JP2003133114A - Method of manufacturing network resistor - Google Patents

Abstract

(57) [Problem] To provide a network resistor that does not cause a resistance failure due to solder cracking or a conduction failure due to non-wetting of solder when the network resistor is mounted by soldering. It is intended to provide a manufacturing method. SOLUTION: Plating 23 is formed on through-hole electrodes 12 and individual electrodes 11 formed in a plurality of recesses in an individual substrate formed by performing a secondary division 19.
Before the step of applying, polishing 20 and washing 21 using emery powder or the like are performed to cure the second protective layer 17 and adhere to the through-hole electrodes 12 formed in the plurality of through-holes. This is to remove the scattering of the low molecular resin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a network resistor used in various electronic devices.

[0002]

2. Description of the Related Art A conventional network resistor of this type is
It was manufactured based on the manufacturing process diagram as shown in FIG.

First, a plurality of pairs of individual electrodes 1 containing silver as a main component are formed by screen printing on the periphery of each through hole and the inner wall of the through hole in a sheet-like insulating substrate having a large number of through holes and vertical and horizontal dividing grooves. The through-hole electrode 2 and the through-hole electrode 2 are formed so as to be electrically connected to each other, and are fired with a firing profile having a peak temperature of 850 ° C. And Next, the common electrode 3 containing silver as a main component is formed between the individual electrodes 1 forming a pair by a screen printing method, and the common electrode 3 is stabilized by firing it with a firing profile having a peak temperature of 850 ° C. It is a film. Next, between the individual electrode 1 and the common electrode 3 forming a pair, a ruthenium oxide-based resistor 4 is formed by a screen printing method so as to be electrically connected to both the electrodes 1 and 3, and a peak temperature of 850 ° C. By firing with the firing profile of, the resistor 4 is made a stable film. Next, the first protective layer 5 containing a plurality of glasses as a main component is formed by a screen printing method so as to cover the plurality of resistors 4, and the glass is baked by a baking profile having a peak temperature of 600 ° C. The first protective layer 5 containing the main component is a stable film. Next, trimming 6 is performed by a laser trimming method in order to correct the resistance value of the resistor 4 between the paired individual electrode 1 and the common electrode 3 to a constant value.

Next, a plurality of second protective layers 7 containing a resin as a main component are formed by a screen printing method so as to cover the individual electrodes 1, the common electrodes 3 and the resistors 4 forming the pair, and the peak temperature is set. By curing with a curing profile of 200 ° C., the second protective layer 7 becomes a stable film. next,
A plurality of strip-shaped substrates are formed by performing a primary division 8 in which the through holes are divided from the sheet-shaped insulating substrate by either one of vertical and horizontal dividing grooves. Next, by performing the secondary division 9 of the strip-shaped substrate by either the other of the vertical and horizontal division grooves formed in the strip-shaped substrate, an individual substrate having a plurality of pairs of through-hole electrodes 2 is formed. . And finally, the through-hole electrode 2 and the individual electrode 1 formed in the plurality of recesses in the individual substrate.
To form a network resistor by forming a plating 10 having a first plating layer made of nickel plating or the like and a second plating layer made of solder or tin covering the first plating layer so as to cover the network resistor. It was manufactured.

[0005]

In the above conventional network resistor, the individual electrode 1 and the common electrode 3 forming a pair are used.
A plurality of second protective layers 7 containing a resin as a main component are formed by a screen printing method so as to cover the resistor 4 and the resistor 4. The second protective layer 7 has a curing profile with a peak temperature of 200 ° C. Since a stable film is formed by curing, when the second protective layer 7 is cured, scattered particles of a low molecular weight resin are generated. When the scattered particles adhere to the through-hole electrode 2, the When the plating 10 is formed so as to cover the hole electrode 2 and the individual electrode 1, the plating 10 does not reach the scattered matter adhering to the through hole electrode 2, and as a result, the network resistance When the container is mounted by soldering, there is a problem that a resistance value defect may occur due to solder breakage or a conduction defect may occur due to non-wetting of the solder.

The present invention solves the above-mentioned conventional problems. When a network resistor is mounted by soldering, a resistance value defect due to solder breakage and a conduction defect due to solder non-wetting occur in advance. It is an object of the present invention to provide a method for manufacturing a network resistor that can be prevented.

[0007]

In order to achieve the above object, the present invention has the following constitution.

According to a first aspect of the present invention, an individual electrode and a through hole electrode are provided around each through hole and an inner wall of the through hole in a sheet-like insulating substrate having a large number of through holes and vertical and horizontal dividing grooves. Forming a common electrode that is located between the individual electrodes forming a pair, and electrically connecting the two to each other between the individual electrode forming the pair and the common electrode As described above, a step of forming a protective layer made of resin by printing and curing so as to cover the individual electrodes, the common electrode and the resistor, and the sheet-like insulating substrate is divided vertically and horizontally. A step of dividing the through hole by either one of the grooves to perform a primary division into a strip substrate, and a plurality of pairs of through hole electrodes are provided by the other of the vertical and horizontal directions after the primary division. And a step of plating the through-hole electrodes and the individual electrodes formed in the plurality of recesses in the individual substrate obtained by the secondary division. Low molecular weight resin that is generated when the protective layer is hardened by polishing and cleaning with emery powder before the plating process and adheres on the through-hole electrodes formed in multiple through-holes. According to this manufacturing method, the step of plating the through-hole electrodes and the individual electrodes formed in the plurality of recesses in the second-divided individual substrate is performed. By polishing and cleaning with emery powder, etc., the low-molecular-weight resin that is generated when the protective layer is cured and adheres onto the through-hole electrodes formed in multiple through-holes is scattered. Therefore, when plating is applied to the through-hole electrodes and the individual electrodes formed in the plurality of recesses in the individual substrate obtained by the secondary division, the scattered particles of the low-molecular resin are It has been removed from the through-hole electrode, and this makes it possible to reliably plate the through-hole electrode.Therefore, when this network resistor is mounted by soldering, it will not be soldered as before. This has the effect of eliminating the problem that the resistance value failure due to the above-mentioned or the conduction failure due to the non-wetting of the solder occurs.

According to a second aspect of the present invention, an individual electrode is formed between each through hole on the upper surface of a sheet-like insulating substrate having a large number of through holes and vertical and horizontal dividing grooves, and a pair of through electrodes are formed. Forming a common electrode located between the individual electrodes, and forming a resistor between the pair of individual electrodes and the common electrode so as to be electrically connected to both, and the resistor. Trimming in order to adjust the resistance value of, the step of forming a protective layer so as to cover the individual electrode, the common electrode and the resistor, the sheet-shaped insulating substrate one of the vertical and horizontal dividing grooves A step of dividing the through-hole and the individual electrode into primary strip-shaped substrates by means of, and electrically connecting the individual electrodes to the convex portions located between the plurality of concave portions in the primary-divided rectangular substrate. To A step of forming a surface electrode, a step of subdividing into a piece-shaped substrate having a plurality of pairs of end face electrodes by either of the vertical and horizontal division grooves, and a plurality of pairs in the piece-shaped substrate obtained by the secondary division. And a step of plating on the end surface electrodes, and before the step of performing the plating, polishing and cleaning with emery powder etc. are performed, which occurs during trimming and adheres in a large number of through holes. According to this manufacturing method, the end surface electrodes are electrically connected to the individual electrodes on the convex portions located between the plurality of concave portions on the primary-divided strip-shaped substrate. Formed, and to obtain a piece-shaped substrate having a plurality of pairs of end face electrodes by subdividing the strip-shaped substrate, before the step of plating on a plurality of pairs of end face electrodes in this piece-shaped substrate, Polishing with emery powder By cleaning, the scattered substances that are generated during trimming and that adhere to the inside of many through holes are removed. During plating, scattered matter containing metal such as ruthenium generated during trimming is in a state of being removed from inside the through hole. This plating has the effect of being able to solve the problem of causing a short circuit between adjacent resistors.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION (Embodiment 1) Hereinafter, a method for manufacturing a network resistor according to Embodiment 1 of the present invention will be described with reference to the drawings.

FIG. 1 is a process diagram showing a method of manufacturing a network resistor according to a first embodiment of the present invention, and FIG. 2 is a top view showing an internal structure of the network resistor. Figure 1,
A method of manufacturing the network resistor according to the first embodiment of the present invention will be described with reference to FIG.

In FIGS. 1 and 2, first, silver is used as a main component on the periphery of each through hole and the inner wall of the through hole in a sheet-shaped insulating substrate having a large number of through holes and vertical and horizontal dividing grooves by a screen printing method. A plurality of pairs of individual electrodes 11 and through-hole electrodes 12
1 and 12 are formed so as to be electrically connected to each other, and fired with a firing profile having a peak temperature of 850 ° C.,
A plurality of pairs of individual electrodes 11 and through-hole electrodes 12 are stable films. Next, the common electrode 13 containing silver as a main component is formed between the individual electrodes 11 forming a pair by a screen printing method, and the common electrode 13 is stabilized by baking it with a baking profile having a peak temperature of 850 ° C. It is a film. Next, a ruthenium oxide-based resistor 14 is formed by a screen printing method between the individual electrode 11 and the common electrode 13 forming a pair so as to be electrically connected to both 11, 13 and a peak temperature of 850 ° C. By firing with the firing profile of, the resistor 14 is made a stable film. Next, the first protective layer 15 containing a plurality of glasses as a main component is formed by a screen printing method so as to cover the plurality of resistors 14, and the glass is baked by a baking profile having a peak temperature of 600 ° C. The first protective layer 15 containing the main component is a stable film. Next, in order to correct the resistance value of the resistor 14 between the paired individual electrode 11 and the common electrode 13 to a constant value, trimming 16 is performed by the laser trimming method.

Next, a plurality of second protective layers 17 containing a resin as a main component are formed by a screen printing method so as to cover the individual electrodes 11, the common electrode 13 and the resistor 14 forming the pair.
Is formed and cured with a curing profile having a peak temperature of 200 ° C., so that the second protective layer 17 becomes a stable film. Next, a primary division 1 in which the through hole is divided from the sheet-like insulating substrate by either one of vertical and horizontal division grooves.
By performing step 8, a plurality of strip substrates are formed. Next, by performing the secondary division 19 of the strip-shaped substrate by either the other of the vertical and horizontal division grooves formed in the strip-shaped substrate, an individual substrate having a plurality of pairs of through-hole electrodes 12 is formed. .

Next, polishing 20 with emery powder or the like is performed. The polishing 20 is performed when the second protective layer 17 is hardened, and has a function of polishing the scattered particles of the low molecular weight resin adhered on the through hole electrodes 12 formed in the plurality of through holes. Is. Here, emery powder is a mixed mineral such as corundum and magnetite tablets, and its particle size is 0.3 mm.
It is the following.

Next, cleaning 21 is carried out by washing with water or a combination of washing with water and alcohol substitution. This wash 2
The reference numeral 1 serves to wash away and remove the scattered substances of the low molecular weight resin polished by the polishing 20.

Finally, a first plating layer made of nickel plating or the like is formed so as to cover the through-hole electrodes 12 and the individual electrodes 11 formed in the plurality of recesses 22 in the individual substrate, and the first plating layer. The network resistor is manufactured by forming the plating 23 having the second plating layer made of solder, tin, or the like, which covers the first plating layer.

In the first embodiment of the present invention described above, on the through-hole electrode 12 and the individual electrode 11 which are formed in the plurality of recesses 22 in the individual substrate formed by performing the secondary division 19. Before the step of applying the plating 23, polishing 20 with emery powder and cleaning 21 are performed, so that the through-hole electrodes 12 formed at the time of curing the second protective layer 17 and formed in the plurality of through-holes 12 are formed.
Since the scattered substances of the low molecular weight resin adhering to the above are removed, the through-hole electrodes formed in the plurality of recesses 22 in the individual substrate formed by performing the secondary division 19 When the plating 23 is applied on the electrode 12 and the individual electrode 11, the scattered substances of the low molecular weight resin are removed from the through-hole electrode 12, which ensures the plating 23 on the through-hole electrode 12. Therefore, when this network resistor is mounted by soldering, there is no problem of resistance value failure due to solder squeezing or conduction failure due to solder non-wetting as in the past. It has the effect of.

(Embodiment 2) A method for manufacturing a network resistor according to Embodiment 2 of the present invention will be described below.
A description will be given with reference to the drawings.

FIG. 3 is a process diagram showing a method for manufacturing a network resistor according to the second embodiment of the present invention, and FIG. 4 is a top view showing the internal structure of the network resistor. Figure 3,
A method of manufacturing a network resistor according to the second embodiment of the present invention will be described with reference to FIG.

In FIG. 3 and FIG. 4, first, silver is the main component between the through holes located on the upper surface of a sheet-like insulating substrate having a large number of through holes and vertical and horizontal dividing grooves, by a screen printing method. By forming a plurality of pairs of individual electrodes 31 and firing with a firing profile having a peak temperature of 850 ° C., the plurality of pairs of individual electrodes 31 are made stable films.
Next, a common electrode 32 containing silver as a main component is formed between the individual electrodes 31 forming the pair by a screen printing method, and the common electrode 32 is baked by a baking profile having a peak temperature of 850 ° C. to form the common electrode 32. Use a stable film. next,
Between the paired individual electrode 31 and common electrode 32, both
The ruthenium oxide-based resistor 33 is formed by a screen printing method so as to be electrically connected to the resistors 1 and 32, and is fired with a firing profile having a peak temperature of 850 ° C., thereby forming the resistor 33 as a stable film. Next, the first protective layer 34 containing a plurality of glasses as a main component is formed by a screen printing method so as to cover the plurality of resistors 33, and the glass is baked by a baking profile having a peak temperature of 600 ° C. The first protective layer 34 containing the main component is a stable film. Next, trimming 35 is performed by a laser trimming method in order to correct the resistance value of the resistor 33 between the paired individual electrodes 31 to a constant value.

Next, while covering the first protective layer 34 containing a plurality of glasses as a main component and overlapping with a part of the individual electrodes 31, a plurality of second main components containing a resin by a screen printing method are used. A protective layer 36 is formed and a peak temperature of 200
The second protective layer 36 is made into a stable film by curing with a curing profile of ° C. Next, a plurality of strip-shaped substrates are formed by performing a primary division 37 that divides the sheet-shaped insulating substrate into the through holes and the individual electrodes 31 by using one of vertical and horizontal division grooves.

Next, epoxy having Ni and C as conductive components is electrically connected to the individual electrodes 31 on the convex portions 39 located between the plurality of concave portions 38 in the primary-divided strip-shaped substrate. The resin paste material is printed by roller transfer and dried, and the peak temperature is 165.
The end face electrode 40 is formed by curing with a curing profile of ° C.

Next, the strip-shaped substrate is divided by the other one of the vertical and horizontal division grooves formed in the strip-shaped substrate to perform a secondary division 41, thereby obtaining an individual substrate having a plurality of pairs of end face electrodes 40. Form.

Next, polishing 42 with emery powder or the like is performed. The polishing 42 is performed by performing the trimming 35, and serves to polish the scattered matter containing the metal such as ruthenium attached in the many through holes.

Next, cleaning 43 is performed with water or a combination of water cleaning and alcohol substitution. This wash 4
The reference numeral 3 serves to wash away and remove the scattered substances containing the metal such as ruthenium polished by the polishing 42.

Finally, a plurality of pairs of end face electrodes 4 on the individual substrate formed by performing the secondary division 41.
By forming a plating 44 having a first plating layer made of nickel plating or the like and a second plating layer made of solder or tin covering the first plating layer so as to cover 0, a network resistor is formed. Are manufactured.

In the second embodiment of the present invention described above, the individual electrode 3 is provided on the convex portion 39 located between the plurality of concave portions 38 in the strip-shaped substrate formed by performing the primary division 37.
The end face electrode 40 is formed so as to be electrically connected to
Then, by performing the secondary division 41 of the strip-shaped substrate, an individual substrate having a plurality of pairs of end face electrodes 40 is obtained, and plating 4 is performed on the plurality of pairs of end face electrodes 40 in the individual substrate.
Before the step of applying 4, polishing 42 with emery powder or the like,
By performing the cleaning 43, the scattered matter including the metal such as ruthenium, which is generated when the trimming 35 is performed and adheres in the many through holes, is removed. When the plating 44 is applied on the end face electrode 40 of No. 3, the scattered matter containing a metal such as ruthenium generated when the trimming 35 is performed is removed from the through hole. The flying substance adhered in the hole is plated, and the plating 44 can solve the problem that a short circuit occurs between the adjacent resistors 33.

[0028]

As described above, according to the method of manufacturing the network resistor of the present invention, the through-hole electrodes and the individual electrodes formed in the plurality of recesses in the second-divided individual substrate are plated. Scattering of low-molecular-weight resin that occurs during curing of the protective layer and adheres to the through-hole electrodes formed in multiple through-holes by polishing and cleaning with emery powder before the process. Therefore, when plating is applied to the through-hole electrodes and the individual electrodes formed in the plurality of recesses in the individual substrate obtained by the secondary division, the scattered particles of the low-molecular resin are Since it is removed from the through-hole electrode, and this makes it possible to reliably plate the through-hole electrode, mount this network resistor by soldering. It was the case, conventional or generate the resistance failure due solder leaching as, or those having the effect that solder conduction failure due to non-wetting is no longer a problem occurs.

[Brief description of drawings]

FIG. 1 is a process diagram showing a method of manufacturing a network resistor according to a first embodiment of the present invention.

FIG. 2 is a top view showing an internal structure of the network resistor.

FIG. 3 is a process diagram showing a method of manufacturing a network resistor according to a second embodiment of the present invention.

FIG. 4 is a top view showing the internal structure of the network resistor.

FIG. 5 is a process diagram showing a method for manufacturing a conventional network resistor.

[Explanation of symbols]

11,31 Individual electrodes 12 Through-hole electrode 13,32 Common electrode 14,33 resistor 15,34 First protective layer 16,35 trimming 17,36 Second protective layer 18,37 Primary division 19,41 Secondary division 20,42 polishing 21,43 cleaning 22 recess 23,44 plating 38 recess 39 convex 40 Edge electrode

Claims (2)

[Claims] 1. An individual electrode and a through hole electrode are electrically connected to the periphery of each through hole and an inner wall of the through hole in a sheet-like insulating substrate having a large number of through holes and vertical and horizontal dividing grooves. Forming and forming a common electrode positioned between the paired individual electrodes, and forming a resistor between the paired individual electrodes and the common electrode so as to be electrically connected to both And a step of forming a protective layer made of resin by printing and curing so as to cover the individual electrodes, the common electrodes and the resistors, and dividing the through hole by dividing the sheet-like insulating substrate by one of vertical and horizontal dividing grooves. And the primary division into strip-shaped substrates, and the secondary division into the individual substrates having a plurality of pairs of through-hole electrodes by either the vertical or horizontal direction after the primary division. And a step of plating on the through-hole electrodes and the individual electrodes formed in the plurality of recesses in the second-divided individual substrate,
Prior to the step of applying the plating, by polishing and cleaning with emery powder or the like, the low-molecular substances that are generated at the time of curing the protective layer and are attached on the through-hole electrodes formed in the plurality of through holes A method for manufacturing a network resistor, which is designed to remove scattered resin. 2. A common electrode located on the upper surface of a sheet-like insulating substrate having a large number of through holes and vertical and horizontal dividing grooves, forming individual electrodes between the respective through holes, and located between a pair of individual electrodes. A step of forming a resistor between the pair of individual electrodes and the common electrode so as to be electrically connected to both, and trimming for adjusting the resistance value of the resistor. A step of performing, a step of forming a protective layer so as to cover the individual electrode, the common electrode and the resistor, and the through-hole and the individual electrode are divided into the sheet-shaped insulating substrate by one of vertical and horizontal dividing grooves. A step of primary division into strip-shaped substrates; a step of forming end face electrodes so as to be electrically connected to the individual electrodes on the convex portions located between the plurality of concave portions in the primary-divided strip-shaped substrate; Vertical Secondary dividing into individual substrates having a plurality of pairs of end face electrodes by either of the other lateral division grooves, and plating on the plurality of pairs of end face electrodes in the secondary divided individual substrate A network that includes a step, and removes scattered matter generated during trimming and adhering in a large number of through holes by performing polishing and cleaning with emery powder before the step of applying the plating. Method of manufacturing resistor.