JP2003273165A - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Abstract

(57) [Summary] An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of securing component positional accuracy after mounting. SOLUTION: In mounting the electronic component 15 on the substrate 3 by mounting the solder bump 15a of the electronic component 15 on the circuit electrode 3a of the substrate 3 via a reinforcing resin 27, the reinforcing resin is mounted on the substrate 3. After applying 27, the electronic component 15 is mounted on the substrate 3. Subsequent to the component mounting, a pressing member 16 for pressing the electronic component 15 against the substrate 3 by its own weight is placed on the electronic component 15. Thus, even if the application state of the reinforcing resin 27 is not uniform, the displacement due to the surface tension can be prevented by the pressing force, and the positional accuracy of the component after mounting can be secured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate by landing a connecting electrode of the electronic component on a circuit electrode of the substrate via a liquid bonding material. It is about.

[0002]

2. Description of the Related Art As a method of mounting an electronic component such as a semiconductor chip on a substrate, a method of joining a connecting electrode of the electronic component and a circuit electrode of the substrate by soldering or a conductive adhesive is widely used. In any of these mounting methods, a liquid bonding material such as cream solder, flux, or conductive resin is supplied to the bonding portion between the connection electrode of the electronic component and the circuit electrode of the substrate. The supply of these liquid bonding materials is performed in advance before mounting the electronic component on the substrate. For example, a method of applying the liquid bonding material to the circuit electrodes of the substrate in advance or the liquid bonding material for the connecting electrodes of the electronic components. Is used.

[0003]

However, with the miniaturization of electronic devices and the miniaturization of the component size of electronic components, the problem of component misalignment frequently occurs in the mounting of the electronic components. . That is, in the component mounting operation, since the connecting electrode of the electronic component lands via the liquid bonding material, the electronic component immediately after landing is in a floating state and is likely to slide laterally.

At this time, if the application of the liquid bonding material is uneven and the application amount is partially uneven, a lateral force acts on the electronic component due to the surface tension of the liquid bonding material. If this force is larger than the movement resistance of the electronic component due to its own weight, the electronic component slides laterally from the landing position during mounting, resulting in positional displacement. As described above, the weight of electronic parts has become smaller due to the miniaturization of electronic parts in recent years.Therefore, even if the mounting position accuracy is improved by a method such as position recognition at the time of mounting, the variation in the coating state of the liquid bonding material Due to the displacement of the electronic components, the positional accuracy of the components after mounting cannot be ensured, which causes a defect such as a defective joint in a subsequent process such as reflow.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of ensuring the positional accuracy of components after mounting.

[0006]

According to another aspect of the present invention, there is provided an electronic component mounting apparatus for mounting an electronic component on a substrate by landing a connecting electrode of the electronic component on a circuit electrode of the substrate via a liquid bonding material. An electronic component mounting apparatus, which is a component supply unit for supplying an electronic component, a component mounting means for picking up an electronic component from the component supply unit and transferring and mounting the electronic component on the substrate, and the electronic component mounted on the substrate. The pressing member mounting means mounts a pressing member for pressing the component against the substrate by its own weight, and the pressing member supply unit that supplies the pressing member to the pressing member mounting means.

An electronic component mounting apparatus according to a second aspect is the electronic component mounting apparatus according to the first aspect, further comprising liquid bonding material transfer means for supplying the liquid bonding material to the connection electrodes of the electronic component by transfer. Prepared

An electronic component mounting apparatus according to a third aspect of the invention is the electronic component mounting apparatus according to the first aspect, further comprising a liquid bonding material applying means for applying the liquid bonding material to the circuit electrodes of the substrate.

An electronic component mounting method according to a fourth aspect is an electronic component mounting method for mounting an electronic component on a substrate by landing a connecting electrode of the electronic component on a circuit electrode of the substrate via a liquid bonding material. Then, the electronic component is taken out from the component supply unit and transferred to the substrate and mounted, and subsequently, after the component mounting, the pressing member for pressing the electronic component against the substrate by its own weight is mounted on the electronic component mounted on the substrate. And a pressing member placing step of placing.

An electronic component mounting method according to a fifth aspect is the electronic component mounting method according to the fourth aspect, wherein the liquid bonding material is applied to the electronic component prior to mounting the electronic component on the substrate by the mounting head. It is supplied by transfer to the connection electrode of.

An electronic component mounting method according to a sixth aspect is the electronic component mounting method according to the fourth aspect, wherein the liquid bonding material is applied to the substrate prior to mounting the electronic component on the substrate by the mounting head. Apply to circuit electrodes.

According to the present invention, a pressing member for pressing the electronic component against the substrate by its own weight is placed on the electronic component mounted on the substrate, which results in uneven application of the liquid bonding material. It is possible to prevent the positional deviation of the components, and to ensure the positional accuracy of the components after mounting.

[0013]

1 is a block diagram of an electronic component mounting system according to a first embodiment of the present invention, and FIG. 2 is a plan view of an electronic component mounting apparatus according to a first embodiment of the present invention. 3 is a functional explanatory view of a pressing member supply unit of the electronic component mounting apparatus according to the first embodiment of the present invention, and FIGS. 4, 5, and 6 are process explanations of the electronic component mounting method according to the first embodiment of the present invention. It is a figure.

First, referring to FIG. 1, an electronic component mounting system for manufacturing a mounting substrate by mounting electronic components on a substrate by soldering will be described. In FIG. 1, the electronic component mounting system includes an electronic component mounting apparatus M1 and a reflow apparatus M2.
It is composed of The electronic component mounting apparatus M1 transports the substrate on which the circuit electrodes are formed on the transport path, and mounts the electronic component on the substrate by the mounting stage provided on the transport path. The reflow device M2 is provided with a transfer mechanism that is connected to the transfer path of the electronic component mounting device M1. The reflow device M2 is used for connecting electronic components by heating the substrate on which the electronic components are mounted while heating the substrate. The solder at the joint between the electrode and the circuit electrode on the substrate is melted and soldered.

Next, referring to FIG. 2, an electronic component mounting apparatus M
1 will be described. In FIG. 2, a transport path 2 is arranged in the X direction at the center of the base 1. The transport path 2 transports a substrate 3 delivered from an upstream device (not shown) in the device, and positions the substrate 3 on a mounting stage provided in the transport path 2. On both sides of the transport path 2,
The component supply unit 4 and the pressing member supply unit 6 are arranged from the upstream side (left side in FIG. 2).

Two Y-axis tables 8 are arranged at both ends of the base 1 in the X direction, and an X-axis table 9 is installed on the Y-axis table 8. A transfer head 10 is attached to the X-axis table 9, and the transfer head 10 is moved to the X-axis table 9 by driving the X-axis table 9 and the Y-axis table 8.
Move horizontally in the Y direction.

The component supply unit 4 has a plurality of tape feeders 5.
Are juxtaposed. The tape feeder 5 stores the electronic components held on the tape, and feeds the electronic components to the pickup position 5a by the transfer head 10 by pitch-feeding the tape. The electronic component 15 has solder bumps 15a as connecting electrodes formed on the lower surface thereof, and the transfer head 10 uses the suction nozzle 10a to feed the tape feeder 5 to the tape feeder 5.
The electronic component 15 is vacuum-sucked and picked up from the pickup position 5a, and transferred and mounted on the substrate 3. The X-axis table 9, the Y-axis table 8 and the transfer head 10 are component mounting means for taking out electronic components from the component supply unit 4 and transferring and mounting them on the substrate 3.

A plurality of bulk feeders 7 are arranged side by side in the pressing member supply section 6 arranged downstream of the component supply section 4. As shown in FIG. 3, the bulk feeder 7 stores the pressing members 16 in a bulk shape in a storage container 7b in a hopper shape, and sequentially feeds these pressing members 16 by a transfer unit 7c to pick up a pickup position by a transfer head. 7a
Supply to. As will be described later, the pressing member 16 is a weight member that is used by placing it on the electronic component 15 mounted on the substrate 3, and by placing the electronic component 15 on the electronic component 15 by its own weight. It has the function of pressing against.

The transfer head 10 picks up the pressing member 16 by vacuum suction from the pickup position 7a of the bulk feeder 7 by the suction nozzle 10a, and mounts the pressing member 16 on the electronic component 15 mounted on the substrate 3. . The X-axis table 9, the Y-axis table 8 and the transfer head 10 are
The pressing member 16 is taken out from the pressing member supply unit 6 and serves as a pressing member mounting means for mounting the pressing member 16 on the electronic component 15 mounted on the substrate 3.

A paste supply unit 11 and a component recognition camera 12 are arranged on the moving path of the transfer head 10 between the transport path 2 and the component supply unit 4. The paste supply unit 11 includes a rotary table-shaped paste storage container, and forms a paste coating film having a predetermined thickness on the bottom surface of the rotary table. As the paste which is a liquid bonding material used here, a paste in which an active component is contained in a thermosetting resin and which has a capability of removing a solder oxide film is used. By lowering the electronic component 15 held by the transfer head 10 with respect to this paste coating film, the paste 14 (see FIG. 4) is supplied to the solder bumps 15a of the electronic component 15 by transfer coating.

Therefore, the paste supply unit 11 has the solder bumps 15a, which are the connecting electrodes of the electronic component 15, prior to the mounting of the electronic component 15 on the substrate 3 by the transfer head 10.
It serves as a liquid bonding material transfer means for supplying the paste 14 which is a liquid bonding material by transfer. Solder bump 1
5a to the circuit electrode 3a of the substrate 3 with a paste 14
As a method of supplying the paste, a dispenser (not shown) that discharges the paste 14 may be used, and the paste 14 may be applied in advance on the circuit electrode 3a of the substrate 3 prior to mounting the electronic component 15. In this case, the dispenser serves as the liquid bonding material applying means.

The component recognition camera 12 takes an image of the electronic component 15 held by the suction nozzle 10a from below when the transfer head 10 picking up the electronic component 15 from the component supply unit 4 passes above. Then, the image pickup result is subjected to recognition processing to identify the electronic component 15 and detect the position thereof.

This electronic component mounting apparatus is configured as described above, and an electronic component mounting method using this electronic component mounting apparatus will be described below with reference to FIGS. 4, 5 and 6. The transfer head 10 moves from the component supply unit 4 to the suction nozzle 1
The electronic component 15 is picked up and taken out by 0a, and is positioned on the paste supply unit 11, as shown in FIG. The paste 14 is stored on the bottom surface of the paste storage container 11 a of the paste supply unit 11. By the relative rotation of the paste storage container 11a with respect to the squeegee 11b, a coating film of the paste 14 is formed on the bottom surface of the paste storage container 11a.

The suction nozzle 10a is connected to the paste storage container 11
By vertically moving with respect to a, as shown in FIG. 4B, the paste 14 which is a liquid bonding material is supplied by transfer coating to the lower surface of the solder bump 15a of the electronic component 15 (liquid bonding material supply). Process). In addition, when supplying the paste 14, a dispenser that discharges the paste 14 may be used, and the paste 14 may be supplied in advance onto the circuit electrodes 3 a of the substrate 3 before mounting the electronic component 15.

After that, the electronic component 15 after the paste application is transferred and mounted on the substrate 3 (component mounting step). That is, the transfer head 10 passes above the component recognition camera 12, recognizes the electronic component 15 there, and then moves onto the substrate 3. Then, as shown in FIG. 4C, the solder bump 15a
Is aligned with the circuit electrode 3a formed on the substrate 3, and then the suction nozzle 10a is moved up and down with respect to the substrate 3. As a result, the solder bumps 15a land on the circuit electrodes 3a.

Solder bump 1 in the liquid bonding material supplying step
The state of supply of the paste 14 to the 5a does not always mean that the paste 14 is evenly attached to the lower ends of the solder bumps 15a. Therefore, as shown in FIG. 6A, the amount of the paste 14 in the state where the solder bump 15a lands on the upper surface of the circuit electrode 3a may be biased to one side. When the paste 14 is unevenly distributed in this way, the solder bump 15
The surface tension acting on a is not uniform, and a horizontal force acts on the solder bump 15a. In the case of an electronic component such as a fine pitch component having a small size and a light weight, the displacement of the electronic component is likely to occur due to the horizontal force. Therefore, in the present embodiment, the displacement of the electronic component is prevented by the method described below.

As shown in FIG. 5A, above the electronic component 15 mounted on the substrate 3, a transfer head is provided in which the pressing member 16 is taken out from the pressing member supply section 6 by the suction nozzle 10a immediately after mounting. 10 moves. Then, as the suction nozzle 10a moves up and down, as shown in FIG. 5B, the pressing member 16 is mounted on the electronic component 15 (pressing member mounting step). The placing of the pressing member is performed as quickly as possible after the components are mounted (for example, within 60 seconds).

As a result, the electronic component 15 is pressed by the pressing member 16
It is pressed against the substrate 3 by its own weight W. As a result of this pressing, as shown in FIG.
A force f pressing against the surface of the circuit electrode 3a acts on a, and even when a horizontal force is exerted due to uneven distribution of the paste 14, the pressing force f causes the displacement of the solder bump 15a. To be prevented.

The substrate 3 on which the electronic component 15 is mounted and the pressing member 16 is mounted on the electronic component 15 in this manner is sent to the reflow device M2. Then, by heating this substrate 3, as shown in FIG.
The solder bumps 15a of the electronic component 15 and the circuit electrodes 3 of the substrate 3
The solder at the joint with a is melted and soldered (reflow process).

In this reflow process, the solder bumps 15a are melted and then cooled and solidified,
As shown in FIG. 6C, a solder joint portion 15a * soldered to the upper surface of the circuit electrode 3a is formed, and the periphery of the joint portion to the circuit electrode 3a is surrounded by a reinforcing resin in which the paste 14 is thermoset. The part 14 * is formed. In this reflow process, the electronic component 15 is pressed by the weight of the pressing member 16, so that the displacement of the solder bumps 15a is prevented and good soldering is realized.

After that, the substrate 3 discharged from the reflow device M2 and cooled to room temperature is sent to a pressing member collecting section (not shown), where the substrate 3 is tilted as shown in FIG. 5 (d). As a result, the pressing member 16 is dropped from the top of the electronic component 15 and collected. The pressing member 16 collected is
It is sent again to the pressing member supply unit 6 of the electronic component mounting apparatus M1 and is reused. As a result, even if the number of pressing members 16 is limited, they can be effectively used, which is economical. In the pressing member collecting section, instead of tilting the substrate 3, the pressing member 16 is blown by air blow.
It is also possible to use a method of removing the above from the electronic component 15.

(Second Embodiment) FIG. 7A is a partial plan view of an electronic component mounting apparatus according to a second embodiment of the present invention.
FIG. 8B is a front view of the resin coating portion of the electronic component mounting apparatus according to the second embodiment of the present invention, and FIG. 8 is a process explanatory diagram of the electronic component mounting method according to the second embodiment of the present invention. In the second embodiment,
On the upstream side of the electronic component mounting apparatus M1 shown in the first embodiment,
A resin coating section is additionally provided, and the reinforcing resin is coated on the substrate before mounting the electronic component.

In FIGS. 7A and 7B, a resin coating section 20 for coating the substrate 3 with a reinforcing resin is connected upstream of the electronic component mounting apparatus M1. A transport path 22 for transporting the substrate 3 is provided on the base 21 of the resin coating section 20, and the transport path 22 is connected to the transport path 2 of the electronic component mounting apparatus M1. A Y-axis table 24 and an X-axis table 25 are provided on the base 21.
A dispenser 26 is attached to the device 5. By driving the Y-axis table 24 and the X-axis table 25,
The dispenser 26 horizontally moves to apply the reinforcing resin stored therein onto the substrate 3.

Next, an electronic component mounting method according to an embodiment of the present invention will be described with reference to FIG. In FIG. 8A, the substrate 3 is the same as the substrate 3 shown in the first embodiment, and the circuit electrode 3a is formed on the upper surface. A reinforcing resin 27, which is a liquid bonding material, is applied to the substrate 3 by the dispenser 26 of the resin application unit 20 so as to cover the circuit electrodes 3a. In the second embodiment, the resin coating section 20 serves as a liquid bonding material coating means for coating the circuit electrode 3a of the substrate 3 with the liquid bonding material. In this resin application, the substrate 3
The distribution of the reinforcing resin 27 applied to the above is not necessarily uniform, and in the example shown here, the reinforcing resin 27 is applied to the arrow a side.

Thereafter, as shown in FIG. 8B, the substrate 3 coated with the reinforcing resin 27 is soldered by the same method as that of the first embodiment (see FIGS. 4A and 4B). The electronic component 15 in which the paste 14 is applied to the bump 15a is mounted, and the solder bump 15a is connected to the circuit electrode 3 as shown in FIG. 8C.
Land on a. At this time, as described above, since the coating amount of the reinforcing resin 27 on the substrate 3 is biased toward the arrow a side,
As shown in FIG. 8D, the electronic component 15 includes a reinforcing resin 2
The surface tension of 7 causes a horizontal force to act.

Even in such a case, the first embodiment
Similarly, since the pressing member 16 is quickly placed on the upper surface of the electronic component 15 after mounting, the electronic component 15 is pressed against the substrate 3 by the weight W of the pressing member 16. This pressing prevents the electronic component 15 from being displaced. In the second embodiment, the supply of paste 14 may be omitted.

As described above, according to the first and second embodiments, when a minute component having a small weight is mounted via the liquid bonding material, even if the application state of the liquid bonding material is uneven, the pressing is performed. It is possible to prevent lateral displacement due to the pressing force of the member, ensure the positional accuracy of components after mounting, and prevent problems in post-processes such as reflow.

In the above embodiment, the example in which the connecting electrode is the solder bump formed on the lower surface of the electronic component has been described, but the form of the connecting electrode is not limited to the solder bump, and the connecting electrode is a liquid. The present invention can be applied as long as it is mounted via a bonding material.

[0039]

According to the present invention, a pressing member for pressing the electronic component against the substrate by its own weight is placed on the electronic component mounted on the substrate, so that the application state of the liquid bonding material is non-uniform. It is possible to prevent the positional deviation due to, and to ensure the positional accuracy of components after mounting.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an electronic component mounting system according to a first embodiment of the present invention.

FIG. 2 is a plan view of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 3 is a functional explanatory diagram of a pressing member supply unit of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 4 is a process explanatory view of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 5 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 6 is a process explanatory diagram of the electronic component mounting method according to the first embodiment of the present invention.

FIG. 7A is a partial plan view of the electronic component mounting apparatus according to the second embodiment of the present invention. FIG. 7B is a front view of the resin coating section of the electronic component mounting apparatus according to the second embodiment of the present invention.

FIG. 8 is a process explanatory diagram of an electronic component mounting method according to a second embodiment of the present invention.

[Explanation of symbols]

M1 electronic component mounting device M2 reflow equipment 3 substrates 4 Parts supply department 6 Pressing member supply section 10 Transfer head 11 Paste supply section 14 paste 15 Electronic components 15a Solder bump 16 Pressing member 20 Resin coating part

Continued front page    (72) Inventor Ken Maeda             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5E313 AA03 AA11 CC03 EE24 EE38                       FF24 FF28 FG05                 5F044 KK02 LL01 PP17

Claims (6)

[Claims] 1. An electronic component mounting apparatus for mounting an electronic component on a substrate by landing a connecting electrode of the electronic component on a circuit electrode of the substrate via a liquid bonding material, and supplying the electronic component. Part, component mounting means for picking up an electronic component from the component supply part and transferring and mounting it on the substrate, and a pressing member for pressing the electronic component against the substrate by its own weight on the electronic component mounted on the substrate. An electronic component mounting apparatus comprising: a pressing member mounting means; and a pressing member supply section that supplies the pressing member to the pressing member mounting means. 2. The electronic component mounting apparatus according to claim 1, further comprising liquid bonding material transfer means for supplying the liquid bonding material to the connection electrode of the electronic component by transfer. 3. The electronic component mounting apparatus according to claim 1, further comprising a liquid bonding material applying unit that applies the liquid bonding material to the circuit electrodes of the substrate. 4. An electronic component mounting method for mounting an electronic component on a substrate by landing a connecting electrode of the electronic component on a circuit electrode of the substrate via a liquid bonding material, wherein the electronic component is mounted on the substrate. A component mounting process of transferring and mounting to a substrate, and a mounting member mounting process of mounting a pressing member for pressing the electronic component against the substrate by its own weight on the electronic component mounted on the substrate subsequent to the component mounting. An electronic component mounting method comprising: 5. The liquid bonding material is transferred and supplied to a connecting electrode of the electronic component before the mounting of the electronic component on the substrate by the mounting head.
Electronic component mounting method described. 6. The electronic component mounting method according to claim 4, wherein the liquid bonding material is applied to the circuit electrodes of the substrate prior to mounting the electronic component on the substrate by the mounting head.