JP2003283031A - Multi-beam light source device, image output device, and optical recording / reproducing device - Google Patents

Abstract

(57) [Summary] [Problem] To be able to cope with multi-beams and increase the number of pins,
Provided is a multi-beam light source device using a so-called flat package type semiconductor laser that can be easily miniaturized. SOLUTION: A male screw part 23a of a lens cell 23 is screwed into a female screw part 25a of a holding member 25, and a substrate 22 holding the flat package type semiconductor laser 21 is fixed to the holding member 25 by screws 26, respectively. Is held by the holding member 25. Then, the laser light emitted from the flat package type semiconductor laser 21 is coupled by the coupling lens 24 disposed in front of the flat package type semiconductor laser 21 and mounted on the cylindrical lens cell 23.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a laser printer,
The present invention relates to a multi-beam light source device applied to an image output device such as a digital copying machine or an optical recording / reproducing device such as a laser facsimile device and an optical disk device.

[0002]

2. Description of the Related Art In recent years, in the field of laser writing for laser printers, digital copying machines, etc., in response to the demand for higher printing speed or higher printing density.
Many multi-beam writings that simultaneously scan with a plurality of beams have been developed. As means for multi-beaming,
A method of combining the outgoing beams from the single-beam semiconductor laser using a combining means such as a beam combining prism,
A method of using a semiconductor laser array having a plurality of light emitting points as a light source has been put into practical use.

Conventionally, as a semiconductor laser used as a light source unit of an optical writing unit in a laser printer, a digital copying machine, etc., a so-called can package type has been widely used.

20 and 21 are cross-sectional views for explaining an example of the structure of a conventional can package type semiconductor laser. In the example shown in FIG. 20, the can package type semiconductor laser 1 has a base member 3 by a leaf spring 2. The coupling lens 5 is fixed to the lens cell 4. The male screw portion of the lens cell 4 is screwed into the female screw portion of the holder 6.

The laser light emitted from the can package type semiconductor laser 1 is coupled by the coupling lens 5, and is adjusted and held as follows according to the characteristics of the optical system after the coupling lens 5. .

By adjusting the base member 3 to which the can package semiconductor laser 1 is fixed in the mounting surface (Y-axis direction and Z-axis direction), the emission direction of laser light is adjusted.

By pushing in or pulling out the lens cell 4 loaded with the coupling lens 5,
Adjust the optical axis (focus direction) (collimate adjustment).

In the example shown in FIG. 21, the can package type semiconductor laser 10 and the coupling lens 11 are held by a common holding member 12. Specifically, the can package type semiconductor laser 10 is press-fitted to hold the holding member 12.
And the coupling lens 11 is positionally adjusted in the three axial directions, and then fixed to the holding member 12 with an adhesive 13.

Usually, a semiconductor laser used as a light source is connected to a driving board (not shown) which is turned on / off based on image information or the like (may be used not only for driving but also for controlling). However, in a light source device using a conventional can package type semiconductor laser as a light source, the can package type semiconductor lasers 1 and 10 are directly fixed to the base member 3 and the holding member 12 as in the examples shown in FIGS. It had been.

[0010]

By the way, in recent years, in response to the demand for higher printing speed and higher printing density, simultaneous scanning with a plurality of beams is performed in the field of laser writing in a laser printer, a digital copying machine or the like. The development of efficient multi-beam writing is required, but as its light source: ・ High functionality such as multi-beam, easy integration, ・ Multi-pin (lead terminal), small size It has come to be required that such characteristics be easy to realize.

However, in the can package type semiconductor laser having the above-mentioned structure, it is not easy to achieve high functionality and high integration such as multi-beam, and it is difficult to increase the number of pins (lead terminals) and downsize. It was

An object of the present invention is to solve the above-mentioned problems of the prior art, to cope with multi-beams, and to easily increase the number of pins and downsize, using a so-called flat package type semiconductor laser, and a multi-beam light source device, An object is to provide an image output device and an optical recording / reproducing device using the multi-beam light source device as a light source.

[0013]

In order to achieve the above-mentioned object, the invention according to claim 1 couples at least a flat package type semiconductor laser and a laser beam emitted from this flat package type semiconductor laser. In a multi-beam light source device having a coupling lens for holding, the substrate holding the flat package type semiconductor laser is held by a holding member holding the coupling lens. Compared to a light source device that uses a can package type semiconductor laser as a light emitting unit, it is easy to achieve high functionality such as multi-beam, high integration, and miniaturization. Can be held securely by the method of It can be positioned between Kkeji type semiconductor laser with high precision.

According to a second aspect of the invention, in the multi-beam light source device according to the first aspect, the substrate is held by a holding member after the relative positional relationship between the substrate and the coupling lens is adjusted. With this configuration, since the emission direction of the emission beam is adjusted by adjusting the position of the substrate holding the flat package type semiconductor laser, it is possible to easily adjust the relative position of the flat package type semiconductor laser with respect to the coupling lens. .

According to a third aspect of the present invention, in the multi-beam light source device according to the first aspect, after adjusting the relative positional relationship between the coupling lens and the flat package type semiconductor laser, an adhesive is applied to the holding member. This configuration is characterized in that the coupling lens is fixed to the holding member by a bonding method after adjusting the emitting direction of the emitting beam and the collimating direction by adjusting the position of the coupling lens. The relative position of the flat package type semiconductor laser with respect to the lens can be adjusted easily and at low cost.

According to a fourth aspect of the present invention, in the multi-beam light source device according to the first aspect, a flat package type semiconductor laser is surface-mounted on a substrate and held, and by this configuration, the flat package type laser is held. By mounting the semiconductor laser on the surface, the semiconductor laser can be fixed to the substrate at low cost.

According to a fifth aspect of the present invention, in the multi-beam light source device according to the fourth aspect, the flat package type semiconductor laser is mounted on the substrate after adjusting the relative positional relationship with the coupling lens within the mounting surface. This feature makes it easy to adjust the optical axis and collimator individually even when adjusting and fixing multiple flat package type semiconductor lasers on a common substrate. ， Simplification is possible.

According to a sixth aspect of the present invention, in the multi-beam light source device according to the first aspect, the laser light emitting surface of the flat package type semiconductor laser is held by the substrate. Even when the focal length of the lens is short and the space between the flat package type semiconductor laser and the coupling lens is narrow, when mounting the flat package type semiconductor laser on the surface,
Since it is possible to hold the flat package type semiconductor laser from the rear of the light source device which can secure a sufficient space, the adjustment and assembly work becomes easy.

According to a seventh aspect of the present invention, in the multi-beam light source device according to the first aspect, the external connection terminal of the flat package type semiconductor laser is extended straight from the lateral side surface of the package of the flat package type semiconductor laser. With this configuration, even if thermal expansion of the external connection terminal occurs due to temperature change, the expansion direction of the external connection terminal is orthogonal to the collimating direction (the direction connecting the light emitting point and the coupling lens). Collimation rate
A change in (distance between the light emitting point and the coupling lens) can be suppressed.

According to an eighth aspect of the present invention, in the multi-beam light source device according to the seventh aspect, each width of the external connection terminals provided in the flat package type semiconductor laser is t.
And the mounting interval between the external connection terminals is p, the following expression (Equation 3) is satisfied.

[0021]

[Equation 3] t ≦ p / 2 With this configuration, even if parts variation and assembly variation occur and the relative relationship between the light emitting point and the optical axis of the coupling lens fluctuates from the design value (target value), external connection is possible. Since the width of the terminals is sufficiently smaller than the distance between the external connection terminals,
It is possible to prevent the external connection terminal from coming into contact with the terminal adjacent to the corresponding electrode.

According to a ninth aspect of the present invention, at least a plurality of flat package type semiconductor lasers and a plurality of coupling lenses for respectively coupling laser beams emitted from the flat package type semiconductor lasers are provided. In the multi-beam light source device, the plurality of flat package type semiconductor lasers are held on a common substrate. With this configuration, a plurality (M) of Nch-LD arrays (flat package type semiconductor lasers) are provided. To combine the output beams from
A light source device that emits N laser beams can be provided, and a plurality of flat package type semiconductor lasers can be driven by a common substrate, so that the number of components and cost can be reduced. You can

According to a tenth aspect of the present invention, in the multi-beam light source device according to the ninth aspect, a plurality of flat package type semiconductor lasers are arranged one-dimensionally on a common substrate, and the width in the arrangement direction is a. When the width in the direction orthogonal to the arrangement direction is b, the following formula (Equation 4) is satisfied.

[0024]

## EQU00004 ## a <b With this configuration, the lateral direction of the flat package type semiconductor lasers is made to coincide with the (one-dimensional) array direction of the plurality of flat package type semiconductor lasers. The arrangement interval of the semiconductor lasers can be narrowed, and the substrate can be downsized and highly integrated.
Further, it is possible to suppress the deviation of the optical characteristics of the plurality of laser beams on the surface to be scanned.

According to an eleventh aspect of the present invention, in the multi-beam light source device according to the ninth aspect, the external connection terminals of the plurality of flat package type semiconductor lasers are straightened from the lateral side surface of the package of the flat package type semiconductor laser. The external connection terminals of a plurality of one-dimensionally arranged flat package type semiconductor lasers are projected in a direction orthogonal to the arrangement direction. The arrangement intervals of the flat package type semiconductor lasers can be narrowed without the connection terminals interfering with each other.

According to a twelfth aspect of the present invention, in the multi-beam light source device according to the ninth aspect, the plurality of flat package type semiconductor lasers have a structure without protruding external connection terminals. Depending on the configuration, since a plurality of flat package type semiconductor lasers arranged one-dimensionally do not have protruding external connection terminals, the external connection terminals of adjacent flat package type semiconductor lasers do not interfere with each other The arrangement interval of the semiconductor lasers can be narrowed.

According to a thirteenth aspect of the present invention, in the multi-beam light source device according to the ninth aspect, the plurality of flat package type semiconductor lasers are arranged such that the laser light emission directions are relative to the flat package type semiconductor laser mounting surface of the substrate. It is characterized in that it is held on the substrate so that the laser light emitted from the plurality of flat package type semiconductor lasers is inclined and held with respect to the mounting surface of the substrate. Since the emission direction of the emitted laser light is parallel to the optical axis of the corresponding coupling lens, deterioration of optical performance such as wavefront aberration in the coupling lens can be suppressed.

The invention described in claim 14 is at least
A multi-beam light source device comprising a plurality of flat package type semiconductor lasers and a plurality of coupling lenses for respectively coupling laser beams emitted from these flat package type semiconductor lasers, wherein the plurality of flat package type semiconductors are provided. The laser is held on different substrates, and with this configuration, a plurality of flat package type semiconductor lasers are provided.
Flat package type semiconductor lasers (and corresponding coupling lenses) are held on different substrates.
The degree of freedom of the mechanical layout is expanded.

The invention according to claim 15 is the method according to claims 1 to 1.
4. The multi-beam light source device according to any one of 4 above, characterized in that a driving circuit element for driving a flat package type semiconductor laser is provided on the substrate, and with this configuration, the driving circuit element is flat packaged. Since it is mounted on the same substrate as the type semiconductor laser, it is possible to reduce the influence of external noise, reduce the number of components, and improve reliability.

The invention according to claim 16 is defined by claims 1 to 1.
5. The multi-beam light source device according to any one of 5 above, characterized in that the substrate is formed of a material having a longitudinal elastic modulus of 1 GPa or more. With this configuration, the flat package type semiconductor laser has a longitudinal elastic modulus of 1 GPa or more. Since it is held on the substrate which is excellent in synthesis, the alignment accuracy between the flat package type semiconductor laser (light emitting point) and the coupling lens can be maintained.

The invention as set forth in claim 17 is based on claims 1 to 1.
4 is an image output device characterized by using the multi-beam light source device according to any one of claims 1 to 4 as a light source device of an optical scanning device in an image forming apparatus using an electrophotographic process. Since it is possible to simultaneously scan (× N) laser beams, the printing speed can be increased and the density can be increased, and the same printing speed / scanning density as that of the single beam light source device can be achieved. In order to reduce the number of revolutions of the polygon scanner, it is possible to reduce power consumption / heat generation and reduce the load on the environment.

An eighteenth aspect of the present invention is characterized in that the image output apparatus according to the fifteenth aspect is provided with a plurality of photosensitive means serving as a surface to be scanned. With this configuration, a tandem process using an electrophotographic process is performed. By using it as a light source device of an optical scanning device of a multi-color image output device of a general type, it is possible to achieve high density / high speed of monochromatic and multicolor output images.

The invention according to claim 19 is the invention according to claims 1 to 1.
4 is an optical recording / reproducing device characterized by using the multi-beam light source device according to any one of claims 1 to 4 as a light source device of an optical pickup for recording / reproducing a signal to / from an optical recording medium, This device makes it possible to increase the recording / reproducing speed on the optical storage medium and increase the capacity.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the drawings.

As described above, in the field of laser writing of laser printers, digital copying machines, etc., in response to the demand for higher printing speed or higher printing density, multi-beam writing in which a plurality of beams are simultaneously scanned. Has been developed, and as its light source, it has the following characteristics: -High functionality such as multi-beam, easy integration-High number of pins (lead terminals), easy miniaturization Has come to be required.

Then, as a result of studying and researching various semiconductor lasers, as a semiconductor laser having the above-mentioned characteristics, a so-called flat package type semiconductor laser was focused. Further, by using the flat package type semiconductor laser as the light source unit of the multi-beam light source device, it becomes possible to achieve further multi-beam.

Here, the semiconductor laser is not limited to a single-beam semiconductor laser, but a plurality of (N) -channel semiconductor laser arrays (Nch-LD arrays) in which light-emitting points are arranged in an array in a light-emitting portion (laser chip), It also includes a semiconductor laser array in which light emitting points are two-dimensionally arranged.

When the flat package type semiconductor laser is used, the flat package type semiconductor laser can be fixed to the substrate by a method such as soldering. By fixing and holding the substrate holding the flat package type semiconductor laser on the holding member common to the coupling lens, the relative position of the flat package type semiconductor laser and the coupling lens can be reliably maintained. It was

FIG. 1 is a partial cross-sectional view showing a light source unit for a multi-beam light source device for explaining a first embodiment of the present invention, in which a flat package type semiconductor laser 21 is fixed to a substrate 22, Laser light (not shown) emitted from the flat package type semiconductor laser 21 is arranged in front of the flat package type semiconductor laser 21 and is coupled by a coupling lens 24 attached to a cylindrical lens cell 23. It The flat package type semiconductor laser 21 is shifted in the Y and Z directions in the figure, and the optical axis of the beam emitted from the coupling lens 24 is adjusted. Then, the male screw portion 23a of the lens cell 23 is screwed into the female screw portion 25a of the holding member 25, and the substrate 22 holding the flat package type semiconductor laser 21 is fixed to the holding member 25 by screws 26, respectively. Are held by the holding member 25.

Further, by shifting the coupling lens 24 in the X direction, the beam emitted from the coupling lens 24 can be converted into a parallel light beam, a divergent light beam, or a convergent light beam.

In FIG. 1, a drive board 28 having a drive circuit element (IC) 27 for driving the flat package type semiconductor laser 21 mounted thereon is separate from the substrate 22 holding the flat package type semiconductor laser 21. And are electrically connected by a harness 29.

Further, as shown in FIG. 2, the driving I is mounted on the substrate 30 holding the flat package type semiconductor laser 21.
By mounting C27, the board 30 may have a function as a drive board. As described above, by mounting the driving IC 27 on the same substrate 30 as the flat package type semiconductor laser 21, it is possible to reduce the influence of external noise, as compared with the case where both are mounted on different substrates. The electric characteristics of the flat package type semiconductor laser 21 can be maintained well, and the number of parts can be reduced and the reliability can be improved.

In the following description of the implementation,
It is assumed that the substrate 30 has a driving board structure that holds the flat package type semiconductor laser 21 and the driving IC 27.

The substrates 22 and 30 have a longitudinal elastic modulus of 1 GPa.
By using the above materials, the rigidity of the substrate itself can be secured, and the flat package type semiconductor laser 21 and the coupling lens 2 are affected by external force or vibration.
It is possible to suppress the deterioration of the alignment accuracy with respect to No. 4.

FIG. 3 is a partial cross-sectional view showing a light source unit for a multi-beam light source device for explaining a second embodiment of the present invention. In the second embodiment, a flat package type semiconductor laser 21 is held. Substrate 30 that is a drive board
Are fixed to the holding member 31 in advance. Therefore, the alignment (adjustment of the relative positional relationship) between the flat package type semiconductor laser 21 and the coupling lens 24 is performed so that the outgoing beam has a desired collimating property and an outgoing direction (optical axis direction).
Is adjusted in the three axes (x, y, z) directions, and after this adjustment, the coupling lens 24 is fixed to the holding member 31. In this example, the coupling lens 24 is fixed by an ultraviolet curable adhesive 32.

As in the second embodiment, the light source (ie, the flat package type semiconductor laser 21) is fixed in advance, and the position of the coupling lens 24 alone is adjusted to adjust the assembling of the light source device. It is possible to improve work efficiency.

4 to 6 are perspective views for explaining a light source unit for a multi-beam light source device according to a third embodiment of the present invention. FIG. 4 is an exploded perspective view showing the whole and FIG. 5 is a substrate. FIG. 6 is a perspective view for explaining from the back side, and FIG. 6 is a perspective view for explaining from the front side of the substrate. In the third embodiment, the surface mounting of the flat package type semiconductor laser 11 is possible. And facilitates fixing (soldering) work to the substrate 30.

The substrate 30 is held in advance on the holding member 32 by the screw 26, and the coupling lens 2
So that the outgoing direction of the outgoing beam of 4 is the desired direction,
As shown in FIG. 5, the flat package type semiconductor laser 21 is position-adjusted (Y-axis direction and Z-axis direction) on the mounting surface of the substrate 30 (the mounting surface 30a is the surface opposite to the emission direction), and then the substrate 30. Fixed to. In this case, the position of the coupling lens 24 (that is, the lens cell 23) is adjusted only in the X direction and then fixed to the holding member 32.

When a plurality of flat package type semiconductor lasers 21 are provided on the substrate 30 and each of them is adjusted and held in the Y-axis and Z-axis directions, it is difficult to adopt the adjusting / holding method described above. Therefore, it is advisable to adopt the method described below.

In the case of the flat package type semiconductor laser 21 of this embodiment, as shown in FIG.
The lead terminal (external connection terminal) 33 projects to the a side and is surface-mounted on the mounting surface 30 a of the substrate 30. The laser light 34 passes through a through hole 30b formed in the substrate 30 and is coupled by the coupling lens 24.

When the focal length of the coupling lens 24 is short and the space between the flat package type semiconductor laser 21 and the coupling lens 24 is narrow, a sufficient space is provided during surface mounting as in this embodiment. Adjustment and assembling work are facilitated by adopting a configuration in which the flat package type semiconductor laser 21 can be held from the rear of the light source device that can be secured.

FIG. 7 is a sectional view showing a light source section for a multi-beam light source device for explaining a fourth embodiment of the present invention. In the fourth embodiment, the laser light 34 in the flat package type semiconductor laser 21 is used. From the side surface 21b of the package which is orthogonal to the emitting direction, the lead terminals 3 are straightened in the lateral direction
3 extends, and the lead terminal 33 is the mounting surface 30a of the substrate 30.
It is provided in. The substrate 30 is provided with a through hole 35 or a recess for burying about half of the package of the flat package type semiconductor laser 21.

In the configuration of the fourth embodiment, even when the lead terminal 33 is thermally expanded due to the temperature rise, the position of the light emitting point 34a of the flat package type semiconductor laser 21 in the X direction (relative to the coupling lens not shown in FIG. 7). It is possible to suppress the fluctuation of the position) and suppress the fluctuation of the collimation rate (that is, the distance along the optical axis between the light emitting point 34a and the coupling lens).

FIG. 8 is a sectional view of a light source device showing a comparative example with this embodiment. In the comparative example, the lead terminal 36 extends in a Z shape from the side surface 21b orthogonal to the emitting surface of the flat package type semiconductor laser 21. Mounting surface 30a of the substrate 30
It is provided in.

In the case of this comparative example, the distance R from the mounting surface 30a to the side surface 21a of the flat package type semiconductor laser 21 becomes relatively large and the lead terminal 36 thermally expands due to heat generation of the laser chip or increase in ambient temperature. , Linear expansion coefficient: α = 1 × 10 −5 [1 /
ΔR when K], R = 5 [mm], and Δt = 50 [K]
= Α × R × Δt = 0.0025 [mm]. The vertical magnification of the optical system combined with this light source device is mY = 400.
If it is doubled, the image forming position shift (beam waist position shift) on the image plane is mY × ΔR = 400 × 0.0025 = 1.
It becomes 0 [mm], which may increase the beam spot diameter.

FIG. 9 is a plan view for explaining the structure of the flat package type semiconductor laser used in this embodiment. In the above-described embodiment, the holding members 25,
The mounting error of the substrates 26 and 30 with respect to the substrates 31 and 32, the placement error of the mounting portions (electrodes) of the lead terminals 33 on the substrates 26 and 30, the eccentricity of the optical axis of the coupling lens 24, or the coupling lens 2
The mounting position of the flat package type semiconductor laser 21 with respect to the coupling lens 24 is set to a design value (target value) due to variations in shape error in the mounting portion of No. 4 and the like.
There is a possibility that it will fluctuate significantly. Then, the relative position of the lead terminal 33 with respect to the electrode is displaced due to the variation. For this reason, when a relative displacement occurs in the arrangement direction of the lead terminals 33, the lead terminals 33 may contact not the corresponding electrodes but the adjacent terminals when the optical axis is adjusted.

Therefore, in the flat package type semiconductor laser 21 used in this embodiment, as shown in FIG.
, The width of the lead terminal 33 is t, and the lead terminal 3 is
When the arrangement interval of 3 is p, the condition of t ≦ p / 2 is satisfied. Therefore, if the relative displacement as described above is less than p / 2, the optical axis can be adjusted without contacting the adjacent electrodes.

FIG. 10 is a partial cross-sectional view for explaining a light source section for a multi-beam light source device according to a fifth embodiment of the present invention. In the fifth embodiment, a common (one in this example) substrate is used. Emitted beams 37a and 37b from a plurality M (M = 2 in this example) of flat package type semiconductor lasers 21a and 21b fixed to 30 are coupled by corresponding coupling lenses 24a and 24b, respectively. It is configured to be combined by the combining prism 38.

In the light source device of the fifth embodiment, by combining the output beams 37a and 37b from the plurality of flat package type semiconductor lasers 21a and 21b, it is possible to output N × M laser beams at the same time. Become. In addition, a plurality of flat package type semiconductor lasers 21
By using the substrate 30 as a common drive board for driving a and 21b, it is possible to reduce the number of substrates 30 and reduce the cost.

The flat package type semiconductor lasers 21a and 21b and the coupling lenses 24a and 24b are used.
The adjustment of the relative positional relationship with and may be performed by the method described in the above-described second and third embodiments.

FIG. 11 is a plan view for explaining the structure of a flat package type semiconductor laser when a plurality of flat package type semiconductor lasers are held on a substrate as in the fifth embodiment. When three flat package type semiconductor lasers 21a to 21c are arranged one-dimensionally on a common substrate (not shown), the flat package type semiconductor lasers 21a to 21c are arranged.
When the width in the arrangement direction of c is a and the width in the orthogonal direction is b, the condition of a <b is satisfied. Therefore, each flat package type semiconductor laser (light emitting point) 2
It becomes possible to narrow the interval L1 between 1a to 21c, and it is possible to reduce the size and increase the integration of the entire substrate.

On the other hand, in the comparative example with the configuration of the flat package type semiconductor laser shown in FIG. 11 shown in FIG. 12, a> b is satisfied, and in this comparative example, the intervals between the flat package type semiconductor lasers 21a to 21c. L2 becomes wider.

FIG. 13 is a plan view for explaining another example of the configuration of the flat package type semiconductor laser when a plurality of flat package type semiconductor lasers are held on the substrate. When the flat package type semiconductor lasers 21a to 21c are one-dimensionally arranged on a common substrate (not shown), the lead terminals 3 of the respective flat package type semiconductor lasers 21a to 21c.
3 are extended in the direction orthogonal to the arrangement direction.
Therefore, since the lead terminals of the flat package type semiconductor lasers adjacent to each other can be arranged on the substrate without interfering with each other, the distance L3 between the flat package type semiconductor lasers 21a to 21c can be narrowed. .

In the comparative example shown in FIG. 14, the lead terminals 33 of the flat package type semiconductor lasers 21a to 21c extend in the same direction as the arrangement direction. Therefore, in order to arrange the flat package semiconductor lasers so that they do not interfere with the lead terminals of the adjacent flat package semiconductor lasers, it is necessary to widen the distance L4 between the flat package semiconductor lasers.

FIG. 15 is a plan view for explaining another example of the configuration of the flat package type semiconductor laser when a plurality of flat package type semiconductor lasers are held on a substrate. The flat package type semiconductor laser shown in this example is shown in FIG. 40a to 40c have a configuration in which they have no externally projecting lead terminals but are provided with planar external connection terminals 41 as lead terminals, and because of such a configuration, flat package semiconductors adjacent to each other are provided. The lasers 40a to 40c can be arranged on the substrate without the external connection terminals 41 interfering with each other.

FIG. 16 is a plan view for explaining an example using the light source device of the above-described embodiment as a light source device of an optical scanning device in an image output device such as a laser printer or a digital copying machine according to the present invention. 17 is an enlarged cross-sectional view of the light source device portion in FIG. 16, a laser beam emitted from the light source device 42 (laser beams from one flat package type semiconductor lasers 21a and 21b are illustrated by one line) 43a, 43b is a polygon mirror 4
The four deflecting and reflecting surfaces 44a are configured to intersect with each other. Reference numeral 46 in the drawing is a scanning image forming optical system.

Therefore, it is possible to reduce the influence of the deviation (sag) of the reflection points of the two laser beams 43a and 43b on the deflecting reflection surface 44a, and when the image formation is by the electrophotographic method, the photosensitive member is covered. The deviation of the optical characteristics of the two laser beams 43a and 43b on the scanning surface 45 can be reduced.

In FIG. 17, after the relative positions of the two coupling lenses 24a and 24b with respect to the flat package type semiconductor lasers 21a and 21b are adjusted, the two coupling lenses 24a and 24b are bonded to the protrusions 47a protruding from the holding member 47. It is fixed by an appropriate fixing method. The flat package type semiconductor lasers 21a and 21b are fixed to the common substrate 30, but the lead terminals 36 of the flat package type semiconductor lasers 21a and 21b in the present embodiment have an asymmetrical shape, and the emitted laser beam. The emitting directions of 43a and 43b are held so as to be inclined with respect to the mounting surface 30a of the substrate 30. By adopting such a holding structure, the flat package type semiconductor lasers 21a and 21b
Since the laser beams 43a and 43b emitted from are parallel to the optical axes of the coupling lenses 24a and 24b, it is possible to suppress deterioration of optical performance such as wavefront aberration.

Further, in the configuration shown in FIGS. 16 and 17, since the intersecting angle of the laser beams 43a and 43b from the two flat package type semiconductor lasers 21a and 21b can be made small, both lasers on the scanned surface 45 can be reduced. It is possible to suppress the occurrence of deviation in the optical characteristics of the beams 43a and 43b.

FIG. 18 is a plan view for explaining an example in which the light source device of the above-described embodiment is used as a light source device for a pickup of an optical recording / reproducing apparatus such as an optical disk device according to the present invention. Similar to the fifth embodiment shown in FIG. 10, the form is an example in which a plurality of M (M = 2 in this example) flat package type semiconductor lasers 21a and 21b are combined by a beam combining prism 49 to emit beams 37a and 37b. However, the configuration is different from that of the fifth embodiment in that the flat package type semiconductor lasers 21a and 21b are independently held on different substrates 30a and 30b, respectively. By adopting this configuration, the degree of freedom in the mechanical layout of the flat package type semiconductor lasers 21a and 21b and the coupling lenses 24a and 24b is increased.

Further, each flat package type semiconductor laser 21a, 21b and coupling lens 24a, 24b.
The relative positional relationship with and can be adjusted individually by the method described above.

The configuration of the above-described embodiment of the light source device is used as a multi-beam light source device as a light source device in an optical scanning device mounted on an image forming apparatus using an electrophotographic process, thereby increasing the printing speed. / Higher density can be achieved.

Further, in order to achieve the same printing speed / scanning density as the single beam light source device with the light source device as shown in FIG. 16, it is possible to reduce the number of rotations of the polygon mirror 44, so that the power consumption is reduced. This leads to reduction of energy consumption (energy saving) and reduction of heat generation (prevention of global warming), and it is possible to reduce the load on the environment.

In an image output device such as a digital color copying machine or a color printer, each color (for example, black: K, cyan: C, magenta: M, yellow: Y)
In many cases, the tandem system in which the photosensitive means (for example, a photosensitive drum) corresponding to the above is arranged in series in the conveying direction of the image recording medium (for example, paper) is adopted.

Therefore, as shown in FIG. 19A, in the image output device 50, the photosensitive drums 5 corresponding to the respective colors are used.
Independent optical scanning devices (52K, 52C, 51K, 51M, 51Y) equipped with the above-described light source device
52M, 52Y) may be installed so as to face each other, or four light beams may be emitted from one optical scanning device 53 as shown in FIG. As shown in (c) and (d), the configuration may be such that two light scanning devices 54, 55 or 56, 57 respectively emit one to three light beams.

With such a structure, in the case of one photoconductor drum type image output device (4
It is possible to obtain an output image that is four times as large as that in (writing is required twice).

The optical scanning device corresponding to each color is
K, 52C, 52M, and 52Y, when the number of beams emitted from all the optical scanning devices 52K, 52C, 52M, and 52Y is one, the optical scanning device 52
An image output device to which K, 52C, 52M, and 52Y is applied can obtain a full-color (four-color) image. On the other hand, at least one of the four optical scanning devices (for example, the optical scanning device 52K corresponding to black) is provided in the above-mentioned configuration.
By using a beam light scanning device and performing light scanning only by this light scanning device 52K, 4
Double the density is possible. Alternatively, if the transport speed (and process speed) of the recording medium is changed to 4 times, the number of output images can be increased to 4 times.

Further, even in the case of a full-color image, a character image is often written in black and a high resolution is often required. Therefore, by adding it to the four-beam optical scanning device 52K (black), another Optical scanning device (5
By simultaneously writing 2C, 52M, 52Y; 1 beam), a higher-quality output image can be obtained even in an image in which characters / photographs / line drawings are mixed.

By using the optical recording / reproducing apparatus as a light source device of an optical pickup for recording and / or reproducing a signal on an optical recording medium such as an optical disk or a magneto-optical disk, the recording / reproducing apparatus can Since reproduction can be performed with a plurality of beams, recording / reproduction speed can be increased and capacity can be increased.

[0080]

As described above, according to the present invention,
By using the flat package type semiconductor laser, it is possible to achieve high functionality such as multi-beam, high integration, and miniaturization as compared with a light source device using a conventional can package type semiconductor laser as a light emitting unit. In addition, the flat package semiconductor laser can be securely held on the substrate by soldering, etc., and the positioning of the coupling lens and the flat package semiconductor laser can be performed with high accuracy. It is possible to provide a light source device that can be applied to various devices while being capable of coping with increasing number of pins, easily increasing the number of pins and downsizing.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing a light source unit for a multi-beam light source device for explaining a first embodiment of the present invention.

FIG. 2 is a perspective view showing a substrate having a function of a drive board in the present embodiment.

FIG. 3 is a partial cross-sectional view showing a light source unit for a multi-beam light source device for explaining a second embodiment of the present invention.

FIG. 4 is an exploded perspective view for explaining a light source unit for a multi-beam light source device according to a third embodiment of the present invention.

FIG. 5 is a perspective view for explaining the substrate according to the third embodiment as viewed from the back surface side.

FIG. 6 is a perspective view for explaining the substrate according to the third embodiment as viewed from the front side.

FIG. 7 is a sectional view for explaining a light source unit for a multi-beam light source device according to a fourth embodiment of the present invention.

FIG. 8 is a cross-sectional view showing a comparative example with the fourth embodiment.

FIG. 9 is a plan view for explaining the configuration of a flat package type semiconductor laser used in this embodiment.

FIG. 10 is a partial cross-sectional view showing a light source unit for a multi-beam light source device for explaining a fifth embodiment of the present invention.

FIG. 11 is a plan view for explaining the configuration of a flat package type semiconductor laser used in this embodiment.

12 is a plan view showing a comparative example with the flat package type semiconductor laser of FIG.

FIG. 13 is a plan view for explaining another example of the configuration of the flat package type semiconductor laser used in this embodiment.

14 is a plan view showing a comparative example with the flat package type semiconductor laser of FIG.

FIG. 15 is a plan view for explaining another example of the configuration of the flat package type semiconductor laser used in this embodiment.

FIG. 16 is a plan view for explaining an example in which the light source device of the above-described embodiment is used as a light source device of an optical scanning device in an image output device such as a laser printer or a digital copying machine according to the present invention.

FIG. 17 is an enlarged cross-sectional view of the light source device portion in FIG.

FIG. 18 is a plan view for explaining an example in which the light source device of the above-described embodiment is used as a light source device of a pickup of an optical recording / reproducing device such as an optical disc device according to the present invention.

FIG. 19 is an explanatory diagram of a configuration related to a photoconductor drum and an optical scanning device of the optical recording / reproducing device of the present embodiment.

FIG. 20 is a cross-sectional view for explaining a configuration example of a conventional can package type semiconductor laser.

FIG. 21 is a sectional view for explaining another configuration example of a conventional can package type semiconductor laser.

[Explanation of symbols]

21, 21a, 21b, 40a, 40b, 40c Flat package type semiconductor lasers 22, 30, 30a, 30b Substrate 23 Lens cells 24, 24a, 24b Coupling lenses 25, 31, 32, 47 Holding member 27 Driving IC 28 Driving Board 33, 36, 41 lead terminal 44 polygon mirror 46 scanning image forming optical system 50 image output device 51K, 51C, 51M, 51Y photosensitive drums 52K, 52C, 52M, 52Y, 53, 54, 55,
56,57 Optical scanning device

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G11B 7/14 H04N 1/036 Z 5D789 H04N 1/036 B41J 3/00 D 5F071 / 13 H04N 1/04 104A F term (reference) 2C362 AA07 AA15 AA43 AA45 AA48 BA84 DA08 2H045 BA23 BA32 DA02 5C051 AA02 CA07 DB04 DB05 DC02 DD02 EA01 5C072 AA03 DA02 DA04 DA10 HA02 HA06 HA12 HA06 HA08 HA12 HA06 HA08 HA12 HA06 HA08 HA09 HA13 HAB HABHA FA36 5F073 AB04 AB27 BA04 BA06 BA07 EA29 FA03 FA04 FA23

Claims (19)

[Claims] 1. A multi-beam light source device comprising at least a flat package type semiconductor laser and a coupling lens for coupling laser light emitted from the flat package type semiconductor laser, wherein the flat package type semiconductor laser is provided. A multi-beam light source device characterized in that a substrate holding the above is held by a holding member holding the coupling lens. 2. The multi-beam light source device according to claim 1, wherein the substrate is held by the holding member after the relative positional relationship between the substrate and the coupling lens is adjusted. 3. The multi-beam according to claim 1, wherein the coupling lens is held by the holding member with an adhesive after the relative positional relationship with the flat package type semiconductor laser is adjusted. Light source device. 4. The multi-beam light source device according to claim 1, wherein the flat package type semiconductor laser is surface-mounted and held on the substrate. 5. The multi-beam according to claim 4, wherein the flat package type semiconductor laser is held on the substrate after adjusting a relative positional relationship with the coupling lens within a mounting surface. Light source device. 6. The multi-beam light source device according to claim 1, wherein a laser beam emitting surface of the flat package type semiconductor laser is held on the substrate. 7. The multi-beam light source device according to claim 1, wherein the external connection terminal of the flat package type semiconductor laser is extended straight from the lateral side surface of the package of the flat package type semiconductor laser. 8. The following formula is satisfied when the width of each of the external connection terminals provided in the flat package type semiconductor laser is t and the mounting interval between the external connection terminals is p. 7. The multi-beam light source device according to 7. [Formula 1] t ≦ p / 2 9. A multi-beam light source device comprising at least a plurality of flat package type semiconductor lasers and a plurality of coupling lenses for respectively coupling laser beams emitted from these flat package type semiconductor lasers, A multi-beam light source device, wherein a plurality of flat package type semiconductor lasers are held on a common substrate. 10. The plurality of flat package type semiconductor lasers are arranged one-dimensionally on a common substrate, the width in the arrangement direction is a, and the width in the direction orthogonal to the arrangement direction is b.
The multi-beam light source device according to claim 9, wherein the following expression is satisfied. [Equation 2] a <b 11. The multi-beam light source according to claim 9, wherein each of the external connection terminals of the plurality of flat package type semiconductor lasers extends straight from the lateral side surface of the package of the flat package type semiconductor laser. apparatus. 12. The multi-beam light source device according to claim 9, wherein the plurality of flat package type semiconductor lasers have a structure having no protruding external connection terminal. 13. The plurality of flat package type semiconductor lasers are held on a substrate so that the emission direction of laser light is inclined with respect to the flat package type semiconductor laser mounting surface of the substrate. Item 9. The multi-beam light source device according to item 9. 14. A multi-beam light source device comprising at least a plurality of flat package type semiconductor lasers and a plurality of coupling lenses for respectively coupling laser beams emitted from these flat package type semiconductor lasers, A multi-beam light source device, wherein the plurality of flat package type semiconductor lasers are held on different substrates. 15. The multi-beam light source device according to claim 1, wherein a driving circuit element for driving the flat package type semiconductor laser is provided on the substrate. 16. The substrate according to claim 1, wherein the substrate is made of a material having a longitudinal elastic modulus of 1 GPa or more.
The multi-beam light source device according to claim 1. 17. An image output device, wherein the multi-beam light source device according to claim 1 is used as a light source device of an optical scanning device in an image forming apparatus using an electrophotographic process. 18. The image output device according to claim 15, further comprising a plurality of photosensitive means to be a surface to be scanned. 19. The multi-beam light source device according to claim 1 is used as a light source device of an optical pickup for recording / reproducing a signal on / from an optical recording medium. Optical recording / playback device.