JP2003124725A - Chip antenna device and packaging structure for chip antenna - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip antenna device in which dispersion in the resonance characteristics of a chip antenna can be suppressed even when there is dispersion in the packaging position of the chip antenna on a packaged substrate. SOLUTION: In a substrate 4 equipped with the chip antenna and a matching element for controlling impedance thereof and provided in the chip antenna, a power feeding element 10 and a power non-feeding element 11 are positioned between different two of ceramic layers 5-9 and a ground conductor 12 is positioned between further different two of ceramic layers 5-9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip antenna device and a chip antenna mounting structure,
In particular, mobile phones, GPS (Global Position)
mobile communication device such as an ioning system receiver, or, for example, Bluetooth.
The present invention relates to a chip antenna device provided with a small chip antenna that is preferably used in an electronic device having a short-range wireless communication function such as ooth) and a chip antenna mounting structure.

[0002]

2. Description of the Related Art A chip antenna forming a meander antenna or a helical antenna is often used as a built-in antenna in mobile communication devices and other electronic devices having a communication function.

When a chip antenna that constitutes such a meander antenna or a helical antenna is mounted on a mounting substrate on which a ground conductor film is formed, three of the four side surfaces are surrounded by the ground conductor film. If it is in a closed state or in a state in which it is very close to the ground conductor film, the resonance frequency band becomes narrow, and the gain deteriorates.

Therefore, in order to secure the above-mentioned resonating frequency band and gain above a certain level, the chip antenna is arranged at a corner of the mounting substrate so that only two side surfaces are surrounded by the ground conductor film. At the same time, it is necessary to mount the chip antenna at a sufficient distance from the ground conductor film.

[0005]

From the above, there is a problem that the mounting position of the chip antenna on the mounting substrate is extremely limited, and the characteristics of the chip antenna greatly vary due to the dispersion of the mounting position. To do.

SUMMARY OF THE INVENTION An object of the present invention is to provide a chip antenna device and a chip antenna mounting structure which can solve the above problems.

[0007]

The present invention is first directed to a chip antenna device having a chip antenna and a matching element for adjusting the impedance of the chip antenna.

The chip antenna described above includes a base body including a plurality of ceramic layers made of laminated dielectric or magnetic materials, a plurality of radiation conductors provided on the base body, a ground conductor also provided on the base body, and a base body. The power supply terminal is provided on the outer surface for supplying power to the radiation conductor, and the grounding terminal is also provided on the outer surface of the base body and is electrically connected to the grounding conductor.

At least one of the radiation conductors serves as a feeding element electrically connected to the feeding terminal, and the rest of the radiation conductor serves as a parasitic element electrically connected to the grounding terminal.

The radiation conductor which serves as the feeding element and the radiation conductor which serves as the parasitic element are located between different ceramic layers.

Further, the ground conductor is located between ceramic layers different from the ceramic layer in which the radiation conductor is located.

The matching element is electrically connected to the above-mentioned power supply terminal.

In the chip antenna device according to the present invention, it is preferable that the radiation conductor and the ground conductor are strip-shaped extending along the periphery of the ceramic layer.

More preferably, the ceramic layer is rectangular, and the radiation conductor and the ground conductor are provided with a portion extending in an L shape passing near the corners of the ceramic layer.

Further, it is preferable that the radiation conductor serving as the feeding element and the radiation conductor serving as the parasitic element are arranged so as to overlap in the stacking direction of the bases.

On the other hand, it is preferable that the ground conductor is arranged so as not to overlap the radiation conductor in the stacking direction of the substrates.

Further, it is preferable that a trimming conductor electrically connected to each of the radiation conductor serving as a feeding element and the radiation conductor serving as a parasitic element is provided on the outer surface of the base.

The matching element is preferably provided by a chip component forming a π-type circuit including an inductor and a capacitor.

Further, the ground conductor is arranged so as not to position any radiation conductor between the ground conductor and one end surface of the substrate in the laminating direction (hereinafter referred to as "a preferable arrangement mode of the ground conductor"). Is preferred.

When the above-mentioned "preferable arrangement mode of the grounding conductor" is adopted, it is more preferable that the radiation conductor serving as the feeding element, the radiation conductor serving as the parasitic element, and the grounding conductor are arranged in this order in the stacking direction of the base. preferable.

According to the present invention, the chip antenna adopting the "preferred arrangement mode of the grounding conductor" is mounted on the mounting substrate on which the grounding conductor film is formed by cutting out a part of the peripheral region. It is also directed to the structure for. This mounting structure is characterized in that the chip antenna is mounted in the notched region of the ground conductor film on the mounting substrate, with the end surface of the base body on the side where the ground conductor is located facing the mounting substrate side. I am trying.

[0022]

FIG. 1 shows a chip antenna device 1 according to an embodiment of the present invention. The chip antenna device 1 includes a chip antenna 2 shown in a perspective view in FIG. 1 and a matching element 3 shown in a block diagram in FIG. The base body 4 included in the chip antenna 2 is disassembled and shown in a perspective view in FIG.

As shown in FIG. 2, the substrate 4 is composed of a plurality of ceramic layers 5 composed of laminated dielectrics or magnetic materials,
6, 7, 8 and 9. It should be understood that FIG. 2 shows only representative ones of the plurality of ceramic layers included in the substrate 4.

The substrate 4 includes a plurality of radiation conductors 10 and 1.
1 and a ground conductor 12 are provided. Details of the shapes and positions of the radiation conductors 10 and 11 and the ground conductor 12 will be described later.

Further, as shown in FIG. 1, a power supply terminal 13 and a plurality of ground terminals 14 are provided on the outer surface of the base body 4. The matching element 3 is electrically connected to the power supply terminal 13.

One of the radiation conductors 10 and 11, that is, the radiation conductor 10 serves as a power feeding element electrically connected to the power feeding terminal 13, and the remaining radiation conductors 11 are grounding terminals 1.
4 is a parasitic element that is electrically connected to 4. In the following description, the "radiation conductor serving as a feeding element" may be simply referred to as "feeding element", and the "radiation conductor serving as a parasitic element" may be simply referred to as "parasitic element".

The power feeding element 10 is located between the ceramic layers 5 and 6. On the other hand, the parasitic element 11
Are located between the ceramic layers 6 and 7. The ground conductor 12 includes the ceramic layers 7 and 8
Located between and.

The radiating conductors 10 and 11 and the ground conductor 12 are preferably in the form of strips extending along the periphery of the ceramic layers 5-9. Further, in this embodiment, each of the ceramic layers 5 to 9 is rectangular, and the radiating conductors 10 and 11 and the ground conductor 12 are portions that extend in an L shape through the vicinity of specific corners of the ceramic layers 5 to 9. Is equipped with.

The feeding element 10 and the parasitic element 11 are shown in FIG.
It is preferable that the bases 4 are arranged so as to overlap each other in the stacking direction, as shown in FIG.

On the other hand, as shown in FIG. 2, the ground conductor 12 is preferably arranged so as not to overlap the radiation conductors 10 and 11 in the stacking direction of the base 4.

Further, it is preferable that the ground conductor 12 is arranged so as not to position any radiation conductor between the ground conductor 12 and the one end surface 15 of the base body 4 in the laminating direction. More preferably, as shown in FIG. 2, the feeding element 10, the parasitic element 11, and the ground conductor 12 are arranged in this order in the stacking direction of the base 4.

As described above, since the power feeding element 10 and the power feeding terminal 13 are electrically connected, in this embodiment,
The ceramic layer 6 is shown in a broken line and omitted in the drawing.
Via-hole conductors 16 are provided which pass through and 7.
One end of the via-hole conductor 16 is electrically connected to the end of the power feeding element 10, and the other end of the via-hole conductor 16 is electrically connected to the lead conductor 17 formed on the ceramic layer 8. The lead conductor 17 is electrically connected to the power supply terminal 13.

A via-hole conductor 18 penetrating the ceramic layer 7 is provided to electrically connect the parasitic element 11 and the grounding terminal 14 to each other. One end of the via-hole conductor 18 is electrically connected to the end of the parasitic element 11,
The other end of the via-hole conductor 18 is electrically connected to the lead conductor 19 formed on the ceramic layer 8. The lead conductor 19 is electrically connected to the grounding terminal 14.

The ground conductor 12 has a plurality of lead portions 20 and is electrically connected to the plurality of ground terminals 14 via the lead portions 20.

In such a chip antenna 2, since the grounding conductor 12 is built in, the lines of electric force from the radiation conductors 10 and 11 are concentrated on the grounding conductor 12, and the value of the stray capacitance is around the chip antenna 2. It becomes difficult to be influenced by the change of the situation of 1), and the characteristic variation due to the variation of the mounting position of the chip antenna 2 can be reduced.

The trimming conductor 2 is formed on the outer surface of the base body 4, that is, on the end face 21 opposite to the end face 15 described above.
2 and 23 are formed respectively. One trimming conductor 22 is electrically connected to the end portion of the power feeding element 10 via a via hole conductor 24 extending so as to penetrate the ceramic layer 5. The other trimming conductor 23 is electrically connected to the end of the parasitic element 11 via a via-hole conductor 25 extending so as to penetrate the ceramic layers 5 and 6. The trimming conductors 22 and 23 preferably have a strip-like shape.

By trimming the trimming conductors 22 and 23, the substantial lengths of the feed element 10 and the parasitic element 11 can be adjusted, and accordingly, the resonance frequency and impedance of the chip antenna 2 are adjusted. Can be easily adjusted.

In manufacturing the chip antenna 2, a known method for manufacturing a monolithic ceramic electronic component can be applied. That is, a plurality of ceramic green sheets containing raw material powders of dielectric or magnetic ceramics are prepared, and a conductive paste film for the radiation conductor 10 or the like is formed on a specific one of the ceramic green sheets by printing or the like, Via-hole conductor 16
After forming through holes for the like, filling the conductive paste therein, a plurality of ceramic green sheets are laminated, pressure-bonded, and then laminated, whereby the substrate 4 can be obtained. Further, the power supply terminal 13 and the like can be formed by applying and baking a conductive paste on the outer surface of the substrate 4.

FIG. 3 is a block diagram showing the structure of the matching element 3.

Referring to FIG. 3, the matching element 3 is the element 2
A π-type circuit including 6, 27 and 28 is configured.
Elements 26, 27 and 28 are provided by inductors or capacitors. Which one of the elements 26 to 28 is provided by the inductor or the capacitor is selected depending on the situation such as whether the matching element 3 should be a low pass filter or a high pass filter. The element 26 that is connected in series on the wiring from the power supply 29 to the chip antenna 2 is provided by either the inductor or the capacitor, but is grounded.
For either one of 7 and 28, neither the inductor nor the capacitor may be inserted.

As described above, according to the chip antenna apparatus 1 including the chip antenna 2 and the matching element 3, the two elements, the feeding element 10 and the parasitic element 11, and the matching element 3 are provided.
By the action of and, resonance occurs at two frequencies, and if these two resonance frequencies are brought close to each other, a broadband antenna can be realized in one frequency band. On the other hand,
By separating the two resonance frequencies from each other, it is possible to realize a dual-frequency antenna that can be used in two different frequency bands.

The matching element 3 is not limited to the one that constitutes the π-type circuit as described above, but may be one that constitutes another type of circuit such as a T-type circuit.

FIG. 4 shows an example of the mounting structure of the chip antenna device 1 having the chip antenna 2.

On the mounting substrate 30 for mounting the chip antenna 2, a ground conductor film 31 is formed as shown by hatching. The ground conductor film 31 has a peripheral region partially cut away, and the mounting substrate 30 has
A rectangular conductor notch area 32 is formed.

The chip antenna 2 is mounted on the above-mentioned conductor cutout region 32 on the mounting substrate 30. At this time, preferably, one corner of the chip antenna 2 is aligned with one corner of the conductor cutout region 32 so that the two side surfaces of the chip antenna 2 are in contact with the edge of the ground conductor film 31.

Further, in the chip antenna 2 mounted on the mounting board 30, the end surface 15 (see FIGS. 1 and 2) on the side where the ground conductor 12 is located in the stacking direction of the base body 4 faces the mounting board 30 side. To be done. by this,
The above-described action of the grounding conductor 12 built in the base 4 can be more effectively exhibited.

Further, as shown in FIG. 4, the matching element 3 is
It is provided by a chip component and mounted on the ground conductor film 31.

FIG. 5 shows the current distribution in the chip antenna 2 mounted on the mounting substrate 31 and its surroundings. In FIG. 5, the direction of the current is indicated by an arrow.

As shown in FIG. 5, the direction of the current flowing through the strip conductor 33 such as the radiation conductors 10 and 11 and the ground conductor 12 in the chip antenna 2 and the current flowing on the ground conductor film 31 of the mounting substrate 30 are shown. Since the directions are the same and the phases are the same, the chip antenna 2 and the ground conductor film 3
1 does not need to be particularly spaced apart from each other, and as shown in the figure, even if the chip antenna 2 is surrounded by the ground conductor film 31, the characteristics of the chip antenna 2 can be less likely to deteriorate.

This effect is more preferable especially when the conductor 33, that is, the radiation conductors 10 and 11 and the ground conductor 12 are in the form of strips extending along the periphery of the ceramic layers 5 to 9. When it is provided with a portion that extends in an L shape through the vicinity of the corners of ~ 9,
It is more prominent.

Next, experimental examples carried out for confirming various effects of the present invention will be described.

1. Preparation of Sample As shown in Table 1, chip antennas according to each of Examples and Comparative Examples 1 to 3 were prepared.

[0053]

[Table 1]

As shown in Table 1, in the embodiment, the feeding element and the parasitic element are located in different ceramic layers, that is, "separate layers", and the ground conductor is built in.

In Comparative Example 1, the feeding element and the parasitic element are located in the "separate layer", but the ground conductor is not incorporated.

In Comparative Example 2, the feeding element and the parasitic element are located in the same ceramic layer, that is, "in the same layer", and the grounding conductor is built in.

In Comparative Example 3, the feed element and the parasitic element are located "in the same layer", and the ground conductor is not built therein.

In addition, Table 1 shows the length of the feeding element, that is, the "feeding element length", and the length of the parasitic element, that is, the "non-feeding element length".

As can be seen from Table 1, the "feed element length" and the "parasitic element length" are shorter in the built-in type as compared with the type in which the ground conductor is not built-in.

Table 2 shows typical resonance characteristics when the chip antennas according to each of these Examples and Comparative Examples 1 to 3 are mounted on a mounting board.

[0061]

[Table 2]

2. Relationship between Mounting Position Deviation and Characteristics Regarding the chip antennas according to each of the examples and the comparative examples 1 to 3 shown in Tables 1 and 2, the influence of variations in the mounting position on the mounting board on the resonance characteristics of the chip antenna. investigated.

FIG. 6 shows a state in which the chip antenna 2 is mounted on the mounting substrate 30 at a normal position with respect to the ground conductor film 31. 0.2 mm downward when it is displaced 0.2 mm upward from this normal position.
Bandwidth (unit: MHz) at the shifted position, at the shifted position by 0.2 mm to the left, and at the shifted position by 0.2 mm to the right It is shown in Table 3 in comparison with the width, and the band center frequency (unit: MHz) is also shown in Table 4.

[0064]

[Table 3]

[0065]

[Table 4]

Referring to Table 2, Examples and Comparative Examples 1 to 3
And, there is not much difference in bandwidth and efficiency.

On the other hand, as shown in Tables 3 and 4, in Comparative Examples 1 and 3, the band width and the band center frequency are relatively largely varied due to the displacement of the mounting position of the chip antenna. However, according to the embodiment, even if the mounting position of the chip antenna is deviated, the variations in the bandwidth and the band center frequency are relatively small.

Incidentally, comparing the example and the comparative example 2,
In both cases, variations in bandwidth and band center frequency are relatively small. However, in Comparative Example 2,
Since the feed element and the parasitic element are located in the same ceramic layer, that is, “in the same layer”, it can be said that it is inferior to the embodiment in that the chip antenna can be downsized.

3. Relationship between Mounting Position on Mounting Board and Characteristic Table 5 shows the resonance characteristics when the mounting position on the mounting board of the chip antenna according to the embodiment is changed by using a mobile phone size board as the mounting board. There is.

[0070]

[Table 5]

In Table 5, "center of short side of substrate" is shown in FIG.
4 shows the case where the chip antenna 2 is mounted at the position as shown in FIG. 4, the "center of the long side of the substrate" shows the case where the chip antenna 2 is mounted at the position as shown in FIG. 4, and the "substrate angle" is
The case where the chip antenna 2 is mounted in the position as shown in FIG. 8 is shown.

In FIGS. 7 and 8, elements corresponding to those shown in FIG. 4 are designated by the same reference numerals.

Further, in FIG. 4, FIG. 7 and FIG. 8, the unit of the numeral indicating the dimension is “mm”.

The dimensions of the mounted chip antenna 2 were 8 mm in length, 5 mm in width and 0.8 mm in thickness.

From the resonance characteristics shown in Table 5, good resonance characteristics can be obtained even if the mounting board on which the chip antenna is mounted is of a mobile phone size or the mounting position on the mounting board is changed. You can see that you can get it.

In Table 5 and Table 6 shown below,
"VS" in the "Bandwidth" column is VSWR (Volt
age Standing Wave Ratio / voltage standing wave ratio), which indicates a bandwidth at which it is less than 2.

4. Relationship between Distance between Feeding Element and Parasitic Element and Characteristic In the chip antenna according to the example, the resonance characteristics are shown when the distance between the feeding element and the parasitic element is changed within the range of 350 to 950 μm. 6 is shown.

[0078]

[Table 6]

Normally, when two conductors are caused to resonate with each other, the spacing between the conductors is narrowed, the coupling capacitance is increased, the bandwidth is narrowed, and the gain is lowered.

However, according to the chip antenna of the embodiment, as shown in Table 6, even if the distance between the feeding element and the parasitic element is narrowed, the bandwidth is not so narrow and the gain is not so great. It has not dropped.

From this, it is understood that the thickness of the chip antenna can be reduced, and the feed element and the parasitic element can be further miniaturized by arranging them so as to overlap each other in the stacking direction.

[0082]

As described above, according to the chip antenna device of the present invention, the radiation conductor serving as a feed element and the radiation conductor serving as a parasitic element of the chip antenna are located between different ceramic layers. , The ground conductor is located between the ceramic layers different from the ceramic layers in which these radiation conductors are located, and the matching element is electrically connected to the power supply terminal of the chip antenna. It

First, the lines of electric force from the radiating conductor can be concentrated on the ground conductor, so that the value of the stray capacitance is less likely to be affected by changes in the surroundings of the chip antenna, and the mounting position of the chip antenna varies. It is possible to suppress variations in characteristics due to.

Further, when the chip antenna is mounted on the mounting substrate, if the position is along the periphery of the mounting substrate, changing the mounting position does not cause substantial deterioration of the characteristics of the chip antenna. be able to. Therefore, even if the chip antenna is mounted at a position where three of the four side surfaces are surrounded by the ground conductor film or is mounted very close to the ground conductor film, It is possible to prevent substantial deterioration.

As described above, the degree of freedom in the mounting position of the chip antenna is increased, and the degree of freedom in designing the electronic device including the chip antenna is increased, which can contribute to, for example, downsizing of the electronic device.

The above effects are obtained when the radiating conductor and the grounding conductor are in the form of strips extending along the periphery of the ceramic layer, and when the radiating conductor and the grounding conductor pass in the vicinity of the corners of the rectangular ceramic layer, they are L-shaped. When the ground conductor is provided so as to extend so as not to overlap the radiation conductor in the stacking direction of the base body, the ground conductor may be disposed between the end conductor and one end face of the base body in the stacking direction. When the radiation conductor is arranged so as not to be located, further, in the stacking direction of the base body, when the radiation conductor serving as the feeding element, the radiation conductor serving as the parasitic element, and the ground conductor are arranged in this order,
Then, with the end face of the base body on the side where the ground conductor is located facing the mounting substrate side, the chip antenna
When the ground conductor film on the mounting board is mounted in the cutout region, it is more effectively and surely exhibited.

Further, according to the chip antenna device of the present invention, resonance occurs at two frequencies. Therefore, if the two resonance frequencies are brought close to each other, a wide band antenna can be realized in one frequency band. On the other hand, by separating the two resonance frequencies from each other, it is possible to realize a dual-frequency antenna that can be used in two different frequency bands.

In the chip antenna provided in the chip antenna apparatus according to the present invention, the radiation conductor serving as the feeding element and the radiation conductor serving as the parasitic element are not deteriorated in characteristics even if they are arranged so as to overlap in the stacking direction of the bases. Since the radiation conductors serving as the feeding element and the radiation conductors serving as the parasitic element are arranged so as to overlap each other in the stacking direction of the bases, the miniaturization of the chip antenna is advantageous because it is not substantially invited. Can be achieved.

In the chip antenna provided in the chip antenna device according to the present invention, trimming conductors electrically connected to the radiation conductor serving as the feeding element and the radiation conductor serving as the parasitic element are provided on the outer surface of the base. By trimming these trimming conductors,
Adjust the substantial length of the feed element and the parasitic element,
The resonance frequency and impedance of the chip antenna can be adjusted arbitrarily and easily.

If the matching element provided in the chip antenna device according to the present invention is provided by a chip component that constitutes a π-type circuit including an inductor and a capacitor, the chip component itself can be downsized. It is also possible to reduce the size of the chip antenna device as a whole.

[Brief description of drawings]

FIG. 1 shows a chip antenna device 1 according to an embodiment of the present invention, in which a chip antenna 2 included in the chip antenna device 1 is shown in a perspective view, and a matching element 3 is shown in a block diagram.

FIG. 2 is a base body 4 included in the chip antenna 2 shown in FIG.
It is a perspective view which decomposes | disassembles and shows only.

FIG. 3 is a block diagram for explaining a configuration of a matching element 3 shown in FIG.

FIG. 4 is a plan view showing an example of a mounting structure of a chip antenna device 1 including a chip antenna 2.

5 is a plan view schematically showing the current distribution in the chip antenna 2 and its periphery in the mounting structure shown in FIG.

FIG. 6 is a plan view showing a mounting structure of a chip antenna 2 used for explaining the evaluation results shown in Tables 3 and 4 obtained in an experimental example.

FIG. 7 is a plan view showing another example of the mounting structure of the chip antenna device 1 including the chip antenna 2.

FIG. 8 is a plan view showing still another example of the mounting structure of the chip antenna apparatus 1 including the chip antenna 2.

[Explanation of symbols]

1 Chip Antenna Device 2 Chip Antenna 3 Matching Element 4 Bases 5-9 Ceramic Layer 10 Radiating Conductor (Feeding Element) 11 Radiating Conductor (Non-Feeding Element) 12 Grounding Conductor 13 Feeding Terminal 14 Grounding Terminal 15, 21 End Faces 16, 18 , 24, 25 via-hole conductors 17, 19 lead-out conductors 20 lead-out portions 22, 23 trimming conductors 26 to 28 elements provided by inductors or capacitors 29 power supply 30 mounting board 31 grounding conductor film 32 conductor notch area

Claims (10)

[Claims] 1. A chip antenna, and a matching element for adjusting the impedance of the chip antenna, wherein the chip antenna includes a base body including a plurality of ceramic layers made of laminated dielectric or magnetic materials, and A plurality of radiation conductors provided on the base, a ground conductor provided on the base, a power supply terminal provided on the outer surface of the base for feeding the radiation conductor, and provided on the outer surface of the base. And a grounding terminal electrically connected to the grounding conductor, at least one of the radiation conductors is a feeding element electrically connected to the feeding terminal, and the rest of the radiation conductors are It becomes a parasitic element electrically connected to the grounding terminal, and the radiation conductor serving as the feeding element and the radiation conductor serving as the parasitic element are located in different ceramic layers. The chip antenna device, wherein the ground conductor is located between the ceramic layers different from the ceramic layer where the radiation conductor is located, and the matching element is electrically connected to the power supply terminal. 2. The chip antenna device according to claim 1, wherein the radiating conductor and the grounding conductor are strip-shaped extending along the periphery of the ceramic layer. 3. The chip according to claim 2, wherein the ceramic layer has a rectangular shape, and the radiating conductor and the grounding conductor are provided with a portion extending in an L shape passing near a corner of the ceramic layer. Antenna device. 4. The chip according to claim 1, wherein the radiation conductor serving as the feeding element and the radiation conductor serving as the parasitic element are arranged so as to overlap each other in the stacking direction of the base body. Antenna device. 5. The chip antenna device according to claim 1, wherein the ground conductor is arranged so as not to overlap the radiation conductor in the stacking direction of the base. 6. The trimming conductors, which are electrically connected to the radiation conductor serving as the feeding element and the radiation conductor serving as the parasitic element, are provided on the outer surface of the base body. The chip antenna device according to any one of 1. 7. The chip antenna device according to claim 1, wherein the matching element is provided by a chip component forming a π-type circuit including an inductor and a capacitor. 8. The ground conductor according to claim 1, wherein the ground conductor is arranged so as not to position any of the radiation conductors between the ground conductor and one end surface of the base in the stacking direction. Chip antenna device. 9. A radiation conductor serving as the feeding element, a radiation conductor serving as the parasitic element, in the stacking direction of the base body,
The chip antenna device according to claim 8, wherein the chip antenna device is arranged in the order of the ground conductors. 10. The chip antenna provided in the chip antenna device according to claim 8 or 9, wherein the chip antenna is mounted on a mounting substrate on which a ground conductor film is formed by cutting out a part of a peripheral region thereof. In the structure, the chip antenna is provided in a cutout region of the ground conductor film on the mounting substrate while facing the mounting substrate side with the end surface on the side where the ground conductor is located in the stacking direction of the base body. The mounting structure of the chip antenna to be mounted.