２２は、マイクロプレート１０の脚部１３が挿入
可能なものである。The heating device 1 shown in FIG. 2 has a structure in which the base 2 and the heat transfer section 4 are integrated. That is, the base 2 is formed with the groove 22 that opens to the upper surface 21 thereof.
The groove 13 allows the legs 13 of the microplate 10 to be inserted.
【００３３】例えば、脚部１３がマイクロプレート１０
の全周に渡って環状に形成されたものであれば、溝２２
もそれと同様の形状、配置で形成されている。For example, the leg portion 13 is the microplate 10.
If it is formed in an annular shape over the entire circumference of the groove 22
Also has the same shape and arrangement.
【００３４】この溝２２で囲まれる内側の部分にランド
部が形成されており、このランド部が伝熱部４を構成す
る。A land portion is formed in an inner portion surrounded by the groove 22, and the land portion constitutes the heat transfer portion 4.
【００３５】マイクロプレート１０をその脚部１３が溝
２２内に入るように装填すると、伝熱部４がマイクロプ
レート１０の底部側に形成された凹部１４内に挿入され
る。この場合、伝熱部４の上面４１は、各ウェル１１の
底部１２に接近するが、非接触である。When the microplate 10 is loaded so that the legs 13 thereof enter the groove 22, the heat transfer portion 4 is inserted into the recess 14 formed on the bottom side of the microplate 10. In this case, the upper surface 41 of the heat transfer portion 4 approaches the bottom portion 12 of each well 11, but is in non-contact.
【００３６】図３は、本発明の加温装置の第３実施形態
を示す断面側面図である。以下、この第３実施形態につ
いて説明するが、前述の第１実施形態と同様の事項につ
いてはその説明を省略し、相違点を中心に説明する。FIG. 3 is a sectional side view showing a third embodiment of the heating device of the present invention. Hereinafter, the third embodiment will be described, but the description of the same matters as those of the first embodiment will be omitted, and the differences will be mainly described.
【００３７】図３に示す加温装置１は、基台２を冷却す
る冷却手段を備えるものである。即ち、基台２の上面に
は、冷却手段としてペルチェ素子５が接合されている。
ペルチェ素子５は、一方の面側に発熱部（加熱部）５
１、多方の面側に吸熱部（冷却部）５２を有しており、
図示しない通電手段の通電により、発熱部（加熱部）５
１が発熱するとともに、吸熱部（冷却部）５２で吸熱さ
れ冷却される。The heating device 1 shown in FIG. 3 includes a cooling means for cooling the base 2. That is, the Peltier element 5 is joined to the upper surface of the base 2 as a cooling means.
The Peltier element 5 has a heating portion (heating portion) 5 on one surface side.
1, has a heat absorption part (cooling part) 52 on the side of many sides,
A heat generating part (heating part) 5 is generated by energizing an energizing means (not shown).
1 generates heat, and is absorbed and cooled by the heat absorbing section (cooling section) 52.
【００３８】本実施形態では、基台２上に、このような
ペルチェ素子５をその吸熱部５２が基台２の上面に接触
するように設置する。In the present embodiment, such a Peltier element 5 is installed on the base 2 so that the heat absorbing portion 52 thereof contacts the upper surface of the base 2.
【００３９】例えば、ヒーター３の作動によりマイクロ
プレート１０の加温が終了したら、ヒーター３をＯＦＦ
にし、ペルチェ素子５への通電を行なう。これにより、
ペルチェ素子５が作動し、基台２が吸熱され冷却され
る。基台２の温度が低下すると、伝熱部４も同様に温度
が低下し、その近傍にある各ウェル１１が冷却される。For example, when the heating of the microplate 10 is completed by the operation of the heater 3, the heater 3 is turned off.
Then, the Peltier device 5 is energized. This allows
The Peltier element 5 operates and the base 2 absorbs heat and is cooled. When the temperature of the base 2 decreases, the temperature of the heat transfer section 4 also decreases, and each well 11 in the vicinity thereof is cooled.
【００４０】このような冷却手段を具備することによ
り、マイクロプレート１０を加温するのみならず、冷却
することも可能となる他、所定の温度履歴（温度の経時
変化のパターン）を得るに際し、その温度コントロール
を迅速、適正に行なうことができる。By providing such a cooling means, it is possible not only to heat the microplate 10 but also to cool it, and when obtaining a predetermined temperature history (pattern of temperature change with time), The temperature can be controlled quickly and properly.
【００４１】また、前述した伝熱部４の機能（作用・効
果）は、冷却手段における冷却についても同様であり、
冷却の際の温度分布を均一にすることができる。The function (action / effect) of the heat transfer section 4 described above is the same for the cooling in the cooling means.
It is possible to make the temperature distribution uniform during cooling.
【００４２】なお、ペルチェ素子（冷却手段）５の設置
位置は、図示のものに限らず、例えば、基台２の内部や
下面に設置することもでき、あるいは、伝熱部４の内部
または表面に設置することもできる。The installation position of the Peltier element (cooling means) 5 is not limited to that shown in the figure, and it may be installed inside or on the bottom surface of the base 2, or inside or on the surface of the heat transfer section 4, for example. It can also be installed at.
【００４３】以上、本発明の加温装置を図示の各実施形
態について説明したが、本発明は、これらに限定される
ものではなく、加温装置を構成する各部は、同様の機能
を発揮し得る任意の構成のものと置換することができ
る。Although the heating device of the present invention has been described above with reference to the illustrated embodiments, the present invention is not limited to these, and each part constituting the heating device exhibits the same function. It can be replaced with one having any desired configuration.
【００４４】[0044]
【発明の効果】以上述べたように、本発明によれば、マ
イクロプレートに対する熱伝導効率が高く、温度分布を
均一にすることができる。As described above, according to the present invention, the heat transfer efficiency to the microplate is high and the temperature distribution can be made uniform.
【００４５】また、熱伝導効率が高いことから、迅速な
加温等が可能となり、その結果、例えば、所定の温度履
歴を得るに際し、その温度コントロールを迅速、適正に
行なうことができる。Further, since the heat transfer efficiency is high, rapid heating or the like can be performed, and as a result, for example, when a predetermined temperature history is obtained, the temperature control can be performed quickly and appropriately.
【図１】本発明の加温装置の第１実施形態を示す断面側
面図である。FIG. 1 is a sectional side view showing a first embodiment of a heating device of the present invention.
【図２】本発明の加温装置の第２実施形態を示す断面側
面図である。FIG. 2 is a sectional side view showing a second embodiment of the heating device of the present invention.
【図３】本発明の加温装置の第３実施形態を示す断面側
面図である。FIG. 3 is a sectional side view showing a third embodiment of the heating device of the present invention.
１ 加温装置 ２ 基台 ２１ 上面 ２２ 溝 ３ ヒーター ４ 伝熱部 ４１ 上面 ５ ペルチェ素子 ５１ 発熱部（加熱部） ５２ 吸熱部（冷却部） １０ マイクロプレート １１ ウェル １２ 底部 １３ 脚部 １４ 凹部 1 heating device 2 bases 21 upper surface 22 groove 3 heater 4 Heat transfer section 41 upper surface 5 Peltier element 51 Heat generating part (heating part) 52 Heat absorption part (cooling part) 10 micro plates 11 wells 12 bottom 13 legs 14 recess
Claims (6)
台を備え、 前記基台は、マイクロプレートの脚部が当接する面より
突出し、マイクロプレートの底部側に形成された凹部内
に挿入可能な伝熱部を有することを特徴とする加温装
置。1. A base for placing and heating a microplate is provided, the base protruding from a surface with which the legs of the microplate come into contact and inserted into a recess formed on the bottom side of the microplate. A heating device having a heat transfer part capable of heating.
クで構成されている請求項１に記載の加温装置。2. The heating device according to claim 1, wherein the heat transfer section includes a heating plate or a heating block.
底部側に形成された凹部に対応した形状をなしている請
求項１または２に記載の加温装置。3. The heating device according to claim 1, wherein the heat transfer section has a shape corresponding to a recess formed on the bottom side of the microplate.
した際、マイクロプレートの底部と非接触である請求項
１ないし３のいずれかに記載の加温装置。4. The heating device according to claim 1, wherein the heat transfer section is in non-contact with the bottom of the microplate when the microplate is placed.
る冷却手段を備える請求項１ないし４のいずれかに記載
の加温装置。5. The heating device according to claim 1, further comprising cooling means for cooling the base and / or the heat transfer section.
れている請求項５に記載の加温装置。6. The heating device according to claim 5, wherein the cooling unit is configured by a Peltier element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002101829A JP3657236B2 (en) | 2002-04-03 | 2002-04-03 | Heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002101829A JP3657236B2 (en) | 2002-04-03 | 2002-04-03 | Heating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003289849A true JP2003289849A (en) | 2003-10-14 |
| JP3657236B2 JP3657236B2 (en) | 2005-06-08 |
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ID=29241991
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002101829A Expired - Fee Related JP3657236B2 (en) | 2002-04-03 | 2002-04-03 | Heating device |
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| Country | Link |
|---|---|
| JP (1) | JP3657236B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018003443A1 (en) * | 2016-06-27 | 2018-01-04 | 公立大学法人大阪府立大学 | Heat transfer plate, well plate unit and device for stripping cells |
-
2002
- 2002-04-03 JP JP2002101829A patent/JP3657236B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018003443A1 (en) * | 2016-06-27 | 2018-01-04 | 公立大学法人大阪府立大学 | Heat transfer plate, well plate unit and device for stripping cells |
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| Publication number | Publication date |
|---|---|
| JP3657236B2 (en) | 2005-06-08 |
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