JP2003119249A - Liquid crystal sealing resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal sealing resin composition which has solved the conventional problems in the preparation of liquid crystal display panels such as liquid crystal injection time, deterioration in adhesion to glass substrates due to the thermal strain by high temperatures, misregistration, variability of gaps, and oozing from an end-sealing medium at the liquid crystal injection part, and is suited in the liquid crystal dropping system. SOLUTION: The liquid crystal sealing resin composition which is used comprises (1) a specified elastomer, (2) a compound having at least one epoxy group and at least one vinyl group per molecule, (3) a (meth)acrylate monomer and/or its oligomer, (4) an epoxy resin, (5) a curing agent, and (6) a photoinitiator.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal encapsulating resin composition, and more particularly to a liquid crystal encapsulating resin composition which can be cured at a low temperature and which is compatible with a liquid crystal dropping method. .

[0002]

2. Description of the Related Art In a current liquid crystal display panel, a main sealant is applied on one glass substrate to be bonded so as to form a liquid crystal injection hole, the other glass substrate is stacked and bonded by heat curing. After that, liquid crystal is injected through a liquid crystal injection hole in a vacuum, and the liquid crystal injection portion is sealed with an ultraviolet curable end sealant.

In the above-mentioned method of manufacturing a liquid crystal display panel, the process time for injecting liquid crystal is long, and the method for heat curing is 150.
Decrease in adhesion of glass substrate due to thermal strain due to high temperature around ℃
There are problems such as misalignment, gap variation, and seepage from the end sealant in the liquid crystal injection part.

As a method for solving these problems, a photo-curable acrylic adhesive containing an acrylic acid ester or a methacrylic acid ester as a main component, a photo-curable epoxy adhesive, a partially acrylated or partially methacrylic acid of a novolac type epoxy resin is used. There has been proposed a combination of photo-curing and heat-curing, which are mainly composed of a compound. These photo-curable sealants are liquid crystal dripping type sealants that are exposed to light at room temperature.
Since it cures in a short time to shorten the panel manufacturing process time and the liquid crystal glass substrate is quickly fixed, the above problems of the panel manufacturing method using the thermosetting epoxy resin are solved.

However, physical properties that satisfy the requirements such as the originally required adhesiveness, the reliability of adhesion when left at high temperature and high humidity for a long time, the maintenance of electro-optical characteristics of liquid crystal, and the prevention of alignment disorder are obtained. Has not been done.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to select a composition which is most suitable as a liquid crystal dropping type sealant and further optimize the composition ratio to obtain a high quality liquid crystal display panel in a short time. An object of the present invention is to provide a sealant composition which is manufactured to solve the above problems.

[0007]

Means for Solving the Problems As a result of studies to solve the problems of the present invention, the present inventors have found that (1) elastomer 5 to 30% by mass, (2) epoxy group in one molecule. And a compound having at least one vinyl group 10 to 50% by mass, (3) (meth) acrylate monomer and / or oligomer 5 to 30% by mass, (4) epoxy resin 5 to 30% by mass, (5) curing agent The above problem was solved by using a resin composition for liquid crystal encapsulation consisting of 1 to 20% by mass and (7) 0.1 to 5% by mass of a photoinitiator.

Further, preferably, the elastomer is in the form of particles, the particle diameter is 0.1 to 5 μm, and the elastomer is an epoxy (meth) acrylate obtained by reacting an epoxy resin with (meth) acrylic acid. An elastomer obtained by copolymerizing a copolymerizable (meth) acrylic monomer, and a compound having at least one epoxy group and at least one vinyl group in one molecule is preferably obtained by reacting an epoxy resin with (meth) acrylic acid. By using the obtained epoxy (meth) acrylate resin composition for liquid crystal encapsulation, it has succeeded in obtaining even better results.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The encapsulating resin composition used in the present invention will be described in detail below. The (1) elastomer used in the present invention will be described. The elastomer used in the present invention is not particularly limited, but is preferably obtained by copolymerizing with an acrylic monomer copolymerizable with an epoxy (meth) acrylate obtained by reacting an epoxy resin with (meth) acrylic acid. Spherical elastomer is used.

Epoxy resin used in the present invention and (meth)
An elastomer obtained by copolymerizing an acrylic monomer capable of being copolymerized with an epoxy (meth) acrylate obtained by reacting acrylic acid has an elastomer uniformly dispersed in a resin layer after a sealing resin is cured. , So-called sea / island structure.

As a method for dispersing the elastomer particles, the elastomer particles may be dispersed in an epoxy resin, or may be dissolved in the epoxy resin and then precipitated during curing. A method of forming an elastomer in the presence of a graft copolymer with an epoxy resin may be used. Preferably, a method of easily controlling the particle size of the elastomer, such as a method of forming an elastomer in the presence of a graft copolymer with an epoxy resin or a graft copolymer with an epoxy resin, is preferable. These methods are methods in which the elastomer and the epoxy resin have an interaction with each other and are stably dispersed. If there is no interaction at the interface between the elastomer and the epoxy resin, it easily aggregates after curing and it is difficult to maintain high reliability. Further, since the elastomer is appropriately crosslinked, the elastomer particles are less likely to be deformed even by stress due to curing, which is even better.

The particle size of the elastomer used in the present invention is 0.1 to 5 μm, preferably 0.2.
Elastomers having a so-called sea / island structure dispersed in particles of ˜2 μm are preferable. Maintaining coating workability by setting the average particle size to 0.1 μm or more,
When the thickness is 5 μm or less, high adhesion reliability can be obtained. The amount of the elastomer used is preferably 5 to 20% by mass. High adhesion reliability is exhibited by using 5 mass% or more, and coating suitability is secured by using 20 mass% or less.

The compound (2) having at least one epoxy group and at least one vinyl group in one molecule used in the present invention will be explained. The compound (2) having at least one epoxy group and at least one vinyl group in one molecule used in the present invention is a part (meth) acryl of a glycidyl group of a copolymer using glycidyl (meth) acrylate as a comonomer. Although an acid-modified compound or the like can be used, epoxy (meth) acrylate obtained by reacting an epoxy resin with (meth) acrylic acid is preferable.

The epoxy resin is not particularly limited except that it is an epoxy resin having two or more epoxy groups. A specific example will be described below.

For example, polyalkylene glycols such as ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol and polypropylene glycol, dimethylolpropane, trimethylolpropane, spiroglycol, glycerin and the like. And an aromatic diol represented by bisphenol A, bisphenol S, bisphenol F, bisphenol AD, and the like, and ethylene glycol Aromatic polyhydric glycols obtained by the reaction of epichlorohydrin with alkylene glycol-modified diols such as propylene glycol Jill ether compounds, adipic acid, aliphatic obtained by a reaction of aliphatic dicarboxylic acids and epichlorohydrin, represented by such as itaconic acid polyglycidyl ester compounds, isophthalic acid, terephthalic acid,
Aromatic polyvalent glycidyl ester compound obtained by reaction of aromatic dicarboxylic acid represented by pyromellitic acid and epichlorohydrin, aliphatic polyvalent glycidyl ether ester compound obtained by reaction of hydroxydicarboxylic acid compound and epichlorohydrin Or an aromatic polyvalent glycidyl ether ester compound, other, alicyclic polyvalent glycidyl ether compound, an aliphatic polyvalent glycidyl amine compound obtained by the reaction of an aliphatic diamine represented by polyethylene diamine and the like with epichlorohydrin, diaminodiphenylmethane , Aniline, aromatic polyvalent glycidylamine compounds obtained by the reaction of aromatic diamines represented by metaxylylenediamine and the like with epichlorohydrin,
Hydantoin-type polyhydric glycidyl compounds obtained by reaction of hydantoin and its derivatives with epichlorohydrin, novolak resins derived from phenol or cresol and formaldehyde, polyphenols represented by polyalkenylphenol and its copolymers, and epichlorohydrin Novolak-type polyvalent glycidyl ether compound obtained by the reaction, epoxidized diene polymer such as epoxidized polybutadiene and epoxidized polyisoprene, 3,4-epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methyl Specific examples include cyclohexane carbonate and bis (2,3-epoxycyclopentyl) ether.

It is preferable to use these epoxy resins that have been highly purified by a molecular distillation method or the like.

By using an epoxy resin selected from these, 0.4 to 0.9 equivalent of (meth) acrylic acid is reacted with 1 equivalent of an epoxy group under a basic catalyst to form a partial (meth). An acrylated epoxy resin is obtained.

The epoxy (meth) acrylate obtained by reacting these epoxy resins with (meth) acrylic acid is
By being partially (meth) acrylicized, compatibility with the epoxy resin becomes high, and high adhesion reliability can be obtained. The amount of the epoxy (meth) acrylate obtained by reacting these epoxy resins with (meth) acrylic acid is 10 to 50% by mass in the liquid crystal encapsulating resin composition. 10 mass%
With the above-mentioned use, high adhesion reliability is exhibited and the high temperature and high humidity reliability is exhibited by setting it to 50% or less.

The (3) acrylate monomer and / or oligomer used in the present invention will be described. (Meth) acrylate monomer used in the present invention and /
Alternatively, the oligomer is not particularly limited, and a known material can be used. Specific examples include the following.

Examples of the monofunctional (meth) acrylate include, as a substituent, a methyl group, an ethyl group, a propyl group, a butyl group, an amyl group, a 2-ethylhexyl group, an octyl group, a nonyl group, a dodecyl group, a hexadecyl group and an octadecyl group. , Cyclohexyl group, benzyl group, methoxyethyl group, butoxyethyl group, phenoxyethyl group, nonylphenoxyethyl group, tetrahydrofurfuryl group, glycidyl group, 2-hydroxyethyl group, 2-hydroxypropyl group, 3-chloro-2- Hydroxypropyl group, dimethylaminoethyl group, diethylaminoethyl group, nonylphenoxyethyltetrahydrofurfuryl group, caprolactone-modified tetrahydrofurfuryl group, isobornyl group, dicyclopentanyl group, dicyclopentenyl group, dicyclopentenyloxy group And (meth) acrylate having an ethyl group.

Examples of polyfunctional (meth) acrylates are 1,3-butylene glycol, 1,4-butanediol, 1,5-pentanediol and 3-methyl-1,5.
-Pentanediol, 1,6-hexanediol, neopentyl glycol, 1,8-octanediol, 1,
9-nonanediol, tricyclodecane dimethanol,
Diacrylate such as ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, di (meth) acrylate of tris (2-hydroxyethyl) isocyanurate, and 4 mol or more of ethylene oxide or propylene oxide added to 1 mol of neopentyl glycol. The obtained diol di (meth) acrylate, diol di (meth) acrylate obtained by adding 2 moles of ethylene oxide or propylene oxide to 1 mole of bisphenol A, 3 moles or more of ethylene oxide or 1 mole of trimethylolpropane, or Diol or tri (meth) acrylate of triol obtained by adding propylene oxide, 4 mol or more of ethylene oxide or propylene oxide per 1 mol of bisphenol A Diol di (meth) acrylate / tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate / dipentaerythritol Poly (meth) acrylate / caprolactone-modified tris [(meth) acryloxyethyl] isocyanurate, alkyl-modified dipentaerythritol poly (meth) acrylate, caprolactone-modified dipentaerythritol poly (meth) acrylate / hydroxypivalic acid, neo Pentyl glycol diacrylate, caprolactone modified hydroxypivalic acid neopentyl glycol diacrylate / ethylene oxide modified phosphoric acid (meth) acrylate, ethylene Kisaido modified alkylated phosphoric acid (meth) acrylate and the like.

Further, N-vinyl-2-pyrrolidone, acryloylmorpholine, vinylimidazole, N-vinylcaprolactam, vinyl acetate, (meth) acrylic acid,
(Meth) acrylamide, N-hydroxymethyl acrylamide or N-hydroxyethyl acrylamide, and their alkyl ether compounds can also be used.

Further, as the polymerizable monomer which can be used in the same manner as the polymerizable monomer, there are known and commonly used polymerizable oligomers such as polyester poly (meth) acrylate, polyether poly (meth) acrylate, polyether ester polyurethane (meth) acrylate and epoxy poly. (Meth) acrylate and the like.

It is preferable to use those (meth) acrylate monomers and / or oligomers that have been highly purified by a molecular distillation method or the like.

The amount of the (meth) acrylate monomer and / or oligomer selected from these is 5 to 30% by mass in the liquid crystal encapsulating resin composition. When it is used in an amount of 5% by mass or more, photopolymerization activity becomes high, and when it is 30% or less, adhesion reliability is exhibited.

The (4) epoxy resin used in the present invention will be described. The epoxy resin used in the present invention is not particularly limited, and known materials can be used. Specific examples include the following. For example, polyalkylene glycols such as ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, polypropylene glycol, dimethylol propane, trimethylol propane, spiro glycol, glycerin, etc. Aliphatic polyhydric glycidyl ether compound obtained by reaction of polyhydric alcohols with epichlorohydrin, aromatic diols represented by bisphenol A, bisphenol S, bisphenol F, bisphenol AD, and ethylene glycol, propylene glycol Aromatic Polyvalent Glycidyl Ate Obtained by Reaction of Alkylene Glycol-Modified Diols with Epichlorohydrin Compounds, aliphatic dicarboxylic acids represented by adipic acid, itaconic acid, etc., and aliphatic polyvalent glycidyl ester compounds obtained by the reaction of epichlorohydrin, aromatic dicarboxylic acids represented by isophthalic acid, terephthalic acid, pyromellitic acid, etc. Aromatic polyvalent glycidyl ester compound obtained by reaction of acid with epichlorohydrin, aliphatic polyvalent glycidyl ether ester compound or aromatic polyvalent glycidyl ether ester compound obtained by reaction of hydroxydicarboxylic acid compound and epichlorohydrin, and others , An alicyclic polyvalent glycidyl ether compound, an aliphatic polyvalent glycidylamine compound obtained by the reaction of an aliphatic diamine represented by polyethylenediamine and the like with epichlorohydrin, diaminodiphenylmethane, aniline, metaxylylene diamid Aromatic polyvalent glycidylamine compounds obtained by the reaction of aromatic diamines represented by, for example, hydantoin and hydantoin-type polyvalent glycidyl compounds obtained by the reaction of its derivatives with epichlorohydrin, phenol or cresol and formaldehyde Novolak resin, derived from
A novolak-type polyvalent glycidyl ether compound obtained by the reaction of polyphenols represented by polyalkenylphenol and its copolymers with epichlorohydrin,
Epoxidized diene polymers such as epoxidized polybutadiene and epoxidized polyisoprene, 3,4-epoxy-6-
Methylcyclohexylmethyl-3,4-epoxy-6-
Specific examples include methylcyclohexane carbonate and bis (2,3-epoxycyclopentyl) ether.

It is preferable to use those epoxy resins that have been highly purified by a molecular distillation method or the like. The amount of the epoxy resin selected from these is 5 to 30 mass% in the liquid crystal encapsulating resin composition. 5 mass%
The adhesive reliability is improved by the above-mentioned use, and the curability by light irradiation becomes high when the content is 30% or less.

The (5) curing agent used in the present invention will be described. The curing agent used in the present invention is not particularly limited as long as it is a thermal latent curing agent. Specific examples include organic acid dihydrazide compounds, imidazole and its derivatives, dicyandiamide, aromatic amines and the like. The amount of these curing agents used is 1% by mass to 20% by mass in the liquid crystal sealant composition. When the amount is 1% by mass or more, the adhesion reliability under high temperature and high humidity conditions is exhibited, and when the amount is 20% by mass or less, the pot life can be maintained.

The (6) photoinitiator used in the present invention will be explained. The photoinitiator used in the present invention is not particularly limited, and known materials can be used. Specific examples include the following.

Specifically, for example, benzophenone, 2,2
-Diethoxy acetophenone, benzyl, benzoyl isopropyl ether, benzyl dimethyl ketal, 1-
Examples thereof include hydroxycyclohexyl phenyl ketone and thioxanthone.

The amount of these used is 0.1% in the liquid crystal sealant composition.
It is 1% by mass to 5% by mass. When the content is 0.1% by mass or more, the curability by light irradiation is given, and when the content is 5% by mass or less, the hygroscopicity of the cured material can be suppressed.

In the present invention, additives such as a filler, a coupling agent, an ion trap agent and an ion exchange agent may be used, if necessary, in addition to the above components.

The filler can be used for the purpose of adjusting the viscosity and reducing the thermal stress of the cured product. The inorganic filler to be used can be selected from known inorganic compounds and is not particularly limited. Specifically, for example, calcium carbonate,
Magnesium carbonate, barium sulfate, magnesium sulfate,
Aluminum silicate, zirconium silicate, iron oxide, titanium oxide, aluminum oxide (alumina), zinc oxide,
Silicon dioxide, potassium titanate, kaolin, talc,
Examples include asbestos powder, quartz powder, mica, and glass fiber. The particle size of the inorganic filler is not particularly limited as long as it does not affect the cell gap characteristics, but preferably 2 μm or less can be used. The amount of the inorganic filler used is 1% by mass to 40% by mass. When the amount is 1% by mass or more, the thermal stress reducing effect is exhibited, and when the amount is 40% by mass or less, the workability viscosity can be suppressed. Since the resin composition of the present invention needs to be uniformly mixed, it is sufficiently kneaded by using a three-roll to sufficiently defoam so that no bubbles are generated in the encapsulating resin. A stopping resin composition is obtained.

The liquid crystal encapsulating resin composition obtained as described above is used for producing a liquid crystal display device. An example of how to use it will be described. A spacer having a preset gap width is mixed with the liquid crystal sealing resin composition. Using a pair of glass substrates, the liquid crystal sealing resin composition is applied on one glass substrate in a frame shape by a dispenser. A liquid crystal material corresponding to the internal capacity of the panel is precisely dropped into the frame. After the other glass faces and is bonded, the glass substrate is bonded by irradiating ultraviolet rays in an amount of 1000 to 6000 mJ under pressure. After that, 120 with no pressure applied.
A liquid crystal panel is formed by heating at a temperature of ℃ for 1 hour to sufficiently cure.

[0035]

EXAMPLES The present invention will be described in detail below with reference to typical examples. [Synthesis Example 1] 1000 equipped with an elastomer synthetic stirrer, a gas introduction pipe, a thermometer, and a cooling pipe
Prepare a ml four-necked flask, and have a bisphenol F type epoxy resin (Epiclone 830S, Dainippon Ink and Chemicals, Inc.) with two epoxy groups in the molecule 600
g, methacrylic acid 12 g, triethanolamine 1
g and 50 g of toluene were added, and the mixture was reacted at 110 ° C. for 5 hours while bubbling with dry air to introduce a double bond. Next, 20 g of butyl acrylate, 20 g of glycidyl methacrylate, 1 g of divinylbenzene, 1 g of azobismethylvaleronitrile and 2 g of azobisisobutyronitrile were added thereto, and the mixture was polymerized at 70 ° C. for 3 hours and further at 90 ° C. for 1 hour to synthesize an elastomer. .

[Synthesis Example 2] 500 m equipped with a synthetic stirrer for epoxy acrylate, a gas introduction pipe, a thermometer, and a cooling pipe
A four-necked flask of 1 l was prepared, and 200 g of bisphenol A type epoxy resin: Epiclon EXA850CRP [manufactured by Dainippon Ink and Chemicals, Inc.] and methacrylic acid: 50
g and 0.2 g of triethanolamine were mixed and heated and stirred at 110 ° C. for 5 hours while bubbling with dry air to obtain an epoxy acrylate.

[Example 1] The elastomer obtained in Synthesis Example 1, the epoxy acrylate obtained in Synthesis Example 2, the bisphenol A-modified dimethacrylate, and Epiclon 850.
S, CR805, Amicure-VDH, 1-hydroxycyclohexyl phenyl ketone, KBM-403 [silane coupling agent: manufactured by Shin-Etsu Chemical Co., Ltd.] in a Dalton mixer with the compounding amounts shown in Table 1 [Table 1]. After mixing 3
Thoroughly kneading with this roll, viscosity 150 MPa ・ s
The liquid crystal sealing resin composition (S-1) was obtained. This S-1
Was used to evaluate the following liquid crystal sealing material.

1 The viscosity of the pot life liquid crystal encapsulating resin composition (S-1) at 25 ° C. was measured and the measured value was used as a reference. S-1 is put in a polyethylene container, sealed, and stored under a constant condition of -10 ° C. Thirty
After the lapse of days, the viscosity was measured under the same conditions and the rate of increase was used to judge. ○: less than 10% △: 10% or more and less than 50% ×: 50% or more

2 The resin composition (S-1) for liquid crystal sealing suitable for coating was filled in a 10 cc syringe and then defoamed. Drawing was performed with a dispenser (shot master: manufactured by Musashi Engineering). The coating conditions were such that the coating speed was 4 cm per second. The following criteria were used to judge superiority or inferiority. ◯: No bleeding, no stringing, and good appearance. Δ: No bleeding, no stringing, but poor appearance. X: Exudation and stringing occur, resulting in extremely poor coatability.

3 Adhesive Strength 1 g of the liquid crystal encapsulating resin composition (S-1) was drawn on alkali-free glass with a dispenser (shot master: manufactured by Musashi Engineering). After alignment with the pair of glass substrates, pressure was applied until the gap became 5 μm. After fixing the gap by irradiating the ultraviolet ray of 2000 mJ, the bonding was completed by heating at 120 ° C. for 1 hour. After being stored in a constant temperature bath at 25 ° C. and 50% humidity for 24 hours, the peel strength was measured by a tensile tester (manufactured by Intesco).

4 Evaluation of Electrical Characteristics of Liquid Crystal Panel A TFT (thin film transistor) liquid crystal display cell was prepared by the same method as above, and was manufactured under the conditions of 60 ° C. and 95% RH for 100
A high temperature and high humidity operation test was performed for 0 hours, and the voltage holding ratio after the test was measured.

[Examples 2 to 6] Table 2 [Table 1] shows the results of the tests conducted with the materials and blending amounts shown in Table 1 [Table 1].

[Comparative Examples 1 to 6] Table 2 [Table 1] shows the results obtained by conducting a test with the materials and compounding amounts shown in Table 1 [Table 1] for comparison.

[0044]

[Table 1]

[0045]

By using the resin composition for liquid crystal encapsulation of the present invention, the adhesiveness required for the original liquid crystal encapsulating material and the adhesive reliability when left for a long time under high temperature and high humidity,
The liquid crystal dropping method can be applied while maintaining the electro-optical characteristics of the liquid crystal and maintaining the characteristics such as alignment disorder, thereby shortening the liquid crystal panel manufacturing process and reducing the cost.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 23/29 H01L 23/30 C 23/31 F term (reference) 2H089 MA04Y NA22 NA37 NA43 NA48 NA53 PA19 QA03 QA11 QA12 QA13 TA06 4J002 BG042 CD191 CD201 DE106 DE116 DE136 DE146 DE186 DE236 DG056 DJ006 DJ016 DJ026 DJ036 DJ046 DJ056 DL006 FD016 GP00 GQ00 4J036 AA01 AA04 AB01 AB02 FA07 FA06 FA05 FA06 FA05 FA02 DB02 AD08 AD21 AD02 AD08 AD21 AD09 AD02 AD11 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD06 AD02 HA02 JA07 4M109 AA01 CA04 EA02 EB02 GA10

Claims (8)

[Claims] 1. (1) Elastomer 5 to 30% by mass, (2) Compound having at least one epoxy group and at least one vinyl group in one molecule                                                       10 to 50% by mass,  (3) (meth) acrylate monomer and / or oligomer                                                         5-30% by mass, (4) Epoxy resin 5 to 30% by mass, (5) Curing agent 1 to 20% by mass, (6) Photoinitiator 0.1-5% by mass A resin composition for liquid crystal encapsulation. 2. The resin composition for liquid crystal encapsulation according to claim 1, wherein the elastomer is in the form of particles and has a particle diameter of 0.1 to 5 μm. 3. The acrylic elastomer is an acrylic elastomer obtained by copolymerizing a (meth) acrylic monomer copolymerizable with an epoxy (meth) acrylate obtained by reacting an epoxy resin with (meth) acrylic acid. The resin composition for liquid crystal encapsulation according to claim 1 or 2, which is characterized in that. 4. The compound having at least one epoxy group and at least one vinyl group in one molecule is an oligomer having a number average molecular weight of 400 to 10,000, and the compound according to claim 1. The liquid crystal encapsulating resin composition of. 5. The copolymer according to claim 1, wherein the oligomer is a copolymer obtained by partially modifying a glycidyl group of a copolymer using glycidyl (meth) acrylate as a comonomer with (meth) acrylic acid. The resin composition for liquid crystal sealing according to any one of 1. 6. A liquid crystal encapsulating resin composition, characterized in that 1% to 50% by mass of a filler is contained in 100% by mass of the liquid crystal encapsulating resin composition according to any one of claims 1 to 5. object. 7. A panel characterized in that the resin composition for liquid crystal encapsulation according to any one of claims 1 to 6 is applied onto a cell substrate, liquid crystal is dropped, and then a pair of cell substrates are bonded together. Manufacturing method. 8. A liquid crystal display panel produced by the method for producing a liquid crystal panel according to claim 7.