JP2003174008A - Spin processing apparatus and processing method - Google Patents

Abstract

(57) [Problem] To provide a spin processing apparatus in which a substrate is not contaminated by a processing liquid remaining on a turbulence prevention cover. SOLUTION: In a spin processing apparatus for rotating and processing a substrate, a rotating body 11 which is driven to rotate and holds the substrate W in a detachable manner, and which is non-rotatably disposed facing a lower surface side of the substrate. A nozzle head 32 having a nozzle hole 33 for injecting the processing liquid on the lower surface of the substrate, and an opposing wall portion provided integrally with the rotator and opposed to the lower surface of the substrate held by the rotator at a predetermined interval. And a heater 5 for heating the turbulence prevention cover and drying the processing liquid remaining on the upper surface of the opposing wall.
2 was provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spin processing apparatus and a spin processing method for treating a substrate with a treatment liquid while rotating the substrate in a circumferential direction and then performing a drying treatment.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a liquid crystal display device or a semiconductor device, there is a film forming process or a photo process for forming a circuit pattern on a substrate such as a glass substrate or a semiconductor wafer. In these processes, the film forming process and the cleaning process are repeatedly performed on the substrate.

A spin processing apparatus is used to perform the cleaning processing of the substrate and the drying processing after the cleaning processing. This spin processing apparatus has a cup body, and a rotary body that is driven to rotate is provided in the cup body. The rotating body is provided with a holding mechanism, and the holding mechanism detachably holds the substrate.

The substrate held by the holding mechanism is sequentially washed and dried while rotating together with the rotating body. In the cleaning process of the substrate, not only the upper surface on which the circuit pattern is formed but also the lower surface may be required to be clean. In such a case, while rotating the substrate, the processing liquid is jetted toward the lower surface of the substrate to clean the lower surface of the substrate.

When the cleaning process is completed, the supply of the process liquid is stopped, the rotating body is rotated at a high speed, and the centrifugal force generated by the rotation scatters the cleaning liquid adhering to the substrate to perform the drying process. become.

When the rotating body is rotated at a high speed when the substrate is dried, turbulent flow is likely to occur in the space between the upper surface side of the rotating body and the lower surface side of the substrate. on the other hand,
When the substrate is dried, the treatment liquid scattered from the substrate becomes a mist and floats in the cup body.

Therefore, when a turbulent flow is generated on the lower surface side of the substrate during the drying process of the substrate, mist floating in the cup body is caught on the lower surface side of the substrate and adheres to the lower surface to cause stains and watermarks. There are times when

Therefore, the rotating body is provided with a turbulent flow prevention cover having an opposed wall portion which faces the lower surface of the substrate held by the rotating body with a slight gap, and the rotating body is rotated at a high speed. At times, it is considered to prevent turbulence from occurring on the lower surface side of the substrate.

[0009]

If a turbulent flow prevention cover is provided on the rotating body, it is possible to prevent turbulent flow from being generated on the lower surface side of the substrate during the substrate drying process. However, it is inevitable that the processing liquid sprayed on the lower surface of the substrate adheres to and remains on the upper surface of the turbulent flow prevention cover during the cleaning processing of the substrate.

Therefore, when the substrate is dried, the treatment liquid remaining on the upper surface of the turbulence prevention cover may be scattered and adhere to the lower surface of the substrate, which may cause stains and watermarks. In particular, if the processing liquid is scattered from the turbulent flow prevention cover and adheres to the substrate in the latter stage of the substrate drying processing step (particularly immediately before the end), the processing liquid is hardly dried and remains on the lower surface of the substrate. In some cases, the generation of watermarks cannot be avoided.

According to the present invention, the processing liquid remaining on the upper surface of the turbulence prevention cover is prevented from being scattered and redeposited on the lower surface of the substrate during the drying processing of the substrate, particularly when the drying processing is completed. Another object of the present invention is to provide a spin processing apparatus and a spin processing method.

[0012]

According to a first aspect of the present invention, there is provided a spin processing apparatus for rotating and processing a substrate, wherein the rotating body is rotationally driven and detachably holds the substrate, and a lower surface side of the substrate. A non-rotatably arranged nozzle head having a nozzle hole for injecting a processing liquid on the lower surface of the substrate, and a predetermined surface on the lower surface of the substrate held integrally with the rotating body and held by the rotating body. A spin comprising: a turbulent flow prevention cover having opposed wall portions facing each other at intervals; and heating means for heating the turbulent flow prevention cover to dry the treatment liquid remaining on the upper surface of the opposed wall portion. It is in the processing unit.

According to a second aspect of the present invention, the nozzle head is provided with a mounting portion facing the lower surface of the facing wall portion of the turbulent flow prevention cover, and the heating means is provided in the mounting portion. The spin processing apparatus according to claim 1.

A third aspect of the present invention is the spin processing apparatus according to the first aspect, wherein the heating means is provided on the lower surface of the opposing wall portion of the turbulence prevention cover.

According to a fourth aspect of the present invention, the substrate is processed while being rotated by a rotating body that holds the substrate detachably and has a turbulent flow prevention cover that prevents turbulent flow from being generated on the lower surface side of the substrate. In the spin processing method, a step of processing the lower surface with a processing solution while rotating the substrate at a low speed, a step of rotating the substrate at a higher speed than when processing with the processing solution and a drying process, and drying the substrate. In the processing, the turbulent flow preventive cover is heated to dry the treatment liquid adhering and remaining on the upper surface of the turbulent flow preventive cover.

According to a fifth aspect of the present invention, in the spin processing method according to the fourth aspect, the drying process performed by heating the turbulent flow prevention cover is finished before the drying process of the substrate is finished. is there.

According to the present invention, the treatment liquid remaining on the upper surface of the turbulence prevention cover during the substrate cleaning treatment is heated and dried during the drying treatment, so that the treatment liquid is turbulent near the end of the drying treatment. It is possible to prevent scattering from the prevention cover and reattachment to the lower surface of the substrate.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

1 and 2 show a first embodiment of the present invention.

FIG. 1 shows a spin processing apparatus, which has a cup body 1 shown by a chain line in the figure. A through hole 2 is formed in the center of the bottom of the cup body 1 in the radial direction, and a plurality of discharge pipes 1a are connected to the peripheral portion at predetermined intervals in the circumferential direction.

A cylindrical power transmission body 3 is provided in the through hole 2. The power transmission body 3 is rotationally driven by a control motor 4 as a drive source. The control motor 4 has a cylindrical stator 5 and a cylindrical rotor 6 that is rotatably inserted in the stator 5.

The lower end of the power transmission body 3 is joined to the upper end surface of the rotor 6 and fixed by a screw 7. Therefore, the power transmission body 3 is designed to rotate integrally with the rotor 6.

A rotating body 11 is attached to an upper end portion of the power transmission body 3 which projects into the cup body 1. The rotating body 11 is formed by joining a disk-shaped lower plate 12 and an upper plate 13, and a central portion of the lower plate 12 and the upper plate 13 communicates with the internal space of the power transmission body 3. A through hole 14 is formed.

On the peripheral portion of the upper plate 13 of the rotating body 11, four support cylinder portions 15 are integrally formed at predetermined intervals in the circumferential direction, for example, at intervals of 90 degrees. A through hole 16 is formed in a portion of the lower plate 12 corresponding to the supporting cylinder portion 15.

Bushings 17a and 17b are fitted in the support cylindrical portion 15 and the through hole 16, respectively.
A holding member 18 is rotatably supported by a and 17b. The holding member 18 includes the bushes 17a and 17b.
A shaft portion 19 supported by the shaft portion 19 and a head portion 20 integrally formed on the upper end portion of the shaft portion 19 and having a diameter larger than that of the shaft portion 19.

A holding member 18 is provided on the upper end surface of the head 20.
A taper member 21 is provided at a position eccentric from the rotation center of the. An engagement pin 22 is provided so as to project from the upper end of the taper surface 21a of the taper member 21 in the inclined direction.

A substrate W such as a semiconductor wafer or a glass substrate for a liquid crystal device is provided on the taper member 21 provided on each holding member 18 with the lower surface of the peripheral portion placed on the taper surface 21a. In that state, when each holding member 18 is rotated in a predetermined direction, for example, clockwise, the taper member 21 is eccentrically rotated, so that the peripheral portion of the substrate W rises along the taper surface 21a of the taper member 21, The outer peripheral surface thereof contacts the engaging pin 22. As a result, the substrate W is 4
It is held integrally with the rotating body 11 by one holding member 18.

The holding member 18 is in the opposite direction to the above.
When it is rotated counterclockwise, the engaging pin 22 separates from the outer peripheral surface of the substrate W, and the peripheral portion of the substrate W descends along the tapered surface 21 a of the taper member 21. As a result, the holding state of the substrate W held by the four holding members 18 is released.

The number of holding members 18 is not limited to four and may be more than three, and may be three when the substrate W is a semiconductor wafer.

The lower end of the shaft portion 19 of the holding member 18 projects to the lower surface side of the rotating body 11, and the child gear 25 is attached to the projecting end portion.
Is fitted. The child gear 25 fitted to the shaft portion 19 of each holding member 18 meshes with the parent gear 26. The parent gear 26 is rotatably held by the power transmission body 3 via a bearing 27.

The master gear 26 is biased in a predetermined rotation direction, for example, counterclockwise by a spring 28 provided on the outer peripheral surface of the power transmission body 3. As a result, the child gear 25 rotates clockwise, and the rotation of the holding member 18
When the taper member 21 is eccentrically rotated in conjunction with, the substrate W is rotated by the engagement pin 22 of each holding member 18.
Held in.

To release the holding state of the substrate W, the master gear 26 is rotated in the clockwise direction against the urging force of the spring 28 by a release mechanism (not shown). Specifically, the release mechanism prevents the parent gear 26 from rotating, and in this state, the rotating body 11 is rotated clockwise by the control motor 4. As a result, the holding member 18 rotates counterclockwise, and the holding state of the substrate W by the engagement pin 22 is released.

A holding cylinder 31 is provided inside the power transmission body 3.
Are inserted without being affected by the rotation of the power transmission body 3. A nozzle head 32 is attached to the upper end of the holding cylinder 31. A mortar-shaped recess 32 a is formed on the upper surface of the nozzle head 32. A plurality of processing liquid nozzle holes 33 for injecting the processing liquid at a predetermined angle toward the center of the lower surface of the substrate W held by the rotating body 11 and a gas such as nitrogen gas or argon gas are provided in the recess 32a. A gas nozzle hole 34 for jetting substantially vertically from directly below the center of the substrate W is formed with its tip open.

The treatment liquid nozzle hole 33 and the gas nozzle hole 3
To the base ends of the nozzles 4, one ends of a processing liquid supply pipe 36 and a gas supply pipe 37 for supplying the processing liquid and the gas to the nozzle holes are connected, respectively. These supply pipes 36 and 37 are passed through the inside of the holding cylinder 31 and led out to the outside, and the other ends are connected to a processing liquid supply tank and a gas supply tank (not shown).

The upper surface and the outer peripheral surface of the rotating body 11 are covered with a turbulent flow prevention cover 41 formed of a synthetic resin having water repellency and heat resistance, such as vinyl chloride or a fluorine series synthetic resin. This turbulence prevention cover 4
Reference numeral 1 denotes a facing wall portion 42 facing the lower surface of the substrate W held by the rotating body 11 with a slight gap therebetween, and the facing wall portion 42.
And a peripheral wall portion 43 vertically provided on the peripheral edge portion.

The processing liquid nozzle hole 3 is formed in the facing wall portion 42.
3 and the through hole 44 for allowing the processing liquid and the gas jetted from the gas nozzle hole 34 to reach the lower surface of the substrate W.

The upper ends of the four holding members 18 erected on the upper surface of the rotating body 11 project from the through holes 44a formed in the opposing wall portion 42 of the turbulence prevention cover 41 to the upper surface side thereof. ing.

Further, above the rotating body 11, similarly to the lower surface, an upper cleaning liquid nozzle 45 for injecting the cleaning liquid onto the substrate W and a clean unit (not shown) for supplying a dry gas.
Are arranged.

The substrate W is held on the rotating body 11, and the rotating body 11 is tens to hundreds of r.s.r. p. While rotating at a low speed of m, the cleaning liquid is supplied to the upper surface and the lower surface of the substrate W from the upper cleaning nozzle 45 and the processing liquid nozzle hole 33. After supplying the cleaning liquid for a predetermined time, the supply is stopped, and then the rotating body 1
1 to 1000 r. p. The gas is jetted from the gas nozzle holes 34 toward the lower surface of the substrate W while rotating at a high speed of m or more.

As a result, the cleaning liquid deposited on the upper and lower surfaces of the substrate W has a diameter of the substrate W that is generated by the centrifugal force generated when the substrate W is rotated at a high speed by the rotating body 11 and the gas ejected from the gas nozzle holes. Since it flows outward in the direction and scatters from the outer peripheral edge, the upper and lower surfaces of the substrate W are dried.

The upper surface side of the rotating body 11 is covered with a turbulent flow prevention cover 41, and a gap of a predetermined distance is formed between the upper surface of the opposing wall portion 42 and the lower surface of the substrate W held by the rotating body 11. To be done. Therefore, when the rotating body 11 is rotated at a high speed when the substrate W is dried, the gas jetted from the gas nozzle holes 34 is injected into the lower surface of the substrate W in the gap between the upper surface of the facing wall portion 42 and the lower surface of the substrate W. Since it flows in a layered manner from the center portion outward in the radial direction, turbulent flow is suppressed from being generated on the lower surface side of the substrate W.

That is, during the drying process of the substrate W, even if the processing liquid scattered from the substrate W becomes a mist and floats in the cup body 1, it does not enter the lower surface side of the substrate W and adhere to the lower surface thereof. Can be prevented.

On the outer peripheral surface of the nozzle head 32, a disc-shaped mounting portion 51 extending outward in the radial direction is integrally formed. The upper surface of the mounting portion 51 has an opposing wall portion 4 of the turbulent flow prevention cover 41 provided on the rotating body 11.
It faces the lower surface of 2. A planar electric heater 52 as a heating means is provided on the upper surface of the mounting portion 51.

As the electric heater 52, for example, a ceramic heater or a rubber heater is used. The electric heater 52 may be provided on the entire surface of the attachment portion 51, but may be provided partially along the circumferential direction, and the point is not limited.

Power supply to the electric heater 52 is controlled by a controller (not shown). When the electrothermal heater 52 is heated to generate heat, the heat heats the facing wall portion 41 of the turbulent flow prevention cover 41. As a result, after the substrate W is treated with the treatment liquid, the treatment liquid remaining on the upper surface of the opposed wall portion 41 is heated and dried.

The heating and drying of the turbulent flow prevention cover 41 by the electric heater 52 is completed before the drying process of the substrate W performed by rotating the rotating body 11 at a high speed is completed. Heating conditions are set.

According to the spin processing apparatus having such a structure, the turbulent flow prevention cover 41 is provided on the rotating body 11 to prevent the turbulent flow from being generated on the lower surface of the substrate W held by the rotating body 11. . Therefore, when the substrate W is treated with the treatment liquid and then dried, the treatment liquid adheres to and remains on the upper surface of the turbulent flow prevention cover 41, and the treatment liquid scatters near the end of the drying process to the lower surface of the substrate W. There is a risk that the particles will adhere and remain without being dried, causing contamination of the substrate W and generation of watermarks.

However, the opposing wall portion 42 of the turbulent flow prevention cover 41 that faces the lower surface of the substrate W during the drying process has the heater 52 provided on the mounting portion 51 of the nozzle head 32.
Heated by. As a result, the processing liquid remaining on the upper surface of the facing wall portion 42 is removed by drying.

The heating condition of the turbulent flow prevention cover 41 by the heater 52 is set so that the heating and drying of the turbulent flow prevention cover 41 by the heater 52 is completed faster than the drying process of the substrate W.

As a result, at the time when the drying process of the substrate W is completed, the processing liquid does not remain attached to the turbulent flow prevention cover 41, so that the substrate W rotates together with the rotating body 11 just before the completion of the drying process. It is possible to prevent the processing liquid from scattering from the turbulent flow prevention cover 41 and reattaching to the substrate W, which may cause stains or watermarks.

FIG. 3 shows a second embodiment of the present invention. In the second embodiment, the nozzle head 32 is not provided with the mounting portion 51, and the opposing wall portion 42 of the turbulent flow prevention cover 41 is provided.
A heater 52 is provided on the lower surface of the.

The turbulent flow prevention cover 41 rotates together with the rotating body 11. Therefore, although not shown in detail, power supply to the heater 52 provided on the facing wall portion 42 may be performed by a slip ring via the rotor 6 of the control motor 4, for example.

FIG. 4 shows a third embodiment of the present invention. In the third embodiment, a mounting portion 51 is provided on the nozzle head 32, and a plurality of magnets 61 such as electromagnets or permanent magnets are arranged at predetermined intervals in the circumferential direction and are adjacent to each other in the circumferential direction. The matching magnets 61 are provided so as to have different polarities.

On the other hand, the facing wall portion 42 of the turbulent flow prevention cover 41
A plurality of coils 62 are provided on the lower surface of the coil 62 at predetermined intervals in the circumferential direction.

Therefore, when the rotating body 11 is driven to rotate, the magnets 61 having different polarities sequentially face the coils 62 provided on the turbulent flow prevention cover 41, and the coils 62 generate heat by electromagnetic induction. The coil 62 is provided to heat the opposing wall portion 42 of the turbulent flow prevention cover 41.

That is, in the third embodiment, the heating means is composed of the magnet 61 and the coil 62.

In the third embodiment, the coil 6
Instead of heating the coil 2, a heating wire may be connected to the coil 62 so that only the heating wire is heated by the current generated in the coil.

The heating means of the present invention is not limited to the above-mentioned respective embodiments, but the turbulent flow prevention cover 41 may be heated by other means. For example, although not shown, warm air is jetted to the lower surface side of the turbulence prevention cover 41 through the holding cylinder 31 provided with the nozzle head 32, and the hot air blows the opposing wall portion 2 of the turbulence prevention cover 41. May be.

[0059]

As described above, according to the present invention, the turbulent flow prevention cover provided on the rotor is heated during the drying process after the substrate is washed.

Therefore, by performing the cleaning process on the substrate, even if the processing liquid remains on the upper surface of the turbulent flow prevention cover, the processing liquid is heated and dried during the drying process of the substrate. It is possible to prevent the processing liquid from scattering from the turbulence prevention cover and reattaching to the lower surface of the substrate immediately before the end.

[Brief description of drawings]

FIG. 1 is a sectional view showing a schematic configuration of a spin processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of a mounting portion provided with a heater.

FIG. 3 is a cross-sectional view showing a schematic configuration of a heater mounting structure according to a second embodiment of the present invention.

FIG. 4 is a configuration diagram of heating means showing a third embodiment of the present invention.

[Explanation of symbols]

11 ... Rotating body 32 ... Nozzle head 33 ... Treatment liquid nozzle hole 34 ... Gas nozzle hole 41 ... Turbulent flow prevention cover 42 ... Opposing wall 51 ... Mounting part 52 ... Heater (heating means)

Claims (5)

[Claims] 1. A spin processing apparatus for processing a substrate by rotating the substrate, the rotating body being rotationally driven and detachably holding the substrate, and the non-rotatably arranged facing the lower surface side of the substrate. A nozzle head having a nozzle hole for injecting a processing liquid on the lower surface of the substrate, and a disturbance having an opposing wall portion provided integrally with the rotating body and opposed to the lower surface of the substrate held by the rotating body at a predetermined interval. A spin processing apparatus comprising: a flow prevention cover; and heating means for heating the turbulence prevention cover to dry the processing liquid remaining on the upper surface of the opposing wall portion. 2. The nozzle head is provided with a mounting portion facing the lower surface of the facing wall portion of the turbulent flow prevention cover, and the heating means is provided in the mounting portion. The spin processing apparatus described. 3. The spin processing apparatus according to claim 1, wherein the heating means is provided on a lower surface of a facing wall portion of the turbulent flow prevention cover. 4. A spin processing method in which a substrate is detachably held and is processed while rotating the substrate by a rotating body having a turbulent flow prevention cover for preventing turbulent flow from being generated on the lower surface side of the substrate, A step of treating the lower surface with the treatment liquid while rotating the substrate at a low speed; a step of rotating the substrate at a higher speed than the treatment with the treatment liquid to perform a drying treatment; and a step of performing a drying treatment on the substrate. And a step of heating the turbulent flow prevention cover to dry the treatment liquid adhering to and remaining on the upper surface of the turbulent flow prevention cover. 5. The spin processing method according to claim 4, wherein the drying process performed by heating the turbulent flow prevention cover is finished before the drying process of the substrate is finished.