JP2003263120A - Display panel - Google Patents

Abstract

(57) [Problem] To prevent deterioration of switching element characteristics and dielectric breakdown between wirings due to static electricity during and after a display panel manufacturing process. SOLUTION: A high resistance portion 9 provided at a wiring end of a signal wiring 2 and a scanning wiring 3 is connected to a short-circuit line 8.
Even if charges due to static electricity are applied before the substrate is divided, the charges are dispersed to other wirings via the high resistance portion 9 and the short-circuit line 8.
Also, even if charge due to static electricity is applied after the substrate is cut,
Since the high resistance portion 9 remains between the divided end and the display region, the voltage drops at the high resistance portion 9 from the divided end to the display region.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a television set, a personal computer, a word processor or an OA (Office Automation).
The present invention relates to a display panel such as a liquid crystal display panel used in devices and the like.

[0002]

2. Description of the Related Art The above-mentioned liquid crystal display panel has a structure in which a pair of substrates are arranged opposite to each other with a liquid crystal layer as a display medium interposed therebetween. An active matrix substrate, which is one of the substrates, is provided so that a plurality of signal wirings and a plurality of scanning wirings intersect each other with an insulating film interposed therebetween, and each signal wiring and each scanning wiring are provided in the vicinity of the intersection. A pixel electrode connected to both wirings via a TFT (thin film transistor) as a switching element is provided. A signal of a corresponding signal wiring is applied to each pixel electrode via a TFT switched by a signal of a corresponding scanning wiring, and a voltage is applied to a liquid crystal layer between the pixel electrode and a counter electrode facing the pixel electrode. .
As a result, the optical characteristics of the liquid crystal layer portion sandwiched between the two electrodes change, and this change in optical characteristics is visually recognized as a display pattern.

When a voltage of, for example, about 100 V or more generated by static electricity or the like is applied to the signal wiring or the scanning wiring with respect to this liquid crystal display panel, the TFT is broken or the characteristics are deteriorated, and the signal wiring and the scanning wiring are Since the insulating film between them is destroyed, line-shaped defects and display unevenness appear at the time of image display, which causes deterioration of display quality. This level of static electricity cannot be completely prevented because it is generated in the process of manufacturing the active matrix substrate, the process of rubbing the alignment film for aligning the liquid crystal layer, and the like.

Therefore, conventionally, an active matrix substrate having a short circuit line as shown in FIGS. 7 and 8 has been used.

FIG. 7 is a diagram showing an equivalent circuit of a conventional active matrix substrate. This active matrix substrate is provided with a plurality of signal wirings 2 and scanning wirings 3 crossing each other through an insulating film on a transparent substrate 1 made of a glass plate or the like, and each signal wiring 2 is provided in a display area. And a TF as a switching element near the intersection of each scanning line 3 with each other.
A T4 and a pixel electrode 5 connected to the TFT4 are provided. A signal input terminal 6 is provided at one end of the signal wiring 2 extending to the periphery of the matrix-shaped display area, and a signal input terminal 7 is provided at one end of the scanning wiring 3. . Further, the short-circuit line 8 is formed so as to surround the periphery of the display region, and the short-circuit line 8 is connected to both ends of the signal wiring 2 and both ends of the scanning wiring 3 until the middle of the manufacturing process.

FIG. 8 is a plan view showing another conventional active matrix substrate. In FIG. 8, parts having the same functions are assigned the same numbers as in FIG. 7 and their description is omitted.
Note that, in FIG. 8, the inside of the display area 20 is omitted for simplification, and some of the wirings and terminals arranged in parallel around the display area 20 are omitted. In this active matrix substrate, the short-circuit line 8 is connected to the end of the signal wiring 2 on which the signal input terminal 6 is not provided and the end of the scanning wiring 3 on the side where the signal input terminal 7 is not provided. ing.

These active matrix substrates are superposed on a counter substrate in which a counter electrode is provided on a transparent substrate, and liquid crystal is injected between the two substrates to complete a liquid crystal display panel. However, since the signal line 2 and the scanning line 3 cannot be driven while being short-circuited by the short-circuit line 8, the short-circuit is released by dividing the substrate 1 along the division line 10 until the completion of the liquid crystal display panel. .

In this way, the short-circuit line 8 is provided and each signal wiring 2 is provided.
By connecting each scanning line 3 with each scanning line 3, all the signal lines 2 and the scanning lines 3 are always kept at the same potential. Therefore, even if static electricity is applied during the manufacturing process of the liquid crystal display panel, TF
It is possible to prevent the characteristic deterioration of T and the occurrence of dielectric breakdown between wirings.

However, in the structure shown in FIGS. 7 and 8, since the signal wirings 2 and the scanning wirings 3 are electrically independent after the division of the active matrix substrate, they occur in the step after the division. It is impossible to prevent deterioration of TFT characteristics and dielectric breakdown between wirings due to static electricity. In addition, the characteristics of the TFT deteriorate even when a voltage of about 100 V is applied, but even after the liquid crystal display panel is completed, the driver is connected, the polarizer is attached, and the shield case is incorporated to manufacture the liquid crystal display device. Etc., and is always affected by static electricity until it is installed in the shield case, so it is actually very difficult to prevent this level of static electricity at all.

Further, in the structure shown in FIG. 7, a cross section of the signal wiring 2 and a cross section of the scanning wiring 3 are formed at all the ends of the substrate,
In the configuration shown in FIG. 8, since the cross section of the signal wiring 2 and the cross section of the scanning wiring 3 remain at the substrate end on the side where the signal input terminals 6 and 7 are not formed, a defect due to static electricity entering from this cross section is caused. This is a serious defect that frequently occurs and reduces the yield rate.

Further, in the structure shown in FIGS. 7 and 8, all the signal wirings 2 and the scanning wirings 3 are divided until the active matrix substrate is divided to release the short circuit from the short circuit line 8.
Since the and are short-circuited, each signal wiring 2 and each scanning wiring 3
It cannot be inspected for a short circuit between them and the presence or absence of disconnection of each wiring.

Therefore, conventionally, an active matrix substrate having an element and an internal short-circuit line as shown in FIG. 9 is known.

FIG. 9 is a diagram showing an equivalent circuit of a conventional active matrix substrate. In FIG. 9, parts having the same functions are assigned the same numbers as in FIG. 7 and their explanations are omitted. In this active matrix substrate, an internal short-circuit line 13 is separately provided inside the short-circuit line 8, and each signal line 2 and each scanning line 3 is connected to the internal short-circuit line 13 via an element 12. As the element 12, a high resistance element made of a semiconductor thin film or a non-linear element showing a non-linear resistance value with respect to an applied voltage is used.

According to this structure, even after the active matrix substrate is divided along the dividing line 10 to disconnect the signal wiring 2 and the scanning wiring 3 from the short-circuit line 8, the signal wiring 2 and the scanning wiring 3 are separated from each other. The connection with the internal short-circuit line 13 is left. Therefore, even if static electricity is applied in the process after the substrate is divided, the charge is dispersed to the surrounding signal wiring 2 and scanning wiring 3 through the element 12 and the internal short-circuit line 13,
It is possible to prevent characteristic deterioration of the TFT and dielectric breakdown between wirings. In this case, when inspecting for a short circuit between each signal wiring 2 and each scanning wiring 3 or disconnection of each wiring during the manufacturing process of the liquid crystal display panel, or when actually driving after completion of the liquid crystal display panel. The connection resistance value between each signal wiring 2 and each scanning wiring 3 and the internal short-circuit line 13 is set to a sufficiently high value so as not to cause a problem.

[0015]

In the conventional example shown in FIGS. 7 and 8, after the active matrix substrate is divided and the short circuit between the signal lines 2 and the scanning lines 3 and the short circuit line 8 is released, Since the signal wirings 2 and the scanning wirings 3 are electrically independent from each other, it is impossible to prevent characteristic deterioration of the switching element and dielectric breakdown between wirings when static electricity is applied after the substrate is cut. Further, since the cross section of the signal line 2 and the scanning line 3 remains at the end of the substrate, there are many defects due to static electricity entering from the cross section. Further, since all the signal wirings 2 and the scanning wirings 3 are short-circuited until the active matrix substrate is divided and the connection with the short-circuit line 8 is released, the signal wirings 2 and the scanning wirings 3 are short-circuited. Inability to inspect for short circuits and broken wires.

In the conventional example shown in FIG. 9, the static electricity is applied to the element 12 and the characteristics thereof are deteriorated to cause a leak between the signal wirings 2 and the scanning wirings 3, or the wirings to the wirings. The display quality may deteriorate due to variations in connection resistance with the internal short-circuit line 13. Further, the resistance value of the element 12 is set to a sufficiently high resistance value so as not to cause a problem during actual driving, and is usually set to a value higher by one digit or more than the resistance values of the signal wiring 2 and the scanning wiring 3. Therefore, when static electricity is applied from the dividing end (the portion C in FIG. 9) after dividing the substrate, most of the charges flow to the signal wiring 2 or the scanning wiring 3 due to the difference in the resistance value. Therefore,
Almost no electric charge is dispersed in the internal short-circuit line 13 through the element 12, and the T connected to the signal wiring 2 or the scanning wiring 3
The characteristics of the FT4 may be deteriorated or dielectric breakdown between wirings may occur.

The present invention has been made in order to solve the above problems of the prior art, and it is possible to prevent deterioration of characteristics of switching elements and dielectric breakdown between wirings due to static electricity even after the substrate is divided. The purpose is to provide a panel.

[0018]

The display panel of the present invention comprises:
A plurality of signal wirings and a plurality of scanning wirings are provided so as to intersect with each other and are insulated from each other on one of the pair of substrates arranged to face each other with the display medium interposed therebetween. In a display panel in which a pixel electrode connected to both wirings through a switching element is provided in the vicinity of the intersection, and a portion where the pixel electrode exists is a display region,
A high resistance portion is provided in the middle or end portion of at least one of the scanning wiring and the signal wiring outside the display area, and the high resistance portion is exposed from the end surface of the one substrate or from the end surface. The one of the substrates is divided so as to be arranged on the inner side, whereby the above object is achieved.

The high resistance portion may be composed of a semiconductor film, a metal film or a metal oxide film.

The high resistance portion may be made of a film having a surface resistance higher than that of a film forming a wiring portion other than the high resistance portion.

The display panel of the present invention is provided on one of a pair of substrates which are arranged to face each other with a display medium interposed therebetween, in which a plurality of signal wirings and a plurality of scanning wirings cross each other and are insulated from each other. In a display panel in which a pixel electrode connected to both wirings via a switching element is provided in the vicinity of an intersection of each signal wiring and each scanning wiring, and a portion where the pixel electrode exists is a display area, the scanning is performed. A discharge inducing electrode is provided in the vicinity of the end of at least one of the wiring and the signal wiring and outside the display area so as to be insulated from the corresponding wiring, thereby achieving the above object.

The discharge inducing electrode may be electrically connected to a counter electrode on the other substrate of the pair of substrates.

The discharge inducing electrode may be provided so as to overlap the corresponding wiring and be insulated.

The discharge inducing electrode may be provided so as to be insulated from both wirings at least between adjacent ones of the wirings.

The discharge inducing electrode may be provided so as to have a width wider than the corresponding wiring at the end of the substrate or a larger area than the corresponding wiring at the end of the substrate.

The operation of the present invention will be described below.

In the present invention, at least one of the scanning wiring and the signal wiring has a high resistance portion in the middle or end portion outside the display area. Even if static electricity is applied in the process up to the division of the substrate, by connecting each wire to the short-circuit wire at the high resistance part, it is possible to disperse the charge to other wires via the high resistance part and the short-circuit wire. The characteristics of the switching element and the dielectric breakdown between wirings do not occur. Also, since the resistance value of the high resistance part is sufficiently higher than the wiring resistance value of other signal wiring parts and scanning wiring parts, even if it is connected to the short-circuit line, it is possible to inspect for disconnection of each wiring and leakage between wirings. It is possible.

When the substrate is divided, the high resistance portion is exposed from the end face of the substrate or is arranged inside the end face of the substrate so that the high resistance portion is separated from the display end. Some or all of the resistance part remains. Therefore, even if a charge due to static electricity is applied in the process after the substrate is cut, the voltage drops in the high resistance portion from the cut end to the display region.
No deterioration of switching element characteristics or dielectric breakdown between wirings. Also, since the high resistance part is located closer to the substrate end side than the signal input terminal, even if it remains after the display panel is completed,
It does not affect the signal applied for actual driving.

For the high resistance portion, it is desirable to use a film having a surface resistance higher than that of the film forming the other wiring portion, and any of a semiconductor film, a metal film, a metal oxide film or the like is used. Good. In particular, it is desirable to form the high resistance portion with the material forming the active matrix substrate, since it is not necessary to add a manufacturing process.

According to another aspect of the present invention, a discharge induction electrode is provided near the end of at least one of the scanning wiring and the signal wiring and outside the display area so as to be insulated from the wiring. Therefore, even if static electricity is generated around the display panel during the manufacturing process of the display panel or after the completion of the display panel, the static electricity is discharged to the discharge induction electrode, and the application of static electricity to the scanning wiring and the signal wiring is suppressed. Therefore, characteristic deterioration of the switching element and dielectric breakdown between wirings do not occur.

By connecting the discharge inducing electrode to the counter electrode, the applied static electricity is diffused over the entire display panel, so that the influence of the static electricity can be prevented.

The discharge inducing electrode may be provided so as to be overlapped with and insulated from the scanning wiring or the signal wiring, or may be provided between adjacent wirings so as to be insulated from both wirings. It may be provided outside the wires at both ends so as to be insulated from the wires. In any case, since the discharge induction electrode and each wiring are electrically insulated, the static electricity applied to the discharge induction electrode is not applied to the scanning wiring or the signal wiring.

If the discharge inducing electrode is made wider than the scanning wiring and the signal wiring at the end portion of the substrate or wider than the scanning wiring and the signal wiring at the end portion of the substrate, static electricity discharged around the display panel is generated. Is easily applied to the discharge induction electrode, which is desirable.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the following figures, the parts having the same functions as those of the conventional art will be described with the same numbers.

(Embodiment 1) FIG. 1 is a diagram showing an equivalent circuit of an active matrix substrate in a display panel of Embodiment 1.

This active matrix substrate comprises a plurality of signal wirings 2 on a transparent substrate 1 made of a glass plate or the like.
And scanning lines 3 are provided so as to intersect with each other via an insulating film (not shown), and TF as a switching element is provided in the display area in the vicinity of the intersection of each signal line 2 and each scanning line 3.
A T4 and a pixel electrode 5 connected to the TFT4 are provided. Each of the signal wirings 2 and each of the scanning wirings 3 extends to the outside of the display area where the pixel electrodes 5 are provided in a matrix, and the signal input terminal 6 is provided at one end of the signal wiring 2.
And a signal input terminal 7 is provided at one end of the scanning wiring 3. The signal of the corresponding signal wiring 2 is applied to each pixel electrode 5 via the TFT 4 which is switched by the signal of the corresponding scanning wiring 3.

A short-circuit line 8 is formed around the display area so as to surround the periphery. The short-circuit line 8 is connected to both ends of each signal line 2 and high resistance parts 9 provided at both ends of each scanning line 3. The high resistance portion 9 can be formed simultaneously with the TFT 4 by using, for example, the semiconductor film n ⁺ a-Si forming the TFT 4. n ⁺ a-
The resistivity of Si is usually about several tens of Ωcm, and the film thickness thereof is about several hundred angstroms. n ⁺ a
-If the surface resistance of Si is 100 MΩ / □, the width of the high resistance portion 9 is 100 μm, and the length is 10 μm, the connection between the signal wiring 2 and the short-circuit line 8 or between the scanning wiring 3 and the short-circuit line 8 is established. The resistance is 10 MΩ.

As shown in FIG. 2, this active matrix substrate is bonded with another counter substrate (not shown) having a flat counter electrode formed on another transparent substrate, and then,
The substrate 1 is divided along the division line 10 and the short circuit line 8 is separated. At this time, a part of each high resistance portion 9 remains at both ends of the signal wiring 2 (and both ends of the scanning wiring 3). In addition, in FIG. 2 and FIGS.
Reference numeral 1 indicates the edge of the substrate 1 before division, and 32 indicates the edge of the counter substrate. As shown in FIG. 2, the edge 32 of the counter substrate is a signal wiring portion 2a other than the high resistance portion 9 in the counter substrate.
It is desirable to arrange so as to cover all (and the scanning wiring portion). After that, liquid crystal is filled between both substrates to complete the display panel.

In this display panel, all the signal wirings 2 and the scanning wirings 3 are connected to the short circuit line 8 by the high resistance portion 9 until the active matrix substrate is divided. Therefore, even if static electricity is generated in the process before the substrate is divided, the applied charges are distributed to all the wirings through the high resistance portion 9 and the short-circuit line 8, so that the characteristics of the switching element are deteriorated and the insulation breakdown between the wirings is caused. Does not occur. The wiring resistance values of the signal wiring portion 2a and the scanning wiring portion other than the high resistance portion 9 are usually 1 to several tens.
Since the resistance value is about kΩ, which is sufficiently lower than the resistance value of the high resistance portion 9, even before the substrate connected to the short-circuit line 8 is divided, a substrate inspection such as disconnection of each wiring or leakage between wirings can be performed.

Further, in the step after the substrate is divided, the surface of the active matrix substrate is covered with the counter substrate except on the signal input terminals 6 and 7. For this reason, the generated static electricity is mainly divided into the end faces of the substrate (A in FIGS. 1 and 2).
Part) to enter the signal wiring 2 and the scanning wiring 3. However, there is a high resistance portion 9 between the signal wiring 2 and the scanning wiring 3 and the dividing end, and the applied static electricity causes a voltage drop in the high resistance portion 9 before reaching the display area. The deterioration of the characteristics and the insulation breakdown between wirings do not occur. Further, since the high resistance portion 9 is located closer to the substrate end side than the signal input terminals 6 and 7, it does not affect the signal applied to the signal input terminals 6 and 7 for actual driving after the display panel is completed. .
Further, since the signal wirings 2 and the scanning wirings 3 are not electrically connected to each other, the occurrence of leakage between wirings due to static electricity applied to the element 12 connecting the wirings, unlike the conventional example shown in FIG. The occurrence of display unevenness due to minute leaks does not occur.

In this embodiment, the dividing line 10 of the active matrix substrate is arranged so as to divide a part of the high resistance portion 9. However, a part of the high resistance portion is provided between the dividing end and the display region. Alternatively, the dividing line 10 may be arranged at another position as long as the whole is left. Further, the high resistance portion 9 may be exposed from the end surface of the substrate or may be arranged inside the end surface of the substrate.

(Second Embodiment) FIG. 3 shows a partially enlarged view of a display panel according to a second embodiment.

In this display panel, a dividing line 10 of the active matrix substrate is arranged so as to divide a part of the short-circuit line 8 connected to the high resistance portion 9 of the signal wiring 2. After the substrate is cut, a part of the short-circuit line 8 is left in the peripheral area of the active matrix substrate.

In this display panel, all the signal wirings 2 and the scanning wirings 3 are connected to the short circuit line 8 by the high resistance portion 9 as in the first embodiment until the active matrix substrate is divided. Even when static electricity is generated, the applied charges are dispersed to all the wirings through the high resistance portion 9 and the short-circuit line 8, so that characteristic deterioration of the switching element and insulation breakdown between the wirings do not occur.

Further, in the step after the substrate is divided, the applied static electricity is dispersed to the peripheral signal wiring 2 and the scanning wiring 3 through a part of the short circuit line 8 left in the peripheral area of the active matrix substrate. Since the voltage drops in the high resistance portion 9 before reaching the display area, it is effective for further preventing the characteristic deterioration of the switching element and the dielectric breakdown between wirings due to static electricity. However, in this case, since the wirings are connected through the high resistance portion 9 even after the display panel is completed, the wirings between the adjacent wirings should be prevented so as not to affect the driving signal during actual driving. It is necessary to set the connection resistance value of.

(Third Embodiment) FIG. 4 shows a partially enlarged view of a display panel according to a third embodiment.

After the substrate is cut, a part of the short-circuit line 8 is left in the peripheral area of the active matrix substrate and is connected to the end 2a of the signal wiring 2 (or the end of the scanning wiring 3) by the high resistance portion 9. .

In this display panel, the narrowed portion of the short-circuit wiring 8 is connected to the high resistance portion 9 of the end portion 2a of the plurality of signal wirings 2 (or the end portion of the plurality of scanning wirings 3), and the narrowed portion is divided. Cutting line 1 of active matrix substrate
0 is placed. After cutting the substrate, the constricted portion of the short-circuit line 8 is left in the peripheral region of the active matrix substrate,
In the high resistance portion 9, the end portion 2a of the signal wiring 2 (and the scanning wiring 3
End). In this case, as shown in FIG. 4, it is preferable that the edge 32 of the counter substrate cover the counter substrate up to the constricted portion of the short-circuit line 8.

In this display panel, all the signal wirings 2 and the scanning wirings 3 are connected to the short-circuit line 8 by the high resistance portion 9 as in the first embodiment until the active matrix substrate is divided, as in the first embodiment. Even if static electricity is generated, the applied charges are distributed to all the wirings through the high resistance portion 9 and the short-circuit wire 8, so that characteristic deterioration of the switching element and insulation breakdown between the wirings do not occur.

Further, in the step after the substrate is cut, the counter substrate 11 covers up to the constricted portion of the short circuit line 8, and the portion to which static electricity is applied after the substrate is divided is the constricted portion (FIG. 4).
B)), the occurrence of defects due to static electricity can be significantly reduced compared to the first and second embodiments. In the second and third embodiments, the influence of static electricity can be further reduced by adopting a structure in which the short-circuit line 8 remaining on the panel after the division is connected to the counter electrode (not shown).

In the above-described first to third embodiments, the example in which the semiconductor film is used as the high resistance portion 9 has been described, but if the film has a higher surface resistance than the signal wiring portion 2a or the scanning wiring portion other than the high resistance portion. Any of them can be used, and a metal film or a metal oxide film may be used. When a metal film is used as the high resistance part 9, it is preferable to thin the high resistance part 9 in order to increase the resistance value thereof or to increase the length-to-width ratio of the metal film. A metal oxide film may be used as the high resistance portion 9. If a semiconductor film, a metal film, or a metal oxide film forming the active matrix substrate is used as the high resistance portion 9, it is possible to reduce the manufacturing cost because it is not necessary to add a special process.

Further, in the above-described first to third embodiments, the short circuit wire 8
Is arranged so as to surround the periphery of the display region, and the high resistance portion 9 provided at both ends of the signal wiring 2 and both ends of the scanning wiring 3 is connected to the short-circuit line 8, but the short-circuit line 8 is arranged in an L shape. Then, the high resistance portion 9 provided at one end of the signal wiring 2 and the one end of the scanning wiring 3 may be connected to the short-circuit line 8. In this case, the edge 32 of the counter substrate is arranged so that the end on the non-connected side is completely covered with the counter substrate so that static electricity is not applied to the signal wiring 2 and the scanning wiring 3 due to contact or the like after the substrate is divided. Preferably.

(Embodiment 4) FIG. 5 is a plan view of an active matrix substrate in a display panel of Embodiment 4. In FIG. 5, the inside of the display area 20 is omitted for simplification, and some of the wirings and terminals arranged in parallel around the display area 20 are omitted.

In this active matrix substrate, the short-circuit line 8 has an end portion where the signal input terminal 6 of the signal wiring 2 is not provided and an end portion of the scanning wiring 3 where the signal input terminal 7 is not provided. Connected with. Further, on the side of the display area 20 where the signal input terminals 6 and 7 are not provided, the discharge induction electrode 15 is provided so as to cover the signal wiring 2 and the scanning wiring 3 via an insulating film (not shown). Are overlaid.

This active matrix substrate is bonded to a counter substrate (not shown) on which counter electrodes are formed, and then liquid crystal is filled between the two substrates to complete a display panel. The substrate 1 is divided along the line 10 and the short-circuit line 8 is separated. At this time, the discharge induction electrode 15 covers the end portions of the signal wiring 2 and the scanning wiring 3 on the side where the signal input terminals 6 and 7 are not provided.

In this way, the discharge induction electrode 15 is connected to the signal wiring 2
And since the end portion of the scanning wiring 3 is covered, most of the static electricity discharged around the display panel is applied to the discharge induction electrode 15. Since the discharge inducing electrode 15 is electrically insulated from the signal wiring 2 and the scanning wiring 3, no voltage is applied to the TFT 4 formed at the overlapping portion of the signal wiring 2 and the scanning wiring 3, and the TFT is electrostatically discharged.
There is no deterioration of characteristics and insulation breakdown between wirings.

(Embodiment 5) FIG. 6 is a plan view of an active matrix substrate in a display panel of Embodiment 5. In FIG. 6, the inside of the display area 20 is omitted for simplification, and some of the wirings and terminals arranged in parallel around the display area 20 are omitted.

In this active matrix substrate, the short-circuit line 8 has an end portion where the signal input terminal 6 of the signal wiring 2 is not provided and an end portion of the scanning wiring 3 where the signal input terminal 7 is not provided. Connected with. Further, on the side of the display area 20 where the signal input terminals 6 and 7 are not provided, the discharge inducing electrodes 15 are provided on both sides of each signal wiring 2 and both sides of each scanning wiring 3 separately from each wiring. Has been.

This active matrix substrate is bonded to a counter substrate (not shown) on which counter electrodes are formed, and then a liquid crystal is filled between the two substrates to complete a display panel. The substrate 1 is divided along the line 10 and the short-circuit line 8 is separated. At this time, the discharge inducing electrodes 15 sandwich the both ends of the signal line 2 and the scanning line 3 on the side where the signal input terminals 6 and 7 are not provided. At this time, it is possible to omit the outermost signal wiring 2 and the discharge induction electrode 15 outside the scanning wiring.

In this way, the discharge induction electrode 15 is connected to the signal wiring 2
And both sides of the end of the scanning wiring 3 are sandwiched, and moreover,
Since the width of the discharge inducing electrode 15 is made wider than the width of the signal line 2 and the scanning line 3, most of the static electricity discharged around the display panel is applied to the discharge inducing electrode 15. Further, since the discharge induction electrode 15 is electrically insulated from the signal wiring 2 and the scanning wiring 3, the TFT formed at the overlapping portion of the signal wiring 2 and the scanning wiring 3
No voltage is applied to No. 4 and static electricity does not cause deterioration of TFT characteristics or dielectric breakdown between wirings.

This display panel also includes the discharge induction electrode 1
Since 5 is connected to the counter electrode (not shown) via the common line 25, the charge applied by static electricity can be diffused from the counter electrode to the entire liquid crystal display panel, and the influence of static electricity can be further reduced. be able to.

The shape of the discharge inducing electrode 15 is not limited to those shown in the above-described fourth and fifth embodiments, and since the conductive material may be formed in the vicinity of the signal wiring 2 and the scanning wiring 3, the signal wiring may be formed. It can be appropriately changed according to the connection pattern between the wiring 2 and the short-circuit line 8 and the connection pattern between the scanning wiring 3 and the short-circuit line 8. In particular, if the width or area of the discharge induction electrode 15 at the substrate end is made larger than the width or area of each of the wirings 2 and 3 at the substrate end, static electricity is effectively guided to the discharge induction electrode 15. Further, if the discharge inducing electrode 15 is formed by using the same material as the signal wiring 2, the scanning wiring 3, the common line 25, etc., it is not necessary to add a special process, and thus the manufacturing cost can be reduced.

[0063]

As described in detail above, according to the present invention,
At least one of the scanning wiring and the signal wiring has a high resistance portion in the middle or end thereof outside the display region, and the high resistance portion is exposed from one substrate end surface,
Alternatively, since one of the substrates is divided so as to be disposed inside the end face of the substrate, the characteristic deterioration of the switching element and the breakdown of the insulating film between the wirings due to static electricity can be prevented even in the step after the division of the substrate. Therefore, it is possible to improve the manufacturing yield and to manufacture a highly reliable display panel through all the steps before and after the substrate cutting.

Further, since the resistance value of the high resistance portion is sufficiently lower than that of the other wiring portions, it is possible to inspect the disconnection of each wiring and the leakage between wirings even in the state of being connected to the short-circuit line before the division. This is possible, and the manufacturing yield can be further improved.

Further, since the high resistance portion is located closer to the substrate end side than the signal input terminal, even if the high resistance portion is left after the completion of the display panel, it does not affect the signal applied for actual driving, and the display An image with good quality can be obtained.

Since the high resistance portion can be formed by using the same material as the semiconductor film, the metal film, the oxide film or the like which composes the active matrix substrate, it is not necessary to add a special process and the manufacturing cost can be reduced. can do.

According to another aspect of the present invention, since the discharge inducing electrode is provided near the end of at least one of the scanning wiring and the signal wiring and outside the display area,
Even if static electricity is generated around the display panel after the display panel is completed, the static electricity can be applied to the discharge inducing electrodes, and the static electricity can be prevented from being applied to the signal wiring or the scanning wiring.
Therefore, it is possible to prevent the characteristic deterioration of the switching element and the dielectric breakdown between the wirings due to the static electricity.

Since the discharge inducing electrode can be formed in the step of forming the signal wiring and the scanning wiring, it is not necessary to add a special step, and the manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is an equivalent circuit diagram of an active matrix substrate in a display panel according to a first exemplary embodiment.

FIG. 2 is a partially enlarged view of the display panel according to the first embodiment.

FIG. 3 is a partially enlarged view of the display panel according to the second embodiment.

FIG. 4 is a partially enlarged view of the display panel according to the third embodiment.

FIG. 5 is a plan view of an active matrix substrate in a display panel of Embodiment 4.

FIG. 6 is a plan view of an active matrix substrate in a display panel of Embodiment 5.

FIG. 7 is an equivalent circuit diagram of a conventional active matrix substrate.

FIG. 8 is a plan view of another conventional active matrix substrate.

FIG. 9 is an equivalent circuit diagram of another conventional active matrix substrate.

[Explanation of symbols]

1 substrate 2 signal wiring 2a Signal wiring part other than high resistance part 3 scan wiring 4 TFT 5 pixel electrodes 6, 7 Signal input terminal 8 short-circuit wire 9 High resistance part 10 cutting line 15 Discharge induction electrode 20 display area 25 common lines 31 Edge 32 edges

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2H092 GA33 GA37 GA38 GA39 HA12                       HA13 JA24 JB77 JB79 KA05                       NA14 NA30                 5C094 AA31 AA42 BA03 CA19 DA09                       DB03 DB04 EA07 FB14

Claims (5)

[Claims] 1. A plurality of signal wirings and a plurality of scanning wirings are provided so as to intersect with each other and are insulated from each other on one of a pair of substrates that are arranged to face each other with a display medium interposed therebetween. Pixel electrodes connected to both wirings via a switching element are provided in the vicinity of the intersection with each scanning wiring,
In a display panel in which a portion where the pixel electrode is present is used as a display area, an electric discharge is made by insulating the wiring from the outside of the display area in the vicinity of an end of at least one of the scanning wiring and the signal wiring. A display panel provided with induction electrodes. 2. The display panel according to claim 1, wherein the discharge induction electrode is electrically connected to a counter electrode on the other substrate of the pair of substrates. 3. The discharge inducing electrode is provided so as to be overlapped and insulated from the corresponding wiring.
Display panel described in. 4. The display panel according to claim 1, wherein the discharge inducing electrode is provided between at least adjacent ones of the corresponding wirings and insulated from both wirings. 5. The discharge inducing electrode is provided so as to have a width wider than a corresponding wiring at an end portion of the substrate or a wider area than a corresponding wiring at an end portion of the substrate. Display panel described in one.