JP2003163180A - Work conveying apparatus and dicing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a work conveying apparatus capable of suctioning and retaining a diced work in a lump, cleaning the work while being suctioned and retained, and conveying it to the next process. <P>SOLUTION: This work conveying apparatus is provided with a suction head 14 that conveys a work 2 in a lump, which has been diced into pieces while, being suctioned to a dicing jig 5 and one of surfaces has been cleaned, a work cleaning means 24 that cleans the other surfaces of the work 2 while being suctioned to and retained by the suction head 14, and a buffer section 44 that delivers the cleaned work 2 in a lump. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work transfer device and a dicing device for transferring a work diced by a dicing blade to a post-processing step.

[0002]

BGA is used as an example of a semiconductor package.
(Ball / Grid / Array) type and CSP
A case of manufacturing a (Chip / Size / Package) type semiconductor package will be described. A plurality of semiconductor chips are mounted in a matrix on a work such as a glass epoxy resin substrate, and one side of the semiconductor chip mounting surface side is molded to form a package portion. The work on which the package portion is formed is placed on the dicing jig and transferred to the XY table of the dicing device. The work and the dicing jig are conveyed by, for example, a work supply hand 101 shown in FIG. That is,
With the work 103 preliminarily positioned and placed on the dicing jig 102, the dicing jig 102 is held by the work supply hand 101 and the XY of the dicing machine is held.
Transferred to the table.

The dicing jig transferred to the XY table is sucked and held together with the work, and after the XY table is aligned with the cutting line of the dicing blade, it is scanned in the X direction, for example. When this is done (for example, when scanning the forward path), one side is cut, and the same cutting operation is repeated by moving one line in the Y direction.
When the cutting of one side is completed, the XY table is rotated by 90 degrees and the XY table is similarly reciprocally scanned in, for example, the X direction on the adjacent other side, and moved by one line in the Y direction. The cutting operation is repeated. As a result, the work is cut into individual pieces in a matrix while being placed on the dicing jig.

When the cutting is completed, the work is transferred to the spin cleaning unit together with the dicing jig. In the spin cleaning unit, the cleaning stage is rotationally driven at a high speed in the sealed space while the dicing jig is suction-held together with the work on the cleaning stage. At this time, the cleaning liquid is sprayed from the spray nozzle toward the workpiece to clean the workpiece. After the cleaning is completed, air is sprayed onto the work while the cleaning stage is being rotated, and the work is dried. The work that has been washed and dried is taken out to the take-out position together with the dicing jig, and only the work is taken out individually from the dicing jig and conveyed to the inspection process. In the inspection step, an image processing test and a continuity test are performed on the individual semiconductor packages, and the work after the inspection is divided into good products and defective products and stored in a storage tray.

[0005]

In the conventional dicing machine, the work is carried on the XY table of the dicing machine with the work placed on the dicing jig in consideration of the efficiency of taking out and transferring the work after cutting. After being cut, it is transferred to the cleaning stage while being placed on the dicing jig. Therefore, a large suction force is required to suck and securely fix the dicing jig and the work on the XY table or the cleaning stage, and the size of the apparatus is increased, and the suction may be insufficient. . In particular, while the workpiece after dicing is being transferred, it is sufficient to maintain the suction state with respect to the dicing jig, but if the suction state is not maintained, it is easy to shift the position due to vibration, etc. Workpieces separated into individual pieces in the process may also fall off. In addition, it is difficult to maintain a sufficient suction force for each work even when trying to suck and hold the diced works all at once and carry them to the subsequent process. It was not possible to realize an appropriate adsorption and conveyance means for carrying out drying, drying, or conveyance. In addition, when the adsorption of each work is insufficient, the work may fall off at once and become a defective product. Also,
When a rectangular resin substrate is used as the work, it is molded on one side at a time. Therefore, as shown in FIG. 12, both sides in the longitudinal direction of the work 103 are packaged with the package part (resin) due to the difference in shrinkage after the molding. Sealing part) 10
It is easy to warp to the 4 side. Generally, the work 103 is the package unit 1.
Since 04 is placed on the dicing jig 102 with the lower side, the package unit 104 is placed in a floating state. In this case, even if the work 103 is to be attracted to the XY table together with the dicing jig 102, the work 10
3 is not adsorbed sufficiently and comes off, or the dicing blade 10
Even if the cutting is carried out at 5, the troubles such as not being able to cut along the intended cutting line and scattering of the cut work will occur. In addition, even if the molded work is warped to some extent, the semiconductor chips are arranged in a matrix. Therefore, if such a work is treated as a defective product, the yield is reduced and the manufacturing cost is increased.

An object of the present invention is to solve the above-mentioned problems of the prior art and to suck and hold dicing works all together.
An object of the present invention is to provide a work transfer device and a dicing device that can perform cleaning while adsorbing and holding the work and transfer the work to a subsequent process.

[0007]

In order to solve the above problems, the present invention has the following constitution. That is, in the work transfer device that transfers the diced work to the post-processing step through the cleaning step, the work whose one surface is cleaned is diced into individual pieces while being adsorbed by the dicing jig. It is provided with a suction conveyance means that conveys the work while suction-holding it, a work cleaning means that cleans the other surface while the work is suction-held by the suction conveyance means, and a buffer part that collectively delivers the cleaned work. It is characterized by that. Further, the work has a terminal connection portion formed on one surface and a resin-sealed package portion formed on the other surface, and the suction conveyance means sucks and holds the terminal connection portion side of the diced work. It is characterized in that it is transported by. Further, the suction conveyance means is provided with a suction head, and a matrix-shaped partition member capable of contacting and sealing the work is provided on the suction surface of the suction head. Further, the suction head is characterized in that a suction area for dividing the suction surface partitioned by the partition member into a plurality of areas and suctioning is formed. Also, the partition member,
It is formed of a conductive rubber material, and is fitted in partition grooves formed in a matrix on the suction surface of the suction head. Further, the partition member is characterized in that the partition member forms a closed space by straddling the cutting line of the work and abutting on the work, thereby adsorbing the works collectively on the suction surface. In addition, a pilot pin that can be fitted into a positioning hole formed in the dicing jig is formed on the suction surface of the suction head. Also,
The workpiece cleaning means includes a casing-shaped cleaning device body having an opening formed in the top plate and a cleaning nozzle movably provided in the cleaning device body, and the suction head is pressed against the top plate. While the work adsorbed and held from the opening is being introduced into the main body of the cleaning apparatus, the cleaning liquid is jetted from the cleaning nozzles arranged to face the other surface of the work. Further, the first seal portion provided on the inner wall of the opening of the top plate abuts the periphery of the suction head, and the suction surface abuts the second seal portion provided on the top plate to seal the opening. Then, the cleaning is performed by forming an enclosed space in the main body of the cleaning device. In addition to the cleaning nozzle, a drying nozzle is provided, and after cleaning the workpiece, air is ejected from the drying nozzle to dry the workpiece. Further, the present invention is characterized in that it is provided with a work supply means capable of adsorbing the work and supplying it to the dicing jig and holding a pressing member for suppressing the warp of the work and carrying it to the dicing jig. Further, the pressing member is characterized in that a cutting opening is formed at a central portion in the longitudinal direction of the work, and a warp of the work is pressed by a pressing portion projecting to the pressing surface side at a peripheral portion of the cutting opening. In addition, a cushioning member is provided on the pressing surface side of the pressing member to stabilize the pressing member by contacting the dicing jig when pressing the work on the dicing jig. Further, the holding member is characterized in that it is removed by the work supply means after the work is cut at the central portion in the longitudinal direction.

Further, in the dicing machine, a work supply unit for transferring the work to a dicing jig fixed to a dicing table, a dicing unit for dicing the work with a dicing blade, and one surface of the dicing work After the first work cleaning section which is cleaned while being sucked and held by the dicing jig, and the second cleaning step where one surface of the cleaned work is collectively sucked and held and the other surface is cleaned It is characterized by comprising the above-mentioned work transfer device for transferring to the processing step, an inspection part for individually inspecting the work transferred from the work transfer device, and a work storage part for storing the work after the inspection. .

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a work transfer device and a dicing device according to the present invention will be described in detail below with reference to the accompanying drawings. 1 is an explanatory plan view showing the overall structure of the dicing device, FIG. 2 is an explanatory diagram showing a schematic structure of the work suction / transport device, and FIGS. 3 (a), (b) and (c) are side views of the work suction / transport device. Perspective and downward views, FIG. 4 (a)
FIG. 5B is a top view of the suction surface of the work suction and conveyance device and a partial cross-sectional view of the work suction transfer device when it is delivered to a dicing jig.
6B and 6C are side views, a top view and a rear view of the work cleaning / drying apparatus, FIGS. 6A and 6B are a top view and an internal view of the work cleaning / drying apparatus, and FIG. 7 is a work cleaning / drying apparatus. 8 is a perspective view of a holding jig and a dicing jig, and FIGS. 9A and 9B are perspective views of the holding jig and a perspective view of the holding jig when set on the dicing jig. , Fig. 10
(A) And (b) is explanatory drawing which shows the supply operation of the supply hand holding the workpiece | work and the holding jig.

A schematic structure of the dicing apparatus will be described with reference to FIG. A work supply unit 1 can supply one by one from a supply magazine 3 in which a plurality of rectangular works 2 such as a circuit board for BGA and CSP are stored. Semiconductor chips are mounted in a matrix on one surface of the work 2 and collectively resin-molded, and terminal connection portions (ball pads or the like) are formed on the other surface. A connection terminal such as a solder ball may be connected to the terminal connection portion of the work 2.
The work 2 is sent from the supply magazine 3 to the cutting position A by a pusher or the like. The work 2 sent to the cutting position A is sucked and held by the work supply means described later, and is transferred to the dicing jig 5 waiting at the dicing position B.

Reference numeral 6 denotes a dicing unit, which dices the package unit that is collectively molded into individual semiconductor chips to divide the work 2 into individual pieces. The dicing jig 5 is fixed to the dicing table 7, and the work 2 conveyed by the work supply / conveyance unit is sucked and held by the dicing jig 5. The dicing table 7 is movable in the X-Y directions and is rotatable. The dicing table 7 supplied with the work 2 is aligned with the cutting line of the dicing blade 8 by imaging, and one side is cut when scanning in the X direction (for example, to the left side in FIG. 1).
Returning to the X direction (to the right in FIG. 1) again, the cutting operation of moving one line in the Y direction is repeated. When the cutting on one side is completed, the dicing table 7 is rotated by 90 degrees and the other side adjacent to the dicing table 7 is also cut.
Similarly, the cutting operation is repeated by reciprocally scanning in the X direction and moving by one line in the Y direction. This allows
The work 2 is cut into individual pieces in a matrix while being placed on the dicing jig 5.

Reference numeral 9 denotes a first work cleaning section, which cleans the diced work 2 while being sucked and held by the dicing jig 5. The first work cleaning section 9 sprays a cleaning liquid mixed with water and air on the terminal connection surface side of the work 2 suction-held by the dicing jig 5 while reciprocating the cleaning nozzle 10 in the arrow direction, and Wash off the cutting debris adhering to the connection surface and unnecessary parts around the board.

Reference numeral 11 denotes a work transfer device, which collectively sucks and holds the works 2 adsorbed on the cleaned dicing jig 5 and transfers them to the post-processing step. 12 is a work transfer device 1
This is a work inspection unit that individually inspects the works 2 conveyed from 1. The work 2 is individually imaged in the work inspection unit 12 to be subjected to an image processing test (check of terminal connection surface) and an OS test (continuity test). Reference numeral 13 is a work storage unit, and the work 2 after the inspection is According to the inspection result, it is divided into good products and defective products.
The defective products are stored in the storage tray 13b.

Next, the structure of the work transfer device 11 will be described in detail with reference to FIGS. In FIG. 2, reference numeral 14 denotes a suction head provided as a suction and conveyance means, which collectively sucks and holds the workpieces 2 that have been diced into individual pieces while being sucked by the dicing jig 5. The suction head 14 sucks and holds the terminal connection portion side (the side opposite to the package portion) of the diced work 2 and conveys it. The suction head 14 includes a holding plate 16 having an air suction hole and an air suction path formed in a suction head body 15, and the suction plate 1.
7 are integrally suspended and supported. This adsorption plate 1
A matrix-shaped partition member 18 that is in contact with the work 2 and can be hermetically sealed is integrally fitted to the suction surface of 7. The holding plate 16 and the suction plate 17 are screwed together to form a housing.

In FIG. 3A, the suction head main body 15
Includes an air suction pipe 19 connected to a suction mechanism (not shown).
Are connected. Further, in FIG. 3B, the suction plate 17 has suction areas E1 to E for sucking the suction surface partitioned by the partition member 18 in a plurality of areas.
8 are formed, and the holding plate 16 is provided with suction passages 20a to 20f for each area that individually communicate with specific suction areas of the suction areas E1 to E8. The holding plate 16 has suction holes 21a to 21h communicating with the suction passages 20a to 20f for each area and the suction areas E3 and E6. The suction holes 21a to 21h are connected to the suction holes 21a to 21h.
Suction can be performed for each area from each of the suction areas E1 to E8 through a book air suction tube 19. In this way, the suction area of the work 2 after dicing is set to E1 to E8.
It is possible to avoid a situation in which all the workpieces 2 adsorbed on the entire surface of the suction plate 17 fall due to a malfunction of the suction system by dividing the work into two and sucking. Further, by restricting the suction areas E1 to E8, suction can be performed intensively, so that it is possible to make the piping thin.

Further, in FIG. 3C, the partition member 1
8 is formed of a conductive rubber material in a matrix. Since the partition member 18 contacts the terminal formation surface side of the work 2, it has conductivity in order to prevent the semiconductor chip from being damaged by static electricity, and has a rubber material in order to improve the adhesion to the work 2. An elastic material such as is desirable.

In FIG. 4 (a), the suction plate 17 is provided with suction holes (through holes) 17a corresponding to the respective diced works 2, and the suction holes 17a are formed in the suction areas E1 to E8. It is in communication. In addition, partition grooves 17b are formed in a matrix on the suction surface of the suction plate 17.

In FIG. 4 (b), a partition member 18 is fitted in the partition groove 17b and fixed by adhesion. Since the partition member 18 is an elastic material and is easily deformed, it can be mounted on the suction plate 17 by being guided by the partition groove 17b, and the partition groove 17b holds the matrix shape. Further, the rigidity of the partition member 18 can be changed by adjusting the depth of the partition groove 17b. The lower surface side of the partition member 18 is fitted so as to project downward from the suction surface of the suction plate 17. The partition member 18 straddles the cutting line 22 of the diced work 2 and comes into contact with the substrate surface of the work 2, thereby forming a sealed space on the terminal connection surface side and securely sucking the respective work 2 collectively. Can be held.
In FIG. 4B, suction holes 5a are formed on the work mounting surface of the dicing jig 5 so as to correspond to each work 2, and the package portion side is sucked and held.

2 and 3 (c), on the suction surface side of the suction plate 17, a pilot pin 23 that can be fitted into a positioning hole 5b formed in the dicing jig 5 is provided.
Are formed. The suction head 14 is attached to the dicing jig 5
When they are overlapped with each other, the pilot pin 23 is fitted into the positioning hole 5b, and the partition member 18 is pressed against the work 2. As a result, the work 2 sucked and held by the dicing jig 5 and the partition member 18 of the suction plate 17 can be accurately aligned. This is because collective suction cannot be reliably performed unless the partition member 18 and the work 2 are accurately aligned. Suction head 14
Is driven by a motor in conjunction with a ball screw (not shown) to move up and down to transfer the work 2 to the dicing jig 5.

Reference numeral 24 denotes a second work cleaning section as a work cleaning means, which cleans the works 2 conveyed by suction and holding them together by the suction head 14. That is, after dicing, the work 2 is cleaned by the first work cleaning unit 9 on the terminal connection surface side in the dicing jig 5, but dust due to cutting remains in the gap between the partition member 18 and each work 2. There is a case. In addition, an unnecessary substrate portion (scrap) around the work after dicing may remain. These dusts and scraps are cleaned by the second work cleaning section 24. In FIG. 1, the suction head 14
Moves to the cleaning position C where the second work cleaning unit 24 is provided when the works 2 are collectively sucked and held at the dicing position B.

In FIG. 5A, the second work cleaning section 24 is a cleaning apparatus main body 27 in which an opening 26 is formed in a top plate 25, and a cleaning provided movably in the cleaning apparatus main body 27. And a nozzle 28. The suction head 14 (suction plate 17) is pressed against the top plate 25, and the cleaning liquid is jetted from the cleaning nozzle 28 while the workpiece 2 suction-held on the suction plate 17 is allowed to enter the cleaning device body 27 through the opening 26. The work 2 is washed by the above.

Sealing structure of the main body 27 of the cleaning device FIG.
Will be described with reference to. Opening 26 provided on the top plate 25
A first seal rubber 29 as a first seal portion extends inside the opening inner wall. A second seal rubber 30 is provided as a second seal portion on the peripheral edge of the opening 26 of the top plate 25. When the suction head 14 moves downward while collectively holding the workpieces 2 by suction, and the suction plate 17 enters the opening 26, the first seal rubber 2
9 abuts and seals the periphery of the suction head 14 (suction plate 17 or holding plate 16) and presses the suction surface of the suction plate 17 against the second seal rubber 30 provided on the top plate 25 to open the opening 26. Sealing is performed and a sealed space is formed in the main body 27 of the cleaning device for cleaning.

5 (b) and 6 (b), the cleaning nozzle 28 is provided in the moving body 31, and the drying nozzle 32 is integrally provided in the moving body 31. A cleaning liquid (mixture of water and air) is ejected from the cleaning nozzle 28 to perform cleaning, and air is ejected from the drying nozzle 32 after cleaning the workpiece to dry the workpiece 2. The moving body 31 is fixed to the tip of the moving pipe 33, and the inside of the moving pipe 33 is used as a pipe passage for a cleaning liquid or air.

The moving body 31 is provided so as to be reciprocally movable in the longitudinal direction in the cleaning device main body 27 by the moving mechanism 34. The configuration of the moving mechanism 34 will be described with reference to FIG.
In (b), 35 is a moving motor, which is provided at a position separated from the cleaning device main body 27 and is normally and reversely rotated at a predetermined timing. A motor pulley 36 is provided on the motor shaft of the moving motor 35. A driven pulley 37 is rotatably provided near the cleaning device body 27. An endless timing belt 38 is stretched between the motor pulley 36 and the driven pulley 37.
A connecting portion 39 connected to the rear end side of the moving pipe 33 is connected to a part of the timing belt 38. When the moving motor 35 is rotationally driven in a predetermined direction, the timing belt 38 wound between the pulleys rotates in the same direction,
The moving pipe 33 moves in the direction of the arrow in FIG. 5A through the connecting portion 39 to move the moving body 31. The cleaning / drying operation is performed by the moving body 31 with respect to the work 2.
The cleaning nozzle 28 may be operated for cleaning when moving forward, and the drying nozzle 32 may be operated for drying when returning, or the moving body 31 reciprocates with respect to the work 2. At this time, the cleaning nozzle 28 is operated to perform cleaning,
Next, when the moving body 31 reciprocates, the drying nozzle 32 may be operated to perform drying.

In FIG. 5A, a tray 40 is provided so that it can be pulled out below the moving area in which the moving body 31 in the cleaning device main body 27 moves. The bottom portion 40a of the tray 40 is formed in a mesh shape so that scraps and dust dropped by washing the work 2 can be separated from the washing liquid and collected. Further, even if the work 2 sucked and held by the suction head 14 falls for some reason, the tray 4
Since it can be recovered by setting 0, the work 2 is not wasted.

In addition, in FIGS. 5A and 5C, a drain port 41 is provided at the bottom of the cleaning device main body 27 to drain the cleaning liquid (water) after cleaning. In addition, the cleaning device body 2
An exhaust port 42 is formed on the side surface of the bottom side of 7, so that air suction is performed in parallel during the cleaning / drying operation in the cleaning device main body 27 so as to prevent water vapor from diffusing. A moving port 43 through which the moving pipe 33 moves back and forth is provided on the side surface of the cleaning device body 27. The moving port 43 is configured so that the sealing property is maintained by packing or the like.

In FIG. 1, the suction head 14 moves from the cleaning position C to the buffer position D while collectively suction-holding the work after cleaning and drying. 44 is a buffer unit,
Buffer tray 45 that delivers the cleaned work all together
Are arranged in two rows. The buffer unit 44 temporarily stocks the cleaned work 2 and transfers the work 2 to the work inspection unit 12, which is a subsequent process, without interruption. The buffer tray 45 has a second work cleaning unit 2
The workpieces 2 sucked and held by the suction head 14 from 4 are collectively delivered with the package portion side facing down. The buffer tray 45 to which the work 2 has been transferred is sent forward, and the reversing pickup 46 adsorbs the terminal connecting portions one by one and inverts them by 180 degrees, and the conveyance pickup 47 waiting in opposition to the package 47 packages them. The part side is suction-held and conveyed to the work inspection part 12. The buffer trays 45 may be provided not only in two rows but also in one row or in more rows. In addition, the work 2
Is inverted in order to prepare for a later work inspection step.

In the work inspection unit 12, the chips transferred to the inspection table 48 by the transfer pickup 47 are inspected, including the image processing inspection and the continuity inspection. On the peripheral edge of the inspection table 48, first to fourth work holding portions (recesses) 48a to 48d are provided at four positions swung by 90 degrees, and the work 2 transferred from the transfer pickup 47 is provided.
Is placed with the terminal connection side facing down. The work 2 held by each of the work holding portions 48a to 48d is sent to the inspection stage by rotating the inspection table 48 by 90 degrees.

Reference numeral 49 denotes a work pickup, which is a first to fourth work holding portion 48a provided on the inspection table 48.
To 48d, first to fourth pickup heads 49a capable of sucking and holding the package side of the work 2 at intervals corresponding to
49d is provided at a position swung by 90 degrees. The inspection table 48 and the work pickup 49 are rotatably provided in synchronization with each other. First to fourth work holding parts 48a to 48d and first to fourth pickup heads 49
It rotates so as to overlap with a to 49d at least at two places.

In FIG. 1, the first and fourth pickup heads 49a and 49d are the second and third work holding parts 48b,
The second pickup head 49b is in a position overlapping the 48c, the second pickup head 49b is in a position facing the image processing section 50, and the third pickup head 49c is in a position facing the OS test section 51. In the image processing unit 50, the terminal connection surface (solder ball surface side) of the work 2 is imaged and inspected for any abnormality, and in the OS test unit 51, the probe is applied to the connection terminal portion (solder ball or the like) to conduct electricity. The test is done.

When the inspection table 48 is rotated 90 degrees in the direction of the arrow (counterclockwise direction) in FIG. 1, the first work holding part 48a moves to the position of the second work holding part 48b and the second work holding part is held. The portion 48b is rotationally moved to the position of the third work holding portion 48c. At this time, the fourth pickup head 49d moves to the position of the first pickup head 49a, and the third pickup head 49c rotates to the position of the fourth pickup head 49d. First to fourth pickup heads 49a to 49
d is the work 2 in synchronization with the rotation of the inspection table 48.
It is designed to move up and down while being sucked and held. As a result, the image processing inspection and the continuity inspection are performed in parallel while the work 2 is intermittently conveyed. Therefore, the plurality of inspection steps and the transfer operation can be performed in an overlapping manner, which shortens the takt time and enables high-speed processing.

The work storage unit 13 stores the work 2 after the inspection is divided into good products and defective products. In FIG. 1, the work storage unit 13 includes a storage tray 1 for storing non-defective products.
3a and a defective product storage tray 13b for storing defective products are provided. When the work 2 that has been inspected by the OS test unit 51 is conveyed to the position of the work holding unit 48d of the inspection table 48, it is adsorbed and held by the storage pickup 52 and transferred to the work storage unit 13, and the non-defective item storage tray 1
3a or a defective product storage tray 13b.

Next, a corresponding mechanism of the work transfer device 11 when the work 2 is warped will be described with reference to FIGS. When the work 2 is a single-sided molded rectangular substrate, both sides of the work 2 in the longitudinal direction easily warp toward the package portion side, as shown in FIG. For this reason, the pressing member 53 shown in FIG. 8 may be held and supplied by the work supply means that conveys the work 2 to the dicing jig 5. The pressing member 53 has a cutting opening 54 formed at the center of the work 2 in the longitudinal direction, and a pressing portion 55 formed by projecting the peripheral edge of the cutting opening 54 toward the work 2 has a central portion of the work 2 (terminal connection). Between the sections). Further, the pressing member 53 is provided with an opening 56 for reducing the weight.

In FIG. 9A, cushioning members 57 are provided at four positions on the pressing surface side of the pressing member 53. In FIG. 9B, the cushioning material 57 is formed by pressing the work 2 with the pressing portion 55 at the peripheral edge of the cutting opening 54 when the pressing member 53 is superposed on the dicing jig 5. It is provided for abutting against and stabilizing the pressing member 53. For example, a relatively hard resin plate material such as a metal plate material such as stainless steel material or aluminum material or a ceramic material is used.

Next, the structure of the work supply hand 58 as an example of the work supply means for conveying the work 2 and the pressing member 53 to the dicing jig 5 will be described with reference to FIGS. Reference numeral 59 denotes a base portion, which is a pressing member 53.
A holding arm 60 for holding the above is provided slidably. Reference numeral 61 denotes a work suction rod, which is suspended and supported by the base portion 59, and a suction pad portion 62 capable of sucking and holding the work is provided at the lower end portion. Base part 59
A coil spring 63 is elastically mounted between the work suction rod 61 and the work suction rod 61 to constantly urge the suction pad portion 62 downward.
The upper end side of the work suction rod 61 is connected to and supported by the base portion 59, and the suction port 61a is provided so as to open on the base portion 59 and is connected to the vacuum generator by a suction hose (not shown).

The holding arm 60 has a holding claw 64a which can be locked in locking holes 53a provided on both sides of the pressing member 53.
A holding portion 64 having a is provided. Holding arm 60
Is connected to a cylinder rod 65a of a holding cylinder 65 provided on the base portion 59 and is movable along a slide rail 66.

The work supply hand 58 has a holding section 64 in advance.
The holding claw 64a is locked in the locking hole 53a of the pressing member 53 and held. At this time, since the pressing member 53 is provided at a position where the work suction rod 61 and the suction pad portion 62 can be inserted through the opening 56, the work supply hand 58 holds the pressing member 53 without interfering with them. can do.

Then, in FIG. 10A, the work 2 delivered to the cutting position A (see FIG. 1) is suction-held by the suction pad portion 62 by lowering the work supply hand 58. Then, while holding the work 2 and the pressing member 53, the work supply hand 58 is conveyed from the cutting position A (see FIG. 1) to the dicing position B of the dicing unit 6 and transferred to the dicing jig 5. At this time, FIG.
As shown in, when the work supply hand 58 is moved downward,
First, the work 2 is set on the dicing jig 5, and further moved downward to push back the work suction rod 61 against the urging force of the coil spring 63, and the pressing member 53 is placed on the work 2 in an overlapping manner. Then, the suction of the suction pad 62 is released, the holding cylinder 65 is operated to retract the holding claw 64, and the transfer operation of the work 2 and the pressing member 53 is completed. The work 2 is sucked and held on the dicing jig 5 in a state where the warp is corrected by the pressing member 53.

The work supply hand 58 is temporarily retracted from the dicing position B, and the pressing member 5 is moved by the dicing section 6.
The work 2 is diced by the dicing blade 8 through the cutting opening 54 of 3 to cut the work 2 at the central portion in the longitudinal direction. Then, the work supply hand 58 is moved to the dicing position B again, and the pressing member 53 is held by the holding portion 64 and removed. Since the work 2 is cut from the central portion in the longitudinal direction of the work 2 having the largest warp amount, the pressing member 5
Even if 3 is removed, the work 2 is adsorbed and held on the dicing jig 5 side. Then, the work 2 sucked and held by the dicing jig 5 is subjected to a normal dicing operation, and the remaining portion is diced into a matrix. Further, when the work supply hand 58 holds the pressing member 53, the work supply hand 58 returns from the dicing position B to the cutting position A again and prepares for the next work 2 conveyance.

According to the above construction, the workpieces 2 that have been diced into individual pieces while being attracted to the dicing jig 5 can be collectively attracted and held by the attraction head 14. Therefore, the workpieces can be placed on the dicing jig as in the conventional case. Since it is not necessary to convey the work as it is, it is prevented from being displaced with respect to the dicing jig during transfer of the work after dicing, or from falling off because the suction state cannot be maintained in the dicing process or the cleaning / drying process. Further, since it is not necessary to suck the entire dicing jig, the suction force is small, and since the dicing jig is not transported, the transport mechanism can be simplified and the device can be downsized. In particular, the suction head 14 is the suction head body 1
Since the matrix-shaped partitioning member 18 that is capable of contacting and sealing the work 2 is provided on the suction surface of No. 5, a sealed space is formed between the work 2 and the diced work 2 to securely suck and hold the work together. Can be realized. Further, since the work 2 diced by the suction head 14 can be cleaned while being collectively suction-held, it is possible to remove dust and scraps due to the dicing in a simplified cleaning process. Further, the work 2 is sucked by the work supply hand 58 and supplied to the dicing jig 5, and the pressing member 53 for suppressing the warp of the work 2 is held to hold the work 2.
When the work 2 is conveyed to the dicing jig 5, the warp of the work 2 can be corrected and held by the dicing jig 5. Further, after the work 2 is cut by the pressing member 53 at the central portion in the longitudinal direction, the pressing member 5 is pressed by the work supply hand 58.
By removing 3 and performing dicing, the defect rate of the work 2 can be reduced and the yield can be improved.

Various preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and other than the dicing process and the cleaning / drying process of the work 2 included in the work transfer device 11. The steps of can be arbitrarily combined. Further, the suction head 14 can be appropriately replaced and used depending on the type and size of the work 2. Also,
In the dicing device, the number of work holding portions of the inspection table 48 and the number of pickup heads of the work pickup 49 are not limited to four and can be increased or decreased, and many modifications are made without departing from the spirit of the invention. Of course you get.

[0042]

EFFECTS OF THE INVENTION When the work transfer device and the dicing device according to the present invention are used, the works that have been diced into individual pieces while being adsorbed by the dicing jig can be collectively sucked and held by the suction transfer means. Since it is not necessary to convey the work while it is placed on the dicing jig, it is possible to shift the position of the work after dicing with respect to the dicing jig and to keep the suction state in the dicing process and the cleaning / drying process. It disappears and does not fall out. Further, since it is not necessary to suck the entire dicing jig, the suction force is small, and since the dicing jig is not transported, the transport mechanism can be simplified and the device can be downsized. In particular,
Since the suction surface of the suction head provided as the suction conveyance means is provided with a matrix-shaped partition member that can contact and seal the workpiece, a sealed space is formed between the workpiece and the diced workpiece to ensure a collective operation. It is possible to realize adsorption and holding. Further, while the suction head is pressed against the top plate and the work suction-held from the opening is allowed to enter the main body of the cleaning apparatus, the cleaning liquid is ejected from the cleaning nozzles arranged opposite to each other to clean the other surface of the work. Therefore, dust and scraps associated with dicing can be removed by a simplified cleaning process. In addition, the work is sucked by the work supply means and supplied to the dicing jig, and the holding member that suppresses the warp of the work is held and conveyed to the dicing jig to correct the warp of the work and use the dicing jig. It can be adsorbed and held. Further, by cutting the work at the central portion in the longitudinal direction while the work is being held by the holding member, it is possible to securely suck and hold the work on the dicing jig. Further, after cutting the work at the center in the longitudinal direction, the work supply means removes the pressing member and performs dicing, whereby the defective rate of the work can be reduced and the yield can be improved.

[Brief description of drawings]

FIG. 1 is an explanatory plan view showing an overall configuration of a dicing device.

FIG. 2 is an explanatory diagram showing a schematic configuration of a work suction transport device.

3A and 3B are a side view, a top view, and a bottom view of a work suction / conveyance device.

4A and 4B are a top view of a suction surface of a work suction and conveyance device and a partial cross-sectional view of a state in which the work is transferred to a dicing jig.

FIG. 5 is a side view, a top view, and a rear view of the work cleaning / drying apparatus.

6A and 6B are a top view and an internal view of the work cleaning / drying apparatus.

FIG. 7 is a partial explanatory view showing a seal structure of the work cleaning / drying apparatus.

FIG. 8 is a perspective view of a holding jig and a dicing jig.

FIG. 9 is a perspective view of a holding jig and a perspective view when set on a dicing jig.

FIG. 10 is an explanatory diagram showing a supply operation of a supply hand holding a work and a holding jig.

FIG. 11 is an explanatory diagram of a conventional work supply hand.

FIG. 12 is an explanatory diagram showing a problem in a conventional work dicing process.

[Explanation of symbols]

1 Work supply department 2 work 3 supply magazines 4 Cutout part 5 Dicing jig 6 Dicing part 7 dicing table 8 dicing blade 9 First work cleaning section 10 Washing nozzle 11 Work transfer device 12 Work inspection department 13 Work storage 13a, 13b storage tray 14 Suction head 15 Suction head body 16 holding plate 17 Adsorption plate 17a, 21a-21h Suction hole 17b Partition groove 18 Partition member 19 Air suction tube E1-E8 suction area 20a to 20f Area-specific suction paths 22 cutting line 23 Pilot pin 24 Second work cleaning part 25 Top plate 26 opening 27 Cleaning device body 28 Washing nozzle 29 First seal rubber 30 Second seal rubber 31 Mobile 32 drying nozzle 33 Moving pipe 34 Moving mechanism 35 Motor for movement 36 motor pulley 37 Driven pulley 38 Timing belt 39 connected parts 40 trays 41 drain 42 Exhaust port 43 Moving port 44 buffer section 45 buffer tray 46 Reverse pickup 47 Transport pickup 48 inspection table 49 Work pickup 50 Image processing unit 51 OS test section 52 Storage Pickup 53 Presser member 54 Cutting Aperture 55 Presser section 56 openings 57 cushioning material 58 Work supply hand 59 Base 60 holding arm 61 Workpiece suction rod 62 Suction pad 63 coil spring 64 holding part 64a holding claw 65 Holding cylinder 66 slide rails

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tatsuji Oguchi             90 Kamitokuma, Tokura-cho, Hanashina-gun, Nagano             Inside Pick Yamada Co., Ltd. F term (reference) 3B201 AA46 AB23 BB02 BB22 BB42                       BB92 CC12 CD35                 3C007 AS05 AS24 DS02 FS01 FT07                       FT13 FU02

Claims (15)

[Claims] 1. A work transfer device for transferring a diced work to a post-processing step after a cleaning step. A work having one surface cleaned by being diced into individual pieces while being adsorbed by a dicing jig, Adsorption transfer means for transferring while collectively adsorbing and holding, a work cleaning means for cleaning the other surface while the work is adsorbed and held by the adsorption transfer means, and a buffer for collectively transferring the cleaned work And a work transfer device. 2. The work has a terminal connecting portion formed on one surface thereof and a resin-sealed package portion formed on the other surface thereof, and the suction transfer means is provided on the side of the terminal connecting portion of the diced work. The work transfer device according to claim 1, wherein the work transfer device is sucked and held to be transferred. 3. The adsorbing and conveying means includes an adsorbing head, and the adsorbing surface of the adsorbing head is provided with a matrix-like partitioning member which is in contact with a work and can be sealed. 2. The work transfer device described in 2. 4. The work transfer device according to claim 3, wherein the suction head is formed with a suction area for suctioning the suction surface divided by the partition member in a plurality of areas. 5. The work transfer according to claim 3, wherein the partition member is made of a conductive rubber material, and is fitted into partition grooves formed in a matrix on the suction surface of the suction head. apparatus. 6. The partition member forms a closed space by straddling a cutting line of the work and abutting the work so as to form a closed space so that each work is collectively sucked on the suction surface. Work transfer device. 7. The work transfer device according to claim 3, wherein the suction surface of the suction head is formed with a pilot pin that can be fitted into a positioning hole formed in the dicing jig. 8. The work cleaning means comprises a casing-shaped cleaning device main body having an opening formed in a top plate, and a cleaning nozzle movably provided in the cleaning device main body, and the suction head is mounted on the ceiling. It is characterized in that while the work held by suction against the plate and adsorbed and held from the opening is introduced into the main body of the cleaning apparatus, the cleaning liquid is jetted from the cleaning nozzles arranged opposite to clean the other surface of the work. The work transfer device according to claim 1. 9. A first member provided on an inner wall of an opening of the top plate.
The sealing part of the device comes into contact with the periphery of the suction head, and the opening is sealed by bringing the suction surface into contact with the second sealing part provided on the top plate to form a sealed space in the main body of the cleaning device. The work transfer device according to claim 8, wherein cleaning is performed. 10. The work transfer according to claim 8, wherein a drying nozzle is provided in addition to the cleaning nozzle, and the work is dried by ejecting air from the drying nozzle after cleaning the work. apparatus. 11. A work supply means is provided which is capable of adsorbing a work and supplying it to a dicing jig and holding a pressing member for suppressing the warp of the work and conveying it to the dicing jig. Alternatively, the work transfer device according to item 2. 12. The pressing member has a cutting opening formed at a central portion in the longitudinal direction of the work, and a pressing portion protruding toward the pressing surface side at a peripheral portion of the cutting opening presses the warp of the work. The work transfer device according to claim 11. 13. A cushioning member is provided on the pressing surface side of the pressing member to stabilize the pressing member by contacting the dicing jig when pressing the work on the dicing jig. 11. The work transfer device according to item 11 or 12. 14. The work transfer device according to claim 11, wherein the pressing member is removed by the work supply means after cutting the work at the center in the longitudinal direction. 15. A work supply part for transferring a work to a dicing jig fixed to a dicing table, a dicing part for dicing the work with a dicing blade, and one surface of the dicing work is attracted to the dicing jig. The first work cleaning section, which is cleaned while being held, and the one surface of the cleaned work, are collectively suction-held, and the other surface is transferred to the post-processing step through the second cleaning step. A work transfer device according to any one of claims 1 to 14, an inspection unit for individually inspecting a work transferred from the work transfer device, and a work storage unit for storing the work after the inspection. A dicing device characterized by the above.