JP2003289168A - Semiconductor laser device, optical pickup device, and electronic equipment - Google Patents

Abstract

(57) [Problem] To provide a semiconductor laser device in which the number of parts is small, the optical axis of laser light can be freely adjusted, and after this adjustment, the optical axis of laser light is not easily shifted. A laser chuck (32) can move, rotate, or tilt the mounting stem (14a) while holding the mounting stem (14a) therebetween. X and Y positions of the optical axis on a plane orthogonal to the optical axis, the rotation angle of the optical axis, the position of the semiconductor laser chip 12 in the optical axis direction, the radial angle and the tangential angle of the optical axis. Can be adjusted. At this time, the mounting stem portion 14a
Adjustment stem 14b between the shaft and each fixing stem 14c
Is plastically deformed, the position and angle of the mounting stem 14a are maintained, and the position and angle of the optical axis of the laser beam are maintained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser device, an optical pickup device, and electronic equipment.

[0002]

2. Description of the Related Art FIG. 7 is a side view schematically showing a conventional semiconductor laser device and a supporting mechanism for the device. Also,
FIG. 8 is a bottom view showing the semiconductor laser device of FIG.
This semiconductor laser device 101 includes a semiconductor laser chip 1
02 and the monitor photodiode 103 to the stem 10
4 and the cap 105 is put on it, and the connector 106 is fixed to the lower surface of the stem 104. Then, the semiconductor laser device 101 is incorporated in the laser folder 111, the laser folder 111 is inserted between the housings 112, and the flange 111a of the laser folder 111 is pressed against the end surface of each housing 112 by the pressing spring 113, whereby the semiconductor It supports the laser device 101. In this state, set the laser folder 111 to X
Direction and the Y direction, the X-direction position and the Y-direction position of the optical axis of the laser light emitted from the semiconductor laser chip 102 can be adjusted on the surface orthogonal to the optical axis. Further, the semiconductor laser device 101 can be rotated, and the rotation angle of the optical axis of the semiconductor laser chip 102 can be adjusted with the optical axis of the laser light as the center of rotation.

For example, in an optical pickup device equipped with the semiconductor laser device 101, such adjustment of the optical axis of the laser light of the semiconductor laser chip 102 is indispensable and passes through the collimator lens 121 as shown in FIG. The X-direction position and the Y-direction position of the optical axis of the laser light are adjusted to adjust the beam spot of the laser light, and the rotation angle of the optical axis of the laser light is adjusted to adjust the grating.

FIG. 10 shows an adjusting jig for adjusting the optical axis of the laser light of the semiconductor laser chip 102.
The adjusting jig 201 includes a folder chuck 202 that holds a laser folder 111 and a semiconductor laser device 101.
And a laser chuck 203 that holds the stem 104 of FIG. The folder chuck 202 moves the laser folder 111 in the X direction and the Y direction while sandwiching the laser folder 111. Also, the laser chuck 20
3 rotates the semiconductor laser device 101 while sandwiching the stem 104. Thereby, the optical axis of the laser light of the semiconductor laser chip 102 is adjusted.

[0005]

However, in the conventional support mechanism for a semiconductor device, the laser folder 11 is used.
1, the pressing spring 113, and a supporting member (not shown) for pressing and supporting the pressing spring 113 are required, the number of parts is large, the number of assembling steps is large, and the assembling work is complicated.

Further, the stem 104 is adjusted by the adjusting jig 201.
By moving or rotating the semiconductor laser chip 102.
Even if the optical axis of the laser light is adjusted, the folder chuck 20
2 or when the laser chuck 203 is opened, a slight stress from the folder chuck 202 or the laser chuck 203 acts on the stem 104, and the stem 104
The position of was shifted, and the optical axis of the laser beam was also shifted.

Further, in the optical pickup device, it cannot be said that the optical axis of the laser light is sufficiently adjusted only by adjusting the X-direction position, the Y-direction position and the rotation angle of the optical axis of the laser light. . For example, when the tilt angle of the optical axis of the laser beam with respect to the collimator lens 121 shown in FIG. 9 needs to be adjusted, the tilt angle of the stem 104 cannot be changed. Therefore, instead of moving the stem 104 in the X direction and the Y direction. The laser beam is moved to adjust the X-direction position and the Y-direction position of the optical axis of the laser light, and the incident angle of the laser light with respect to the collimator lens 121 is adjusted. However, in such an adjusting method, since the optical axis of the collimating lens 121 and the optical axis of the laser light are largely deviated from each other, it is not possible to use the portion of the laser light having the maximum light intensity, and the coupling efficiency of the optical pickup device. Has dropped.

Therefore, the present invention has been made in view of the above-mentioned problems of the prior art, has a small number of parts, and can freely adjust the optical axis of the laser beam. An object of the present invention is to provide a semiconductor laser device whose axis is hard to shift.

It is another object of the present invention to provide an optical pickup device equipped with the semiconductor laser device of the present invention, and an electronic device equipped with the pickup device.

[0010]

In order to solve the above-mentioned problems, a semiconductor laser device of the present invention comprises a mounting stem portion on which a semiconductor laser chip is mounted, a fixing stem portion fixed to a housing, and a mounting stem portion. And a plastically deformable adjusting stem portion that connects the stem portion and the fixing stem portion.

According to the present invention having such a configuration, the mounting stem portion and the fixing stem portion are connected via the adjusting stem portion. If the mounting stem is moved or the angle is changed after fixing the fixing stem to the housing, the adjusting stem plastically deforms according to the position and angle of the mounting stem, and this plasticity The deformed adjusting stem portion holds the position and angle of the mounting stem portion. Therefore, the number of parts is small, and the optical axis of the laser light can be adjusted freely, and the optical axis of the laser light is unlikely to shift after this adjustment.

Further, in the present invention, due to the plastic deformation of the adjusting stem portion, at least one of the X-direction position and the Y-direction position of the optical axis of the semiconductor laser chip on the plane orthogonal to the optical axis of the laser light is obtained. Adjusted. Alternatively, the rotation angle of the optical axis of the laser light of the semiconductor laser chip is adjusted by the plastic deformation of the adjusting stem portion. Further, the plastic deformation of the adjusting stem portion adjusts the position of the semiconductor laser chip in the optical axis direction of the laser light of the semiconductor laser chip. Further, due to the plastic deformation of the adjusting stem portion, at least one of the radial angle and the tangential angle of the optical axis of the semiconductor laser chip with respect to the surface orthogonal to the optical axis of the laser light is adjusted.

As described above, the optical axis of the laser beam of the semiconductor laser chip can be adjusted in any of the X direction position, the Y direction position, the rotation angle, the position in the optical axis direction, the radial angle, and the tangential angle. it can.

Further, in the present invention, the adjusting stem portion has an adhesive holding space for fixing the shape of the adjusting stem portion.

Here, after adjusting the position and angle of the mounting stem portion, the adhesive is filled into the holding space of the plastically deformed adjusting stem portion and cured. As a result, the shape of the adjustment stem portion is firmly fixed, and the position and angle of the mounting stem portion can be held more reliably.

Further, in the present invention, the fixing stem portion is fitted and positioned in the housing.

By thus fitting and positioning the fixing stem portion in the housing, it is possible to more reliably hold the position and angle of the mounting stem portion after adjusting the position and angle of the mounting stem portion. it can.

Next, the optical pickup device of the present invention comprises the semiconductor laser device of the present invention.

In such an optical pickup device,
Since the optical axis of the laser light of the semiconductor laser chip can be freely adjusted and held, the performance of the optical pickup device can be improved.

Further, the electronic equipment of the present invention comprises the optical pickup device of the present invention.

That is, the present invention includes not only the semiconductor laser device and the optical pickup device, but also electronic equipment equipped with the optical pickup device of the present invention.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is a side view schematically showing an embodiment of a semiconductor laser device of the present invention and a supporting mechanism of the semiconductor laser device. 2 is a bottom view showing the semiconductor laser device of FIG.

The semiconductor laser device 11 of the present embodiment comprises a semiconductor laser chip 12 and a monitor photodiode 1.
3 is mounted on the mounting stem portion 14a of the stem 14, a cap 15 is put on the mounting stem portion 14a, and the connector 16 is fixed to the lower surface of the mounting stem portion 14a.

The stem 14 is formed by fixing both ends of the mounting stem portion 14a to the respective fixing stem portions 14c via the respective adjusting stem portions 14b. The stem 14 is made of iron, for example, and the thickness of the mounting stem portion 14a is set to about 2 mm and the thickness of each fixing stem portion 14c is set to about 1.2 mm. Further, each adjustment stem portion 14b is
It consists of a pair of thin rods of about 0.6 mm, and is plastically deformed by a small stress.

It should be noted that each adjustment stem portion 14b may be provided with a rib, or each adjustment stem portion 14b may be formed in a mesh shape or the like to adjust the ease of plastic deformation. Also, stem 1
4 may be formed of another kind of metal, synthetic resin, or the like, and the mounting stem portion 14a, each adjustment stem portion 14b,
Also, the fixing stem portions 14c may be made of different materials. Further, each adjusting stem portion 14b
May be made of another type of material or another shape as long as it can be plastically deformed.

The semiconductor laser device 11 is fixed by screwing each fixing stem portion 14c to each housing 21. Therefore, the semiconductor laser device 11 can be fixed and supported by using only the stem 14 and the screws, the number of parts is small, the number of assembling steps is small, and the assembling work is simple.

FIG. 3 schematically shows an optical pickup device to which the semiconductor laser device 11 is applied. here,
A laser beam from the semiconductor laser chip 12 of the semiconductor laser device 11 is condensed via the collimator lens 22 to form a beam spot on the recording medium 23.

FIG. 4 shows an adjusting jig for adjusting the optical axis of the laser light of the semiconductor laser chip 12. The adjusting jig 31 includes a laser chuck 32 that holds the mounting stem portion 14a. The tips of the arms 32a of the laser chuck 32 are fitted into the recesses 14d of the mounting stem portion 14a as shown in FIG. 5, and securely hold the mounting stem portion 14a.

Here, with the mounting stem portion 14a being sandwiched by the laser chuck 32, the laser chuck 3
If the drive stem 2 is controlled, the mounting stem portion 14a can be moved, rotated, or tilted, and along with this, the light on the surface orthogonal to the optical axis of the laser light of the semiconductor laser chip 12 will be emitted. The X-direction position and the Y-direction position of the axis, the rotation angle of the optical axis, the position of the semiconductor laser chip 12 in the optical axis direction,
It is possible to adjust the angle (radial angle) of the optical axis with respect to the plane orthogonal to the optical axis and the angle (tangential angle) of the optical axis with respect to the plane orthogonal to the optical axis in the Y direction. That is, the optical axis of the laser light can be adjusted in detail.

Therefore, while observing the beam spot on the recording medium 23 and confirming the radial angle and the tangential angle of the optical axis of the laser beam of the semiconductor laser chip 12, the semiconductor laser chip 12 is checked.
Adjust the optical axis of the laser light. For example, when the tilt angle of the optical axis of the laser light with respect to the collimator lens 22 needs to be adjusted, the radial angle and the tangential angle of the optical axis of the laser light are changed. As a result, the optical axis of the collimator lens 22 and the optical axis of the laser light are not deviated from each other,
The tilt angle of the optical axis of the laser light can be adjusted, and the coupling efficiency of the optical pickup device can be kept to the maximum by utilizing the portion of the laser light having the maximum light intensity.

In this way, when the mounting stem portion 14a is moved, rotated, or tilted in order to adjust the optical axis of the laser light of the semiconductor laser chip 12, the mounting stem portion 14a and the respective fixing stem portions 14c. Since each adjusting stem portion 14b between them is plastically deformed, even if the laser chuck 32 is removed from the mounting stem portion 14a, the mounting stem portion 1
The position and angle of 4a do not change, and the position and angle of the optical axis of the laser light are maintained. Further, when the laser chuck 32 is detached, a slight stress from the laser chuck 32 is applied to the stem 1.
4 does not deviate from the position of the stem 14 and the optical axis of the laser light does not shift.

Further, after the adjustment of the optical axis of the laser beam of the semiconductor laser chip 12 is completed, each adjusting stem portion 14b is adjusted.
If an adhesive is applied and cured between each pair of rods, the shape of each adjusting stem portion 14b can be firmly maintained, and the optical axis of the laser beam can be more reliably maintained. You can

The present invention is not limited to the above embodiment, but can be variously modified. For example,
As shown in FIGS. 6A and 6B, a groove 21a may be formed in each housing 21A and each fixing stem portion 14c may be fitted into the groove 21a of each housing 21A. Further, the protrusions 2 are formed in the grooves 21a of each housing 21A.
1b and the respective concave portions 14e are formed in the respective fixing stem portions 14c, and the convex portions 2 of the respective grooves 21a are formed.
1b may be fitted into the concave portion 14e of each fixing stem portion 14c. As a result, the position and angle of the mounting stem portion 14b can be held more reliably.

Further, the present invention includes not only the semiconductor laser device and the optical pickup device, but also electronic equipment equipped with the optical pickup device of the present invention.

[0036]

As described above, according to the present invention, the mounting stem portion and the fixing stem portion are connected via the adjusting stem portion. If the mounting stem is moved or the angle is changed after fixing the fixing stem to the housing, the adjusting stem plastically deforms according to the position and angle of the mounting stem, and this plasticity The deformed adjusting stem portion holds the position and angle of the mounting stem portion. Therefore, the number of parts is small, and the optical axis of the laser light can be adjusted freely, and the optical axis of the laser light is unlikely to shift after this adjustment.

Further, according to the present invention, the optical axis of the laser light of the semiconductor laser chip is any of the X direction position, the Y direction position, the rotation angle, the position in the optical axis direction, the radial angle, and the tangential angle. Can also be adjusted.

Further, according to the present invention, after adjusting the position and angle of the mounting stem portion, the adhesive is filled in the holding space of the plastically deformed adjusting stem portion and cured, whereby the adjusting stem portion is cured. The shape of is firmly fixed, and the position and angle of the mounting stem are held more securely.

Further, according to the present invention, since the fixing stem portion is fitted and positioned in the housing, the position and the angle of the mounting stem portion are adjusted after the position and the angle of the mounting stem portion are adjusted. It can be held more reliably.

[Brief description of drawings]

FIG. 1 is a side view schematically showing an embodiment of a semiconductor laser device of the present invention and a supporting mechanism of the semiconductor laser device.

FIG. 2 is a bottom view showing the semiconductor laser device of FIG.

3 is a side view schematically showing an optical pickup device to which the semiconductor laser device of FIG. 1 is applied.

FIG. 4 is a side view schematically showing an adjustment jig for adjusting the optical axis of laser light of the semiconductor laser device of FIG.

5 is a cross-sectional view taken along the line AA of FIG.

6A is a side view showing a modified example of the semiconductor laser device and the support mechanism of FIG. 1, and FIG. 6B is a BB of FIG.
FIG.

FIG. 7 is a side view schematically showing a conventional semiconductor laser device and a supporting mechanism of the device.

8 is a bottom view showing the semiconductor laser device of FIG. 7. FIG.

9 is a side view schematically showing an optical pickup device to which the semiconductor laser device of FIG. 7 is applied.

10 is a side view schematically showing an adjusting jig for adjusting the optical axis of laser light of the semiconductor laser device of FIG.

[Explanation of symbols]

11 Semiconductor laser device 12 Semiconductor laser chip 13 Monitor photodiode 14 stems 14a Stem part for mounting 14b Stem part for adjustment 14c Stem part for fixing 15 caps 16 connectors 21 housing 22 Collimating lens 23 recording media 31 Adjustment jig 32 laser chuck

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Claims (9)

[Claims] 1. A mounting stem portion on which a semiconductor laser chip is mounted, a fixing stem portion fixed to a housing, and a plastically deformable adjusting stem portion connecting the mounting stem portion and the fixing stem portion. A semiconductor laser device comprising. 2. The plastic deformation of the adjusting stem portion adjusts at least one of the X-direction position and the Y-direction position of the optical axis of the semiconductor laser chip on a plane orthogonal to the optical axis of the laser light. The semiconductor laser device according to claim 1, which is characterized in that. 3. The semiconductor laser device according to claim 1, wherein the rotation angle of the optical axis of the laser light of the semiconductor laser chip is adjusted by plastic deformation of the adjusting stem portion. 4. The position of the semiconductor laser chip in the optical axis direction of the laser light of the semiconductor laser chip is adjusted by the plastic deformation of the adjusting stem portion.
The semiconductor laser device according to 1. 5. The plastic deformation of the adjusting stem portion adjusts at least one of a radial angle and a tangential angle of the optical axis of the semiconductor laser chip with respect to a plane orthogonal to the optical axis of the laser light. The semiconductor laser device according to claim 1. 6. The semiconductor laser device according to claim 1, wherein the adjusting stem portion has an adhesive holding space for fixing the shape of the adjusting stem portion. 7. The semiconductor laser device according to claim 1, wherein the fixing stem portion is fitted and positioned in the housing. 8. An optical pickup device comprising the semiconductor laser device according to claim 1. Description: 9. An electronic apparatus comprising the optical pickup device according to claim 8.