JP2003140008A - Optical module, manufacturing method thereof, and optical transmission device - Google Patents

Abstract

(57) [Problem] To provide resin sealing before mounting an optical waveguide. An optical element having an optical portion is provided.
It is mounted on a substrate 20 having a through hole 22. Optical element 10
Arranges the optical part 12 toward the through hole 22. A resin 40 is provided between the optical element 10 and the substrate 20. Resin 40
Is provided so as not to enter the through hole 22. Resin 4
After 0 is provided, the optical waveguide 50 is inserted into the through hole 22.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an optical module, a method for manufacturing the same, and an optical transmission device.

[0002]

BACKGROUND OF THE INVENTION In recent years, information communication has tended to increase in speed and capacity, and optical communication has been developed. In optical communication, an electric signal is converted into an optical signal, the optical signal is transmitted through an optical fiber, and the received optical signal is converted into an electric signal. The conversion of electrical signals and optical signals is performed by optical elements. The optical element is
Since it has a light exit port or a light entrance port, it is difficult to provide resin sealing before attaching the optical fiber. However, if resin sealing can be performed before attaching the optical fiber, the manufacturing process can be facilitated.

The present invention solves the problems of the prior art, and its object is to enable resin sealing before mounting an optical waveguide.

[0004]

(1) In a method of manufacturing an optical module according to the present invention, (a) an optical element having an optical portion is mounted on a substrate having a through hole, and (b) at least the optical element. In the step (a), a resin is provided between the element and the substrate, and (c) after the resin is provided, an optical waveguide is attached toward the through hole. The optical element is arranged toward the hole, and the step (b) is performed while avoiding the resin from entering the through hole.

According to the present invention, the resin can be provided so as not to block the through hole necessary for transmitting light and before the optical waveguide is attached. This resin can improve the connection reliability between the optical element and the substrate.

(2) In this method of manufacturing an optical module, the through hole may be closed before the step (b).

(3) In this method of manufacturing an optical module, in the step of closing the through hole, a deformable sheet is superposed on the substrate, the deformable sheet is sucked through the through hole, and the through hole is pulled out. A part of the deformable sheet may be inserted into the optical part.

Here, the deformable sheet may be a sheet that elastically deforms or a sheet that plastically deforms.

(4) In this method of manufacturing an optical module, the deformable sheet may be removed after the step (b).

(5) In this method of manufacturing an optical module, the step of closing the through hole may be performed by providing a filler in a region from the through hole to the optical portion.

(6) In this method of manufacturing an optical module, the filler may be removed after the step (b).

(7) In this method of manufacturing an optical module, the step (b) may be performed while supplying a fluid from the through hole to the optical portion.

Here, the fluid may be either gas or liquid.

(8) In this method of manufacturing an optical module, the resin may be provided so as to cover the optical element in the step (b).

(9) In this method of manufacturing an optical module, the resin may be provided in the step (b) while avoiding the side surface of the optical element opposite to the substrate.

(10) The optical module according to the present invention is manufactured by the above method.

(11) An optical transmission device according to the present invention has an optical module, and the optical element is attached to each of both ends of the optical waveguide.

(12) The light transmission device may further include plugs provided at both ends of the optical waveguide.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIGS. 1A to 2
(C) is a figure explaining the manufacturing method of the optical module which concerns on 1st Embodiment to which this invention is applied. The optical element 10 is used in the method of manufacturing the optical module. Optical element 10
Has at least one (a plurality in the example of FIG. 1) optical part 12. The optical element 10 may be a light emitting element or a light receiving element. As an example of the light emitting element, a surface emitting element, particularly a surface emitting laser can be used. A surface emitting element such as a surface emitting laser emits light in a vertical direction from its surface. When the optical element 10 is a light emitting element, the optical portion 12 is a light emitting portion, and when the optical element 10 is a light receiving element, the optical portion 12 is a light receiving portion. The plurality of optical portions 12 are arranged at the same pitch. Here, the same pitch means that the pitches are the same (substantially the same) within a required accuracy range. According to the optical element 10 having the plurality of optical portions 12, it is not necessary to adjust the pitch of the optical portions 12. As a modified example, a plurality of optical elements having one optical portion may be prepared, and each optical element may be arranged so that the optical portions have the same pitch. In that case, it is preferable to use a plurality of optical elements having the same configuration.

The optical element 10 has at least one (for example, a plurality) electrode 14. In the example shown in FIG. 1, the electrode 14
Includes bumps (such as gold or solder). The electrode 14 may be formed only on the surface of the optical element 10 on which the optical portion 12 is formed, or the electrode 14 may be formed on the surface on which the optical portion 12 is formed and the other surface (for example, the opposite surface). It may have been done.

As shown in FIG. 1A, the optical element 10 is mounted on the substrate 20. The substrate 20 has at least one (for example, a plurality) through holes 22. The through hole 22 is the substrate 2
It may be formed perpendicular to the surface of 0. The number of through holes 22 is equal to the number of optical portions 12. In the optical element 10, the optical portion 12 is arranged so as to face the substrate 20 side (specifically, the through hole 22). A wiring pattern 24 is formed on the substrate 20. The electrode 14 of the optical element 10 has the wiring pattern 2
4 (for example, the land). In this embodiment, the optical element 10 is face-down bonded to the substrate 20. For joining the electrode 14 and the wiring pattern 24 (specifically, the land), metal joining is applied,
Use brazing material such as solder. The present invention does not exclude electrically connecting the electrode 14 and the wiring pattern 24 with a wire or the like. As a modification, a face-up bonding structure may be applied.

As shown in FIG. 1A, a gap (specifically, gas or gas) is provided between the surface of the optical element 10 on which the optical portion 12 is formed and the surface of the substrate 20 on which the wiring pattern 24 is formed. Forming a liquid flow path). The thickness (height) of the electrode 14 and the wiring pattern 24 may be used for forming the gap. If there is a gap between the optical element 10 and the substrate 20, part of both may be in contact with each other.

As shown in FIG. 1B, the sheet 30 is arranged (or stacked) on the substrate 20. For details, board 2
The sheet 30 is placed on the surface opposite to the surface on which the optical element 10 is mounted at 0. The through hole 22 is closed by the sheet 30. The sheet 30 may be attached to the substrate 20,
It may be simply placed on the substrate 20. The sheet 30 is a deformable one (for example, one made of a thermoplastic resin). The sheet 30 may be elastically deformable or plastically deformable.

Then, a part of the sheet 30 is sucked into the through hole 22. For example, the sheet 30 is evacuated into the through hole 22. Specifically, the chamber 32 is formed on the side of the substrate 20 on which the optical element 10 is mounted, and the inside of the chamber 32 is evacuated. Thus, as shown in FIG. 1C, a part of the sheet 30 can be inserted into the through hole 22. That is, the through hole 22 is formed in the portion 34 of the sheet 30.
Can be closed with. The sheet 30 has the through holes 22.
Only the portion located inside may extend and enter the through hole 22. In this case, the sheet 30 may be adhered to the substrate 20 (for example, peelable temporary adhesion). Alternatively,
A portion of the seat 30 located outside the through hole 22 may also be dragged into the through hole 22. In this case, the sheet 30 may be simply placed on the substrate 20.

The portion 34 of the sheet 30 that has entered the through hole 22 is the optical portion 12 (for example, the entire surface thereof).
May be in contact with. In the example shown in FIG. 1 (C), the portion 34 of the sheet 30 has a width or a diameter in the through hole 2.
Although it is larger than 2, it may be the same as the through hole 22 or smaller than the through hole 22. As shown in FIG. 1C, a portion 34 of the sheet 30 has a rounded tip (curved surface).

As shown in FIG. 2A, a resin 40 is provided at least between the optical element 10 and the substrate 20. here,
The term “between the optical element 10 and the substrate 20” means the term between any surface of the optical element 10 and any surface of the substrate 20. Figure 2
In the example shown in (A), the optical element 10 is sealed with the resin 40. The resin 40 may be provided by either the molding process or the potting process. The resin 40 also covers the joint between the electrode 14 and the wiring pattern 24. Resin 40
Are also filled between the opposing surfaces of the optical element 10 and the substrate 20. The resin 40 may contact (or adhere) to the portion 34 of the sheet 30. However, the through hole 2 of the substrate 20
Since the portion 34 of the sheet 30 has entered the portion 2, the resin 40 does not enter the through hole 22. That is, the step of providing the resin 40 is performed while avoiding entering the through hole 22. If the resin 40 has a light-shielding property (specifically, a property of blocking light of a wavelength with which the optical portion 12 reacts), it is possible to prevent external light from entering the optical portion 12 through the resin 40.

As shown in FIG. 2B, the sheet 30 is removed from the substrate 20. In addition, from the resin 40 to the sheet 30
A portion 34 of the Then, the resin 40
A hole 42 corresponding to the portion 34 of the sheet 30 is formed. If portion 34 of sheet 30 was in contact with optical portion 12, then optical portion 12 would be exposed within hole 42. If the tip of the portion 34 of the sheet 30 is rounded (curved), the hole 42 of the resin 40 also has a rounded (curved) inner surface.

As shown in FIG. 2C, the optical waveguide 50 is attached to the substrate 20. Specifically, the through hole 2 of the substrate 20
The optical waveguide 50 (the tip thereof) is inserted into 2. The optical waveguide 50 is a transmission line for propagating an optical signal. The cross section of the optical waveguide 50 is often circular or elliptical. In the present embodiment, the optical waveguide 50 is an optical fiber. The optical fiber is composed of a core and a clad.
The material of the optical fiber may be either quartz glass or plastic. The optical fiber may be covered with a jacket to form an optical fiber cable. Optical waveguide 50
Arrange | positions the front end surface toward the optical part 12.

The optical waveguide 50 (the tip thereof) is made of resin 40.
It is also inserted in the hole 42 of. The hole 42 shown in FIG. 2B has a size (width or inner diameter) at a position close to the optical portion 12 smaller than the size (width or inner diameter) of the through hole 22. Therefore, the tip portion of the optical waveguide 50 contacts the inner surface of the hole 42 and stops without contacting the optical portion 12. This protects the optical part 12.

An optical module can be manufactured through the above steps. According to the present embodiment, the optical waveguide 50
The resin 40 is provided before mounting the optical part 12
The resin 40 can be provided while avoiding the above. Therefore,
The manufacturing process can be smoothly performed.

(Second Embodiment) FIGS. 3A to 3
(C) is a figure explaining the manufacturing method of the optical module which concerns on 2nd Embodiment to which this invention is applied. In this embodiment, the same components as those described in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In the present embodiment, as shown in FIG. 3A, the filler 60 is provided in the through hole 22 of the substrate 20. The filler 60 may be a resin (for example, a silicone resin or a resin used as a resist). The filler 60 is
It may be in the form of gel such as silicone gel.
The filler 60 may be provided after mounting the optical element 10 on the substrate 20. In that case, the filler 60 is also provided in the region from the through hole 22 to the optical portion 12. The filler 60 is
It may be provided through the through hole 22 from the side surface of the substrate 20 opposite to the surface on which the optical element 10 is mounted. Then, the filler 60 is provided between the opposing surfaces of the optical element 10 and the substrate 20. Then, the through hole 22 is closed. Also, the optical portion 12 is covered with the filler 60. As shown in FIG. 3A, the filler 60 may be provided so as to rise from the surface of the substrate 20 opposite to the surface on which the optical element 10 is mounted. The filler 60 is used for the electrode 14 and the wiring pattern 2.
It may be provided so as to avoid the joint portion of No. 4.

As shown in FIG. 3B, the resin 40 (first
The embodiment has been described above. ) Is provided. Since the filler 60 is already provided in the through hole 22, the resin 40 does not enter the through hole 22. Further, if the filler 60 covers the optical portion 12, the resin 40 does not cover the optical portion 12. If the filler 60 is provided so as to avoid the joint between the electrode 14 and the wiring pattern 24, the joint between the electrode 14 and the wiring pattern 24 is covered with the resin 40.

As shown in FIG. 3C, the filler 60 is removed. The removal of the filler 60 may be performed with water or an organic solvent. The filler 60 is removed from the through hole 22. Also, the filler 60 is removed from above and above the optical portion 12. Then, the optical portion 12 is exposed in the through hole 22. A recess 44 is formed in the resin 40. The recess 44 is formed on the surface of the optical element 10 on which the optical portion 12 is formed. The optical portion 12 is arranged in the recess 44.

After that, as shown in FIG. 2C, the optical waveguide 50 is attached. The optical module can be manufactured through the above steps. According to the present embodiment, the resin 40 is provided before attaching the optical waveguide 50, but the resin 40 can be provided while avoiding the optical portion 12. Therefore, the manufacturing process can be smoothly performed.

(Third Embodiment) FIG. 4 is a diagram for explaining a method of manufacturing an optical module according to a third embodiment of the present invention. In this embodiment, a filler 62 is used instead of the filler 60 shown in FIG. The filler 62 is light transmissive. As the filler 62, a material having the same refractive index as the material forming the optical waveguide 50 may be used. A refractive index adjusting agent may be used as the filler 62. In this example, the position where the filler 62 is provided may be the same as the filler 60 shown in FIG. 3A except that the through hole 22 is avoided. For example, in FIG.
Similar to the filler 60 shown in (A), a filler 62 is also provided in the through hole 22, and then the filler 62 is introduced from the through hole 22.
May be removed. In the example shown in FIG. 4, the filler 62 is not attached to the surface of the substrate 20 opposite to the surface on which the optical element 10 is mounted, but it may be attached.
Other details correspond to the contents described for the filler 60. In the present embodiment, while leaving the filler 62,
The optical waveguide 50 is attached. A filler 62 is provided between the optical portion 12 and the optical waveguide 50. According to this
Since there is no step of removing the filler 62, the manufacturing process of the optical module can be simplified.

(Fourth Embodiment) FIG. 5 is a diagram for explaining a method of manufacturing an optical module according to a fourth embodiment of the present invention. In the present embodiment, the resin 40 is
The optical element 10 is provided so as to avoid the surface opposite to the substrate 20. That is, the fillet of the resin 40 is formed on the side surface of the optical element 10. The other contents are the same as the contents described in the second embodiment. According to the present embodiment, the surface of optical element 10 opposite to substrate 20 is exposed without being covered with resin 40. Therefore, the heat dissipation effect of the optical element 10 can be obtained. Further, when electrodes (pads) are formed on the surface exposed from the resin 40, electrical connection can be achieved.

(Fifth Embodiment) FIG. 6 is a diagram for explaining a method of manufacturing an optical module according to a fifth embodiment of the present invention. In the present embodiment, instead of providing the filler 60 described in the second embodiment, the through hole 2
The resin 40 is provided while supplying a fluid (gas (eg, air) or liquid) from 2 to the optical portion 12.
For example, the chamber 64 is formed on the side of the substrate 20 on which the optical element 10 is mounted, and the fluid is supplied into the chamber 64. Then, the fluid is fed from the through hole 22. If the resin 40 is provided in this state, the resin 40 will not spread over the inside of the through hole 22 and the region from the through hole 22 to the optical portion 12. In this way, the resin 40 can be provided avoiding the inside of the through hole 22 and avoiding the optical part 12 and the upper part thereof.

After that, as shown in FIG. 2C, the optical waveguide 50 is attached. The optical module can be manufactured through the above steps. According to the present embodiment, the resin 40 is provided before attaching the optical waveguide 50, but the resin 40 can be provided while avoiding the optical portion 12. Therefore, the manufacturing process can be smoothly performed.

FIG. 7A is a diagram showing an optical transmission device according to an embodiment to which the present invention is applied. Light transmission device 100
Is for mutually connecting electronic devices 102 such as a computer, a display, a storage device, and a printer. The electronic device 102 may be an information communication device. The light transmission device 100 may be one in which the plugs 106 are provided at both ends of the cable 104. The cable 104 includes a plurality of optical waveguides 50 (see FIG. 2C). The light emitting element is aligned with one end of each optical waveguide 50, and the light receiving element is aligned with the other end. The light emitting element or the light receiving element (at least one of which corresponds to the above-described optical element 10) is attached to the substrate 20 shown in FIG. An electric signal output from one of the electronic devices 102 is converted into an optical signal by the light emitting element, the optical signal is transmitted through the optical waveguide 50, and converted into an electric signal by the light receiving element. The electric signal is input to the other electronic device 102.
Thus, according to the optical transmission device 100 according to the present embodiment, it is possible to transmit information of the electronic device 102 by using the optical signal.

FIG. 7B is a diagram showing an optical transmission device according to an embodiment to which the present invention is applied. The optical transmission device according to the present embodiment has the optical module according to the modification of the first embodiment. In FIG. 7B, the optical waveguide 50
Are not inserted into the holes 42 of the resin 40. Moreover, the optical waveguide 50 is not inserted into the through hole 22 of the substrate 20. The tip end surface of the optical waveguide 50 is arranged flush with the surface of the substrate 20 opposite to the surface on which the optical element 10 is mounted. In this state, the optical waveguide 50 is fixed and the connector 70 is formed.

FIG. 8 is a diagram showing a usage pattern of the optical transmission device according to the embodiment to which the present invention is applied. Light transmission device 1
12 connects between the electronic devices 110. Electronic device 110
As a liquid crystal display monitor or digital CRT
(It may be used in the fields of finance, mail order, medical care, and education.), LCD projector, plasma display panel (PDP), digital TV, cash register (P) of retail stores.
Examples include OS (Point of SaleScanning), video, tuner, game machine, printer, and the like.

The present invention is not limited to the above-mentioned embodiment, but various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations having the same function, method and result, or configurations having the same purpose and result). Further, the invention includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. Further, the present invention includes a configuration having the same effects as the configurations described in the embodiments or a configuration capable of achieving the same object. Further, the invention includes configurations in which known techniques are added to the configurations described in the embodiments.

[Brief description of drawings]

FIG. 1 (A) to FIG. 1 (C) are views for explaining a method of manufacturing an optical module according to a first embodiment to which the present invention is applied.

FIG. 2A to FIG. 2C are diagrams illustrating a method of manufacturing the optical module according to the first embodiment to which the present invention is applied.

FIG. 3 (A) to FIG. 3 (C) are diagrams illustrating a method of manufacturing an optical module according to a second embodiment of the present invention.

FIG. 4 is a diagram illustrating a method of manufacturing an optical module according to a third embodiment of the present invention.

FIG. 5 is a diagram illustrating a method of manufacturing an optical module according to a fourth embodiment of the present invention.

FIG. 6 is a diagram illustrating a method for manufacturing an optical module according to a fifth embodiment of the present invention.

FIG. 7A and FIG. 7B are diagrams showing an optical transmission device according to an embodiment to which the present invention is applied.

FIG. 8 is a diagram showing a usage pattern of the optical transmission device according to the embodiment to which the present invention is applied.

[Explanation of symbols]

10 optical elements 12 Optical part 20 substrates 22 through hole 30 sheets 40 resin 50 optical waveguide 60 Filler

Claims (12)

[Claims] 1. An optical element having (a) an optical portion is mounted on a substrate having a through hole, (b) a resin is provided at least between the optical element and the substrate, and (c) the resin is provided. After that, including mounting an optical waveguide toward the through hole, in the step (a), the optical element is arranged with the optical portion facing the through hole, the step (b), A method of manufacturing an optical module, wherein the resin is prevented from entering the through hole. 2. The method of manufacturing an optical module according to claim 1, wherein the through hole is closed before the step (b). 3. The method of manufacturing an optical module according to claim 2, wherein in the step of closing the through hole, a deformable sheet is superposed on the substrate, and the deformable sheet is sucked through the through hole, A method of manufacturing an optical module, comprising: inserting a part of the deformable sheet from a through hole to the optical portion. 4. The method of manufacturing an optical module according to claim 3, wherein the deformable sheet is removed after the step (b). 5. The method of manufacturing an optical module according to claim 2, wherein the step of closing the through hole is performed by providing a filler in a region extending from the through hole to the optical portion. 6. The method for manufacturing an optical module according to claim 5, wherein the filler is removed after the step (b). 7. The method of manufacturing an optical module according to claim 1, wherein the step (b) is performed while supplying a fluid from the through hole to the optical portion. 8. The method of manufacturing an optical module according to claim 1, wherein the resin is provided so as to cover the optical element in the step (b). 9. The method of manufacturing an optical module according to claim 1, wherein in the step (b), the resin is provided so as to avoid the side surface of the optical element opposite to the substrate. Module manufacturing method. 10. An optical module manufactured by the method according to any one of claims 1 to 9. 11. An optical transmission device comprising the optical module according to claim 10, wherein the optical element is attached to each of both ends of the optical waveguide. 12. The optical transmission device according to claim 11, further comprising plugs provided at both ends of the optical waveguide.