JP2003114358A - Joint structure between planar optical waveguide and metal member, and optical waveguide module using the joint structure - Google Patents
Joint structure between planar optical waveguide and metal member, and optical waveguide module using the joint structureInfo
- Publication number
- JP2003114358A JP2003114358A JP2002173083A JP2002173083A JP2003114358A JP 2003114358 A JP2003114358 A JP 2003114358A JP 2002173083 A JP2002173083 A JP 2002173083A JP 2002173083 A JP2002173083 A JP 2002173083A JP 2003114358 A JP2003114358 A JP 2003114358A
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- Prior art keywords
- waveguide
- optical waveguide
- metal member
- metal
- planar optical
- Prior art date
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12014—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by the wavefront splitting or combining section, e.g. grooves or optical elements in a slab waveguide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12026—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence
- G02B6/1203—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence using mounting means, e.g. by using a combination of materials having different thermal expansion coefficients
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12033—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for configuring the device, e.g. moveable element for wavelength tuning
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
Abstract
(57)【要約】
【課題】 接合用部材の変形等を伴わず、信頼性が高
い、平面光導波路と金属部材との接合構造とその接合構
造を用いた光導波路モジュールを提供する。
【解決手段】 例えばアレイ導波路回折格子等の平面光
導波路20の接合面に、図1の(c)、(d)に示すよ
うに、金属膜11bを形成し、金属部材7の接合面に金
属膜11aを形成し、これら金属膜11aと金属膜11
bとの拡散接合によって平面光導波路と金属部材7とを
接合する。この金属部材7にスライド移動部材17を接
合する。図1の(a)に示すように、アレイ導波路回折
格子の導波路形成領域10を第1と第2の導波路形成領
域10a,10bに分離してスライド移動部材17によ
り導波路形成領域10aを交差分離面8に沿って移動
し、アレイ導波路回折格子の光透過中心波長温度依存性
を低減する。
PROBLEM TO BE SOLVED: To provide a highly reliable bonding structure of a planar optical waveguide and a metal member without accompanying deformation of a bonding member and an optical waveguide module using the bonding structure. SOLUTION: For example, as shown in FIGS. 1C and 1D, a metal film 11b is formed on a joint surface of a planar optical waveguide 20 such as an arrayed waveguide diffraction grating, and A metal film 11a is formed, and the metal film 11a and the metal film 11 are formed.
The planar optical waveguide and the metal member 7 are joined by diffusion joining with the b. The slide moving member 17 is joined to the metal member 7. As shown in FIG. 1A, the waveguide forming region 10 of the arrayed waveguide diffraction grating is separated into first and second waveguide forming regions 10a and 10b, and the slide moving member 17 guides the waveguide forming region 10a. Along the crossing separation plane 8 to reduce the temperature dependence of the light transmission center wavelength of the arrayed waveguide diffraction grating.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、光通信などに使用
されるアレイ導波路回折格子等の平面光導波路と金属部
材との接合構造およびその接合構造を用いた光導波路モ
ジュールに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joining structure between a planar optical waveguide such as an arrayed waveguide diffraction grating used for optical communication and a metal member, and an optical waveguide module using the joining structure.
【0002】[0002]
【背景技術】近年、光通信においては、その伝送容量を
飛躍的に増加させる方法として、光波長多重伝送(WD
M)の研究開発が盛んに行なわれ、実用化が進みつつあ
る。光波長多重伝送は、例えば互いに異なる波長を有す
る複数の光を波長多重化して伝送させるものである。BACKGROUND ART In recent years, in optical communication, as a method of dramatically increasing the transmission capacity, optical wavelength division multiplexing (WD) is used.
M) is actively researched and developed, and is being put to practical use. The optical wavelength division multiplexing transmission is, for example, wavelength division multiplexing of a plurality of lights having different wavelengths and transmission.
【0003】このような光波長多重通信のシステムにお
いては、伝送される多重光から、光受信側で波長ごとの
光を取り出すことが必要である。そのため、光波長多重
通信システムには、予め定められた波長の光のみを透過
する光透過デバイス等が設けられる。In such an optical wavelength division multiplexing system, it is necessary to extract light of each wavelength from the transmitted multiplexed light at the optical receiving side. Therefore, the optical wavelength division multiplexing communication system is provided with a light transmission device or the like that transmits only light of a predetermined wavelength.
【0004】光透過デバイスの一例として、平面光導波
路(平板光導波路回路)がある。この平板光導波路回路
(PLC;Planar Lightwave Cir
cuit)は、例えばシリコンなどの基板上に石英系ガ
ラスの導波路形成領域を形成したものであり、アレイ導
波路回折格子(AWG;Arrayed Wavegu
ide Grating)やマッハツェンダ光干渉型合
分波器等の様々な回路が知られている。As an example of the light transmitting device, there is a flat optical waveguide (flat optical waveguide circuit). This planar optical waveguide circuit (PLC; Planar Lightwave Cir)
is a silica-based glass waveguide formation region formed on a substrate such as silicon, and is an arrayed waveguide diffraction grating (AWG; Arrayed Wavegu).
Various circuits such as a side-to-side demultiplexer and a Mach-Zehnder optical interference type demultiplexer are known.
【0005】アレイ導波路回折格子は、例えば図8に示
すように構成された平面光導波路20である。図8の図
中、符号1はシリコンなどの基板であり、この基板上に
形成された導波路形成領域10には、図8に示すような
導波路構成がコアにより形成されている。The arrayed waveguide diffraction grating is a planar optical waveguide 20 constructed as shown in FIG. 8, for example. In the drawing of FIG. 8, reference numeral 1 is a substrate made of silicon or the like, and a waveguide structure as shown in FIG. 8 is formed by a core in a waveguide forming region 10 formed on this substrate.
【0006】アレイ導波路回折格子の導波路構成は、少
なくとも1本の光入力導波路2と、該光入力導波路2の
出力側に接続された第1のスラブ導波路3と、該第1の
スラブ導波路3の出力側に接続されたアレイ導波路4
と、該アレイ導波路4の出力側に接続された第2のスラ
ブ導波路5と、該第2のスラブ導波路5の出力側に接続
されて複数並設された光出力導波路6とを有している。The waveguide structure of the arrayed waveguide diffraction grating has at least one optical input waveguide 2, a first slab waveguide 3 connected to the output side of the optical input waveguide 2, and the first slab waveguide 3. Array waveguide 4 connected to the output side of the slab waveguide 3 of
A second slab waveguide 5 connected to the output side of the arrayed waveguide 4 and a plurality of optical output waveguides 6 connected in parallel to the output side of the second slab waveguide 5 Have
【0007】前記アレイ導波路4は、第1のスラブ導波
路3から導出された光を伝搬するものであり、複数のチ
ャンネル導波路4aを並設して形成されており、隣り合
うチャンネル導波路4aの長さは互いに設定量(ΔL)
異なっている。The arrayed waveguide 4 propagates the light derived from the first slab waveguide 3, and is formed by arranging a plurality of channel waveguides 4a in parallel, and the adjacent channel waveguides 4a are formed. The lengths of 4a are set by each other (ΔL)
Is different.
【0008】なお、アレイ導波路4を構成するチャンネ
ル導波路4aは、通常、例えば100本といったように
多数設けられる。また、光出力導波路6は、例えばアレ
イ導波路回折格子によって分波あるいは合波される互い
に異なる波長の信号光の数に対応させて設けられるもの
である。ただし、図8においては、図の簡略化のため
に、これらのチャンネル導波路4a、光出力導波路6お
よび、光入力導波路2の各々の本数を簡略的に示してあ
る。The channel waveguides 4a constituting the arrayed waveguide 4 are usually provided in a large number such as 100. The optical output waveguides 6 are provided in correspondence with the numbers of signal lights having different wavelengths, which are demultiplexed or combined by the arrayed waveguide diffraction grating, for example. However, in FIG. 8, for simplification of the drawing, the numbers of the channel waveguides 4a, the optical output waveguides 6, and the optical input waveguides 2 are simply shown.
【0009】光入力導波路2には、例えば送信側の光フ
ァイバ(図示せず)が接続されて、波長多重光が導入さ
れるようになっており、例えば1本の光入力導波路2を
通って第1のスラブ導波路3に導入された波長多重光
は、その回折効果によって広がってアレイ導波路4に入
射し、アレイ導波路4を伝搬する。An optical fiber (not shown) on the transmission side, for example, is connected to the optical input waveguide 2 so that wavelength-multiplexed light can be introduced. For example, one optical input waveguide 2 is used. The wavelength-multiplexed light that has been introduced into the first slab waveguide 3 spreads by the diffraction effect thereof, enters the array waveguide 4, and propagates in the array waveguide 4.
【0010】このアレイ導波路4を伝搬した光は、第2
のスラブ導波路5に達し、さらに、光出力導波路6に集
光されて出力されるが、アレイ導波路4を構成する全て
のチャンネル導波路4aの長さが互いに異なることか
ら、アレイ導波路4を伝搬した後に個々の光の位相にず
れが生じ、このずれ量に応じて集束光の波面が傾き、こ
の傾き角度により集光する位置が決まる。The light propagated through the arrayed waveguide 4 is
Of the channel waveguides 4a that reach the slab waveguide 5 and are condensed and output to the optical output waveguide 6. However, since the lengths of all the channel waveguides 4a forming the array waveguide 4 are different from each other, After propagating through 4, the phase of each light is shifted, the wavefront of the focused light is tilted according to this shift amount, and the tilt angle determines the position where light is focused.
【0011】アレイ導波路4から第2のスラブ導波路5
に光が入射する際に、光が集光する角度(回折角)をφ
とすると、この角度φと集光する光の波長(光透過中心
波長)λとの間には、(数1)に示すような関係があ
る。Array waveguide 4 to second slab waveguide 5
When the light is incident on the
Then, there is a relationship as shown in (Equation 1) between this angle φ and the wavelength (light transmission center wavelength) λ of the condensed light.
【0012】[0012]
【数1】 [Equation 1]
【0013】nsは第1、第2のスラブ導波路の等価屈
折率、dはチャンネル導波路同士の、第1、第2のスラ
ブ導波路側の端部間隔、φは回折角、ncはアレイ導波
路の等価屈折率、ΔLは隣り合うチャンネル導波路の長
さの差、mは回折次数をそれぞれ示す。N s is the equivalent refractive index of the first and second slab waveguides, d is the distance between the channel waveguides on the first and second slab waveguide sides, φ is the diffraction angle, and n c Is the equivalent refractive index of the arrayed waveguide, ΔL is the difference in length between adjacent channel waveguides, and m is the diffraction order.
【0014】ここで、回折角φ=0としたときの波長を
λ0とすると、この波長λ0は(数2)により示され
る。なお、波長λ0は、一般に、アレイ導波路回折格子
の中心波長と呼ばれる。Here, when the wavelength when the diffraction angle φ = 0 is λ 0 , this wavelength λ 0 is expressed by (Equation 2). The wavelength λ 0 is generally called the center wavelength of the arrayed waveguide diffraction grating.
【0015】[0015]
【数2】 [Equation 2]
【0016】また、図9に示すように、回折角φ=0と
なるアレイ導波路回折格子の集光位置を点Oとすると、
回折角φpを有する光の集光位置は、点Oとは異なる点
P(点OからX方向にずれた位置)に集光する。ここ
で、O−P間のX方向の距離をxとすると、距離xと波
長λとの間に(数3)が成立する。Further, as shown in FIG. 9, when the point O is the converging position of the arrayed waveguide diffraction grating having the diffraction angle φ = 0,
The light having the diffraction angle φ p is condensed at a point P (a position shifted from the point O in the X direction) different from the point O. Here, when the distance between the O and P in the X direction is x, (Equation 3) is established between the distance x and the wavelength λ.
【0017】[0017]
【数3】 [Equation 3]
【0018】(数3)において、Lfは第2のスラブ導
波路の焦点距離であり、ngはアレイ導波路の群屈折率
である。なお、アレイ導波路の群屈折率ngは、アレイ
導波路の等価屈折率ncにより、(数4)で与えられ
る。In (Equation 3), L f is the focal length of the second slab waveguide, and n g is the group index of the arrayed waveguide. Incidentally, the group index n g of the arrayed waveguide, the effective refractive index n c of the arrayed waveguide, is given by equation (4).
【0019】[0019]
【数4】 [Equation 4]
【0020】前記(数3)は、第2のスラブ導波路の焦
点OからX方向の距離dx離れた位置に光出力導波路の
入力端を配置形成することにより、dλだけ波長の異な
った光を取り出すことが可能であることを意味する。In the above (Formula 3), the input end of the optical output waveguide is arranged at a position away from the focal point O of the second slab waveguide by the distance dx in the X direction, so that the light whose wavelength is different by dλ is formed. Means that it is possible to take out.
【0021】つまり、例えば図8に示すように、1本の
光入力導波路2から互いに異なる波長λ1,λ2,λ
3,・・・λn(nは2以上の整数)を持った波長多重
光を入力させると、これらの光は、波長毎に互いに異な
る光出力導波路6から出力される。That is, for example, as shown in FIG. 8, different wavelengths λ1, λ2, λ from one optical input waveguide 2 are obtained.
When wavelength-multiplexed light having 3, ... λn (n is an integer of 2 or more) is input, these lights are output from the optical output waveguides 6 different for each wavelength.
【0022】なお、アレイ導波路回折格子は、光回路の
相反性(可逆性)の原理を利用しているため、光分波器
としての機能と共に、光合波器としての機能も有してい
る。そのため、図8とは逆に、各光出力導波路6から互
いに波長が異なる光をそれぞれ入射させると、これらの
光は、上記と逆の伝搬経路を通り、アレイ導波路4と第
1のスラブ導波路3とによって合波され、1本の光入力
導波路2から出射される。Since the arrayed-waveguide diffraction grating uses the principle of reciprocity (reversibility) of an optical circuit, it has a function as an optical demultiplexer as well as an optical multiplexer. . Therefore, contrary to FIG. 8, when lights having different wavelengths are made incident from the respective optical output waveguides 6, these lights pass through the propagation paths opposite to the above, and the arrayed waveguides 4 and the first slabs are made. The light is combined with the waveguide 3 and emitted from one optical input waveguide 2.
【0023】また、前記(数3)の関係は、第1のスラ
ブ導波路3に関しても同様に成立する。すなわち、図9
において、例えば第1のスラブ導波路3の焦点中心を点
O’とし、この点O’からX方向に距離dx’ずれた位
置にある点を点P’とすると、この点P’に光を入射し
た場合に、出力の波長がdλ’ずれることになる。この
関係を式により表わすと、(数5)のようになる。Further, the relation of the above (Equation 3) is similarly established for the first slab waveguide 3. That is, FIG.
In, for example, when the center of the focal point of the first slab waveguide 3 is defined as a point O ′ and a point at a position deviated from the point O ′ in the X direction by a distance dx ′ is defined as a point P ′, light is emitted at this point P ′. When incident, the wavelength of the output shifts by dλ '. If this relationship is expressed by an equation, it becomes as shown in (Equation 5).
【0024】[0024]
【数5】 [Equation 5]
【0025】なお、(数5)において、Lf’は第1の
スラブ導波路の焦点距離である。この(数5)は、第1
のスラブ導波路の焦点O’とX方向の距離dx’離れた
位置に光入力導波路の出力端を配置形成することによ
り、前記焦点Oに形成した光出力導波路においてdλ’
だけ波長の異なった光を取り出すことが可能であること
を意味する。In the equation (5), L f 'is the focal length of the first slab waveguide. This (Equation 5) is the first
By forming the output end of the optical input waveguide at a position away from the focal point O ′ of the slab waveguide by the distance dx ′ in the X direction, dλ ′ in the optical output waveguide formed at the focal point O.
It means that it is possible to extract lights with different wavelengths.
【0026】ところで、アレイ導波路回折格子は、元
来、石英系ガラス材料を主とするために、この石英系ガ
ラス材料の温度依存性に起因してアレイ導波路回折格子
の前記光透過中心波長が温度に依存してシフトする。こ
の温度依存性は、1つの光出力導波路6からそれぞれ出
力される光の透過中心波長をλ、前記アレイ導波路4を
形成するコアの等価屈折率をnc、基板(例えばシリコ
ン基板)1の線膨張係数をαs、アレイ導波路回折格子
の温度変化量をTとしたときに、(数6)により示され
るものである。By the way, since the arrayed-waveguide diffraction grating is originally composed mainly of a silica-based glass material, the optical transmission center wavelength of the arrayed-waveguide diffraction grating is caused by the temperature dependence of the silica-based glass material. Shifts depending on the temperature. This temperature dependence is represented by λ as the transmission center wavelength of the light output from one optical output waveguide 6, n c as the equivalent refractive index of the core forming the arrayed waveguide 4, and the substrate (for example, a silicon substrate) 1 Where α s is the linear expansion coefficient of and the temperature change amount of the arrayed-waveguide diffraction grating is T.
【0027】[0027]
【数6】 [Equation 6]
【0028】ここで、従来の一般的なアレイ導波路回折
格子において、(数6)から前記光透過中心波長の温度
依存性を求めてみる。従来の一般的なアレイ導波路回折
格子においては、dnc/dT=1×10
−5(℃−1)、αs=3.0×10−6(1/K)、
nc=1.451(波長1.55μmにおける値)であ
るから、これらの値を(数6)に代入する。Here, in the conventional general arrayed-waveguide diffraction grating, the temperature dependence of the light transmission center wavelength will be calculated from (Equation 6). In the conventional general arrayed-waveguide diffraction grating, dn c / dT = 1 × 10
−5 (° C. −1 ), α s = 3.0 × 10 −6 (1 / K),
Since n c = 1.451 (value at wavelength 1.55 μm), these values are substituted into (Equation 6).
【0029】また、波長λは、各光出力導波路6につい
てそれぞれ異なるが、各波長λの温度依存性は等しい。
そして、現在用いられているアレイ導波路回折格子は、
波長1550nmを中心とする波長帯の波長多重光を分
波したり合波したりするために用いられることが多いの
で、ここでは、λ=1550nmを(数6)に代入す
る。そうすると、従来の一般的なアレイ導波路回折格子
の前記光透過中心波長の温度依存性dλ/dTは、dλ
/dT=0.011(nm/℃)となる。The wavelength λ is different for each optical output waveguide 6, but the temperature dependence of each wavelength λ is equal.
And the arrayed waveguide grating currently used is
Since it is often used for demultiplexing or multiplexing the wavelength-multiplexed light in the wavelength band centering on the wavelength of 1550 nm, here, λ = 1550 nm is substituted into (Equation 6). Then, the temperature dependence dλ / dT of the light transmission center wavelength of the conventional general arrayed waveguide diffraction grating is dλ
/DT=0.011 (nm / ° C.).
【0030】ここで、アレイ導波路回折格子の温度変動
によってアレイ導波路回折格子の光出力導波路から出力
される光透過中心波長がΔλずれたとする。上記の議論
から、dλ’=Δλとなるように、光入力導波路の出力
端位置を前記X方向に距離dx’だけずらせば、例えば
焦点Oに形成した光出力導波路において、波長ずれのな
い光を取り出すことができる。また、他の光出力導波路
に関しても同様の作用が生じるため、前記光透過中心波
長ずれΔλを補正(解消)できることになる。Here, it is assumed that the optical transmission center wavelength output from the optical output waveguide of the arrayed waveguide diffraction grating deviates by Δλ due to the temperature variation of the arrayed waveguide diffraction grating. From the above discussion, if the output end position of the optical input waveguide is shifted by the distance dx ′ in the X direction so that dλ ′ = Δλ, there will be no wavelength shift in the optical output waveguide formed at the focus O, for example. The light can be extracted. Further, since the same action occurs with respect to other optical output waveguides, it is possible to correct (eliminate) the optical transmission center wavelength shift Δλ.
【0031】ここで、温度変化量と光入力導波路の位置
補正量の関係を導いておく。前記光透過中心波長の温度
依存性(温度による光透過中心波長のずれ量)は、前記
の如く、dλ/dT=0.011(nm/℃)で表され
るので、温度変化量Tを用いて光透過中心波長ずれ量Δ
λを(数7)により表わすことができる。Here, the relationship between the temperature change amount and the position correction amount of the optical input waveguide will be derived. Since the temperature dependence of the light transmission center wavelength (the shift amount of the light transmission center wavelength due to temperature) is expressed by dλ / dT = 0.011 (nm / ° C.) as described above, the temperature change amount T is used. Deviation of center wavelength of light transmission Δ
λ can be represented by (Equation 7).
【0032】[0032]
【数7】 [Equation 7]
【0033】(数5)、(数7)から、温度変化量Tと
光入力導波路の位置補正量dx’を求めると、(数8)
が導かれる。From the equations (5) and (7), the temperature change amount T and the position correction amount dx 'of the optical input waveguide are calculated (equation 8).
Is guided.
【0034】[0034]
【数8】 [Equation 8]
【0035】上記議論をふまえ、アレイ導波路回折格子
の第1のスラブ導波路3と第2のスラブ導波路5の少な
くとも一方を、スラブ導波路を通る光の経路と交わる面
で分離して分離スラブ導波路と成し、該分離スラブ導波
路の少なくとも一方側を前記分離面に沿って温度に依存
してスライド移動させる構成が提案された。なお、この
提案の詳細は、特願2000−283806号に記載さ
れている。Based on the above discussion, at least one of the first slab waveguide 3 and the second slab waveguide 5 of the arrayed-waveguide diffraction grating is separated and separated at the surface intersecting the path of light passing through the slab waveguide. A configuration has been proposed in which a slab waveguide is formed, and at least one side of the separation slab waveguide is slid along the separation surface depending on the temperature. The details of this proposal are described in Japanese Patent Application No. 2000-283806.
【0036】上記提案の構成は、例えば図6に示すよう
な構成である。すなわち、まず、アレイ導波路回折格子
の第1のスラブ導波路3を、第1のスラブ導波路3を通
る光の経路と交わる交差分離面8によって分離してい
る。交差分離面8は導波路形成領域10の一端側(図6
の(a)の左端側)から導波路形成領域10の途中部に
かけて設けられており、この交差分離面8に連通させ
て、第1のスラブ導波路3と交差しない非交差分離面1
8が形成されている。The configuration proposed above is, for example, as shown in FIG. That is, first, the first slab waveguide 3 of the arrayed waveguide diffraction grating is separated by the cross separation surface 8 that intersects the path of light passing through the first slab waveguide 3. The cross separation surface 8 is located on one end side of the waveguide formation region 10 (see FIG. 6).
(A) (the left end side of (a)) to a midway portion of the waveguide formation region 10, and is communicated with the crossing separation surface 8 so as not to cross the first slab waveguide 3 and the non-crossing separation surface 1
8 is formed.
【0037】そして、交差分離面8と非交差分離面18
とによって、導波路形成領域10を、一方側の分離スラ
ブ導波路3aを含む第1の導波路形成領域10aと、他
方側の分離スラブ導波路3bを含む第2の導波路形成領
域10bとに分離している。なお、図6の(a)では、
非交差分離面18は交差分離面8と直交して設けられて
いる態様を示しているが、非交差分離面18は交差分離
面8と直交しなくてもよい。Then, the crossing separation surface 8 and the non-crossing separation surface 18
By this, the waveguide forming region 10 is divided into a first waveguide forming region 10a including the separation slab waveguide 3a on one side and a second waveguide forming region 10b including the separation slab waveguide 3b on the other side. Separated. In addition, in (a) of FIG.
Although the non-crossing separation surface 18 is shown to be provided orthogonal to the crossing separation surface 8, the non-crossing separation surface 18 may not be orthogonal to the cross separation surface 8.
【0038】また、前記第1の導波路形成領域10aと
第2の導波路形成領域10bとに跨る態様で、導波路形
成領域10よりも線膨張係数が大きいスライド移動部材
17が設けられており、このスライド移動部材17によ
り、第1の導波路形成領域10aを第2の導波路形成領
域10bに対して、交差分離面8に沿ってスライド移動
させる構成と成している。スライド移動部材17は、金
属等により形成される。Further, a slide moving member 17 having a linear expansion coefficient larger than that of the waveguide forming region 10 is provided so as to extend over the first waveguide forming region 10a and the second waveguide forming region 10b. The slide moving member 17 is configured to slide the first waveguide formation region 10a with respect to the second waveguide formation region 10b along the intersecting separation surface 8. The slide moving member 17 is made of metal or the like.
【0039】図6において、スライド移動部材17によ
って、(数8)により示される位置補正量dx’だけ、
前記分離面(図6の交差分離面8)に沿って第1のスラ
ブ導波路3の分離スラブ導波路3a及び光入力導波路2
をスライド移動させることにより、前記光透過中心波長
ずれを解消することが可能となる。In FIG. 6, by the slide moving member 17, only the position correction amount dx 'represented by (Equation 8),
The separation slab waveguide 3a of the first slab waveguide 3 and the optical input waveguide 2 along the separation surface (the cross separation surface 8 in FIG. 6).
It is possible to eliminate the shift of the light transmission center wavelength by sliding the lens.
【0040】なお、上記効果を発揮するために、上記提
案においては、スライド移動部材17による第1の導波
路形成領域10aの移動量が、アレイ導波路回折格子の
各光透過中心波長の温度依存性を補償することができる
移動量となるように、図6の(b)のBに示す長さ、す
なわち、スライド移動部材17とアレイ導波路回折格子
とを接合する接合用部材13同士の間の長さを設計して
いる。In order to exert the above effect, in the above proposal, the amount of movement of the first waveguide forming region 10a by the slide moving member 17 depends on the temperature of each light transmission center wavelength of the arrayed waveguide diffraction grating. 6B, that is, between the joining members 13 for joining the slide moving member 17 and the arrayed-waveguide diffraction grating so that the movement amount can compensate the property. The length is designed.
【0041】また、図6においては、一方側の分離スラ
ブ導波路3aと他方側の分離スラブ導波路3bの光軸が
Z方向にずれるのを抑制するために、位置ずれ抑制部材
19を設けている。この位置ずれ抑制部材19は省略す
ることも可能である。Further, in FIG. 6, in order to prevent the optical axes of the separation slab waveguide 3a on one side and the separation slab waveguide 3b on the other side from deviating in the Z direction, a positional deviation suppressing member 19 is provided. There is. The position shift suppressing member 19 can be omitted.
【0042】[0042]
【発明が解決しようとする課題】ところで、上記特願2
000−283806号において、スライド移動部材1
7をアレイ導波路回折格子に接合する接合構造は特に限
定されておらず、その実施形態例において、接合用部材
13を接着剤とした例は示されていないが、例えば上記
接合用部材13として接着剤を適用した場合、光導波路
モジュールを過酷な高温高湿条件下に置くと、光透過中
心波長が大きくすれてしまうといった問題が生じる場合
があった。By the way, the above-mentioned Japanese Patent Application No. 2
000-283806, slide moving member 1
The joining structure for joining 7 to the arrayed waveguide diffraction grating is not particularly limited, and although an example in which the joining member 13 is used as an adhesive is not shown in the embodiment example, for example, as the joining member 13 described above, In the case where the adhesive is applied, if the optical waveguide module is placed under severe conditions of high temperature and high humidity, there may be a problem that the center wavelength of light transmission is greatly shifted.
【0043】すなわち、本発明者が、図6に示した構成
における接合用部材13を接着剤とした光導波路モジュ
ールを用いて、光導波路モジュール周辺の環境温度85
℃、湿度85%として336時間保持する高温高湿試験
を行ない、試験前と試験後に、光導波路モジュールの光
透過中心波長変動量を測定した結果、図2の特性線b、
b’、b"に示すように、上記光導波路モジュールの高
温高湿試験後の変動量が約0.1nm〜0.15nmと
なり、大きい変動量となる場合があった。That is, the present inventor uses the optical waveguide module having the bonding member 13 in the configuration shown in FIG.
As a result of performing a high temperature and high humidity test in which the temperature is kept at 85 ° C. and a humidity of 85% for 336 hours, and measuring the fluctuation amount of the light transmission center wavelength of the optical waveguide module before and after the test, the characteristic line b in FIG.
As shown in b ′ and b ″, the fluctuation amount of the above optical waveguide module after the high temperature and high humidity test was about 0.1 nm to 0.15 nm, which was a large fluctuation amount in some cases.
【0044】なお、例えば100GHzの周波数スペー
シングを有するアレイ導波路回折格子を実際のシステム
で使用するためには、その光透過中心波長ずれ量を±
0.03nm程度に抑える必要があり、この条件を満足
するためには、上記高温高湿試験のような過酷な条件下
でも光透過中心波長ずれ量が小さいことが望まれてい
る。In order to use the arrayed waveguide diffraction grating having a frequency spacing of 100 GHz in an actual system, the light transmission center wavelength shift amount is ±.
It is necessary to suppress the thickness to about 0.03 nm, and in order to satisfy this condition, it is desired that the shift amount of the light transmission center wavelength is small even under severe conditions such as the high temperature and high humidity test.
【0045】上記のように、図6の構成における接合用
部材13として接着剤を適用し、光モジュールを高温高
湿条件下に置いた場合に、光透過中心波長が大きくすれ
てしまう原因は、以下の現象によると考えられる。As described above, when an adhesive is applied as the joining member 13 in the configuration of FIG. 6 and the optical module is placed under high temperature and high humidity conditions, the cause of the large center wavelength of light transmission is: It is considered to be due to the following phenomenon.
【0046】つまり、接着剤は、例えば図7に示すよう
に、アレイ導波路回折格子の環境(温度、湿度)の変化
によってクリープ変形する可能性があるので、スライド
移動部材17とアレイ導波路回折格子とを接合する接着
剤配設部位同士の間の長さがB’に示すようになって、
Bに示す設計値より短くなってしまうことによると考え
られる。That is, since the adhesive may undergo creep deformation due to changes in the environment (temperature, humidity) of the arrayed-waveguide diffraction grating, as shown in FIG. The length between the adhesive disposing portions for joining the lattice is as shown in B ',
It is considered that this is because the value becomes shorter than the design value shown in B.
【0047】したがって、アレイ導波路回折格子の光透
過中心波長温度依存性を長期にわたって正確に補償する
ことを考慮した場合、接合用部材13として接着剤を適
用することは問題である可能性があり、上記提案におい
て、アレイ導波路回折格子の光透過中心波長温度依存性
を長期にわたって正確に補償するためには、スライド移
動部材17をアレイ導波路回折格子に固定する構成を最
適化することが重要な課題であると、本発明者は考え
た。Therefore, in consideration of accurately compensating the temperature dependence of the light transmission center wavelength of the arrayed waveguide diffraction grating for a long period of time, applying an adhesive as the joining member 13 may be a problem. In the above proposal, in order to accurately compensate the temperature dependence of the optical transmission center wavelength of the arrayed waveguide diffraction grating for a long period of time, it is important to optimize the configuration in which the slide moving member 17 is fixed to the arrayed waveguide diffraction grating. The present inventor thought that such a problem would occur.
【0048】また、前記の如く、スライド移動部材17
は金属部材等により形成されるものであるため、本発明
者は、スライド移動部材17をアレイ導波路回折格子に
固定する構成の最適化のためには、アレイ導波路回折格
子のような平面光導波路20と金属部材の接合構造を最
適化することが重要な課題であると考えた。Further, as described above, the slide moving member 17
Is formed of a metal member or the like, the inventor of the present invention, in order to optimize the configuration for fixing the slide moving member 17 to the arrayed waveguide diffraction grating, a planar light guide such as an arrayed waveguide diffraction grating is used. It was considered to be an important task to optimize the joint structure between the waveguide 20 and the metal member.
【0049】本発明は、上記課題を解決するためになさ
れたものであり、その目的は、平面光導波路と金属部材
との接合面に設けられる接合用部材の変形等を伴うこと
が無く、信頼性が高い、平面光導波路と金属部材との接
合構造およびその接合構造を用いた光導波路モジュール
を提供することにある。The present invention has been made in order to solve the above-mentioned problems, and its purpose is to prevent the deformation of the joining member provided on the joining surface between the planar optical waveguide and the metal member, and to provide the reliability. (EN) Provided is a highly bonded structure of a planar optical waveguide and a metal member, and an optical waveguide module using the bonded structure.
【0050】[0050]
【課題を解決するための手段】本発明は次のような構成
をもって課題を解決するための手段としている。すなわ
ち、第1の発明の平面光導波路と金属部材との接合構造
は、平面光導波路と金属部材とを接合する接合構造であ
って、前記金属部材の接合面と前記平面光導波路の接合
面に設けた金属膜の拡散接合によって前記平面光導波路
と前記金属部材を接合した構成をもって課題を解決する
手段としている。The present invention has the following constitution as means for solving the problems. That is, the joining structure of the planar optical waveguide and the metal member of the first invention is a joining structure for joining the planar optical waveguide and the metal member, and the joining surface of the metallic member and the joining surface of the planar optical waveguide are The means for solving the problem is configured such that the planar optical waveguide and the metal member are joined by diffusion joining of the provided metal film.
【0051】また、第2の発明の平面光導波路と金属部
材との接合構造は、上記第1の発明の構成に加え、前記
金属部材の線膨張係数を平面光導波路の線膨張係数とほ
ぼ等しく形成した構成をもって課題を解決する手段とし
ている。In addition, in the joint structure of the planar optical waveguide and the metal member of the second invention, in addition to the structure of the first invention, the linear expansion coefficient of the metal member is substantially equal to the linear expansion coefficient of the planar optical waveguide. The formed structure is used as a means for solving the problem.
【0052】さらに、第3の発明の平面光導波路と金属
部材との接合構造は、上記第1または第2の発明の構成
に加え、前記金属部材はコバールまたはインバー合金と
した構成をもって課題を解決する手段としている。Further, in the joint structure of the planar optical waveguide and the metal member of the third invention, in addition to the structure of the first or second invention, the metal member is made of Kovar or Invar alloy to solve the problem. It is a means to do.
【0053】さらに、第4の発明の平面光導波路と金属
部材との接合構造は、上記第1乃至第3のいずれか一つ
の発明の構成に加え、前記金属膜は平面光導波路側と金
属部材側にそれぞれ設けられてそれぞれの金属膜の表面
側に拡散接合面が形成されており、前記平面光導波路側
の金属膜の拡散接合面と前記金属部材側の金属膜の拡散
接合面との間に再結晶温度が約70℃〜約500℃の軟
金属の金属介設部材が設けられている構成をもって課題
を解決する手段としている。Further, in the joint structure of the flat optical waveguide and the metal member of the fourth invention, in addition to the structure of any one of the first to third inventions, the metal film is provided on the flat optical waveguide side and the metal member. Between the diffusion bonding surface of the metal film on the side of the planar optical waveguide and the diffusion bonding surface of the metal film on the side of the metal member. In order to solve the problem, a soft metal interposing member having a recrystallization temperature of about 70 ° C. to about 500 ° C. is provided.
【0054】さらに、第5の発明の平面光導波路と金属
部材との接合構造は、上記第1の発明の構成に加え、前
記金属部材は平面光導波路と間隔を介して配置された第
1金属部材と、該第1金属部材と平面光導波路との間に
介設されて前記第1金属部材より線膨張係数が小さい第
2金属部材により形成されており、該第2金属部材の接
合面が平面光導波路に接合されている構成をもって課題
を解決する手段としている。Furthermore, in the joint structure of the flat optical waveguide and the metal member of the fifth invention, in addition to the structure of the first invention, the metal member is a first metal arranged with a space from the flat optical waveguide. And a second metal member interposed between the first metal member and the planar optical waveguide and having a linear expansion coefficient smaller than that of the first metal member, and a joint surface of the second metal member. The structure joined to the planar optical waveguide is used as a means for solving the problem.
【0055】さらに、第6の発明の平面光導波路と金属
部材との接合構造は、上記第5の発明の構成に加え、前
記第2金属部材の線膨張係数が平面光導波路の線膨張係
数とほぼ等しい構成をもって課題を解決する手段として
いる。Further, in the joint structure of the planar optical waveguide and the metal member of the sixth invention, in addition to the configuration of the fifth invention, the linear expansion coefficient of the second metal member is the linear expansion coefficient of the planar optical waveguide. Almost the same structure is used as a means for solving the problem.
【0056】さらに、第7の発明の平面光導波路と金属
部材との接合構造は、上記第5または第6の発明の構成
に加え、前記第2金属部材はコバールまたはインバー合
金とした構成をもって課題を解決する手段としている。Further, the joint structure of the planar optical waveguide and the metal member of the seventh invention has a structure in which the second metal member is a Kovar or Invar alloy in addition to the structure of the fifth or sixth invention. As a means to solve.
【0057】さらに、第8の発明の平面光導波路と金属
部材との接合構造は、上記第5または第6または第7の
発明の構成に加え、前記第1金属部材は温度に依存して
平面光導波路よりも大きく伸縮する部材とした構成をも
って課題を解決する手段としている。Furthermore, in the joint structure of the flat optical waveguide and the metal member of the eighth invention, in addition to the structure of the fifth, sixth or seventh invention, the first metal member is a flat surface depending on temperature. A member that expands and contracts more than the optical waveguide is used as means for solving the problem.
【0058】さらに、第9の発明の平面光導波路と金属
部材との接合構造は、上記第8の発明の構成に加え、前
記第1金属部材は銅またはアルミニウムとした構成をも
って課題を解決する手段としている。Further, in the joint structure of the flat optical waveguide and the metal member of the ninth invention, in addition to the structure of the eighth invention, the first metal member is made of copper or aluminum. I am trying.
【0059】さらに、第10の発明の平面光導波路と金
属部材との接合構造は、上記第5乃至第9のいずれか一
つの発明の構成に加え、前記金属膜は平面光導波路側と
金属部材の第2金属部材側にそれぞれ設けられて、それ
ぞれの金属膜の表面側に拡散接合面が形成されており、
前記平面光導波路側の金属膜の拡散接合面と前記第2金
属部材側の金属膜の拡散接合面との間に再結晶温度が約
70℃〜約500℃の軟金属の金属介設部材が設けられ
ている構成をもって課題を解決する手段としている。Further, in the joint structure of the flat optical waveguide and the metal member of the tenth invention, in addition to the structure of any one of the fifth to ninth inventions, the metal film is formed on the flat optical waveguide side and the metal member. And a diffusion bonding surface is formed on the surface side of each metal film.
Between the diffusion bonding surface of the metal film on the side of the planar optical waveguide and the diffusion bonding surface of the metal film on the side of the second metal member, a metal intervening member of a soft metal having a recrystallization temperature of about 70 ° C to about 500 ° C is provided. The provided structure is used as a means for solving the problem.
【0060】さらに、第11の発明の光導波路モジュー
ルは、上記第1乃至第10のいずれか一つの発明の平面
光導波路と金属部材との接合構造を適用して形成される
構成をもって課題を解決する手段としている。Furthermore, the optical waveguide module of the eleventh aspect of the invention solves the problem by a structure formed by applying the joining structure of the flat optical waveguide and the metal member of any one of the first to tenth aspects of the invention. It is a means to do.
【0061】さらに、第12の発明の光導波路モジュー
ルは、少なくとも1本の光入力導波路と、該光入力導波
路の出力側に接続された第1のスラブ導波路と、該第1
のスラブ導波路の出力側に接続され、互いに設定量異な
る長さの複数並設されたチャネル導波路から成るアレイ
導波路と、該アレイ導波路の出力側に接続された第2の
スラブ導波路と、該第2のスラブ導波路の出力側に接続
されて複数並設された光出力導波路とを有する導波路形
成領域を基板上に形成し、前記第1のスラブ導波路と第
2のスラブ導波路の少なくとも一方がスラブ導波路を通
る光の経路と交わる交差面で分離されて分離スラブ導波
路と成し、その分離面によって前記導波路形成領域が一
方側の分離スラブ導波路を含む第1の導波路形成領域と
他方側の分離スラブ導波路を含む第2の導波路形成領域
とに分離されている平面光導波路の前記第1と第2の導
波路形成領域に跨る態様で、前記第1の導波路形成領域
と前記第2の導波路形成領域の少なくとも一方側を前記
分離面に沿って移動させるスライド移動部材が設けられ
ており、該スライド移動部材を平面光導波路上に支持す
る支持部材が前記スライド移動部材に固定されており、
前記支持部材は金属部材により形成されて該金属部材が
上記第1乃至第4のいずれか一つの発明の平面光導波路
と金属部材の接合構造により前記平面光導波路に接合さ
れている構成をもって課題を解決する手段としている。Further, the optical waveguide module according to the twelfth invention comprises at least one optical input waveguide, a first slab waveguide connected to the output side of the optical input waveguide, and the first slab waveguide.
Array slab waveguide connected to the output side of the slab waveguide, the array waveguide including a plurality of side-by-side channel waveguides having different set amounts from each other, and a second slab waveguide connected to the output side of the array waveguide. And a waveguide forming region having a plurality of optical output waveguides connected to the output side of the second slab waveguide and arranged in parallel, are formed on the substrate, and the first slab waveguide and the second slab waveguide are formed. At least one of the slab waveguides is separated at an intersecting surface that intersects a path of light passing through the slab waveguide to form a separated slab waveguide, and the waveguide forming region includes the separated slab waveguide on one side by the separated surface. In a mode of straddling the first and second waveguide forming regions of the planar optical waveguide separated into the first waveguide forming region and the second waveguide forming region including the separated slab waveguide on the other side, The first waveguide formation region and the second waveguide At least one side of the formation region are sliding member is provided to move along the separation surface, the supporting member for supporting the sliding member on the planar optical waveguide is fixed to the sliding member,
The support member is formed of a metal member, and the metal member is bonded to the planar optical waveguide by the bonding structure of the planar optical waveguide and the metal member according to any one of the first to fourth inventions. It is a means to solve.
【0062】さらに、第13の発明の光導波路モジュー
ルは、上記第12の発明の構成に加え、前記スライド移
動部材は温度に依存して平面光導波路よりも大きく伸縮
する部材である構成をもって課題を解決する手段として
いる。Furthermore, the optical waveguide module of the thirteenth invention has a problem in that, in addition to the configuration of the twelfth invention, the slide moving member is a member that expands and contracts more than the planar optical waveguide depending on temperature. It is a means to solve.
【0063】さらに、第14の発明の光導波路モジュー
ルは、上記第13の発明の構成に加え、前記スライド移
動部材は銅またはアルミニウムにより形成されている構
成をもって課題を解決する手段としている。Furthermore, in the optical waveguide module according to the fourteenth invention, in addition to the structure of the thirteenth invention, the slide moving member is formed of copper or aluminum as means for solving the problem.
【0064】さらに、第15の発明の光導波路モジュー
ルは、少なくとも1本の光入力導波路と、該光入力導波
路の出力側に接続された第1のスラブ導波路と、該第1
のスラブ導波路の出力側に接続され、互いに設定量異な
る長さの複数並設されたチャネル導波路から成るアレイ
導波路と、該アレイ導波路の出力側に接続された第2の
スラブ導波路と、該第2のスラブ導波路の出力側に接続
されて複数並設された光出力導波路とを有する導波路形
成領域を基板上に形成し、前記第1のスラブ導波路と第
2のスラブ導波路の少なくとも一方がスラブ導波路を通
る光の経路と交わる交差面で分離されて分離スラブ導波
路と成し、その分離面によって前記導波路形成領域が一
方側の分離スラブ導波路を含む第1の導波路形成領域と
他方側の分離スラブ導波路を含む第2の導波路形成領域
とに分離されている平面光導波路の前記第1と第2の導
波路形成領域に跨る態様で、前記第1の導波路形成領域
と前記第2の導波路形成領域の少なくとも一方側を前記
分離面に沿って移動させるスライド移動部材が設けられ
ており、該スライド移動部材を平面光導波路上に支持す
る支持部材が前記スライド移動部材に固定されており、
前記スライド移動部材を形成する第1金属部材と前記支
持部材を形成する第2金属部材から成る金属部材が上記
第5乃至第10のいずれか一つの発明の平面光導波路と
金属部材の接合構造により前記平面光導波路に接合され
ている構成をもって課題を解決する手段としている。Furthermore, the optical waveguide module of the fifteenth invention comprises at least one optical input waveguide, a first slab waveguide connected to the output side of the optical input waveguide, and the first slab waveguide.
Array slab waveguide connected to the output side of the slab waveguide, the array waveguide including a plurality of side-by-side channel waveguides having different set amounts from each other, and a second slab waveguide connected to the output side of the array waveguide. And a waveguide forming region having a plurality of optical output waveguides connected to the output side of the second slab waveguide and arranged in parallel, are formed on the substrate, and the first slab waveguide and the second slab waveguide are formed. At least one of the slab waveguides is separated at an intersecting surface that intersects a path of light passing through the slab waveguide to form a separated slab waveguide, and the waveguide forming region includes the separated slab waveguide on one side by the separated surface. In a mode of straddling the first and second waveguide forming regions of the planar optical waveguide separated into the first waveguide forming region and the second waveguide forming region including the separated slab waveguide on the other side, The first waveguide formation region and the second waveguide At least one side of the formation region are sliding member is provided to move along the separation surface, the supporting member for supporting the sliding member on the planar optical waveguide is fixed to the sliding member,
A metal member including a first metal member forming the slide moving member and a second metal member forming the support member is formed by the joining structure of the flat optical waveguide and the metal member according to any one of the fifth to tenth aspects of the invention. The structure joined to the planar optical waveguide serves as means for solving the problem.
【0065】[0065]
【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて説明する。なお、本実施形態例の説明におい
て、従来例および提案例と同一名称部分には同一符号を
付し、その重複説明は省略する。図1の(a)、(b)
には、本発明に係る光導波路モジュールの第1実施形態
例の要部構成が示されている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the description of the example of the present embodiment, the same reference numerals are given to the same names as those in the conventional example and the proposed example, and the duplicated description will be omitted. 1 (a), (b)
Shows the configuration of the main part of the first embodiment of the optical waveguide module according to the present invention.
【0066】なお、図1の(a)にはその平面図が、図
1の(b)にはそのA−A’断面図が示されている。ま
た、図1の(c)には図1の(b)の鎖線枠D内の拡大
断面図が示されており、図1の(d)には、本実施形態
例に適用されている平面光導波路と金属部材との接合構
造が断面図により模式的に示されている。Incidentally, FIG. 1 (a) is a plan view thereof, and FIG. 1 (b) is a sectional view taken along the line AA '. In addition, FIG. 1C shows an enlarged cross-sectional view in the chain line frame D of FIG. 1B, and FIG. 1D shows a plane applied to this embodiment example. A joint structure of the optical waveguide and the metal member is schematically shown by a sectional view.
【0067】本実施形態例の光導波路モジュールは、以
下に示す構成の平面光導波路20を有する。つまり、こ
の平面光導波路20は、図1の(a)に示すように、前
記アレイ導波路回折格子の導波路構成を有する導波路形
成領域10を基板1上に形成している。また、この平面
光導波路20は、前記第1のスラブ導波路3と第2のス
ラブ導波路5の少なくとも一方(ここでは第1のスラブ
導波路3)がスラブ導波路を通る光の経路と交わる交差
面(交差分離面8)で分離されて分離スラブ導波路3
a,3bと成している。The optical waveguide module of this embodiment has a planar optical waveguide 20 having the following structure. That is, in the planar optical waveguide 20, as shown in FIG. 1A, the waveguide formation region 10 having the waveguide configuration of the arrayed waveguide diffraction grating is formed on the substrate 1. Further, in the planar optical waveguide 20, at least one of the first slab waveguide 3 and the second slab waveguide 5 (here, the first slab waveguide 3) intersects a path of light passing through the slab waveguide. Separated slab waveguide 3 separated at the intersecting surface (intersecting separating surface 8)
a and 3b.
【0068】この交差分離面8と非交差分離面18とに
よって、前記導波路形成領域10が一方側の分離スラブ
導波路3aを含む第1の導波路形成領域10aと他方側
の分離スラブ導波路3bを含む第2の導波路形成領域1
0bとに分離されている。Due to the crossing separation surface 8 and the non-crossing separation surface 18, the first waveguide formation region 10a in which the waveguide formation region 10 includes the separation slab waveguide 3a on one side and the separation slab waveguide on the other side. Second waveguide formation region 1 including 3b
It is separated into 0b.
【0069】また、本実施形態例の光導波路モジュール
には、この平面光導波路20の前記第1と第2の導波路
形成領域10a,10bに跨る態様で、第1の導波路形
成領域10aと第2の導波路形成領域10bの少なくと
も一方側(ここでは第1の導波路形成領域10a側)を
前記交差分離面8に沿って移動させるスライド移動部材
17が設けられている。Further, in the optical waveguide module of the present embodiment, the first waveguide formation region 10a is formed so as to extend over the first and second waveguide formation regions 10a and 10b of the planar optical waveguide 20. A slide moving member 17 is provided to move at least one side of the second waveguide formation region 10b (here, the first waveguide formation region 10a side) along the intersecting separation surface 8.
【0070】スライド移動部材17は温度に依存して平
面光導波路20よりも大きく伸縮する部材であり、スラ
イド移動部材17は、例えば線膨張係数が1.7×10
−5(1/K)の銅(Cu)により形成されている。The slide moving member 17 is a member that expands and contracts more greatly than the planar optical waveguide 20 depending on the temperature, and the slide moving member 17 has, for example, a linear expansion coefficient of 1.7 × 10.
It is formed of −5 (1 / K) copper (Cu).
【0071】スライド移動部材17には、該スライド移
動部材17を平面光導波路20上に支持する支持部材9
が固定されており、該支持部材9は金属部材7により形
成されている。金属部材7は、平面光導波路20の線膨
張係数とほぼ等しい線膨張係数を有している。金属部材
7は、例えば線膨張係数が4.0×10−6(1/K)
のコバールにより形成されている。The slide moving member 17 has a supporting member 9 for supporting the slide moving member 17 on the planar optical waveguide 20.
Are fixed, and the support member 9 is formed of a metal member 7. The metal member 7 has a linear expansion coefficient substantially equal to that of the planar optical waveguide 20. The metal member 7 has, for example, a linear expansion coefficient of 4.0 × 10 −6 (1 / K).
Is formed by Kovar.
【0072】なお、図1の(a)、(c)に示すよう
に、スライド移動部材17には金属部材7の嵌合穴12
が形成され、この嵌合穴12に金属部材7の支持部材9
を嵌め合わせた態様でスライド移動部材17と金属部材
7が焼ばめにより接合されている。As shown in FIGS. 1A and 1C, the slide moving member 17 has a fitting hole 12 for the metal member 7.
Is formed, and the support member 9 for the metal member 7 is formed in the fitting hole 12.
The slide moving member 17 and the metal member 7 are joined by shrink fit in a manner fitted together.
【0073】本実施形態例の光導波路モジュールは、上
記金属部材7を、以下に示す平面光導波路20と金属部
材との接合構造により、アレイ導波路回折格子の平面光
導波路20に接合して形成されている。The optical waveguide module of the present embodiment is formed by joining the metal member 7 to the plane optical waveguide 20 of the arrayed waveguide diffraction grating by the following joining structure of the plane optical waveguide 20 and the metal member. Has been done.
【0074】本実施形態例に適用されている平面光導波
路と金属部材との接合構造は、図1の(d)に示すよう
に、平面光導波路20の接合面(ここではアレイ導波路
回折格子の導波路形成領域表面)と前記金属部材7の接
合面との接合部に設けた金属膜11の拡散接合によっ
て、前記平面光導波路20と金属部材7とを接合するこ
とを特徴としている。As shown in FIG. 1D, the joining structure of the planar optical waveguide and the metal member applied to the present embodiment has a joining surface of the planar optical waveguide 20 (here, an arrayed waveguide diffraction grating). The planar optical waveguide 20 and the metal member 7 are joined by diffusion joining of the metal film 11 provided at the joining portion between the waveguide forming region surface) and the joining surface of the metal member 7.
【0075】つまり、本実施形態例の光導波路モジュー
ルは、金属部材7の接合面である金属部材7の下面に成
膜された金属膜11aと、平面光導波路20の接合面で
あるアレイ導波路回折格子の導波路形成領域10表面に
成膜された金属膜11bとの拡散接合によって、平面光
導波路20と金属部材7を接合して形成されている。That is, in the optical waveguide module of this embodiment, the metal film 11a formed on the lower surface of the metal member 7 which is the bonding surface of the metal member 7 and the arrayed waveguide which is the bonding surface of the planar optical waveguide 20. The planar optical waveguide 20 and the metal member 7 are joined by diffusion joining with the metal film 11b formed on the surface of the waveguide forming region 10 of the diffraction grating.
【0076】上記拡散接合は、固相接合法の一種であ
り、上記金属膜の再結晶温度以上で圧力が加えられるこ
とにより行われるものである。拡散接合は、金属部を溶
融させることなく、加熱・加圧保持し、接合面の原子を
拡散させ、原子間の結合を起こさせて金属的に完全な接
合部を得ようとする接合方法である。拡散接合を行なう
と、金属膜を形成する金属や接合条件によって緻密な接
合が可能であり、かつ、金属膜の機械的強度と同等の良
好な機械的強度を得ることができる。The diffusion bonding is a kind of solid phase bonding method, and is performed by applying a pressure at a temperature equal to or higher than the recrystallization temperature of the metal film. Diffusion bonding is a bonding method in which heating and pressurization are held without melting the metal part, the atoms on the bonding surface are diffused, and bonds between the atoms are caused to obtain a completely metal-bonded part. is there. Diffusion bonding enables precise bonding depending on the metal forming the metal film and the bonding conditions, and also provides good mechanical strength equivalent to that of the metal film.
【0077】前記金属膜11aは、中間層21と、接合
層22とを有し、金属膜11bは、接合層23と中間層
24とを有している。接合層22と接合層23の接触面
が拡散接合面である。接合層22,23は各々0.5μ
m厚さのCuにより形成され、中間層21,24は、各
々例えば0.1μm厚さのCrにより形成されている。The metal film 11a has an intermediate layer 21 and a bonding layer 22, and the metal film 11b has a bonding layer 23 and an intermediate layer 24. The contact surface between the bonding layer 22 and the bonding layer 23 is a diffusion bonding surface. Bonding layers 22 and 23 are each 0.5 μ
The intermediate layers 21 and 24 are each made of, for example, 0.1 μm thick Cr.
【0078】このように、接合層22,23の厚みは両
方で1μm程度であり、中間層21,24の厚みを加え
ても、例えば金属部材と平面光導波路とを接着剤により
接合する場合の厚み(50〜100μm)よりも非常に
小さい。なお、図1の(c)、(d)は、金属膜11の
構成を模式的に示したものであり、各層の膜厚は必ずし
も上記膜厚に対応した厚みに示されていない。As described above, the thicknesses of the bonding layers 22 and 23 are both about 1 μm, and even if the thicknesses of the intermediate layers 21 and 24 are added, for example, when the metal member and the planar optical waveguide are bonded with an adhesive. It is much smaller than the thickness (50 to 100 μm). 1C and 1D schematically show the structure of the metal film 11, and the film thickness of each layer is not necessarily shown to a thickness corresponding to the above film thickness.
【0079】接合層22,23は、なるべく低温で拡散
接合可能な金属により形成することが好ましいが、再結
晶温度が常温付近にある金属を選定する場合は、クリー
プ変形や超塑性変形を起こす可能性がある。The bonding layers 22 and 23 are preferably formed of a metal capable of diffusion bonding at a temperature as low as possible. However, when a metal whose recrystallization temperature is near room temperature is selected, creep deformation or superplastic deformation can occur. There is a nature.
【0080】そこで、接合層22,23は、光導波路モ
ジュールが使用される温度範囲(0℃〜70℃)より高
い温度で、かつ、導波路の屈折率に影響を与えない温度
(500℃以下)付近に再結晶温度がある金属により形
成することが望ましい。接合層22,23を形成する金
属は、Cu以外に、例えば線膨張係数が2.5×10
−5(1/K)のアルミニウム(Al)等が考えられ
る。Therefore, the bonding layers 22 and 23 are formed in the optical waveguide module.
Higher than the temperature range (0 ℃ -70 ℃) where Joule is used
Temperature that does not affect the refractive index of the waveguide
Formed by a metal that has a recrystallization temperature near (500 ° C or less)
Is desirable. Gold forming the bonding layers 22 and 23
In addition to Cu, the genus has, for example, a linear expansion coefficient of 2.5 × 10.
-5(1 / K) aluminum (Al), etc. are considered
It
【0081】接合層22,23として、上記のような金
属を選定することにより、拡散接合時にアレイ導波路回
折格子の光導波路の屈折率に与える影響を軽減できる。
また、中間層21,24は、接合層22,23と金属部
材7または導波路形成領域10との密着性を良好にする
ために設けられている。By selecting the metal as described above for the bonding layers 22 and 23, it is possible to reduce the influence on the refractive index of the optical waveguide of the arrayed waveguide diffraction grating during diffusion bonding.
The intermediate layers 21 and 24 are provided to improve the adhesion between the bonding layers 22 and 23 and the metal member 7 or the waveguide forming region 10.
【0082】なお、本実施形態例において、金属部材7
は、金属膜11a側の表面(つまり、中間層21に対向
する面)の平均粗さが0.02μm程度になるまでラッ
プ研磨されている。中間層21,24は多層膜としても
よいし、上記密着性が良好なときは省略することもでき
る。In this embodiment, the metal member 7
Is lap-polished until the average roughness of the surface on the metal film 11a side (that is, the surface facing the intermediate layer 21) becomes about 0.02 μm. The intermediate layers 21 and 24 may be multilayer films, or may be omitted when the above-mentioned adhesion is good.
【0083】本実施形態例において、金属膜11の拡散
接合は、上記金属膜11a,11bの成膜後、アレイ導
波路回折格子と金属部材7を高温の不活性雰囲気中(N
2:10ppm、500℃)で50Kfg/cm2で5
000sec間加圧することにより、接合層22,23
に、その再結晶温度以上で圧力を加えて行なった。In this embodiment, the diffusion bonding of the metal film 11 is carried out by forming the metal films 11a and 11b and then forming the arrayed waveguide diffraction grating and the metal member 7 in a high temperature inert atmosphere (N.
2 : 10 ppm, 500 ° C.) 5 at 50 Kfg / cm 2
By applying pressure for 000 seconds, the bonding layers 22, 23
In addition, pressure was applied above the recrystallization temperature.
【0084】なお、接合層22,23を形成するCuの
再結晶温度は200〜220℃付近が一般的に知られて
いる。この再結晶温度以上で、かつ、Cuの融点以下の
温度で上記のような加圧を行なうことにより、上記拡散
接合を良好に行なうことができ、接合層22,23の変
形がほとんど無い状態で緻密に接合することができる。It is generally known that the recrystallization temperature of Cu forming the bonding layers 22 and 23 is around 200 to 220 ° C. By performing the above-mentioned pressurization at a temperature not lower than the recrystallization temperature and not higher than the melting point of Cu, the diffusion bonding can be favorably performed and the bonding layers 22 and 23 are hardly deformed. It can be closely joined.
【0085】本実施形態例によれば、上記のように、ア
レイ導波路回折格子と金属部材7を、金属膜11の拡散
接合によって行なっており、金属膜11を形成する金属
や接合条件を上記のように適切に設定することによって
緻密な接合を行なうことができ、金属膜11の機械的強
度と同等の良好な機械的強度でアレイ導波路回折格子と
金属部材7を接合することができる。According to the present embodiment, as described above, the arrayed waveguide diffraction grating and the metal member 7 are formed by diffusion bonding of the metal film 11, and the metal forming the metal film 11 and the bonding conditions are set as described above. By appropriately setting as described above, it is possible to perform precise bonding, and it is possible to bond the arrayed waveguide diffraction grating and the metal member 7 with good mechanical strength equivalent to that of the metal film 11.
【0086】したがって、本実施形態例の光導波路モジ
ュールは、この接合構造を適用することにより、平面光
導波路20と金属部材との接合を信頼性の高いものとす
ることができ、歩留まりの向上を図ることができる。Therefore, in the optical waveguide module of the present embodiment, by applying this joining structure, the joining of the planar optical waveguide 20 and the metal member can be made highly reliable, and the yield is improved. Can be planned.
【0087】また、アレイ導波路回折格子の導波路形成
領域10はSiやガラス等により形成されており、これ
らの材料に比べてスライド移動部材17の線膨張係数は
大きい。そのため、例えばスライド移動部材17の下側
の面に金属膜を形成し、この金属膜と金属部材7の接合
面に形成した金属膜を拡散接合すると、拡散接合の冷却
過程において平面光導波路20の光導波路形成領域10
に大きな残留応力が与えられる可能性がある。Further, the waveguide forming region 10 of the arrayed waveguide diffraction grating is made of Si, glass or the like, and the linear expansion coefficient of the slide moving member 17 is larger than those materials. Therefore, for example, when a metal film is formed on the lower surface of the slide moving member 17 and the metal film formed on the bonding surface of the metal member 7 is diffusion-bonded, the planar optical waveguide 20 of the planar optical waveguide 20 is cooled in the diffusion bonding cooling process. Optical waveguide forming region 10
There is a possibility that a large residual stress will be applied to.
【0088】しかし、本実施形態例では、導波路形成領
域10の線膨張係数とほぼ等しい線膨張係数を有する金
属部材7と平面光導波路20とを金属膜11の拡散接合
により接合する構成を適用することにより、金属膜11
の拡散接合の際の冷却時に光導波路形成領域10に残留
応力を殆ど与えることなく金属部材7と平面光導波路2
0とを接合できる。However, in this embodiment, a configuration is adopted in which the metal member 7 having a linear expansion coefficient substantially equal to the linear expansion coefficient of the waveguide forming region 10 and the planar optical waveguide 20 are joined by diffusion bonding of the metal film 11. By doing so, the metal film 11
Of the metal member 7 and the planar optical waveguide 2 with almost no residual stress applied to the optical waveguide forming region 10 during cooling during the diffusion bonding of
Can be joined with 0.
【0089】そして、金属部材7とスライド移動部材1
7とを焼きばめ等により接合することによって、スライ
ド移動部材17の機能によってアレイ導波路回折格子の
光透過中心波長温度依存性を的確に補償できる優れた光
モジュールを形成することができる。Then, the metal member 7 and the slide moving member 1
7 and 7 are joined by shrink fitting or the like, it is possible to form an excellent optical module capable of appropriately compensating for the temperature dependence of the light transmission center wavelength of the arrayed waveguide diffraction grating by the function of the slide moving member 17.
【0090】本発明者は、本実施形態例の光導波路モジ
ュールについて、光導波路モジュール周辺の環境温度8
5℃、湿度85%として336時間保持する高温高湿試
験を行なった。そして、この試験前と試験後に、光導波
路モジュールの光透過中心波長変動量を測定した。Regarding the optical waveguide module of the present embodiment, the present inventor has set the ambient temperature around the optical waveguide module to 8
A high temperature and high humidity test was performed in which the temperature was kept at 5 ° C. and the humidity was 85% for 336 hours. Then, before and after this test, the fluctuation amount of the light transmission center wavelength of the optical waveguide module was measured.
【0091】その結果、本実施形態例の光導波路モジュ
ールは、図2の特性線a、a’、a"に示すように、い
ずれも高温高湿試験後の変動量が0.01nm〜0.0
2nmで非常に小さく、上記のような過酷な試験におい
ても、光透過中心波長ずれ量は、実際のシステムで使用
するための光透過中心波長ずれ量許容範囲(±0.03
nm程度)よりも小さかった。As a result, in the optical waveguide module of this embodiment, as shown by the characteristic lines a, a ′, and a ″ in FIG. 2, the variation amount after the high temperature and high humidity test is 0.01 nm to 0. 0
It is very small at 2 nm, and even in the above-mentioned severe tests, the light transmission center wavelength shift amount is within the light transmission center wavelength shift amount allowable range (± 0.03) for use in an actual system.
nm).
【0092】この検討結果からも明らかなように、本実
施形態例の光導波路モジュールは、上記のような非常に
厳しい環境変化が生じたとしても金属膜11の変形等を
伴うことがないので、アレイ導波路回折格子の光透過中
心波長補償機能を長期にわたって良好に維持できる、非
常に信頼性の高い優れた光導波路モジュールを実現でき
る。As is clear from the results of this examination, the optical waveguide module of the present embodiment does not involve deformation of the metal film 11 even if the above-mentioned extremely severe environmental change occurs. It is possible to realize an excellent optical waveguide module having extremely high reliability, which can favorably maintain the light transmission center wavelength compensation function of the arrayed waveguide diffraction grating for a long period of time.
【0093】図3の(a)、(b)には、本発明に係る
光導波路モジュールの第2実施形態例の要部構成が示さ
れている。なお、図3の(a)にはその平面図が、図3
の(b)にはそのA−A’断面図が示されている。ま
た、図3の(c)には図3の(b)の鎖線枠D内の拡大
断面図が示されている。FIGS. 3 (a) and 3 (b) show the essential structure of the second embodiment of the optical waveguide module according to the present invention. The plan view of FIG.
(B) shows the AA 'sectional view. Further, FIG. 3C shows an enlarged cross-sectional view within the chain line frame D of FIG. 3B.
【0094】第2実施形態例の光導波路モジュールは、
上記第1実施形態例と同様の構成の平面光導波路20を
有しており、上記第1実施形態例に設けられていたスラ
イド移動部材17と同様の機能を有するスライド移動部
材17とその支持部材9を有している。The optical waveguide module of the second embodiment is
The slide moving member 17 having the same configuration as that of the first embodiment and having the same function as the slide moving member 17 provided in the first embodiment and its supporting member. Have nine.
【0095】第2実施形態例では、金属部材7が第1金
属部材7(7a)と第2金属部材7(7b)により形成
されており、これら第1、第2の金属部材7(7a,7
b)が予め溶接等により接合された状態で、平面光導波
路20に接合されている。第1金属部材7aが、平面光
導波路20と間隔を介して配置されて上記スライド移動
部材17を形成しており、第2金属部材7が第1金属部
材7aと平面光導波路20(アレイ導波路回折格子)と
の間に介設されて、上記支持部材9を形成している。In the second embodiment, the metal member 7 is formed by the first metal member 7 (7a) and the second metal member 7 (7b), and the first and second metal members 7 (7a, 7a, 7b) are formed. 7
b) is joined to the planar optical waveguide 20 in a state where it is joined by welding or the like in advance. The first metal member 7a is disposed with a space from the plane optical waveguide 20 to form the slide moving member 17, and the second metal member 7 is formed with the first metal member 7a and the plane optical waveguide 20 (array waveguide. And a diffraction grating) to form the support member 9.
【0096】第1金属部材7aは、温度に依存して平面
光導波路20よりも大きく伸縮する部材である銅の部材
により形成され、第2金属部材7bは第1金属部材7a
より線膨張係数が小さく、平面光導波路20のシリコン
基板あるいは導波路形成領域10の線膨張係数とほぼ等
しい線膨張係数を有するコバールにより形成されてい
る。The first metal member 7a is formed of a copper member which is a member that expands and contracts more greatly than the planar optical waveguide 20 depending on the temperature, and the second metal member 7b is the first metal member 7a.
The linear expansion coefficient is smaller, and it is formed of a silicon substrate of the planar optical waveguide 20 or Kovar having a linear expansion coefficient substantially equal to the linear expansion coefficient of the waveguide forming region 10.
【0097】第2実施形態例では、第1金属部材7aと
第2金属部材7bから成る金属部材7を平面光導波路2
0の導波路形成領域10上に配置し、第1金属部材7a
を第1と第2の導波路形成領域10a,10bに跨る態
様とし、金属部材7bの接合面に形成した金属膜11a
とアレイ導波路回折格子の接合面に形成した金属膜11
bとの拡散接合により、金属部材7をアレイ導波路回折
格子に接合している。In the second embodiment, the metal member 7 including the first metal member 7a and the second metal member 7b is connected to the planar optical waveguide 2.
0 on the waveguide forming region 10 and the first metal member 7a
The metal film 11a formed on the joint surface of the metal member 7b.
Film 11 formed on the joint surface between the and array waveguide diffraction grating
The metal member 7 is bonded to the arrayed waveguide diffraction grating by diffusion bonding with b.
【0098】第2実施形態例も上記第1実施形態例と同
様の効果を奏することができる。The second embodiment can also achieve the same effects as the first embodiment.
【0099】図4には、本発明に係る光導波路モジュー
ルの第3実施形態例に適用されている平面光導波路と金
属部材との接合構造が示されている。第3実施形態例の
光導波路モジュールは、上記第1実施形態例と同様に形
成されたアレイ導波路回折格子の平面光導波路20を有
し、この平面光導波路20と金属部材7を接合し、金属
部材7にスライド移動部材17を接合して形成されてい
る。FIG. 4 shows a joint structure of a planar optical waveguide and a metal member applied to the third embodiment of the optical waveguide module according to the present invention. The optical waveguide module of the third embodiment has a planar optical waveguide 20 of an arrayed waveguide diffraction grating formed in the same manner as the first exemplary embodiment, and the planar optical waveguide 20 and the metal member 7 are joined together, It is formed by joining the slide moving member 17 to the metal member 7.
【0100】第3実施形態例が上記第1実施形態例と異
なる特徴的なことは、図4に示すように、金属部材7側
の金属膜11aの拡散接合面と平面光導波路20側の金
属膜11bの拡散接合面との間に、金属介設部材25を
設けたことである。なお、接合層22と接合層23の接
触面が上記拡散接合面である。The third embodiment differs from the first embodiment in that the diffusion bonding surface of the metal film 11a on the metal member 7 side and the metal on the planar optical waveguide 20 side are different from each other as shown in FIG. The metal interposition member 25 is provided between the diffusion bonding surface of the film 11b. The contact surface between the bonding layer 22 and the bonding layer 23 is the diffusion bonding surface.
【0101】金属介設部材25は、再結晶温度が約70
℃〜約500℃の軟金属により形成されている。第3実
施形態例において、金属介設部材25は、接合層22,
23と同種の金属であるCuにより形成している。ま
た、第3実施形態例において、金属部材7bの金属膜1
1a側の平面度は1μm、平均粗さは0.8μmとして
いる。The metal interposition member 25 has a recrystallization temperature of about 70.
It is formed of a soft metal having a temperature of about 500 ° C to about 500 ° C. In the third embodiment, the metal interposition member 25 includes the bonding layer 22,
It is formed of Cu, which is the same metal as 23. In addition, in the third embodiment, the metal film 1 of the metal member 7b is used.
The flatness on the 1a side is 1 μm, and the average roughness is 0.8 μm.
【0102】なお、金属介設部材25は、再結晶温度が
約70℃〜約500℃の軟金属であれば、接合層22,
23と異種の金属であるAlにより形成することもでき
る。金属介設部材25をAlとした場合でも、500℃
付近の温度で十分拡散接合が可能である。Cu、Alと
も、接合時の温度付近で軟化するため、接合面同士の密
着性もよい。If the recrystallization temperature is about 70 ° C. to about 500 ° C., the metal interposing member 25 is made of a soft metal.
It can also be formed of Al, which is a metal different from 23. Even if the metal interposition member 25 is Al, 500 ° C
Diffusion bonding is possible at a temperature around. Since both Cu and Al soften near the temperature at the time of joining, the adhesion between the joining surfaces is also good.
【0103】金属介設部材25は、金属シートや金属板
等により形成することもできるし、メッキ等の手段によ
り金属膜11b上に形成して設けることもできる。The metal interposition member 25 can be formed of a metal sheet, a metal plate, or the like, or can be formed and provided on the metal film 11b by means such as plating.
【0104】第3実施形態例は以上のように構成されて
おり、第3実施形態例も上記第1実施形態例と同様の効
果を奏することができる。The third embodiment is constructed as described above, and the third embodiment can also achieve the same effects as the first embodiment.
【0105】また、第3実施形態例は、金属介設部材2
5を設けることによって、例えば金属部材7とアレイ導
波路回折格子等の平面光導波路20の表面の少なくとも
一方の平面度や表面粗さが不十分である場合でも、金属
部材7と平面光導波路20の表面との間隔を調整して、
金属部材7と平面光導波路20との良好な接合を行なう
ことができる。Further, in the third embodiment, the metal interposition member 2 is used.
By providing 5, the metal member 7 and the planar optical waveguide 20 can be provided even if the flatness and the surface roughness of at least one of the surfaces of the metal member 7 and the planar optical waveguide 20 such as an arrayed waveguide diffraction grating are insufficient. Adjust the distance from the surface of
Good joining of the metal member 7 and the planar optical waveguide 20 can be performed.
【0106】さらに、金属介設部材25を設けることに
より、金属部材7と平面光導波路20(アレイ導波路回
折格子)間に生ずる残留応力を緩和することができる。Furthermore, by providing the metal interposition member 25, the residual stress generated between the metal member 7 and the planar optical waveguide 20 (array waveguide diffraction grating) can be relaxed.
【0107】図5には、本発明に係る光導波路モジュー
ルの第4実施形態例に適用されている平面光導波路と金
属部材との接合構造が示されている。第4実施形態例の
光導波路モジュールは、上記第2実施形態例と同様に形
成されたアレイ導波路回折格子の平面光導波路20を有
し、このアレイ導波路回折格子と、第1、第2金属部材
7a,7bから成る金属部材7を接合して形成されてい
る。FIG. 5 shows a joining structure of a planar optical waveguide and a metal member applied to the fourth embodiment of the optical waveguide module according to the present invention. The optical waveguide module of the fourth embodiment has a planar optical waveguide 20 of an arrayed waveguide diffraction grating formed in the same manner as the second embodiment, and the arrayed waveguide diffraction grating and the first and second It is formed by joining metal members 7 made of metal members 7a and 7b.
【0108】第4実施形態例が上記第2実施形態例と異
なる特徴的なことは、図5に示すように、金属部材7側
の金属膜11aの拡散接合面と平面光導波路20側の金
属膜11bの拡散接合面との間に、金属介設部材25を
設けたことであり、この金属介設部材25およびその配
設構成は、上記第3実施形態例と同様である。The fourth embodiment is different from the second embodiment in that the diffusion bonding surface of the metal film 11a on the metal member 7 side and the metal on the planar optical waveguide 20 side are different from each other as shown in FIG. The metal interposition member 25 is provided between the film 11b and the diffusion bonding surface, and the metal interposition member 25 and the arrangement configuration thereof are the same as those in the third embodiment.
【0109】したがって、第4実施形態例は、上記第2
実施形態例と同様の効果を奏し、かつ、金属介設部材2
5の配設による上記第3実施形態例と同様の効果を奏す
ることができる。Therefore, the fourth embodiment is the same as the second embodiment.
The same effect as that of the embodiment is obtained, and the metal interposition member 2 is provided.
It is possible to obtain the same effect as the third embodiment by the arrangement of No. 5.
【0110】なお、本発明は上記実施形態例に限定され
ることはなく、様々な実施の態様を採り得る。例えば上
記各実施形態例では、スライド移動部材17をCuによ
り形成したが、スライド移動部材17は例えばアレイ導
波路回折格子等の平面光導波路20よりも大きく伸縮す
る部材により形成されるものであり、スライド移動部材
17はAl製でもよい。The present invention is not limited to the above-mentioned embodiments, but can take various modes. For example, in each of the above-described embodiments, the slide moving member 17 is made of Cu, but the slide moving member 17 is made of a member that expands and contracts more greatly than the planar optical waveguide 20 such as an arrayed waveguide diffraction grating. The slide moving member 17 may be made of Al.
【0111】また、上記各実施形態例では支持部材9
(上記第1、第3実施形態例における金属部材7およ
び、上記第2、第4実施形態例における第2金属部材7
b)をコバールにより形成したが、支持部材9を、例え
ば線膨張係数が1.0×10−6(1/K)のインバー
合金等を適用することもできる。Further, in each of the above embodiments, the support member 9 is used.
(Metal member 7 in the first and third embodiments and second metal member 7 in the second and fourth embodiments.
Although b) is formed of Kovar, the support member 9 may be made of Invar alloy having a linear expansion coefficient of 1.0 × 10 −6 (1 / K).
【0112】また、上記第1、第3実施形態例では、ス
ライド移動部材17に嵌合穴12を形成したが、スライ
ド移動部材17に嵌合穴12を形成せずに、スライド移
動部材17の下側に密接した態様で、金属部材7を溶接
等により接合してもよい。Further, in the above-mentioned first and third embodiments, the fitting hole 12 is formed in the slide moving member 17, but the fitting hole 12 is not formed in the slide moving member 17 and the slide moving member 17 is formed. The metal member 7 may be joined to the lower side by welding or the like.
【0113】さらに、上記実施形態例では、アレイ導波
路回折格子の第1のスラブ導波路3を分離する構成とし
たが第2のスラブ導波路5を分離するようにしてもよい
し、第1と第2のスラブ導波路3,5の両方を分離する
ようにしてもよい。Further, in the above embodiment, the first slab waveguide 3 of the arrayed waveguide diffraction grating is separated, but the second slab waveguide 5 may be separated, or the first slab waveguide 5 may be separated. Both the second slab waveguide 3 and the second slab waveguide 5 may be separated.
【0114】すなわち、アレイ導波路回折格子の光透過
中心波長を調整する構成は、前記特願2000−283
806号に記載されているような様々な構成を適用する
ことができ、様々な構成において、金属部材とアレイ導
波路回折格子との接合構造を上記各実施形態例のような
構成にすることにより、上記各実施形態例のような優れ
た効果を奏することができる。That is, the configuration for adjusting the light transmission center wavelength of the arrayed waveguide diffraction grating is described in the above-mentioned Japanese Patent Application 2000-283.
Various configurations as described in Japanese Patent No. 806 can be applied. The excellent effects as in the above-described embodiments can be obtained.
【0115】さらに、上記例では、アレイ導波路回折格
子と金属部材7を接合する例を述べたが、本発明の平面
光導波路と金属部材との接合構造は、アレイ導波路回折
格子以外の様々な平面光導波路の接合面と金属部材の接
合面を接合する構造として適用されるものであり、ま
た、その接合構造を適用して様々な光導波路モジュール
を構成することができる。Furthermore, in the above example, the example in which the arrayed waveguide diffraction grating and the metal member 7 are bonded together has been described, but the bonding structure of the planar optical waveguide and the metal member of the present invention is various other than the arrayed waveguide diffraction grating. It is applied as a structure for joining the joining surface of the flat optical waveguide and the joining surface of the metal member, and various optical waveguide modules can be configured by applying the joining structure.
【0116】[0116]
【発明の効果】本発明の平面光導波路と金属部材との接
合構造によれば、平面光導波路と金属部材は、前記平面
光導波路の接合面と前記金属部材の接合面との接合部に
設けた金属膜の拡散接合によって接合されているので、
非常に良好な機械的強度を有し、かつ、接着剤のような
変形を伴うこともなく、非常に信頼性の高い平面光導波
路と金属部材との接合構造を実現できる。According to the joining structure of the flat optical waveguide and the metal member of the present invention, the flat optical waveguide and the metal member are provided at the joining portion between the joining surface of the flat optical waveguide and the joining surface of the metal member. Since they are bonded by diffusion bonding of the metal film,
It is possible to realize a highly reliable joint structure between a planar optical waveguide and a metal member, which has very good mechanical strength and does not involve deformation like an adhesive.
【0117】また、本発明の平面光導波路と金属部材と
の接合構造において、金属部材の線膨張係数を平面光導
波路の線膨張係数とほぼ等しく形成した構成によれば、
金属膜の拡散接合の冷却過程において、平面光導波路に
応力を殆ど加えることなく接合ができ、より一層信頼性
の高い平面光導波路と金属部材との接合構造を実現でき
る。Further, according to the joint structure of the planar optical waveguide and the metallic member of the present invention, the linear expansion coefficient of the metallic member is made substantially equal to the linear expansion coefficient of the planar optical waveguide.
In the cooling process of the diffusion bonding of the metal film, the planar optical waveguide can be bonded with almost no stress, and a more reliable bonded structure between the planar optical waveguide and the metal member can be realized.
【0118】さらに、本発明の平面光導波路と金属部材
との接合構造において、金属部材はコバールまたはイン
バー合金とした構成によれば、これらの金属部材を用い
て上記効果を的確に発揮することができる。Further, in the joint structure of the planar optical waveguide and the metal member of the present invention, if the metal member is made of Kovar or Invar alloy, the above effects can be properly exhibited by using these metal members. it can.
【0119】さらに、本発明の平面光導波路と金属部材
との接合構造において、平面光導波路側と金属部材側に
それぞれ設けられた金属膜表面側の拡散接合面の間に再
結晶温度が約70℃〜約500℃の軟金属の金属介設部
材が設けられている構成によれば、例えば金属部材表面
と平面光導波路表面の少なくとも一方の平面度や表面粗
さが不十分である場合でも、金属部材と平面光導波路表
面との間隔を調整して、金属部材と平面光導波路との良
好な接合を行なうことができる。Further, in the bonding structure of the planar optical waveguide and the metal member of the present invention, the recrystallization temperature is about 70 between the diffusion bonding surfaces on the metal film surface side provided on the planar optical waveguide side and the metal member side. According to the configuration in which the metal intervening member made of a soft metal having a temperature of ℃ to about 500 ℃ is provided, for example, even when the flatness or the surface roughness of at least one of the surface of the metal member and the surface of the planar optical waveguide is insufficient, By adjusting the distance between the metal member and the surface of the planar optical waveguide, the metal member and the planar optical waveguide can be bonded well.
【0120】また、この構成は、金属介設部材を設ける
ことにより、金属部材と平面光導波路間に生ずる残留応
力を緩和することができる。Further, in this structure, by providing the metal interposition member, the residual stress generated between the metal member and the planar optical waveguide can be relaxed.
【0121】さらに、本発明の平面光導波路と金属部材
との接合構造において、金属部材が第1、第2金属部材
を有する構成によれば、例えば第1金属部材の線膨張係
数と平面光導波路の線膨張係数との差が大きいと、拡散
接合の冷却過程において平面光導波路に与える残留応力
が大きくなるが、第1金属部材より線膨張係数が小さい
第2金属部材側を平面光導波路に接合することにより、
前記残留応力を軽減させることができ、かつ、線膨張係
数が大きい第1金属部材を利用して例えば平面光導波路
の温度依存性抑制効果等を果たすことができる。Further, in the joint structure of the planar optical waveguide and the metallic member of the present invention, according to the structure in which the metallic member has the first and second metallic members, for example, the linear expansion coefficient of the first metallic member and the planar optical waveguide are If the difference between the linear expansion coefficient and the linear expansion coefficient is large, the residual stress applied to the planar optical waveguide during the cooling process of the diffusion bonding becomes large. By doing
The residual stress can be reduced, and the effect of suppressing the temperature dependence of the planar optical waveguide can be achieved by using the first metal member having a large linear expansion coefficient.
【0122】さらに、上記金属部材が第1、第2金属部
材を有する構成において、第2金属部材はコバールまた
はインバー合金とした構成によれば、これらの材料を適
用して上記効果を的確に発揮することができる。Further, in the structure in which the metal member has the first and second metal members, if the second metal member is made of Kovar or Invar alloy, these materials can be applied to achieve the above effect accurately. can do.
【0123】さらに、上記金属部材が第1、第2金属部
材を有する構成において、第1金属部材は温度に依存し
て平面光導波路よりも大きく伸縮する部材とした構成に
よれば、第1金属部材が温度に依存して平面光導波路よ
りも大きく伸縮する性質を利用して、平面光導波路の温
度依存性を抑制できる光モジュールの形成等を実現でき
る。Further, in the structure in which the metal member has the first and second metal members, the first metal member is a member which expands and contracts more greatly than the planar optical waveguide depending on the temperature. By utilizing the property that the member expands and contracts more greatly than the planar optical waveguide depending on the temperature, it is possible to realize the formation of an optical module that can suppress the temperature dependency of the planar optical waveguide.
【0124】さらに、上記金属部材が第1、第2金属部
材を有する構成において、第1金属部材は銅またはアル
ミニウムとした構成によれば、これらの銅、アルミニウ
ムを用いて、例えば平面光導波路の温度依存性を抑制で
きる光モジュールの形成等を容易に実現できる。Further, in the structure in which the metal member has the first and second metal members, the first metal member is made of copper or aluminum. By using these copper and aluminum, for example, a planar optical waveguide It is possible to easily realize the formation of an optical module which can suppress the temperature dependence.
【0125】さらに、上記金属部材が第1、第2金属部
材を有する構成において、平面光導波路側と第2金属部
材側にそれぞれ設けられた金属膜表面側の拡散接合面の
間に再結晶温度が約70℃〜約500℃の軟金属の金属
介設部材が設けられている構成によれば、例えば第2金
属部材表面と平面光導波路表面の少なくとも一方の平面
度や表面粗さが不十分である場合でも、第2金属部材と
平面光導波路表面との間隔を調整して、金属部材と平面
光導波路との良好な接合を行なうことができる。また、
この構成は、金属介設部材を設けることにより、金属部
材と平面光導波路間に生ずる残留応力を緩和することが
できる。Further, in the structure in which the metal member has the first and second metal members, the recrystallization temperature is provided between the diffusion bonding surfaces on the metal film surface side provided on the planar optical waveguide side and the second metal member side, respectively. According to the configuration in which the metal interposing member made of a soft metal having a temperature of about 70 ° C. to about 500 ° C. is provided, for example, the flatness or surface roughness of at least one of the surface of the second metal member and the surface of the planar optical waveguide is insufficient. Even in this case, the distance between the second metal member and the surface of the planar optical waveguide can be adjusted to achieve good bonding between the metal member and the planar optical waveguide. Also,
With this configuration, by providing the metal interposition member, the residual stress generated between the metal member and the planar optical waveguide can be relaxed.
【0126】さらに、本発明の光導波路モジュールによ
れば、上記それぞれの平面光導波路と金属部材との接合
構造を適用して形成されているので、平面光導波路と金
属部材とを非常に良好な機械的強度で、かつ、接着剤の
ような変形を伴うこともなく行うことができ、非常に信
頼性の高い光導波路モジュールを形成できる。Further, according to the optical waveguide module of the present invention, since it is formed by applying the above-mentioned joining structure of the planar optical waveguide and the metal member, the planar optical waveguide and the metal member are very good. The optical waveguide module can be formed with high mechanical strength and without deformation such as an adhesive, and a very reliable optical waveguide module can be formed.
【0127】さらに、本発明の光導波路モジュールにお
いて、平面光導波路を、アレイ導波路等を備えたアレイ
導波路回折格子の回路を有する構成とし、金属部材をス
ライド移動部材の支持部材として、該支持部材を上記本
発明の平面光導波路と金属部材の接合構造により前記平
面光導波路に接合した構成によれば、支持部材を非常に
良好な機械的強度で、変形等も伴わずに平面光導波路に
接合できる。Further, in the optical waveguide module of the present invention, the planar optical waveguide is configured to have a circuit of an arrayed waveguide diffraction grating including an arrayed waveguide and the like, and the metal member is used as a support member for the slide moving member. According to the configuration in which the member is bonded to the planar optical waveguide by the bonding structure of the planar optical waveguide and the metal member of the present invention, the supporting member has a very good mechanical strength and is a planar optical waveguide without deformation. Can be joined.
【0128】したがって、支持部材により支持するスラ
イド移動部材の機能を用いて、例えばアレイ導波路回折
格子の光透過中心波長温度依存性を低減できる優れた光
導波路モジュールを実現できる。Therefore, by using the function of the slide moving member supported by the supporting member, it is possible to realize an excellent optical waveguide module capable of reducing the temperature dependence of the light transmission center wavelength of the arrayed waveguide diffraction grating.
【0129】さらに、上記アレイ導波路回折格子の回路
を有する平面光導波路と金属部材の支持部材を有する本
発明の光導波路モジュールにおいて、スライド移動部材
は温度に依存して平面光導波路よりも大きく伸縮する部
材である構成によれば、スライド移動部材の機能を用い
て、例えばアレイ導波路回折格子の光透過中心波長温度
依存性を容易に、かつ、的確に低減できる。Further, in the optical waveguide module of the present invention having the planar optical waveguide having the circuit of the arrayed waveguide diffraction grating and the supporting member of the metal member, the slide moving member expands and contracts more greatly than the planar optical waveguide depending on the temperature. According to the configuration of the member, the temperature dependence of the light transmission center wavelength of the arrayed waveguide diffraction grating can be easily and accurately reduced by using the function of the slide moving member.
【0130】さらに、上記アレイ導波路回折格子の回路
を有する平面光導波路を金属部材の支持部材を有する本
発明の光導波路モジュールにおいて、スライド移動部材
は銅またはアルミニウムにより形成されている構成によ
れば、これらの金属によりスライド移動部材を形成して
上記効果を的確に発揮できる。Further, in the optical waveguide module of the present invention having the supporting member of the metal member for the planar optical waveguide having the circuit of the arrayed waveguide diffraction grating, the slide moving member is made of copper or aluminum. The slide moving member can be formed of these metals, and the above effects can be accurately exhibited.
【0131】さらに、本発明の光導波路モジュールにお
いて、平面光導波路をアレイ導波路回折格子の回路を有
する構成とし、スライド移動部材を形成する第1金属部
材と前記スライド移動部材の支持部材を形成する第2金
属部材から成る金属部材を平面光導波路と金属部材の接
合構造により前記平面光導波路に接合されている構成に
よれば、アレイ導波路回折格子の光透過中心波長温度依
存性を低減できる信頼性の高い光導波路モジュールを実
現できる。Further, in the optical waveguide module of the present invention, the planar optical waveguide is configured to have the circuit of the arrayed waveguide diffraction grating, and the first metal member forming the slide moving member and the supporting member for the slide moving member are formed. According to the configuration in which the metal member formed of the second metal member is bonded to the planar optical waveguide by the bonding structure of the planar optical waveguide and the metallic member, it is possible to reduce the temperature dependence of the light transmission center wavelength of the arrayed waveguide diffraction grating. It is possible to realize a highly efficient optical waveguide module.
【図1】本発明に係る光導波路モジュールの第1実施形
態例と、第1実施形態例に適用されている平面光導波路
と金属部材との接合構造を示す要部構成図である。FIG. 1 is a main part configuration diagram showing a first embodiment of an optical waveguide module according to the present invention and a joint structure of a planar optical waveguide and a metal member applied to the first embodiment.
【図2】上記第1実施形態例と、本発明に係る光導波路
モジュールの第2実施形態例の高温高湿試験前と試験後
の光透過中心波長変動量を比較例と比較して示すグラフ
である。FIG. 2 is a graph showing the amount of change in the central wavelength of light transmission before and after the high temperature and high humidity test in the first embodiment and the second embodiment of the optical waveguide module according to the present invention in comparison with a comparative example. Is.
【図3】本発明に係る光導波路モジュールの第2実施形
態例と、第2実施形態例に適用されている平面光導波路
と金属部材との接合構造を示す要部構成図である。FIG. 3 is a main part configuration diagram showing a second embodiment of an optical waveguide module according to the present invention and a joint structure of a planar optical waveguide and a metal member applied to the second embodiment.
【図4】本発明に係る光導波路モジュールの第3実施形
態例に適用されている平面光導波路と金属部材との接合
構造を示す説明図である。FIG. 4 is an explanatory view showing a joint structure of a planar optical waveguide and a metal member applied to an optical waveguide module according to a third embodiment of the present invention.
【図5】本発明に係る光導波路モジュールの第4実施形
態例に適用されている平面光導波路と金属部材との接合
構造を示す説明図である。FIG. 5 is an explanatory view showing a joint structure of a planar optical waveguide and a metal member applied to an optical waveguide module according to a fourth embodiment of the present invention.
【図6】アレイ導波路回折格子の光透過中心波長補償提
案例の構成を示す説明図である。FIG. 6 is an explanatory diagram showing a configuration of a proposal example of optical transmission center wavelength compensation of an arrayed waveguide diffraction grating.
【図7】金属部材と平面光導波路との接合用の接合用部
材として接着剤を適用した場合の問題点を示す説明図で
ある。FIG. 7 is an explanatory diagram showing a problem when an adhesive is applied as a joining member for joining a metal member and a planar optical waveguide.
【図8】アレイ導波路回折格子の一例を示す説明図であ
る。FIG. 8 is an explanatory diagram showing an example of an arrayed waveguide diffraction grating.
【図9】アレイ導波路回折格子における光透過中心波長
シフトと光入力導波路および光出力導波路の位置との関
係を示す説明図である。FIG. 9 is an explanatory diagram showing the relationship between the light transmission center wavelength shift in the arrayed waveguide diffraction grating and the positions of the optical input waveguide and the optical output waveguide.
1 基板 2 光入力導波路 3 入力側スラブ導波路 3a,3b 分離スラブ導波路 4 アレイ導波路 4a チャンネル導波路 5 出力側スラブ導波路 6 光出力導波路 7 金属部材 7a 第1金属部材 7b 第2金属部材 9 支持部材 10 導波路形成領域 11a 第1の導波路形成領域 11b 第2の導波路形成領域 11,11a,11b 金属膜 17 スライド移動部材 22,23 接合層 25 金属介設部材 1 substrate 2 Optical input waveguide 3 Input side slab waveguide 3a, 3b separate slab waveguide 4 Array waveguide 4a channel waveguide 5 Output side slab waveguide 6 Optical output waveguide 7 Metal members 7a First metal member 7b Second metal member 9 Support members 10 Waveguide formation area 11a First waveguide formation region 11b Second waveguide formation region 11, 11a, 11b Metal film 17 Slide moving member 22,23 Bonding layer 25 Metal interposition member
───────────────────────────────────────────────────── フロントページの続き (72)発明者 根角 昌伸 東京都千代田区丸の内2丁目6番1号 古 河電気工業株式会社内 (72)発明者 田中 完二 東京都千代田区丸の内2丁目6番1号 古 河電気工業株式会社内 Fターム(参考) 2H037 AA01 BA24 DA02 DA06 2H047 KA03 KA12 LA18 NA10 2H049 AA02 AA12 AA59 AA62 AA65 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Masanobu Nekkaku 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Kawa Electric Industry Co., Ltd. (72) Inventor Kanji Tanaka 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Kawa Electric Industry Co., Ltd. F-term (reference) 2H037 AA01 BA24 DA02 DA06 2H047 KA03 KA12 LA18 NA10 2H049 AA02 AA12 AA59 AA62 AA65
Claims (15)
合構造であって、前記金属部材の接合面と前記平面光導
波路の接合面に設けた金属膜の拡散接合によって前記平
面光導波路と前記金属部材を接合したことを特徴とする
平面光導波路と金属部材との接合構造。1. A joint structure for joining a planar optical waveguide and a metal member, wherein the planar optical waveguide and the planar optical waveguide are joined by diffusion bonding of a metal film provided on the joint surface of the metallic member and the joint surface of the planar optical waveguide. A joining structure of a planar optical waveguide and a metal member, characterized in that a metal member is joined.
線膨張係数とほぼ等しく形成したことを特徴とする請求
項1記載の平面光導波路と金属部材との接合構造。2. The joint structure of a flat optical waveguide and a metal member according to claim 1, wherein the linear expansion coefficient of the metal member is formed to be substantially equal to the linear expansion coefficient of the flat optical waveguide.
としたことを特徴とする請求項1または請求項2記載の
平面光導波路と金属部材との接合構造。3. The joint structure between a planar optical waveguide and a metal member according to claim 1, wherein the metal member is Kovar or Invar alloy.
それぞれ設けられてそれぞれの金属膜の表面側に拡散接
合面が形成されており、前記平面光導波路側の金属膜の
拡散接合面と前記金属部材側の金属膜の拡散接合面との
間に再結晶温度が約70℃〜約500℃の軟金属の金属
介設部材が設けられていることを特徴とする請求項1乃
至請求項3のいずれか一つに記載の平面光導波路と金属
部材との接合構造。4. The diffusion bonding surface of the metal film is provided on the flat optical waveguide side and the metal member side, and a diffusion bonding surface is formed on the front surface side of each metal film. 5. A soft metal intervening member having a recrystallization temperature of about 70 ° C. to about 500 ° C. is provided between and the diffusion bonding surface of the metal film on the side of the metal member. Item 4. A joint structure between the planar optical waveguide according to any one of items 3 and a metal member.
配置された第1金属部材と、該第1金属部材と平面光導
波路との間に介設されて前記第1金属部材より線膨張係
数が小さい第2金属部材により形成されており、該第2
金属部材の接合面が平面光導波路に接合されていること
を特徴とする請求項1記載の平面光導波路と金属部材の
接合構造。5. The first metal member is disposed between the first metal member and the plane optical waveguide, and the metal member is linearly expanded from the first metal member. The second metal member having a small coefficient,
The joint structure of a planar optical waveguide and a metal member according to claim 1, wherein the joint surface of the metallic member is joined to the planar optical waveguide.
路の線膨張係数とほぼ等しいことを特徴とする請求項5
記載の平面光導波路と金属部材の接合構造。6. The linear expansion coefficient of the second metal member is substantially equal to the linear expansion coefficient of the planar optical waveguide.
A structure for joining the described planar optical waveguide and a metal member.
合金としたことを特徴とする請求項5または請求項6記
載の平面光導波路と金属部材の接合構造。7. The joint structure of a planar optical waveguide and a metal member according to claim 5, wherein the second metal member is Kovar or Invar alloy.
波路よりも大きく伸縮する部材としたことを特徴とする
請求項5または請求項6または請求項7記載の平面光導
波路と金属部材の接合構造。8. The flat optical waveguide and the metal member according to claim 5, wherein the first metal member is a member which expands and contracts more greatly than the flat optical waveguide depending on temperature. Joint structure.
したことを特徴とする請求項8記載の平面光導波路と金
属部材の接合構造。9. The joint structure of a planar optical waveguide and a metal member according to claim 8, wherein the first metal member is copper or aluminum.
第2金属部材側にそれぞれ設けられて、それぞれの金属
膜の表面側に拡散接合面が形成されており、前記平面光
導波路側の金属膜の拡散接合面と前記第2金属部材側の
金属膜の拡散接合面との間に再結晶温度が約70℃〜約
500℃の軟金属の金属介設部材が設けられていること
を特徴とする請求項5乃至請求項9のいずれか一つに記
載の平面光導波路と金属部材との接合構造。10. A metal film is provided on each of the flat optical waveguide side and the second metal member side of the metal member, and a diffusion bonding surface is formed on the front surface side of each metal film. A soft metal metal interposing member having a recrystallization temperature of about 70 ° C. to about 500 ° C. is provided between the diffusion bonding surface of the metal film and the diffusion bonding surface of the metal film on the second metal member side. The joining structure of the planar optical waveguide and the metal member according to any one of claims 5 to 9.
つに記載の平面光導波路と金属部材との接合構造を適用
して形成されることを特徴とする光導波路モジュール。11. An optical waveguide module, which is formed by applying the joining structure of the planar optical waveguide according to any one of claims 1 to 10 and a metal member.
光入力導波路の出力側に接続された第1のスラブ導波路
と、該第1のスラブ導波路の出力側に接続され、互いに
設定量異なる長さの複数並設されたチャネル導波路から
成るアレイ導波路と、該アレイ導波路の出力側に接続さ
れた第2のスラブ導波路と、該第2のスラブ導波路の出
力側に接続されて複数並設された光出力導波路とを有す
る導波路形成領域を基板上に形成し、前記第1のスラブ
導波路と第2のスラブ導波路の少なくとも一方がスラブ
導波路を通る光の経路と交わる交差面で分離されて分離
スラブ導波路と成し、その分離面によって前記導波路形
成領域が一方側の分離スラブ導波路を含む第1の導波路
形成領域と他方側の分離スラブ導波路を含む第2の導波
路形成領域とに分離されている平面光導波路の前記第1
と第2の導波路形成領域に跨る態様で、前記第1の導波
路形成領域と前記第2の導波路形成領域の少なくとも一
方側を前記分離面に沿って移動させるスライド移動部材
が設けられており、該スライド移動部材を平面光導波路
上に支持する支持部材が前記スライド移動部材に固定さ
れており、前記支持部材は金属部材により形成されて該
金属部材が請求項1乃至請求項4のいずれか一つに記載
の平面光導波路と金属部材の接合構造により前記平面光
導波路に接合されていることを特徴とする光導波路モジ
ュール。12. At least one optical input waveguide, a first slab waveguide connected to an output side of the optical input waveguide, and an output side of the first slab waveguide, which are connected to each other. An array waveguide composed of a plurality of channel waveguides of different lengths set in parallel, a second slab waveguide connected to the output side of the array waveguide, and an output side of the second slab waveguide A waveguide formation region having a plurality of optical output waveguides connected in parallel to each other is formed on the substrate, and at least one of the first slab waveguide and the second slab waveguide passes through the slab waveguide. A separation slab waveguide is formed by being separated at a crossing surface that intersects a light path, and the separation surface separates the first waveguide formation region including the separation slab waveguide on one side from the first formation region on the other side. Separated into the second waveguide formation region including the slab waveguide The first of the planar optical waveguides
And a slide moving member that moves at least one side of the first waveguide forming region and the second waveguide forming region along the separation surface in a manner to extend over the first waveguide forming region and the second waveguide forming region. A support member for supporting the slide moving member on the planar optical waveguide is fixed to the slide moving member, the support member is formed of a metal member, and the metal member is any one of claims 1 to 4. An optical waveguide module, characterized in that the planar optical waveguide is bonded to the planar optical waveguide by a bonding structure of the planar optical waveguide and the metal member according to any one of the above.
面光導波路よりも大きく伸縮する部材であることを特徴
とする請求項12記載の光導波路モジュール。13. The optical waveguide module according to claim 12, wherein the slide moving member is a member that expands and contracts more than the planar optical waveguide depending on temperature.
ウムにより形成されていることを特徴とする請求項13
記載の光導波路モジュール。14. The slide moving member is formed of copper or aluminum.
The optical waveguide module described.
光入力導波路の出力側に接続された第1のスラブ導波路
と、該第1のスラブ導波路の出力側に接続され、互いに
設定量異なる長さの複数並設されたチャネル導波路から
成るアレイ導波路と、該アレイ導波路の出力側に接続さ
れた第2のスラブ導波路と、該第2のスラブ導波路の出
力側に接続されて複数並設された光出力導波路とを有す
る導波路形成領域を基板上に形成し、前記第1のスラブ
導波路と第2のスラブ導波路の少なくとも一方がスラブ
導波路を通る光の経路と交わる交差面で分離されて分離
スラブ導波路と成し、その分離面によって前記導波路形
成領域が一方側の分離スラブ導波路を含む第1の導波路
形成領域と他方側の分離スラブ導波路を含む第2の導波
路形成領域とに分離されている平面光導波路の前記第1
と第2の導波路形成領域に跨る態様で、前記第1の導波
路形成領域と前記第2の導波路形成領域の少なくとも一
方側を前記分離面に沿って移動させるスライド移動部材
が設けられており、該スライド移動部材を平面光導波路
上に支持する支持部材が前記スライド移動部材に固定さ
れており、前記スライド移動部材を形成する第1金属部
材と前記支持部材を形成する第2金属部材から成る金属
部材が請求項5乃至請求項10のいずれか一つに記載の
平面光導波路と金属部材の接合構造により前記平面光導
波路に接合されていることを特徴とする光導波路モジュ
ール。15. At least one optical input waveguide, a first slab waveguide connected to an output side of the optical input waveguide, and an output side of the first slab waveguide, which are mutually connected to each other. An array waveguide composed of a plurality of channel waveguides having different lengths set in parallel, a second slab waveguide connected to the output side of the array waveguide, and an output side of the second slab waveguide A waveguide formation region having a plurality of optical output waveguides connected in parallel to each other is formed on the substrate, and at least one of the first slab waveguide and the second slab waveguide passes through the slab waveguide. A first slab waveguide is formed by separating the slab waveguide at a crossing surface that intersects the optical path, and the waveguide forming region includes the first slab waveguide on one side and the second slab waveguide on the other side. Separated into the second waveguide formation region including the slab waveguide The first of the planar optical waveguides
And a slide moving member that moves at least one side of the first waveguide forming region and the second waveguide forming region along the separation surface in a manner to extend over the first waveguide forming region and the second waveguide forming region. A supporting member for supporting the slide moving member on the planar optical waveguide is fixed to the slide moving member, and includes a first metal member forming the slide moving member and a second metal member forming the supporting member. An optical waveguide module, wherein the metal member is bonded to the planar optical waveguide by the bonding structure of the planar optical waveguide and the metal member according to any one of claims 5 to 10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002173083A JP2003114358A (en) | 2001-07-30 | 2002-06-13 | Joint structure between planar optical waveguide and metal member, and optical waveguide module using the joint structure |
| PCT/JP2002/006161 WO2003012498A1 (en) | 2001-07-30 | 2002-06-20 | Bonded structure of plane optical waveguide and metal member and optical waveguide module using the bonded structure |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-229934 | 2001-07-30 | ||
| JP2001229934 | 2001-07-30 | ||
| JP2002173083A JP2003114358A (en) | 2001-07-30 | 2002-06-13 | Joint structure between planar optical waveguide and metal member, and optical waveguide module using the joint structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003114358A true JP2003114358A (en) | 2003-04-18 |
Family
ID=26619554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002173083A Pending JP2003114358A (en) | 2001-07-30 | 2002-06-13 | Joint structure between planar optical waveguide and metal member, and optical waveguide module using the joint structure |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2003114358A (en) |
| WO (1) | WO2003012498A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005017611A1 (en) * | 2003-08-13 | 2005-02-24 | The Furukawa Electric Co., Ltd. | Flat optical waveguide circuit type optical variable attenuator |
| KR101327158B1 (en) | 2013-01-24 | 2013-11-06 | 주식회사 네온포토닉스 | Device for arrayed waveguide grating |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103197386B (en) * | 2013-04-01 | 2015-05-20 | 北京工业大学 | Vertical coupling grating coupler bonded by metal and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6845184B1 (en) * | 1998-10-09 | 2005-01-18 | Fujitsu Limited | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
| JP3457898B2 (en) * | 1998-11-17 | 2003-10-20 | 京セラ株式会社 | Optical semiconductor element storage package |
| JP2001150745A (en) * | 1999-11-30 | 2001-06-05 | Canon Inc | Image processing apparatus and method |
-
2002
- 2002-06-13 JP JP2002173083A patent/JP2003114358A/en active Pending
- 2002-06-20 WO PCT/JP2002/006161 patent/WO2003012498A1/en not_active Ceased
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005017611A1 (en) * | 2003-08-13 | 2005-02-24 | The Furukawa Electric Co., Ltd. | Flat optical waveguide circuit type optical variable attenuator |
| US7233714B2 (en) | 2003-08-13 | 2007-06-19 | The Furukawa Electric Co., Ltd. | Planar optical waveguide circuit type variable attenuator |
| KR101327158B1 (en) | 2013-01-24 | 2013-11-06 | 주식회사 네온포토닉스 | Device for arrayed waveguide grating |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003012498A1 (en) | 2003-02-13 |
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