JP2003273406A - Light emitting element mounting board - Google Patents
Light emitting element mounting boardInfo
- Publication number
- JP2003273406A JP2003273406A JP2002077392A JP2002077392A JP2003273406A JP 2003273406 A JP2003273406 A JP 2003273406A JP 2002077392 A JP2002077392 A JP 2002077392A JP 2002077392 A JP2002077392 A JP 2002077392A JP 2003273406 A JP2003273406 A JP 2003273406A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- wiring pattern
- element mounting
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
Abstract
(57)【要約】
【課題】 従来と同等の明るさを確保しつつ、コストが
低い発光素子実装基板を得る。
【解決手段】 本発明の発光素子実装基板は、プリント
基板１と、プリント基板１上に形成される金属の配線パ
ターン２と、配線パターン２内に設置され、当該配線パ
ターン２から電力が供給されて発光する発光素子３と、
配線パターン２上に形成され、発光素子３を被覆する封
止樹脂４とを備える。
(57) [Summary] [Problem] To obtain a light-emitting element mounting substrate with low cost while securing the same brightness as the conventional one. SOLUTION: The light emitting element mounting board of the present invention is installed in a printed board 1, a metal wiring pattern 2 formed on the printed board 1, and the wiring pattern 2, and power is supplied from the wiring pattern 2. A light emitting element 3 that emits light
A sealing resin formed on the wiring pattern and covering the light emitting element;
Description
【０００１】[0001]
【発明が属する技術分野】本発明は光電スイッチの投光
部、発光機能付の押釦スイッチ及び表示灯などに適用さ
れ、発光素子を搭載した発光素子実装基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting element mounting substrate, which is applied to a light projecting portion of a photoelectric switch, a push button switch with a light emitting function, an indicator lamp, and the like and has a light emitting element mounted thereon.
【０００２】[0002]
【従来の技術】従来の発光素子実装基板を図４〜図７に
示す。図４ではＣＡＮタイプのステムａ１２に発光素子
ａ１３を実装したディスクリートタイプの発光部品のリ
ードａ１５を、プリント基板ａ１１のスルーホールａ１
６に差し込んで半田によって固定する。発光素子ａ１３
から上方に発せされた光の一部は発光素子ａ１３を保護
する封止樹脂ａ１４界面で反射して下方へ向かい、ステ
ムａ１２表面で反射して再び上方へ向かう。このように
ステムａ１２を光学的な反射面として利用することで、
上方への明るさが増す。2. Description of the Related Art A conventional light emitting element mounting substrate is shown in FIGS. In FIG. 4, the lead a15 of the discrete type light emitting component in which the light emitting element a13 is mounted on the CAN type stem a12 is connected to the through hole a1 of the printed board a11.
Insert into 6 and fix with solder. Light emitting element a13
A part of the light emitted upward from is reflected at the interface of the sealing resin a14 that protects the light emitting element a13 and travels downward, and is reflected at the surface of the stem a12 and travels upward again. By using the stem a12 as an optical reflection surface in this way,
Brightness increases upward.
【０００３】また、図５ではプリント基板ａ２１に発光
素子ａ２３を実装し、上方への明るさを増すため、封止
樹脂ａ２４を高く盛り上げてレンズ形状にする。ここ
で、封止樹脂ａ２４を形成する際はキャスティング型を
用いる。封止樹脂ａ２４は形成する際の硬化時に高温に
するため粘度が低下して流れ出す。そこで、キャスティ
ング型を用いることによって、封止樹脂ａ２４が流れ出
すことを防ぎ、封止樹脂ａ２４を高く盛り上げることが
できる。Further, in FIG. 5, the light emitting element a23 is mounted on the printed circuit board a21, and in order to increase the upward brightness, the sealing resin a24 is raised to a lens shape. Here, a casting type is used when forming the sealing resin a24. Since the sealing resin a24 is heated to a high temperature when it is formed, the sealing resin a24 has a reduced viscosity and flows out. Therefore, by using the casting type, it is possible to prevent the sealing resin a24 from flowing out and to raise the sealing resin a24 high.
【０００４】また、図６ではプリント基板ａ３１に発光
素子ａ３３を実装する場合、発光素子ａ３３から上方に
発せされた光の一部は発光素子ａ３３を保護する封止樹
脂ａ３４界面で反射して下方へ向かい、プリント基板ａ
３１を通過して下面へ漏れる光がある。そこで、白いレ
ジストａ３２でプリント基板ａ３１上面をコーティング
することで、下方へ向かった光はレジストａ３２表面で
反射して再び上方へ向かい、上方への明るさが増す。さ
らには、図７のように白色のプリント基板ａ４１を使用
することで、下方へ向かった光をより上方へ反射させる
ことで、上方への明るさがさらに増す（その他のレジス
トａ４２、発光素子ａ４３及び封止樹脂ａ４４の機能は
図６のレジストａ３２、発光素子ａ３３及び封止樹脂ａ
３４と同様なので説明を省略する）。Further, in FIG. 6, when the light emitting element a33 is mounted on the printed circuit board a31, a part of the light emitted upward from the light emitting element a33 is reflected at the interface of the sealing resin a34 which protects the light emitting element a33, and is downward. Heading to printed circuit board a
There is light that passes through 31 and leaks to the lower surface. Therefore, by coating the upper surface of the printed circuit board a31 with the white resist a32, the light traveling downward is reflected by the surface of the resist a32 and travels upward again to increase the brightness upward. Furthermore, by using a white printed circuit board a41 as shown in FIG. 7, the light directed downward is reflected more upward, thereby further increasing the brightness in the upward direction (other resist a42, light emitting element a43). The functions of the sealing resin a44 and the sealing resin a44 are the resist a32, the light emitting element a33, and the sealing resin a in FIG.
The description is omitted because it is the same as 34).
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、図４の
発光素子実装基板の場合、ＣＡＮタイプのステムａ１２
はコストが高く、プリント基板ａ１１上に固定するため
のリードａ１５の切断や半田付け等を行う必要があり、
製造のコストが高くなるという問題点がある。However, in the case of the light emitting element mounting substrate of FIG. 4, the CAN type stem a12 is used.
Is high in cost, and it is necessary to cut or solder the lead a15 for fixing it on the printed circuit board a11.
There is a problem that the manufacturing cost becomes high.
【０００６】また、図５の発光素子実装基板の場合、封
止樹脂ａ２４を高く盛り上げるためにキャスティング型
を用いる必要があるので、こちらも製造のコストが高く
なるという問題点がある。Further, in the case of the light emitting element mounting substrate of FIG. 5, it is necessary to use a casting type in order to raise the sealing resin a24 to a high level, which also raises a problem of high manufacturing cost.
【０００７】さらに、図６及び図７の発光素子実装基板
の場合、レジストａ３２，ａ４２及びプリント基板ａ４
１の光の反射率は所望よりも低いので、プリント基板ａ
３１，ａ４１を通過して下面へ漏れる光が多く、上方へ
の明るさが図４の発光素子実装基板と比べると十分でな
く、また、レジストａ３２，レジストａ４２及びプリン
ト基板ａ４１を用いることでコストが高くなるという問
題点がある。Further, in the case of the light emitting element mounting substrate of FIGS. 6 and 7, the resists a32 and a42 and the printed substrate a4 are used.
Since the reflectance of light of 1 is lower than desired, the printed circuit board a
A lot of light leaks to the lower surface after passing through 31 and a41, and the upward brightness is not sufficient as compared with the light emitting element mounting substrate of FIG. 4, and the cost is reduced by using the resist a32, the resist a42, and the printed board a41. There is a problem that is high.
【０００８】本発明は上記の問題点を解決するためにな
されたものであり、従来と同等の明るさを確保しつつ、
コストが低い発光素子実装基板を得ることを目的とす
る。The present invention has been made to solve the above-mentioned problems, and while maintaining the same brightness as the conventional one,
It is an object to obtain a light emitting device mounting substrate with low cost.
【０００９】[0009]
【課題を解決するための手段】請求項１に記載の課題解
決手段は、基板と、前記基板上に形成される金属の配線
パターンと、前記配線パターン内に設置され、当該配線
パターンから電力が供給されて発光する発光素子と、前
記配線パターン上に形成され、前記発光素子を被覆する
樹脂とを備える。According to a first aspect of the present invention, there is provided a substrate, a metal wiring pattern formed on the substrate, a metal wiring pattern formed on the substrate, and electric power is supplied from the wiring pattern. A light emitting element which is supplied and emits light, and a resin which is formed on the wiring pattern and covers the light emitting element are provided.
【００１０】請求項２に記載の課題解決手段において、
前記樹脂はレンズの形状を有する。In the problem solving means according to claim 2,
The resin has the shape of a lens.
【００１１】請求項３に記載の課題解決手段は、前記発
光素子を囲み、前記樹脂が充填される白い枠体をさらに
備える。According to a third aspect of the present invention, there is provided a means for solving the problem, further comprising a white frame surrounding the light emitting element and filled with the resin.
【００１２】請求項４に記載の課題解決手段は、前記発
光素子を囲み、前記樹脂が充填される円形の枠体をさら
に備える。According to a fourth aspect of the present invention, there is provided a means for solving the problem, further comprising a circular frame surrounding the light emitting element and filled with the resin.
【００１３】[0013]
【発明の実施の形態】本発明の実施の形態について説明
する。図１は本発明の実施の形態における発光素子実装
基板の上面図、図２はその側面図である。実施の形態の
発光素子実装基板は、プリント基板１、配線パターン
２、発光素子３、封止樹脂４、ワイヤ５及びダム（枠
体）６からなる。なお、図２の符号３の付線の先が示す
白抜きの領域は発光素子が存在する位置を示す。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described. FIG. 1 is a top view of a light emitting element mounting substrate according to an embodiment of the present invention, and FIG. 2 is a side view thereof. The light emitting element mounting substrate of the embodiment includes a printed board 1, a wiring pattern 2, a light emitting element 3, a sealing resin 4, a wire 5 and a dam (frame body) 6. In addition, the white area indicated by the tip of the line with reference numeral 3 in FIG. 2 indicates the position where the light emitting element exists.
【００１４】プリント基板１は実施の形態ではチップオ
ンボード（Chip on Board（ＣＯＢ））基板である。The printed board 1 is a chip on board (COB) board in the embodiment.
【００１５】配線パターン２は金属を含んで構成され、
プリント基板１上に円形に形成され、図示のように、一
部が矩形に切り取られた略円形の配線パターン２１と、
配線パターン２１と絶縁されるように配線パターン２１
の矩形に切とたれたところに形成された矩形の配線パタ
ーン２２とからなる。The wiring pattern 2 is made of metal.
A substantially circular wiring pattern 21 formed in a circular shape on the printed circuit board 1 and partially cut into a rectangular shape, as shown in the figure,
The wiring pattern 21 is insulated from the wiring pattern 21.
And a rectangular wiring pattern 22 formed in a rectangular shape.
【００１６】発光素子３は、例えばＬＥＤ（発光ダイオ
ード）の半導体チップ（ＬＥＤチップ）であり、円形の
配線パターン２の中心上に搭載され、アノード及びカソ
ードのうち、一方が配線パターン２１に実装されて電気
的に導通し、他方がワイヤ５を介して配線パターン２２
に電気的に導通する。ワイヤ５の材質は例えば金であ
る。以上のように、発光素子３は配線パターン２内に設
置する。The light emitting element 3 is, for example, a semiconductor chip (LED chip) of an LED (light emitting diode), is mounted on the center of the circular wiring pattern 2, and one of the anode and the cathode is mounted on the wiring pattern 21. To electrically connect with the wiring pattern 22 via the wire 5.
Electrically connected to. The material of the wire 5 is gold, for example. As described above, the light emitting element 3 is installed in the wiring pattern 2.
【００１７】また、例えば特開平７−３２６８４８号公
報に記載されているように、ワイヤボンディングを行う
ＣＯＢ基板では、配線パターン２の表面が平滑であるこ
とが要求されるため、下地メッキとして光沢メッキを行
うことで配線パターン２の表面の平滑化を行った後、金
メッキが施される。Further, as described in Japanese Patent Application Laid-Open No. 7-326848, for example, in a COB substrate for wire bonding, the surface of the wiring pattern 2 is required to be smooth. The surface of the wiring pattern 2 is smoothed by performing the above, and then gold plating is performed.
【００１８】ダム６は円形の配線パターン２の縁上に沿
って設けられ、発光素子３を中心として囲む円形であっ
て、配線パターン２上面を基準にして高さが発光素子３
よりも高い。The dam 6 is provided along the edge of the circular wiring pattern 2 and surrounds the light emitting element 3 as a center. The height of the dam 6 is based on the upper surface of the wiring pattern 2.
Higher than.
【００１９】封止樹脂４は配線パターン２上に形成さ
れ、発光素子３を被覆することで保護する。封止樹脂４
は透明な例えばエポキシ樹脂であり、高温にして粘度を
低下させることで、ダム６内に流し込んで充填して形成
され、ダム６から盛り上がって形成されている。The sealing resin 4 is formed on the wiring pattern 2 and covers the light emitting element 3 to protect it. Sealing resin 4
Is a transparent epoxy resin, for example, which is formed by pouring it into the dam 6 and filling it by lowering the viscosity at a high temperature and rising from the dam 6.
【００２０】次に動作について説明する。配線パターン
２１，２２から発光素子３へ電力が供給されることによ
って、発光素子３は光を発する。この光は発光素子３を
保護する封止樹脂４界面で反射して下方へ向かい、配線
パターン２表面で反射して再び上方へ向かう。このよう
に配線パターン２を光学的な反射面として利用すること
で、上方への明るさが増す。Next, the operation will be described. The light emitting element 3 emits light when power is supplied to the light emitting element 3 from the wiring patterns 21 and 22. This light is reflected by the interface of the sealing resin 4 that protects the light emitting element 3 and travels downward, and is reflected by the surface of the wiring pattern 2 and travels upward again. By using the wiring pattern 2 as an optical reflection surface in this way, the brightness in the upward direction is increased.
【００２１】以上のように、発光素子３に電力を供給す
る配線パターン２を光学的な反射面として利用すること
で、図４の発光素子実装基板と同等の明るさを確保しつ
つ、高価なＣＡＮタイプの発光素子ａ１３を用いないの
で発光素子実装基板を低いコストで構成できる。また、
図４の発光素子実装基板と比較して、リードａ１５の切
断や半田付け等を行う必要がなく、製造のコストが低く
なる。また、ＣＡＮタイプのステムａ１２を用いないの
で、配線パターン２や封止樹脂４の形状を所望の最適な
形状にすることができる。As described above, by using the wiring pattern 2 for supplying electric power to the light emitting element 3 as an optical reflection surface, the brightness equivalent to that of the light emitting element mounting substrate of FIG. Since the CAN type light emitting element a13 is not used, the light emitting element mounting substrate can be constructed at low cost. Also,
Compared with the light emitting element mounting substrate of FIG. 4, it is not necessary to cut the lead a15, solder, etc., and the manufacturing cost is reduced. In addition, since the CAN type stem a12 is not used, the wiring pattern 2 and the sealing resin 4 can be formed into desired shapes.
【００２２】また、配線パターン２上にダム６を形成す
ることで、封止樹脂４が流れ出さず、封止樹脂４を高く
盛り上げることができる。よって、従来の図５の発光素
子実装基板のようにキャスティング型を用いる必要がな
いので、製造のコストが低くなる。Further, by forming the dam 6 on the wiring pattern 2, the sealing resin 4 does not flow out, and the sealing resin 4 can be raised higher. Therefore, unlike the conventional light emitting element mounting substrate of FIG. 5, it is not necessary to use the casting type, which reduces the manufacturing cost.
【００２３】また、配線パターン２は金属なので、従来
の図６及び図７のレジストａ３２，ａ４２及びプリント
基板ａ４１と比較して光の反射率は非常に高い。例え
ば、配線パターン２に施されている金メッキの光の反射
率は９０％以上である。これによって、プリント基板１
を通過して下面へ漏れる光が極めて少なくなり、従来の
図６及び図７の発光素子実装基板と比較して上方への明
るさが増す。さらにダム６を白色にすれば、ダム６表面
で光が反射するので、上方への明るさがさらに増す。ま
た、レジストａ３２，ａ４２及びプリント基板ａ４１を
用いず、配線パターン２を利用するのでコストが低くな
る。Further, since the wiring pattern 2 is made of metal, the reflectance of light is very high as compared with the conventional resists a32, a42 and the printed board a41 shown in FIGS. 6 and 7. For example, the reflectance of light of the gold plating applied to the wiring pattern 2 is 90% or more. As a result, the printed circuit board 1
Light that passes through the substrate and leaks to the lower surface is extremely reduced, and the brightness in the upward direction is increased as compared with the conventional light emitting element mounting substrate of FIGS. 6 and 7. Further, if the dam 6 is made white, the light is reflected on the surface of the dam 6, so that the upward brightness is further increased. Further, since the wiring pattern 2 is used without using the resists a32, a42 and the printed board a41, the cost is reduced.
【００２４】また、封止樹脂４を高く盛り上げて凸レン
ズの形状にすることにより、発光素子３が全方位に光を
発するものであっても、配線パターン２上方へ光が発す
るように指向性を持たせることができる。封止樹脂４を
凸レンズの形状にするためには、封止樹脂４の粘度を適
切にすることで可能になる。また、ダム６を円形にする
ことにより、封止樹脂４のうちダム６から盛り上がった
部分を円形のレンズを形成できるので、優れた光の指向
性が得られる。Further, by raising the sealing resin 4 to a high degree to form a convex lens, even if the light emitting element 3 emits light in all directions, directivity is set so that light is emitted above the wiring pattern 2. You can have it. In order to make the sealing resin 4 into the shape of a convex lens, it is possible to make the viscosity of the sealing resin 4 appropriate. Further, by making the dam 6 circular, it is possible to form a circular lens in the portion of the sealing resin 4 that rises from the dam 6, so that excellent light directivity can be obtained.
【００２５】また、図３に示すように、ダム径を変えて
形成することによって、発光素子３が発する光の指向性
を自在に得ることができる。例えば発光素子３上方（９
０度）の光の強度がダム６の径がφ４．０ｍｍの場合に
約３．０μＷになるような条件の下で、ダム６の径の条
件のみをφ３．５ｍｍに変更した場合、光の強度は約
２．５μＷになった。Further, as shown in FIG. 3, by forming the dam diameter differently, it is possible to freely obtain the directivity of the light emitted from the light emitting element 3. For example, above the light emitting element 3 (9
Under the condition that the intensity of light (0 degree) is about 3.0 μW when the diameter of the dam 6 is φ4.0 mm, if only the condition of the diameter of the dam 6 is changed to φ3.5 mm, The strength was about 2.5 μW.
【００２６】（変形例）なお、本発明は図示するものに
限らない。例えば、封止樹脂４を容易にレンズ形状にす
るためにダム６を設けたが、ダム６を省略して封止樹脂
４の粘度や形状を巧みに制御して封止樹脂４をレンズ形
状にしてもよい。(Modification) The present invention is not limited to the illustrated one. For example, although the dam 6 is provided in order to easily form the sealing resin 4 into a lens shape, the dam 6 is omitted and the viscosity and shape of the sealing resin 4 are skillfully controlled to form the sealing resin 4 into a lens shape. May be.
【００２７】また、配線パターン２の形状は円形でなく
てもよい。発光素子が実施の形態のＬＥＤチップの発光
素子３の場合であれば、配線パターン２の形状は少なく
とも発光素子３を実装できる形状であり、さらには発光
素子３の放熱を考慮した形状であってもよい。The shape of the wiring pattern 2 need not be circular. When the light emitting element is the light emitting element 3 of the LED chip of the embodiment, the shape of the wiring pattern 2 is such that at least the light emitting element 3 can be mounted, and further the heat dissipation of the light emitting element 3 is taken into consideration. Good.
【００２８】[0028]
【発明の効果】請求項１に記載の発明によれば、配線パ
ターンを利用することで、従来と同等の明るさを確保し
つつ、コストが低い。According to the first aspect of the present invention, by using the wiring pattern, it is possible to secure the same brightness as that of the conventional one, but the cost is low.
【００２９】請求項２に記載の発明によれば、発光素子
からの光に指向性を持たせることができる。According to the second aspect of the invention, the light emitted from the light emitting element can have directivity.
【００３０】請求項３に記載の発明によれば、白い枠体
を備えることで、明るさを増すことができる。According to the third aspect of the invention, the brightness can be increased by providing the white frame.
【００３１】請求項４に記載の発明によれば、円形の枠
体を備えることで、樹脂に円形のレンズを形成できる。According to the invention described in claim 4, since the circular frame is provided, the circular lens can be formed on the resin.
【図１】 本発明の実施の形態の発光素子実装基板を示
す平面図である。FIG. 1 is a plan view showing a light emitting element mounting substrate according to an embodiment of the present invention.
【図２】 本発明の実施の形態の発光素子実装基板を示
す側面図である。FIG. 2 is a side view showing a light emitting element mounting substrate according to an embodiment of the present invention.
【図３】 本発明の実施の形態の光の指向性を示すグラ
フである。FIG. 3 is a graph showing the directivity of light according to the embodiment of the present invention.
【図４】 従来の発光素子実装基板を示す側面図であ
る。FIG. 4 is a side view showing a conventional light emitting element mounting substrate.
【図５】 従来の発光素子実装基板を示す側面図であ
る。FIG. 5 is a side view showing a conventional light emitting element mounting substrate.
【図６】 従来の発光素子実装基板を示す側面図であ
る。FIG. 6 is a side view showing a conventional light emitting element mounting substrate.
【図７】 従来の発光素子実装基板を示す側面図であ
る。FIG. 7 is a side view showing a conventional light emitting element mounting substrate.
１ プリント基板、２ 配線パターン、３ 発光素子、
４ 封止樹脂、５ ダム。1 printed circuit board, 2 wiring pattern, 3 light emitting element,
4 sealing resin, 5 dams.
フロントページの続き Ｆターム(参考） 5F041 AA04 AA33 DA02 DA07 DA12 DA20 DA36 DA43 DA57 FF11Continued front page F-term (reference) 5F041 AA04 AA33 DA02 DA07 DA12 DA20 DA36 DA43 DA57 FF11
Claims (4)
電力が供給されて発光する発光素子と、 前記配線パターン上に形成され、前記発光素子を被覆す
る樹脂と、を備えた発光素子実装基板。1. A substrate, a metal wiring pattern formed on the substrate, a light emitting element that is installed in the wiring pattern, emits light when power is supplied from the wiring pattern, and is formed on the wiring pattern. And a resin for covering the light emitting element, the light emitting element mounting substrate comprising:
１に記載の発光素子実装基板。2. The light emitting element mounting substrate according to claim 1, wherein the resin has a lens shape.
れる白い枠体をさらに備えた請求項１に記載の発光素子
実装基板。3. The light emitting device mounting board according to claim 1, further comprising a white frame surrounding the light emitting device and filled with the resin.
れる円形の枠体をさらに備えた請求項２に記載の発光素
子実装基板。4. The light emitting element mounting substrate according to claim 2, further comprising a circular frame surrounding the light emitting element and filled with the resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002077392A JP2003273406A (en) | 2002-03-20 | 2002-03-20 | Light emitting element mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002077392A JP2003273406A (en) | 2002-03-20 | 2002-03-20 | Light emitting element mounting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003273406A true JP2003273406A (en) | 2003-09-26 |
Family
ID=29205706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002077392A Pending JP2003273406A (en) | 2002-03-20 | 2002-03-20 | Light emitting element mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003273406A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100722093B1 (en) * | 2005-10-19 | 2007-05-25 | 삼성에스디아이 주식회사 | Membrane electrode assembly for fuel cell, manufacturing method thereof, and fuel cell system employing the same |
| JP2007311401A (en) * | 2006-05-16 | 2007-11-29 | Idec Corp | Led light emitting device and method of fabricating the same |
| JP2008118107A (en) * | 2006-11-03 | 2008-05-22 | Ctx Opto Electronics Corp | Light emitting diode package structure |
| JP2012256085A (en) * | 2006-11-22 | 2012-12-27 | Mitsubishi Chemicals Corp | Light-emitting device, and manufacturing method of light-emitting device |
| US9093357B2 (en) | 2010-01-22 | 2015-07-28 | Sharp Kabushiki Kaisha | Light emitting device |
| US9231023B2 (en) | 2009-11-13 | 2016-01-05 | Sharp Kabushiki Kaisha | Light-emitting device having a plurality of concentric light transmitting areas |
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| JPH0428269A (en) * | 1990-05-23 | 1992-01-30 | Fujikura Ltd | Mounting structure of led bare chip |
| JPH0529665A (en) * | 1991-07-25 | 1993-02-05 | Rohm Co Ltd | LED light source device |
| JP2001237462A (en) * | 2000-02-22 | 2001-08-31 | Sanyo Electric Co Ltd | LED light emitting device |
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2002
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0428269A (en) * | 1990-05-23 | 1992-01-30 | Fujikura Ltd | Mounting structure of led bare chip |
| JPH0529665A (en) * | 1991-07-25 | 1993-02-05 | Rohm Co Ltd | LED light source device |
| JP2001237462A (en) * | 2000-02-22 | 2001-08-31 | Sanyo Electric Co Ltd | LED light emitting device |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100722093B1 (en) * | 2005-10-19 | 2007-05-25 | 삼성에스디아이 주식회사 | Membrane electrode assembly for fuel cell, manufacturing method thereof, and fuel cell system employing the same |
| JP2007311401A (en) * | 2006-05-16 | 2007-11-29 | Idec Corp | Led light emitting device and method of fabricating the same |
| JP2008118107A (en) * | 2006-11-03 | 2008-05-22 | Ctx Opto Electronics Corp | Light emitting diode package structure |
| JP2012256085A (en) * | 2006-11-22 | 2012-12-27 | Mitsubishi Chemicals Corp | Light-emitting device, and manufacturing method of light-emitting device |
| US9231023B2 (en) | 2009-11-13 | 2016-01-05 | Sharp Kabushiki Kaisha | Light-emitting device having a plurality of concentric light transmitting areas |
| US9607970B2 (en) | 2009-11-13 | 2017-03-28 | Sharp Kabushiki Kaisha | Light-emitting device having a plurality of concentric light transmitting areas |
| US9093357B2 (en) | 2010-01-22 | 2015-07-28 | Sharp Kabushiki Kaisha | Light emitting device |
| US9312304B2 (en) | 2010-01-22 | 2016-04-12 | Sharp Kabushiki Kaisha | LED illuminating device comprising light emitting device including LED chips on single substrate |
| US9425236B2 (en) | 2010-01-22 | 2016-08-23 | Sharp Kabushiki Kaisha | Light emitting device |
| US9679942B2 (en) | 2010-01-22 | 2017-06-13 | Sharp Kabushiki Kaisha | Light emitting device |
| US9966367B2 (en) | 2010-01-22 | 2018-05-08 | Sharp Kabushiki Kaisha | Light emitting device |
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