JP2003037246A - Electronic components and electronic component modules - Google Patents

Abstract

(57) [Summary] [Problem] To provide an electronic component that can achieve three-dimensional mounting. A semiconductor component having an electrode, a flexible wiring film connected to the electrode via an electrode and extending over the upper and lower surfaces of the semiconductor component, and a wiring film on the upper and lower surfaces of the semiconductor component And an electrode provided on the exposed surface of the portion. An adhesive is provided on the exposed surfaces of the wiring film on the upper and lower surfaces of the semiconductor component. The semiconductor component is a memory integrated circuit in which predetermined electrodes in the spare electrode row are used as chip selection electrodes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and an electronic component module, and more particularly to an electronic component module having a structure in which electronic components and semiconductor components (semiconductor chips, semiconductor devices) that can be mounted on each other are stacked.

[0002]

2. Description of the Related Art In mounting an IC such as an LSI, the mounting area increases two-dimensionally as the number of mounted ICs increases. It becomes three-dimensional only when multiple mounting boards are used by stacking them. IC memory (memory integrated circuit)
In order to increase the storage capacity and the mounting density, semiconductor devices are stacked and mounted.

For example, the "Nikkei Microdevice" issued by Nikkei BP, December 1989 issue, December 1, the same year, P48, four semiconductor devices (SRAM) of the TAB structure are stacked,
There is described a module in which four common terminals other than the chip selection terminal are stacked and connected at the outer lead portion.

[0004]

When an IC is mounted on a wiring board (board), a mounting area which is more than twice the area occupied by each component is required every time one component is added.

Further, in the conventional memory IC, although described in the above-mentioned document, three-dimensional mounting is performed, but in other ICs such as a logic IC, since there are almost no common pins, a plurality of semiconductor devices are mounted. Means of simply overlapping cannot be adopted.

An object of the present invention is to provide an electronic component and an electronic component module which can achieve three-dimensional mounting.

Another object of the present invention is to provide an electronic component and an electronic component module capable of three-dimensionally mounting an IC other than the memory IC.

The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.

[0009]

The outline of the representative ones of the inventions disclosed in the present application will be briefly described as follows.

(1) A semiconductor component having an electrode, a flexible wiring film connected to the electrode through the electrode and extending over the upper and lower surfaces of the semiconductor component, and upper and lower surfaces of the semiconductor component. And an electrode provided on the exposed surface of the wiring film portion. An adhesive is provided on the exposed surface of the wiring film portion on the lower surface side of the semiconductor component. The semiconductor component is a memory integrated circuit having a chip selection electrode at a predetermined position of the preliminary electrode position.

(2) A semiconductor component having an electrode, a flexible wiring film connected to the electrode through the electrode and extending over the upper and lower surfaces of the semiconductor component, and an upper and lower surface side of the semiconductor component. It has a structure in which electronic components having electrodes provided on the exposed surface of the wiring film portion are stacked and connected to each other in multiple stages via electrodes. Each of the electronic components is a memory integrated circuit in which chip selection electrodes are electrically independent from each other.

(3) In the above-mentioned means (2), a plurality of electronic components are mounted side by side in some stages.

(4) A plurality of semiconductor components in a stacked state and a flexible wiring film electrically connected to the electrodes of each semiconductor component via the electrodes, wherein the wiring film is the lowermost layer. Of the semiconductor component extends to the lower surface side and has an electrode on the lower surface. The wiring film has a structure that wraps a plurality of stacked semiconductor components.

(5) In the structure of the above-mentioned means (4), the wiring film is alternately folded back at a constant length, and a semiconductor component is sandwiched between the lower and upper wiring film portions formed by the folding back. It has a structure.

According to the above-mentioned means (1), (a) the semiconductor component forming the memory IC is mounted on a flexible wiring film, and the electrodes exposed on the wiring film portions on the upper and lower surfaces of the semiconductor component. Since it is provided, the components can be sequentially stacked and mounted, and the electronic component is suitable for three-dimensional mounting. Further, it becomes an electronic component capable of three-dimensional mounting by incorporating another IC such as a logic IC other than the memory IC.

According to the means (b), since the adhesive is provided on the exposed surface of the wiring film portion on the lower surface side of the semiconductor component, it becomes easy to fix the electronic components when mounting or sequentially stacking them. .

(C) Since the semiconductor component is a memory integrated circuit having a chip selection electrode at a predetermined position of the preliminary electrode position, a plurality of electronic components having different chip selection electrode positions are selected and mounted in a stack. When a plurality of electronic components are stacked and modularized, the memory capacity can be increased without increasing the mounting area.

According to the means (2), (a) the electronic parts having the electrodes on the upper and lower surfaces are connected in a multi-tiered manner with the electrodes interposed therebetween. The three-dimensional mounting can be achieved and the mounting area can be reduced.

(B) Since each electronic component is a memory integrated circuit whose chip selection electrodes are electrically independent from each other, the memory capacity can be increased without increasing the mounting area of the electronic component module. You can

(C) By forming the wiring pattern of the wiring film on a general wiring board, an electronic component module incorporating another IC such as a logic IC other than the memory IC can be obtained.

According to the above-mentioned means (3), (a) electronic parts having different sizes can be incorporated, which facilitates modularization.

(B) By forming the wiring pattern of the wiring film like a general wiring board, an electronic component module incorporating another IC such as a logic IC other than the memory IC can be obtained.

According to the means (4), (a) since the plurality of semiconductor components are in a stacked state, the electronic component module can reduce the mounting area.

(B) The wiring film has a structure that encloses a plurality of laminated semiconductor components, which facilitates manufacturing.

(C) By forming the wiring pattern of the wiring film on a general wiring board, an electronic component module incorporating another IC such as a logic IC other than the memory IC can be obtained.

According to the means (5), (a) the wiring film is alternately folded back with a constant length, and the semiconductor component is sandwiched between the lower and upper wiring film portions formed by the folding back. Since the structure is such that it can be manufactured easily.

(B) By making the wiring pattern of the wiring film like a general wiring board, it becomes an electronic component module incorporating other ICs such as logic ICs other than memory ICs.

[0028]

DETAILED DESCRIPTION OF THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

In all the drawings for explaining the embodiments, parts having the same functions are designated by the same reference numerals, and the repeated description thereof will be omitted.

(Embodiment 1) FIG. 1 is a sectional view of an electronic component according to an embodiment (Embodiment 1) of the present invention, FIG. 2 is a perspective view thereof, and FIG. 3 is a plan view of a semiconductor chip similarly incorporated in an electronic component. FIG. 4, FIG. 4 is a plan view of the same wiring film used in the manufacture of electronic parts, FIG. 5 is a bottom view of the same wiring film, and FIG. 6 shows a state in which a plurality of films are stacked in the manufacture of the wiring film of the first embodiment. Sectional view, Figure 7
Is a cross-sectional view showing the structure of the wiring film of the first embodiment, FIG. 8 is a perspective view showing the electronic component module according to the first embodiment, and FIG. 9 is a schematic perspective view showing a state in which the electronic component and the electronic component module are mounted. Is.

As shown in FIG. 1, the electronic component 1 of the first embodiment has a structure in which a semiconductor chip 2 which is a semiconductor component is wrapped with a wiring film 3 and integrated with adhesives 14 and 15. The semiconductor chip 2 has an electrode 4 on the lower surface and is electrically connected to an electrode 17 provided on the inner surface side of the wiring film 3.

A plurality of exposed electrodes 21 are provided on the wiring film 3 portion on the lower surface side of the semiconductor chip 2. These electrodes 21 are used when mounting the electronic component 1. An adhesive 24 is applied to the wiring film 3 portion on the lower surface side of the semiconductor chip 2. The adhesive 24 is used as an adhesive when mounting the electronic component 1.

Wiring film 3 on the upper surface side of semiconductor chip 2
A plurality of electrodes 23 are provided on the upper surface (exposed surface) of the portion. These electrodes 23 are electrodes for mounting electronic components of the same structure, which are stacked on the electronic component 1.

The electronic component 1 of the first embodiment has a structure in which a semiconductor chip 2 composed of a memory integrated circuit is incorporated. Then, the chip selection electrodes are, for example, 4
The structure has a chip selection electrode located at a predetermined position of each preliminary electrode position.

In the first embodiment, four electronic components 1 are stacked to form an electronic component module 40 as shown in FIG. In this case, the chip selection electrodes in each electronic component 1 are independent of each other. That is, as will be described later, the positions of the chip selection electrodes of the semiconductor chips 2 incorporated in the four electronic components 1 are different from each other, which will be described later.

The structure of the electronic component according to the first embodiment will be described below.
The description will be made with reference to the method of manufacturing the electronic component and the method of manufacturing the wiring film 3.

The wiring film 3 is as shown in FIG. 4 in the unfolded state, and the back surface is as shown in FIG.

Although not particularly limited, the semiconductor chip 2 wrapped in the wiring film 3 has a square shape as shown in FIG. 3 and has electrodes 4 along the edge of the main surface (front surface).

The semiconductor chip 2 constitutes, for example, a memory integrated circuit and has a chip selection electrode 4a.
One of the electrodes 4 becomes the chip selection electrode 4a.
In the first embodiment, for example, four types of semiconductor chips 2 having different chip selection electrode arrangement positions are prepared. In the semiconductor chip 2 of FIG. 3, four lined up positions are the preliminary electrode positions 5a to 5d, and the chip selection electrode 4a is provided at the preliminary electrode position 5a. The remaining spare electrode positions 5b, 5
No electrodes are provided on c and 5d.

Although not shown, the remaining three types of semiconductor chips 2 have a structure in which chip selection electrodes are provided at the preliminary electrode positions 5b, 5c and 5d, respectively. This is intended to stack four electronic components 1 in the case of the first embodiment. Therefore, when stacking a larger number of electronic components 1, a plurality of types of semiconductor chips 2 having the number of spare electrode positions or more are used.

The wiring film 3 is, as shown in FIGS. 4 and 5, a square portion 10 facing the main surface of the semiconductor chip 2.
And a triangular portion 11 having a substantially triangular shape connected to each side of the square portion 10, the semiconductor chip 2 is mounted on the surface portion 12 of the square portion 10 shown in FIG. 4, and each triangle portion 11 is folded back inward. As a result, the side surface and the back surface of the semiconductor chip 2 are completely covered as shown in FIG.

The surface portion 12 and the triangular portion 11 are also provided.
Adhesives 14 and 15 are provided on the surface portion 13 of the rectangular portion 10 and the surface portion 13 of the triangular portion 11.
Then, the semiconductor chip 2 and the semiconductor chip 2 are bonded together.

An electrode 17 is provided on the surface portion 12 of the wiring film 3.
Is provided. This electrode 17 is the semiconductor chip 2
It corresponds to the electrode 4 of.

On the back surface of the wiring film 3 shown in FIG. 5, an electrode 21 for mounting the electronic component 1 is provided on the back surface portion 20 of the square portion 10, and an electronic component to be stacked on the back surface portion 22 of the triangular portion 11. An electrode 23 for connecting 1 is provided. Further, the back surface portion 20 is provided with an adhesive 24 for mounting the electronic component 1.

On the other hand, the wiring film 3 is not particularly limited, but as shown in FIG. 7, the insulating first film 30 is used.
And an electrically insulating second film 31 attached to the first film 30, a wire 32 extending between the first film 30 and the second film 31, and electrically connected to the wire 32. And the electrodes 17, 21, 23 exposed on the front and back surfaces of the wiring film 3. In addition,
In FIG. 7, the adhesive is omitted.

In manufacturing the wiring film 3, first, two insulating films are prepared. This insulating film is made of, for example, a polyimide film having a thickness of about 0.1 mm, and is a first film 30 and a second film 31, as shown in FIG. Through holes 33 are formed in the first and second films 30 and 31 by punching. Finally, the electrodes 17, 21, 23 are provided in the portion where the through hole 33 is provided.

Next, for forming wiring on the first film 30, for example, Al is formed by vapor deposition and patterned by etching.

Next, the first film 30 and the second film 31 are superposed and laminated by thermocompression bonding or the like.

Next, in the through holes 33 on the front and back surfaces of the wiring film 3, the electrodes 17, 21, made of solder, etc.
23 is formed (see FIG. 7). Also, wiring film 3
Adhesives 14, 15, and 24 are formed at predetermined locations on the front and back surfaces, and the wiring film 3 shown in FIGS. 4 and 5 is formed.

When the electronic component 1 of the first embodiment is manufactured using such a wiring film 3, the semiconductor chip 2 is face down on the surface portion 12 of the square portion 10 of the wiring film 3 shown in FIG. It is positioned by bonding and is bonded with an adhesive 14. At this time, the electrode 4 of the semiconductor chip 2 and the electrode 17 of the surface portion 12 overlap each other.

Next, the triangular portion 11 connected to the four sides of the square portion 10 is folded back and adhered to the back surface of the electronic component 1 with the adhesive 15. Then, heat treatment is performed. As a result, the electrodes made of solder are adhered to each other, as shown in FIG.
And the electronic component 1 shown in FIG. 2 is manufactured.

The electronic component 1 of the first embodiment is mounted on the wiring board 35 as shown in FIG. At the time of this mounting, the adhesive 24 on the lower surface of the electronic component 1
Is fixed to the wiring board 35, and the electrode 21 on the lower surface of the electronic component 1 is connected to an electrode (not shown) of the wiring board 35 by reflowing to complete the mounting.

FIG. 8 shows the electronic component module 40 of the first embodiment. This electronic component module 40
In the state in which the semiconductor chip 2 is wrapped with the wiring film 3, the four types of electronic components 1 with different positions of the chip selection electrodes of the semiconductor chip 2 are sequentially positioned and stacked, and then reflowed to temporarily dispose each electrode. It was manufactured after the electrodes were melted to join the electrodes. That is, although not shown, the chip selection electrodes of each electronic component 1 from the bottom to the top sequentially change to 4a to 4d. As a result, the memory capacity can be quadrupled while the mounting area remains the mounting area of the single electronic component 1.

FIG. 9 shows a state in which the electronic component module 40 is mounted on the wiring board 35. Further, in FIG. 9, electrodes on the upper surfaces of the electronic component 1 and the electronic component module 40 are omitted.

As the adhesive, for example, an epoxy resin adhesive is used, but a film that melts at a constant temperature may be used. Further, the adhesive on the lower surface of the electronic component 1 may not be provided and may be prepared at the time of mounting.

Alternatively, an anisotropic conductive film may be used without using the solder bump as the electrode.

In the electronic component 1, the semiconductor chip 2
The cuts of the wiring film 3 may be covered with an adhesive so as not to come into contact with the outside air.

The electronic component 1 may have a structure in which a plurality of films are multiply wrapped to improve reliability.

In the wiring film 3, the wiring 32 may have a multi-layer structure. In this case, the wiring routing margin is improved.

In the electronic component of the first embodiment, another IC such as a logic IC may be incorporated as a semiconductor chip. In this case, the wiring pattern of the wiring film 3 has the same wiring as the structure of a normal flat wiring board. For this reason,
In some of the electronic components 1, the wiring connected to the electrodes on the upper and lower surfaces of the electronic component 1 is connected to the electrodes of the electronic components on the upper and lower surfaces of the electronic component 1, or one electrode of the electronic components on the upper and lower surfaces. It has a wiring structure such as that connected to.

The electronic component of Embodiment 1 has the following effects.

(1) The semiconductor chip 2 which is a semiconductor component constituting the memory IC is mounted on the flexible wiring film 3, and the exposed electrodes 23 are formed on the wiring film 3 on the upper and lower surfaces of the semiconductor chip 2. Since 21 is provided, they can be sequentially stacked and mounted, which is suitable for three-dimensional mounting.

(2) Since the adhesive 24 is provided on the exposed surface of the wiring film 3 portion on the lower surface side of the semiconductor chip 2, the electronic parts 1 can be easily fixed when mounting or sequentially stacking them.

(3) Since the semiconductor chip 2 is a memory integrated circuit having a chip selection electrode at a predetermined position of the preliminary electrode position, a plurality of electronic components 1 having different chip selection electrode positions are selected and stacked. Can be implemented as
When a plurality of electronic components 1 are stacked to be modularized, the memory capacity can be increased without increasing the mounting area.

(4) If the wiring pattern of the wiring film 3 is selected, an electronic component for manufacturing an electronic component module incorporating another IC such as a logic IC other than the memory IC is obtained.

The electronic component module of Embodiment 1 has the following effects.

(1) Since the electronic components 1 having the electrodes 23 and 21 on the upper and lower surfaces are stacked and connected to each other through the electrodes 23 and 11 in multiple stages, three-dimensional mounting can be achieved. At the same time, the mounting area can be reduced.

(2) Since the chip selection electrodes of each electronic component 1 are electrically independent memory integrated circuits, the memory capacity can be increased without increasing the mounting area.

(3) If the wiring pattern of the wiring film 3 is selected, it is possible to provide an electronic component module incorporating another IC such as a logic IC other than the memory IC.

(Embodiment 2) FIG. 10 is a sectional view of an electronic component according to another embodiment (Embodiment 2) of the present invention, and FIG. 11 is a perspective view of the same.

The electronic component 1 according to the second embodiment has a structure in which a semiconductor device 51 having leads (electrodes) 50 of the J-vent type as a semiconductor component is wrapped with a wiring film 3. Therefore, the same effect as that of the first embodiment can be obtained.

In the case of the electronic component 1 according to the second embodiment, the semiconductor chip (not shown) is sealed in the package 52 of the semiconductor device 51, so that the semiconductor chip has high moisture resistance. Therefore, as shown in FIG. 11, the wiring film 3 wrapping the semiconductor device 51 has no problem even if the corners of the package 52 of the semiconductor device 51 are exposed. In the structure of the second embodiment, there is an effect that the margin of wrapping with the wiring film 3 is increased and the sealing work with the wiring film 3 is facilitated.

As another configuration of the second embodiment, a similar effect can be obtained even if a butt-lead type semiconductor device or a BGA (ball grid array) in which leads extend straight downward is incorporated as the semiconductor device. it can.

(Embodiment 3) FIG. 12 is a perspective view showing an electronic component module according to another embodiment (Embodiment 3) of the present invention, and FIG. 13 is a schematic diagram showing a wiring connection state of the electronic component module.

The electronic component module 55 according to the third embodiment has a structure in which the electronic components 1 according to the first embodiment are stacked in four stages, and electrodes for mounting are provided on the lower surface of the electronic component module 55. In the case of this embodiment, a plurality of, for example, two electronic components 1 are mounted side by side in a part of the stages to further increase the functionality as an electronic component module. In FIG. 12, electrodes on the upper surface of the uppermost electronic component 1 are omitted.

FIG. 13 is a schematic view showing the wiring 32, the electrodes 17, 21 and 23 provided on the wiring 32, and the semiconductor chip 2 and the electrode 4 provided on the semiconductor chip 2. The insulation of the wiring film 3 is shown in FIG. The plastic film is omitted. Further, the wiring 32 is drawn by a two-dot chain line for clarity of the drawing, and a gap is provided between the electrodes 17, 21, 23 provided on the wiring 32 and the electrode 4 of the semiconductor chip 2. Also,
Since the wiring film 3 has a wiring structure, some of the wirings 32 are also wirings for connecting the electrodes of the upper and lower semiconductor chips 2.

Electronic component module 55 of the third embodiment
With, the electronic components 1 having different sizes can be incorporated, which facilitates modularization. Further, other ICs such as a logic IC other than the memory IC can be incorporated.

(Embodiment 4) FIG. 14 is a perspective view showing an electronic component module according to another embodiment (Embodiment 4) of the present invention, and FIG. 15 is a partial sectional view showing a wiring connection state of the electronic component module. Is. The fourth embodiment and the next fifth embodiment of the present invention are configured such that a plurality of semiconductor components (semiconductor devices or semiconductor chips) in a laminated state are electrically connected to the electrodes of each of the semiconductor components via the electrodes. And a wiring film, the wiring film extending to the lower surface side of the lowermost semiconductor component and having an electrode on the lower surface.

Electronic Component Module 60 of the Fourth Embodiment
15 has a structure in which a plurality of stacked semiconductor devices 51 (J-vent type) are wrapped with a wiring film 3 as shown in FIG. Therefore, the electrical connection with the wiring 32 has a structure in which the electrode 50 connected to the wiring 32 is electrically connected to the lead 50 protruding to the side surface of the package 52 of the semiconductor device 51. Therefore, by forming the wiring pattern of the wiring film 3 like a general mother board, incorporation of other ICs such as logic ICs other than memory ICs can be achieved.

Electronic component module 60 of Embodiment 4
Since the plurality of semiconductor devices 51 are stacked, the electronic component module can reduce the mounting area.

Further, the wiring film 3 has a structure in which a plurality of semiconductor devices 51 laminated is wrapped, which facilitates manufacturing.

(Embodiment 5) FIG. 16 is a schematic view showing an electronic component module according to another embodiment (Embodiment 5) of the present invention, and FIG. 17 is a partial sectional view showing a wiring connection state of the electronic component module. is there.

Electronic component module 65 of the fifth embodiment
Has a structure in which the semiconductor chip 2 is sandwiched between the wiring films 3 which are alternately folded back with a constant length. That is, the wiring film 3 is alternately folded back with a fixed length, the semiconductor chip 2 is sandwiched between the wiring film portions of the lower layer and the upper layer formed by folding back, and the electrode 4 of the semiconductor chip 2 and the electrode 17 of the wiring film 3 are sandwiched. It has a structure in which and are electrically connected.

FIG. 17 is a schematic view showing the semiconductor chip 2, the electrode 4 provided on the semiconductor chip 2, the wiring 32, and the electrodes 17 and 21 provided on the wiring 32. The insulating film of the wiring film 3 is shown in FIG. Is omitted. In addition, the wiring 32 is drawn with a chain double-dashed line to clarify the drawing, and the wiring 3
A gap is provided between the electrodes 17 and 21 provided on the second electrode 2 and the electrode 4 of the semiconductor chip 2. Also, some wiring 3
Since the wiring film 3 has a wiring structure, the wiring 2 also serves as a wiring for connecting the electrodes of the upper and lower semiconductor chips 2.

Electronic component module 65 of the fifth embodiment
Since the semiconductor chip 2 has a structure in which the wiring film 3 is alternately folded back at a constant length and is sandwiched between the wiring film portions of the lower layer and the upper layer formed by folding back, the manufacturing becomes easy.

In the fifth embodiment, the semiconductor chip 2
Instead of, the butt-lead type semiconductor device may be sandwiched between the wiring film portions of the lower layer and the upper layer formed by folding back, and the same effect as that of the above embodiment can be obtained.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

[0088]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

(1) Since the semiconductor components constituting the memory IC are mounted on a flexible wiring film and exposed electrodes are provided on the wiring film portions on the upper and lower surfaces of the semiconductor components, they are sequentially stacked. Can be implemented as
It becomes an electronic component suitable for three-dimensional mounting.

(2) Also, logic I other than the memory IC
It becomes an electronic component in which other ICs such as C are incorporated and three-dimensional mounting is possible.

(3) Since the adhesive is provided on the exposed surface of the wiring film portion on the lower surface side of the semiconductor component, it is easy to fix the electronic components when mounting or sequentially stacking them.

(4) Since the semiconductor component is a memory integrated circuit having a chip selection electrode at a predetermined position of the preliminary electrode position, a plurality of electronic components having different chip selection electrode positions are selected and mounted in a stack. When a plurality of electronic components are stacked and modularized, the memory capacity can be increased without increasing the mounting area.

(5) Since electronic components having electrodes on the upper and lower surfaces are stacked and connected to each other through electrodes, the electronic component module can be three-dimensionally mounted and mounted. The area can be reduced. Further, by selecting the wiring pattern of the wiring film, incorporation of other ICs such as a logic IC other than the memory IC can be achieved.

(6) Since the chip selection electrodes of each electronic component are memory integrated circuits electrically independent of each other, the memory capacity can be increased without increasing the mounting area of the electronic component module. You can

[Brief description of drawings]

FIG. 1 is a sectional view of an electronic component according to an embodiment (Embodiment 1) of the present invention.

FIG. 2 is a perspective view of the electronic component according to the first embodiment.

FIG. 3 is a plan view showing a semiconductor chip incorporated in the electronic component of the first embodiment.

FIG. 4 is a plan view of a wiring film used in manufacturing the electronic component of the first embodiment.

FIG. 5 is a bottom view of a wiring film used in manufacturing the electronic component of the first embodiment.

FIG. 6 is a cross-sectional view showing a state in which a plurality of films are stacked in the production of the wiring film of the first embodiment.

FIG. 7 is a cross-sectional view showing the structure of the wiring film of the first embodiment.

FIG. 8 is a perspective view showing the electronic component module according to the first embodiment.

FIG. 9 is a schematic perspective view showing a state in which the electronic component and the electronic component module of the first embodiment are mounted.

FIG. 10 is a sectional view of an electronic component according to another embodiment (second embodiment) of the present invention.

FIG. 11 is a perspective view of an electronic component according to a second embodiment.

FIG. 12 is a perspective view showing an electronic component module according to another embodiment (Embodiment 3) of the present invention.

FIG. 13 is a schematic diagram showing a wiring connection state of the electronic component module of the third embodiment.

FIG. 14 is a perspective view showing an electronic component module according to another embodiment (Embodiment 4) of the present invention.

FIG. 15 is a partial cross-sectional view showing a wiring connection state of the electronic component module of the fourth embodiment.

FIG. 16 is a schematic diagram showing an electronic component module which is another embodiment (embodiment 5) of the present invention.

FIG. 17 is a partial cross-sectional view showing a wiring connection state of the electronic component module according to the fifth embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Semiconductor chip, 2a ... Chip selection electrode, 3 ... Wiring film, 4a ... Chip selection electrode, 5a ...
5d ... Preliminary electrode position, 10 ... Square portion, 11 ... Triangle portion, 12, 13 ... Surface portion, 14, 15 ... Adhesive agent, 17 ...
Electrode, 20 ... Back surface part, 21 ... Electrode, 22 ... Back surface part, 23
... Electrodes, 24 ... Adhesives, 30 ... First film, 31 ... Second film, 32 ... Wiring, 33 ... Through holes, 35 ...
Wiring board, 40 ... Electronic component module, 50 ... Lead, 51 ... Semiconductor device, 52 ... Package, 55, 6
0,65 ... Electronic component module.

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[Procedure amendment]

[Submission date] June 7, 2002 (2002.6.7)

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction content]

A stage consisting of one semiconductor chip and two halves
The step in which the conductor chips are juxtaposed is the one semiconductor chip.
Are arranged across the two semiconductor chips arranged side by side.
And the semiconductor is formed on the lower surface of the laminated structure.
Provided with a group of mounting electrodes electrically connected to the chip
A module characterized by being formed.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction content]

The module further has a wiring film.
Then, the group of electrodes for mounting is on the bottom layer of the laminated structure.
Designed so that it protrudes from the wiring film part where it is located to the lower surface.
It is characterized by being formed.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction content]

The semiconductor chip is formed on the wiring film.
Connected to the mounting electrodes through the wiring layer
It is characterized by

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction content]

[0013] a plurality of semiconductor components of the product layer state, each of the semiconductor component via the electrode and the electrode and a flexible wiring film is electrically connected, the wiring film is the lowermost semiconductor The part extends to the lower surface side and has an electrode on the lower surface. The wiring film has a structure that wraps a plurality of stacked semiconductor components.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction content]

[0014] In the configuration of the means of the previous Symbol [0013],
The wiring film is alternately folded back with a fixed length, and a semiconductor component is sandwiched between the lower and upper wiring film portions formed by the folding back.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Name of item to be corrected] 0015

[Correction method] Change

[Correction content]

According to the above-mentioned [0010] , part of
Mount multiple electronic components side by side in a
Since it is a module, it can be multi-functional. Well
It is also possible to incorporate electronic components of different sizes.
Modularization becomes easy. It should be noted that the electronic component is capable of three-dimensional mounting by incorporating another IC such as a logic IC other than the memory IC.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Delete

[Procedure Amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Delete

[Procedure Amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0018

[Correction method] Delete

[Procedure Amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0019

[Correction method] Delete

[Procedure Amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0020

[Correction method] Delete

[Procedure Amendment 13]

[Document name to be amended] Statement

[Correction target item name] 0021

[Correction method] Delete

[Procedure Amendment 14]

[Document name to be amended] Statement

[Name of item to be corrected] 0022

[Correction method] Delete

[Procedure Amendment 15]

[Document name to be amended] Statement

[Name of item to be corrected] 0023

[Correction method] Change

[Correction content]

According to the means [0013] , (a)
Since the plurality of semiconductor components are in the stacked state, the electronic component module can reduce the mounting area.

[Procedure Amendment 16]

[Document name to be amended] Statement

[Correction target item name] 0026

[Correction method] Change

[Correction content]

According to the means [0014] , (a)
Since the wiring film is alternately folded back with a constant length, and the semiconductor component is sandwiched between the wiring film portions of the lower layer and the upper layer formed by the folding, the manufacturing becomes easy.

Claims (3)

[Claims] 1. A step formed of one semiconductor chip and a step in which two semiconductor chips are juxtaposed are stacked so that the one semiconductor chip is placed across the two juxtaposed semiconductor chips. A module, wherein a group of mounting electrodes electrically connected to the semiconductor chip is provided on a lower surface of the laminated structure. 2. The module further comprises a wiring film, and the group of electrodes for mounting is configured so as to project from a wiring film portion located at a lowermost layer of the laminated structure to a lower surface. The module according to claim 1, wherein 3. The module according to claim 1, wherein the semiconductor chip is connected to the mounting electrode via a wiring layer formed on the wiring film.