JP2003272789A - Socket for surface mount package - Google Patents

Abstract

(57) [Problem] To provide a socket for a surface mount package that can reduce the space for disposing conductive members and can be manufactured at low cost. SOLUTION: A plurality of through-holes are formed at positions corresponding to the pin arrangement of a BGA package on a printed circuit board 2, and a conductive rubber 1 is fixed in each through-hole by bonding or the like, and a surface mounting type package socket 10 is provided. Create

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type package socket for fixing a surface mount type package.

[0002]

2. Description of the Related Art In recent years, the number of pins required for a package has increased due to the high integration of ICs (integrated circuits).
The speeding up of the operation tends to reduce the length from the die inside the IC to the substrate on which the IC is installed. Further, due to miniaturization of electronic devices, ICs used inside the electronic devices also tend to be miniaturized. For this reason, the surface mount type package has been widely used, and the BGA capable of reducing the area of the IC while securing a large number of pins.
(Ball Grid Array) packages are becoming mainstream. In addition, CSP (Ch
The use of ip Size Package) is also increasing. In these BGA packages and CSPs, a large number of ball-shaped solders (solder balls) are arranged on the lower surface of the package, and each package is soldered to a printed circuit board using the solder balls, and the IC is electrically connected to the printed circuit board. To be done.

On the other hand, at the stage of prototyping electronic equipment, IC
In many cases, the cost is higher than the manufacturing cost of the printed circuit board, so that a method of temporarily mounting the IC on the printed circuit board using a socket is generally used. With this technique,
For example, a stretchable metal pin with a spring inside is BG
The printed circuit board and the IC are electrically connected to each other by contacting the solder balls of the A package.

[0004]

However, the BGA
The pitch of the solder balls of the package tends to be shortened, and recently, the 1.0 mm pitch is mainly used, and the narrower pitch of 0.8 mm is becoming mainstream, and the space for arranging the metal pins is secured. It's getting harder to do. Further, in the above-mentioned metal pin, since it is necessary to arrange a spring inside and hold the contact part slidably, the mechanical structure becomes complicated, the manufacturing cost of the metal pin is high, and the cost of the socket itself is high. To increase.

An object of the present invention is to provide a surface mount type package socket which can reduce the space for disposing the conductive member and can be manufactured at low cost.

[0006]

[Means for Solving the Problems and Effects of the Invention] (1)
1st invention The socket for surface mounting type packages concerning the 1st invention,
A plurality of conductive members are provided at positions capable of contacting a plurality of terminals provided in the surface mount package, and at least a portion of the conductive member that comes into contact with the terminals is made of an elastic member.

In the surface mount type package socket according to the present invention, a plurality of conductive members are provided at positions capable of contacting a plurality of terminals provided on the surface mount type package, and at least the terminals of the conductive members are provided. Since the contacting portion is composed of the elastic member, the elasticity of the elastic member can be used to secure the electrical connection with the terminals of the surface mount type package without using a mechanically complicated structure. . In this way, the structure of the conductive member can be simplified and the size of the conductive member can be reduced by performing the electrical connection by utilizing the elasticity of the elastic member. The arrangement space for the members can be reduced, and the manufacturing cost can be reduced.

(2) Second Invention A surface mount type package socket according to the second invention is
In the structure of the surface mount package socket according to the first aspect of the invention, the conductive member is made of conductive rubber. In this case, since the conductive member is formed of conductive rubber, the conductive member can be configured using one member, the conductive member can be further downsized, and the manufacturing cost can be further reduced. be able to.

(3) Third Invention A surface mount type package socket according to the third invention is
In the structure of the surface mount type package socket according to the first or second aspect of the invention, the plurality of terminals provided in the surface mount type package have a substantially spherical shape, and the elastic member has a substantially hemispherical shape.

In this case, by bringing the substantially spherical portion of the terminal and the substantially hemispherical portion of the elastic member into contact with each other, the substantially hemispherical portion of the elastic member is deformed to become a substantially spherical portion of the terminal. It is possible to make sure contact, and stable electrical connection can be secured even when the shape accuracy of the substantially spherical portion of the terminal and the substantially hemispherical portion of the elastic member is not very high.

(4) Fourth Invention A surface mount type package socket according to a fourth invention is
In the configuration of the surface mount type package socket according to the first or second invention, the conductive member is the first conductive member embedded in the printed board, and the first conductive member is provided on the printed board. A second conductive member joined to the elastic member, and the second conductive member is formed of an elastic member.

In this case, the first conductive member embedded in the printed board and the first conductive member provided on the printed board
Since the conductive member is composed of the second conductive member made of an elastic member that is joined to the conductive member, the second conductive member is formed after the first conductive member is formed at the same time as the printed board. The conductive member can be formed on the printed circuit board simply by bonding to the first conductive member, and the surface mount type package socket can be produced by a simple manufacturing method.

(5) Fifth Invention A surface mount type package socket according to the fifth invention is
In the structure of the surface mount package socket according to the fourth aspect of the invention, the position of one end of the first conductive member is different from the position of the other end. In this case, since the position of one end of the first conductive member is different from the position of the other end, the contact arrangement of the surface mount type package socket is different from the pin arrangement of the IC mounted in the surface mount type package socket. can do.

(6) Sixth Invention A surface mount type package socket according to the sixth invention is
In the structure of the surface mount package socket according to any one of the first to fifth inventions, the conductive member is fixed in the printed circuit board, and the conductive region electrically connected to the conductive member is on the printed circuit board. Is formed.

In this case, since the conductive area electrically connected to the conductive member is formed on the printed board, the conductive area is used to define a predetermined portion of the IC to be mounted in the surface mount type package socket. It is possible to measure an electric signal from the pin and arrange an electric element such as a bypass capacitor, so that various additional functions can be easily realized.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Surface mounting package sockets according to respective embodiments of the present invention will be described below with reference to the drawings. 1A and 1B are a plan view and a side sectional view schematically showing the configuration of the surface mount type package socket according to the first embodiment of the present invention.

As shown in FIGS. 1A and 1B, the surface mount package socket 10 is composed of a plurality of conductive rubbers 1 and a printed circuit board 2. Printed circuit board 2
Has a plurality of through holes formed at positions corresponding to the pin arrangement of the BGA package, and conductive rubber 1 which is a conductive member and an elastic member is fixed in each through hole by adhesion or the like. Through holes 3 for fixing screws, which will be described later, are formed at four corners of the printed circuit board 2. Both ends of the conductive rubber 1 are formed in a hemispherical shape in order to ensure a stable contact state with the solder balls or the like of the BGA package.

As the printed circuit board 2, a commonly used printed circuit board can be used. Examples of the conductive rubber 1 include NR (natural rubber) type, BR (butadiene rubber) type, EPDM (ethylene propylene diene rubber) type, SBR (butadiene styrene rubber) type, and NB.
Made of R (butadiene acrylonitrile rubber) type, CR (chloroprene rubber) type, urethane type, silicone type, etc., Hs (Shore hardness) 40 to 90, special grade resistance value 10 ⁻⁴ to 10 ⁹ (Ω · cm ) Can be used.

FIG. 2 is a diagram showing a range of resistance values and hardness that can be used as the conductive rubber. The area A shown in FIG. 2 is
Hardness (Hs) is 70 or more and 90 or less and resistance value (log
・ Ω) ranges from 0 to 12 and hardness (Hs) is 40
Is 70 or more and the resistance value (log · Ω) is 6 or more and 12 or more
The range B is a range including the following ranges, and the region B has a hardness (Hs) of 60 or more and 70 or less and a resistance value (log · Ω).
Ranges from 2 to 6 and hardness (Hs) from 40 to 60
And the resistance value (log · Ω) is 4 or more and 6 or less, and the hardness (Hs) is 30 or more and 40 or less and the resistance value (l
is a range in which the hardness (Hs) is 60 or more and 90 or less and the resistance value (log · Ω) is -5 or more and 0 or less. And the hardness (Hs) is 60 or more and 70 or less and the resistance value (log
Ω) is a range including a range of 0 or more and 2 or less.

Of the above ranges, the range of resistance and hardness that can be used as the conductive rubber 1 is most preferably the range of region A, and the range of region B can also be used under predetermined conditions. Further, the range C can be used by changing the rubber material to a special grade. In addition,
The elastic member is not particularly limited to the above conductive rubber, and may be made of another material such as conductive plastic as long as it has substantially the same characteristics as the above conductive rubber.

FIG. 3 is a schematic cross-sectional view showing a state in which the BGA package is fixed to the circuit board by using the surface mount type package socket shown in FIG. As shown in FIG. 3, the surface mount type package socket 10 is arranged on the circuit board 5, and the surface mount type package socket 10 is provided.
BGA with the surface on which the solder balls SB are formed facing down
The package BP is arranged, and the IC fixing plate 4 is arranged on the BGA package BP. In this state, insert the bolt 6 into the through hole 3 or the like, and screw the nut 7 into the bolt 6,
BGA package B with IC fixing plate 4 and circuit board 5
The P and the surface mount type package socket 10 are sandwiched, the surface mount type package socket 10 is fixed to the circuit board 5, and the BGA package BP is fixed to the surface mount type package socket 10.

At this time, the contact portion of the conductive rubber 1 with the solder ball SB is deformed as shown in the figure, and the conductive rubber 1 and the solder ball SB are electrically connected. The circuit board 5 is also formed of a printed circuit board, and although not shown, a contact is formed on the surface of the circuit board 5 at a portion in contact with the conductive rubber 1, and the contact and the circuit board 5 are predetermined. Is electrically connected to the solder ball S of the BGA package BP.
B and a predetermined portion of the circuit board 5 are electrically connected. The shape of the conductive rubber 1 is not particularly limited to the above example,
Other shapes such as a cylinder may be used as long as they can be electrically connected to the solder balls SB and the like by utilizing the elasticity of the conductive rubber 1.
Further, a heat radiation fin or the like for the BGA package IC may be mounted on the IC fixing plate 4.

As described above, in the present embodiment, the elasticity of the conductive rubber 1 which is one component is used to electrically connect the solder balls SB of the BGA package BP without using a mechanically complicated structure. Conductive rubber 1
Can be downsized to reduce the space for arranging the conductive rubber 1, and the surface mount package socket 10 can be manufactured at low cost.

Next explained is a surface mount type package socket according to the second embodiment of the invention. Figure 4
(A) and (b) are a plan view and a side sectional view schematically showing a configuration of a surface mount package socket according to a second embodiment of the present invention.

The difference between the surface mount type package socket 10a shown in FIG. 4 and the surface mount type package socket 10 shown in FIG. 1 is that the conductive rubber 1 has a conductive rubber contact 1a,
1c and through hole vias 1b,
Since the other points are the same as those of the surface mount type package socket 10 shown in FIG. 1, the same portions are denoted by the same reference numerals and detailed description thereof will be omitted below.

The printed circuit board 2a shown in FIG.
A plurality of through holes are formed at positions corresponding to the pin arrangement of the package, through hole vias 1b made of a conductive metal such as copper foil are formed in each through hole, and disk-shaped conductive members are formed at both ends of the through hole vias 1b. Rubber contacts 1a, 1c
Are fixed by adhesion or the like. In this way, the second
Conductive rubber contacts 1a and 1c, which are conductive members, are electrically connected through through hole vias 1b, which are first conductive members, and conductive members are connected from the conductive rubber contacts 1a and 1c and through hole vias 1b. Composed of conductive rubber contacts 1a,
1c serves as an elastic member. The conductive rubber contacts 1a, 1c
The material of the conductive rubber is the same as that of the conductive rubber 1.
The shapes of a and 1c are not particularly limited to the above example, and other shapes such as a square plate may be used as long as they can be electrically connected to the solder balls SB and the like by utilizing the elasticity of the conductive rubber contacts 1a and 1c. Good.

With the above-described structure, in the present embodiment, it is possible to obtain substantially the same effect as that of the first embodiment, and at the same time when the through-hole via 1b is formed at the same time as the printed board 2a, the conductive rubber contact 1a is formed. , 1c can be formed on the printed board 2a simply by joining the through holes 1b to the through-hole vias 1b, and the surface mount type package socket 10a can be manufactured by a simple manufacturing method.

Next explained is a surface mount type package socket according to the third embodiment of the invention. Figure 5
(A) and (b) are a plan view and a side sectional view schematically showing a configuration of a surface mount type package socket according to a third embodiment of the present invention.

The difference between the surface mount type package socket 10b shown in FIG. 5 and the surface mount type package socket 10a shown in FIG. 4 is that the printed circuit board 2a is changed to three-layered printed circuit boards 2b to 2d. Via 1b
Is the same as that of the surface mount type package socket 10a shown in FIG. 4, and the same reference numerals are given to the same portions and the detailed description will be given below. Omit it.

A printed board 2c is laminated on the printed board 2d shown in FIG. 5, and a printed board 2b is laminated on the printed board 2c to form a laminated printed board. The printed circuit board 2b has a plurality of through holes formed at positions corresponding to the pin arrangement of the BGA package.
A blind via 1d made of a conductive metal such as copper foil is formed in each through hole, and a disc-shaped conductive rubber contact 1a is fixed to the upper part of the blind via 1d by adhesion or the like.

On the other hand, on the printed board 2d, a plurality of through holes are formed at positions corresponding to contact arrangements on a circuit board (not shown) different from the pin arrangement of the BGA package, and a conductive material such as copper foil is formed in each through hole. A blind via 1f made of a conductive metal is formed, and a disc-shaped conductive rubber contact 1c is fixed to the lower part of the blind via 1f by adhesion or the like.

Here, a blind via 1e made of a conductive metal such as a copper foil is formed on the printed board 2c, and the blind via 1d and the blind via 1f are electrically connected by the blind via 1e. in this way,
The conductive rubber contacts 1a and 1c which are the second conductive members are the first
Are electrically connected via blind vias 1d to 1f, which are conductive members, and the conductive rubber contacts 1a and 1c and the blind vias 1d to 1f constitute a conductive member. The conductive rubber contacts 1a and 1c are elastic members. Become.

With the above-described structure, in this embodiment, it is possible to obtain substantially the same effect as in the second embodiment, and the position of the blind via 1d is the blind via 1.
Since it is different from the position of f, the conductive rubber contact 1c is arranged at a position different from the conductive rubber contact 1a, and the contact arrangement of the surface mount package socket 10b can be made different from the pin arrangement of the BGA package.

Although a multilayer printed circuit board is used in the present embodiment, the present invention is not limited to this example. For example, a printed circuit board of one layer is used to form a wiring pattern similar to the blind via 1e on the printed circuit board. However, the conductive rubber contact 1c may be arranged at a position different from that of the conductive rubber contact 1a.

Next explained is a surface mount type package socket according to the fourth embodiment of the invention. Figure 6
[Fig. 8] is a plan view schematically showing a configuration of a surface mount type package socket according to a fourth embodiment of the present invention.

The surface mount type package socket 10c shown in FIG. 6 differs from the surface mount type package socket 10 shown in FIG. 1 in that the lands R1 to R, which are conductive regions, are different.
5 and wirings L1 to L5 are added, and other points are basically the same as the surface mount type package socket 10 shown in FIG. Description is omitted.

As shown in FIG. 6, on the surface of the printed board 2e, lands R1 to R5 made of a conductive metal such as copper foil are formed.
And wirings L1 to L5 are formed. Land R1-R
5, the surface is exposed, and the surfaces of the wirings L1 to L5 are covered with a predetermined insulating layer. Further, as in the first embodiment, a plurality of through holes are formed in the printed circuit board 2e at positions corresponding to the pin arrangement of the BGA package, and a conductive member and an elastic member, which are conductive members, are provided in each through hole. The rubber 1 is fixed by adhesion or the like. Note that FIG.
In order to facilitate the illustration, the number of conductive rubbers 1 is shown in FIG.
It is decreasing more. Further, reference numerals 11 to 14 are given to specific conductive rubbers among the plurality of conductive rubbers 1 so that they can be distinguished.

The land R1 is connected to the conductive rubber 1 via the wiring L1.
1, the land R2 is electrically connected to the land R3 via the wiring L4, and the land R3 is connected to the wiring L3.
Is electrically connected to the conductive rubber 13 through the land R4
Is electrically connected to the conductive rubber 12 via the wiring L2.

For example, the conductive rubbers 11 and 12 are connected to the GND pin of the BGA package, and the conductive rubber 13 is the BGA.
Land R when connected to the VCC pin of the package
1, R2 form a print pattern P1 for attaching a noise removing bypass capacitor, and lands R3, R4 form a print pattern P2 for attaching a noise removing bypass capacitor. Further, the land R5 is connected to the conductive rubber 1 through the wiring L5.
BG electrically connected to 4 and conductive rubber 14 connected
It serves as a measuring terminal for measuring an electric signal from the pin of the A package.

FIG. 7 is a schematic sectional view showing a state in which the BGA package is fixed to the circuit board using the surface mount type package socket shown in FIG. As shown in FIG. 7, the bolt 6 and the nut 7 are the same as in the first embodiment.
Thus, the IC fixing plate 4 and the circuit board 5 are sandwiched, and the BGA package BP is fixed to the surface mount type package socket 10c.

Here, the bypass capacitors PC are soldered on the printed patterns P1 and P2, and the bypass capacitors PC for the power supply lines of the BGA package IC are mounted on the printed board 2e. Further, the electric signal of the BGA package IC can be measured from the land R5. The number and position of lands are not particularly limited to the above example, and various changes can be made.

With the above-described structure, in this embodiment, the same effect as that of the first embodiment can be obtained, and the land R electrically connected to the conductive rubbers 11 to 14 can be obtained.
1 to R5 are formed on the printed circuit board 2e, the lands R1 to R5 are used to measure an electric signal from a predetermined pin of the BGA package IC mounted in the surface mount type socket 10c for a package, and a bypass capacitor. Etc. can be arranged, and various additional functions can be easily realized.

In the above description, the BGA package is fixed to the surface mount type package socket by fixing screws and bolts, but the fixing method is not particularly limited to this example, and the surface mount type package socket is not limited to this example. Other fixing methods may be used as long as the compressive force can be applied to the conductive rubber or the like.

In the above description, the BGA package is taken as an example, but the surface mount type package to which the present invention is applicable is not limited to this example, and a CSP (Chip Size) is used.
Package), SOP (Small Outline Package), TSO
P (Thin Small Outline Package), QFP (Quad Fla)
The present invention can be similarly applied to t Package).

[Brief description of drawings]

FIG. 1 is a plan view and a side sectional view schematically showing a configuration of a surface mount type package socket according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a range of resistance values and hardness that can be used as conductive rubber.

FIG. 3 is a schematic cross-sectional view showing a state in which a BGA package is fixed to a circuit board using the surface mount type package socket shown in FIG.

4A and 4B are a plan view and a side sectional view schematically showing a configuration of a surface mount type package socket according to a second embodiment of the present invention.

5A and 5B are a plan view and a side sectional view schematically showing a configuration of a surface mount type package socket according to a third embodiment of the present invention.

FIG. 6 is a plan view schematically showing a configuration of a surface mount type package socket according to a fourth embodiment of the present invention.

7 is a schematic cross-sectional view showing a state in which a BGA package is fixed to a circuit board by using the surface mount type package socket shown in FIG.

[Explanation of symbols]

1, 11-14 Conductive rubber 1a, 1c Conductive rubber contact 1b Through-hole via 1d-1f Blind via 2, 2a-2e Printed circuit board 4 IC fixing plate 5 Circuit board 6 Bolt 7 Nut 10, 10a-10c For surface mount type package Socket R1 to R5 land

Claims (6)

[Claims] 1. A plurality of conductive members are provided at positions capable of contacting a plurality of terminals provided in a surface mount type package, and at least a portion of the conductive member that comes into contact with the terminals is made of an elastic member. Characteristic surface mount type package socket. 2. The surface mount type package socket according to claim 1, wherein the conductive member is made of conductive rubber. 3. The surface mount package according to claim 1, wherein the plurality of terminals provided in the surface mount package have a substantially spherical shape, and the elastic member has a substantially hemispherical shape. For socket. 4. The conductive member includes a first conductive member embedded in a printed circuit board and a second conductive member provided on the printed circuit board and joined to the first conductive member. 3. The surface mount package socket according to claim 1, further comprising a member, wherein the second conductive member is formed of the elastic member. 5. The position of one end of the first conductive member is
5. The surface mount type package socket according to claim 4, wherein the position is different from the position of the other end. 6. The conductive member is fixed to a printed circuit board, and a conductive region electrically connected to the conductive member is formed on the printed circuit board. The surface mount package socket according to any one of the above.