JP2003289190A - Mounting member and mounting method for heat-generating electronic components - Google Patents

Abstract

(57) [Problem] To fix a heat-generating electronic component in contact with or close to a heat radiator, and eliminate the need for a special jig for holding the heat-generating electronic component on an electronic circuit board. Provided are a member for mounting a heat-generating electronic component and a mounting method using the same, which can prevent the operation from becoming complicated and increasing the cost. SOLUTION: Mounting member (nut plate 10)
A first member (first and second heat conducting portions 14 and 16, a cross-shaped portion 18, a vertical positioning portion 20) for holding a heat-generating electronic component (power transistor 12), and the first member (First to third feet 22, 24, 26) for holding the first member on an electronic circuit board, and a third member (female screw 1) for fixing the first member to a heat radiator (heat sink)
8d, a bolt hole, a bolt formed in the heat radiator), and the first and second members function as jigs for holding the heat-generating electronic component on the electronic circuit board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting member and a mounting method for a heat-generating electronic component, and more specifically, a mounting for fixing a discrete type heat-generating electronic component in contact with or close to a radiator. TECHNICAL FIELD The present invention relates to a member for heating and a method for mounting a heat-generating electronic component using the member.

[0002]

2. Description of the Related Art Conventionally, when a heat-generating electronic component such as a power transistor is mounted on an electronic circuit board housed in a case, it is described in, for example, Japanese Unexamined Patent Publication No. 10-98286 and Japanese Utility Model Registration No. 2598317. As described above, the heat generating electronic component is brought into contact with or close to a heat radiator having a high heat conductivity or a large heat capacity such as a case side wall and a standing portion provided on the case, while using an appropriate mounting member. The heat-generating electronic component and the heat radiator which are in contact with each other are fixed, and the generated heat is conducted to the heat radiator to radiate the heat.

[0003]

Generally, when a discrete type heat-generating electronic component is fixed in contact with or close to a heat radiator, the heat-generating electronic component is mounted in order to minimize the reduction of the mounting area. In the case where the heat generating electronic component is fixed upright on the electronic circuit board, the heat generating electronic component can be stabilized by fixing the heat generating electronic component to the heat radiator using the attachment member described above.

Therefore, until the process of fixing the lead portion of the heat-generating electronic component to the electronic circuit board and further fixing the fixed heat-generating electronic component to the radiator using the mounting member, A dedicated jig for holding (or fixing) the component on the electronic circuit board is required, and the process of mounting and removing the jig complicates the work. There is also a problem that the cost increases with the design and manufacture of the dedicated jig.

Therefore, an object of the present invention is to solve the above-mentioned problems and to fix a heat-generating electronic component to an electronic circuit board when fixing the heat-generating electronic component in contact with or close to a heat radiator. It is an object of the present invention to provide a member for mounting a heat-generating electronic component, which does not require the jig, and thus can prevent the work from becoming complicated and the cost from increasing. Another object of the present invention is to provide a method for mounting a heat-generating electronic component using the mounting member.

[0006]

In order to solve the above problems, in the present invention, at least one heat-generating electronic component mounted on an electronic circuit board is mounted in contact with or close to a heat radiator. In a mounting member for a heat-generating electronic component, the mounting member includes a first member that holds the heat-generating electronic component, and a second member that holds the first member on the electronic circuit board. The third member for fixing the first member to the radiator is configured.

A mounting member for a heat-generating electronic component, wherein at least one heat-generating electronic component mounted on an electronic circuit board is mounted in contact with or close to a heat radiator, wherein the mounting member is the heat-generating electronic component. A first member for holding, a second member for holding the first member on the electronic circuit board, and a third member for fixing the first member to the radiator are configured. So, the mounting member,
Specifically, since the first member and the second member function as jigs for holding the heat-generating electronic component on the electronic circuit board, a dedicated jig is not required, so that the work It is possible to prevent complication and increase in cost.

According to a second aspect of the present invention, the first member is composed of a first portion and a second portion which are formed with a separation distance substantially equal to the width of the heat-generating electronic component. The heat-generating electronic component is sandwiched and held between the first portion and the second portion.

The first member is composed of a first portion and a second portion which are formed at a distance as large as the width of the heat-generating electronic component, and the heat-generating electronic component is the first member. Since it is configured to be held by being sandwiched between the part and the second part, the work of holding the heat-generating electronic component becomes simple. When the first member and the heat-generating electronic component held by the first member are held on the electronic circuit board by the second member,
The position of the heat-generating electronic component can be easily corrected.

Further, in the present invention, the third member may have a first bolt insertion hole formed in the first member and a second bolt insertion hole formed in the radiator. A bolt insertion hole and a bolt to be inserted into the first and second bolt insertion holes, and the bolt is inserted into the first and second bolt insertion holes to allow the first member and the heat radiation. When the body is fastened and fixed, stress is applied to the first portion and the second portion in the direction of decreasing the separation distance.

The third member has a first bolt insertion hole to be bored in the first member and a second bolt insertion hole to be bored in the radiator.
And a bolt to be inserted into the first and second bolt insertion holes, and the first and second bolt insertion holes are used to insert the bolt into the first and second bolt insertion holes.
When the member and the heat radiator are fastened and fixed, stress is applied to the first portion and the second portion in the direction of reducing the separation distance. Therefore, the heat generating electronic component and the first member are The heat radiators can be closely attached and fixed to each other, so that the heat dissipation of the heat-generating electronic component can be improved.

According to a fourth aspect of the present invention, there is provided a method for mounting a heat-generating electronic component using the mounting member according to any one of the first to third aspects, wherein at least one of the heat generating members is used. Heat-resistant electronic component is held by the first member, the first member and the heat-generating electronic component fixed thereto are held on the electronic circuit board by the second member, and on the electronic circuit board. From the step of bringing at least one of the held first member and heat-generating electronic component into contact with the heat radiator, and fixing the first member and heat-generating electronic component to the heat radiator by the third member. Configured to be.

At least one exothermic electronic component is held by a first member, the first member and the exothermic electronic component held by the second member are held on the electronic circuit board by a second member, and At least one of the first member and the heat-generating electronic component held on the electronic circuit board is brought into contact with the heat radiator, and the first member and the heat-generating electronic component are connected to the heat radiator by the third member. The fixing member, that is, the first member and the second member are made to function as a jig for holding the heat-generating electronic component on the electronic circuit board. Since it is configured as described above, a dedicated jig is not necessary, so that it is possible to prevent the work from becoming complicated and the cost from increasing. Further, the heat-generating electronic component, the first member, and the heat radiator can be closely attached and fixed to each other, so that the heat radiation property of the heat-generating electronic component can be improved.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION A mounting member for a heat-generating electronic component according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a perspective view of a mounting member for a heat-generating electronic component according to this embodiment as viewed from the front left side together with the heat-generating electronic component, and FIG. 2 is a mounting member shown in FIG. FIG. 3 is a perspective view of the heat generating electronic component viewed from the left side of the back surface. Further, FIG. 3 is a perspective view of a state in which one of the heat-generating electronic components is removed (or before being attached) from the attachment member shown in FIG. 1, as viewed from the front left side, as in FIG. In FIGS. 1 to 3, reference numeral 10 indicates a member for mounting a heat-generating electronic component (hereinafter referred to as “nut plate”), and the nut plate 10 is formed by press-molding a metal having high heat conductivity such as aluminum.

The nut plate 10 includes a first member for holding a plurality of, specifically two, heat-generating electronic components such as the power transistor 12, and the entire nut plate 10 including the first member. , A nut plate 1 including a first member and a second member for holding the power transistor 12 held therein on an electronic circuit board (described later).
A third member is provided for fixing the entire zero to a radiator (heat sink, which will be described later). In FIG. 4, the nut plate 10
Is shown in a front view, FIG. 5 is a top view thereof, and FIG. 6 is a right side view thereof.

Referring to FIGS. 1 to 6, first of all, the first member will be described. The first member is the first heat conducting portion 14 and the second heat conducting member which are main constituent members of the nut plate 10. The part 16 (both the first part described above) and the first and second heat conducting parts 14, 16 from the nut plate 10
Of the cross-shaped portion 18 (the above-mentioned second portion) formed in a cross shape by projecting in the front (in the X-axis direction) at a distance approximately the same as the width of the power transistor 12 in the X-axis direction, and The first and second heat conducting portions 14 and 16 and the vertical positioning portion 20 of the power transistor 12 formed below the cross-shaped portion 18 in the vertical (Z-axis) direction.

The cross-shaped portion 18 is specifically composed of a lateral (Y-axis) direction member 18a and a vertical member 18b. Both ends 18a1 of the lateral member 18a and the upper end 18b1 of the vertical member 18b are formed in a tapered shape. Then, the first heat conducting portion 14 and the second heat conducting portion 16 are connected to each other. A circular projecting portion 18c is formed at the intersection of the lateral member 18a and the vertical member 18b, and a female screw 18d into which a bolt described later is to be inserted is formed on the projecting portion 18c. The lateral member 18a and the vertical member 18b are
Sides of both ends 18a1 and upper end 18b1 (indicated by 18b2)
Is formed so that the separation distance thereof is about the same as the width of the power transistor 12 in the Y-axis direction.

Further, the vertical positioning portion 20, as specifically shown in FIGS. 5 and 6, has the first and second heat conducting portions 14 and 16 and the cross-shaped portion 18 (more specifically, its portion). Below the lateral member 18a) in the vertical direction,
Forward of the first and second heat conducting portions 14 and 16 in the X-axis direction,
Further, the upper surface 20a is formed at a position rearward of the cross-shaped portion 18 in the X-axis direction.

As is apparent from FIGS. 1 and 2, the power transistor 12 includes the first and second heat conducting portions 14 and 1.
6 and the cross-shaped portion 18 (more specifically, the lateral member 18
It is sandwiched by a) and positioned in the X-axis direction. Further, by being sandwiched between both ends 18a1 of the lateral member 18a and the side surface 18b2 of the upper end 18b1 of the vertical member 18b, positioning in the Y-axis direction is performed. Furthermore, by being placed on the upper surface 20a of the vertical positioning portion 20, positioning in the Z-axis direction is performed. Thus, the power transistor 12 is held in place on the nut plate 10.

Since the power transistor 12 is only sandwiched by the above-mentioned members formed so as to have a separation distance similar to the width in each direction, its holding position can be easily corrected. .

Next, the second member will be described with reference to FIGS. 7 is a perspective view showing the nut plate 10 together with an electronic circuit board to which it is fixed, and FIG. 8 is a perspective view showing a state where the nut plate 10 is held on the electronic circuit board.

As shown in FIGS. 1 to 8, two first legs 22 are formed below the vertical positioning portion 20 on both left and right sides (Y-axis direction). Also, the vertical member 1
The lower portion of 8b is bent forward in the X-axis direction, and one second foot portion 24 similar to the first foot portion 22 is formed at the tip thereof. Further, the X of the two first foot portions 22 described above
A total of two third foot portions 26 shorter than the first and second foot portions 22 and 24 are formed axially rearward. The second member is composed of these first to third foot portions 22, 24 and 26.

As shown in FIG. 7, an electronic circuit board (hereinafter,
The above-mentioned first foot portion 2 is provided on the “substrate” 30.
Two first fitting holes 32 that fit into 2 are drilled, and one second fitting hole 34 that fits into the second foot portion 24 is drilled. Further, a total of six through holes 36 for inserting each of the three lead wires 12a connected to the two power transistors 12 are formed, and a recess 38 in which a heat sink described later is located is formed. To be done.
Note that other electronic components mounted on the substrate 30 are omitted for simplification of the drawing.

As shown in FIG. 8, while inserting the lead wire 12a into the corresponding through hole 36, the first fitting hole 3 is formed.
2, the first foot portion 22 is inserted into the second fitting hole 34, and the second foot portion 24 is inserted into and fitted into the second fitting hole 34, and the third foot portion 26 is arranged at a predetermined position on the substrate 30. This holds the first member, more generally the nut plate 10, in place on the substrate 30 along with the power transistor 12 held therein. At this time, since the holding position of the power transistor 12 can be corrected as described above, the lead wire 12a can be easily inserted even if there is a positional formation error of the through hole 36 with respect to the fitting holes 32 and 34. be able to. Thus, the entire nut plate 10 including the first member and the power transistor 12 held by the nut plate 10 can be easily held on the substrate 30. After that, the lead wire 12 of the power transistor 12
a is soldered to the substrate 30, and the power transistor 12 is fixed to the substrate 30.

In the state where the nut plate 10 is held on the substrate 30, the first and second heat conducting portions 14 and 16 of the nut plate 10 have side surfaces on the side of the through hole 36 of the recess 38 (38a in FIG. 7). The recess 38, the fitting holes 32 and 34, and the through hole 36 are formed so as to be located above or on the outer side of the substrate than the side surface 38a.

Next, the third member will be described with reference to FIGS. 9 to 11.

As shown in FIGS. 9 and 10, the substrate 30 to which the power transistor 12 is soldered is a housing case 40 made of a metal having a high thermal conductivity such as aluminum.
Housed in. Specifically, the substrate 30 is the housing case 4
It is mounted on the mounting portion 42 formed at an appropriate position of 0 and is fixed at a predetermined position in the housing case 40 by an appropriate method such as fastening with a bolt (not shown).

A part of the inner surface of the housing case 40 is formed thick to form a heat sink 44 that is substantially the same shape as the recess 38 of the substrate 30 in a top view.

A bolt insertion hole 46 is formed in the heat sink 44 at a position corresponding to the above-mentioned female screw 18d with the substrate 30 fixed. The housing case 40 is inserted into the bolt insertion hole 46 and the female screw 18d.
The first member, specifically, the first and second heat conducting portions 14 and 16 are fixed by externally inserting and fastening the bolt.
Are closely attached and fixed to the heat sink 44. That is, the heat generated by the power transistor 12 is radiated (dissipated) to the outside of the housing case 40 via the first and second heat conducting portions 14 and 16 and the heat sink 44.

FIG. 11 is a top view showing a state in which the nut plate 10 including the first member is fixed to the heat sink 44 with bolts. In the figure, reference numeral 48 indicates a bolt. As described above, the third member includes the female screw 18d formed in the protruding portion 18c of the cross-shaped portion 18, the bolt hole 46, and the bolt 48.

Next, referring to FIGS. 12 to 15, the above-mentioned first to third members will be further described. 12
Is the nut plate 10 and the heat sink 4 of FIG.
4 is a partially enlarged view of the vicinity of FIG. 4 and FIG.
FIG. 13 is an enlarged cross-sectional view taken along line XIII-XIII of FIG. 11, showing the vicinity of the nut plate 10 and the heat sink 44 similarly to the above. 14 is a sectional view taken along line XIV-XIV of FIG. 13, and FIG. 15 is a sectional view taken along line XV-XV of FIG.

As shown in FIGS. 12 to 15, the power transistor 12 includes a first heat conducting portion 14 and a second conducting portion 16 which are first members, and a cross-shaped portion 18 (more specifically, a lateral portion thereof). By being sandwiched by the direction member 18a), the positioning in the X-axis direction shown in FIGS. 1 and 2 is performed. Also, both ends 18a1 of the lateral member 18a
And the side surface 18b2 of the upper end 18b1 of the vertical member 18b.
It is positioned in the Y-axis direction by being sandwiched by and is further positioned in the Z-axis direction by being placed on the upper surface 20a of the vertical positioning unit 20.

A female screw 18d formed on the cross portion 18 and a bolt hole 46 formed in the heat sink 44 are formed.
The nut plate 10 (specifically, the first heat conducting portion 14 and the second heat conducting portion 16) and the heat sink 44 are in close contact with each other by inserting and fixing the bolts 48 from the outside of the housing case 40. And then fixed. At this time, since the female screw 18d and the bolt 48 are fastened and fixed, a stress acting on the heat sink 44 side acts on the cross-shaped portion 18. In other words, the first and second conductive portions 14 and 16 and the cross-shaped portion 1
8 (more specifically, the lateral member 18a), the stress acts in the direction of decreasing the distance from the power transistor 12, and the power transistor 12 is strongly sandwiched in the X-axis direction. The first and second barrel parts 16 and 16 and the cross-shaped part 18 are closely attached.

As described above, since the power transistor 12, the first member and the heat sink 44 can be adhered and fixed to each other, the heat dissipation of the power transistor 12 can be improved.

As described above, in the nut plate 10 according to this embodiment, the power transistor 12 is held on the substrate 30 by the first member and the second member and is also held on the substrate 30. The power transistor 12 thus formed is in close contact with and fixed to the heat sink 44 by the third member. That is, the first member and the second member can function as a jig for holding the power transistor 12 on the substrate 30. For this reason, a dedicated jig is not required, so that it is possible to prevent the work from becoming complicated and the cost from increasing. Further, since the holding by the first member and the second member can be easily performed as described above, the workability can be further improved. Furthermore, the heat dissipation of the power transistor 12 can be improved.

Next, with reference to FIG. 16, a method of mounting the power transistor 12 using the above nut plate 10 will be described. FIG. 16 is a block diagram showing a method of mounting the power transistor 12 according to this embodiment, which is divided into blocks for each step.

In the following, referring again to the aforementioned drawings, first, at S1, at least one power transistor 12 is held by the above-mentioned first member. More specifically, as shown in FIGS. 1 and 2, the two power transistors 12 are connected to the first and second heat conducting portions 14 and 16 which are the first members, and the cross-shaped portion 18 (more More specifically, it is sandwiched by the lateral member 18a) and positioned in the X-axis direction, and is sandwiched by both ends 18a1 of the lateral member 18a and the side surface 18b2 of the upper end 18b1 of the vertical member 18b to move in the Y-axis direction. After positioning, it is further mounted on the upper surface 20a of the vertical positioning unit 20 and Z
Hold by axial positioning.

The power transistor 12 is inserted from above in the Z-axis direction into the gap between the first and second heat conducting portions 14 and 16 and the cross portion 18 (specifically, the lateral member 18a thereof). It is placed on the upper surface 20a of the vertical positioning portion 20.

Then, in S2, the first member and the power transistor 12 held by the first member are connected to the second member described above.
The member is held on the substrate 30. More specifically, as shown in FIGS. 7 and 8, the lead wire 12a of the power transistor 12 is connected to the corresponding through hole 3.
6, the first foot portion 22 as the second member is placed in the first fitting hole 32, and the second foot portion 24 is placed in the second fitting hole 34.
And the third leg 36
Are arranged on the substrate 30 so that the first member and the power transistor 12 held by the first member are formed on the substrate 30.
Hold it in place. That is, the first member and the second member function as a jig for holding the power transistor 12 on the substrate 30.

Then, in step S3, the lead wire 12a of the power transistor 12 is soldered to the substrate 30 to fix the power transistor 12 to the substrate 30.

Then, in S4, as shown in FIG. 10, the substrate 30 is fixed to the mounting portion 42 of the housing case 40 by an appropriate method such as fastening with bolts. At this time, the first member held on the substrate 30, specifically, the first and second heat conducting portions 14 and 16 are brought into close contact with the heat sink 44.

Next, in S5, the first member is fixed to the heat sink by the above-mentioned third member. Specifically, as shown in FIGS. 11 to 15, the power transistor 12 is fixed in close contact with the heat sink 44 by inserting the bolt 48 into the female screw 18d as the third member and the bolt hole 46.

As described above, the nut plate 10, more specifically, the first member and the second member are connected to the power transistor 12.
Since it functions as a jig for holding the substrate on the substrate 30, a dedicated jig becomes unnecessary, and an increase in cost can be prevented. Further, since the jig mounting / removing process is not required, the work can be prevented from becoming complicated.

As described above, in the embodiment of the present invention, at least one heat-generating electronic component (power transistor 1) mounted on the electronic circuit substrate (substrate 30) is used.
In a member (nut plate 10) for mounting an exothermic electronic component in which 2) is mounted in contact with or close to a radiator (heat sink 44), the mounting member is a first member (holding the exothermic electronic component). First heat conducting section 1
4, second heat conducting portion 16, cross-shaped portion 18 (lateral member 1
8a, both ends 18a1, a vertical member 18b, an upper end 18b
1, side surface 18b2), vertical positioning portion 20 (upper surface 2
0a)) and a second member (first foot portion 22, second foot portion 24) for holding the first member on the electronic circuit board.
The third foot portion 26) and the third member (female screw 18d, bolt hole 46, bolt 48) for fixing the first member to the radiator are configured.

Further, the first member is a first portion formed with a separation distance approximately the same as the width of the heat-generating electronic component (width in the X-axis and Y-axis directions shown in FIG. 1 etc.). (First
Of the heat-conducting portion 14, the second heat-conducting portion 16) and the second portion (the cross-shaped portion 18 (lateral member 18a)), and the heat-generating electronic component is connected to the first portion and the second portion. It was configured to be held by being sandwiched between the parts.

Further, the first member is provided with both ends 18a1 of the cross-shaped portion 18 and the side surface 1 of the cross-shaped portion 18 which are formed at a distance approximately the same as the width of the heat-generating electronic component in the Y-axis direction.
8b2, and the heat-generating electronic component is sandwiched and held by them.

The third member has a first bolt insertion hole (specifically, a female screw 18d formed in the projecting portion 18c of the cross-shaped portion 18) to be formed in the first member. )
And a second bolt insertion hole (specifically, the bolt hole 46) to be bored in the radiator, and a bolt 48 to be inserted into the first and second bolt insertion holes, and When the bolt is inserted into the first and second bolt insertion holes to fasten and fix the first member and the radiator, the first portion (the first heat conducting portion 14, the second heat conducting portion) Part 16) and the second part (cross-shaped part 18 (lateral member 1
8a)) is applied with a stress in the direction of decreasing the separation distance (separation distance in the X-axis direction).

In addition, in the method of mounting the heat-generating electronic component (power transistor 12) using the above-mentioned mounting member (nut plate 10), at least one heat-generating electronic component is held by the first member. (S1), the first member and the heat-generating electronic component fixed thereto are held on the electronic circuit board by the second member (S1).
2), and at least one of the first member and the heat-generating electronic component held on the electronic circuit board is brought into contact with the radiator (S4), and the first member and the heat-generating electronic component are The third member is fixed to the radiator by the step (S5).

In the embodiment of the present invention, the power transistor 12 is described as an example of the heat-generating electronic component, but the present invention is not limited to this, and other electronic components can be used.

Further, although the number of the power transistors 12 held by the nut plate 10, specifically, the first member is two, the number is not limited to this, and may be one or three or more. good.

The power transistor 12 may be brought into direct contact with the heat sink 44. For example,
The heat sink 44 may be formed with a partial projecting portion that is inserted into the gap between the first heat conducting portion 14 and the second heat conducting portion 16.

Further, the third foot portion 26 is made shorter than the first and second foot portions 22 and 24 so as to be arranged at a predetermined position of the substrate 30, but the third foot portion 26 is made to be the first foot portion. , The second foot 2
The length may be about the same as 2, 24, and appropriate fitting holes may be formed in the substrate 30 so that the third foot portion 26 can be inserted into the substrate 30.

The first portion (the first heat conducting portion 14,
The separation distance in the X-axis direction defined by the second heat conducting portion 16) and the second portion (the cross-shaped portion 18 (lateral member 18a)) is formed smaller than the width of the heat-generating electronic component. The thermoelectric electronic component may be sandwiched and fixed between the first portion and the second portion. This also applies to the Y-axis direction defined by both ends 18a1 of the cross-shaped portion 18 and the side surfaces 18b2 of the cross-shaped portion 18.

[0055]

According to the present invention, the mounting member (nut plate), specifically the first member and the second member, holds the heat-generating electronic component on the electronic circuit board. Since it functions as a jig for this purpose, a dedicated jig is not required, and thus it is possible to prevent complication of work and increase in cost.

According to the second aspect, the work of fixing the heat-generating electronic component (power transistor) to the first member becomes simple. Further, when the first member and the heat-generating electronic component fixed thereto are held on the electronic circuit board by the second member, the position of the heat-generating electronic component can be easily corrected.

In the third aspect, the heat-generating electronic component, the first member, and the heat radiator can be closely fixed to each other, so that the heat radiation property of the heat-generating electronic component can be improved. it can.

According to a fourth aspect of the present invention, in the method of mounting the heat-generating electronic component, the mounting members, specifically, the first member and the second member are the heat-generating electronic component on the electronic circuit board. Since it is configured so as to function as a jig for holding it, a dedicated jig is not required, so that it is possible to prevent complication of work and increase in cost.

[Brief description of drawings]

FIG. 1 is a perspective view of a mounting member for a heat-generating electronic component according to an embodiment of the present invention, viewed from the front left side together with the heat-generating electronic component.

FIG. 2 is a perspective view of the mounting member shown in FIG. 1 as viewed from the left side of the back surface together with the heat-generating electronic component.

3 is a perspective view showing a state in which one of the heat-generating electronic components is removed (or before being attached) from the attachment member shown in FIG. 1, as seen from the front left side, as in FIG. 1.

FIG. 4 is a front view of the mounting member shown in FIG.

5 is a top view of the mounting member shown in FIG. 1. FIG.

FIG. 6 is a right side view of the attachment member shown in FIG.

FIG. 7 is a perspective view showing the attachment member shown in FIG. 1 together with an electronic circuit board to which the attachment member is fixed.

8 is a perspective view showing a state in which the attachment member shown in FIG. 1 is fixed to an electronic circuit board.

9 is a perspective view showing the electronic circuit board shown in FIG. 8 together with a housing case in which the electronic circuit board is housed.

10 is a perspective view showing a state where the electronic circuit board shown in FIG. 8 is housed in a housing case.

FIG. 11 is a top view showing a state in which the attachment member shown in FIG. 1 is fixed to a radiator.

FIG. 12 is a partially enlarged view of FIG. 11 in the vicinity of a mounting member and a radiator.

13 is an enlarged cross-sectional view taken along the line XIII-XIII in FIG. 11, showing the vicinity of the attachment member and the heat radiator as in FIG.

14 is a sectional view taken along line XIV-XIV in FIG.

15 is a sectional view taken along line XV-XV in FIG.

FIG. 16 is a block diagram showing a method of mounting a heat-generating electronic component using the mounting member according to the embodiment of the present invention, which is divided into blocks for each step.

[Explanation of symbols]

10 Mounting member (nut plate) 12 Heat-generating electronic components (power transistors) 14 First heat conduction part 16 Second heat conducting section 18 Cross 18a Lateral member 18a1 (lateral member) both ends 18b Vertical member 18b1 (upper and lower member) upper end 18b2 Side surface (of vertical member) 18c protruding part 18d female screw 20 Vertical positioner 20a (upper and lower positioning portion) upper surface 22 First foot 24 Second foot 26 Third foot 30 electronic circuit board (board) 44 heat sink 46 bolt holes 48 volts

Claims (4)

[Claims] 1. At least one mounted on an electronic circuit board
In a mounting member for a heat-generating electronic component that fixes individual heat-generating electronic components in contact with or close to a heat radiator, the mounting member includes a first member that holds the heat-generating electronic component, and the first member. A heat-generating electronic component mounting member comprising a second member for holding the first member on the electronic circuit board and a third member for fixing the first member to the radiator. 2. The first member is composed of a first portion and a second portion which are formed with a separation distance substantially equal to the width of the heat-generating electronic component, and the heat-generating electronic component is 2. The heat-generating electronic component mounting member according to claim 1, wherein the heat-generating electronic component mounting member is configured to be held by being sandwiched between the first portion and the second portion. 3. The third member includes a first bolt insertion hole to be bored in the first member, a second bolt insertion hole to be bored in the heat radiator, and the third member. 1 and 2
Of the bolt to be inserted into the bolt insertion hole, and when the bolt is inserted into the first and second bolt insertion holes to fasten and fix the first member and the radiator, The member for mounting an exothermic electronic component according to claim 2, wherein stress is applied to the portion and the second portion in a direction that reduces the separation distance. 4. A method of mounting a heat-generating electronic component using the mounting member according to any one of claims 1 to 3, comprising: a. Holding at least one exothermic electronic component by the first member; b. Holding the first member and the heat-generating electronic component held by the first member on the electronic circuit board by the second member; and c. At least one of the first member and the heat-generating electronic component held on the electronic circuit board is brought into contact with the radiator, and the first member and the heat-generating electronic component held by the third member are attached to the third member. A method for mounting a heat-generating electronic component, comprising the step of fixing the heat-radiating member to the heat radiator with a member.