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JP2003124269A - Bonding device and bonding tool for electronic components - Google Patents

Bonding device and bonding tool for electronic components

Info

Publication number
JP2003124269A
JP2003124269A JP2001312144A JP2001312144A JP2003124269A JP 2003124269 A JP2003124269 A JP 2003124269A JP 2001312144 A JP2001312144 A JP 2001312144A JP 2001312144 A JP2001312144 A JP 2001312144A JP 2003124269 A JP2003124269 A JP 2003124269A
Authority
JP
Japan
Prior art keywords
groove
horn
fitting member
electronic component
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001312144A
Other languages
Japanese (ja)
Other versions
JP3617485B2 (en
Inventor
誠司 ▲高▼橋
Seiji Takahashi
Kenichi Otake
健一 大竹
Masafumi Hisaku
雅史 檜作
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001312144A priority Critical patent/JP3617485B2/en
Publication of JP2003124269A publication Critical patent/JP2003124269A/en
Application granted granted Critical
Publication of JP3617485B2 publication Critical patent/JP3617485B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/07178

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】 【課題】 ボンディングツールの構成において圧着子締
結用のねじ加工を圧着子に行う必要がなく、安定した形
状精度を確保することができる電子部品のボンディング
装置およびボンディングツールを提供することを目的と
する。 【解決手段】 電子部品を荷重と振動により圧着するボ
ンディングツールにおいて、側面にテーパ面を有し末広
がり形状の圧着子30をホーン15に着脱自在に締結す
る方式として、ホーン15の圧着側にテーパ面を有する
溝を設け、圧着子30をこの溝に当接させた状態で、嵌
合部材34A,36Aをボルト部材33Aによって、ま
た嵌合部材34B,36Bをボルト部材33Bによって
締め付けて、圧着子30をテーパ面を介して固定する方
式を用いる。これにより圧着子30にねじを設けること
なく、安定した形状精度で圧着子30の締結を行える。
PROBLEM TO BE SOLVED: To provide an electronic component bonding apparatus and a bonding tool which can secure stable shape accuracy without requiring a crimping element to be subjected to screw processing for fastening a crimping element in a bonding tool configuration. The purpose is to do. SOLUTION: In a bonding tool for crimping an electronic component by load and vibration, a crimping member 30 having a tapered side surface and a divergent shape is detachably fastened to a horn 15 by using a tapered surface on a crimping side of the horn 15. With the crimping member 30 in contact with the groove, the fitting members 34A and 36A are fastened by the bolt member 33A, and the fitting members 34B and 36B are fastened by the bolt member 33B. Is fixed via a tapered surface. Thus, the crimping device 30 can be fastened with stable shape accuracy without providing the crimping device 30 with a screw.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、フリップチップの
ようなバンプ付き電子部品などの電子部品を基板の電極
などの被接合面にボンディングする電子部品のボンディ
ング装置およびボンディングツールに関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding apparatus and a bonding tool for bonding an electronic component such as an electronic component with a bump such as a flip chip to a surface to be joined such as an electrode of a substrate.

【0002】[0002]

【従来の技術】電子部品を基板の電極などの被接合面に
ボンディングする方法として、超音波圧接を用いる方法
が知られている。この方法は、電子部品を被接合面に対
して押圧しながら電子部品に超音波振動を与え、接合面
を微小に振動させて摩擦を生じさせることにより接合面
を密着させるものである。この方法に用いられるボンデ
ィングツールは、振動発生源である超音波振動子の振動
を電子部品に伝達させる細長形状の棒体であるホーンを
有しており、このホーンに備えられた圧着子によって電
子部品に荷重と振動を作用させながら、電子部品を被接
合面に圧着してボンディングするようになっている。
2. Description of the Related Art As a method of bonding an electronic component to a surface to be bonded such as an electrode of a substrate, a method using ultrasonic pressure welding is known. In this method, ultrasonic vibration is applied to the electronic component while pressing the electronic component against the surfaces to be joined, and the joint surfaces are caused to vibrate slightly to generate friction, thereby bringing the joint surfaces into close contact with each other. The bonding tool used in this method has a horn, which is an elongated rod body that transmits the vibration of an ultrasonic oscillator, which is a vibration source, to electronic components. Electronic components are bonded to the surfaces to be joined by pressure bonding while applying load and vibration to the components.

【0003】圧着子にはボンディング時の負荷(荷重と
振動)が作用するため、繰り返し使用によってその下面
(電子部品の吸着面)が摩耗しやすい。この摩耗が甚し
くなると正常なボンディングを行うことが出来なくなる
ことから、定期的に圧着子を交換せねばならない。この
ため、超音波接合用のボンディングツールでは、ホーン
全体を交換することの無駄を避け、圧着子をホーン本体
に対して着脱可能な別部品としこの別部品のみを交換す
る方法が一般に用いられている。
Since a load (load and vibration) upon bonding acts on the crimping element, its lower surface (adsorption surface of electronic parts) is easily worn by repeated use. If this wear becomes severe, normal bonding cannot be performed, so the crimps must be replaced regularly. Therefore, in a bonding tool for ultrasonic bonding, it is generally used to avoid waste of replacing the entire horn and replace the crimping member with another part that is detachable from the horn body. There is.

【0004】このような圧着子を別部品とする構成の例
として、ホーンに凹状のテーパ面を設け、このテーパ面
に嵌合する凸状のテーパ面を有する圧着子をねじによっ
てホーン本体に締結する方法が知られている。この方法
では、従来は圧着子に内ねじ部を設け、この内ねじ部と
ボルト部材によって圧着子をホーン本体に固定するよう
にしていた。
As an example of a structure in which such a crimping member is provided as a separate component, a concave tapered surface is provided on the horn, and the crimping member having a convex tapered surface that fits into this tapered surface is fastened to the horn body with a screw. It is known how to do it. In this method, conventionally, the crimping member is provided with an internal screw portion, and the crimping member is fixed to the horn body by the internal screw portion and the bolt member.

【0005】[0005]

【発明が解決しようとする課題】しかしながら上記圧着
子に内ねじ部を設ける方法では、セラミック材料などね
じ加工に適さない素材を圧着子の材質として採用するこ
とができないという材質選定上の制約とともに、テーパ
面の加工精度上の制約から締結状態における圧着子のホ
ーンに対する形状精度を確保することが困難であるとい
う問題点があった。
However, in the method of providing the internal threaded portion on the crimping member, there is a restriction on the material selection such that a material such as a ceramic material which is not suitable for screw processing cannot be adopted as the material of the crimping member. There is a problem that it is difficult to secure the shape accuracy of the crimping element in the fastening state with respect to the horn due to restrictions on the processing accuracy of the tapered surface.

【0006】そこで本発明は、ボンディングツールの構
成において圧着子締結用のねじ加工を圧着子に行う必要
がなく、安定した形状精度を確保することができる電子
部品のボンディング装置およびボンディングツールを提
供することを目的とする。
Therefore, the present invention provides a bonding apparatus and a bonding tool for an electronic component which can secure stable shape accuracy without requiring the crimping member to be threaded for fastening the crimping member in the structure of the bonding tool. The purpose is to

【0007】[0007]

【課題を解決するための手段】請求項1記載の電子部品
のボンディング装置は、電子部品に荷重と振動を作用さ
せながらこの電子部品を被接合面に圧着する電子部品の
ボンディング装置であって、前記電子部品に当接するボ
ンディングツールと、このボンディングツールを前記電
子部品に押圧する押圧手段とを備え、前記ボンディング
ツールは、横長のホーンと、このホーンに振動を付与す
る振動子と、前記ホーンの圧着側の表面に前記振動子に
より誘起される定在波振動の腹に相当する位置に左右対
称形状で振動伝播方向に対して直交して設けられた溝
と、この溝の左右両内側面に設けられた第1の面および
第2の面と、前記溝の底面に当接する当接面を有し前記
電子部品に当接する接合作用部から前記当接面に向かっ
て末広がり形状に設けられた圧着子と、この圧着子に設
けられ前記当接面に設けられた凹凸部を溝の底面に設け
られた位置決め用の凹凸部に当接させた状態で前記第1
の面と対向する第3のテーパ面および前記第2の面と対
向する第4のテーパ面と、前記第1の面および第3のテ
ーパ面と当接する第1の嵌合部材と、前記第2の面およ
び第4のテーパ面と当接する第2の嵌合部材と、前記第
1の嵌合部材および第2の嵌合部材をそれぞれホーンに
締結する第1の締め付け手段および第2の締め付け手段
とを備えた。
According to a first aspect of the present invention, there is provided an electronic component bonding apparatus for crimping an electronic component onto a surface to be joined while applying load and vibration to the electronic component. A bonding tool that comes into contact with the electronic component, and a pressing unit that presses the bonding tool against the electronic component, the bonding tool includes a horizontally long horn, a vibrator that applies vibration to the horn, and a horn of the horn. A groove provided in the surface on the crimping side in a position corresponding to the antinode of the standing wave vibration induced by the vibrator in a symmetrical shape and orthogonal to the vibration propagation direction, and on both the left and right inner side surfaces of this groove. The first and second surfaces are provided, and a contact surface that contacts the bottom surface of the groove is provided. And crimping element that is, the first being in contact with the concave-convex portion for positioning is provided an uneven portion provided on the abutting surface is provided on the crimping element on the bottom of the groove
A third tapered surface facing the first surface, a fourth tapered surface facing the second surface, a first fitting member abutting the first surface and the third tapered surface, and 2nd fitting member which contacts the 2nd surface and 4th taper surface, 1st fastening means and 2nd fastening which fasten the said 1st fitting member and 2nd fitting member to a horn, respectively. And means.

【0008】請求項2記載の電子部品のボンディング装
置は、請求項1記載の電子部品のボンディング装置であ
って、前記第1の締め付け手段および第2の締め付け手
段は、前記ホーンの前記溝内に開口した貫通孔と、この
貫通孔内を挿通するボルト部材と、このボルト部材と螺
合して前記第1の嵌合部材および第2の嵌合部材をホー
ンに締結するナット部材である。
An electronic component bonding apparatus according to a second aspect of the invention is the electronic component bonding apparatus according to the first aspect, wherein the first fastening means and the second fastening means are provided in the groove of the horn. They are an open through hole, a bolt member that is inserted through the through hole, and a nut member that is screwed with the bolt member to fasten the first fitting member and the second fitting member to the horn.

【0009】請求項3記載の電子部品のボンディング装
置は、請求項2記載の電子部品のボンディング装置であ
って、前記第1の嵌合部材および第2の嵌合部材に前記
ボルト部材と螺合する内ねじ部が形成されており、第1
の嵌合部材および第2の嵌合部材が前記ナット部材を兼
ねる。
An electronic component bonding apparatus according to a third aspect is the electronic component bonding apparatus according to the second aspect, wherein the bolt member is screwed to the first fitting member and the second fitting member. An inner thread portion is formed to
The fitting member and the second fitting member also serve as the nut member.

【0010】請求項4記載の電子部品のボンディング装
置は、請求項1記載の電子部品のボンディング装置であ
って、前記第1の締め付け手段および第2の締め付け手
段は、前記ホーンの前記溝内に開口して設けられた内ね
じ部と、この内ねじ部に螺合して前記第1の嵌合部材お
よび第2の嵌合部材をホーンに締結するボルト部材であ
る。
An electronic component bonding apparatus according to a fourth aspect is the electronic component bonding apparatus according to the first aspect, wherein the first fastening means and the second fastening means are provided in the groove of the horn. An inner threaded portion provided with an opening, and a bolt member that is screwed into the inner threaded portion and fastens the first fitting member and the second fitting member to the horn.

【0011】請求項5記載の電子部品のボンディング装
置は、請求項1乃至4記載の電子部品のボンディング装
置であって、前記圧着子に接合作用部から前記溝との当
接面まで貫通して設けられた吸着孔を有し、前記当接面
を溝の底面に当接させた状態で、前記吸着孔が前記底面
と当接面との間に介装されたシール部材を介して前記ホ
ーンの内部に設けられた吸引孔と連通する。
An electronic component bonding apparatus according to a fifth aspect of the present invention is the electronic component bonding apparatus according to any one of the first to fourth aspects, in which the crimping member is penetrated from the joining action portion to the contact surface with the groove. The horn has a suction hole provided, and in a state where the contact surface is in contact with the bottom surface of the groove, the horn is provided with a seal member interposed between the bottom surface and the contact surface. It communicates with the suction hole provided inside.

【0012】請求項6記載の電子部品のボンディングツ
ールは、電子部品に荷重と振動を作用させながらこの電
子部品を被接合面に圧着するボンディングツールであっ
て、横長のホーンと、このホーンに振動を付与する振動
子と、前記ホーンの圧着側の表面に前記振動子により誘
起される定在波振動の腹に相当する位置に左右対称形状
で振動伝播方向に対して直交して設けられた溝と、この
溝の左右両内側面に設けられた第1の面および第2の面
と、前記溝の底面に当接する当接面を有し前記電子部品
と当接する接合作用部から前記当接面に向かって末広が
り形状に設けられた圧着子と、この圧着子に設けられ前
記当接面に設けられた凹凸部を溝の底面に設けられた位
置決め用の凹凸部に当接させた状態で前記第1の面と対
向する第3のテーパ面および前記第2の面と対向する第
4のテーパ面と、前記第1の面および第3のテーパ面と
当接する第1の嵌合部材と、前記第2の面および第4の
テーパ面と当接する第2の嵌合部材と、前記第1の嵌合
部材および第2の嵌合部材をそれぞれホーンに締結する
第1の締め付け手段および第2の締め付け手段とを備え
た。
According to a sixth aspect of the present invention, there is provided a bonding tool for an electronic component, which is a bonding tool for crimping the electronic component onto a surface to be joined while applying load and vibration to the electronic component. And a groove provided in a surface corresponding to the antinode of standing wave vibration induced by the vibrator on the surface of the horn on the crimping side in a symmetrical shape and orthogonal to the vibration propagation direction. And a contact surface contacting the bottom surface of the groove, and a contact surface contacting the bottom surface of the groove. In the state where the crimping member provided in a divergent shape toward the surface and the uneven portion provided on the contact surface provided on the crimping member are brought into contact with the positioning unevenness portion provided on the bottom surface of the groove. A third table facing the first surface. A fourth tapered surface facing the surface and the second surface, a first fitting member that abuts the first surface and the third tapered surface, the second surface and the fourth tapered surface A second fitting member that comes into contact with the first fitting member and a second fitting member that fastens the first fitting member and the second fitting member to the horn, respectively.

【0013】請求項7記載の電子部品のボンディングツ
ールは、請求項6記載の電子部品のボンディングツール
であって、前記第1の締め付け手段および第2の締め付
け手段は、前記ホーンの前記溝内に開口した貫通孔と、
この貫通孔内を挿通するボルト部材と、このボルト部材
と螺合して前記第1の嵌合部材および第2の嵌合部材を
ホーンに締結するナット部材である。
An electronic component bonding tool according to a seventh aspect is the electronic component bonding tool according to the sixth aspect, wherein the first fastening means and the second fastening means are provided in the groove of the horn. Through hole opened,
The bolt member is inserted through the through hole, and the nut member is screwed with the bolt member to fasten the first fitting member and the second fitting member to the horn.

【0014】請求項8記載の電子部品のボンディングツ
ールは、請求項7記載の電子部品のボンディングツール
であって、前記第1の嵌合部材および第2の嵌合部材に
前記ボルト部材と螺合する内ねじ部が形成されており、
第1の嵌合部材および第2の嵌合部材が前記ナット部材
を兼ねる。
An electronic part bonding tool according to an eighth aspect is the electronic part bonding tool according to the seventh aspect, wherein the bolt member is screwed to the first fitting member and the second fitting member. The inner thread part is formed,
The first fitting member and the second fitting member also serve as the nut member.

【0015】請求項9記載の電子部品のボンディングツ
ールは、請求項6記載の電子部品のボンディングツール
であって、前記第1の締め付け手段および第2の締め付
け手段は、前記ホーンの前記溝内に開口して設けられた
内ねじ部と、この内ねじ部に螺合して前記第1の嵌合部
材および第2の嵌合部材をホーンに締結するボルト部材
である。
An electronic component bonding tool according to a ninth aspect is the electronic component bonding tool according to the sixth aspect, wherein the first fastening means and the second fastening means are provided in the groove of the horn. An inner threaded portion provided with an opening, and a bolt member that is screwed into the inner threaded portion and fastens the first fitting member and the second fitting member to the horn.

【0016】請求項10記載の電子部品のボンディング
ツールは、請求項6乃至9記載の電子部品のボンディン
グツールであって、前記圧着子に接合作用部から前記溝
との当接面まで貫通して設けられた吸着孔を有し、前記
当接面を溝の底面に当接させた状態で、前記吸着孔が前
記底面と当接面との間に介装されたシール部材を介して
前記ホーンの内部に設けられた吸引孔と連通する。
An electronic component bonding tool according to a tenth aspect of the present invention is the electronic component bonding tool according to any one of the sixth through ninth aspects, wherein the crimping member penetrates from the joining action portion to the contact surface with the groove. The horn has a suction hole provided, and in a state where the contact surface is in contact with the bottom surface of the groove, the horn is provided with a seal member interposed between the bottom surface and the contact surface. It communicates with the suction hole provided inside.

【0017】請求項11記載の電子部品のボンディング
装置は、電子部品に荷重と振動を作用させながらこの電
子部品を被接合面に圧着する電子部品のボンディング装
置であって、前記電子部品に当接するボンディングツー
ルと、このボンディングツールを前記電子部品に押圧す
る押圧手段とを備え、前記ボンディングツールは、横長
のホーンと、このホーンに振動を付与する振動子と、前
記ホーンの圧着側の表面に前記振動子により誘起される
定在波振動の腹に相当する位置に左右対称形状で振動伝
播方向に対して直交して設けられた溝と、この溝の左右
両内側面に設けられた第1の面および第2の面と、前記
溝の底面に当接する当接面を有し前記電子部品と当接す
る接合作用部から前記当接面に向かって末広がり形状に
設けられた圧着子と、この圧着子に設けられ前記当接面
に設けられた凹凸部を溝の底面に設けられた位置決め用
の凹凸部に当接させた状態で前記第1の面と対向する第
3のテーパ面および前記第2の面と対向する第4のテー
パ面と、前記ホーンの溝と反対側の表面に前記定在波振
動の腹に相当する位置を中心として左右対称形状で振動
伝播方向に対して直交して設けられた第1の副溝および
第2の副溝と、前記第1の面および第3のテーパ面と当
接する第1の嵌合部材と、前記第2の面および第4のテ
ーパ面と当接する第2の嵌合部材と、前記第1の副溝お
よび第2の副溝にそれぞれ嵌合する第3の嵌合部材およ
び第4の嵌合部材と、第1の副溝に開口し前記溝まで貫
通する第1の貫通孔および第2の副溝に開口し前記溝ま
で貫通する第2の貫通孔と、前記第1の貫通孔を挿通し
て第1のナット部材と螺合し第1の嵌合部材と第3の嵌
合部材とをホーンに締結する第1のボルト部材と、前記
第2の貫通孔を挿通して第2のナット部材と螺合し第2
の嵌合部材と第4の嵌合部材とをホーンに締結する第2
のボルト部材とを備えた。
An electronic component bonding apparatus according to an eleventh aspect of the present invention is an electronic component bonding apparatus for crimping an electronic component to a surface to be joined while applying a load and vibration to the electronic component, and abutting the electronic component. A bonding tool and a pressing unit that presses the bonding tool against the electronic component are provided, and the bonding tool includes a horizontally long horn, a vibrator that applies vibration to the horn, and a surface on the crimping side of the horn. A groove that is symmetrically formed at a position corresponding to the antinode of standing wave vibration induced by the vibrator and that is orthogonal to the vibration propagation direction, and a first groove provided on both left and right inner side surfaces of the groove. And a second surface and a contact surface that abuts on the bottom surface of the groove, and a crimping element that is provided in a divergent shape from the joining action portion that abuts the electronic component toward the abutting surface. A third tapered surface facing the first surface in a state where the uneven portion provided on the contact surface provided on the pressure contactor is brought into contact with the uneven portion for positioning provided on the bottom surface of the groove. And a fourth taper surface facing the second surface, and a symmetrical shape with respect to the vibration propagation direction on the surface of the horn opposite to the groove, the position being the antinode of the standing wave vibration. First sub-grooves and second sub-grooves provided orthogonally to each other, a first fitting member that abuts the first surface and the third tapered surface, the second surface and the fourth surface. A second fitting member that comes into contact with the tapered surface, a third fitting member and a fourth fitting member that fit into the first sub groove and the second sub groove, respectively, and a first sub groove. A first through hole that is open to the groove and penetrates to the groove; and a second through hole that opens to the second sub-groove and penetrates to the groove; A first bolt member that is inserted through the through hole of the first nut member and is screwed with the first nut member to fasten the first fitting member and the third fitting member to the horn, and the second through hole is inserted. Then, the second nut member is screwed into the second nut member
Second fastening member for fastening the fourth fitting member and the fourth fitting member to the horn
And a bolt member.

【0018】請求項12記載の電子部品のボンディング
装置は、請求項11記載の電子部品のボンディング装置
であって、前記第1の嵌合部材と第3の嵌合部材のうち
のいずれか1つに前記第1のボルト部材と螺合する内ね
じ部が形成され、この内ねじ部が形成された嵌合部材が
前記第1のナット部材を兼ね、前記第2の嵌合部材と第
4の嵌合部材のうちのいずれか1つに前記第2のボルト
部材と螺合する内ねじ部が形成され、この内ねじ部が形
成された嵌合部材が前記第2のナット部材を兼ねる。
An electronic component bonding apparatus according to a twelfth aspect is the electronic component bonding apparatus according to the eleventh aspect, wherein any one of the first fitting member and the third fitting member is used. Is formed with an inner threaded portion that is screwed with the first bolt member, and the fitting member having the inner threaded portion also serves as the first nut member, and the second fitting member and the fourth fitting member are formed. An inner threaded portion that is screwed with the second bolt member is formed on any one of the fitting members, and the fitting member with the inner threaded portion also serves as the second nut member.

【0019】請求項13記載の電子部品のボンディング
装置は、請求項11および12のいずれかに記載の電子
部品のボンディング装置であって、前記圧着子に接合作
用部から前記溝との当接面まで貫通して設けられた吸着
孔を有し、前記当接面を溝の底面に当接させた状態で、
前記吸着孔が前記底面と当接面との間に介装されたシー
ル部材を介して前記ホーンの内部に設けられた吸引孔と
連通する。
An electronic component bonding apparatus according to a thirteenth aspect is the electronic component bonding apparatus according to any one of the eleventh aspect and the twelfth aspect, wherein the contact surface of the crimping member is in contact with the groove from the joining action portion. With a suction hole that penetrates up to, with the contact surface in contact with the bottom surface of the groove,
The suction hole communicates with a suction hole provided inside the horn via a seal member interposed between the bottom surface and the contact surface.

【0020】請求項14記載の電子部品のボンディング
ツールは、電子部品に荷重と振動を作用させながらこの
電子部品を被接合面に圧着するボンディングツールであ
って、横長のホーンと、このホーンに振動を付与する振
動子と、前記ホーンの圧着側の表面に前記振動子により
誘起される定在波振動の腹に相当する位置に左右対称形
状で振動伝播方向に対して直交して設けられた溝と、こ
の溝の左右両内側面に設けられた第1の面および第2の
面と、前記溝の底面に当接する当接面を有し前記電子部
品と当接する接合作用部から前記当接面に向かって末広
がり形状に設けられた圧着子と、この圧着子に設けられ
前記当接面に設けられた凹凸部を溝の底面に設けられた
位置決め用の凹凸部に当接させた状態で前記第1の面と
対向する第3のテーパ面および前記第2の面と対向する
第4のテーパ面と、前記ホーンの溝と反対側の表面に前
記定在波振動の腹に相当する位置を中心として左右対称
形状で振動伝播方向に対して直交して設けられた第1の
副溝および第2の副溝と、前記第1の面および第3のテ
ーパ面と当接する第1の嵌合部材と、前記第2の面およ
び第4のテーパ面と当接する第2の嵌合部材と、前記第
1の副溝および第2の副溝にそれぞれ嵌合する第3の嵌
合部材および第4の嵌合部材と、第1の副溝に開口し前
記溝まで貫通する第1の貫通孔および第2の副溝に開口
し前記溝まで貫通する第2の貫通孔と、前記第1の貫通
孔を挿通して第1のナット部材と螺合し第1の嵌合部材
と第3の嵌合部材とをホーンに締結する第1のボルト部
材と、前記第2の貫通孔を挿通して第2のナット部材と
螺合し第2の嵌合部材と第4の嵌合部材とをホーンに締
結する第2のボルト部材とを備えた。
A bonding tool for an electronic component according to a fourteenth aspect is a bonding tool for crimping an electronic component onto a surface to be bonded while applying a load and a vibration to the electronic component. And a groove provided in a surface corresponding to the antinode of standing wave vibration induced by the vibrator on the surface of the horn on the crimping side in a symmetrical shape and orthogonal to the vibration propagation direction. And a contact surface contacting the bottom surface of the groove, and a contact surface contacting the bottom surface of the groove. In the state where the crimping member provided in a divergent shape toward the surface and the uneven portion provided on the contact surface provided on the crimping member are brought into contact with the positioning unevenness portion provided on the bottom surface of the groove. A third te facing the first surface. A fourth taper surface facing the first surface and the second surface, and a symmetrical shape in the vibration propagation direction on the surface opposite to the groove of the horn, with a position corresponding to the antinode of the standing wave vibration being the center. A first sub-groove and a second sub-groove that are provided orthogonal to each other, a first fitting member that comes into contact with the first surface and the third tapered surface, the second surface and the second A second fitting member that comes into contact with the tapered surface of No. 4, a third fitting member and a fourth fitting member that fit into the first sub-groove and the second sub-groove, respectively; A first through hole that opens to the sub groove and penetrates to the groove, a second through hole that opens to the second sub groove and penetrates to the groove, and a first nut that passes through the first through hole. A first bolt member that is screwed to the member to fasten the first fitting member and the third fitting member to the horn; and the second through hole. Screwed and 2 of the nut member the second engagement member and a fourth engaging member and a second bolt member for fastening the horn.

【0021】請求項15記載の電子部品のボンディング
ツールは、請求項14記載の電子部品のボンディングツ
ールであって、前記第1の嵌合部材と第3の嵌合部材の
うちのいずれか1つに前記第1のボルト部材と螺合する
内ねじ部が形成され、この内ねじ部が形成された嵌合部
材が前記第1のナット部材を兼ね、前記第2の嵌合部材
と第4の嵌合部材のうちのいずれか1つに前記第2のボ
ルト部材と螺合する内ねじ部が形成され、この内ねじ部
が形成された嵌合部材が前記第2のナット部材を兼ね
る。
A bonding tool for an electronic component according to a fifteenth aspect is the bonding tool for an electronic component according to the fourteenth aspect, wherein any one of the first fitting member and the third fitting member is used. Is formed with an inner threaded portion that is screwed with the first bolt member, and the fitting member having the inner threaded portion also serves as the first nut member, and the second fitting member and the fourth fitting member are formed. An inner threaded portion that is screwed with the second bolt member is formed on any one of the fitting members, and the fitting member with the inner threaded portion also serves as the second nut member.

【0022】請求項16記載の電子部品のボンディング
ツールは、請求項14および15のいずれかに記載の電
子部品のボンディングツールであって、前記圧着子に接
合作用部から前記溝との当接面まで貫通して設けられた
吸着孔を有し、前記当接面を溝の底面に当接させた状態
で、前記吸着孔が前記底面と当接面との間に介装された
シール部材を介して前記ホーンの内部に設けられた吸引
孔と連通する。
A bonding tool for an electronic component according to a sixteenth aspect is the bonding tool for an electronic component according to any one of the fourteenth and fifteenth aspects, wherein the contact surface of the crimping member from the joining action portion to the groove is contacted. A sealing member having a suction hole penetrating to the bottom surface of the groove and the suction hole being interposed between the bottom surface and the contact surface. Through a suction hole provided inside the horn.

【0023】本発明によれば、両側に外側に開いたテー
パ面を有する溝の底面に、両側面がテーパ面となった末
広がり形状の圧着子を当接させ、溝のテーパ面と圧着子
の側面のテーパ面との間に嵌合部材を勘合させてホーン
に締結することにより、圧着子にねじ加工を行うことな
く、安定した形状精度を確保して圧着子を締結すること
ができる。
According to the present invention, the bottom end of the groove having the taper surface which is open to the outside on both sides is brought into contact with the crimping member having a diverging shape in which both side surfaces are tapered, and the taper surface of the groove and the crimping member are By fitting the fitting member between the side surface and the taper surface and fastening it to the horn, it is possible to secure the stable shape accuracy and fasten the crimping tool without screwing the crimping tool.

【0024】[0024]

【発明の実施の形態】(実施の形態1)図1は本発明の
実施の形態1の電子部品のボンディング装置の正面図、
図2は本発明の実施の形態1の電子部品のボンディング
ツールの上下反転斜視図、図3は本発明の実施の形態1
の電子部品のボンディングツールの正面図、図4、図
5、図6は本発明の実施の形態1の電子部品のボンディ
ングツールの部分断面図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) FIG. 1 is a front view of a bonding apparatus for electronic parts according to Embodiment 1 of the present invention.
2 is a vertically inverted perspective view of an electronic component bonding tool according to the first embodiment of the present invention, and FIG. 3 is a first embodiment of the present invention.
FIG. 4, FIG. 5, and FIG. 6 are partial cross-sectional views of the bonding tool for electronic components according to Embodiment 1 of the present invention.

【0025】まず、図1を参照して電子部品のボンディ
ング装置の全体構造を説明する。1は支持フレームであ
って、その前面には第1昇降板2と第2昇降板3が昇降
自在に設けられている。第1昇降板2にはシリンダ4が
装着されており、そのロッド5は第2昇降板3に結合さ
れている。第2昇降板3にはボンディングヘッド10が
装着されている。支持フレーム1の上面にはZ軸モータ
6が設けられている。Z軸モータ6は垂直な送りねじ7
を回転させる。送りねじ7は第1昇降板2の背面に設け
られたナット8に螺合している。したがってZ軸モータ
6が駆動して送りねじ7が回転すると、ナット8は送り
ねじ7に沿って上下動し、第1昇降板2や第2昇降板3
も上下動する。
First, the overall structure of the electronic device bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which a first elevating plate 2 and a second elevating plate 3 are vertically movable. A cylinder 4 is mounted on the first lifting plate 2, and a rod 5 of the cylinder 4 is connected to the second lifting plate 3. A bonding head 10 is attached to the second lift plate 3. A Z-axis motor 6 is provided on the upper surface of the support frame 1. Z-axis motor 6 has vertical feed screw 7
To rotate. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first elevating plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 rotates, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3 are moved.
Also moves up and down.

【0026】図1において、上面が電子部品の被接合面
である基板46は基板ホルダ47上に載せられており、
基板ホルダ47はテーブル48上に載せられている。テ
ーブル48は可動テーブルであって、基板46をX方向
やY方向へ水平移動させ、基板46を所定の位置に位置
決めする。テーブル48は電子部品40に対して基板4
6を相対的に移動させる位置決め手段となっている。
In FIG. 1, the substrate 46 whose upper surface is the surface to be joined of the electronic component is placed on the substrate holder 47,
The substrate holder 47 is placed on the table 48. The table 48 is a movable table, and horizontally moves the substrate 46 in the X direction and the Y direction to position the substrate 46 at a predetermined position. The table 48 is the substrate 4 for the electronic component 40.
It is a positioning means for moving the 6 relatively.

【0027】42はカメラであって、一軸テーブル43
に装着されている。44はカメラ42から前方へ延出す
る鏡筒である。カメラ42を一軸テーブル43に沿って
前進させ、鎖線で示すように鏡筒44の先端部をボンデ
ィングツール14の下面に吸着して保持された接合物と
してのバンプ付きの電子部品40と基板46の間に位置
させ、その状態で電子部品40と基板46の位置をカメ
ラ42で観察する。
Reference numeral 42 denotes a camera, which is a uniaxial table 43.
Is attached to. A lens barrel 44 extends forward from the camera 42. The camera 42 is moved forward along the uniaxial table 43, and the tip of the lens barrel 44 is adsorbed and held on the lower surface of the bonding tool 14 as shown by the chain line to hold the bumped electronic component 40 and the substrate 46. The position of the electronic component 40 and the substrate 46 is observed by the camera 42 in this state.

【0028】53は認識部であり、カメラ42で撮像さ
れた電子部品40や基板46の画像を認識してこれらの
位置を検出する。50は主制御部であり、モータ駆動部
51を介してZ軸モータ6すなわちボンディングヘッド
10の昇降動作を制御し、テーブル制御部52を介して
テーブル48すなわち基板46の位置決めを行う。また
主制御部50は、認識部53によって検出された電子部
品40と基板46の位置より、水平面内における両者の
位置ずれを演算し、この位置ずれを補正するようにテー
ブル48を駆動する。さらに主制御部50には、荷重制
御部54と吸引装置56が接続されている。
A recognition unit 53 recognizes the images of the electronic component 40 and the substrate 46 picked up by the camera 42 and detects their positions. Reference numeral 50 denotes a main control unit that controls the vertical movement of the Z-axis motor 6, that is, the bonding head 10 via a motor drive unit 51, and positions the table 48, that is, the substrate 46, via the table control unit 52. Further, the main control unit 50 calculates the positional deviation between the electronic component 40 and the substrate 46 in the horizontal plane from the positions detected by the recognition unit 53, and drives the table 48 so as to correct the positional deviation. Further, the load control unit 54 and the suction device 56 are connected to the main control unit 50.

【0029】押圧手段としてのシリンダ4は、荷重制御
部54を介して主制御部50に接続されており、シリン
ダ4のロッド5の突出力すなわちボンディングツール1
4で電子部品40のバンプを基板46に押し付ける押圧
荷重が制御される。吸引装置56は主制御部50からの
指令によってボンディングツール14による電子部品4
0の吸引・吸引解除を行う。超音波振動子から成る振動
子17は、超音波振動子駆動部55を介して主制御部5
0に接続されており、主制御部50からの指令に従って
超音波振動を行う。
The cylinder 4 as the pressing means is connected to the main control unit 50 via the load control unit 54, and the projection output of the rod 5 of the cylinder 4, that is, the bonding tool 1
At 4, the pressing load for pressing the bump of the electronic component 40 against the substrate 46 is controlled. The suction device 56 receives the command from the main control unit 50, and the electronic component 4 by the bonding tool 14
Performs suction / release of 0. The transducer 17, which is an ultrasonic transducer, is connected to the main controller 5 via the ultrasonic transducer driver 55.
0, and performs ultrasonic vibration according to a command from the main control unit 50.

【0030】ボンディングヘッド10の本体11の下端
部には、ホルダ12が結合されている。ホルダ12には
ブロック13が装着され、ブロック13にはボンディン
グツール14が固定されている。ブロック13の側部の
突部13aは吸引装置56に接続されている。以下、図
2、図3を参照してボンディングツール14について説
明する。
A holder 12 is connected to the lower end of the main body 11 of the bonding head 10. A block 13 is attached to the holder 12, and a bonding tool 14 is fixed to the block 13. The protrusion 13 a on the side of the block 13 is connected to the suction device 56. The bonding tool 14 will be described below with reference to FIGS. 2 and 3.

【0031】図2および図3に示すように、ボンディン
グツール14は横長のホーン15を主体としている。ホ
ーン15は細長形状の棒状体であり、平面視してその両
側部からセンターへ向って次第に幅狭となるテーパ面1
5aを有している。ホーン15の中央部にはテーパ形状
の圧着子30(吸着部)が下方へ突出して着脱自在に装
着されている。
As shown in FIGS. 2 and 3, the bonding tool 14 is mainly composed of a horizontally long horn 15. The horn 15 is an elongated rod-shaped body, and has a tapered surface 1 that gradually narrows from both sides toward the center in plan view.
5a. At the center of the horn 15, a taper-shaped crimping element 30 (suction portion) is attached so as to project downward and be detachable.

【0032】図1において、ブロック13の側面に設け
られた突部13aには吸着パッド19が装着されてい
る。ホーン15には圧着子30の吸着孔32に連通する
真空吸引孔16a,16bが形成されており、吸着パッ
ド19はホーン15の上面の真空吸引孔16bに当接し
ている。したがって吸着パッド19に接続された吸引装
置56(図1)を駆動してエアを吸引することにより、
圧着子30に開口した吸着孔32(図3(b))から真
空吸引し、この圧着子30の下面にバンプ付きの電子部
品40を真空吸着して保持することができる。
In FIG. 1, a suction pad 19 is attached to the protrusion 13a provided on the side surface of the block 13. The horn 15 is formed with vacuum suction holes 16a and 16b which communicate with the suction holes 32 of the crimp 30 and the suction pad 19 is in contact with the vacuum suction hole 16b on the upper surface of the horn 15. Therefore, by driving the suction device 56 (FIG. 1) connected to the suction pad 19 to suck air,
Vacuum suction can be performed from the suction holes 32 (FIG. 3B) opened in the crimping member 30, and the electronic component 40 with bumps can be vacuum-sucked and held on the lower surface of the crimping member 30.

【0033】圧着子30の下端部は接合作用部30a
(図4参照)となっており、圧着子30の曲げ振動と押
圧手段(シリンダ4)の押圧荷重を電子部品40に作用
させる。圧着子30は電子部品40を吸着して保持する
とともに、ボンディング時には接合作用部30aの圧着
面30b(図4参照)が電子部品40の上面に当接して
電子部品40を基板46に対して押圧する。
The lower end portion of the crimping member 30 has a joining action portion 30a.
(See FIG. 4), the bending vibration of the crimping member 30 and the pressing load of the pressing means (cylinder 4) are applied to the electronic component 40. The crimping element 30 adsorbs and holds the electronic component 40, and at the time of bonding, the crimping surface 30b (see FIG. 4) of the joining action portion 30a contacts the upper surface of the electronic component 40 to press the electronic component 40 against the substrate 46. To do.

【0034】圧着子30から等距離隔てられた4ヶ所に
は、リブ15cがホーン15と一体的に設けられてい
る。ブロック13への取り付けバランスを良くするため
に、4個のリブ15cはホーン15のセンターの圧着子
30を中心として平面視して対称に突設されている。ボ
ンディングツール14は、リブ15cに形成された貫通
孔20にボルトを螺入することにより、ブロック13の
下面に着脱自在に装着されている。
Ribs 15c are provided integrally with the horn 15 at four locations equidistant from the crimping piece 30. In order to improve the mounting balance on the block 13, the four ribs 15c are provided so as to project symmetrically with respect to the crimping piece 30 at the center of the horn 15 in a plan view. The bonding tool 14 is detachably mounted on the lower surface of the block 13 by screwing a bolt into the through hole 20 formed in the rib 15c.

【0035】図2において、ホーン15の側端部には振
動付与手段である振動子17が装着されている。振動子
17を駆動することにより、ホーン15には縦振動(ホ
ーン15の長手方向の振動)が付与され、圧着子30は
水平方向a(ホーン15の長手方向)に振動する。図3
(a),(b)に示すように、ホーン15の形状は両端
部から中央部に向かって側面のテーパ面15aおよび上
下面のテーパ面15bを経て順次幅および高さが絞られ
た形状となっている。
In FIG. 2, a vibrator 17 which is a vibration applying means is attached to the side end of the horn 15. By driving the vibrator 17, longitudinal vibration (vibration in the longitudinal direction of the horn 15) is applied to the horn 15, and the crimping element 30 vibrates in the horizontal direction a (the longitudinal direction of the horn 15). Figure 3
As shown in (a) and (b), the horn 15 has a shape in which the width and height are sequentially reduced from both ends toward the center through the side tapered surface 15a and the upper and lower tapered surfaces 15b. Has become.

【0036】これにより、振動子17より圧着子30に
伝達される経路において超音波振動の振幅は増幅され、
圧着子30には振動子17が発振する振幅以上の振動が
伝達され、この振動は圧着面30bを介して電子部品4
0に伝達される。この電子部品40への振動伝達におい
ては、振動子17によってホーン15を介して伝達され
る縦振動のみならず、ホーン15の縦振動によってテー
パ形状の圧着子30に誘起される曲げ振動が重畳して伝
達される。
As a result, the amplitude of ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the crimp 30.
Vibration having an amplitude larger than that of the oscillator 17 is transmitted to the crimping member 30, and this vibration is transmitted through the crimping surface 30b to the electronic component 4
Transmitted to 0. In transmitting the vibration to the electronic component 40, not only the longitudinal vibration transmitted by the vibrator 17 via the horn 15, but also the bending vibration induced in the tapered crimp 30 by the longitudinal vibration of the horn 15 is superimposed. Be transmitted.

【0037】次に図4、図5を参照して圧着子30のホ
ーン15への装着について説明する。ホーン15の下面
側(圧着側)の中心位置、すなわちホーン15に振動子
17により誘起される定在波振動の腹に相当する位置に
は、左右対称形状の溝18が振動伝播方向(ホーン15
の長手方向)に直交する方向(紙面に対して垂直方向)
に設けられている。溝18の左右両内側面は、外側に開
いたテーパ形状の第1のテーパ面(第1の面)18a、
第2のテーパ面(第2の面)18bとなっている。溝1
8の底面18cの中央部には、位置決め用の凹部18d
が設けられており、凹部18dには、ホーン15の内部
に設けられた真空吸引孔16aが開口している。
Next, referring to FIGS. 4 and 5, the mounting of the crimping member 30 on the horn 15 will be described. At the center position of the lower surface side (crimping side) of the horn 15, that is, at the position corresponding to the antinode of the standing wave vibration induced in the horn 15 by the vibrator 17, a groove 18 having a symmetrical shape has a vibration propagation direction (the horn 15).
Direction (the direction perpendicular to the paper surface)
It is provided in. Both left and right inner side surfaces of the groove 18 have a tapered first tapered surface (first surface) 18a, which is open outward.
The second tapered surface (second surface) 18b is formed. Groove 1
In the center of the bottom surface 18c of No. 8, a positioning recess 18d is formed.
Is provided, and a vacuum suction hole 16a provided inside the horn 15 is opened in the recess 18d.

【0038】ホーン15に装着される圧着子30は、電
子部品40に当接する接合作用部30aから溝18の底
面18cに当接する当接面30fに向かって幅が増大す
る末広がり形状となっており、当接面30fには、溝1
8の凹部18dに嵌合する凸部30eが設けられてい
る。なお、凹部18d、凸部30eの凹凸方向を入れ換
えて、溝18側に凸部を、圧着子30側に凹部を設けて
位置決めするようにしてもよい。
The crimp 30 mounted on the horn 15 has a divergent shape in which the width increases from the joining action portion 30a that abuts the electronic component 40 to the abutment surface 30f that abuts the bottom surface 18c of the groove 18. , The contact surface 30f has a groove 1
8 is provided with a convex portion 30e that fits into the concave portion 18d. Alternatively, the concave and convex directions of the concave portion 18d and the convex portion 30e may be reversed, and the convex portion may be provided on the groove 18 side and the concave portion may be provided on the crimping member 30 side for positioning.

【0039】圧着子30には、接合作用部30aから当
接面30fまで貫通する吸着孔32が設けられている。
当接面30fを溝18の底面18cに当接させた状態で
は、吸着孔32は底面18cの凹部18dと当接面30
fの凸部30eとの間に介装されたシール部材31を介
して、ホーン15の内部に設けられた真空吸引孔16a
と連通するようになっている。
The crimp 30 is provided with a suction hole 32 penetrating from the joining action portion 30a to the contact surface 30f.
In the state where the contact surface 30f is in contact with the bottom surface 18c of the groove 18, the suction holes 32 are located in the recess 18d of the bottom surface 18c and the contact surface 30.
A vacuum suction hole 16a provided inside the horn 15 via a seal member 31 interposed between the convex portion 30e of FIG.
It is designed to communicate with.

【0040】圧着子30の両側面は第3のテーパ面30
c、第4のテーパ面30dとなっており、凸部30eを
位置決め用の凹部18dに嵌合させて圧着子30を溝1
8に位置合わせし、当接面30fを溝18の底面18c
に当接させた状態では、第1のテーパ面18aは第3の
テーパ面30cと、また第2のテーパ面18bは第4の
テーパ面30dとそれぞれ対向する。ホーン15の上面
の中央位置には、圧着子30と略対称形状の凸部15d
が設けられており、圧着子30がホーン15に装着され
た状態において、ホーン15の質量分布が振動伝播方向
の中心線について対称に保たれるようになっている。
Both side surfaces of the crimping member 30 have a third taper surface 30.
c and the fourth taper surface 30d, the projection 30e is fitted into the positioning recess 18d, and the crimp 30 is inserted into the groove 1.
8 and the contact surface 30f is the bottom surface 18c of the groove 18.
The first taper surface 18a and the second taper surface 18b face the third taper surface 30c and the fourth taper surface 30d, respectively. At the central position of the upper surface of the horn 15, a convex portion 15d having a substantially symmetrical shape with the crimping member 30 is formed.
Is provided, and the mass distribution of the horn 15 is kept symmetrical with respect to the center line in the vibration propagation direction in the state where the crimp 30 is attached to the horn 15.

【0041】次にホーン15への圧着子30の締結方法
について説明する。ホーン15には、溝18の両側端部
に開口する2つの垂直な貫通孔15eが設けられてお
り、圧着子30をホーン15に締結する際には、図5に
示すように2つの貫通孔15eに第1のボルト部材33
A,第2のボルト部材33Bを上側から挿通させる。そ
して第1のボルト部材33A,第2のボルト部材33B
のねじ部を、それぞれテーパ形状の第1の嵌合部材34
A、第2の嵌合部材34Bの内ねじ部34aと螺合させ
る。
Next, a method of fastening the crimping member 30 to the horn 15 will be described. The horn 15 is provided with two vertical through holes 15e that are open at both ends of the groove 18, and when the crimping member 30 is fastened to the horn 15, as shown in FIG. 15e has a first bolt member 33
A, the second bolt member 33B is inserted from the upper side. Then, the first bolt member 33A and the second bolt member 33B
Of the first fitting member 34 having a tapered shape.
A, it is screwed into the inner threaded portion 34a of the second fitting member 34B.

【0042】これにより、図4に示す第1の嵌合部材3
4Aのテーパ面34b、34cは、第1のテーパ面18
a、第3のテーパ面30cとそれぞれ当接し、また第2
の嵌合部材34Bのテーパ面34d、34eは、第2の
テーパ面18b、第4のテーパ面30dとそれぞれ当接
する。そして第1のボルト部材33A,第2のボルト部
材33Bを所定の締結トルクで締め付けることにより、
圧着子30の当接面30fは溝18の底面18cに所定
の面圧で押圧され、強固な締結が実現される。
As a result, the first fitting member 3 shown in FIG.
4A taper surface 34b, 34c, the first taper surface 18
a, the third taper surface 30c, respectively, and the second
The tapered surfaces 34d and 34e of the fitting member 34B come into contact with the second tapered surface 18b and the fourth tapered surface 30d, respectively. Then, by tightening the first bolt member 33A and the second bolt member 33B with a predetermined tightening torque,
The contact surface 30f of the crimping member 30 is pressed against the bottom surface 18c of the groove 18 with a predetermined surface pressure, and firm fastening is realized.

【0043】この締結状態において、圧着子30のホー
ン15に対する形状精度は、当接面30fが溝18の底
面18cに当接し、さらに凸部30eが凹部18dに嵌
合した状態にあることから、圧着子30は水平方向の位
置ずれや圧着面30bのホーン15に対する平行度のば
らつきを生じることなく正しい姿勢で締結される。ま
た、圧着子30の締結において、圧着子30にはねじ加
工を必要としないことから、セラミックなどねじ加工に
不適な材質をも含めて広い範囲から圧着子30の材質を
選定することができる。
In this fastening state, the shape accuracy of the crimping member 30 with respect to the horn 15 is such that the contact surface 30f is in contact with the bottom surface 18c of the groove 18 and the convex portion 30e is fitted in the concave portion 18d. The crimping member 30 is fastened in a correct posture without causing a positional displacement in the horizontal direction and variation in parallelism of the crimping surface 30b with respect to the horn 15. Further, when the crimping piece 30 is fastened, the crimping piece 30 does not need to be threaded, so that the material of the crimping piece 30 can be selected from a wide range including materials such as ceramics that are not suitable for threading.

【0044】なお、第1の面18a、第2の面18b
は、必ずしも外側に開いたテーパ面である必要はなく、
圧着面30bに対して垂直な垂直面であってもよい。こ
の場合、第1の面18aに当接する第1の嵌合部材34
Aのテーパ面34bならびに、第2の面18bに当接す
る第2の嵌合部材34Bのテーパ面34dも垂直面とな
る。
The first surface 18a and the second surface 18b
Does not have to be a tapered surface that is open to the outside,
It may be a vertical surface that is perpendicular to the crimp surface 30b. In this case, the first fitting member 34 that comes into contact with the first surface 18a
The taper surface 34b of A and the taper surface 34d of the second fitting member 34B that contacts the second surface 18b are also vertical surfaces.

【0045】また、圧着子30をホーン15に締め付け
る方法として、図6に示すような方法を用いてもよい。
図6(a)に示す例では、内ねじ部34aが設けられた
第1の嵌合部材34A、第2の嵌合部材34Bの代わり
に、貫通孔が設けられた第1の嵌合部材34’A、第2
の嵌合部材34’Bを用いる。そして貫通孔15eおよ
び第1の嵌合部材34’A、第2の嵌合部材34’Bを
それぞれ挿通して下方に突出した第1のボルト部材3
3’A、第2のボルト部材33’Bのねじ部を、ナット
部材35と螺合させて締め付けることにより、圧着子3
0をホーン15に締結する。
A method shown in FIG. 6 may be used as a method of fastening the crimping member 30 to the horn 15.
In the example shown in FIG. 6A, instead of the first fitting member 34A and the second fitting member 34B provided with the inner screw portion 34a, the first fitting member 34 provided with a through hole. 'A, second
The fitting member 34'B is used. Then, the first bolt member 3 protruding downward through each of the through holes 15e, the first fitting member 34'A, and the second fitting member 34'B.
3'A, the screw portion of the second bolt member 33'B is screwed into the nut member 35 to be tightened, so that the crimp 3
Fasten 0 to horn 15.

【0046】この例では、貫通孔15eと、第1のボル
ト部材33’A、第2のボルト部材33’Bと、ナット
部材35が、第1の嵌合部材34’A、第2の嵌合部材
34’Bをホーン15に締結する第1の締め付け手段お
よび第2の締め付け手段となっている。なお、図4,図
5に示す例では、第1の嵌合部材34Aおよび第2の嵌
合部材34Bに内ねじ部34aが形成され、第1の嵌合
部材34Aおよび第2の嵌合部材34Bが上記ナット部
材35を兼ねた形となっている。
In this example, the through hole 15e, the first bolt member 33'A, the second bolt member 33'B, and the nut member 35 are connected to the first fitting member 34'A and the second fitting member. It serves as a first fastening means and a second fastening means for fastening the coupling member 34'B to the horn 15. In addition, in the example shown in FIGS. 4 and 5, the first fitting member 34A and the second fitting member 34B are formed with the inner threaded portion 34a, and the first fitting member 34A and the second fitting member 34A are formed. 34B has a shape that also serves as the nut member 35.

【0047】また図6(b)に示す例では、ホーン15
の貫通孔15eの代わりに内ねじ部15’eを設け、第
1のボルト部材33’’A、第2のボルト部材33’’
Bを、第1の嵌合部材34’A、第2の嵌合部材34’
Bに設けられた貫通孔に下方から挿通させ、内ねじ部1
5’eに螺合させるようにしている。この例では、内ね
じ部15’eと、第1のボルト部材33’’A、第2の
ボルト部材33’’Bが、第1の嵌合部材34’A、第
2の嵌合部材34’Bをホーン15に締結する第1の締
め付け手段および第2の締め付け手段となっている。
In the example shown in FIG. 6B, the horn 15
In place of the through hole 15e, the inner screw portion 15′e is provided, and the first bolt member 33 ″ A and the second bolt member 33 ″ are provided.
B is the first fitting member 34'A, the second fitting member 34 '
The internal threaded portion 1 is inserted through the through hole provided in B from below.
5'e is screwed together. In this example, the inner threaded portion 15′e, the first bolt member 33 ″ A, and the second bolt member 33 ″ B are the first fitting member 34′A and the second fitting member 34. It serves as a first fastening means and a second fastening means for fastening the B to the horn 15.

【0048】(実施の形態2)図7,図8は本発明の実
施の形態2の電子部品のボンディングツールの部分断面
図である。図7において、ホーン15の下面側に設けら
れた溝18、圧着子30、シール部材31、第1の嵌合
部材34A、第2の嵌合部材34B、第1のボルト部材
33A,第2のボルト部材33Bは、実施の形態1にお
いて図4に示すものと同様である。
(Second Embodiment) FIGS. 7 and 8 are partial sectional views of a bonding tool for an electronic component according to a second embodiment of the present invention. In FIG. 7, the groove 18 provided on the lower surface side of the horn 15, the crimp 30, the seal member 31, the first fitting member 34A, the second fitting member 34B, the first bolt member 33A, and the second bolt member 33A. Bolt member 33B is similar to that shown in FIG. 4 in the first embodiment.

【0049】ホーン15の上面側(溝18形成面の反対
側)には、凸部15dの両側に定在波振動の腹に相当す
る位置を中心として、第1の副溝15f、第2の副溝1
5gが設けられている。第1の副溝15f、第2の副溝
15gは、いずれも左右対称形状で振動伝播方向に対し
て直交して設けられ、それぞれ外側に開いた1対のテー
パ面15hを有している。第1の副溝15f、第2の副
溝15gの底面には、下面側の溝18まで貫通する第1
の貫通孔15i、第2の貫通孔15jが設けられてい
る。
On the upper surface side of the horn 15 (opposite to the surface on which the groove 18 is formed), the first sub groove 15f and the second auxiliary groove 15f are formed on both sides of the convex portion 15d with the positions corresponding to the antinodes of standing wave vibration as the center. Sub groove 1
5g is provided. Each of the first sub-groove 15f and the second sub-groove 15g has a bilaterally symmetrical shape and is provided orthogonally to the vibration propagation direction, and has a pair of tapered surfaces 15h opened to the outside. The bottom surface of the first sub-groove 15f and the second sub-groove 15g extends to the bottom surface groove 18 through the first sub-groove.
Through holes 15i and second through holes 15j are provided.

【0050】第1の副溝15f、第2の副溝15gに
は、貫通孔36aが設けられたテーパ形状の第3の嵌合
部材36Aおよび第4の嵌合部材36Bが嵌合する。こ
の状態で、図8に示すように第1のボルト部材33Aを
上側から第3の嵌合部材36Aおよび第1の貫通孔15
iを挿通させ、第1の嵌合部材34Aと螺合させて締め
付けることにより、第1の嵌合部材34Aと第3の嵌合
部材36Aはホーン15に締結される。また第2のボル
ト部材33Bを上側から第4の嵌合部材36Bおよび第
2の貫通孔15jを挿通させ、第2の嵌合部材34Bと
螺合させて締め付けることにより、第2の嵌合部材34
Bと第3の嵌合部材36Aはホーン15に締結される。
The first sub-groove 15f and the second sub-groove 15g are fitted with the tapered third fitting member 36A and the fourth fitting member 36B having the through holes 36a. In this state, as shown in FIG. 8, the first bolt member 33A is attached to the third fitting member 36A and the first through hole 15 from the upper side.
The first fitting member 34A and the third fitting member 36A are fastened to the horn 15 by inserting i and screwing it into the first fitting member 34A and tightening it. In addition, the second fitting member 36B is inserted from the upper side through the fourth fitting member 36B and the second through hole 15j, and is screwed and tightened with the second fitting member 34B, whereby the second fitting member 34
B and the third fitting member 36A are fastened to the horn 15.

【0051】この実施の形態2においては、実施の形態
1と同様に形状精度に優れた強固な締結が実現されると
ともに、ホーン15の上面側と下面側にテーパ形状の嵌
合部材を2つづつ配置して締結する構成としていること
から、ホーン15に対して作用する締め付け力は上下均
等となり、締め付けによるホーン15の変形を極力低減
できるという効果を有する。
In the second embodiment, similar to the first embodiment, a strong fastening having excellent shape accuracy is realized, and two tapered fitting members are provided on the upper surface side and the lower surface side of the horn 15. Since they are arranged and fastened to each other, the tightening force acting on the horn 15 becomes uniform in the vertical direction, and the deformation of the horn 15 due to the tightening can be reduced as much as possible.

【0052】なお上記実施の形態においては、第1のボ
ルト部材33A、第2のボルト部材33Bと螺合する内
ねじを、第1の嵌合部材34A、第2の嵌合部材34B
に設けるようにしているが、この内ねじを第3の嵌合部
材36A、第4の嵌合部材36Bに設け、第1のボルト
部材33Aと第2のボルト部材33Bを下から挿入して
固定するようにしてもよい。また、実施の形態1の図6
(a)に示す例と同様に、第1のボルト部材33A、第
2のボルト部材33Bをナット部材35と螺合させて締
め付けるようにしてもよい。図7,図8に示す例では、
第1の嵌合部材34A、第2の嵌合部材34Bが、ナッ
ト部材を兼ねた形となっている。
In the above-described embodiment, the first screw member 33A and the second screw member 33B are screwed into the first screw member 34A and the second screw member 34B.
The inner screw is provided on the third fitting member 36A and the fourth fitting member 36B, and the first bolt member 33A and the second bolt member 33B are inserted from below and fixed. You may do it. Further, FIG. 6 of the first embodiment.
Similar to the example shown in (a), the first bolt member 33A and the second bolt member 33B may be screwed into the nut member 35 and tightened. In the example shown in FIGS. 7 and 8,
The first fitting member 34A and the second fitting member 34B have a shape that doubles as a nut member.

【0053】さらに実施の形態1と同様に、第1の面1
8a、第2の面18bを垂直面としてもよい。この場合
第1の面18aと対称位置にある第1の副溝15fのテ
ーパ面15hならびに第2の面18bと対称位置にある
第2の副溝15gのテーパ面15hも垂直面とすること
が望ましい。
Further, as in the first embodiment, the first surface 1
8a and the second surface 18b may be vertical surfaces. In this case, the taper surface 15h of the first sub-groove 15f located symmetrically to the first surface 18a and the taper surface 15h of the second sub-groove 15g located symmetrically to the second surface 18b may be vertical surfaces. desirable.

【0054】[0054]

【発明の効果】本発明によれば、両側に外側に開いたテ
ーパ面を有する溝の底面に、両側面がテーパ面となった
末広がり形状の圧着子を当接させ、溝のテーパ面と圧着
子の側面のテーパ面との間に嵌合部材を嵌合させてホー
ンに締結するようにしたので、圧着子にねじ加工を行う
ことなく、圧着子を安定した形状精度を確保して締結す
ることができる。
According to the present invention, a divergent crimping member having tapered surfaces on both sides is brought into contact with the bottom surface of a groove having tapered surfaces open on both sides to crimp the taper surface of the groove. Since the fitting member is fitted between the side surface of the child and the taper surface and fastened to the horn, the crimping terminal is fastened with stable shape accuracy without screwing the crimping terminal. be able to.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施の形態1の電子部品のボンディン
グ装置の正面図
FIG. 1 is a front view of an electronic component bonding apparatus according to a first embodiment of the present invention.

【図2】本発明の実施の形態1の電子部品のボンディン
グツールの上下反転斜視図
FIG. 2 is an upside-down perspective view of the bonding tool for electronic components according to the first embodiment of the present invention.

【図3】本発明の実施の形態1の電子部品のボンディン
グツールの正面図
FIG. 3 is a front view of the bonding tool for electronic components according to the first embodiment of the present invention.

【図4】本発明の実施の形態1の電子部品のボンディン
グツールの部分断面図
FIG. 4 is a partial cross-sectional view of a bonding tool for electronic components according to the first embodiment of the present invention.

【図5】本発明の実施の形態1の電子部品のボンディン
グツールの部分断面図
FIG. 5 is a partial cross-sectional view of a bonding tool for electronic components according to the first embodiment of the present invention.

【図6】本発明の実施の形態1の電子部品のボンディン
グツールの部分断面図
FIG. 6 is a partial cross-sectional view of a bonding tool for an electronic component according to the first embodiment of the present invention.

【図7】本発明の実施の形態2の電子部品のボンディン
グツールの部分断面図
FIG. 7 is a partial sectional view of a bonding tool for an electronic component according to a second embodiment of the present invention.

【図8】本発明の実施の形態2の電子部品のボンディン
グツールの部分断面図
FIG. 8 is a partial sectional view of a bonding tool for an electronic component according to a second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

14 ボンディングツール 15 ホーン 16a 吸引孔 17 振動子 18 溝 18a 第1のテーパ面(第1の面) 18b 第2のテーパ面(第2の面) 18c 底面 18d 凹部 30 圧着子(吸着部) 30a 接合作用部 30c 第3のテーパ面 30d 第4のテーパ面 30e 凸部 32 吸着孔 33A 第1のボルト部材 33B 第2のボルト部材 34A 第1の嵌合部材 34B 第2の嵌合部材 14 Bonding tool 15 horn 16a suction hole 17 oscillators 18 grooves 18a First tapered surface (first surface) 18b Second tapered surface (second surface) 18c bottom 18d recess 30 Crimper (Suction part) 30a Joining action part 30c Third tapered surface 30d Fourth tapered surface 30e convex part 32 suction holes 33A First bolt member 33B Second bolt member 34A First fitting member 34B Second fitting member

フロントページの続き (72)発明者 檜作 雅史 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 5F044 PP16 Continued front page    (72) Inventor Masafumi Hinoki             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5F044 PP16

Claims (16)

【特許請求の範囲】[Claims] 【請求項1】電子部品に荷重と振動を作用させながらこ
の電子部品を被接合面に圧着する電子部品のボンディン
グ装置であって、前記電子部品に当接するボンディング
ツールと、このボンディングツールを前記電子部品に押
圧する押圧手段とを備え、前記ボンディングツールは、
横長のホーンと、このホーンに振動を付与する振動子
と、前記ホーンの圧着側の表面に前記振動子により誘起
される定在波振動の腹に相当する位置に左右対称形状で
振動伝播方向に対して直交して設けられた溝と、この溝
の左右両内側面に設けられた第1の面および第2の面
と、前記溝の底面に当接する当接面を有し前記電子部品
に当接する接合作用部から前記当接面に向かって末広が
り形状に設けられた圧着子と、この圧着子に設けられ前
記当接面に設けられた凹凸部を溝の底面に設けられた位
置決め用の凹凸部に当接させた状態で前記第1の面と対
向する第3のテーパ面および前記第2の面と対向する第
4のテーパ面と、前記第1の面および第3のテーパ面と
当接する第1の嵌合部材と、前記第2の面および第4の
テーパ面と当接する第2の嵌合部材と、前記第1の嵌合
部材および第2の嵌合部材をそれぞれホーンに締結する
第1の締め付け手段および第2の締め付け手段とを備え
たことを特徴とする電子部品のボンディング装置。
1. A bonding apparatus for an electronic component, wherein an electronic component is pressure-bonded to a surface to be joined while a load and vibration are applied to the electronic component, the bonding tool being in contact with the electronic component, and the bonding tool being the electronic component. And a pressing means for pressing the component, the bonding tool,
A horizontally long horn, a vibrator that imparts vibration to the horn, and a bilaterally symmetrical shape in the vibration propagation direction at a position corresponding to the antinode of standing wave vibration induced by the vibrator on the pressure-bonding side surface of the horn. The electronic component has a groove provided orthogonal to each other, a first surface and a second surface provided on both left and right inner side surfaces of the groove, and an abutting surface that abuts a bottom surface of the groove. A crimping member provided in a divergent shape toward the abutting surface from the abutting joining action portion, and a concavo-convex portion provided on the abutting surface and provided on the crimping member for positioning provided on the bottom surface of the groove. A third taper surface facing the first surface and a fourth taper surface facing the second surface in the state of being brought into contact with the uneven portion; the first surface and the third taper surface; A first fitting member that abuts, and a first fitting member that abuts the second surface and the fourth tapered surface. And a first tightening means and a second tightening means for respectively fastening the first fitting member and the second fitting member to the horn. apparatus.
【請求項2】前記第1の締め付け手段および第2の締め
付け手段は、前記ホーンの前記溝内に開口した貫通孔
と、この貫通孔内を挿通するボルト部材と、このボルト
部材と螺合して前記第1の嵌合部材および第2の嵌合部
材をホーンに締結するナット部材であることを特徴とす
る請求項1記載の電子部品のボンディング装置。
2. The first tightening means and the second tightening means, a through hole opened in the groove of the horn, a bolt member inserted through the through hole, and screwed with the bolt member. 2. The electronic component bonding apparatus according to claim 1, wherein the first fitting member and the second fitting member are nut members for fastening the horn to the horn.
【請求項3】前記第1の嵌合部材および第2の嵌合部材
に前記ボルト部材と螺合する内ねじ部が形成されてお
り、第1の嵌合部材および第2の嵌合部材が前記ナット
部材を兼ねることを特徴とする請求項2記載の電子部品
のボンディング装置。
3. The first fitting member and the second fitting member are formed with an internal thread portion to be screwed with the bolt member, and the first fitting member and the second fitting member are The electronic component bonding apparatus according to claim 2, which also functions as the nut member.
【請求項4】前記第1の締め付け手段および第2の締め
付け手段は、前記ホーンの前記溝内に開口して設けられ
た内ねじ部と、この内ねじ部に螺合して前記第1の嵌合
部材および第2の嵌合部材をホーンに締結するボルト部
材であることを特徴とする請求項1記載の電子部品のボ
ンディング装置。
4. The first tightening means and the second tightening means have an inner threaded portion provided in the groove of the horn, the inner threaded portion being threadedly engaged with the inner threaded portion. 2. The electronic component bonding apparatus according to claim 1, which is a bolt member for fastening the fitting member and the second fitting member to the horn.
【請求項5】前記圧着子に接合作用部から前記溝との当
接面まで貫通して設けられた吸着孔を有し、前記当接面
を溝の底面に当接させた状態で、前記吸着孔が前記底面
と当接面との間に介装されたシール部材を介して前記ホ
ーンの内部に設けられた吸引孔と連通することを特徴と
する請求項1乃至4記載の電子部品のボンディング装
置。
5. The crimping member has a suction hole penetrating from a joining action portion to a contact surface with the groove, and the contact surface is in contact with a bottom surface of the groove, 5. The electronic component according to claim 1, wherein the suction hole communicates with a suction hole provided inside the horn via a seal member interposed between the bottom surface and the contact surface. Bonding equipment.
【請求項6】電子部品に荷重と振動を作用させながらこ
の電子部品を被接合面に圧着するボンディングツールで
あって、横長のホーンと、このホーンに振動を付与する
振動子と、前記ホーンの圧着側の表面に前記振動子によ
り誘起される定在波振動の腹に相当する位置に左右対称
形状で振動伝播方向に対して直交して設けられた溝と、
この溝の左右両内側面に設けられた第1の面および第2
の面と、前記溝の底面に当接する当接面を有し前記電子
部品と当接する接合作用部から前記当接面に向かって末
広がり形状に設けられた圧着子と、この圧着子に設けら
れ前記当接面に設けられた凹凸部を溝の底面に設けられ
た位置決め用の凹凸部に当接させた状態で前記第1の面
と対向する第3のテーパ面および前記第2の面と対向す
る第4のテーパ面と、前記第1の面および第3のテーパ
面と当接する第1の嵌合部材と、前記第2の面および第
4のテーパ面と当接する第2の嵌合部材と、前記第1の
嵌合部材および第2の嵌合部材をそれぞれホーンに締結
する第1の締め付け手段および第2の締め付け手段とを
備えたことを特徴とする電子部品のボンディングツー
ル。
6. A bonding tool for crimping an electronic component to a surface to be joined while applying load and vibration to the electronic component, which is a horizontally long horn, a vibrator for imparting vibration to the horn, and a horn of the horn. A groove provided on the surface on the pressure-bonding side at a position corresponding to the antinode of standing wave vibration induced by the vibrator and having a symmetrical shape and orthogonal to the vibration propagation direction,
The first surface and the second surface provided on both the left and right inner side surfaces of this groove.
And a crimping member that has a contacting surface that contacts the bottom surface of the groove and is formed in a shape that widens toward the contacting surface from the joining action portion that contacts the electronic component. A third taper surface and a second surface that face the first surface in a state where the uneven portion provided on the contact surface is brought into contact with the uneven portion for positioning provided on the bottom surface of the groove; A fourth tapered surface facing each other, a first fitting member that abuts the first surface and a third tapered surface, and a second fitting that abuts the second surface and a fourth tapered surface. A bonding tool for an electronic component, comprising: a member; and a first fastening means and a second fastening means for fastening the first fitting member and the second fitting member to a horn, respectively.
【請求項7】前記第1の締め付け手段および第2の締め
付け手段は、前記ホーンの前記溝内に開口した貫通孔
と、この貫通孔内を挿通するボルト部材と、このボルト
部材と螺合して前記第1の嵌合部材および第2の嵌合部
材をホーンに締結するナット部材であることを特徴とす
る請求項6記載の電子部品のボンディングツール。
7. The first tightening means and the second tightening means are a through hole opened in the groove of the horn, a bolt member inserted through the through hole, and screwed with the bolt member. 7. The electronic component bonding tool according to claim 6, wherein the nut member is a nut member for fastening the first fitting member and the second fitting member to a horn.
【請求項8】前記第1の嵌合部材および第2の嵌合部材
に前記ボルト部材と螺合する内ねじ部が形成されてお
り、第1の嵌合部材および第2の嵌合部材が前記ナット
部材を兼ねることを特徴とする請求項7記載の電子部品
のボンディングツール。
8. The first fitting member and the second fitting member are formed with an internal thread portion to be screwed with the bolt member, and the first fitting member and the second fitting member are The electronic component bonding tool according to claim 7, which also functions as the nut member.
【請求項9】前記第1の締め付け手段および第2の締め
付け手段は、前記ホーンの前記溝内に開口して設けられ
た内ねじ部と、この内ねじ部に螺合して前記第1の嵌合
部材および第2の嵌合部材をホーンに締結するボルト部
材であることを特徴とする請求項6記載の電子部品のボ
ンディングツール。
9. The first tightening means and the second tightening means are provided with an inner threaded portion provided to open in the groove of the horn and the first threaded portion screwed into the inner threaded portion. The electronic component bonding tool according to claim 6, which is a bolt member for fastening the fitting member and the second fitting member to the horn.
【請求項10】前記圧着子に接合作用部から前記溝との
当接面まで貫通して設けられた吸着孔を有し、前記当接
面を溝の底面に当接させた状態で、前記吸着孔が前記底
面と当接面との間に介装されたシール部材を介して前記
ホーンの内部に設けられた吸引孔と連通することを特徴
とする請求項6乃至9記載の電子部品のボンディングツ
ール。
10. The crimping member has a suction hole penetrating from a joining action portion to a contact surface with the groove, wherein the contact surface is in contact with the bottom surface of the groove. 10. The electronic component according to claim 6, wherein the suction hole communicates with a suction hole provided inside the horn through a seal member interposed between the bottom surface and the contact surface. Bonding tool.
【請求項11】電子部品に荷重と振動を作用させながら
この電子部品を被接合面に圧着する電子部品のボンディ
ング装置であって、前記電子部品に当接するボンディン
グツールと、このボンディングツールを前記電子部品に
押圧する押圧手段とを備え、前記ボンディングツール
は、横長のホーンと、このホーンに振動を付与する振動
子と、前記ホーンの圧着側の表面に前記振動子により誘
起される定在波振動の腹に相当する位置に左右対称形状
で振動伝播方向に対して直交して設けられた溝と、この
溝の左右両内側面に設けられた第1の面および第2の面
と、前記溝の底面に当接する当接面を有し前記電子部品
と当接する接合作用部から前記当接面に向かって末広が
り形状に設けられた圧着子と、この圧着子に設けられ前
記当接面に設けられた凹凸部を溝の底面に設けられた位
置決め用の凹凸部に当接させた状態で前記第1の面と対
向する第3のテーパ面および前記第2の面と対向する第
4のテーパ面と、前記ホーンの溝と反対側の表面に前記
定在波振動の腹に相当する位置を中心として左右対称形
状で振動伝播方向に対して直交して設けられた第1の副
溝および第2の副溝と、前記第1の面および第3のテー
パ面と当接する第1の嵌合部材と、前記第2の面および
第4のテーパ面と当接する第2の嵌合部材と、前記第1
の副溝および第2の副溝にそれぞれ嵌合する第3の嵌合
部材および第4の嵌合部材と、第1の副溝に開口し前記
溝まで貫通する第1の貫通孔および第2の副溝に開口し
前記溝まで貫通する第2の貫通孔と、前記第1の貫通孔
を挿通して第1のナット部材と螺合し第1の嵌合部材と
第3の嵌合部材とをホーンに締結する第1のボルト部材
と、前記第2の貫通孔を挿通して第2のナット部材と螺
合し第2の嵌合部材と第4の嵌合部材とをホーンに締結
する第2のボルト部材とを備えたことを特徴とする電子
部品のボンディング装置。
11. A bonding apparatus for an electronic component, wherein an electronic component is pressure-bonded to a surface to be joined while applying load and vibration to the electronic component, the bonding tool being in contact with the electronic component, and the bonding tool being the electronic component. The bonding tool includes a pressing means for pressing a component, the bonding tool includes a horizontally long horn, a vibrator that imparts vibration to the horn, and a standing wave vibration induced by the vibrator on a pressure-bonding side surface of the horn. A groove that is symmetrically formed at a position corresponding to the antinode of the groove and that is orthogonal to the vibration propagation direction; a first surface and a second surface that are provided on both left and right inner side surfaces of the groove; A crimping member that has a contacting surface that abuts the bottom surface of the crimping member and that is formed in a shape that spreads toward the abutting surface from a joining action portion that abuts the electronic component; Be A third taper surface facing the first surface and a fourth taper surface facing the second surface in a state where the uneven portion is brought into contact with the uneven portion for positioning provided on the bottom surface of the groove; A first sub-groove and a second sub-groove, which are symmetrically formed on the surface of the horn opposite to the groove on the side corresponding to the antinode of the standing wave vibration and are orthogonal to the vibration propagation direction. A sub-groove, a first fitting member that comes into contact with the first surface and the third tapered surface, a second fitting member that comes into contact with the second surface and the fourth tapered surface, and 1
A third fitting member and a fourth fitting member respectively fitted in the sub groove and the second sub groove, and a first through hole and a second through hole which are opened in the first sub groove and penetrate to the groove. A second through hole that opens in the sub groove and penetrates to the groove, and a first fitting member and a third fitting member that are inserted through the first through hole and screwed together with the first nut member. And a first bolt member that fastens to the horn, and a second nut member that is inserted through the second through hole and screwed into the second nut member to fasten the second fitting member and the fourth fitting member to the horn. And a second bolt member for the electronic component bonding apparatus.
【請求項12】前記第1の嵌合部材と第3の嵌合部材の
うちのいずれか1つに前記第1のボルト部材と螺合する
内ねじ部が形成され、この内ねじ部が形成された嵌合部
材が前記第1のナット部材を兼ね、前記第2の嵌合部材
と第4の嵌合部材のうちのいずれか1つに前記第2のボ
ルト部材と螺合する内ねじ部が形成され、この内ねじ部
が形成された嵌合部材が前記第2のナット部材を兼ねる
ことを特徴とする請求項11記載の電子部品のボンディ
ング装置。
12. An inner threaded portion that is screwed into the first bolt member is formed on any one of the first fitting member and the third fitting member, and the inner threaded portion is formed. The fitted fitting member also serves as the first nut member, and an inner threaded portion for screwing the second bolt member into any one of the second fitting member and the fourth fitting member. The electronic component bonding apparatus according to claim 11, wherein the fitting member having the inner threaded portion also serves as the second nut member.
【請求項13】前記圧着子に接合作用部から前記溝との
当接面まで貫通して設けられた吸着孔を有し、前記当接
面を溝の底面に当接させた状態で、前記吸着孔が前記底
面と当接面との間に介装されたシール部材を介して前記
ホーンの内部に設けられた吸引孔と連通することを特徴
とする請求項11および12のいずれかに記載の電子部
品のボンディング装置。
13. The crimping member has a suction hole penetrating from a joining action portion to a contact surface with the groove, wherein the contact surface is in contact with the bottom surface of the groove. 13. The suction hole communicates with a suction hole provided inside the horn via a seal member interposed between the bottom surface and the contact surface, according to claim 11. Electronic component bonding equipment.
【請求項14】電子部品に荷重と振動を作用させながら
この電子部品を被接合面に圧着するボンディングツール
であって、横長のホーンと、このホーンに振動を付与す
る振動子と、前記ホーンの圧着側の表面に前記振動子に
より誘起される定在波振動の腹に相当する位置に左右対
称形状で振動伝播方向に対して直交して設けられた溝
と、この溝の左右両内側面に設けられた第1の面および
第2の面と、前記溝の底面に当接する当接面を有し前記
電子部品と当接する接合作用部から前記当接面に向かっ
て末広がり形状に設けられた圧着子と、この圧着子に設
けられ前記当接面に設けられた凹凸部を溝の底面に設け
られた位置決め用の凹凸部に当接させた状態で前記第1
の面と対向する第3のテーパ面および前記第2の面と対
向する第4のテーパ面と、前記ホーンの溝と反対側の表
面に前記定在波振動の腹に相当する位置を中心として左
右対称形状で振動伝播方向に対して直交して設けられた
第1の副溝および第2の副溝と、前記第1の面および第
3のテーパ面と当接する第1の嵌合部材と、前記第2の
面および第4のテーパ面と当接する第2の嵌合部材と、
前記第1の副溝および第2の副溝にそれぞれ嵌合する第
3の嵌合部材および第4の嵌合部材と、第1の副溝に開
口し前記溝まで貫通する第1の貫通孔および第2の副溝
に開口し前記溝まで貫通する第2の貫通孔と、前記第1
の貫通孔を挿通して第1のナット部材と螺合し第1の嵌
合部材と第3の嵌合部材とをホーンに締結する第1のボ
ルト部材と、前記第2の貫通孔を挿通して第2のナット
部材と螺合し第2の嵌合部材と第4の嵌合部材とをホー
ンに締結する第2のボルト部材とを備えたことを特徴と
する電子部品のボンディングツール。
14. A bonding tool for crimping an electronic component to a surface to be joined while applying load and vibration to the electronic component, which is a horizontally long horn, a vibrator for imparting vibration to the horn, and a horn of the horn. A groove provided in the surface on the crimping side in a position corresponding to the antinode of the standing wave vibration induced by the vibrator in a symmetrical shape and orthogonal to the vibration propagation direction, and on both the left and right inner side surfaces of this groove. The first and second surfaces are provided, and a contact surface that abuts the bottom surface of the groove is provided. The crimping piece and the first concave and convex portion provided on the abutting surface of the crimping piece are brought into contact with the concave and convex portion for positioning provided on the bottom surface of the groove.
With a third taper surface facing the surface and a fourth taper surface facing the second surface, and a position corresponding to the antinode of the standing wave vibration on the surface of the horn opposite to the groove. A first sub-groove and a second sub-groove that are symmetrically formed and are orthogonal to the vibration propagation direction; and a first fitting member that comes into contact with the first surface and the third tapered surface. A second fitting member that comes into contact with the second surface and the fourth tapered surface,
A third fitting member and a fourth fitting member which are fitted into the first sub-groove and the second sub-groove, respectively, and a first through hole which is opened in the first sub-groove and penetrates to the groove. And a second through hole that opens in the second sub-groove and penetrates to the groove;
A first bolt member that is inserted through the through hole of the first nut member and is screwed with the first nut member to fasten the first fitting member and the third fitting member to the horn, and the second through hole is inserted. And a second bolt member for screwing together with the second nut member to fasten the second fitting member and the fourth fitting member to the horn.
【請求項15】前記第1の嵌合部材と第3の嵌合部材の
うちのいずれか1つに前記第1のボルト部材と螺合する
内ねじ部が形成され、この内ねじ部が形成された嵌合部
材が前記第1のナット部材を兼ね、前記第2の嵌合部材
と第4の嵌合部材のうちのいずれか1つに前記第2のボ
ルト部材と螺合する内ねじ部が形成され、この内ねじ部
が形成された嵌合部材が前記第2のナット部材を兼ねる
ことを特徴とする請求項14記載の電子部品のボンディ
ングツール。
15. An inner threaded portion that is screwed with the first bolt member is formed on any one of the first fitting member and the third fitting member, and the inner threaded portion is formed. The fitted fitting member also serves as the first nut member, and an inner threaded portion for screwing the second bolt member into any one of the second fitting member and the fourth fitting member. 15. The electronic component bonding tool according to claim 14, wherein the fitting member having the internal threaded portion also serves as the second nut member.
【請求項16】前記圧着子に接合作用部から前記溝との
当接面まで貫通して設けられた吸着孔を有し、前記当接
面を溝の底面に当接させた状態で、前記吸着孔が前記底
面と当接面との間に介装されたシール部材を介して前記
ホーンの内部に設けられた吸引孔と連通することを特徴
とする請求項14および15のいずれかに記載の電子部
品のボンディングツール。
16. The crimping member has a suction hole penetrating from a joining action portion to a contact surface with the groove, wherein the contact surface is in contact with the bottom surface of the groove. The suction hole communicates with a suction hole provided inside the horn through a seal member interposed between the bottom surface and the contact surface. Electronic component bonding tool.
JP2001312144A 2001-10-10 2001-10-10 Electronic component bonding apparatus and bonding tool Expired - Fee Related JP3617485B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001312144A JP3617485B2 (en) 2001-10-10 2001-10-10 Electronic component bonding apparatus and bonding tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001312144A JP3617485B2 (en) 2001-10-10 2001-10-10 Electronic component bonding apparatus and bonding tool

Publications (2)

Publication Number Publication Date
JP2003124269A true JP2003124269A (en) 2003-04-25
JP3617485B2 JP3617485B2 (en) 2005-02-02

Family

ID=19130850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001312144A Expired - Fee Related JP3617485B2 (en) 2001-10-10 2001-10-10 Electronic component bonding apparatus and bonding tool

Country Status (1)

Country Link
JP (1) JP3617485B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7508115B2 (en) 2005-12-28 2009-03-24 Tdk Corporation Horn, horn unit, and bonding apparatus using same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7508115B2 (en) 2005-12-28 2009-03-24 Tdk Corporation Horn, horn unit, and bonding apparatus using same

Also Published As

Publication number Publication date
JP3617485B2 (en) 2005-02-02

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