JP2003142860A - Electronic component cooling structure - Google Patents

Abstract

(57) Abstract: An object of the present invention is to cool two or more electronic components housed in a heat shielding container having different operating temperatures at different temperatures. A cryogenic module (5) and electronic components (6) are housed in a heat shielding container (1) equipped with a cooling device (2), and the cryogenic module is provided in contact with the cooling device (10). It is provided in a separated state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has electronic components that operate at low temperatures, and in particular two or more electronic components that operate at low temperatures.
The present invention also relates to a cooling structure for electronic components when cooling two or more electronic components that operate at different cooling temperatures.

[0002]

2. Description of the Related Art Some electronic parts operate at low temperature or extremely low temperature, and two or more electronic parts or electronic units operating at low temperature or extremely low temperature are the same. It may form a circuit.

A conventional cooling structure for two or more electronic components and electronic units requiring such cooling will be described with reference to FIG.

In FIG. 7, reference numeral 1 denotes a heat shield container having a vacuum inside, and a cold table 2 is provided inside the heat shield container 1, and the cold table 2 covers the bottom of the heat shield container 1. It is attached to the refrigerator 4 via a column 3 that penetrates airtightly.

The column 3 also serves as a passage for the refrigerant circulating between the cold table 2 and the refrigerator 4.

A superconducting filter 5, an isolator 6, and a low noise amplifier 7 are provided on the cold table 2.
The superconducting filter 5, the isolator 6, and the low noise amplifier 7 are electrically connected by a cable 8, and one end of the cable 8 is connected via a connector 9 to an external electronic device such as a communication device. The other end is connected to an external antenna 12 via a connector 11. Further, the connectors 9 and 11 have a heat insulating function.

The signal received by the antenna 12 is input to the superconducting filter 5 through the connector 11 and the cable 8 and further passes through the isolator 6 and the low noise amplifier 7 and through the cable 8 and the connector 9. Connected to an external device (not shown). Here, the isolator 6 prevents the influence of the input impedance generated in the low noise amplifier 7 from affecting the superconducting filter 5.

During operation, the cold table 2 is cooled to an extremely low temperature, for example, 60 K by the refrigerator 4, and the cold table 2 cools the superconducting filter 5, the isolator 6, and the low noise amplifier 7.

[0009]

The above-mentioned superconducting filter 5
Is a cryogenic module that operates at cryogenic temperatures, for example 60K. However, the value guaranteed for the cold resistance temperature of the isolator 6 is about 200K.
No one is guaranteed K. Therefore, at present, 20
At present, there is no choice but to use the isolator 6 that guarantees 0K.

In the above conventional example, the cold table 2 is used.
Therefore, the isolator 6 is also cooled to an extremely low temperature, so that the isolator 6 may malfunction or be damaged.

In view of the above situation, the present invention makes it possible to cool two or more electronic components having different operating temperatures at different temperatures.

[0012]

According to the present invention, a cryogenic module and an electronic component are housed in a heat shielding container having a cooling device, and the cryogenic module is provided in contact with the cooling device. Relates to a cooling structure for an electronic component provided in a state of being separated from the cooling device, and also relates to a cooling structure for an electronic component in which a radiation plate is provided on the electronic component,
Furthermore, the electronic component is connected to the cryogenic module by a semi-rigid cable, and relates to a cooling structure for the electronic component which is supported by the semi-rigid cable away from the cooling device.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

An embodiment will be described with reference to FIG.

In FIG. 1, the same parts as those shown in FIG. 7 are designated by the same reference numerals, and the description thereof will be omitted.

A low noise amplifier 7 and a superconducting filter 5 are attached to the cold table 2, the low noise amplifier 7 is connected to a connector 9 via a cable 14, and the connector 9 is further connected to an external electronic device such as a communication device. ing. The superconducting filter 5 is connected to a connector 11 via a cable 15, and the connector 11 is connected to an antenna 12.

The isolator 6 is a semi-rigid cable 1.
6, connected to the low noise amplifier 7 and the superconducting filter 5 via a semi-rigid cable 17, respectively.

The semi-rigid cables 16 and 17 are
For example, in the case of a coaxial cable, the outer conductor is made of a material such as a copper pipe that can be bent relatively easily, and the semi-rigid cables 16 and 17 have required rigidity.
It also functions as a support member for electronic components, units, and modules.

The semi-rigid cable 16 and the semi-rigid cable 17 separate the isolator 6 from the cold table 2 and support the isolator 6 in a floating state. Further, the radiation plate 18 is fixed to the isolator 6. As the radiation plate 18, a material having a high emissivity and good heat conduction is used so that the radiation heat can be effectively received. For example, a black alumite treated aluminum plate or the like may be used.

The cooling action will be described below.

Since the superconducting filter 5 and the low noise amplifier 7 are directly attached to the cold table 2, they are cooled to a cryogenic temperature by the refrigerator 4 (see FIG. 7) via the cold table 2.

Since the isolator 6 is supported by the semi-rigid cables 16 and 17 and floats in the air, it is not cooled by the cold table 2.
Although cold heat enters the isolator 6 from the semi-rigid cables 16 and 17 through the superconducting filter 5 and the low-noise amplifier 7, since the semi-rigid cables 16 and 17 have a thermal resistance, the amount of cold heat entering. Is suppressed. Furthermore, when suppressing the amount of cold heat entering,
The material of the semi-rigid cables 16 and 17 may be stainless steel or the like having a low thermal conductivity, instead of copper.
The radiant plate 18 absorbs radiant heat from the outside of the heat shield container 1, and the absorption of the radiant heat by the radiant plate 18 causes a temperature difference between the isolator 6, the superconducting filter 5, and the low noise amplifier 7. Can be maintained larger.

That is, in the same heat shield container 1, cooling can be performed at different temperatures according to electronic components and modules by a single system of cooling mechanism (the cold table 2 and the refrigerator 4).

The semi-rigid cables 16 and 17 are
The selection of the material and whether or not to attach the radiation plate 18 may be appropriately selected according to the electronic component or module to be cooled.

As one of the means for adjusting the cooling temperature of the isolator 6, there is a method of adjusting the amount of heat received by the radiation plate 18. The factor of the amount of heat received is, for example, the area of heat received by the radiation plate 18. 2 shows the relationship between the heat receiving area and the heat receiving amount when other factors are constant.

From FIG. 2, the temperature of the isolator 6 is set to 2
When it is desired to set it to 00K, the surface area of the radiation plate 18 is set to 25
It suffices to attach a piece having a size of 00 mm ² (square having a side of 50 mm) to the isolator 6.

Further, as one means for adjusting the cooling temperature of the isolator 6, the thermal resistance of the semi-rigid cables 16 and 17 may be adjusted as described above. As a method of adjustment, the material is selected to adjust the thermal conductivity. Alternatively, the heat transfer area of the semi-rigid cables 16 and 17 is adjusted.

FIG. 3 embodies the above embodiment.

In the structure shown in FIG. 3, one superconducting filter 5 is attached to the cold table 2, and the isolator 6 is supported by the semi-rigid cable 16 with respect to the superconducting filter 5 in a state of hanging downward. . or,
A radiation plate 18 is attached to the isolator 6, and the radiation plate 18 is in a vertical posture so as to easily receive heat.

4 to 6 explain application examples of the above embodiment.

The application example shows the case where there are two or more (2 in the figure) electronic components that are not cooled to a cryogenic temperature.

In FIG. 4, cryogenic modules 20 and 21 that need to be cooled to cryogenic temperature are fixed to the cold table 2, and electronic components 22 and 23 that are cooled to a low temperature are connected in series between the cryogenic modules 20 and 21. The electronic components 22 and 23 are supported by the semi-rigid cables 16 and 17 while being floated from the cold table 2. The electronic component 22, 23 is provided with the radiation plate 18, or the semi-rigid cable 1
How to make the materials of 6 and 17 depends on the electronic component 2
It is appropriately determined according to the cooling temperatures of 2 and 23.

FIG. 5 shows the cryogenic modules 20 and 21.
This is a case where electronic components 22 and 23 that are cooled to a low temperature are provided in parallel, and the electronic components 22 and 23 are the semi-rigid cables 16 and 17 and the semi-rigid cable 1.
6'and 17 'individually support the cold table 2 in a floating state.

Also in this case, the electronic parts 22,
Whether the radiating plate 18 is provided at 23 or the material of the semi-rigid cables 16, 17, 16 ', 17' is determined appropriately according to the cooling temperature of the electronic components 22, 23. .

FIG. 6 shows a case where the cryogenic module 20 is provided in series between the electronic components 22 and 23 to be cooled.

The cryogenic module 20 is provided on the cold table 2, the cryogenic module 20 and the connector 9 are connected by the semi-rigid cable 16, and the cryogenic module 20 and the connector 11 are connected.
And are connected by the semi-rigid cable 17.

The electronic component 22 is provided in the air in the middle of the semi-rigid cable 16, and the electronic component 23 is provided in the air in the middle of the semi-rigid cable 17.

The radiation plate 18 is attached to the electronic components 22 and 23.
Or the semi-rigid cables 16 and 17 are provided.
It goes without saying that what kind of material is used is appropriately determined according to the cooling temperature of the electronic components 22 and 23.

In the above embodiment, the electronic component to be cooled is supported by the cryogenic module via the semi-rigid cable, but a separate supporting member is provided to support the cryogenic module or the cold table 2. Good. In this case as well, it goes without saying that the material of the support member is also selected in consideration of the thermal conductivity.

[0040]

As described above, according to the present invention, a cryogenic module and electronic parts are housed in a heat shield container equipped with a cooling device, and the cryogenic module is provided in contact with the cooling device. Since the electronic component is provided away from the cooling device, the electronic device is prevented from being excessively cooled by the cooling device, and two or more electronic components having different operating temperatures can be cooled at different temperatures. can do.

Further, since the electronic component is provided with the radiation plate, it is possible to cool two or more electronic components having different operating temperatures at different temperatures, and by selecting the heat receiving surface of the radiation plate. The cooling temperature can be adjusted.

Furthermore, since the electronic component is connected to the cryogenic module by a semi-rigid cable and is supported by the semi-rigid cable away from the cooling device, there is no need to separately provide a supporting member for the electronic component. Since the wiring member and the supporting member are used in common, the supporting structure is simplified, and further, by selecting the thermal resistance of the semi-rigid cable, the cooling temperature of the electronic component can be adjusted, and other excellent effects are exhibited.

[Brief description of drawings]

FIG. 1 is a skeleton view showing an embodiment of the present invention.

FIG. 2 is a diagram showing a heat receiving characteristic of a radiation plate.

FIG. 3 is a vertical cross-sectional view showing the same embodiment.

FIG. 4 is a skeleton diagram showing a first application example of the present embodiment.

FIG. 5 is a skeleton diagram showing a second application example of the present embodiment.

FIG. 6 is a skeleton diagram showing a third application example of the present embodiment.

FIG. 7 is a skeleton diagram showing a conventional example.

[Explanation of symbols]

1 Heat shield container 2 cold table 5 Superconducting filter 6 Isolator 7 Low noise amplifier 14 cables 15 cables 16 semi-rigid cable 17 semi-rigid cable 18 Radiant plate 20 Cryogenic module 21 Cryogenic module 22 Electronic components 23 Electronic components

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masaki Sudo             3-14-20 Higashi-Nakano, Nakano-ku, Tokyo Stocks             Hitachi Kokusai Electric Co., Ltd. (72) Inventor Noriyuki Kagaya             3-14-20 Higashi-Nakano, Nakano-ku, Tokyo Stocks             Hitachi Kokusai Electric Co., Ltd. (72) Inventor Takashi Uchida             3-14-20 Higashi-Nakano, Nakano-ku, Tokyo Stocks             Hitachi Kokusai Electric Co., Ltd. F-term (reference) 5E322 AA11 AB11 CA06 FA01

Claims (3)

[Claims] 1. A cryogenic module and an electronic component are housed in a heat shielding container equipped with a cooling device, the cryogenic module is provided in contact with the cooling device, and the electronic component is separated from the cooling device. A cooling structure for electronic parts, which is provided in. 2. The cooling structure for an electronic component according to claim 1, wherein the electronic component is provided with a radiation plate. 3. The cooling structure for an electronic component according to claim 1, wherein the electronic component is connected to the cryogenic module by a semi-rigid cable and is supported by the semi-rigid cable away from the cooling device.