JP2003117890A - Resinous plate stamping die - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent leavings generated at stamping a resinous plate material from clogging a die hole 8 of a die 9. SOLUTION: In this resinous plate stamping die, a punch 4 having a required stamping shape is attached to an upper die set 1 through a packing plate 2, and the die 9 fitted and removed in and from an outer peripheral portion of the punch 4 with a specified clearance is attached to a lower die set 7. A cooking means 3 such as a Peltier element is attached to a packing plate 2 to which the punch 4 is attached, thereby cooling the punch 4. When stamping a resinous plate 10, leavings 11 are cooled and made to shrink, thereby preventing clogging the die hole 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin plate punching die capable of preventing scraps generated when punching a resin plate material.

[0002]

2. Description of the Related Art With the recent increase in the market related to semiconductor products and the reduction in size and weight of mechanical products and electric appliances, the use of resin parts processed by punching out resin plate materials is increasing. The punching process of the resin plate material is performed in the same manner as the conventional punching process of the metal plate material.

FIG. 4 shows a conventional punching die used in such a punching process. The punch 104 and the die 1 are shown in FIG.
09 and stripper 106. In this punching die, the resin plate material 110 pressed and sandwiched by the stripper 106 and the die 109 is punched and processed by the punch 104, and the scrap 111 generated by the punching is formed by the die 10
It is dropped from the die hole 108 formed in No. 9.

However, as a phenomenon peculiar to the resin plate material, when the punch 104 is lifted after punching, the resin plate material 110
The scrap 111, which has been punched out from the mold and is no longer needed, may rise due to its elastic force, causing a scrap rising phenomenon of entering between the stripper 106 and the resin plate material 110. When this phenomenon occurs, the resin plate material 110 becomes a defective appearance such as a dent defect.

In order to prevent the scrap rising phenomenon, the method shown in FIG. 5 is described in the publication "Press Technology Vol. 37, No. 6," (published by Nikkan Kogyo Shimbun Ltd., P. 17-50, 1999). ing. In this method, the lower part of the die hole 108 is connected to an air suction device 120 via a hose 122. The dust 111 clogged in the die hole 108 is sucked by the suction force of air and sucked out from the die hole 108. It is stored in the waste tank 123.

In addition to this, in the case of a small hole diameter,
It is also described that an environment in which air constantly flows from the bypass 121 is performed by performing a process of providing the die 109 with a bypass 121. Then, the dust 111 clogged by this air flow is sucked out from the die hole 108 to prevent the dust from rising.

[0007]

However, in the above-mentioned prior art, since the dust 111 clogged in the die hole 108 is sucked, it is necessary to increase the suction pressure of the air suction device 120. In case of high pressure like this,
The resin plate material 110 sticks to the die hole 108 by the suction force from the lower side of the die hole 108.
A feed error occurs.

[0008] Further, for a die for punching a small hole diameter and a large hole diameter at the same time, a die hole 108 having a large hole diameter and a small hole diameter are collectively sucked by one air suction device 120 and one hose 122. In this case, due to the friction loss of the die hole 108, a phenomenon occurs in which the dust 111 having only the large hole diameter is sucked. In order to prevent this, the air suction devices 120 must be divided so as to correspond to the small hole diameter and the large hole diameter, respectively, and the air suction devices 120 and the hoses 12 are provided by the number of holes.
2 is required, not only the structure becomes complicated, but also the capital investment becomes large. Further, since the hose 122 has to be separately connected to each of the small hole diameter and the large hole diameter, there is a problem that a fine setup is required and the number of setup steps is increased.

The present invention has been made in consideration of the above-mentioned conventional problems, and there is no sticking of the resin plate material to the punching of the resin plate material, and a simple structure does not require a large capital investment. Moreover, it is an object of the present invention to provide a metal mold for punching a resin plate capable of preventing scraps from rising without increasing the number of setup steps.

[0010]

In order to achieve the above object, the invention of claim 1 is provided with a punch having a desired punching shape and a die which is fitted into and removed from the outer peripheral portion of the punch with a certain clearance. A resin plate punching die for processing a plate material is characterized in that a temperature difference providing means for providing a temperature difference is provided between the resin plate material and the punch.

According to the present invention, when the resin plate material is punched by the punch, a temperature difference is provided between the resin plate material and the punch, so that the dust scraps punched by the heat shrink due to the temperature difference between the punch and the punch. Cause Therefore, the residue can be discharged from the die hole without being clogged, and the residue can be prevented from rising.

In such an invention, it is not necessary to suck in dust by air suction, and sticking of the resin plate material due to air suction is eliminated. In addition, it is not necessary to have a complicated structure for performing air suction, the structure is simple, and the number of setup steps is not required.

According to a second aspect of the present invention, there is provided the resin plate punching die according to the first aspect, wherein the temperature difference applying means is a cooling means for cooling the punch.

According to the present invention, since the cooling means cools the punch, when the resin plate material is punched, the scraps to be punched are brought into contact with the punch to be cooled and contracted. Therefore, the waste can be discharged from the die hole without being clogged.

A third aspect of the present invention is the resin plate punching die according to the first aspect, wherein the temperature difference applying means is a heating means for heating the resin plate material.

In the present invention, the debris detached from the resin plate material by punching the punch is cooled and contracted by the contact with the punch and the contact with the ambient temperature. For this reason,
It can be discharged from the die hole without clogging with debris.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below with reference to the illustrated embodiments. In the respective embodiments, the same members are designated by the same reference numerals and correspond to each other.

(Embodiment 1) FIG. 1 shows Embodiment 1 of the present invention, in which an upper die set 1 and a lower die set 7 are vertically opposed to each other.

A packing plate 2 made of die steel is attached to the lower surface of the upper die set 1 so as to be in close contact therewith. A punch 4 for punching is joined to the packing plate 2 by crimping and bolted. The lower part of the punch 4 is formed into a desired punched shape.

A stripper bolt 5 having a spring 21 on the upper portion is attached to the upper die set 1, and a stripper 6 is attached to the stripper bolt 5. The stripper 6 is provided with an opening through which the punch 4 can be inserted, and the punch 4 penetrates the stripper 6 with a certain clearance without directly contacting the stripper 6.

A cooling means 3 as a temperature difference providing means is attached to the packing plate 2. A Peltier element is used as the cooling means 3, and this Peltier element is adhered and fixed to the side surface of the packing plate 2. By mounting the cooling means 3 on the packing plate 2 supporting the punch 4 in this way, the punch 4 is cooled by the cooling means 3 via the packing plate 2. The cooling means 3 may have a structure other than a Peltier element such as a water cooling type or an air cooling type.

A die 9 is attached on the lower die set 7. The die 9 is formed with a die hole 8 having a shape that fits into and out of the outer peripheral portion of the punch 4 with a certain clearance. The die hole 8 is coaxial and penetrates to the lower die set 7.

The resin plate material 10 is supplied along the upper surface of the die 9 in the direction of arrow A, and punching is performed by the punch 4 during the supply. As the resin plate material 10, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyethylene terephthalate, polyamide (for example, nylon 66 (trade name)), and other resins are used. The resin plate material 10 is fed between the stripper 6 and the die 9 in association with a press machine.

In this embodiment, the upper die set 1 is vertically moved by a press machine (not shown). When the upper die set 1 is lowered, the stripper 6 and the die 9 start to sandwich the resin plate material 10 at a certain point. Then, when the upper die set 1 is further lowered, the pressure applied from the stripper 6 to the die 9 becomes stronger, so that the resin plate material 1
0 is fixed.

When the upper die set 1 is further lowered, the punch 4 is further lowered and the resin plate material 10 is punched out. The punched residue 11 enters the die hole 8.
At this time, since the clearance between the punch 4 and the die hole 8 is small, the punched residue 11 has a size substantially equal to the hole diameter of the die hole 8 and is easily clogged in the die hole 8. .

In the first embodiment, the packing plate 2 is cooled by the cooling device 3 using the Peltier element, and the punch 4 is indirectly cooled by heat conduction from the packing plate 2. On the other hand, the stripper 6
Is not cooled because it is not in direct contact with the packing plate 2. Also, the die 9 is not cooled. Therefore, the resin plate material 10 is also not cooled.

Therefore, the resin plate material 10 in an uncooled room temperature state is punched out by the contact with the cooled punch 4 while the waste 11 is punched out, and the cooled waste 11 causes thermal contraction in the die hole 8. , Smaller than the diameter of the die hole 8. Therefore, the residue 11 is not clogged in the die hole 8 and is smoothly discharged from the die hole 8.

In such an embodiment, since the resin plate material 10 is punched by the cooled punch 4, the punched dust 11 is cooled and shrinks, so that the die hole 8 is not clogged and the dust rise is prevented. You can Therefore, it is not necessary to suck the dust 11 by air suction,
The sticking of the resin plate material 10 due to air suction is eliminated. Further, it is not necessary to have a complicated structure for performing air suction, the structure is simple, and the number of setup steps can be reduced.

Although the punch 4 is indirectly cooled by cooling the packing plate 2 in this embodiment, the punch 4 may be directly cooled.

(Second Embodiment) FIG. 2 shows a second embodiment of the present invention. In this embodiment, an air hole 12 is formed in the punch 4 for punching so as to penetrate in the axial direction, and the air hole 12 is formed in the upper die set 1.
Is formed with an air hole 13 communicating with. An ultra-low temperature air generator 14 using the vortex principle is connected to the air hole 13, and cooling air is blown out from the nozzle port 15 at the tip of the air hole 12 via the air hole 13. The ultra-low temperature air generator 14, the air holes 13 and the air holes 12 serve as cooling means for cooling the dust 11. Other configurations are similar to those of the first embodiment.

In the second embodiment, the cooling air from the ultra-low temperature air generator 14 using the vortex principle is injected from the inlet of the air hole 13 of the upper die set 1.
This cooling air passes through the air holes 12 of the punch 4 and is ejected from the nozzle port 15. The resin plate material 10 is punched by the punch 4 while being blown with the cooling air. The punched residue 11 is cooled by the cooling air and causes thermal contraction in the die hole 8. As a result, the waste 11
Is smaller than the hole diameter of the die hole 8, and is smoothly discharged from the die hole 8 without being clogged in the die hole 8.

Therefore, also in this embodiment, it is not necessary to suck the dust 11 by air suction, and sticking of the resin plate material 10 by air suction is eliminated. Further, it is not necessary to have a complicated structure for performing air suction, the structure is simple, and the number of setup steps can be reduced.

As a device for generating cooling air,
Although the ultra-low temperature air generator using the vortex principle is used, a heat exchanger using compressed air or the like may be used.

(Third Embodiment) FIG. 3 shows a third embodiment of the present invention. In this embodiment, the cartridge heater 16 is attached to the die 9. The cartridge heater 16 may be attached so as to contact the side surface of the die 9, or may be embedded in the die 9.

Guide rollers 17 for guiding the supply of the resin plate material 10 are arranged before and after the die 9 in the supply direction A of the resin plate material 10. The contact point of the guide roller 17 with the resin plate material 10 is installed at a height lower than the upper surface of the die 9. Other configurations are similar to those of the first embodiment.

In the third embodiment, the cartridge heater 16 is attached to the die 9, so that the die 9 is heated to a temperature within the range not higher than the glass transition temperature of the resin plate material 10, preferably around 50 ° C. Resin plate material 10
Moves in the direction A along the lower surface of the guide roller 17, and therefore rubs while contacting the upper surface of the die 9. Therefore, the resin plate material 10 is heated by receiving heat from the die 9.

The resin plate material 10 heated by the die 9 is
The punch 4 is punched while receiving a temperature difference due to contact with the punch 4 that is at room temperature or cooled. The punched dust 11 is cooled by contact with the punch 4 and causes thermal contraction in the die hole 8, so that the diameter becomes smaller than the diameter of the die hole 8 and the die hole 8 is not clogged. Smoothly discharged from.

Therefore, also in this embodiment, it is not necessary to suck the dust 11 by air suction, and the sticking of the resin plate material 10 by air suction is eliminated. Further, it is not necessary to have a complicated structure for performing air suction, the structure is simple, and the number of setup steps can be reduced.

In this embodiment, the resin plate material 10 is used.
Is heated indirectly through the die 9, but the resin plate material 1
If the structure is such that only 0 can be heated, it may be heated directly by hot air.

From the above description, the present invention includes the inventions shown in the following additional items.

(Additional Item 1) A resin plate punching die for processing a resin plate material, comprising: a punch having a desired punching shape; and a die that is fitted into and removed from the outer peripheral portion of the punch with a constant clearance. A die for punching a resin plate, comprising cooling means for blowing cooling air onto the resin plate material.

In the invention of the additional item 1, since the resin plate material is cooled, the scraps punched out by the punch are also cooled at the same time, and the scraps become small due to shrinkage, and the die holes of the die are not clogged.

[0043]

According to the first aspect of the present invention, the dust punched out by the punch causes thermal contraction due to the temperature difference between the punch and the punch, so that the dust can be smoothly discharged from the die hole. Therefore, it is not necessary to suck dust by air suction, and sticking of the resin plate material due to air suction is eliminated. In addition, it is not necessary to have a complicated structure for performing air suction, the structure is simple, and the number of setup steps is not required.

According to the second and third aspects of the present invention, in addition to the effect of the first aspect of the invention, it is possible to reliably shrink the debris when the resin plate material is punched by the punch.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a sectional view showing a third embodiment of the present invention.

FIG. 4 is a sectional view showing a conventional mold.

FIG. 5 is a cross-sectional view showing a conventional structure for preventing scraps from rising.

[Explanation of symbols]

3 Cooling means 4 punch 8 die holes 9 dies 10 Resin plate material

Claims (3)

[Claims] 1. A resin plate punching die for processing a resin plate material, comprising: a punch having a desired punching shape; and a die that is fitted into and removed from an outer peripheral portion of the punch with a constant clearance. A metal mold for punching a resin plate, characterized in that a temperature difference applying means for applying a temperature difference is provided between the metal mold and the metal plate. 2. The die for punching a resin plate according to claim 1, wherein the temperature difference applying means is a cooling means for cooling the punch. 3. The mold for punching a resin plate according to claim 1, wherein the temperature difference applying unit is a heating unit for heating the resin plate material.