JP2003165130A - Mold opening/closing control mechanism for compression molding machine and method for controlling mold opening/closing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold opening/closing control mechanism for a compression molding machine in which a compression molded molding is improved in molding quality and productivity without damaging by controlling the clamping speed of a movable mold by paying attention to the flowing speed of a liquid-like resin coating on the material to be molded. <P>SOLUTION: The mold opening/closing control mechanism 41 variably controls the clamping speed of an upper mold 19 so that when a base 2 in which the liquid-like resin is supplied, is clamped by a mold, the flowing speed of the liquid-like resin from the start of casting to the completion of casting becomes a desired flowing speed. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold opening / closing control mechanism and a mold opening / closing control method for a compression molding apparatus in which a molded product supplied with a sealing resin is clamped by a fixed mold and a movable mold for compression molding.

[0002]

2. Description of the Related Art Various types of semiconductor package manufacturing apparatus have been developed and put into practical use. Among these, a compression molding device is used in which a sealing resin having an amount required for resin sealing is supplied to a molded product and clamped by a fixed mold and a movable mold to perform compression molding. This compression molding device does not require resin passages (gates, runners, etc.) to be formed in the molding die, and maintenance is simple.
QFN (Quad / Flat / Non-leaded)
And SON (Small / Outline / Non-le
CSP (Chip / Size) in which semiconductor chips are mounted in a matrix on one side of the substrate, silicon wafer, etc.
It is suitable for resin-sealing a relatively thin molded product (for example, a package thickness of about 0.8 mm) such as a package type. In addition, Q using the lead frame
In the FN type and SON type packages, it is desirable that the tape be attached to one surface of the lead frame.

In this compression molding device, in order to prevent damage to the product to be molded and the mold, and to uniformly spread the sealing resin for sealing, as in the transfer molding device, the clamping speed is low before and after clamping. In other cases, the opening / closing operation is performed at a relatively high speed (JP-A-4-14).
419).

[0004]

When compression molding is performed,
When the mold clamping speed is constant, the flow velocity of the sealing resin is not constant immediately after the start of clamping and immediately before the end of clamping. Further, when the semiconductor chip is connected to the substrate by wire bonding, in order to seal the resin without damaging the bonding wire, it is necessary to reduce the flow rate of the sealing resin, which reduces the mold clamping speed. If the speed is set low, the mold clamping speed must be adjusted to the slowest speed. As a result, the mold clamping time becomes long and the productivity is remarkably reduced.

As described above, the clamping speed is 1/10 to 1/100 of that of the conventional type before the movable mold comes into contact with the sealing resin.
It is necessary to slow down to some extent. For this reason, if compression molding is not performed while paying attention to the relationship between the movable mold clamping speed and the flow velocity of the sealing resin, the molded product may be damaged and the molding quality and productivity may decrease. Occurs.

An object of the present invention is to solve the above-mentioned problems of the prior art and to control a clamp speed of a movable mold while paying attention to a flow velocity of a liquid resin applied to a molded product to obtain a molded product molded by compression molding. It is an object of the present invention to provide a mold opening / closing control mechanism and a mold opening / closing control method for a compression molding apparatus, which can improve the molding quality without causing damage and further improve the productivity.

[0007]

In order to solve the above problems, the present invention has the following constitution. That is, in a mold opening / closing control mechanism of a compression molding apparatus for clamping and molding a molded product supplied with a sealing resin with a fixed mold and a movable mold, the mold opening / closing control mechanism is a molded product supplied with a liquid resin. When the product is clamped by the mold, the movable mold clamping speed is variably controlled so that the flow speed of the liquid resin from the start of rolling to the completion of rolling becomes a desired flow speed. Further, the mold opening / closing control mechanism divides the moving distance of the liquid resin from the start of rolling to the completion of rolling into a plurality of parts so as to change in a geometric progression, selects the common ratio of the geometric progression, and selects the movable clamp. It is characterized in that the liquid resin tip speed in each section is variably controlled by changing the speed. Further, it is characterized in that the clamp speed of the movable die is controlled to be decelerated so as to suppress the flow velocity of the liquid resin as the liquid resin approaches the end portion of the cavity. Further, in the mold opening / closing control mechanism, a screw shaft is rotationally driven by a servo motor, a mold clamping operation of the movable mold is performed through a movable platen connected to the screw shaft, and the rotation speed of the servo motor is changed to change the movable mold. The clamp speed is variably controlled.

Further, in a mold opening / closing control method of a compression molding apparatus in which a molded product supplied with a sealing resin is clamped by a fixed mold and a movable mold to perform compression molding, the molded product supplied with a liquid resin is made into a metal mold. It is characterized in that the clamp speed of the movable mold is variably controlled so that, when clamped by the mold, the flow velocity of the liquid resin from the start of rolling to the completion of rolling becomes a desired flow velocity. In addition, the moving distance from the start of rolling the liquid resin to the completion of rolling is divided into a plurality so as to change in geometric progression, and the common ratio of the geometric progression is selected to change the movable clamp speed. It is characterized in that the liquid resin tip speed in each section is variably controlled. Further, it is characterized in that the clamp speed of the movable mold is controlled to be reduced so that the flow velocity of the liquid resin is suppressed as the liquid resin gets closer to the end of the cavity.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a mold opening / closing control mechanism and a mold opening / closing control method for a compression molding apparatus according to the present invention will be described in detail below with reference to the accompanying drawings. In this embodiment, a case where a compression molding device is used as a part (resin sealing portion) of the resin sealing device will be described. 1 is a front view of the compression molding apparatus viewed from the press side opposite to the operating side, FIG. 2 is a plan view of the resin sealing apparatus, FIG. 3 is a front view of the resin sealing apparatus of FIG.
(A) and (b) are explanatory views of the work, FIG. 5 is a block diagram of a control system of the mold opening / closing control mechanism, FIG. 6 is an explanatory view showing a coating shape of the liquid resin, and FIG. 7 is a height and a lateral direction of the liquid resin. 8 is a data diagram showing the relationship between the width and the flow velocity in the lateral direction, FIG. 8 is a graph diagram in which the data of FIG. 7 is graphed, FIG. 9 is an explanatory diagram showing the application shape of the liquid resin according to another example, and FIG. FIG. 11 is a data diagram showing the relationship between the height and radius of the liquid resin and the clamping speed, FIG. 11 is a graph diagram showing the data of FIG. 10, and FIG. 12 and FIG.
3 is a data diagram and a graph showing the relationship between the platen speed, the resin tip speed and the height of the resin according to the change of the common ratio r in the rectangular work, and FIGS. 14 and 15 are the common ratio r in the circular work. FIG. 16 is a flow chart showing an example of the mold clamping operation, which is a data diagram and a graph showing the relationship among the platen speed, the resin tip speed, and the resin height due to the change of.

First, a schematic structure of the resin sealing device will be described with reference to FIGS. 2 and 3,
Reference numeral 1 denotes a work supply unit, which accommodates a plurality of works to be molded on one side. In this embodiment, as an example of a work, a substrate (film substrate, lead frame, resin substrate, silicon wafer, etc.) 2 on which semiconductor chips are mounted in a matrix is housed in a magazine 3 (see FIG. 4B). There is. When a lead frame is used, it is desirable that a tape be attached to one surface (bottom surface) so that the liquid resin whose viscosity has been reduced does not flow down.

A slit is formed on the side surface of the magazine 3 on the cut-out side, and the cut-out plate (pusher) 5 operated by the actuator 4 sends out one by one from the substrate 2 on the lowermost layer side. As shown in FIG. 3, the magazine 3 is supported by the elevator mechanism 6 and accommodated in a stack, and each time one substrate 2 is cut out, the magazine 3 is lowered by one pitch to prepare for the next cutting of the substrate 2. Has become. In addition to the substrate 2, the work piece to be molded on one side may be a silicon wafer 7 in which semiconductor chips shown in FIG. 4A are formed in a matrix. Figure 4
The grid-like lines formed on the substrate 2 and the silicon wafer 7 in (a) and (b) show the partitions for one package. Further, 2a and 7a indicate defective portions of the semiconductor chip.

Reference numeral 8 denotes a liquid material discharge device as an example of a resin supply unit, which quantitatively discharges and supplies the liquid material (liquid resin) to the work (substrate 2 and silicon wafer 7) supplied from the work supply unit 1. . The front end side of the substrate 2 sent out from the magazine 3 by the cutout plate 5 is transferred to the support rail 9. By moving the tip of the substrate 2 while being chucked by the chuck 10 while being guided by the guide rail 11 provided in parallel with the support rail 9,
The substrate 2 is transported to the ejection position P on the support rail 9.
Reference numeral 12 denotes a camera for picking up an image of the work, which is provided so that the substrate 2 can be picked up before the resin is supplied to check the defective portion of the semiconductor chip.

Reference numeral 13 denotes a dispenser as an example of a discharging means. The dispenser 13 is provided so as to discharge the liquid resin while scanning the substrate 2 in the XY directions. The liquid resin is sent from a storage tank (not shown) to the dispenser 13 via a tube or the like, and the dispenser 1
3 adjusts the height position in the Z-axis direction and then moves X-
While scanning in the Y direction, a prescribed amount of liquid resin is discharged from the nozzle 13a in an arbitrary pattern.

Reference numeral 14 denotes a weight measuring device as an example of a measuring means, which is provided so that the weight of the work (substrate 2, silicon wafer 7) and / or the amount of liquid resin discharged to the work can be measured. In this weight measuring device 14, a measurement mounting plate 14b is provided on a measurement device main body 14a, and the measurement device main body 14a measures the weight by mounting the substrate 2 on the measurement mounting plate 14b. It is supposed to do. The weight measuring device 14 is provided below the discharge position P of the support rail 9. The measurement mounting plate 14 b is composed of an elongated plate along the support rail 9 and is arranged in a gap between the support rails 9. The measuring device main body 14a is placed on a measuring device supporting base 15, and the measuring device supporting base 15 is connected to an elevating cylinder 16 and can be moved up and down.

Reference numeral 17 denotes a compression molding device as a resin sealing portion, which clamps the substrate 2 supplied with the liquid resin by a lower mold 18 which is a fixed mold and an upper mold 19 which is a movable mold to perform compression molding. The substrate 2 on which the liquid resin has been discharged by the liquid material discharging device 8 is transferred to the lower mold 18 which is held by the loader 20 from the support rail 9 and stands by at the take-out position Q. Lower mold 18
Is movable between a clamp position R facing the upper mold 19 and a take-out position Q where the substrate 2 is transferred from the loader 20. A cavity (not shown) is formed in the upper mold 19, and a release film 21 is stretched on the parting surface thereof.

A long film is used as the release film 21, and the release film 21 is sent out from the supply reel 22a by the film transport mechanism 22 and is wound around the take-up reel 22b via the upper mold 19. The release film 21 has heat resistance to withstand the heating temperature of the molding die, is easily peeled from the upper mold surface, and has flexibility and extensibility.
TFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride and the like are preferably used. The release film 21 is stretched in close contact with the upper mold surface by sucking air through a suction hole (not shown) formed in the parting surface of the upper mold 19.

The substrate 2 after compression molding is taken out when the upper die 19 moves upward, and the lower die 18 moves from the clamp position R to the take-out position Q while being placed on the lower die 18. Then, the unloader 23 standing by at the take-out position Q
It is gripped by and transferred to the molded product storage unit.

Reference numeral 24 is a molded product storage device as an example of a molded product storage unit. The molded product storage device 24 is provided with a moving table 25 to which the substrate 2 after compression molding is transferred, a pickup device 26 that holds the substrate 2 by suction from the moving table 25, and rotates and aligns the substrate 2. The pickup device 26 holds the substrate 2 by suction. A storage magazine 27 is provided for storing the printed substrates 2.

The substrate 2 placed on the lower mold 18 is gripped by the unloader 23 and transferred to the moving table 25 waiting at the receiving position U. The moving table 25 is
With the substrate 2 still mounted, it moves from the receiving position U to the storage position V and is sucked and held by the pickup device 26. The transfer table 25 moves again from the storage position V to the reception position U when the substrate 2 is transferred. The pickup device 26 stores the substrate 2 in the storage magazine 27 while adsorbing and holding the substrate 2 and rotating the substrate 90 by 90 degrees so that the substrates 2 are aligned in the same direction.

Next, a specific structure of the compression molding device 17 will be described with reference to FIGS. 1 and 5. In FIG. 1, the lower mold 18 is supported by a stationary platen 28. No through hole for the multi-plunger unit is formed in the lower die supporting surface of the fixed platen 28, so that the surface pressure when the die is closed can be sufficiently secured. Fixed platen 28
Are supported by a fixed tie bar 30 which is erected on a base plate 29 provided at the lower part of the device.

A guide plate 31 is provided on the stationary platen 28. A slide plate 32 is slidably connected to the guide plate 31. The lower mold 18 is supported on the slide plate 32. A nut portion (not shown) is integrally attached to the slide plate 32. A screw shaft 33 is screwed into the nut portion, and the screw shaft 33 is supported on the fixed platen 28. A pulley 34 is attached to one end of the screw shaft 33. Reference numeral 35 is a slide motor, and a pulley 36 is provided on the motor shaft. Pulley 34,
An endless timing belt 37 is stretched between 36. When the slide motor 35 is started, the screw shaft 33 is rotationally driven via the timing belt 37, and the slide plate 32 that cooperates via the nut portion supports the lower die 18 integrally while maintaining the clamp position R and the take-out position Q. It is designed to move between (see Fig. 2).

The upper die 19 is supported by the upper movable platen 38 and is provided so as to be movable with respect to the lower die 18. The upper movable platen 38 is supported on the lower movable platen 39 by movable tie bars 40 provided upright at four locations. As the lower movable platen 39 moves up and down, the upper movable platen 38 supported by the movable tie bar 40 also moves integrally, and the mold is opened and closed.

Reference numeral 41 denotes a mold opening / closing control mechanism, which rotates a mold clamping screw shaft 43 linked to an upper and lower nut 42 fitted in the lower movable platen 39 in a predetermined direction.
The lower movable platen 39 moves up and down to move the upper mold 19 to the lower mold 1.
8 is opened and closed. The mold clamping screw shaft 43 is erected on a screw receiving portion 44 supported by the base plate 29. The lower end of the mold clamping screw shaft 43 extends below the base plate 29, and a pulley 45 is attached to the extending portion of the mold clamping screw shaft 43. Reference numeral 46 denotes a mold clamping motor (servo motor) which is a drive source and is provided on the base plate 29. A pulley 47 is provided on the motor shaft of the mold clamping motor 46. An endless timing belt 48 is stretched between the pulley 45 and the pulley 47. By increasing the reduction ratio between the pulley 45 and the pulley 47, a sufficient mold clamping force can be obtained without increasing the size of the mold clamping motor 46. When the mold clamping motor 46 is started, the mold clamping screw shaft 43 is passed through the timing belt 48.
Is driven to rotate, and the lower movable platen 39 moves up or down via the upper and lower nuts 42.

Next, the control system of the mold opening / closing control mechanism 41 will be described with reference to the block diagram shown in FIG. 49
Is a control unit, which sends an operation command to each unit of the mold opening / closing control mechanism 41 based on the input signal to control the CPU 5.
0, ROM in which a control program for mold opening / closing operation is stored in advance
51, input data, etc. are temporarily stored, or the CPU 50
A RAM 52 used as a work area of the device, a timer 53 for measuring an operation time of the mold clamping motor 46 (mold clamping time), and the like are provided.

Reference numeral 54 denotes an input / output unit, which inputs / outputs signals to / from the control unit 49. Reference numeral 55 denotes a mold clamping pressure detection unit. In this embodiment, a pressure sensor (load cell) is provided in the movable tie bar 40.
Is built in. Reference numeral 56 is a motor pulse measuring unit, for example, a rotation sensor is integrally incorporated in a mold clamping motor (servo motor) 46. Reference numeral 57 is an operation unit for inputting operation commands and control data of the compression molding device 17. A motor driver 58 is provided with a drive circuit for the mold clamping motor (servo motor) 46.

When the molding operation is started by an input to the operation section 57, the control section 49 activates the mold clamping motor 46 through the motor driver 58, the mold clamping screw shaft 43 is rotationally driven, and the molding die is molded. Clamp the item. When the mold clamping pressure detection unit 55 detects that the mold has reached the predetermined mold clamping force, the motor driver 58 stops the driving of the mold clamping motor 46. Movable type (upper type 1
The movement amount of 9) is managed by the movement amount set by the measurement of the motor pulse measuring unit 56. Movable type (upper type 1
When the clamp speed in 9) is changed, the rotation speed of the mold clamping motor (servo motor) 46 measured by the motor pulse measuring unit 56 is changed. Regarding the performance of the mold clamping motor 46, since the opening / closing stroke is shortened by using the shuttle motion of the lower mold 18 in combination,
It suffices that the movable die (upper die 19) can be moved at a maximum of 10 mm / sec, and it is not necessary to use an unnecessarily large motor with high output.

Here, an example of a control operation in which the clamp speed of the movable die is taken into consideration with respect to the flow velocity of the liquid resin applied to the molded article will be described. As a premise, it is assumed that the liquid resin flows in the substrate 2 only in the lateral direction, and the relationship between the clamp speed and the flow speed of the liquid resin is investigated and used as an index for the clamp speed control of the movable die (upper die 19).

First, a case will be described in which the movable clamp speed is controlled so that the liquid resin applied in a rectangular shape on the substrate 2 has a desired flow speed in the lateral direction. In FIG. 6, the shape of the liquid resin applied to the substrate 2 and each parameter are set as follows. The time required for clamping is t (second), 1/2 of the lateral width after t seconds has elapsed is a (mm), and 1/2 of the longitudinal width is B (m).
m) = constant, the height of the liquid resin after t seconds has passed is h (mm)
And In addition, the height of the liquid resin immediately before the mold is clamped is H (mm), and the volume of the liquid resin is M (m).
m ³ ) = constant, the movable clamp speed is V (mm / s)
= Constant. Volume M of liquid resin applied to the substrate 2
M = 2B · 2a · h ... The height h after t seconds is: h = H-Vt ... Substituting the equation into the equation, M = 4aB (H-Vt) When this is solved for a, a = M / 4B (H-Vt) When this is differentiated with respect to time t, da / dt = M / 4B · V / (H-Vt) ² ... M / 4B = ah, and H-Vt = h are substituted into the formula. Da / dt = V · a / h ... Note that the formula is to differentiate dh · 2a · 2B = 2da · 2B · h with respect to time t in consideration of the minute volume of the liquid resin applied to the substrate 2. Can also be obtained by

From the equation, since V is constant, it is understood that the flow velocity (da / dt) of the liquid resin depends on the height (h) and the length (a) in the lateral direction. In this case, the flow velocity (da / dt) of the liquid resin in the lateral direction is proportional to the width (a) of the liquid resin applied in a rectangular shape on the molded product in the lateral direction, and the height of the liquid resin (h It is desirable to control the movable clamp speed V to a predetermined speed by utilizing the relationship inversely proportional to (4). Clamping speed V = 0.1 mm / s, height of liquid resin before clamping Hb = 2 mm, height of liquid resin after clamping He = 0.8 mm, volume of liquid resin M = 800
Height (h), width (a), flow velocity (da /) when compression-molded with 0 mm ³ and 1/2 (constant value) of longitudinal width B = 94 mm.
Data showing the relationship of dt) is shown in FIG. 7, and a graph of this is shown in FIG.

According to FIGS. 7 and 8, when the liquid resin is clamped at a constant speed, the flow velocity of the liquid resin becomes faster as the liquid resin approaches the end of the cavity (maximum flow velocity 3.3 mm / s).
I understand. Also, the height Hb of the liquid resin before clamping
By lowering, the time required for mold clamping can be shortened even if the clamping speed is slowed. For example, the clamp speed V = 0.
At 1 mm / s, height Hb of liquid resin before clamping
= 2 mm, t = 12 s is required, but Hb =
It has been found that t = 42s is required when the distance is 5 mm. From the above results, the flow velocity of the liquid resin becomes faster as it approaches the end of the cavity, and a reaction (return) of the resin occurs, so that the flow velocity (da / dt) of the liquid resin in the lateral direction immediately before the completion of the clamp operation is suppressed. Thus, it is desirable to control the movable clamp speed V to be 0.1 mm / s or less.

Next, another example of the control operation in which the clamp speed of the movable die is taken into consideration with the flow velocity of the liquid resin applied to the molded article will be described. As a premise, the product to be molded is assumed to be a silicon wafer 7, and it is assumed that the liquid resin circularly applied on the product to be molded flows in the radial direction, and the relationship between the clamp speed and the liquid resin flow velocity is investigated. , And is used as an index for clamp speed control of the movable die (upper die 19).

First, a description will be given of a case where the movable clamp speed is controlled so that the radial velocity of the liquid resin applied in a circular shape to the molded product is constant. In FIG. 9, the shape of the liquid resin applied to the substrate 2 and each parameter are set as follows. The time required for clamping is t (second), the radius of the liquid resin after t seconds has passed is r (mm), and the height of the liquid resin after t seconds has passed is h (mm). Also, the velocity K (mm / s) in the radial direction of the liquid resin is constant, the radius of the liquid resin immediately before the mold is clamped by the mold R is R (mm), and the height of the liquid resin is H (m
m) and the volume of the liquid resin M (mm ³ ) = constant. The volume M of the liquid resin immediately after the application of the liquid resin is M = πr ² · h ... The height radius r of the liquid resin after t seconds is r = R + Kt. R + Kt) ² · h When this is solved for h, h = M / (π · (R + Kt) ² ) When this is differentiated with respect to time t, dh / dt = −2MK / π · {(R + Kt) ⁻³ } ... is substituted into the equation to obtain dh / dt = -2Kh / r. Note that the equation takes into account the minute volume of the liquid resin applied to the molded product, and dh · πr ² = dr · 2πr · h It can also be obtained by differentiating with respect to time t.

From the equation, since K is constant, the clamping speed when the radial velocity of the liquid resin is constant depends on the radius (r) of the liquid resin and the height of the liquid resin. I understand. In this case, the clamp speed of the movable die depends on the height (h) of the liquid resin that is circularly applied to the molded product.
Proportional to the radius of the liquid resin applied in the circular shape (r)
It is desirable to control the clamp speed using a relationship that is inversely proportional to. Flow velocity of liquid resin in radial direction K = 1.0 mm
/ S (constant value), height of liquid resin before clamping Hb = 2
mm, height of liquid resin after clamping He = 0.8 mm,
Height (h), radius (r), clamp speed (dh / d) when compression molding is performed with the liquid resin volume M = 8000 mm ^3.
Data showing the relationship of t) is shown in FIG. 10, and a graph of this is shown in FIG.

Further, the clamp speed is set to a constant speed (for example, 0.1
The time t required for mold clamping was 12 s when clamped at (mm / s), but the maximum clamp speed was 0.39 m so that the liquid resin at this time had a constant flow speed.
It was found that when clamped at m / s and a minimum clamping speed of 0.1 mm / s, the time t required for mold clamping was 5.9 s, and the mold clamping time was halved.

From the above results, the clamp speed (dh / d) of the movable type is controlled so that the flow velocity of the liquid resin in the radial direction becomes constant.
By variably controlling t), compression molding can be performed without reducing productivity. Further, the flow velocity of the liquid resin in the radial direction is set to a speed capable of maintaining the molding quality (1.
0 mm / s) is desirable. Further, since the liquid resin tends to have a higher flow velocity as it approaches the cavity end, the clamp speed of the movable mold is controlled to be slowed down to suppress the liquid resin flow velocity and cause a recoil (return) at the cavity end. It is desirable to adjust the clamp speed so that the above does not occur.

The mold opening / closing control mechanism 41 is movable so that when a molded product supplied with a liquid resin is clamped by a mold, the flow velocity of the liquid resin from the start of rolling to the completion of rolling becomes a desired flow velocity. The clamp speed of the mold (upper mold 19) is variably controlled. Specifically, the moving distance from the start of rolling the liquid resin to the completion of rolling is divided into a plurality so as to change in geometric progression, and the common ratio of the geometric progression is increased or decreased to make the movable die (upper die 19). The clamping speed of the liquid resin is changed to variably control the speed of the liquid resin tip in each section. Further, in order to stabilize the behavior of the resin, the clamp speed of the movable die (upper die 19) is controlled to be decelerated so as to suppress the flow velocity of the liquid resin as the liquid resin approaches the cavity end portion.

The total moving amount of the movable platen from the resin rolling start to the rolling completion is ΔH, the total moving time from the resin rolling start to the rolling completion is ΔT, and the shift number from the resin rolling start to the rolling completion is N. If the movable platen movement amount from the (n-1) th shift point to the nth shift point is Hn (n = 1 on the completion side), then Hn
Divide ΔH into N sections so that + 1 = r × Hn. Since ΔH = ΣHn = H1 × (1-r ^N ) / (1-r), H1 = ΔH × (r−1) / (r ^N −1) Hn = ΔH × (r−1) / (r ^N -1) x r ^(n-1)

Next, assuming that the movable platen speed from the (n-1) th shift point to the nth shift point is Vn, the movable platen moves the movement amount Hn in each section at a time of ΔT / N, and thus Vn = N. × (ΔH / ΔT) × (r-1) / (r ^N
−1) × r ^(n-1) . At this time, the moving time of each section is equally divided and the moving amount changes in a geometric progression. Therefore, the speed of the movable platen can be variably controlled by increasing or decreasing the common ratio r. Specifically, in a state where the viscosity is low immediately after the start of resin rolling, the ratio r is increased to accelerate the resin tip speed so that the resin can be sealed in many areas, and the resin tip speed is reduced near the completion of rolling. I am trying.

12 and 13 are a data diagram and a graph showing the relationship between the platen speed and the resin tip speed with a change in the common ratio r in a rectangular work. Further, FIGS. 14 and 15 are a data diagram and a graph showing the relationship among the platen speed, the resin tip speed, and the resin height with the change of the common ratio r in the circular work. In both cases, the resin rolling start height is 2 mm, the resin rolling completion height is 0.8 mm,
The total travel time is 16 seconds. For example,
When it is desired to keep the resin tip speed constant in a certain section, it is desirable to select a common ratio r that horizontally changes with time, for example, r = 1.2 or r = 1.3. Further, in consideration of the viscosity and properties of the resin, it is desirable to select r = 1.5 or more when it is desired to reduce the resin tip speed at the cavity end portion. In this way, at the first to N-th shift points provided from the start of resin rolling to the end of resin rolling, the platen speed is variably controlled by appropriately selecting the common ratio r and the resin tip speed is controlled to a desired speed. can do.

Here, FIG. 1 shows an example of the mold clamping operation.
This will be described with reference to the flowchart shown in FIG. First, when the mold is closed from the mold open position, the mold is clamped at a high speed before the upper mold 19 starts rolling the liquid resin. Then, when the resin rolling start position is reached, the rotation speed of the mold clamping motor 46 is changed in accordance with the change of the common ratio r based on the control program stored in the control unit 49 in consideration of the relationship with the liquid resin flow velocity in advance. Control to shift to Nth speed / low speed mold clamping. Hereinafter, as the N-1st to 2nd shift points change, the rotational speed of the mold clamping motor 46 is variably controlled at any time to perform low-speed mold clamping. The mold clamping pressure by the pressure sensor is monitored at each of the Nth shift point to the second shift point. this is,
This is to detect an abnormal pressure when a foreign object is caught.

Next, when the upper die 19 reaches the first shift point, when the predetermined pressure is reached by pressure monitoring, the die (upper die 19) stop position (movable platen stop position) is monitored by the rotation sensor. . If the die stop position is higher than the intended height, it is determined that there is a possibility that a foreign substance is pinched or the resin amount is excessive, and if it is low, it is determined that the resin amount is insufficient. When the resin rolling is completed, the pressure is maintained and curing is performed, the sealing resin is cured, and the package portion is molded. The clamp end position of the upper die 19 is detected by the pressure sensor, and the clamp position is detected by the rotation sensor.

In the mold opening operation, low speed mold opening is performed while the upper mold 19 depressurizes to the first speed change point in accordance with the reverse procedure of the mold closing operation, and a low speed (variable speed or The mold opening is performed at a constant speed), and the mold opening is performed at high speed from the resin rolling start position to the mold opening position.

Incidentally, the mold opening / closing stroke of the upper mold 19 can be made small by using the shuttle operation from the clamp position R of the lower mold 18 to the take-out position Q in combination with the mold clamping screw shaft 43. From that, 20mm-30
It is set to about mm. Further, it is desirable to move the upper mold 19 at a low speed of 0.1 mm / sec or less near the mold closing position, that is, after the first shift point, and to move at a higher speed in other cases in order to improve the molding quality. .

According to the mold opening / closing control mechanism and the mold opening / closing control method described above, when the molded product supplied with the liquid resin is clamped by the mold, the flow rate of the liquid resin from the start of rolling to the completion of rolling is Since the clamp speed of the movable mold (upper mold 19) is controlled so as to obtain a desired flow velocity, compression molding is performed by paying attention to the flow velocity of the liquid resin, so that the molded product is not damaged and the molding quality and production are improved. It is possible to improve compression properties and perform compression molding. Specifically, the mold opening / closing control mechanism 41
Is a method of dividing the moving distance of the liquid resin from the start of rolling to the completion of rolling into a plurality so as to change in a geometric progression, selecting the common ratio of the geometric progression, and determining the clamping speed of the movable die (upper die 19). The clamp speed of the movable mold is controlled so as to reduce the flow velocity of the liquid resin as the liquid resin gets closer to the end of the cavity, so the tip speed of the liquid resin in each section is optimally controlled and the behavior of the resin Can be stabilized to improve the molding quality, and moreover, the production efficiency can be improved by selecting the clamp speed without waste of the movable die (upper die 19).

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and for example, the compression molding device 17 is integrally assembled with a resin supply portion. However, since the work space at the take-out position Q of the lower mold 18 is wide, it is possible not only to deliver the molded product or the molded product but also to apply the liquid resin to the substrate 2 by the dispenser. . In addition, the application shape of the liquid resin is adjusted according to the shape of the molded product by XY-
It does not matter whether it is applied by scanning in the Z direction or based on the nozzle shape, or both are used in combination. Further, although the molding die is illustrated as having the cavity formed at one place, it may be formed at a plurality of places, and it is needless to say that many modifications can be made without departing from the spirit of the invention. .

[0046]

According to the mold opening / closing control mechanism and the mold opening / closing control method of the compression molding apparatus according to the present invention, when the object to be molded, to which the liquid resin is supplied, is clamped by the mold, the start of rolling to the completion of rolling is performed. Since the clamp speed of the movable mold is controlled so that the flow rate of the liquid resin until it reaches the desired flow rate, compression molding while paying attention to the flow rate of the liquid resin will not damage the molded product and It is possible to improve the quality and productivity and perform compression molding. Specifically, the mold opening / closing control mechanism divides the moving distance of the liquid resin from the start of rolling to the completion of rolling into a plurality of sections so as to change in a geometric progression, and selects and selects the common ratio of the geometric progression to move it. The clamp speed of the movable mold is controlled to be reduced so that the clamp speed of the mold is changed and the flow speed of the liquid resin is suppressed as the liquid resin gets closer to the end of the cavity, so the liquid resin tip speed in each section is optimally controlled. As a result, the behavior of the resin can be stabilized and the molding quality can be improved, and further, the production efficiency can be improved by selecting the clamp speed of the movable die that does not waste.

[Brief description of drawings]

FIG. 1 is a front view of a compression molding apparatus as viewed from a press side opposite to an operation side.

FIG. 2 is a plan view of a resin sealing device.

FIG. 3 is a front view of the resin sealing device of FIG.

FIG. 4 is an explanatory diagram of a work.

FIG. 5 is a block diagram of a control system of a mold opening / closing control mechanism.

FIG. 6 is an explanatory diagram showing a coating shape of a liquid resin.

FIG. 7 is a data diagram showing the relationship between the height of the liquid resin, the width in the widthwise direction, and the flow velocity in the widthwise direction.

8 is a graph showing the data of FIG. 7 as a graph.

FIG. 9 is an explanatory diagram showing a coating shape of a liquid resin according to another example.

FIG. 10 is a data diagram showing the relationship between the height and radius of the liquid resin and the clamp speed.

FIG. 11 is a graph showing the data of FIG. 10 as a graph.

FIG. 12 is a data diagram showing a relationship between a platen speed, a resin tip speed, and a resin height with a change in a common ratio r in a rectangular work.

FIG. 13 is a graph showing a relationship among a platen speed, a resin tip speed, and a resin height with a change in a common ratio r in a rectangular work.

FIG. 14 is a data diagram showing a relationship among a platen speed, a resin tip speed, and a resin height with a change in a ratio r of a circular work.

FIG. 15 is a graph showing a relationship between a platen speed, a resin tip speed, and a resin height with a change in a ratio r of a circular work.

FIG. 16 is a flowchart showing an example of a mold clamping operation.

[Explanation of symbols]

1 Work supply department 2 substrates 3 magazines 4 actuators 5 cutting board 6 Elevator mechanism 7 Silicon wafer 8 Liquid material discharge device 9 Support rail 10 chuck 11 Guide rail 12 cameras 13 dispensers 13a nozzle 14 Weight measuring device 14a Measuring device body 14b Measuring plate 15 Measuring device support 16 Lifting cylinder 17 Compression molding equipment 18 Lower mold 19 Upper mold 20 loader 21 release film 22 Film transport mechanism 22a Supply reel 22b Take-up reel 23 Unloader 24 Molded product storage device 25 moving table 26 Pickup device 27 Storage magazine 28 Fixed platen 29 base plate 30 fixed tie bar 31 Guide plate 32 slide plate 33 screw shaft 34, 36, 45, 47 pulleys 35 Slide Motor 37, 48 Timing belt 38 Upper movable platen 39 Lower movable platen 40 movable tie bar 41 type open / close control mechanism 42 Upper and lower nuts 43 Mold clamping screw shaft 44 Screw receiver 46 Mold clamping motor 49 control unit 50 CPU 51 ROM 52 RAM 53 timer 54 Input / output section 55 Mold clamping pressure detector 56 Motor pulse measuring unit 57 Operation part 58 Motor driver

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tomokazu Asakura             90 Kamitokuma, Tokura-cho, Hanashina-gun, Nagano             Inside Pick Yamada Co., Ltd. (72) Inventor Shusaku Tagami             90 Kamitokuma, Tokura-cho, Hanashina-gun, Nagano             Inside Pick Yamada Co., Ltd. (72) Inventor Hideaki Nakazawa             90 Kamitokuma, Tokura-cho, Hanashina-gun, Nagano             Inside Pick Yamada Co., Ltd. (72) Inventor Naoya Goto             90 Kamitokuma, Tokura-cho, Hanashina-gun, Nagano             Inside Pick Yamada Co., Ltd. F-term (reference) 4F202 AH37 AR08 CA09 CB01 CL22                       CL38                 4F204 AR08 FA01 FB01 FF01 FN11                       FN30 FQ15 FQ40                 5F061 AA01 BA01 CA22 DA06 DA14

Claims (7)

[Claims] 1. A mold opening / closing control mechanism of a compression molding apparatus for clamping and molding a molded product supplied with a sealing resin with a fixed mold and a movable mold, wherein the mold opening / closing control mechanism is supplied with a liquid resin. When the molded product is clamped by a mold, the movable mold clamping speed is variably controlled so that the flow velocity of the liquid resin from the start of rolling to the completion of rolling is a desired flow velocity. Mold opening / closing control mechanism for molding equipment. 2. The mold opening / closing control mechanism divides the moving distance of the liquid resin from the start of rolling to the completion of rolling into a plurality so as to change in a geometric progression, selects a common ratio of the geometric progression, and moves it. The mold opening / closing control mechanism of the compression molding apparatus according to claim 1, wherein the liquid resin tip speed in each section is variably controlled by changing the mold clamping speed. 3. The mold opening / closing of the compression molding apparatus according to claim 1, wherein the clamp speed of the movable mold is controlled so as to reduce the flow velocity of the liquid resin as the liquid resin approaches the end of the cavity. Control mechanism. 4. A mold opening / closing control mechanism, wherein a screw shaft is rotationally driven by a servo motor, and a movable platen connected to the screw shaft is used to perform a mold clamping operation of a movable mold to change the rotation speed of the servo motor. The mold opening / closing control mechanism of the compression molding apparatus according to claim 1, 2 or 3, wherein the clamp speed of the movable mold is variably controlled. 5. A mold opening and closing control method for a compression molding apparatus, wherein a molded product supplied with a sealing resin is clamped by a fixed mold and a movable mold to perform compression molding. A mold opening / closing control method for a compression molding apparatus, wherein a clamp speed of a movable mold is variably controlled so that a liquid resin flow speed from a rolling start to a rolling completion becomes a desired flow speed when clamped by a mold. . 6. The movable clamp speed is divided into a plurality of moving distances from the start of rolling of the liquid resin to the completion of rolling so as to change in geometric progression, and the common ratio of the geometric progression is selected. The mold opening / closing control method of the compression molding apparatus according to claim 5, wherein the liquid resin tip speed in each section is variably controlled by changing 7. The mold opening / closing control of a compression molding apparatus according to claim 5, wherein the clamp speed of the movable mold is controlled so as to reduce the flow velocity of the liquid resin as the liquid resin approaches the end of the cavity. Method.