JP2003158037A - Method for manufacturing multilayer electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method which hardly causes the breakage (including the chipping) of thin layer sheets near a via when peeling a carrier tape, regardless of the multilayer structure and reduction in thickness of ceramic green sheets. SOLUTION: The method comprises steps of (1) stacking the prescribed number of sheets 5 and internal electrodes 6 alternately on a sheet 1 which will become a first base section to form a multilayer section 7, (2) applying a sheet 14 which will become a second base section on the multilayer section 7 to fabricate a finally required laminate 12 wherein the prescribed number of sheets and internal electrodes are alternately stacked, (3) in the laminate 12 forming a blind via hole 4 from the first base section 1 or the second base section 14, so that the hole passes through the multilayer section 7 and then stops in the middle of the second base section 14 or first base section 1 or in the middle of the multilayer section 7, and (4) filling in the blind via hole 4 with a conductive material to form a via electrode 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated electronic component, and more particularly to a manufacturing method suitable for a laminated electronic component such as a laminated capacitor, a laminated inductor, a laminated capacitor built-in substrate, and a laminated module substrate. In particular, multilayer ceramic capacitors, multilayer ceramic inductors,
The present invention relates to a manufacturing method suitable for a laminated ceramic electronic component such as a laminated ceramic capacitor built-in substrate and a laminated ceramic module substrate.

[0002]

2. Description of the Related Art Conventionally, for manufacturing a laminated ceramic electronic component such as a laminated ceramic capacitor in which internal electrodes separated by a ceramic layer are connected by via electrodes penetrating the ceramic layer, a ceramic serving as a base portion is manufactured. A predetermined number of ceramic green sheets and a predetermined number of internal electrodes are alternately pressure-bonded on the green sheets in turn, and via electrodes connecting the internal electrodes in two systems are formed to produce a laminated ceramic green body. The ceramic green body is fired to obtain a laminated ceramic component.

Therefore, the ceramic green sheet is usually formed on a resin film called a carrier tape (back tape). In other words, the carrier tape is attached to the ceramic green sheet, and the ceramic green sheet is conveyed between the processes via the carrier tape and is routed. And
In many cases, the carrier tape is peeled off from the thin layer sheet (ceramic green sheet) in which the via hole is filled with the conductive material (via conductor), and another ceramic green sheet is further laminated on the peeled sheet surface. .

[0004]

Here, after the carrier tape is peeled off from the ceramic green sheet, the conductive material filled in the via hole (constituting the via electrode).
Has a shape protruding from the surface of the ceramic green sheet laminate by about the thickness of the carrier tape. When the ceramic green sheet used is a thin sheet having a thickness of 25 μm or less, for example, when the carrier tape is peeled off from the ceramic green sheet, this protruding portion becomes an obstacle and the ceramic green sheet cannot be peeled from the carrier tape around the via hole. , May be torn.
The breakage of the ceramic green sheet causes defects such as contact (short-circuit) between the wiring pattern layers facing each other through the ceramic green sheet.

In order to realize a high capacity and a small size (thinning) required for a monolithic ceramic capacitor today, for example, the number of laminated ceramic green sheets is increased in order to achieve a higher capacity. Laminated sheets need to be thin. As the ceramic green sheet becomes thinner, the above-mentioned problem of the ceramic green sheet breaking becomes more remarkable. In order to prevent this, it is necessary to peel the carrier tape slowly and carefully, which easily causes a decrease in manufacturing efficiency, which is an obstacle to reducing the manufacturing cost.

The present invention is directed to the production of ceramic multilayer electronic components such as monolithic ceramic capacitors, which are required to have a high capacity and a low thickness, regardless of whether the ceramic green sheet is multi-layered or thin, and when the carrier tape is peeled off. The direct challenge is to provide a method that does not easily break and improve quality and reduce costs.

Alternately, the resin sheet and the internal electrode are alternately
For example, in a laminated resin electronic component (so-called resin package) in which a plurality of layers are solidified with an adhesive and laminated, a thin laminated sheet is required when forming a capacitor layer, and the resin sheet is likely to be broken. Also, the applicable range includes not only the laminated ceramic parts but also a method for manufacturing laminated electronic parts other than ceramics such as laminated resin parts.

[0008]

Means for Solving the Problems and Effects of the Invention According to the present invention, a laminated portion in which a prescribed number of insulating layer sheets and a prescribed number of internal electrodes are laminated alternately, and a base portion for supporting the laminated portion are provided. A method for manufacturing a laminated electronic component including a laminated body having at least a via electrode for connecting between predetermined internal electrodes, and including the following steps as illustrated in the concept of FIG. That is,

A predetermined number of sheets 5 and internal electrodes 6 are alternately laminated on the sheet 1 which is the first base portion, and the laminated portion 7 is formed.
And a sheet 14 to be the second base portion is pressure-bonded onto the laminated portion 7 so that a finally required predetermined number of sheets and a predetermined number of internal electrodes are alternately laminated. A step of producing a laminated body 12, and a second or first penetrating the laminated body 12 from the first or second base portion 1 or 14 through the laminated portion 7.
Forming a blind hole-shaped via hole 4 that stops in the middle of the base portion 14 or 1 or in the middle of the laminated portion 7, and filling the conductive material in the blind hole-shaped via hole 4 to form the via electrode 13 And a step of forming.

With respect to the production of a ceramic laminated electronic component, the present invention supports a laminated portion composed of a ceramic green sheet and a laminated portion in which a prescribed number of ceramic green sheets and a prescribed number of internal electrodes are alternately laminated. A method of manufacturing a ceramic laminated electronic component, which comprises at least a laminated body formed by integrally forming a base portion and a via electrode for connecting predetermined internal electrodes, as illustrated in FIG. The following steps are included. That is, a step of alternately laminating a predetermined number of the ceramic green sheets 5 and the internal electrodes 6 on the ceramic green sheet 1 serving as the first base portion to form the laminated portion 7, and a second step on the laminated portion 7 A step of pressure-bonding the ceramic green sheet 14 serving as the base portion of the above to produce a laminate 12 in which a predetermined number of finally required ceramic green sheets and a predetermined number of internal electrodes are alternately laminated. With respect to the laminated body 12, it penetrates the laminated portion 7 from the first or second base portion 1 or 14 and stops at the middle of the second or first base portion 14 or 1, or the laminated portion 7 And a step of forming a blind hole-shaped via hole 4 that stops in the middle of the step, and a step of forming a via electrode 13 by filling the blind hole-shaped via hole 4 with a conductive material.

As described above, the first
Alternatively, a blind hole-shaped via hole 4 (dead-end hole) that stops in the middle of the laminated body is formed from the second base portion, and a conductive material is filled into the via hole 4 to form the via electrode 13. Generally, the laminated portion is formed. It is possible to avoid the situation in which the carrier tape must be peeled off while the thin thin sheet is filled with the via conductor. And, if the carrier tape is peeled off after filling the via conductor, it has a sufficient thickness.
Alternatively, since it is peeled off at the second sheet portion, the strength and rigidity against peeling of the carrier tape is large, and the sheet is torn (including chipping etc.) at the time of peeling the carrier tape.
Can be eliminated or suppressed. This leads to improvement in quality of multilayer electronic components such as multilayer capacitors. Further, as compared with the case where a via hole is formed for each sheet layer, the present invention has an advantage that the number of steps, that is, the cost is reduced because the via hole forming process is performed once. In addition, when forming vias (via holes and via electrodes) for each sheet, some positional deviation may occur during lamination, but such positional deviation is less likely to occur in via collective formation. In addition, when forming vias for each sheet, there is a slight difference in the packing density between the green sheet part and the conductor-filled part of the vias. Therefore, when stacking and laminating are repeated, deformation such as via collapse due to misalignment may occur However, if the vias are collectively formed as in the present invention,
The deformation such as the via collapse is unlikely to occur.

A metal bump or a pad for the metal bump is formed on the via electrode so as to establish an electrical connection with a device side on which the laminated electronic component is mounted, thereby forming a structure. Specifically, it can be the same as the conventional laminated electronic component, and versatility is maintained.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below with reference to the examples shown in the drawings. FIG. 1 has already explained the concept as a method for manufacturing a laminated electronic component of the present invention, but more specifically, for example, an embodiment of a method for manufacturing a laminated ceramic capacitor will be described with reference to FIG. 2 and subsequent figures. .

In FIG. 2, for example, a ceramic raw material powder such as barium titanate is used as a main component, and a necessary additive such as an organic binder is added thereto and kneaded to prepare a ceramic slurry. Next, the ceramic slurry is applied onto a carrier tape (back tape) 11 made of a resin film or the like by a known doctor blade method or the like, and dried to produce a ceramic green sheet 1.

The ceramic green sheet 1 serves as a first base portion for facilitating the stacking of a plurality of ceramic green sheets for another electrode lamination (lamination). The thickness t1 of the ceramic green sheet 1 is The thickness is made larger than the thickness t3 (see FIG. 3) of the laminated ceramic green sheet (for example, about 2 to 5 times the thickness), and a certain strength and rigidity are secured as the base portion.

Further, as shown in FIG. 3A, a ceramic green sheet 5 (thin layer sheet) for lamination is prepared. This is the same as the above-mentioned carrier tape (carrier film) 11, coated with the same ceramic slurry as that described above thinner than the base sheet, and then dried to form a thin (thickness t3) ceramic green sheet 5 for lamination. To do.

Further, as shown in (2) of FIG. 3, on the surface of the ceramic green sheet 5 opposite to the carrier tape 11, for example, silver, silver palladium, palladium,
The internal electrode 6 having a predetermined pattern is formed by applying an electrode paste containing a metal powder such as nickel and having a predetermined fluidity and adjusted to have a predetermined pattern, for example, by screen printing.

Then, as in (3), the ceramic green sheets 5 for lamination are sequentially prepared in the same manner, and the internal electrodes 6 are printed on the ceramic green sheets 5 in a predetermined pattern. The formation pattern of the internal electrodes 6 includes a first pattern in contact with a first group of via electrodes to be described later and a second pattern in contact with a second group of via electrodes to be described later. One of the two groups is for the positive electrode and the other is for the negative electrode.

Then, as shown in FIG. 4, the carrier tape 1
A plurality of laminating ceramic green sheets 5 each having an internal electrode 6 formed on the sheet surface opposite to 1 are laminated on the ceramic green sheet 1 serving as the first base portion, for example, as shown in. More specifically, the internal electrode 6 formed on one side of the ceramic green sheet 5 for lamination faces the sheet surface of the ceramic green sheet 1 serving as the first base portion opposite to the carrier tape 11, The ceramic green sheet 5 is pressure bonded (). Next, the next ceramic green sheet 5 is pressure-bonded to the exposed surface of the pressure-bonded ceramic green sheet 5 from which the carrier tape 11 has been peeled off so that the internal electrodes 6 formed on one surface of the ceramic green sheet 5 face each other ().

In the same manner, the ceramic green sheets 5 to 5 are sequentially pressed so that the carrier tapes 11 are sequentially peeled off and the internal electrodes 6 are alternately sandwiched and laminated, and the laminated portion 7 having a predetermined thickness is formed. To form.

Next, as shown in FIG. 5, a ceramic green sheet 14 (hereinafter also referred to as a second base sheet) as a second base portion is prepared. In this, the same carrier slurry (carrier film) 11 as described above is thickly coated with the same ceramic slurry as described above, and then dried to obtain a sheet having a thickness similar to that of the first base sheet 1.

Then, as shown in FIG. 6, the second base sheet 14 is further laminated on the laminated portion 7. More specifically, the sheet surface of the second base sheet 14 on the side opposite to the carrier tape 11 is formed into the first portion of the laminated portion 7.
The sheet is pressed so as to come into close contact with the surface of the end sheet opposite to the base sheet 1. At this time, the carrier tape 11 is previously peeled from the sheet surface of the laminated portion 7. The second base sheet 14 and the laminated portion 7 that has been laminated in advance.
One laminated body (laminated green body) by combining with
It becomes 2.

Further, as shown in FIG. 7, for example, a blind hole, in other words, a blind hole-shaped via hole 4 is formed from the second base sheet 14 toward the laminated portion 7. Specifically, the die, punching means of numerical control,
A plurality of via holes 4 are formed in a predetermined pattern by a via forming means such as a precision drilling device or a laser processing machine so as to open at a predetermined position of the ceramic green sheet 14 for the second base portion. These blind hole-shaped via holes 4 are, for example, the second base sheet 1
4 is penetrated through the laminated portion 7 (a group of thin layer sheets 5), and the leading end thereof does not penetrate, for example, the first base sheet 1 and is closed in the middle of the thickness direction of the sheet 1 ( It is located in a dead end form).

Alternatively, such a via hole 4 is punched from the first base sheet 1 and penetrates the laminated portion 7,
The second base sheet 14 can also be formed in a blind hole shape that becomes a dead end in the middle. Furthermore, the blind hole-shaped via hole 4 has the first or second base sheet 1 or 1.
4 is not interrupted within 4, but becomes a dead end at the laminated portion 7 before the first or second base sheet 1 or 14, for example, within the thin layer sheet 5 or immediately before the sheet 1 or 14 The tip of the via hole 4 may be located at the boundary between them.

As a method of forming such a via hole 4, for example, a laser processing machine can be preferably used, and in this case, the formation depth of the via hole 4 is defined by the intensity (energy density) of the laser beam or the laser beam. The hole tip of the via hole 4 can be set to a dead end shape at a desired position by controlling the irradiation time and other control parameters. When a drilling device is used, the via hole tip position can be set by the relative movement distance between the drill and the laminated body 12.

In any case, as described above, the blind hole-shaped via hole 4 is filled with a predetermined conductive material to form the via electrode 13 as shown in FIG.
For example, by filling the via hole 4 with a conductive paste containing a metal powder of silver, silver palladium, palladium, nickel, or the like and having a viscosity having a predetermined fluidity, for example, by hole-filling printing, the first base sheet The via electrode 13 whose one end is closed by 1 (or one end is closed by the second base sheet 14 if the via hole is in the opposite direction) is formed.

In such a laminated body (laminated green body) 12, the carrier tapes 11 on the first base sheet 1 side and the second base sheet 14 side are peeled off at an appropriate stage. The carrier tape 11 is peeled off from the thin layer sheet 5 after the via electrodes 13 are formed.
Does not occur on the sheet surface of. Then, the second base portion 14
Even if the carrier tape 11 is peeled from the sheet surface of the carrier tape 1, since the second base portion 14 has greater strength and rigidity against peeling than the thin layer sheet 5,
Even if the peeling of No. 1 is performed, the sheet portion near the via conductor (via electrode 13) is prevented or suppressed from being brought to the carrier tape 11 side, and at least the fear of chipping of the thin layer sheet 5 is eliminated.

The internal electrodes may be formed on any of the pressure-bonding surfaces in the lamination of the second base portion 14 and the thin layer sheet 5. In that case, an electrode paste (conductive paste) adjusted to a viscosity having a predetermined fluidity by containing a metal powder such as silver, silver-palladium, palladium, or nickel on the corresponding sheet surface is appropriately used, for example, by screen printing. The internal electrodes can also be formed by applying or adhering in a predetermined pattern by the applying or adhering means. By laminating thereafter, the number of internal electrodes is increased by one layer. Therefore, although it contributes to the increase of the capacitance of the capacitor, sufficient pressure is required to eliminate the gap between the one sheet surface and the other internal electrode (formed by rising from the sheet surface), and in order to improve the crimpability. In some cases, the pressure-bonded surfaces of the second base portion 14 and the thin layer sheet 5 are not necessarily advantageous in terms of process cost and elimination of warpage of the final product. It is possible to make the sheet surface without the internal electrodes.

Further, as shown in FIG. 9, the carrier tape 11 on the second base portion 14 side is peeled off, and the via electrode 13 is formed.
Is exposed to the side of the second base portion (ceramic green sheet) 14 and a mounting pad 31 for forming a metal bump later is attached to the exposed via electrode 13 with a predetermined conductive paste such as the above-mentioned via electrode. Print by screen printing or the like using a conductive paste similar to that for the internal electrodes.

Such a laminated body (laminated green body) 12
Is cut into a predetermined green chip shape if necessary, and then degreased and fired at a predetermined temperature and atmosphere to produce a laminated fired body 40 (FIG. 12) of a laminated ceramic capacitor. Further, after firing, necessary metal bumps 32, for example, solder bumps are formed on the pads 31 of the laminated fired body 40 to form a laminated ceramic capacitor chip (component). In order to simplify the description, the laminated fired body 40 of FIG. 10 is drawn in a form in which the laminated green body 15 of FIG. 9 is fired as it is.

Although the case of manufacturing a monolithic ceramic capacitor has been described above as an example, the present invention can be applied to the manufacture of other monolithic ceramic electronic components such as a monolithic ceramic inductor other than a capacitor. Moreover,
The present invention can be applied to not only ceramics but also laminated electronic components made of resin, for example, in which internal electrodes are laminated in a plurality of stages.

[Brief description of drawings]

FIG. 1 is a process diagram conceptually illustrating the present invention.

FIG. 2 is a cross-sectional view showing a specific example of a first base portion corresponding to FIG.

FIG. 3 is a cross-sectional view showing addition of internal electrodes in the thin layer sheet, corresponding to FIG. 1;

FIG. 4 is a cross-sectional view showing a specific example of a process corresponding to that of FIG.

FIG. 5 is a cross-sectional view showing a specific example of a second base portion corresponding to FIG.

FIG. 6 is a sectional view showing a specific example of a process corresponding to that of FIG.

FIG. 7 is a cross-sectional view showing a specific example of a process corresponding to that of FIG.

FIG. 8 is a sectional view showing a specific example of a process corresponding to that of FIG.

9 is a cross-sectional view showing an example of forming mounting pads for forming metal bumps on the laminated body of FIG.

FIG. 10 is a cross-sectional view showing an example of forming a necessary metal bump on the mounting pad of the laminated fired body after firing.

[Explanation of symbols]

1 Ceramic green sheet that becomes the first base 4 beer hall 5 Ceramic green sheet that is a thin layer sheet 6 internal electrodes 7 Laminated part 11 carrier tape 12 laminate 13 Via electrode 14 Ceramic green sheet that becomes the second base 31 mounting pad 32 metal bumps

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Manabu Sato             14-18 Takatsuji-cho, Mizuho-ku, Nagoya City, Aichi Prefecture             Inside this special ceramics company F-term (reference) 5E082 AA01 AB03 EE04 EE35 FF05                       FG26

Claims (3)

[Claims] 1. A laminated portion in which a prescribed number of insulating sheets and a prescribed number of internal electrodes are alternately laminated, a base portion supporting the laminated portion, and a via for connecting a prescribed internal electrode. A method of manufacturing a laminated electronic component including a laminated body including at least an electrode, the method comprising forming a laminated portion by alternately laminating a predetermined number of sheets and internal electrodes on a sheet that is a first base portion. And a step of pressure-bonding a sheet to be the second base portion on the laminated portion to fabricate a laminated body formed by alternately laminating a predetermined number of sheets and a predetermined number of internal electrodes that are finally required. And a blind hole shape that penetrates the laminated portion from the first or second base portion and stops at the middle of the second or first base portion or stops at the middle of the laminated portion with respect to the laminated body. The step of forming a via hole of Method of manufacturing a multilayer electronic component, which comprises a step of forming a via electrode by filling a conductive material in the hole. 2. A laminated portion in which a prescribed number of ceramic green sheets and a prescribed number of internal electrodes are alternately laminated, a base portion supporting the laminated portion, and a via electrode for connecting between prescribed internal electrodes. A method of manufacturing a ceramic laminated electronic component including a laminated body having at least the following: on a ceramic green sheet serving as a first base portion,
A step of alternately laminating a predetermined number of ceramic green sheets and internal electrodes to form a laminated portion, and a ceramic green sheet that serves as a second base portion is pressure-bonded onto the laminated portion to finally obtain a predetermined required amount. A step of producing a laminated body formed by alternately laminating a predetermined number of ceramic green sheets and a predetermined number of internal electrodes, and penetrating the laminated body from the first or second base portion with respect to the laminated body. Forming a blind hole-shaped via hole that stops in the middle of the second or first base portion or stops in the middle of the stacked body; and a via electrode by filling the blind hole-shaped via hole with a conductive material. A method of manufacturing a laminated electronic component, comprising: 3. The method for manufacturing a laminated electronic component according to claim 1, wherein a metal bump or a pad for the metal bump is formed on the via electrode.