JP2003194851A - Contact probe structure and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a contact probe structure which is easy to assemble without a problem of displacement due to a difference in a thermal expansion coefficient from an object to be measured and a method of manufacturing the same. SOLUTION: A contact probe structure 91 has a plurality of contact probes each having a tip portion 1 for making contact with an object to be measured and a root portion 3 for taking out an electrode, and a first having a plurality of grooves parallel to each other. And second holding members 21 and 22. The first and second holding members 21 and 22 sandwich the roots 3 of the contact probes in the grooves so that the tips 1 of the contact probes project in a line, respectively. Fixed to each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card head for conducting an electrical inspection of a semiconductor substrate, a liquid crystal display device, etc., a measuring IC socket, and a manufacturing method thereof. A structure in which a plurality of contact probes are incorporated and held, such as a probe card head and an IC socket for measurement, is hereinafter referred to as a “contact probe structure”.

[0002]

2. Description of the Related Art Inspection of a circuit formed on a semiconductor substrate or a liquid crystal display device is generally performed by using an inspection device equipped with a large number of contact probes. As for the structure of each of the contact probes, the structure shown in FIG.
There was a structure as shown in. In this contact probe 9, the tip 1 for contacting the object to be measured is
It is connected to a columnar root portion 3 via a spring portion 2. The upper end of the root portion 3 may have a conical shape as shown in FIG. The spring portion 2 is composed of a coil spring. To assemble a large number of contact probes 9 having such a structure into an inspection apparatus, a wiring board 23 as shown in FIG. 21 has been used. The wiring board 23 is a substrate made of ceramic or resin, and is provided with a large number of connection holes 24 corresponding to the diameter of the root portion 3. The connection hole 24 is a through hole. As shown in FIG. 22, the root portion 3 is connected to the connection hole 2
4, the contact probe structure in which a large number of tip portions 1 are juxtaposed in the same direction from the wiring board 23 is realized. Since the root portions 3 of the contact probes 9 are juxtaposed from the surface on the opposite side of the wiring board 23, the root portions 3 are electrically connected to the inspection apparatus body.

[0003]

In the contact probe structure used in the conventional inspection apparatus, the material of the wiring board 23 holding a large number of contact probes is ceramic or resin. On the other hand, the object to be measured is often a silicon substrate which is a base material of the IC, and the wiring board and the silicon substrate have different coefficients of thermal expansion.
There is a problem that the arrangement of the tip portion 1 of the contact probe deviates from the arrangement of the electrodes to be measured on the silicon substrate, and accurate measurement cannot be performed.

In order to eliminate the difference in the coefficient of thermal expansion, it is conceivable that the wiring board 23 is made of silicon, which is the same material as the material to be measured, but it is difficult to make the connection hole 24 with silicon. Therefore, the wiring board made of silicon has not been put to practical use.

Further, conventionally, the connection of the contact probe to the wiring board 23 was made by the connection hole 24, and therefore the connection hole 24 had to be machined with a drill. Therefore, the position of the connection hole 24 depends on the stage accuracy of the processing apparatus, and it is difficult to perform high-precision processing. In particular, it was difficult to reduce the positional error of the connection hole 24 to 10 μm or less.

Therefore, an object of the present invention is to provide a contact probe structure which is easy to assemble without a problem of positional deviation due to a difference in coefficient of thermal expansion from the object to be measured, and a manufacturing method thereof.

[0007]

In order to achieve the above object, a contact probe structure according to the present invention has a plurality of contacts each having a tip for contacting an object to be measured and a root for extracting an electrode. The probe and the first and second holding members having a plurality of parallel grooves are provided, and the first and second holding members project the tip portions of the plurality of contact probes in a line. Thus, the root portions of the plurality of contact probes are sandwiched in the plurality of grooves and fixed to each other. By adopting this configuration, the holding member does not need to be bored by a conventional drill or the like and only needs to be grooved, which facilitates manufacturing. Further, in the case of the groove processing, the position accuracy is higher and the processing is easier than the hole processing, so that each contact probe can be held in a desired arrangement with high accuracy.

In the above invention, preferably, the first and second holding members have a surface covered with a metal thin film on a side different from the surface on which the groove is formed. By adopting this configuration, the contact probe sandwiched inside the holding member and the external environment are shielded by the metal thin film, so that the high frequency characteristics of the contact probe can be improved.

In order to achieve the above object, in another example of the contact probe structure according to the present invention, a plurality of the above contact probe structures are laminated so that the directions in which the above-mentioned tip portions project are aligned. It is a contact probe structure in which the above-mentioned tip portions of the probe are arranged side by side in a plane and protrude. By adopting this configuration, the tips can be arranged in a desired pattern in a two-dimensional manner, so that the electrodes scattered in a two-dimensional manner within the planar region of the object to be measured can be simultaneously processed. It is possible to press the tip part, which increases the degree of freedom of measurement.

In the above invention, preferably, the first and second holding members are silicon substrates. By adopting this configuration, when the object to be measured is formed on a silicon substrate, it is possible to expand and contract in the same way as the expansion and contraction of the object to be measured due to temperature change. .

In order to achieve the above object, a method of manufacturing a contact probe structure according to the present invention comprises a groove forming step of forming a groove on each main surface of the first and second silicon substrates, and forming the groove. And an assembling step of bonding the main surfaces of the first and second silicon substrates such that the root portions of the contact probes are sandwiched between the grooves. By adopting this method, it is possible to easily manufacture a contact probe structure in which contact probes are arranged with high accuracy and high density.

Preferably, in the above invention, the groove forming step is performed by etching or grinding. By adopting this method, it is possible to accurately form a groove having a desired cross-sectional shape.

In the above invention, preferably, in the assembling step, the main surfaces are bonded together by any one of anodic bonding of silicon, direct bonding of silicon surfaces by fluoride treatment, and bonding with an adhesive. By adopting this method, the holding members can be bonded to each other with high accuracy.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION A conventional contact probe is mainly manufactured by machining, and is a columnar one with a coil spring attached like the contact probe 9 shown in FIG. . However, in recent years, LIGA (Lith
A method of manufacturing a contact probe by the ographie Galvanoformung Abformung method has been proposed. The contact probe manufacturing method by the LIGA method is, for example,
As disclosed in Japanese Patent Application No. 2000-164407, a resist film is formed on the surface of a substrate, the resist film is processed into a desired pattern by lithography, and plating is performed to form a metal layer on a portion where there is no resist film. To form
Finally, only the metal layer portion is taken out and used as a contact probe. When manufactured in this way, like the contact probe 10 illustrated in FIG.
The shape has a certain flat pattern and a certain thickness. Therefore, in the contact probe manufactured in this manner, the tip portion 1 and the root portion 3 are basically not a columnar shape like the conventional contact probe 9, but are square pillars. Therefore, the inventors have made the present invention as described below by taking advantage of the characteristics of the shape of the contact probe formed by the LIGA method.

(First Embodiment) (Structure) Referring to FIG. 2, a first embodiment according to the present invention.
The contact probe structure 91 in FIG. The contact probe structure 91 has a shape in which a plurality of contact probes 10 (see FIG. 1) are sandwiched between a pair of holding members 21 and 22 having a plurality of grooves 18 parallel to each other as shown in FIG. Has become. From one end surface of this contact probe structure 91, the tip portions 1 of the respective contact probes 10 are projected in a line, and from the other end surface, the root portions 3 of the respective contact probes 10 are projected in a line. . The positional relationship of the arrangement of the contact probes 10 is constrained by the holding members 21 and 22, and thus is maintained in a constant arrangement.

The cross section of the contact probe structure 91 is as shown in FIG. That is, the plurality of holes 19 are formed so as to be sandwiched between the plurality of grooves 18.
The contact probe 10 is housed in each hole 19. A part of the root part 3 and a part of the tip part 1 of each contact probe 10 protrude from the end faces of the holding members 21 and 22. Here, the root portion 3 is the holding member 2
By being sandwiched between 1 and 22, the displacement of the hole 19 in the longitudinal direction is restricted. The contact probe 10 shown in FIG. 4 is actually accommodated obliquely, as can be seen from the root portion 3 seen on the front end face of FIG.
Strictly speaking, the cross section of the spring portion 2 is different from the shape shown in FIG. 4, but in FIG. 4, the cross section of the spring portion 2 is simplified and shown. Hereinafter, the same applies to the spring portion 2 in FIGS. 18 and 19.

In the example shown in FIG. 4, the root portion 3 is fixed by being sandwiched by the holding members 21 and 22, but the tip portion 1 is displaceable along the longitudinal direction of the groove 18. In addition, in the example shown in FIG. 2 and FIG. 4, a part of the root part 3 is projected, but if a necessary electrode can be taken out from the end face of the root part 3, a part of the root part 3 is removed. It does not have to be protruding. By pressing each tip 1 simultaneously against the object to be measured, each spring portion 2 is elastically deformed, and each tip 1 is displaced toward the inside of the hole 19.

(Operation / Effect) In the contact probe structure of the present embodiment, the holding member does not need to be formed with a conventional drill or the like,
It is easy to manufacture because it only needs to be grooved. Further, in the case of the groove processing, the position accuracy is higher and the processing is easier than the hole processing, so that each contact probe can be held in a desired arrangement with high accuracy.

In the case of groove processing, unlike hole processing,
Since it can be easily performed on silicon as described later, the holding member can be made of silicon. When the contact probe is held by the holding member made of silicon, the thermal expansion coefficient of the holding member becomes equal to that of the substrate of the measured object when the substrate of the measured object is silicon. Therefore, even if the DUT expands and contracts due to temperature changes, the holding member side also expands and contracts.
It will contract. As a result, if the desired array of electrodes and the array of the tip of the contact probe are first matched, the relative positional relationship does not change as it is, regardless of subsequent temperature changes, and accurate measurement is possible. You can continue. Since the object to be measured is often a semiconductor element formed on a silicon substrate, the advantage of forming the holding member from silicon is great.

In addition to the example shown in FIG. 4, as a modified example, a contact probe as shown in FIGS. 5 and 6 may be used. In the example shown in FIG. 5, the root portion 3 is the holding member 2
It is not firmly clamped by 1 and 22 and can be displaced inside the hole 19. However, since the base portion 3 is provided with the stopper portion 34, the contact probe does not fall out of the hole 19 downward in the drawing. In the example shown in FIG. 6, the contact probe includes a fixed part 4 and an electrode extraction part 5 instead of the root part 3 (see FIG. 4), and the fixed part 4 and the electrode extraction part 5 are connected by a spring. Has been done. The electrode lead-out portion 5 has a hole 1 inside the hole 1.
9 is displaceable along the longitudinal direction of the hole 9, and the fixed portion 4 is held by the holding members 21 and 22 to restrain the displacement of the hole 19 in the longitudinal direction.

(Second Embodiment) (Structure) Referring to FIG. 7, a second embodiment according to the present invention.
The contact probe structure 92 in FIG. In this contact probe structure 92, the contact probe structure 91 described in the first embodiment or another contact probe structure having the same shape but a different arrangement of contact probes is arranged so that the tips 1 project in the same direction. A plurality of layers are laminated and bonded together.

(Operation / Effect) In the contact probe structure 91 according to the first embodiment, the tip portions 1 of the contact probes are arranged in a line.
In contact probe structure 92 in the present embodiment, tip portions 1 of the contact probe can be two-dimensionally arranged in a desired planar area in a desired arrangement. In FIG. 7, the contact probe structures having different arrangements are laminated, but the contact probe structures arranged in one row in the same arrangement pattern may be combined and laminated.

In the contact probe structure 92 in this embodiment, the tip portion 1 is two-dimensionally formed in a desired pattern.
Since the electrodes can be arranged, the tip portions 1 can be pressed all at once to the electrodes that are two-dimensionally spread and scattered in the planar region of the object to be measured, and the degree of freedom of measurement is increased.

(Third Embodiment) (Structure) Referring to FIG. 8, a third embodiment according to the present invention.
The contact probe structure 93 in FIG. In this contact probe structure 93, the holding members 21, 22 have a surface covered with the metal thin film 25 on a side different from the surface on which the groove for accommodating the contact probe is formed. In the example shown in FIG. 8, the metal thin film 25 is formed on the surface opposite to the surface on which the groove is formed.

(Operation / Effect) In the contact probe structure 93 of the present embodiment, the portion in which the contact probe is housed is sandwiched between the metal thin films 25, so that the space between the contact probe and the external environment is shielded. Therefore, the high frequency characteristics of the contact probe can be improved.

When the same idea as in the second embodiment is applied, a plurality of contact probe structures for one row are laminated to form a contact probe structure 94 which is two-dimensionally arranged and is shown in FIG. Thus, the metal thin film 25 may be arranged between the layers. By doing so, crosstalk noise between the layers can be prevented, and the high frequency characteristics of the contact probe structure 94 as a whole can be improved.

(Fourth Embodiment) (Manufacturing Method) With reference to FIGS. 10 to 17, a method of manufacturing a contact probe structure according to a fourth embodiment of the present invention will be described. The contact probe structure manufactured by this manufacturing method is the contact probe structure 91 described in the first embodiment, and includes the holding members 21 and 2.
2 is made of silicon.

To manufacture this contact probe structure 91, first, a groove forming step is performed. In the groove forming step, as shown in FIG. 10, the groove 18 is processed on the main surface of the silicon substrate 20. The plurality of grooves 18 are processed in one main surface and are processed in parallel in a desired arrangement. In FIG. 10, the dicing saw 15 is used to form the groove 18
Is being processed. The groove 18 is a V-shaped groove as shown in FIG. The shape of the groove to be processed is not limited to the V shape, and may be another shape as required. For example, in FIG.
As shown in, a dicing saw 15k having a rectangular end may be used to form a groove having a rectangular cross section. Further, although not shown, for example, when a cylindrical contact probe like the conventional contact probe 9 is desired to be housed,
The groove may have a semicircular cross section.

As the groove forming step, a method using etching may be adopted instead of the method using a dicing saw. In this case, the relationship between the surface of the silicon substrate 20 where the groove is to be formed, that is, the main surface, and the crystal orientation of the silicon substrate itself is important. For example, when it is desired to form a V-shaped groove, it is necessary to use the silicon substrate 20 whose main surface is the (100) plane.

As shown in FIG. 13, a Si ₃ O ₄ film 16 is formed on the main surface of the silicon substrate 20, and a resist film 17 is formed thereon. Lithography is performed on the resist film 17 to form an opening in a region of the resist film 17 corresponding to the groove. Si using the resist film 17 as a mask
_{The 3} O ₄ film 16 is etched to obtain the structure shown in FIG. As shown in FIG. 15, after removing the resist film 17, etching with KOH is performed using the Si ₃ O ₄ film 16 as a mask. Here, the silicon substrate 20 is
Since the (100) plane was the main surface, the progress of etching was affected by the crystal orientation, and the V-shaped groove 18 was formed as shown in FIG. If it is desired to form a rectangular groove, the same etching may be performed using a silicon substrate whose main surface is the (110) plane. Details of these etching techniques are disclosed as "Crystalline anisotropic etching" on pages 16 to 19 of "Micromachining and Micromechatronics" by Esashi et al. (Baifukan, first edition issued June 20, 1992). Has been done. When the desired groove is formed, the Si ₃ O ₄ film 16 is removed as shown in FIG.

The groove forming step may be a method using a dicing saw as described above or a method using etching. Alternatively, as another method, grinding may be performed. A pair of grooved silicon substrates 20
Serve as holding members 21 and 22. The arrangement of the grooves 18 is formed in such a position that the holding member 21 and the holding member 22 are in a mirror image relationship with each other in consideration of later bonding to each other. After the desired groove is formed on the main surface, the assembly process is performed next.

In the assembly process, a pair of holding members 21, 22
Main surfaces of the contact probes 10 are opposed to each other so that the positions of the grooves 18 are aligned with each other, and the contact probes 10 shown in FIG. The main surfaces are attached to each other so as to sandwich.

Several methods are conceivable as a method of joining the main surfaces to each other, but the first method is anodic bonding of silicon. Regarding the technology of anodic bonding of silicon, "Micromachining and micromechatronics" by Esashi et al. (Published by Baifukan,
It is disclosed on page 47 of the first edition issued June 20, 1992) as "direct joining". That is, when the silicon surfaces to be bonded are made extremely smooth, they are superposed at room temperature in a clean atmosphere and then dehydrated and condensed at a high temperature, the Si atoms are bonded to each other.

As a second method, the surface of silicon can be treated with fluoride. For more information on this method, see "Condition optimiza" by H. Nakanishi et al.
tion, reliability evaluation of SiO2-SiO2 HF bondi
ng and its application for UV detection micro flow
cell "(Sensors and Actuators 83 (2000), pp.136-141)
Is disclosed in. That is, the silicon surface covered with the oxide film (SiO ₂ ) is washed with hydrofluoric acid, and the silicon surfaces are bonded together.

As a third method, a pair of holding members 2
The main surfaces of 1 and 22 may be adhered to each other with an adhesive. When the groove 18 is formed by etching and is bonded by an adhesive, as shown in FIG. 17, the Si ₃ O ₄ film 16 is formed.
It is not necessary to remove the above, and as shown in FIG. 16, the bonding may be performed while leaving the Si ₃ O ₄ film 16 on the main surface.

(Operation / Effect) By adopting such a manufacturing method, as shown in FIG. 2, the contact probe structure 91 in which the contact probes are held in one row in a desired arrangement can be easily manufactured. be able to. Since the holding members 21 and 22 are made of silicon, when the object to be measured is formed on a silicon substrate, it expands and contracts in the same manner as the expansion and contraction of the object to be measured due to temperature changes. Possible contact probe structure 9
1 can be obtained. Further, a plurality of the contact probe structures 91 and other contact probe structures having the same shape but different contact probe arrangements are combined and laminated, and the contact probe structure 9 shown in FIG.
It may be 2.

In the above-mentioned example, the contact probe structure 91 including the contact probe 10 has been described as an example. Therefore, in the assembly process, the root portion 3 is sandwiched, but as shown in FIGS. The same manufacturing method can also be used when the contact probe is used. In those cases, which part of the contact probe is sandwiched may be appropriately selected.

(Fifth Embodiment) An inspection apparatus using a contact probe structure according to a fifth embodiment of the present invention will be described with reference to FIG. In this inspection device, the hole 1 is sandwiched between the holding members 21 and 22.
In the contact probe held in 9, the shape of the root portion 3 is different from that shown in the first embodiment. That is, the root portion 3 is provided with a stopper portion 35 protruding like a brim, and the root portion 3 has the stopper portion 35.
The holding members 21 and 22 are positioned by hanging on the end surfaces of the holding members 21 and 22. On the upper side of the root portion 3, a connection portion 3 for electrically connecting with the ceramic multilayer substrate 31.
3 is provided. The connection part 33 is a tip part 33 for connection.
a and a connecting spring portion 33b are included. Even the contact probe having such a shape can be integrally formed from the tip portion 1 to the connection portion 33 by the LIGA method. Therefore, the present invention is applied to the structure as shown in FIG. Can be assembled into FIG. 18 shows a state before connecting the ceramic multilayer substrate 31 to the connecting portion 33 for the sake of clarity, but from this state, the ceramic multilayer substrate 31 protrudes from the holding members 21, 22. By pressing against 33, the electrode 32 comes into contact with the connecting tip 33a. Since the connecting tip portion 33a is formed of a conductor integrally with the tip portion 1, the electric signal detected by the tip portion 1 is transmitted to the electrode 32 via the connecting tip portion 33a. .

As an electrical connection between the contact probe and the ceramic multilayer substrate 31, the example shown in FIG. 19 is also possible. In this example, the root portion 3 of the contact probe has a stopper portion 36 at the upper end. FIG. 19 shows a state before connecting the ceramic multilayer substrate 31 to the contact probe for the sake of clarity. From the state shown in FIG. 19, the ceramic multilayer substrate 31
The anisotropic conductive sheet 37 so that the positions of the electrodes 32 to be connected are aligned with the positions of the stopper portions 36, respectively.
Via the contact probe structure.
Since the upper portion of the stopper portion 36 projects in a spherical shape, the upper portion of the stopper portion 36 of the anisotropic conductive sheet 37 and the electrode 3 are formed.
Only the part that is sandwiched and compressed by 2 is electrically connected, and the electrical signal detected at the tip 1 is
Each is transmitted to the electrode 32.

It should be noted that the above-described embodiment disclosed this time is illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description but by the scope of the claims, and includes meaning equivalent to the scope of the claims and all modifications within the scope.

[0041]

According to the present invention, with respect to the holding member,
Since it is not necessary to perform hole processing with a conventional drill or the like and only groove processing is required, manufacturing becomes easy. Further, in the case of the groove processing, the position accuracy is higher and the processing is easier than the hole processing, so that each contact probe can be held in a desired arrangement with high accuracy.

[Brief description of drawings]

FIG. 1 is a perspective view of a contact probe manufactured by a LIGA method.

FIG. 2 is a perspective view of a contact probe structure according to the first embodiment of the present invention.

FIG. 3 is a perspective view of a pair of holding members used in the contact probe structure according to the first embodiment of the present invention.

FIG. 4 is a sectional view of a contact probe structure according to the first embodiment of the present invention.

FIG. 5 is a sectional view of another example of the contact probe structure according to the first embodiment of the present invention.

FIG. 6 is a sectional view of still another example of the contact probe structure according to the first embodiment of the present invention.

FIG. 7 is a perspective view of a contact probe structure according to a second embodiment of the present invention.

FIG. 8 is a perspective view of a first contact probe structure according to the third embodiment of the present invention.

FIG. 9 is a perspective view of a second contact probe structure according to the third embodiment of the present invention.

FIG. 10 is a first explanatory diagram when a dicing saw is used as a groove forming step in the method of manufacturing the contact probe structure according to the fourth embodiment of the present invention.

FIG. 11 is a second explanatory diagram in the case where a dicing saw is used as the groove forming step in the method of manufacturing the contact probe structure according to the fourth embodiment of the present invention.

FIG. 12 is a third explanatory diagram in the case where a dicing saw is used as the groove forming step in the method of manufacturing the contact probe structure according to the fourth embodiment of the present invention.

FIG. 13 is an explanatory diagram of a first step when etching is performed as a groove forming step in the method of manufacturing the contact probe structure according to the fourth embodiment of the present invention.

FIG. 14 is an explanatory diagram of a second step when etching is performed as the groove forming step of the method of manufacturing the contact probe structure according to the fourth embodiment of the present invention.

FIG. 15 is an explanatory diagram of a third step when etching is performed as the groove forming step of the method of manufacturing the contact probe structure according to the fourth embodiment of the present invention.

FIG. 16 is an explanatory diagram of a fourth step when etching is performed as the groove forming step of the method of manufacturing the contact probe structure according to the fourth embodiment of the present invention.

FIG. 17 is an explanatory diagram of a fifth step when etching is performed as the groove forming step of the method for manufacturing the contact probe structure according to the fourth embodiment of the present invention.

FIG. 18 is a sectional view of a first example of an inspection device using a contact probe structure according to a fifth embodiment of the present invention.

FIG. 19 is a sectional view of a second example of the inspection device using the contact probe structure according to the fifth embodiment of the present invention.

FIG. 20 is a perspective view of a conventional contact probe.

FIG. 21 is a perspective view of a wiring board for holding a conventional contact probe.

FIG. 22 is a cross-sectional view of a conventional contact probe held on a wiring board.

[Explanation of symbols]

1 tip part, 2 spring part, 3 root part, 4 fixing part, 5 electrode extraction part, 9, 10 contact probe,
15,15k dicing saw, 16 Si ₃ O ₄ film, 1
7 resist film, 18 groove, 19 hole, 20 silicon substrate, 21, 22 holding member, 23 wiring board, 24 connection hole, 25 metal thin film, 31 ceramic multilayer substrate, 3
2 electrodes, 33 connection part, 33a connection tip part, 33
b connection spring part, 34, 35, 36 stopper part, 37 anisotropic conductive sheet, 91, 92, 93, 94
Contact probe structure.

Claims (7)

[Claims] 1. A plurality of contact probes each having a tip for contacting an object to be measured and a root for taking out an electrode, and first and second holding members having a plurality of grooves parallel to each other. The first and second holding members respectively sandwich the root portions of the plurality of contact probes in the plurality of grooves so that the tip portions of the plurality of contact probes project in a line. A contact probe structure that is fixed to each other. 2. The contact probe structure according to claim 1, wherein the first and second holding members have a surface covered with a metal thin film on a side different from a surface on which the groove is formed. 3. The contact probe structure according to claim 1, wherein a plurality of the contact probe structures are laminated so that the directions in which the tip portions project are aligned, and the tip portions of the plurality of contact probes project side by side in a planar manner. The contact probe structure. 4. The contact probe structure according to claim 1, wherein the first and second holding members are silicon substrates. 5. A groove forming step of forming a groove on each of the main surfaces of the first and second silicon substrates; and a step of forming a groove of the contact probe between the first and second silicon substrates having the groove formed therein. And a step of assembling the main surfaces so that the root portions are sandwiched therebetween. 6. The method for manufacturing a contact probe structure according to claim 5, wherein the groove forming step is performed by etching or grinding. 7. The main surfaces are bonded together by using either anodic bonding of silicon, direct bonding of silicon surfaces by fluoride treatment, or bonding with an adhesive in the assembling step. A method for manufacturing the contact probe structure according to 1.