JP2003178940A - Step control system and method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the efficiency of information control in a semiconductor manufacturing flow. <P>SOLUTION: According to chip ID information, two-dimensional bar codes 30, 91 and 173 are individually given to each chip 31 arranged on a wafer 50, or each lead frame 93 to which a chip 92 is bonded, or each package product 171 for resin-packaged semiconductor chip. Thus, the information for the respective chip 31, frame 93 and product chip 171 can be controlled, and the efficiency and accuracy of information control for a semiconductor device can be improved in all steps relating semiconductor manufacturing such as the processing steps, distribution step, shipping step, claim processing step, etc., in the semiconductor manufacturing flow. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process control system and a process control method, and in particular, to efficiently and accurately perform information control relating to a semiconductor device manufacturing process by utilizing a two-dimensional bar code pattern. The present invention relates to a process control system and a process control method capable of performing.

[0002]

2. Description of the Related Art Generally, a semiconductor device manufacturing process includes a great number of processes. Looking at a typical semiconductor device manufacturing process, first, in a wafer processing process, a required semiconductor chip is formed on a wafer surface by repeating a photolithography process, an etching process, a cleaning process, and the like. Next, the probe device inspects each chip formed on the wafer for good or bad, acquires mapping data, and then sends it to the wafer assembly process. In the wafer assembly process, the wafer is first divided into dies in the dicing process. Then,
In the bonding process, a good die is picked up according to the mapping data and mounted on the lead frame. Further, in the wire bonding process, the connection electrode on the semiconductor chip and the external lead-out terminal are connected by wire bonding. Then, in a packaging process, a semiconductor chip is molded with a thermosetting resin, and predetermined information is marked on the surface of the package to complete the semiconductor device.

As described above, a great number of complicated steps are required until a semiconductor device is completed, and it is necessary to accurately manage information on semiconductor products in each step. In this regard, in the conventional semiconductor manufacturing process, since the focus has been on mass-producing semiconductor devices of the same standard and making the most of their economies of scale, it is relatively easy to manage information on semiconductor devices that are distributed in the process. It was That is,
In the conventional semiconductor manufacturing process, since semiconductor devices processed by the same manufacturing method are collectively processed as one lot for in-process distribution, each lot is usually processed under the same conditions, and the information management is also performed. It was relatively easy.

However, in recent years, semiconductor devices have been widely used as general merchandise and industrial parts. For example, AS
There is an increasing market demand for high-mix low-volume production of semiconductor devices such as IC (application specific IC) and SOS (system on silicon). In such a semiconductor device for a specific application, for example, in terms of quantity, it may be sufficient to produce a plurality of types with one wafer.

On the other hand, if a part of the chip is a good product such as a large capacity memory chip, it can be shipped as a product.
There is also a need to manage information individually for each chip.

In this regard, also in the conventional semiconductor manufacturing process, by marking ID information such as numbers or alphabets on the surface of the semiconductor chip on the wafer or the resin-sealed semiconductor package, the physical distribution of the semiconductor device in the process can be achieved. Was being managed. However, there is a limit to the amount of information that can be recorded with numbers and alphabets, and it is necessary to perform edge recognition processing when reading numbers and alphabets, which makes recognition work difficult, and is also vulnerable to dirt and scratches. was there.

In this respect, since the reading operation by the optical device can be easily performed, in the in-process distribution of the semiconductor device in the semiconductor manufacturing process, various information is also recorded by using the one-dimensional bar code pattern. ing. However,
There is a limit to the amount of information that can be stored in a one-dimensional barcode pattern per unit area, and as the amount of information that you want to put on the one-dimensional barcode pattern increases, so does the area of the one-dimensional barcode pattern. Information management based on patterns cannot be used in all semiconductor manufacturing processes that handle semiconductor devices with limited information storage space.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems relating to the information management of semiconductor devices in the in-process distribution of the conventional semiconductor manufacturing process, and is made for each chip arranged on a wafer. , Or a new and improved process control system and process control method capable of individually managing information for each lead frame to which a semiconductor chip is bonded or for each package product of a resin-sealed semiconductor chip. Is to provide.

Further, another object of the present invention is to provide various kinds of information in a limited minute space of a semiconductor device so as to improve efficiency and accuracy of in-process distribution of a semiconductor manufacturing process. An object of the present invention is to provide an improved process control system and process control method.

Still another object of the present invention is to make it possible to easily obtain the ID information attached to each chip, each lead frame, or each product chip by a relatively inexpensive industrial optical device. Moreover, it is an object of the present invention to provide a new and improved process control system and process control method capable of obtaining highly reliable information even if stains or scratches occur.

Further, according to the present invention, the registered product ID information is associated with various additional information such as manufacturing process history information and complaint information in the field after shipping so that the shipped product can be maintained in a user-friendly manner. It is to provide a new and improved process control system and process control method capable of providing a service.

[0012]

In order to solve the above problems, according to a first aspect of the present invention, a plurality of grid-like patterns are formed on a surface in a first direction and a first direction according to information. A reading device for reading the two-dimensional pattern of a semiconductor chip having a two-dimensional pattern arranged in a second direction perpendicular to the one direction, and a desired chip for the two-dimensional pattern read by the reading device There is provided a process management system including: a management unit that manages each semiconductor manufacturing process using the chip information in association with information. A plurality of semiconductor chips may be arranged on the wafer, and the chip information may include ID information unique to each chip. Further, the 1D information may include mapping data obtained in the probing process.

In order to solve the above problems, the second aspect of the present invention
From the viewpoint of, a plurality of grid-like patterns are formed on the surface.
A reading device for reading the two-dimensional pattern of a lead frame to which a two-dimensional pattern formed by arranging in a first direction and a second direction perpendicular to the first direction according to information is added, and a reading device There is provided a process management system comprising: a management unit that associates desired frame information with the two-dimensional pattern read by and manages each semiconductor manufacturing process using the frame information.

In order to solve the above problems, the third aspect of the present invention
From the viewpoint of, a plurality of grid-like patterns are formed on the surface of the resin of a semiconductor device in which a semiconductor chip is sealed with a resin.
A reading device for reading the two-dimensional pattern of a semiconductor device to which a two-dimensional pattern formed by being arranged in a first direction and a second direction perpendicular to the first direction according to information is added, and a reading device There is provided a process management system comprising: a management unit that associates desired information with the two-dimensional pattern read by the above and manages each semiconductor manufacturing process using the information. The information may include manufacturing process history information of the sealed semiconductor chip. Further, the information may include at least one of product shipping information and complaint information from the user after shipping.

In order to solve the above problems, the fourth aspect of the present invention
From the viewpoint of the above, a two-dimensional array formed by arranging a plurality of square-shaped patterns on a surface of a semiconductor chip in a first direction and a second direction perpendicular to the first direction according to information A process control characterized by adding a pattern, reading the two-dimensional pattern in a manufacturing process, and correlating the read two-dimensional pattern with desired information, and managing each manufacturing process based on the information. A method is provided. A plurality of semiconductor chips may be arranged on the wafer, and corresponding information may include ID information unique to each chip. Further, the ID information may include mapping data obtained in the probing process.

In order to solve the above problems, the fifth aspect of the present invention
According to the viewpoint, a two-dimensional pattern formed by arranging a plurality of square-shaped patterns on a surface of a lead frame in a first direction and a second direction perpendicular to the first direction according to information. A process control characterized by adding a pattern, reading the two-dimensional pattern in a manufacturing process, and correlating the read two-dimensional pattern with desired information, and managing each manufacturing process based on the information. A method is provided.

In order to solve the above problems, the sixth aspect of the present invention
From the viewpoint of, a plurality of grid-like patterns are formed on the surface of the resin of a semiconductor device in which a semiconductor chip is sealed with a resin.
A two-dimensional pattern formed by arranging in a first direction and a second direction perpendicular to the first direction according to information is added, and the two-dimensional pattern is read in the manufacturing process and the read two-dimensional pattern is added. There is provided a process management method characterized in that a dimensional pattern is associated with desired information and each manufacturing process is managed based on the information. The information may include manufacturing process history information of the sealed semiconductor chip.
Further, the information may include at least one of product shipping information and complaint information from the user after shipping.

In order to solve the above problems, the seventh aspect of the present invention
From the viewpoint of, a plurality of grid-like patterns are formed on at least one surface of the semiconductor chip, the lead frame, and the semiconductor device in which the semiconductor chip is sealed with resin.
A two-dimensional pattern formed by arranging in a first direction and a second direction perpendicular to the first direction according to information is added, and the two-dimensional pattern is read in the manufacturing process and the read two-dimensional pattern is added. There is provided a process management method characterized in that a dimensional pattern is associated with desired information and each manufacturing process is managed based on the information.

In order to solve the above problems, the eighth aspect of the present invention
From the viewpoint of, a plurality of grid-like patterns are formed on the respective surfaces of the semiconductor chip, the lead frame, and the semiconductor device in which the semiconductor chip is sealed with resin in the first direction and the A two-dimensional pattern arranged in a second direction perpendicular to the first direction is added, the two-dimensional pattern is read in the manufacturing process, and the read two-dimensional pattern is associated with desired information. Then, a process control method is provided which is characterized by performing control of each manufacturing process based on the information. The information corresponding to the two-dimensional pattern added to the semiconductor chip, the information corresponding to the two-dimensional pattern added to the lead frame, and the information corresponding to the two-dimensional pattern added to the semiconductor device are associated with each other. You may

In order to solve the above problems, according to another aspect, each chip arranged on the wafer surface is projected and exposed with a two-dimensional bar code pattern for information management as chip ID information. A semiconductor device is provided. Note that chip information unique to each chip can be included as chip ID information added to the two-dimensional barcode pattern.

Since a two-dimensional bar code pattern has a very large amount of information that can be recorded per unit area and can be easily recognized by an optical device, it has been impossible on the wafer surface in the past. Marking can be performed on each arrayed chip, and information management on each chip can be easily performed.

As a method of marking a two-dimensional bar code pattern on each chip, if projection exposure is performed with a liquid crystal mask capable of changing a light transmission pattern for each shot, each wafer can be exposed using the same mask. It becomes possible to give individual chip ID information.

In order to solve the above-mentioned problems, according to another aspect, a two-dimensional barcode pattern for information management is marked as frame ID information on a lead frame to which a semiconductor chip is bonded. A device is provided. The frame ID information added to the two-dimensional barcode pattern can include chip arrangement information within the frame and chip ID information.

According to this structure, it is possible to easily identify the lead frame with a chip, which was conventionally indistinguishable by simply looking at each lead frame, and at the same time, using an appropriate optical device, By reading the ID information, the chips bonded in the frame can be individually distinguished.

In order to solve the above problems, according to another aspect, a two-dimensional bar code pattern for information management is marked as product ID information on the outer peripheral surface of a resin-sealed semiconductor chip. A semiconductor device is provided. The product ID information recorded in the two-dimensional bar code can include accessory information for each chip to be resin-sealed and chip ID information. According to such a configuration, it is possible to manage information for each chip even when the chip after molding is invisible.

Further, according to another aspect, there is provided a semiconductor device information management system for individually managing information on semiconductor devices for each semiconductor device. And this information management system uses the chip ID information and the chip ID.
Reading device for reading information and read chip ID
It is composed of a management unit that registers information and manages each semiconductor manufacturing process based on the registered chip ID information. Further, by managing the chip ID information and the mapping data at the time of probing in association with each other, erroneous pickup operation at the time of die bonding can be reduced.

Further, according to another aspect, there is provided a semiconductor device information management system for individually managing information about the semiconductor device for each semiconductor device. And this information management system uses the frame ID information and the frame ID
Reading device for reading information and read frame I
The D information is registered, and a management unit that manages each semiconductor manufacturing process based on the registered frame ID information.

Further, according to another aspect, there is provided a semiconductor device information management system for individually managing information about the semiconductor device for each semiconductor device. The information management system registers the product ID information, a reading device for reading the product ID information, the read product ID information, and manages the product shipping process based on the registered product ID information. And a section.

As described above, if the chip ID information, the frame ID information, and the product ID information coded by the two-dimensional bar code pattern are used in the in-process distribution of the semiconductor manufacturing process, fine control can be performed for each chip. This makes it possible to build a semiconductor manufacturing facility that can flexibly support high-mix low-volume production.

If the manufacturing process history information of each chip is associated with the registered product ID information, or the complaint information in the field after product shipment is associated,
When a problem occurs in the semiconductor manufacturing process, the cause can be narrowed down to the individual chip unit, and the maintenance service after shipping can be performed more finely.

[0031]

Preferred embodiments of the process control system and process control method according to the present invention will be described in detail below with reference to the accompanying drawings.

First, FIG. 1 shows an example of a two-dimensional bar code pattern applicable to this embodiment. As shown in the figure, the two-dimensional bar code pattern 10 is a two-dimensional pattern in which predetermined information can be recorded by coloring the two-dimensionally developed squares 11 in black and white according to a predetermined rule. is there. It should be noted that the conventional coding rules and the like can be used as the coding rules for coloring the squares of the two-dimensional pattern, or a new one can be created, but the coloring method is not the gist of the present invention. Since it is not directly related, its detailed description is omitted. However, it is possible to code the data error detection in the coding rule, and in that case, as described later, it is recorded in each chip, each frame, or each resin-sealed semiconductor chip. It is possible to reduce errors when reading the two-dimensional barcode pattern.

Here, a one-dimensional bar code pattern conventionally used as a pattern capable of recording various information will be described in comparison with a two-dimensional bar code pattern applied to the present invention. FIG. 2 shows an example of a typical one-dimensional bar code pattern. As shown in the figure, the one-dimensional bar code pattern 20 has black and white parallel bars 21 of several widths and optical character recognition. It is composed of a character string 23 composed of characters in a font. However, such a one-dimensional barcode pattern 20 has a limit in the amount of information that can be recorded in the pattern per unit area, and as the amount of information desired to be recorded in the one-dimensional barcode pattern increases, the area of the one-dimensional barcode pattern increases. Therefore, the one-dimensional bar code pattern cannot be used as it is for information management in all semiconductor manufacturing processes that handle semiconductor devices with limited information storage space.

On the other hand, according to the knowledge of the inventor, the two-dimensional bar code pattern adopted in the present invention is
Compared to the conventional character information pattern and one-dimensional barcode pattern, it has the following excellent features. (1) The amount of information recorded per unit area is much larger than that of a one-dimensional bar code, and the size of the pattern can be set freely, so it is suitable for applications where the space for attaching the pattern is limited. (2) The pattern forming method is also easy, and various conventional techniques can be applied depending on the portion where the pattern is formed. (3) The optical recognition of the pattern is easy, and it is also resistant to dirt and scratches and has a high degree of freedom in the reading direction, so that the cost required for the information reading device can be kept low. (4) Since it is possible to include a code for data error detection in the pattern, it is possible to minimize the reading error of the pattern.

The present inventor has conducted extensive studies in view of the above-mentioned characteristics of the two-dimensional bar code pattern, and as a result, by utilizing the two-dimensional bar code pattern in various steps of the semiconductor manufacturing process, The present invention has been devised to enable efficient and accurate information management in internal logistics.

An embodiment using a two-dimensional bar code at each stage of the semiconductor manufacturing process will be described in detail below.

1. Embodiment in Wafer Process According to the present embodiment, the two-dimensional barcode pattern 30 as the chip ID information is used in the wafer process.
However, as shown in FIG. 3, the two-dimensional bar code patterns 30-1 to 30-1 to 30-1 to 31-3 are formed at predetermined positions (for example, the lower left position in the illustrated example) of the chips 31-1 to 31-3 formed on each wafer. Recorded as 30-3. To record the chip ID information, for example, in the photolithography process of the wiring process performed near the final process of the wafer process, the chip ID is provided at a predetermined position of the chip during projection exposure.
A two-dimensional barcode pattern corresponding to information can be projected and exposed.

FIG. 4 shows an embodiment of a liquid crystal mask for projecting and exposing the chip ID information on each chip. The liquid crystal mask 40 can change the liquid crystal array of each cell and express a light-transmitting / light-shielding pattern corresponding to a two-dimensional barcode pattern on the mask surface. The chip ID generation unit 41 obtains chip ID information such as product name, lot ID, and chip position coordinates for each chip. In the two-dimensional barcode conversion unit 42, the chip I
The chip ID information transmitted from the D generation unit 41 is converted into a two-dimensional barcode pattern. The liquid crystal driver 43 appropriately changes the light-transmitting / light-shielding pattern of each cell of the liquid crystal mask 40, and the light-transmitting / light-shielding pattern converted into the two-dimensional barcode pattern by the two-dimensional barcode conversion unit 42 is displayed by the liquid crystal driver 43. , Is displayed on the liquid crystal mask 40.

Then, using the liquid crystal mask 40,
By using a projection exposure apparatus (not shown) to perform shot exposure at a predetermined position on each chip, a unique two-dimensional barcode pattern can be printed on each chip. After that, a unique two-dimensional bar code pattern can be formed for each chip by performing a photolithography process and an etching process similar to a normal process. In the above example, a different two-dimensional bar code pattern is attached to each chip, but it goes without saying that the same two-dimensional bar code pattern can be attached to each chip. .

As described above, according to the present embodiment, it becomes possible to add the chip ID information for distinguishing each chip to each chip of the wafer in a very small area, which is impossible in the past. It is possible to distinguish each chip on the wafer surface individually. Further, in the wiring process of the wafer process, if the two-dimensional barcode pattern is formed on the chip, the chip ID information can be recorded for each chip without separately providing a space for adding the two-dimensional barcode pattern. . Further, by using the liquid crystal mask 40 as shown in FIG. 4, different chip ID information can be recorded for each chip with the same mask.

2. Embodiment in Wafer Assembly Process Next, the chip I recorded for each chip as described above
An embodiment in which the D information is used in the wafer assembly process of the semiconductor manufacturing process will be described.

Generally, in the semiconductor manufacturing process, after chips are formed on each wafer in the wafer process,
The prober system inspects each chip for good or bad. FIG. 5 shows non-defective chips 51 (white rectangles in FIG. 5) on the wafer 50 inspected in the probe process,
An example of the arrangement of the semi-defective chips 52 (rectangles with diagonal lines in FIG. 5) and the defective chips 53 (black rectangles in FIG. 5) is shown. The result of the probe inspection is managed as mapping data as shown in FIG. It should be noted that the semi-defective chips 52 include those that can be shipped by changing the wiring or the like. As described later, according to the present embodiment, information management is individually performed for each chip. Therefore, the semi-defective chip 52 can be easily shipped and the product yield can be improved.

FIG. 7 shows a chip I unique to each chip.
A schematic configuration of an assembly process information management system 70 using mapping data including D information and various information tables described later is shown. As shown in the figure, the information acquired in the probing process is the LAN for probing 7
1 to the LAN 73 for the assembly process via the bridge 72 and stored in the database 75 in the data server 74. The assembly process LAN 73 includes a semiconductor manufacturing device that executes each assembly process, for example, a die bonder (DB) 76 that picks up a die-cut chip and mounts it on a lead frame, an electrode on the chip and a terminal for external lead wire. Wire bonder (WB) connected by bonding
77, a marking machine 78 for marking the surface of a package packaged with a thermosetting resin, a chip sorter 79 for classifying chips based on the information stamped on the package, etc. are connected. Hereinafter, an application example of the ID information management according to the present invention in each semiconductor manufacturing apparatus in the chip assembly process will be described in detail.

(A) Embodiment in Die Bonder First, each chip I in the die bonder (DB) 76
Information management based on D information will be described. In the mapping data acquisition sequence 80 shown in FIG. 8, first,
From the die bonder (DB) 76 side, the data server 74 is inquired about the lot ID to be subjected to the bonding process (S81). Then, the data server 74 retrieves the wafer mapping data (see FIG. 6B) regarding the inquired lot from the database 75,
The data is transferred to the die bonder (DB) 76 (S82). The die bonder (DB) 76 performs die bonding processing based on the sent mapping data (S8).
3). At that time, according to the present embodiment, as shown in FIG. 6B, since each chip ID information is associated with the mapping data, when each chip is picked up by the die bonder (DB) 76, The two-dimensional bar code of each chip can be directly image-recognized, and each chip can be compared with the mapping data. As a result, it is possible to further reduce erroneous pickup during die bonding. When the bonding process is completed, an end signal is sent to the server 74, stored in the database 75 (S84), and the process proceeds to the next step.

As described above, the die bonder (DB) 76
In the above, by using the chip ID information attached to each chip, the chip ID information is processed by an appropriate optical device at the time of processing, as compared with the conventional device that relied only on the positional information of the coordinates of the wafer surface. Since it is possible to directly recognize and collate with the mapping data, it is possible to reduce the incidence of erroneous pick-up of the chip during die bonding.

The use of the two-dimensional bar code pattern in which the chip ID information directly marked on each chip is recorded has been described above, but as shown in FIG. By attaching to each frame 93 to be bonded, the frame I
It is also possible to record D information in each frame 93.

FIG. 10 shows an embodiment of a die bonder for marking the frame ID information on each frame. Explaining the schematic configuration of the die bonder 100 shown in the figure, the wafer ring storage magazine 101 stores a wafer ring 102 on which chips before bonding processing are mounted, and from there, a corresponding wafer ring is transferred by a transfer arm (not shown). 102 is taken out and transferred to the processing stage. Bonding arm 103
The chip to be bonded is taken out from the wafer ring 102 and transferred to the bonding head unit 104. The lead frame accommodated in the lead frame accommodating magazine 105 is appropriately supplied to the bonding head unit 104 by the lead frame supply device 106, and the chip is bonded to a predetermined position on the lead frame. Reference numeral 107 is an image recognition device for correcting the position of the chip bonded on the lead frame and recognizing the chip ID information attached to each chip. In this way, the lead frame that has undergone the bonding process is transferred to the marking section, where the frame ID
After the two-dimensional bar code pattern as the frame ID information is printed at a predetermined position by the information printing laser device 108, it is stored in the lead frame storage magazine 105 by the transport arm (not shown). The wafer ring after the bonding is returned to the wafer ring storage magazine 109.

As described above, by using the die bonder 100 as shown in FIG. 10 and adding the unique two-dimensional bar code pattern 91 to each frame 93,
It is possible to identify lead frames with chips, which were previously indistinguishable from looking at each frame.

Next, an example of using the frame ID information in the chip assembly process system as shown in FIG. 7 will be described. Note that FIG. 11 shows an example of a lead frame chip information table stored and managed in the database 75 of the data server 74. As shown in the figure, the lead frame chip information table contains a frame ID. Information, the number of chips, chip ID information, etc. are recorded and managed in association with the two-dimensional bar code pattern on the frame and the two-dimensional bar code pattern on each chip. Further, FIG. 12 shows an example of the manufacturing condition information table of each chip managed in the data server 74. As shown in the drawing, the manufacturing condition information table of each chip includes each chip ID and product code. In addition to basic data such as the wafer process flow number and probing category code, the equipment type, manufacturing conditions, processing date and time, processing equipment, collected data, etc. for each assembly process are recorded. It is managed in association with the two-dimensional barcode pattern on each chip.

As described above, by managing the frame ID information and the chip ID information in association with the two-dimensional bar code pattern on the frame and the two-dimensional bar code pattern on each chip, the frame ID information can be obtained from a certain manufacturing apparatus. If there is an inquiry regarding the chip ID information bonded to the frame based on the
Can search the information table for the frame and respond with the chip ID information bonded to the frame based on the data recorded in the information table. It can be done efficiently.

Next, yet another example of information inquiry / acquisition processing between the die bonder 76 and the data server 74 will be described with reference to the sequence 130 shown in FIG. First, the die bonder (DB) 76 is connected to the data server 74 by the lot ID for the bonding process.
Is inquired (S131). Then, the server 74 retrieves the wafer mapping data regarding the inquired lot from the database 75, and then the die bonder (DB) 7
6 (S132). Dice bonder (DB) 76
Then, the die bonding process is performed based on the sent mapping data (S133). At that time, according to the present embodiment, each chip ID is included in the mapping data.
Dice bonder (DB) because information is related
When each chip is picked up by 76, the two-dimensional bar code of each chip can be directly image-recognized and the matching with the mapping data can be performed for each chip, so erroneous pick-up at the time of die bonding is unlikely to occur.

When the bonding process for one frame is completed (S134), the die bonder (DB) 76
The data server 74 stores the frame ID information for which the processing is completed and the chip ID information bonded to the frame.
And the information table as shown in FIGS. 11 and 12 in the database 75 is updated (S135). Next, the die bonder (DB) 76 performs a bonding process for the next frame based on the mapping data (S136). When the bonding process for the frame is completed (S137), the frame I for which the process is completed is completed.
D information and chip ID bonded to the frame
The information is notified to the data server 74, and the database 75
The information table therein is updated (S138). Thereafter, the same procedure is repeated, and when the bonding process for the lot for which information has been provided from the data server 74 is completed,
The fact is reported to the data server 74 (S139), and the process proceeds to the next step.

As described above, according to the present embodiment, the two-dimensional code pattern recorded in each chip and the two-dimensional information recorded in each frame of the information about each chip recorded in the information table of the data server 74 are recorded. Since the management is performed in association with the code pattern, it is possible to improve the efficiency of the subsequent in-process distribution process and improve the information management accuracy. For example, in the subsequent manufacturing apparatus, if the frame ID information can be recognized by an appropriate image recognition apparatus, the chip ID information bonded to the frame and the manufacturing conditions of each chip are fetched from the information table stored in the data server 74. It becomes possible to perform accurate processing corresponding to each chip.

(B) Embodiment in Wire Bonder Next, as a concrete example of the above-mentioned information use, a data server 74
An embodiment will be described in which the information table stored in (1) and the two-dimensional bar code recorded in each chip and each frame are used in the wire bonding process.

FIG. 14 shows an outline of wiring between the chip and the lead in the wire bonding process. In the wire bonding process according to the present embodiment, the chip 142 on which the two-dimensional code 141 is arranged as shown in the figure. In wiring the wiring 145 between the bonding pad 143 and the lead 144 arranged in the peripheral area of the above, an information inquiry / acquisition processing sequence 150 as shown in FIG. 15 is performed.

Hereinafter, referring to FIGS. 15 and 16,
The information inquiry / acquisition processing sequence 150 in the wire bonding process will be described. First, the wire bonder (WB) 77 is the lot I to be processed.
The data server 74 is queried for D (S151). In response to the inquiry, the data server 74 retrieves the wiring information and the mapping data of the target lot from the information table stored in the database 75, and the wire bonder (W
D) It returns to 77 (S152). The lot wiring information includes the wiring pattern of each chip and the category data of each chip.

The wire bonder (WB) 77 performs the bonding (wiring) process based on the sent information. Next, referring to FIG. 16, the bonding process according to the present embodiment will be described. Will be described. First, the wire bonder (WB) 77 takes in product type wiring information and mapping data based on the lot ID from the data server 74 (S161), and supplies the corresponding chip to the bonding stage (S162). The wire bonder (WB) 77 recognizes the ID information on the frame and the chip by an appropriate image recognition device (S163). Then, based on the recognized ID information, the corresponding category code is acquired from the mapping data (S164), and the wiring pattern is set in the control unit (not shown) in the bonder according to the category type (S165, S165). S166-1,
S166-2, ..., S166-N).

Here, as shown in FIG. 5, there are good chips 51, semi-defective chips 52, and defective chips 53 in the wafer 50. In the semi-defective chips 52, there are redundant circuits and wiring patterns. There are products that can be shipped by changing the. In such a case, according to the present embodiment, by setting the optimum wiring category based on the chip ID information individually recognized for each chip,
The semi-defective chips 52 can be shipped and the yield can be improved.

Then, the wiring between the bonding pad 143 and the lead 144 of each chip 142 is performed by using the wiring coordinates corresponding to the wiring pattern set for each chip (S167). And wire bonder (WB) 77
When the predetermined bonding process is completed, the server reports the fact to the server 74 as shown in FIG. 15 (S154),
Go to the next step.

As described above, according to the present embodiment, the ID information of each chip is directly recognized by the appropriate image recognition device during wire bonding, and the wiring pattern and each chip set for each chip type are set. The wire bonding process can be performed by changing the wiring pattern according to the category code at the time of probing. As a result, even if the wiring pattern is different for each chip made from the same wafer, the bonding process can be performed without changing the setup each time like the conventional device. It is possible to improve efficiency and speed of processing.

(C) Embodiment of Stamping Machine Next, the stamping machine 7 of the assembly process information management system shown in FIG.
8, an embodiment using the chip ID information and the frame ID information according to the present invention will be described. Also in this case, the chip information table of the lead frame stored in the data server 74 in association with each ID information (see FIG. 1).
1) and manufacturing condition information table (Fig. 12),
The efficiency of processing can be improved.

As a first example, an information inquiry / acquisition sequence 180 for imprinting predetermined imprint information on the package surface of each semiconductor device 171 in which a semiconductor chip as shown in FIG. 17 is packaged with resin will be described with reference to FIG. Will be described with reference to. First, the marking machine 78 recognizes the frame ID information printed by a laser or the like on the end of each lead frame by an appropriate image recognition device (S181).
Next, the marking machine 78 queries the data server 74 for the recognized lead frame ID information (S182). In response to the inquiry, the data server 74 receives necessary information from the information table stored in the database 75, for example, necessary information, for example, the arrangement and ID information of the chip bonded in the lead frame, the marking pattern of each chip, and the marking product. The name, attached information of the chip, etc. are taken out and transferred to the marking machine 74 (S183). The marking machine 74 forms a marking pattern composed of marking characters 172 (FIG. 17) such as a product name and a characteristic code based on the acquired information, and stamps the package outer peripheral surface with a laser device, for example (S184). ). Then, when the marking for one frame is completed, the fact is reported to the server 74 (S185), and the process proceeds to the next step.

As described above, according to the embodiment shown in FIG. 18, the product name determined for each chip and the marking attachment information determined according to the characteristics of each chip are attached to the frame. Since the ID information can be acquired by reading the ID information and inquiring the information to the data server 74, it is possible to perform the marking according to the individual chip even when the internal chip after molding is invisible.

In the embodiment shown in FIG. 18, a predetermined marking character is stamped based on the frame ID information and the chip ID information, but the present invention is not limited to this example, and each chip ID is used as the marking information. It is also possible to imprint the two-dimensional barcode pattern itself as information. Next, such an embodiment will be described with reference to a sequence 190 shown in FIG.

First, as in the previous embodiment, the marking machine 7
8 recognizes the frame ID information printed by a laser or the like on the end of each lead frame by an appropriate image recognition device (S191). Next, the marking machine 78 queries the server 74 for the recognized lead frame ID information (S19).
2). In response to the inquiry, the server 74 receives necessary information from the information table stored in the database 75, for example, necessary information, for example, the arrangement and ID information of the chip bonded in the lead frame and the marking pattern or the marking product name of each chip. And the accessory information of the chip are taken out and the stamping machine 7
4 (S193). Based on the acquired information, the marking machine 74, as shown in FIG. 17, adds chip ID information 173 in addition to character information 172 such as a product name and a characteristic code.
Is formed on the outer peripheral surface of the package after molding by, for example, a laser device (S19).
4). When the marking for one frame is completed, the fact is reported to the server 74 (S195), and the process proceeds to the next step.

As described above, according to the embodiment shown in FIG. 19, the chip ID information is stamped on the package surface in addition to the normal marking information.
Information can be managed for each chip by recognizing the information by a predetermined image recognition device and referring the information to the server 74. Also, in the field, each chip ID information can be used as key information, and the quality of service such as maintenance can be improved.

(D) Embodiment of Chip Sorter FIG. 20 shows a schematic structure of a chip sorter 79 for classifying a large number of products manufactured simultaneously.
As shown in the figure, the chip sorter 79 picks up the chips stored in the chip storage tray 201 before sorting by the chip transfer head 203 configured to be movable left and right by the chip transfer unit 202 to perform image recognition. Part 2
Reprinted on 04. Then, the sorter control unit 205 recognizes the marking information stamped on the chip in the image recognition unit 204, and obtains the recognized lot ID of the chip from the server 74.
To inquire. In response to the inquiry, the server 74 acquires necessary information from the information table and transfers it to the sorter control unit 205. The sorter control unit 205 performs sorting based on the transferred identification information, and the corresponding storage tray 206-1,
206-2 and 206-3 are selected, and each chip is sorted on any of the selected storage trays 206-1, 206-2 and 206-3.

As described above, in the embodiment shown in FIG. 20, even when various chips are manufactured in the same frame, the marking information of each chip is identified and stored in the server 74. It is possible to automatically collect and sort only chips of the same type by inquiring into the existing information table. The chip sorter may be configured to recognize only the character information stamped on the package of each chip and collate it with the chip ID information stored in the information table. If the chip ID information is also stamped on the package, the characteristic value of each chip stored in the ID information can be identified and sorted. According to this configuration, it is possible to sort each chip according to the characteristic classification even for the same product on the stamp,
For example, even when the product name is the same, such as memory, and fine classification is required according to the access time, the sorting work can be efficiently performed.

(3) Other Embodiments An example in which the two-dimensional code according to the present invention is applied to the assembly process has been described above, but the present invention is not limited to such an example, and a unique chip ID for each chip. By managing the information table including the processing history in relation to the information, the final process such as the test process after the assembly or the physical distribution process,
Furthermore, it is possible to improve the efficiency of maintenance work after product shipment.

FIG. 21 shows an example of an information table in which the processing history of each chip used in the above process or work is stored. As shown in the figure, this chip ID information table includes processing history information in the wafer process, processing history information in the assembly process, and test data by probing and chip state inspection.

By using the chip ID information table, the data server 74 uses the chip ID information as key information.
It is possible to search for necessary information for each chip from the above information table stored in the database 75. Conventionally, when a trouble is found in a certain process in the semiconductor manufacturing process, it is necessary to conduct a process investigation for each lot, but according to the present embodiment, the investigation range can be limited for each chip. Since this is possible, the efficiency of processing can be improved.

FIG. 22 shows an example in which the information table of FIG. 21 is further expanded. In the illustrated chip ID information table, in addition to the contents of the information table of FIG. 21, shipping information such as a shipping destination, a packaging form, a shipping date, and field complaint information after shipping such as a complaint history are added. In this way, in the chip history information table as shown in FIG. 22, shipping information and complaint information can be added and updated as appropriate using chip ID information as key information.

By using the quality information table, when the user makes a complaint about the quality of the delivered semiconductor device, the chip ID information having the same complaint content as the processing history of each semiconductor manufacturing process is compared. Can be searched, and common elements in the chip group can be analyzed. As a result, it is possible to narrow down the investigation range of the defective chip analysis, which was difficult in the past, and it is possible to expect a great effect in terms of quality improvement of the semiconductor device and quality assurance for the user.

The process control system and the process control method according to the preferred embodiment of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims, and naturally, these are also within the technical scope of the present invention. It is understood that it belongs.

[0075]

As described above, according to the present invention,
A unique two-dimensional barcode pattern for each chip arranged on the wafer, for each lead frame to which the chips are bonded, or for each package product of resin-sealed semiconductor chips based on the chip ID information. It is possible to individually manage information for each chip, each frame, and each resin-sealed product chip by adding the symbol, to each processing step in the semiconductor manufacturing process, physical distribution process, shipping process, It is possible to improve the efficiency and accuracy of information management of semiconductor devices in all processes related to semiconductor manufacturing, such as the claim processing process.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a schematic configuration of an embodiment of a two-dimensional bar code applicable to the present invention.

FIG. 2 is an explanatory diagram showing a schematic configuration of a conventional one-dimensional barcode.

FIG. 3 is an explanatory view showing an embodiment of a two-dimensional bar code pattern formed on a semiconductor chip according to the present invention.

FIG. 4 is an explanatory diagram showing an embodiment of a liquid crystal mask used for projecting and exposing a two-dimensional barcode pattern on a semiconductor chip according to the present invention.

FIG. 5 is an explanatory diagram showing an array state of chips of various qualities formed on a wafer.

FIG. 6 shows an example of a mapping data table stored in a data server, (a) is an example of a conventional mapping data table, and (b) is an example of a mapping data table according to the present invention. There is.

FIG. 7 is a system configuration diagram showing a schematic configuration of an assembly process information management system to which the present invention can be applied.

8 is a flowchart showing an information inquiry / acquisition sequence in the die bonder of the assembly process information management system shown in FIG.

FIG. 9 is an explanatory diagram showing an embodiment of a two-dimensional barcode pattern provided on a lead frame to which a predetermined chip is bonded according to the present invention.

FIG. 10 is a configuration diagram showing a schematic configuration of a die bonder capable of attaching a two-dimensional bar code pattern to a lead frame in a bonding process according to the present invention.

FIG. 11 is an explanatory diagram showing an example of a chip information table created for a lead frame based on the present invention.

FIG. 12 is an explanatory diagram showing an example of an information table relating to assembly process conditions created in the assembly process information management system according to the present invention.

13 is a flowchart showing another example of the information inquiry / acquisition sequence in the die bonder of the assembly process information management system shown in FIG.

FIG. 14 is an explanatory diagram showing the manner in which a chip bonding pad and a lead are wired by a wire bonder.

15 is a flowchart showing an example of an information inquiry / acquisition sequence in the wire bonder of the assembly process information management system shown in FIG.

FIG. 16 is a flowchart showing a process of performing wire bonding processing while recognizing chip ID information when the present invention is applied to a bonding process.

FIG. 17 is an explanatory diagram showing a state in which character information and a two-dimensional code pattern are marked on the package.

18 is a flow chart showing an example of an information inquiry / acquisition sequence in the marking machine of the assembly process information management system shown in FIG. 7.

FIG. 19 is a flowchart showing another example of the information inquiry / acquisition sequence in the marking machine of the assembly process information management system shown in FIG. 7.

FIG. 20 is a configuration diagram showing a schematic configuration of a chip sorter to which the present invention can be applied.

FIG. 21 is an explanatory diagram showing an example of an information table in which the processing history of each chip is stored according to the present invention.

22 is an explanatory diagram showing an example of an information table in which shipping information and complaint information are further added to the information table shown in FIG. 21.

[Explanation of symbols]

10 Two-dimensional barcode pattern 11 squares 30 Two-dimensional barcode pattern for chip ID information 31 chips 40 LCD mask 41 Chip ID generator 42 Two-dimensional barcode conversion unit 43 LCD driver 70 Assembly process information management system 71 Probing LAN 72 bridge 73 LAN for assembly process 74 Data server 75 Database 76 Dice Bonder 77 wire bonder 78 stamping machine 79 Chip Sorter 91 Two-dimensional barcode pattern for frame ID information 92 chips 93 frames 171 Semiconductor device 172 Character information 173 Two-dimensional barcode pattern for product ID information

Claims (17)

[Claims] 1. A two-dimensional pattern formed by arranging a plurality of grid-like patterns on a surface in a first direction and a second direction perpendicular to the first direction according to information is added. A reading device for reading the two-dimensional pattern of the semiconductor chip, and a management unit for associating desired chip information with the two-dimensional pattern read by the reading device and managing each semiconductor manufacturing process using the chip information. A process control system characterized by including. 2. A plurality of the semiconductor chips are arranged on a wafer, and the chip information is an ID unique to each chip.
The process control system according to claim 1, further comprising information. 3. The process management system according to claim 2, wherein the ID information includes mapping data obtained in a probing process. 4. A two-dimensional pattern formed by arranging a plurality of grid-like patterns on a surface in a first direction and a second direction perpendicular to the first direction according to information. A reading device for reading the two-dimensional pattern of the lead frame; and a management unit for associating desired frame information with the two-dimensional pattern read by the reading device and managing each semiconductor manufacturing process using the frame information. A process control system characterized by including. 5. A plurality of grid patterns are formed on a surface of the resin of a semiconductor device in which a semiconductor chip is sealed with a resin, and a first direction and a second direction perpendicular to the first direction according to information. A reading device for reading the two-dimensional pattern of a semiconductor device to which a two-dimensional pattern formed by arranging in the direction of and a desired information is associated with the two-dimensional pattern read by the reading device, A process management system comprising: a management unit that manages each semiconductor manufacturing process by using. 6. The process management system according to claim 5, wherein the information includes manufacturing process history information of the sealed semiconductor chip. 7. The process management system according to claim 5, wherein the information includes at least one of product shipment information and complaint information from the user after shipment. 8. A two-dimensional pattern formed by arranging a plurality of square patterns on a surface of a semiconductor chip in a first direction and a second direction perpendicular to the first direction according to information. Is added, the two-dimensional pattern is read in the manufacturing process, the read two-dimensional pattern is associated with desired information, and each manufacturing process is managed based on the information. . 9. The process control method according to claim 8, wherein a plurality of the semiconductor chips are arranged on a wafer, and the corresponding information includes ID information unique to each chip. 10. The process management method according to claim 9, wherein the ID information includes mapping data obtained in a probing process. 11. A two-dimensional pattern formed by arranging a plurality of grid patterns on a surface of a lead frame in a first direction and a second direction perpendicular to the first direction according to information. Is added, the two-dimensional pattern is read in the manufacturing process, the read two-dimensional pattern is associated with desired information, and each manufacturing process is managed based on the information. . 12. A plurality of square-shaped patterns are formed on the surface of the resin of a semiconductor device in which a semiconductor chip is sealed with a resin.
A two-dimensional pattern formed by arranging in a first direction and a second direction perpendicular to the first direction according to information is added, and the two-dimensional pattern is read in the manufacturing process and the read two-dimensional pattern is added. A process management method comprising: associating a dimensional pattern with desired information and managing each manufacturing process based on the information. 13. The process control method according to claim 12, wherein the information includes manufacturing process history information of the sealed semiconductor chip. 14. The process control method according to claim 12, wherein the information includes at least one of product shipping information and complaint information from a user after shipping. 15. A plurality of grid-like patterns are formed on at least one surface of the semiconductor chip, the lead frame, and a semiconductor device in which the semiconductor chip is sealed with a resin.
A two-dimensional pattern formed by arranging in a first direction and a second direction perpendicular to the first direction according to information is added, and the two-dimensional pattern is read in the manufacturing process and the read two-dimensional pattern is added. A process management method comprising: associating a dimensional pattern with desired information and managing each manufacturing process based on the information. 16. A semiconductor chip, a lead frame, and a semiconductor device in which the semiconductor chip is sealed with resin, and a plurality of grid patterns are formed on the respective surfaces of the resin in a first direction and a first direction according to information. A two-dimensional pattern formed by arranging in a second direction perpendicular to the one direction is added, and in the manufacturing process, the two-dimensional pattern is read and the read two-dimensional pattern is associated with desired information. , A process control method characterized by performing control of each manufacturing process based on the information. 17. Corresponding information corresponding to the two-dimensional pattern added to the semiconductor chip, information corresponding to the two-dimensional pattern added to the lead frame, and two-dimensional pattern added to the semiconductor device. The process control method according to claim 16, wherein the process control method is associated with information.